FOD073L [ONSEMI]

双通道低输入电流高增益分离式达灵顿光耦合器;
FOD073L
型号: FOD073L
厂家: ONSEMI    ONSEMI
描述:

双通道低输入电流高增益分离式达灵顿光耦合器

局域网 输出元件 光电
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Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s  
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is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
April 2009  
FOD073L  
LVTTL/LVCMOS Compatible Low Input Current  
High Gain Split Darlington Optocoupler  
Features  
Description  
Low power consumption  
Low input current: 0.5mA  
Dual channel 8-pin SOIC package  
High CTR: 400% minimum  
High CMR: 10kV/µs  
The FOD073L optocoupler consists of an AlGaAs LED  
optically coupled to a high gain split darlington photo-  
detector. This device is specified to operate at a 3.3V  
supply voltage.  
An integrated emitter – base resistor provides superior  
stability over temperature.  
Guaranteed performance over temperature  
0°C to 70°C  
The combination of a very low input current of 0.5mA  
and a high current transfer ratio of 2000% (typical)  
makes this device particularly useful for input interface to  
MOS, CMOS, LSTTL and EIA RS232C, while output  
compatibility is ensured to LVCMOS as well as high  
fan-out LVTTL requirements.  
U.L. recognized (File # E90700)  
LVTTL/LVCMOS Compatible output  
Applications  
Digital logic ground isolation – LVTTL/LVCMOS  
Telephone ring detector  
An internal noise shield provides exceptional common  
mode rejection of 10kV/µs.  
EIA-RS-232C line receiver  
High common mode noise line receiver  
µP bus isolation  
Current loop receiver  
Schematic  
Package Outline  
VCC  
+
1
8
VF1  
_
V01  
2
3
7
6
5
_
V02  
Truth Table  
VF2  
LED  
ON  
V
O
LOW  
GND  
+
4
OFF  
HIGH  
©2004 Fairchild Semiconductor Corporation  
FOD073L Rev. 1.0  
www.fairchildsemi.com  
Absolute Maximum Ratings (No derating required up to 85°C)  
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be  
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.  
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.  
The absolute maximum ratings are stress ratings only.  
Symbol  
Parameter  
Value  
Units  
°C  
T
Storage Temperature  
Operating Temperature  
Lead Solder Temperature  
-40 to +125  
-40 to +85  
STG  
T
°C  
OPR  
T
260 for 10 sec  
°C  
SOL  
(Wave solder only. See reflow profile for surface mount devices)  
EMITTER  
I (avg)  
DC/Average Forward Input Current  
Each Channel  
20  
40  
mA  
mA  
F
I (pk)  
Peak Forward Input Current  
(50% duty cycle, 1ms P.W.)  
Each Channel  
F
I (trans)  
Peak Transient Input Current (1µs P. W., 300 pps)  
Reverse Input Voltage  
Each Channel  
Each Channel  
Each Channel  
1.0  
5
A
V
F
V
P
R
D
Input Power Dissipation  
35  
mW  
DETECTOR  
(avg)  
I
Average Output Current  
Each Channel  
60  
0.5  
mA  
V
O
V
Emitter-Base Reverse Voltage (FOD070L, FOD270L) Each Channel  
EB  
V
, V  
Supply Voltage, Output Voltage  
Output power dissipation  
Each Channel  
Each Channel  
-0.5 to 7  
100  
V
CC  
O
P
mW  
D
©2004 Fairchild Semiconductor Corporation  
FOD073L Rev. 1.0  
www.fairchildsemi.com  
2
Electrical Characteristics (T = 0 to 70°C unless otherwise specified)  
A
Individual Component Characteristics  
Symbol Parameter  
EMITTER  
Test Conditions  
Min.  
Typ.*  
Max.  
Unit  
V
V
Input Forward Voltage  
T =25°C  
1.35  
1.7  
F
A
I = 1.6mA (Each Channel)  
1.75  
F
BV  
Input Reverse  
T =25°C, I = 10µA  
5.0  
V
R
A
R
Breakdown Voltage  
(Each Channel)  
DETECTOR  
I
Logic High Output Current  
Logic Low Supply Current  
Logic High Supply Current  
I = 0 mA, V = V = 3.3V  
(Each Channel)  
0.05  
0.8  
25  
3
µA  
mA  
µA  
OH  
F
O
CC  
I
I
F1  
= I = 1.6mA,  
CCL  
CCH  
F2  
V
= V = Open, V = 3.3V  
O1  
O2 CC  
I
I
= I = 0mA,  
0.01  
2
F1  
F2  
V
= V = Open, V = 3.3V  
O1  
O2 CC  
Transfer Characteristics  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.*  
Max.  
Unit  
CTR  
COUPLED  
I = 0.5mA, V = 0.4V, V = 3.3V  
400  
7000  
%
F
O
CC  
Current Transfer Ratio  
(Note 1)  
V
Logic Low Output Voltage  
I = 1.6mA, I = 8mA, V = 3.3V  
0.07  
0.07  
0.3  
0.4  
V
OL  
F
O
CC  
I = 5mA, I = 15mA, V = 3.3V  
F
O
CC  
Switching Characteristics (V = 3.3 V)  
CC  
Symbol Parameter  
Test Conditions  
Min.  
Typ.*  
Max. Unit  
T
Propagation Delay  
Time to Logic LOW  
R = 4.7k, I = 0.5mA  
(Fig. 9)  
5
30  
µs  
PHL  
L
F
T
Propagation Delay  
Time to Logic HIGH  
R = 4.7k, I = 0.5mA  
(Fig. 9)  
25  
90  
µs  
PLH  
L
F
|CM | Common Mode Transient I = 0 mA, |V | = 10 V , T = 25°C,  
1,000  
10,000  
10,000  
V/µs  
V/µs  
H
F
CM  
P-P  
A
Immunity at Logic HIGH R = 2.2k(Note 2) (Fig. 10)  
L
|CM | Common Mode Transient I = 1.6mA, |V | = 10 V , R = 2.2k, 1,000  
L
F
CM  
P-P  
L
Immunity at Logic LOW  
T = 25°C (Note 2) (Fig. 10)  
A
*All typicals at T = 25°C  
A
©2004 Fairchild Semiconductor Corporation  
FOD073L Rev. 1.0  
www.fairchildsemi.com  
3
Electrical Characteristics (Continued) (T = 0 to 70°C unless otherwise specified)  
A
Isolation Characteristics  
Symbol  
Characteristics  
Test Conditions  
Min. Typ.* Max. Unit  
I
Input-Output Insulation  
Leakage Current  
Relative humidity = 45%, T = 25°C,  
1.0  
µA  
I-O  
A
t = 5 s, V = 3000 VDC (Note 3)  
I-O  
V
Withstand Insulation Test  
Voltage  
R
50%, T = 25°C, I 2µA,  
2500  
V
RMS  
ISO  
H
A
I-O  
t = 1 min. (Note 3)  
12  
R
C
I
Resistance (Input to Output)  
V
= 500 VDC (Note 3)  
10  
I-O  
I-O  
I-I  
I-O  
Capacitance (Input to Output) f = 1 MHz (Notes 3, 4)  
0.7  
pF  
µA  
Input-Input Insulation  
Leakage Current  
RH 45%, V = 500 VDC (Note 5)  
0.005  
I-I  
11  
R
Input-Input Resistance  
Input-Input Capacitance  
V
= 500 VDC (Note 5)  
10  
I-I  
I-I  
C
f = 1 MHz (Note 5)  
0.03  
pF  
I-I  
*All typicals at T = 25°C  
A
Notes:  
1. Current Transfer Ratio is defined as a ratio of output collector current, I , to the forward LED input current, I , times  
O
F
100%.  
2. Common mode transient immunity in logic high level is the maximum tolerable (positive) dV /dt on the leading  
CM  
edge of the common mode pulse signal, V , to assure that the output will remain in a logic high state  
CM  
(i.e., V > 2.0V). Common mode transient immunity in logic low level is the maximum tolerable (negative) dV /dt  
O
CM  
on the trailing edge of the common mode pulse signal, V , to assure that the output will remain in a logic low state  
CM  
(i.e., V <0.8 V).  
O
3. Device is considered a two terminal device: Pins 1, 2, 3 and 4 are shorted together and Pins 5, 6, 7 and 8 are  
shorted together.  
4. CI-O is measured by shorting pins 1 and 2 or pins 3 and 4 together and pins 5 through 8 shorted together.  
5. Measured between pins 1 and 2 shorted together, and pins 3 and 4 shorted together.  
©2004 Fairchild Semiconductor Corporation  
FOD073L Rev. 1.0  
www.fairchildsemi.com  
4
Typical Performance Curves  
Fig. 2 Current Transfer Ratio vs. Input Forward Current  
Fig. 1 Input Forward Current vs Forward Voltage  
100  
10  
3500  
3000  
V
V
= 0.4V  
O
= 3.3V  
CC  
T
= 85°C  
A
T
= 25°C  
A
T
= 85°C  
A
T
= 70°C  
= 25°C  
A
2500  
2000  
1500  
T
A
T
= -40°C  
A
T
= 70°C  
A
1
T
= 25°C  
A
T
= 0°C  
A
T
= 0°C  
A
0.1  
1000  
500  
0
T
= -40°C  
A
0.01  
0.001  
0.9  
1.0  
1.1  
1.2  
1.3  
1.4  
1.5  
1.6  
1.7  
0.1  
1
10  
VF - FORWARD VOLTAGE (V)  
IF - FORWARD CURRENT (mA)  
Fig. 3 DC Transfer Characterstics  
Fig. 4 Supply Current vs Input Forward Current  
10  
140  
120  
100  
80  
T
V
= 25°C  
T
= 25°C  
A
A
= 3.3V  
V
= 3.3V  
CC  
CC  
I
= 5mA  
F
I
= 4.5mA  
F
4mA  
1
3.5mA  
3mA  
2.5mA  
60  
40  
20  
0
2mA  
1.5mA  
1mA  
0.1  
0.5mA  
0.01  
0.1  
0.0  
0.2  
0.4  
0.6  
V
0.8  
1.0  
1.2  
1.4  
1.6  
1.8  
2.0  
1
10  
I
F
- Input Forward Current (mA)  
- OUTPUT VOLTAGE (V)  
O
Fig. 5 Output Current vs Input Forward Current  
Fig. 6 Propagation Delay vs. Ambient Temperature  
70  
60  
50  
V
= 3.3V  
CC  
IF = 0.5mA  
= 4.7kΩ  
R
L
100  
10  
1/f = 100µs  
Duty Cycle = 10%  
T
= 70°C, 85°C  
A
T
= -40°C  
A
40  
30  
20  
T
A
= 0°C  
A
T
= 25°C  
t
PLH  
1
V
V
= 0.4V  
O
10  
0
= 3.3V  
t
PHL  
CC  
T
= 25°C  
A
0.1  
0.1  
1
10  
-40  
-20  
0
20  
40  
60  
80  
100  
T
- Ambient Temperature (°C)  
A
I
F
- Forward Current (mA)  
©2004 Fairchild Semiconductor Corporation  
FOD073L Rev. 1.0  
www.fairchildsemi.com  
5
Typical Performance Curves (Continued)  
Fig. 7 Propagation Delay To Logic Low vs Pulse Period  
Fig. 8 Propagation Delay vs. Input Forward Current  
28  
26  
24  
22  
20  
18  
16  
100  
12  
10  
T
V
R
= 25°C  
T
V
= 25°C  
A
A
= 3.3V  
= 3.3V  
CC  
CC  
= 4.7kΩ  
I = 0.5mA  
= 4.7kΩ  
L
1/f = 100µs  
Duty Cycle = 10%  
R
L
Duty Cycle = 50µs  
t
PLH  
8
6
10  
4
2
0
1
t
PHL  
0.01  
0.1  
1
10  
0
1
2
3
4
5
6
7
8
9
10  
T - Pulse Period (ms)  
I - Input Forward Current (mA)  
F
©2004 Fairchild Semiconductor Corporation  
FOD073L Rev. 1.0  
www.fairchildsemi.com  
6
Noise  
Shield  
Pulse  
+
IF  
VCC  
Generator  
+3.3 V  
VO  
1
2
3
4
8
7
6
5
tr = 5ns  
ZO = 50  
IF  
V
RL  
VF1  
-
0.1 µF  
V01  
3.3 V  
CL = 15 pF*  
VO  
V02  
-
IF  
MONITOR  
VF2  
50%  
50%  
TPLH  
GND  
VOL  
Rm  
+
TPHL  
*Includes Probe and Fixture Capacitance  
Fig. 9 Switching Time Test Circuit  
Noise  
Shield  
VCC  
V01  
+
+3.3 V  
1
8
7
6
5
IF  
VF1  
-
RL  
VCM 10 V  
90% 90%  
VO  
2
3
4
A
10%  
10%  
tf  
0.1 µF  
0 V  
B
V02  
-
tr  
VFF  
VF2  
+
GND  
VO  
3.3 V  
Switch at A : I F= 0 mA  
VO  
VCM  
-
VOL  
+
Switch at B : I F= 1.6 mA  
Pulse Gen  
Fig. 10 Common Mode Immunity Test Circuit  
©2004 Fairchild Semiconductor Corporation  
FOD073L Rev. 1.0  
www.fairchildsemi.com  
7
Ordering Information  
Order Entry  
Option  
No Suffix  
R2  
Identifier  
Description  
FOD073L  
Shipped in tubes (50 units per tube)  
FOD073LR2  
Tape and reel (2,500 units per reel)  
Marking Information  
2
73L  
1
5
X YY S  
4
3
Definitions  
1
2
3
4
5
Fairchild logo  
Device number  
One digit year code, e.g., ‘3’  
Two digit work week ranging from ‘01’ to ‘53’  
Assembly package code  
©2004 Fairchild Semiconductor Corporation  
FOD073L Rev. 1.0  
www.fairchildsemi.com  
8
Carrier Tape Specifications  
8.0 ± 0.10  
2.0 ± 0.05  
3.50 ± 0.20  
Ø1.5 MIN  
1.75 ± 0.10  
0.30 MAX  
4.0 ± 0.10  
5.5 ± 0.05  
12.0 ± 0.3  
8.3 ± 0.10  
5.20 ± 0.20  
Ø1.5 ± 0.1  
0.1 MAX  
6.40 ± 0.20  
User Direction of Feed  
Dimensions in mm  
©2004 Fairchild Semiconductor Corporation  
FOD073L Rev. 1.0  
www.fairchildsemi.com  
9
Reflow Profile  
Max. Ramp-up Rate = 3°C/S  
Max. Ramp-down Rate = 6°C/S  
T
P
260  
240  
220  
200  
180  
160  
140  
120  
100  
80  
t
P
T
L
Tsmax  
t
L
Preheat Area  
Tsmin  
t
s
60  
40  
20  
0
120  
Time 25°C to Peak  
240  
360  
Time (seconds)  
Profile Freature  
Pb-Free Assembly Profile  
150°C  
Temperature Min. (Tsmin)  
Temperature Max. (Tsmax)  
200°C  
Time (t ) from (Tsmin to Tsmax)  
60–120 seconds  
3°C/second max.  
217°C  
S
Ramp-up Rate (t to t )  
L
P
Liquidous Temperature (T )  
L
Time (t ) Maintained Above (T )  
60–150 seconds  
260°C +0°C / –5°C  
30 seconds  
L
L
Peak Body Package Temperature  
Time (t ) within 5°C of 260°C  
P
Ramp-down Rate (T to T )  
6°C/second max.  
8 minutes max.  
P
L
Time 25°C to Peak Temperature  
©2004 Fairchild Semiconductor Corporation  
FOD073L Rev. 1.0  
www.fairchildsemi.com  
10  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
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