FODM352R2 [ONSEMI]

Photodarlington Optocoupler with a Base-Emitter Resistor in a 4-Pin Full Pitch Mini-Flat Package;
FODM352R2
型号: FODM352R2
厂家: ONSEMI    ONSEMI
描述:

Photodarlington Optocoupler with a Base-Emitter Resistor in a 4-Pin Full Pitch Mini-Flat Package

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FODM352  
Product Preview  
Photodarlington  
Optocoupler with a  
Base-Emitter Resistor in a  
4-Pin Full Pitch Mini-Flat  
Package  
www.onsemi.com  
Description  
The FODM352 consists of one gallium arsenide (GaAs) infrared  
light emitting diode, optically coupled to a photodarlington output  
with a baseemitter resistor, in a compact, miniflat, 4pin package.  
The inputoutput isolation voltage, V , is rated at 3,750 VAC  
.
ISO  
RMS  
MFP4  
CASE 100AP  
Features  
Current Transfer Ratio Min 1000% at I = 1 mA,  
F
MARKING DIAGRAM  
Pin 1  
V
CE  
= 2 V, T = 25°C  
A
Safety and Regulatory Approvals:  
UL1577, 3750 VAC for 1 min  
RMS  
DIN EN/IEC6074755, 565 V Peak Working Insulation Voltage  
Applicable to Infrared Reflow, 260°C  
ON  
352  
VXYYR  
Typical Applications  
Power Supply Regulators  
Digital Logic Inputs  
352  
V
X
YY  
R
= Specific Device Code  
= DIN EN/IEC6074755 Option  
= OneDigit Year Code  
= Work Week  
Microprocessor Inputs  
Programmable Controllers  
= Assembly Package Code  
This document contains information on a product under development. ON Semiconductor  
reserves the right to change or discontinue this product without notice.  
PIN CONNECTIONS  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 3  
of this data sheet.  
© Semiconductor Components Industries, LLC, 2019  
1
Publication Order Number:  
April, 2019 Rev. P0  
FODM352/D  
FODM352  
Table 1. SAFETY AND INSULATIONS RATING As per DIN EN/IEC 6074755, this optocoupler is suitable for “safe electrical  
insulation” only within the safety limit data. Compliance with the safety ratings shall be ensured by means of protective circuits.  
Parameter  
Characteristics  
Installation Classifications per DIN VDE 0110/1.89 Table 1, For Rated  
Mains Voltage  
< 150 V  
< 300 V  
I–IV  
I–III  
RMS  
RMS  
Climatic Classification  
55/110/21  
2
Pollution Degree (DIN VDE 0110/1.89)  
Comparative Tracking Index  
175  
Symbol  
Parameter  
Value  
Unit  
InputtoOutput Test Voltage, Method A, V  
x 1.6 = V , Type and Sample  
904  
V
peak  
V
PR  
IORM  
PR  
Test with t = 10 s, Partial Discharge < 5 pC  
m
InputtoOutput Test Voltage, Method B, V  
x 1.875 = V , 100% Produc-  
1060  
V
peak  
IORM  
PR  
tion Test with t = 1 s, Partial Discharge < 5 pC  
m
V
Maximum Working Insulation Voltage  
Highest Allowable OverVoltage  
External Creepage  
565  
6,000  
w 5  
w 5  
w 0.4  
150  
V
V
IORM  
peak  
V
IOTM  
peak  
mm  
mm  
mm  
°C  
External Clearance  
DTI  
Distance Through Insulation (Insulation Thickness)  
Case Temperature (Note 1)  
T
S
I
Input Current (Note 1)  
200  
mA  
mW  
W
S,INPUT  
P
Output Power (Note 1)  
300  
S,OUTPUT  
9
R
Insulation Resistance at T , V = 500 V (Note 1)  
> 10  
IO  
S
IO  
1. Safety limit values – maximum values allowed in the event of a failure.  
Table 2. ABSOLUTE MAXIMUM RATINGS (Note 2) TA = 25°C unless otherwise specified.  
Symbol  
Parameter  
Value  
Units  
°C  
T
Storage Temperature  
Operating Temperature  
Junction Temperature  
55 to +150  
55 to +110  
55 to +125  
260 for 10 sec  
STG  
OPR  
T
°C  
T
J
°C  
T
SOL  
Lead Solder Temperature (Refer to Reflow Temperature Profile)  
°C  
EMITTER  
I
Continuous Forward Current  
Reverse Input Voltage  
50  
6
mA  
V
F(average)  
V
R
PD  
Power Dissipation (Note 3)  
70  
mW  
LED  
DETECTOR  
I
Continuous Collector Current  
CollectorEmitter Voltage  
150  
300  
0.1  
mA  
V
C(average)  
V
CEO  
V
ECO  
EmitterCollector Voltage  
V
PD  
Collector Power Dissipation (Note 3)  
150  
mW  
C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
2. Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device  
functionality should not be assumed, damage may occur and reliability may be affected.  
3. Functional operation under these conditions is not implied. Permanent damage may occur if the device is subjected to conditions outside  
these ratings.  
www.onsemi.com  
2
 
FODM352  
Table 3. ELECTRICAL CHARACTERISTICS T = 25°C unless otherwise specified  
A
Symbol  
Parameter  
Conditions  
Min  
Typ  
1.2  
30  
Max  
Units  
EMITTER  
I
V
F
Forward Voltage  
F = 10 mA  
R = 4 V  
V = 0 V, f = 1 kHz  
1.4  
10  
V
I
R
Reverse Current  
V
mA  
pF  
C
Terminal Capacitance  
250  
T
DETECTOR  
BV  
CollectorEmitter Breakdown Voltage  
EmitterCollector Breakdown Voltage  
Collector Dark Current  
I
I
= 0.1 mA, I = 0 mA  
300  
0.1  
V
V
CEO  
ECO  
C
F
BV  
= 10 mA, I = 0 mA  
E
F
I
V
= 200 V, I = 0 mA  
200  
nA  
CEO  
CE  
F
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
Table 4. TRANSFER CHARACTERISTICS T = 25°C unless otherwise specified  
A
Symbol  
Parameter  
Collector Current  
Conditions  
I = 1 mA, V = 2 V  
Min  
10  
Typ  
Max  
Units  
mA  
%
I
C
F
CE  
CTR  
Current Transfer Ratio  
I = 1 mA, V = 2 V  
1000  
5000  
F
CE  
V
CollectorEmitter Saturation Voltage  
I = 20 mA, I = 100 mA  
1.2  
V
CE(SAT)  
F
C
Table 5. SWITCHING CHARACTERISTICS T = 25°C unless otherwise specified  
A
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
t
R
Output Rise Time (10% 90%)  
I = 20 mA, V = 2 V,  
L
20  
100  
ms  
F
CC  
R = 100 W  
t
F
Output Fall Time (90% 10%)  
I = 20 mA, V = 2 V,  
L
100  
300  
ms  
F
CC  
R = 100 W  
Table 6. ISOLATION CHARACTERISTICS  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
V
InputOutput Isolation Voltage  
Freq = 60 Hz, t = 1.0 min,  
3,750  
VAC  
RMS  
ISO  
I
v 10 mA (Notes 4, 5)  
IO  
10  
R
C
Isolation Resistance  
Isolation Capacitance  
V
= 500 V (Note 4)  
5 x 10  
W
ISO  
ISO  
IO  
Frequency = 1 MHz  
0.6  
1.0  
pF  
4. Device is considered a two terminal device: Pin 1 and 2 are shorted together and Pins 3 and 4 are shorted together.  
5. 3,750 VAC  
for 1 minute duration is equivalent to 4,500 VAC  
for 1 second duration.  
RMS  
RMS  
ORDERING INFORMATION  
Part Number  
Package  
SOP 4Pin  
SOP 4Pin  
Packing Method  
FODM352  
Tube (100 units)  
FODM352R2  
Tape and Reel (2500 units)  
Tube (100 units)  
FODM352V  
SOP 4Pin, DIN EN/IEC6074755 Option (pending approval)  
SOP 4Pin, DIN EN/IEC6074755 Option (pending approval)  
FODM352R2V  
Tape and Reel (2500 units)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
www.onsemi.com  
3
 
FODM352  
TYPICAL CHARACTERISTICS  
Figure 1. LED Power Dissipation vs. Ambient  
Figure 2. Collector Power Dissipation vs.  
Ambient Temperature  
Temperature  
Figure 3. Collector Emitter Saturation Voltage  
vs. Forward Current  
Figure 4. Forward Current vs. Forward Voltage  
Figure 5. Current Transfer Ratio vs. Forward  
Current  
Figure 6. Collector Current vs. Collector  
Emitter Voltage  
www.onsemi.com  
4
FODM352  
TYPICAL CHARACTERISTICS  
Figure 7. Relative Current Transfer Ratio vs.  
Figure 8. Collector Emitter Saturation Voltage  
vs. Ambient Temperature  
Ambient Temperature  
Figure 9. Collector Dark Current vs. Ambient  
Temperature  
Figure 10. Response Time vs. Load  
Resistance  
Figure 11. Test Circuit for Switching Time  
www.onsemi.com  
5
FODM352  
REFLOW PROFILE  
Figure 12. Reflow Profile  
Profile Feature  
PbFree Assembly Profile  
150°C  
Temperature Min. (Tsmin)  
Temperature Max. (Tsmax)  
200°C  
Time (t ) from (Tsmin to Tsmax)  
60–120 seconds  
3°C/second max.  
217°C  
S
Rampup Rate (t to t )  
L
P
Liquidous Temperature (T )  
L
Time (t ) Maintained Above (T )  
60–150 seconds  
260°C +0°C / –5°C  
30 seconds  
L
L
Peak Body Package Temperature  
Time (t ) within 5°C of 260°C  
P
Rampdown Rate (T to T )  
6°C/second max.  
8 minutes max.  
P
L
Time 25°C to Peak Temperature  
www.onsemi.com  
6
FODM352  
PACKAGE DIMENSIONS  
MFP4 3.85X4.4, 2.54P  
CASE 100AP  
ISSUE O  
www.onsemi.com  
7
FODM352  
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regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
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PUBLICATION ORDERING INFORMATION  
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USA/Canada  
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ON Semiconductor Website: www.onsemi.com  
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For additional information, please contact your local  
Sales Representative  
FODM352/D  

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