FMBM5551 [ONSEMI]

NPN通用放大器;
FMBM5551
型号: FMBM5551
厂家: ONSEMI    ONSEMI
描述:

NPN通用放大器

放大器 光电二极管 晶体管
文件: 总7页 (文件大小:317K)
中文:  中文翻译
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FMBM5551  
NPN General-Purpose Amplifier  
Features  
• This device has matched dies  
• Sourced from process 16  
• See MMBT5551 for characteristics  
C2  
C2  
E1  
C1  
B2  
E2  
B1  
E1  
C1  
B2  
E2  
B1  
pin #1  
SuperSOTTM-6  
Mark: .3S2  
Dot denotes pin #1  
Figure 1. Device Package  
Figure 2. Internal Connection  
Ordering Information  
Part Number  
Top Mark  
Package  
SSOT 6L  
Packing Method  
FMBM5551  
3S2  
Tape and Reel  
Absolute Maximum Ratings  
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-  
ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-  
tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The  
absolute maximum ratings are stress ratings only. Values are at TA = 25°C unless otherwise noted.  
Symbol  
VCEO  
VCBO  
VEBO  
IC  
Parameter  
Value  
160  
Unit  
V
Collector-Emitter Voltage  
Collector-Base Voltage  
Emitter-Base Voltage  
Collector Current (DC)  
Junction Temperature  
180  
V
6
V
600  
mA  
°C  
°C  
TJ  
150  
TSTG  
Storage Temperature Range  
-55 to 150  
© 2005 Semiconductor Components Industries, LLC.  
October-2017,Rev. 2  
Publication Order Number:  
FMBM5551/D  
Thermal Characteristics(1), (2)  
Values are at TA = 25°C unless otherwise noted.  
Symbol  
PD  
Parameter  
Value  
0.7  
Unit  
W
Power Dissipation (TC = 25°C)  
Derate Above 25°C  
5.6  
mW/°C  
°C/W  
RθJA  
Thermal Resistance, Junction-to-Ambient  
180  
Notes:  
1. PD total, for both transistors. For each transistor, PD = 350 mW.  
2. PCB size: FR-4, 76 mm x 114 mm x 1.57 mm (3.0 inch x 4.5 inch x 0.062 inch) with minimum land pattern size.  
Electrical Characteristics  
Values are at TA = 25°C unless otherwise noted.  
Symbol  
Parameter  
Conditions  
Min.  
160  
180  
6
Max.  
Unit  
V
BVCEO Collector-Emitter Breakdown Voltage IC = 1 mA, IB = 0  
BVCBO Collector-Base Breakdown Voltage  
BVEBO Emitter-Base Breakdown Voltage  
IC = 100 μA, IE = 0  
IE = 10 μA, IC = 0  
V
V
V
CB = 120 V, IE = 0  
50  
50  
50  
nA  
μA  
nA  
ICBO  
Collector Cut-Off Current  
VCB = 120 V, IE = 0, TA = 100°C  
VEB = 4 V, IC = 0  
IEBO  
hFE1  
Emitter Cut-Off Current  
DC Current Gain  
VCE = 5 V, IC = 1 mA  
80  
0.9  
80  
Variation Ratio of hFE1  
Between Die 1 and Die 2  
DIVID1  
hFE2  
hFE1(Die1) / hFE1(Die2)  
VCE = 5 V, IC = 10 mA  
1.1  
250  
1.05  
DC Current Gain  
Variation Ratio of hFE2  
Between Die 1 and Die 2  
DIVID2  
hFE3  
h
FE2(Die1) / hFE2(Die2)  
VCE = 5 V, IC = 50 mA  
FE3(Die1) / hFE3(Die2)  
0.95  
30  
DC Current Gain  
Variation Ratio of hFE3  
Between Die 1 and Die 2  
DIVID3  
h
0.9  
1.1  
IC = 10 mA, IB = 1 mA  
IC = 50 mA, IB = 5 mA  
IC = 10 mA, IB = 1 mA  
IC = 50 mA, IB = 5 mA  
VCE = 5 V, IC = 10 mA  
0.15  
0.20  
1
VCE(sat) Collector-Emitter Saturation Voltage  
V
V
VBE(sat) Base-Emitter Saturation Voltage  
VBE(on) Base-Emitter On Voltage  
1
1
V
Difference of VBE(on)  
DEL  
VBE(on)(Die1) - VBE(on)(Die2)  
-8  
8
mV  
Between Die1 and Die 2  
Cob  
Cib  
Output Capacitance  
Input Capacitance  
VCB = 10 V, IE = 0, f = 1 MHz  
VEB = 0.5 V, IC = 0, f = 1 MHz  
6
pF  
pF  
20  
VCE = 10 V, IC = 10 mA,  
f = 100 MHz  
fT  
Current Gain Bandwidth Product  
100  
300  
MHz  
V
CE = 5 V, IC = 200 μA,  
NF  
hfe  
Noise Figure  
f = 1 MHz, RS = 20 kΩ,  
B = 200 Hz  
8
dB  
VCE = 10 V, IC = 1.0 mA,  
f = 10 kHz  
Small Signal Current Gain  
50  
250  
www.onsemi.com  
2
Typical Performance Characteristics  
vs Collector Current  
250  
0.5  
0.4  
0.3  
0.2  
0.1  
0
125 °C  
200  
β = 10  
150  
25 °C  
25 °C  
100  
- 40 °C  
125 °C  
VCE = 5V  
50  
- 40 °C  
0
F
E
0.1 0.2  
0.5  
1
2
5
10 20  
50 100  
1
10  
100  
200  
IC - COLLECTOR CURRENT (mA)  
I C - COLLECTOR CURRENT (mA)  
Figure 4. Collector-Emitter Saturation Voltage  
vs. Collector Current  
Figure 3. Typical Pulsed Current Gain  
vs. Collector Current  
ll
Collector Current  
1
β = 10  
- 40 °C  
1
0.8  
0.6  
0.4  
0.2  
0
0.8  
25 °C  
- 40 °C  
125  
°C  
25 °C  
0.6  
125 °C  
0.4  
V
= 5V  
CE  
0.2  
0
1
10  
- COLLECTOR CURRENT (mA)  
100  
200  
0.1  
1
10  
100 200  
I
IC - COLLECTOR CURRENT (mA)  
Figure 6. Base-Emitter On Voltage  
vs. Collector Current  
Figure 5. Base-Emitter Saturation Voltage  
vs. Collector Current  
Between Emitter-Base  
50  
260  
240  
220  
200  
180  
160  
VCB= 100V  
I
= 1.0 mA  
C
10  
C
B
O
1
25  
50  
75  
100  
°
125  
0.1  
1
10  
100  
1000  
TA - AMBIENT TEMPERATURE ( C)  
RESISTANCE (k  
Ω
)
Figure 8. Collector-Emitter Breakdown Voltage  
with Resistance Between Emitter-Base  
Figure 7. Collector Cut-Off Current  
vs. Ambient Temperature  
www.onsemi.com  
3
Typical Performance Characteristics (Continued)  
l
30  
16  
12  
8
FREG = 20 MHz  
VCE = 10V  
f = 1.0 MHz  
25  
20  
15  
C
ib  
10  
5
4
C
cb  
0
0.1  
0
1
10  
100  
1
10  
I C - COLLECTOR CURRENT (mA)  
50  
V
- COLLECTOR VOLTAGE (V)  
CE  
Figure 10. Small Signal Current Gain  
vs. Collector Current  
Figure 9. Input and Output Capacitance  
vs. Reverse Voltage  
www.onsemi.com  
4
Physical Dimensions  
Figure 11. 6-LEAD, SUPERSOT6, JEDEC MO-193, 1.6 MM WIDE  
www.onsemi.com  
5
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
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