FIN1104MTC [ONSEMI]
LVDS 4 端口高速中继器;型号: | FIN1104MTC |
厂家: | ONSEMI |
描述: | LVDS 4 端口高速中继器 驱动 中继器 光电二极管 接口集成电路 驱动器 |
文件: | 总8页 (文件大小:477K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON
Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s
technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA
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is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
January 2002
Revised January 2003
FIN1104
LVDS 4 Port High Speed Repeater
General Description
Features
This 4 port repeater is designed for high speed intercon-
nects utilizing Low Voltage Differential Signaling (LVDS)
technology. The FIN1104 accepts and outputs LVDS levels
with a typical differential output swing of 330 mV which pro-
vides low EMI at ultra low power dissipation even at high
frequencies. The FIN1104 provides a VBB reference for AC
■ Greater than 800 Mbps data rate
■ 3.3V power supply operation
■ 3.5 ps maximum random jitter and 135 ps maximum
deterministic jitter
■ Wide rail-to-rail common mode range
■ LVDS receiver inputs accept LVPECL, HSTL, and
SSTL-2 directly
coupling on the inputs. In addition the FIN1104 can directly
accept LVPECL, HSTL, and SSTL-2 for translation to
LVDS.
■ Ultra low power consumption
■ 20 ps typical channel-to-channel skew
■ Power off protection
■ > 7.5 kV HBM ESD Protection
■ Meets or exceeds the TIA/EIA-644-A LVDS standard
■ Available in space saving 24-Lead TSSOP package
■ Open circuit fail safe protection
■ VBB reference output
Ordering Code:
Order Number Package Number
Package Description
FIN1104MTC
MTC24
24-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Devices also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.
Pin Descriptions
Connection Diagram
Pin Name
Description
RIN1+, RIN2+
RIN3+, RIN4+
,
Non-inverting LVDS Input
RIN1−, RIN2−
RIN3−, RIN4−
,
Inverting LVDS Input
DOUT1+, DOUT2+, Non-inverting Driver Output
DOUT3+, DOUT4+
DOUT1−, DOUT2−, Inverting Driver Output
DOUT3−, DOUT4−
EN
Driver Enable Pin for All Output
EN
Inverting Driver Enable Pin for all Outputs
Power Supply
VCC
GND
VBB
Ground
Reference Voltage Output
© 2003 Fairchild Semiconductor Corporation
DS500656
www.fairchildsemi.com
Function Table
Functional Diagram
Inputs
Outputs
DIN+
DIN−
DOUT+ DOUT−
EN
H
EN
L
H
L
L
H
L
L
H
L
H
L
H
H
L
Fail Safe Case
H
Z
Z
X
H
X
X
X
X
X
Z
Z
L
H = HIGH Logic Level
L = LOW Logic Level
X = Don’t Care
Z = High Impedance
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2
Absolute Maximum Ratings(Note 1)
Recommended Operating
Conditions
Supply Voltage (VCC
LVDS DC Input Voltage (VIN
LVDS DC Output Voltage (VOUT
Driver Short Circuit Current (IOSD
)
−0.5V to +4.6V
−0.5V to +4.6V
−0.5V to +4.6V
Continuous 10 mA
−65°C to +150°C
150°C
)
Supply Voltage (VCC
)
3.0V to 3.6V
)
Magnitude of Differential
Voltage (|VID|)
)
100 mV to VCC
Storage Temperature Range (TSTG
Max Junction Temperature (TJ)
Lead Temperature (TL)
)
Common Mode Voltage
Range (VIC
)
(0V + |VID|/2) to (VCC − |VID|/2)
−40°C to +85°C
Operating Temperature (TA)
(Soldering, 10 seconds)
260°C
7500V
400V
ESD (Human Body Model)
ESD (Machine Model)
Note 1: The “Absolute Maximum Ratings”: are those values beyond which
damage to the device may occur. The databook specifications should be
met, without exception, to ensure that the system design is reliable over its
power supply, temperature and output/input loading variables. Fairchild
does not recommend operation of circuits outside databook specification.
DC Electrical Characteristics
Min
Typ
Max
Symbol
Parameter
Test Conditions
Units
(Note 2)
VTH
VTL
Differential Input Threshold HIGH
Differential Input Threshold LOW
See Figure 1; VIC = +0.05V, +1.2V, or VCC − 0.05V
See Figure 1; VIC = +0.05V, +1.2V, or VCC − 0.05V
100
mV
mV
−100
VIH
Input HIGH Voltage (EN or EN)
2.0
VCC
V
VIL
Input LOW Voltage (EN or EN)
Output Differential Voltage
VOD Magnitude Change from
Differential LOW-to-HIGH
Offset Voltage
GND
250
0.8
V
VOD
∆VOD
330
450
mV
25
1.375
25
mV
V
R
L = 100 Ω, Driver Enabled,
VOS
See Figure 2
1.125
1.23
∆VOS
Offset Magnitude Change from
Differential LOW-to-HIGH
Short Circuit Output Current
mV
IOS
DOUT+ = 0V and DOUT− = 0V,
−3.4
±3.4
−6
±6
mA
mA
Driver Enabled
V
V
OD = 0V, Driver Enabled
IIN
Input Current (EN, EN, DINx+, DINx−
)
IN = 0V to VCC, Other Input = VCC or 0V
±20
µA
(for Differential Inputs)
CC = 0V, VIN or VOUT = 0V to 3.6V
IOFF
ICCZ
ICC
Power Off Input or Output Current
Disabled Power Supply Current
Power Supply Current
V
±20
11
µA
mA
mA
Drivers Disabled
5.4
Drivers Enabled, Any Valid Input Condition
Driver Disabled, DOUT+ = 0V to 3.6V or
DOUT− = 0V to3.6V
30.4
41
IOZ
Disabled Output Leakage Current
±20
µA
V
VIC
CIN
Common Mode Voltage Range
Input Capacitance
|VID| = 100 mV to VCC
0V + |VID|/2
V
CC − (|VID|/2)
Enable Input
LVDS Input
2.6
2.1
2.8
1.2
pF
COUT
VBB
Output Capacitance
pF
V
Output Reference Voltage
V
CC = 3.3V, IBB = 0 to −275 µA
1.125
1.375
Note 2: All typical values are at TA = 25°C and with VCC = 3.3V.
3
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AC Electrical Characteristics
Over supply voltage and operating temperature ranges, unless otherwise specified
Min
Typ
Max
Symbol
Parameter
Test Conditions
Units
ns
(Note 3)
tPLHD
Differential Output Propagation Delay
LOW-to-HIGH
0.75
0.75
1.1
1.1
1.75
1.75
tPHLD
Differential Output Propagation Delay
HIGH-to-LOW
ns
R
L = 100 Ω, CL = 5 pF,
tTLHD
tTHLD
tSK(P)
Differential Output Rise Time (20% to 80%)
Differential Output Fall Time (80% to 20%)
V
ID = 200 mV to 450 mV,
0.29
0.29
0.4
0.4
0.58
0.58
0.2
ns
ns
ns
VIC = |VID|/2 to VCC − (|VID|/2),
Pulse Skew |tPLH - tPHL
|
Duty Cycle = 50%,
0.02
0.02
0.02
tSK(LH)
tSK(HL)
tSK(PP)
fMAX
,
Channel-to-Channel Skew
(Note 4)
See Figure 1 and Figure 3
0.15
0.5
ns
Part-to-Part Skew (Note 5)
Maximum Frequency (Note 6)(Note 7)
Differential Output Enable Time
from Z to HIGH
ns
400
800
2.2
MHz
tPZHD
5
5
ns
ns
ns
ns
ps
ps
tPZLD
tPHZD
tPLZD
tDJ
Differential Output Enable Time
from Z to LOW
2.5
1.8
2.1
85
R
L = 100 Ω, CL = 5 pF,
Differential Output Disable Time
from HIGH to Z
See Figure 2 and Figure 3
5
Differential Output Disable Time
from LOW to Z
5
LVDS Data Jitter,
V
V
V
V
ID = 300 mV, PRBS = 223 - 1,
IC = 1.2V at 800 Mbps
ID = 300 mV,
135
3.5
Deterministic
tRJ
LVDS Clock Jitter,
2.1
Random (RMS)
IC = 1.2V at 400 MHz
Note 3: All typical values are at TA = 25°C and with VCC = 3.3V.
Note 4: tSK(LH), tSK(HL) is the skew between specified outputs of a single device when the outputs have identical loads and are switching in the same direc-
tion.
Note 5: tSK(PP) is the magnitude of the difference in propagation delay times between any specified terminals of two devices switching in the same direction
(either Low-to-HIGH or HIGH-to-LOW) when both devices operate with the same supply voltage, same temperature, and have identical test circuits.
Note 6: Passing criteria for maximum frequency is the output VOD > 200 mV and the duty cycle is 45% to 55% with all channels switching.
Note 7: Output loading is transmission line environment only; CL is < 1 pF of stray test fixture capacitance.
FIGURE 1. Differential Receiver Voltage Definitions and
Propagation and Transition Time Test Circuit
Note A: All LVDS input pulses have frequency = 10 MHz, tR
or tF < = 0.5 ns
Note B: CL includes all probe and test fixture capacitances
FIGURE 3. Differential Driver Propagation Delay
and Transition Time Test Circuit
FIGURE 2. Differential Driver DC Test Circuit
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4
FIGURE 4. AC Waveform
Note A: All LVTTL input pulses have frequency = 10MHz, tR or tF < = 2 ns
Note B: CL includes all probe and jig capacitances
FIGURE 5. Differential Driver Enable and Disable Circuit
FIGURE 6. Enable and Disable AC Waveforms
5
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24-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC24
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be rea-
sonably expected to result in a significant injury to the
user.
2. A critical component in any component of a life support
device or system whose failure to perform can be rea-
sonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
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6
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
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