FNE41060 [ONSEMI]
智能功率模块,600V,10A;型号: | FNE41060 |
厂家: | ONSEMI |
描述: | 智能功率模块,600V,10A |
文件: | 总17页 (文件大小:1033K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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September 2010
TM
Motion-SPM
FNE41060
Smart Power Module
Features
General Description
It is an advanced motion-smart power module (Motion-SPMTM
)
•
•
•
600V-10A 3-phase IGBT inverter bridge including control ICs
for gate driving and protection
that Fairchild has newly developed and designed to provide
very compact and high performance ac motor drives mainly tar-
geting low-power inverter-driven application like air conditioner
and washing machine. It combines optimized circuit protection
and drive matched to low-loss IGBTs. System reliability is fur-
ther enhanced by the integrated under-voltage lock-out protec-
tion, short-circuit protection, and temperature monitoring. The
high speed built-in HVIC provides opto-coupler-less single-sup-
ply IGBT gate driving capability that further reduce the overall
size of the inverter system design. Each phase current of
inverter can be monitored separately due to the divided nega-
tive dc terminals.
Easy PCB layout due to built-in bootstrap diode and VS out-
put
Divided negative dc-link terminals for inverter current sensing
applications
•
•
•
Single-grounded power supply due to built-in HVIC
Built-in thermistor for over-temperature monitoring
Isolation rating of 2000Vrms/min.
Applications
Additional Information
For further infomation, please see AN-9070 and FEB306-001 in
http://www.fairchildsemi.com
•
AC 100V ~ 253V three-phase inverter drive for small power
ac motor drives
•
Home appliances applications like air conditioner and wash-
ing machine
Figure 1.
©2010 Fairchild Semiconductor Corporation
FNE41060 Rev. C
1
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Integrated Power Functions
•
600V-10A IGBT inverter for three-phase DC/AC power conversion (Please refer to Figure 3)
Integrated Drive, Protection and System Control Functions
•
For inverter high-side IGBTs: Gate drive circuit, High voltage isolated high-speed level shifting
Control circuit under-voltage (UV) protection
•
For inverter low-side IGBTs: Gate drive circuit, Short circuit protection (SC)
Control supply circuit under-voltage (UV) protection
•
•
Fault signaling: Corresponding to UV (Low-side supply) and SC faults
Input interface: 3.3/5V CMOS compatible, Schmitt trigger input
Pin Configuration
Top View
Figure 2.
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FNE41060 Rev. C
Pin Descriptions
Pin Number
Pin Name
Pin Description
1
2
N.C.
N.C.
P
No Connection
No Connection
3
Positive DC–Link Input
Output for U Phase
4
U
5
V
Output for V Phase
6
W
Output for W Phase
7
NU
Negative DC–Link Input for U Phase
Negative DC–Link Input for V Phase
8
NV
9
NW
Negative DC–Link Input for W Phase
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
CSC
Capacitor (Low-pass Filter) for Short-Current Detection Input
Fault Output
VFO
IN(WL)
IN(VL)
IN(UL)
COM
VCC(L)
VCC(H)
IN(WH)
IN(VH)
IN(UH)
VS(W)
VB(W)
VS(V)
VB(V)
VS(U)
VB(U)
Signal Input for Low-side W Phase
Signal Input for Low-side V Phase
Signal Input for Low-side U Phase
Common Supply Ground
Low-Side Common Bias Voltage for IC and IGBTs Driving
High-Side Common Bias Voltage for IC and IGBTs Driving
Signal Input for High-side W Phase
Signal Input for High-side V Phase
Signal Input for High-side U Phase
High-side Bias Voltage Ground for W Phase IGBT Driving
High-side Bias Voltage for W Phase IGBT Driving
High-side Bias Voltage Ground for V Phase IGBT Driving
High-side Bias Voltage for V Phase IGBT Driving
High-side Bias Voltage Ground for U Phase IGBT Driving
High-side Bias Voltage for U Phase IGBT Driving
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FNE41060 Rev. C
Internal Equivalent Circuit and Input/Output Pins
N.C. (1)
N.C. (2)
P (3)
(26) VB(U)
UVB
(25) VS(U)
UVS
OUT(UH)
(24) VB(V)
U(4)
UVS
VVB
VVS
(23) VS(V)
(22) VB(W)
(21) VS(W)
WVB
WVS
OUT(VH)
VVS
(20) IN(UH)
(19) IN(VH)
IN(UH)
IN(VH)
IN(WH)
VCC
V (5)
(18) IN(WH)
(17) VCC(H)
OUT(WH)
WVS
COM
W(6)
(16) VCC(L)
(15) COM
VCC
OUT(UL)
OUT(VL)
COM
NU (7)
NV (8)
NW (9)
(14) IN(UL)
(13) IN(VL)
IN(UL)
IN(VL)
IN(WL)
(12) IN(WL)
(11) VFO
VFO
(10) CSC
C(SC)
OUT(WL)
Note:
1) Inverter high-side is composed of three IGBTs, freewheeling diodes and one control IC for each IGBT.
2) Inverter low-side is composed of three IGBTs, freewheeling diodes and one control IC for each IGBT. It has gate drive and protection functions.
3) Inverter power side is composed of four inverter dc-link input terminals and three inverter output terminals.
Figure 3.
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FNE41060 Rev. C
Absolute Maximum Ratings (TJ = 25°C, Unless Otherwise Specified)
Inverter Part
Symbol
VPN
Parameter
Conditions
Applied between P- NU, NV, NW
Applied between P- NU, NV, NW
Rating
Units
Supply Voltage
450
500
600
10
V
V
VPN(Surge)
VCES
IO,25
Supply Voltage (Surge)
Collector-emitter Voltage
Output Phase Current
V
TC = 25°C, TJ < 150°C (Note 1)
TC = 100°C, TJ < 150°C (Note 1)
TC = 25°C, TJ < 150°C, Under 1ms Pulse Width
TC = 25°C per One Chip
A
IO,100
Ipk
Output Phase Current
5
A
Output Peak Phase Current
Collector Dissipation
15
A
PC
32
W
°C
TJ
Operating Junction Temperature
(Note 2)
-40 ~ 150
Note:
1. Sinusoidal PWM at V =300V, V =V =15V, T < 150°℃, F =20kHz, MI=0.9, PF=0.8
PN
CC
BS
J
SW
2. The maximum junction temperature rating of the power chips integrated within the SPM is 150°C.
Control Part
Symbol
VCC
Parameter
Conditions
Rating
20
Units
Control Supply Voltage
Applied between VCC(H), VCC(L) - COM
V
V
VBS
High-side Control Bias
Voltage
Applied between VB(U) - VS(U), VB(V) - VS(V)
VB(W) - VS(W)
,
,
20
VIN
Input Signal Voltage
Applied between IN(UH), IN(VH), IN(WH), IN(UL)
IN(VL), IN(WL) - COM
-0.3~VCC+0.3
V
VFO
IFO
Fault Output Supply Voltage
Fault Output Current
Applied between VFO - COM
Sink Current at VFO Pin
-0.3~VCC+0.3
1
V
mA
V
VSC
Current Sensing Input Voltage
Applied between CSC - COM
-0.3~VCC+0.3
Bootstrap Diode Part
Symbol
Parameter
Conditions
Rating
600
Units
VRRM
IF
Maximum Repetitive Reverse Voltage
Forward Current
V
A
TC = 25°C
0.5
IFP
TJ
Forward Current (Peak)
TC = 25°C, Under 1ms Pulse Width
1
A
Operating Junction Temperature
-40 ~ 150
°C
Total System
Symbol
Parameter
Conditions
Rating
Units
VPN(PROT) Self Protection Supply Voltage Limit
(Short Circuit Protection Capability)
VCC = VBS = 13.5 ~ 16.5V
TJ = 150°C, Non-repetitive, less than 2ms
400
V
TSTG
VISO
Storage Temperature
Isolation Voltage
-40 ~ 125
2000
°C
60Hz, Sinusoidal, AC 1 minute, Connection
Pins to heat sink plate
Vrms
Thermal Resistance
Symbol
Parameter
Conditions
Min. Typ. Max. Units
Rth(j-c)Q
Rth(j-c)F
Junction to Case Thermal
Resistance
Inverter IGBT part (per 1/6 module)
Inverter FWD part (per 1/6 module)
-
-
-
-
3.8
4.8
°C/W
°C/W
Note:
3. For the measurement point of case temperature(T ), please refer to Figure 2.
C
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FNE41060 Rev. C
Electrical Characteristics (TJ = 25°C, Unless Otherwise Specified)
Inverter Part
Symbol
Parameter
Conditions
Min. Typ. Max. Units
VCE(SAT)
Collector-Emitter Saturation VCC = VBS = 15V
IC = 5A, TJ = 25°C
-
1.5
2.0
V
Voltage
VIN = 5V
VF
FWD Forward Voltage
Switching Times
VIN = 0V
IF = 5A, TJ = 25°C
-
1.5
0.75
0.20
0.70
0.15
0.15
0.65
0.15
0.65
0.15
0.15
-
2.0
1.25
0.45
1.20
0.40
-
V
ms
ms
ms
ms
ms
ms
ms
ms
ms
ms
mA
HS
tON
tC(ON)
tOFF
tC(OFF)
trr
VPN = 300V, VCC = VBS = 15V, IC = 5A
TJ = 25°C
VIN = 0V « 5V, Inductive Load
(Note 4)
0.45
-
-
-
-
LS
tON
VPN = 300V, VCC = VBS = 15V, IC = 5A
TJ = 25°C
VIN = 0V « 5V, Inductive Load
(Note 4)
0.35
1.15
0.40
1.15
0.40
-
tC(ON)
tOFF
tC(OFF)
trr
-
-
-
-
-
ICES
Collector-Emitter
Leakage Current
VCE = VCES
1
Note:
4.
t
and t
include the propagation delay time of the internal drive IC. t
and t
are the switching time of IGBT itself under the given gate driving condition internally.
C(OFF)
ON
OFF
C(ON)
For the detailed information, please see Figure 4.
100% IC 100% IC
trr
VCE
IC
IC
VCE
VIN
VIN
tON
tOFF
tC(ON)
tC(OFF)
10% IC
VIN(ON)
VIN(OFF)
10% VCE
10% IC
10% VCE
90% IC
(b) turn-off
(a) turn-on
Figure 4. Switching Time Definition
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FNE41060 Rev. C
Switching Loss (Typical)
Inductive Load, VPN=300V, VCC=15V, TJ=25℃
Inductive Load, VPN=300V, VCC=15V, TJ=150℃
400
350
300
250
200
150
100
50
400
350
300
250
200
150
100
50
IGBTTurn-ON, Eon
IGBTTurn-OFF, Eoff
IGBTTurn-ON, Eon
IGBTTurn-OFF, Eoff
FRDTurn-OFF, E
rec
FRDTurn-OFF, E
rec
0
0
0
1
2
3
4
5
0
1
2
3
4
5
COLLECTOR CURRENT, Ic [AMPERES]
COLLECTOR CURRENT, Ic [AMPERES]
Figure 5. Switching Loss Characteristics
Control Part
Symbol
Parameter
Conditions
Min. Typ. Max. Units
IQCCH
IQCCL
IPCCH
Quiescent VCC Supply VCC(H) = 15V, IN(UH,VH,WH) = 0V
VCC(H) - COM
VCC(L) - COM
-
-
-
-
-
-
0.10
2.65
0.15
mA
mA
mA
Current
VCC(L) = 15V, IN(UL,VL, WL) = 0V
Operating VCC Supply VCC(H)
= 15V, fPWM = 20kHz, VCC(H) - COM
Current
duty=50%, applied to one PWM
signal input for High-side
IPCCL
VCC(L)
=
15V, fPWM
=
20kHz, VCC(L) - COM
-
-
3.65
mA
duty=50%, applied to one PWM
signal input for Low-side
IQBS
IPBS
Quiescent VBS Supply VBS = 15V, IN(UH, VH, WH) = 0V
Current
VB(U) - VS(U), VB(V)
VS(V), VB(W) - VS(W)
-
-
-
-
-
0.30
2.00
mA
mA
Operating VBS Supply VCC = VBS = 15V, fPWM = 20kHz, VB(U) - VS(U), VB(V)
-
Current
duty=50%, applied to one PWM VS(V), VB(W) - VS(W)
signal input for High-side
VFOH
VFOL
Fault Output Voltage
VSC = 0V, VFO Circuit: 4.7kW to 5V Pull-up
VSC = 1V, VFO Circuit: 4.7kW to 5V Pull-up
4.5
-
-
-
V
V
V
V
V
V
V
ms
V
V
-
0.5
0.55
13.0
13.5
12.5
13.0
-
VSC(ref) Short Circuit Trip Level VCC = 15V (Note 5)
0.45
10.5
11.0
10.0
10.5
30
0.5
UVCCD
UVCCR
UVBSD
UVBSR
tFOD
Detection Level
Reset Level
-
-
-
-
-
-
-
Supply Circuit
Under-Voltage
Protection
Detection Level
Reset Level
Fault-out Pulse Width
VIN(ON) ON Threshold Voltage Applied between IN(UH), IN(VH), IN(WH), IN(UL), IN(VL)
,
-
2.6
-
IN(WL) - COM
VIN(OFF) OFF Threshold Voltage
0.8
Note:
5. Short-circuit current protection is functioning only at the low-sides.
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FNE41060 Rev. C
Bootstrap Diode Part
Symbol
Parameter
Conditions
Min. Typ. Max. Units
VF
trr
Forward Voltage
IF = 0.1A, TC = 25°C
IF = 0.1A, TC = 25°C
-
-
2.5
80
-
-
V
Reverse Recovery Time
ns
Built in Bootstrap Diode VF-IF Characteristic
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
TC=25℃
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15
VF [V]
Note:
6. Built in bootstrap diode includes around 15Ωresistance characteristic.
Figure 6. Built in Bootstrap Diode Characteristic
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FNE41060 Rev. C
Recommended Operating Conditions
Value
Symbol
Parameter
Conditions
Units
Min. Typ. Max.
VPN
VCC
VBS
Supply Voltage
Applied between P - NU, NV, NW
-
300
15
15
-
400
16.5
18.5
1
V
V
Control Supply Voltage
High-side Bias Voltage
Applied between VCC(H), VCC(L)-COM
Applied between VB(U)-VS(U), VB(V)-VS(V),VB(W)-VS(W)
13.5
13.0
-1
V
dVCC/dt, Control supply variation
dVBS/dt
V/ms
tdead
Blanking Time for
Preventing Arm-short
For Each Input Signal
1.5
-
-
-
ms
fPWM
VSEN
PWM Input Signal
-40°C < TJ < 150°C
-
20
4
kHz
V
Voltage for Current
Sensing
Applied between NU, NV, NW - COM
(Including surge voltage)
-4
PWIN(ON) Minimun Input Pulse
(Note 7)
0.5
0.5
-
-
-
-
ms
Width
PWIN(OFF)
Note:
7. SPM might not make response if input pulse width is less than the recommanded value.
Allowable Maximum Output Current
10
9
8
7
6
5
4
3
2
1
0
fSW=5kHz
fSW=15kHz
VDC=300V, VCC=VBS=15V
T < 150℃ , T ≤ 125℃
J
C
M.I.=0.9, P.F.=0.8
Sinusoidal PWM
0
10
20
30
40
50
60
70
80
90 100 110 120 130 140
Case Temperature, TC [℃]
Note:
8. The allowable output current value may be different from the actual application.
Figure 7. Allowable Maximum Output Current
Package Marking and Ordering Information
Device Marking
Device
Package
Reel Size
Tape Width
Quantity
FNE41060
FNE41060
SPM26-AAA
-
-
12
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FNE41060 Rev. C
Mechanical Characteristics and Ratings
Limits
Parameter
Conditions
Units
Min.
0
Typ.
-
Max.
+120
0.8
Device Flatness
Note Figure 8
mm
N•m
kg•cm
g
Mounting Torque
Mounting Screw: - M3
Recommended 0.7N•m
Recommended 7.1kg•cm
0.6
6.2
-
0.7
7.1
11
8.1
Note Figure 9
Weight
-
Figure 8. Flatness Measurement Position
Pre - Screwing : 1→2
Final Screwing : 2→1
2
1
Note:
9. Do not make over torque when mounting screws. Much mounting torque may cause ceramic cracks, as well as bolts and Al heat-sink destruction.
10. Avoid one side tightening stress. Fig.9 shows the recommended torque order for mounting screws. Uneven mounting can cause the SPM ceramic substrate to be damaged.
The Pre-Screwing torque is set to 20~30% of maximum torque rating.
Figure 9. Mounting Screws Torque Order
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FNE41060 Rev. C
Time Charts of SPMs Protective Function
Input Signal
Protection
RESET
SET
RESET
Circuit State
UVCCR
a1
a6
UVCCD
Control
Supply Voltage
a3
a4
a2
a7
Output Current
a5
Fault Output Signal
a1 : Control supply voltage rises: After the voltage rises UVCCR, the circuits start to operate when next input is applied.
a2 : Normal operation: IGBT ON and carrying current.
a3 : Under voltage detection (UVCCD).
a4 : IGBT OFF in spite of control input condition.
a5 : Fault output operation starts.
a6 : Under voltage reset (UVCCR).
a7 : Normal operation: IGBT ON and carrying current.
Figure 10. Under-Voltage Protection (Low-side)
Input Signal
Protection
RESET
SET
RESET
Circuit State
UVBSR
b5
b1
Control
Supply Voltage
UVBSD
b2
b3
b4
b6
Output Current
High-level (no fault output)
Fault Output Signal
b1 : Control supply voltage rises: After the voltage reaches UVBSR, the circuits start to operate when next input is applied.
b2 : Normal operation: IGBT ON and carrying current.
b3 : Under voltage detection (UVBSD).
b4 : IGBT OFF in spite of control input condition, but there is no fault output signal.
b5 : Under voltage reset (UVBSR
)
b6 : Normal operation: IGBT ON and carrying current
Figure 11. Under-Voltage Protection (High-side)
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FNE41060 Rev. C
Lower arms
control input
c6
c7
Protection
Circuit state
SET
RESET
Internal IGBT
Gate-Emitter Voltage
c4
c3
c2
SC
c1
c8
Output Current
SC Reference Voltage
Sensing Voltage
of the shunt
resistance
CR circuit time
constant delay
c5
Fault Output Signal
(with the external shunt resistance and CR connection)
c1 : Normal operation: IGBT ON and carrying current.
c2 : Short circuit current detection (SC trigger).
c3 : Hard IGBT gate interrupt.
c4 : IGBT turns OFF.
c5 : Input “L” : IGBT OFF state.
c6 : Input “H”: IGBT ON state, but during the active period of fault output the IGBT doesn’t turn ON.
c7 : IGBT OFF state
Figure 12. Short-Circuit Current Protection (Low-side Operation only)
Input/Output Interface Circuit
5V-Line (MCU or Control power)
RPF=10kΩ
SPM
,
,
IN(UH) IN(VH)
IN(WH)
,
,
IN(UL) IN(VL)
IN(WL)
MCU
VFO
COM
Note:
1) RC coupling at each input (parts shown dotted) might change depending on the PWM control scheme used in the application and the wiring impedance of the application’s
printed circuit board. The SPM input signal section integrates 5kW (typ.) pull-down resistor. Therefore, when using an external filtering resistor, please pay attention to the sig-
nal voltage drop at input terminal.
2) The logic input is compatible with standard CMOS outputs.
Figure 13. Recommended CPU I/O Interface Circuit
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FNE41060 Rev. C
HVIC
VB(U)
(26) VB(U)
P (3)
U (4)
CBS
CBS
CBS
CBSC
(25) VS(U)
(20) IN(UH)
VS(U)
OUT(UH)
VS(U)
RS
IN(UH)
VB(V)
Gating UH
Gating VH
Gating WH
(24) VB(V)
CBSC
(23) VS(V)
(19) IN(VH)
VS(V)
RS
OUT(VH)
VS(V)
IN(VH)
V (5)
(22) VB(W)
(21) VS(W)
M
VB(W)
VS(W)
CBSC
RS
(18) IN(WH)
(17) VCC(H)
IN(WH)
VCC
CDCS
VDC
M
C
U
OUT(WH)
VS(W)
15V line
W (6)
CPS
CPS
CPS
CSPC15
CSP15
(15) COM
(16) VCC(L)
COM
5V line
LVIC
VCC
VFO
OUT(UL)
OUT(VL)
OUT(WL)
RPF
RSU
NU (7)
NV (8)
NW (9)
CSPC05
CSP05
RS
(11) VFO
Fault
CPF
CBPF
RS
(14) IN(UL)
(13) IN(VL)
(12) IN(WL)
RSV
Gating UL
Gating VL
Gating WL
IN(UL)
IN(VL)
RS
RS
IN(WL)
COM
CSC
CSC
(10) CSC
(1) N.C.
(2) N.C.
CPS CPS CPS
RSW
RF
U-Phase Current
V-Phase Current
W-Phase Current
Input Signal for
Short-Circuit Protection
Note:
1) To avoid malfunction, the wiring of each input should be as short as possible. (less than 2-3cm)
2) By virtue of integrating an application specific type HVIC inside the SPM, direct coupling to CPU terminals without any opto-coupler or transformer isolation is possible.
3) V output is open drain type. This signal line should be pulled up to the positive side of the MCU or control power supply with a resistor that makes I up to 1mA. Please refer
FO
FO
to Figure14.
4) C
of around 7 times larger than bootstrap capacitor C is recommended.
BS
SP15
5) Input signal is High-Active type. There is a 5kW resistor inside the IC to pull down each input signal line to GND. RC coupling circuits is recommanded for the prevention
of input signal oscillation. R C time constant should be selected in the range 50~150ns. (Recommended R =100Ω, C =1nF)
S
PS
S
PS
6) To prevent errors of the protection function, the wiring around R and C should be as short as possible.
F
SC
7) In the short-circuit protection circuit, please select the R C time constant in the range 1.5~2ms.
F
SC
8) Each capacitor should be mounted as close to the pins of the SPM as possible.
9) To prevent surge destruction, the wiring between the smoothing capacitor and the P&GND pins should be as short as possible. The use of a high frequency non-inductive
capacitor of around 0.1~0.22mF between the P&GND pins is recommended.
10) Relays are used at almost every systems of electrical equipments of home appliances. In these cases, there should be sufficient distance between the CPU and the relays.
11) The zener diode should be adopted for the protection of ICs from the surge destruction between each pair of control supply terminals. (Recommanded zener diode=24V/1W)
12) Please choose the electrolytic capacitor with good temperature characteristic in C . Also, choose 0.1~0.2mF R-category ceramic capacitors with good temperature and
BS
frequency characteristics in C
.
BSC
13) For the detailed information, please refer to the AN-9070 and FEB306-001.
Figure 14. Typical Application Circuit
13
www.fairchildsemi.com
FNE41060 Rev. C
Detailed Package Outline Drawings
14
www.fairchildsemi.com
FNE41060 Rev. C
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