FMB200 [ONSEMI]

PNP 多芯片通用放大器;
FMB200
型号: FMB200
厂家: ONSEMI    ONSEMI
描述:

PNP 多芯片通用放大器

放大器 光电二极管 晶体管
文件: 总9页 (文件大小:356K)
中文:  中文翻译
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January 2014  
FMB200  
PNP Multi-Chip General-Purpose Amplifier  
Description  
This device is designed for general-purpose amplifier  
applications at collector currents to 300 mA. Sourced  
from Process 68.  
Block Diagram  
C2  
E1  
C2  
E1  
C1  
B2  
E2  
B1  
C1  
B2  
E2  
B1  
pin #1  
SuperSOT-6  
Mark: .N2  
Dot denotes pin #1  
Figure 1. Device Package  
Figure 2. Internal Connections  
Ordering Information  
Part Number  
Marking  
Package  
SSOT 6L  
Packing Method  
Tape and Reel  
FMB200  
.N2  
© 1998 Fairchild Semiconductor Corporation  
FMB200 Rev. 1.1.0  
www.fairchildsemi.com  
1
Absolute Maximum Ratings(1),(2)  
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-  
ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-  
tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The  
absolute maximum ratings are stress ratings only. Values are at TA = 25°C unless otherwise noted.  
Symbol  
VCEO  
VCBO  
VEBO  
IC  
Parameter  
Value  
-45  
Unit  
V
Collector-Emitter Voltage  
Collector-Base Voltage  
Emitter-Base Voltage  
-60  
V
-6  
V
Collector Current - Continuous  
-500  
mA  
°C  
TJ, TSTG Operating and Storage Junction Temperature Range  
-55 to +150  
Notes:  
1. These ratings are based on a maximum junction temperature of 150°C.  
2. These are steady-state limits. Fairchild Semiconductor should be consulted on applications involving pulsed or  
low-duty cycle operations.  
Thermal Characteristics(3)  
Values are at TA = 25°C unless otherwise noted.  
Symbol  
Parameter  
Max.  
700  
5.6  
Unit  
mW  
Total Device Dissipation  
PD  
Derate Above 25°C  
mW/°C  
°C/W  
RθJA  
Thermal Resistance, Junction to Ambient  
180  
Note:  
3. PCB size: FR-4 76 x 114 x 1.57 mm3 (3.0 inch x 4.5 inch x 0.062 inch) with minimum land pattern size.  
© 1998 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FMB200 Rev. 1.1.0  
2
Electrical Characteristics(4)  
Values are at TA = 25°C unless otherwise noted.  
Symbol  
Parameter  
Conditions  
IC = -10 μA, IB = 0  
Min. Typ. Max. Unit  
BVCBO Collector-Base Breakdown Voltage  
-60  
-45  
-6.0  
V
Collector-Emitter Breakdown  
BVCEO  
IC = -1.0 mA, IE = 0  
V
Voltage(4)  
BVEBO Emitter-Base Breakdown Voltage  
IE = -10 μA, IC = 0  
V
ICBO  
ICES  
IEBO  
Collector Cut-Off Current  
Collector Cut-Off Current  
Emitter Cut-Off Current  
VCB = -50 V, IE = 0  
-50  
-50  
-50  
nA  
nA  
nA  
VCE = -40 V, IE = 0  
VEB = -4.0 V, IC = 0  
IC = -100 μA, VCE = -1.0 V  
IC = -10 mA, VCE = -1.0 V  
IC = -150 mA, VCE = -5.0 V(4)  
IC = -10 mA, IB = -1.0 mA  
IC = -200 mA, IB = -20 mA(4)  
IC = -10 mA, IB = -1.0 mA  
IC = -200 mA, IB = -20 mA(4)  
VCE = -20 V, IC = -20 mA  
VCB = -10 V, f = 1.0 MHz  
80  
hFE  
DC Current Gain  
100  
100  
450  
350  
-0.2  
VCE(sat) Collector-Emitter Saturation Voltage  
VBE(sat) Base-Emitter Saturation Voltage  
V
V
-0.4  
-0.85  
-1.00  
fT  
Current Gain - Bandwidth Product  
Output Capacitance  
300  
4.5  
MHz  
pF  
Cob  
IC = -100 μA, VCE = -5.0 V,  
RG = 2.0 kΩ, f = 1.0 kHz  
NF  
Noise Figure  
2.5  
dB  
Note:  
4. Pulse test: pulse width 300 μs, duty cycle 2.0%.  
© 1998 Fairchild Semiconductor Corporation  
FMB200 Rev. 1.1.0  
www.fairchildsemi.com  
3
Typical Performance Characteristics  
0.3  
0.25  
0.2  
500  
V
= 5V  
CE  
β = 10  
125 °C  
400  
300  
200  
100  
0
0.15  
0.1  
25 °C  
25 °C  
- 40 °C  
0.05  
0
125 °C  
- 40 °C  
100  
0.1  
1
10  
300  
0.01  
0.1  
1
10  
100  
IC - COLLECTOR CURRENT (mA)  
I C - COLLECTOR CURRENT (mA)  
Figure 4. Collector-Emitter Saturation Voltage vs.  
Collector Current  
Figure 3. Typical Pulsed Current Gain vs.  
Collector Current  
1.2  
1
β = 10  
1
0.8  
0.6  
0.4  
0.2  
0
- 40°C  
25 °C  
- 40 °C  
0.8  
0.6  
0.4  
0.2  
0
125 °C  
25 °C  
125 °C  
V
= 5V  
CE  
0.1  
1
10  
100  
300  
0.1  
1
10  
100 200  
I C - COLLECTOR CURRENT (mA)  
IC - COLLECTOR CURRENT (mA)  
Figure 6. Base-Emitter On Voltage vs.  
Collector Current  
Figure 5. Base-Emitter Saturation Voltage vs.  
Collector Current  
100  
95  
90  
85  
80  
75  
70  
V
= 50V  
CB  
10  
1
0.1  
0.01  
0.1  
1
10  
100  
1000  
25  
50  
75  
100  
125  
RESISTANCE (k  
)
Ω
TA - AMBIE NT TEMP ERATURE ( C)  
°
Figure 8. Collector-Emitter Breakdown Voltage with  
Resistance Between Emitter-Base  
Figure 7. Collector Cut-Off Current vs.  
Ambient Temperature  
© 1998 Fairchild Semiconductor Corporation  
FMB200 Rev. 1.1.0  
www.fairchildsemi.com  
4
Typical Performance Characteristics (Continuous)  
100  
f = 1.0 MHz  
4
Ta = 25°C  
3
10  
Ic =  
100 uA  
300 mA  
50 mA  
2
1
0
Cib  
Cob  
0.1  
1
10  
100  
V - COLLECTOR VOLTAGE (V)  
CE  
100  
300  
700  
2000 4000  
I
- BASE CURRENT (uA)  
B
Figure 10. Input and Output Capacitance vs.  
Reverse Voltage  
Figure 9. Collector Saturation Region  
40  
30  
20  
10  
0
300  
V
= 5V  
ce  
270  
240  
210  
180  
150  
120  
90  
60  
30  
0
t
s
IB1 = IB2 = Ic / 10  
V
= 10 V  
cc  
t
f
t
r
t
d
10  
20  
30  
50  
100  
200 300  
1
10  
20  
50  
100 150  
IC - COLLECTOR CURRENT (mA)  
IC - COLLECTOR CURRENT (mA)  
Figure 12. Switching Times vs. Collector Current  
Figure 11. Gain Bandwidth Product vs.  
Collector Current  
1
SOT-6  
0.75  
0.5  
0.25  
0
0
25  
50  
75  
100  
125  
150  
TEMPERATURE (oC)  
Figure 13. Power Dissipation vs.  
Ambient Temperature  
© 1998 Fairchild Semiconductor Corporation  
FMB200 Rev. 1.1.0  
www.fairchildsemi.com  
5
Physical Dimensions  
SSOT  
Figure 14. 6 LEAD, SUPERSOT6, JEDEC MO-193, 1.6 MM WIDE  
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner  
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or  
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the  
warranty therein, which covers Fairchild products.  
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:  
http://www.fairchildsemi.com/dwg/MA/MA06A.pdf.  
For current tape and reel specifications, visit Fairchild Semiconductor’s online packaging area:  
http://www.fairchildsemi.com/packing_dwg/PKG-MA06A.pdf.  
© 1998 Fairchild Semiconductor Corporation  
FMB200 Rev. 1.1.0  
www.fairchildsemi.com  
6
TRADEMARKS  
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not  
intended to be an exhaustive list of all such trademarks.  
Sync-Lock™  
AccuPowerA  
AX-CAP®*  
F-PFSA  
FRFET®  
®
®*  
Global Power ResourceSM  
GreenBridgeA  
Green FPSA  
Green FPSA e-SeriesA  
GmaxA  
PowerTrench®  
PowerXS™  
Programmable Active DroopA  
QFET®  
BitSiCA  
TinyBoost®  
TinyBuck®  
TinyCalcA  
TinyLogic®  
TINYOPTOA  
TinyPowerA  
TinyPWMA  
TinyWireA  
TranSiCA  
Build it NowA  
CorePLUSA  
CorePOWERA  
CROSSVOLTA  
CTLA  
QSA  
GTOA  
IntelliMAXA  
Quiet SeriesA  
RapidConfigureA  
A
Current Transfer LogicA  
DEUXPEED®  
Dual Cool™  
EcoSPARK®  
EfficientMaxA  
ISOPLANARA  
Making Small Speakers Sound Louder  
and Better™  
Saving our world, 1mW/W/kW at a time™  
SignalWiseA  
SmartMaxA  
MegaBuckA  
TriFault DetectA  
TRUECURRENT®*  
SerDesA  
ESBCA  
MICROCOUPLERA  
MicroFETA  
SMART STARTA  
Solutions for Your SuccessA  
SPM®  
®
MicroPakA  
Fairchild®  
MicroPak2A  
Fairchild Semiconductor®  
FACT Quiet SeriesA  
FACT®  
UHC®  
Ultra FRFETA  
UniFETA  
VCXA  
VisualMaxA  
VoltagePlusA  
XS™  
STEALTHA  
MillerDriveA  
SuperFET®  
MotionMaxA  
mWSaver®  
SuperSOTA-3  
FAST®  
SuperSOTA-6  
OptoHiTA  
FastvCoreA  
FETBenchA  
FPSA  
OPTOLOGIC®  
OPTOPLANAR®  
SuperSOTA-8  
SupreMOS®  
SyncFETA  
* Trademarks of System General Corporation, used under license by Fairchild Semiconductor.  
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PRODUCT STATUS DEFINITIONS  
Definition of Terms  
Datasheet Identification  
Product Status  
Definition  
Datasheet contains the design specifications for product development. Specifications may change  
in any manner without notice.  
Advance Information  
Formative / In Design  
Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild  
Semiconductor reserves the right to make changes at any time without notice to improve design.  
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make  
changes at any time without notice to improve the design.  
Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.  
The datasheet is for reference information only.  
Preliminary  
No Identification Needed  
Obsolete  
First Production  
Full Production  
Not In Production  
Rev. I66  
© Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
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