FPAM30LH60 [ONSEMI]

PFC 智能功率模块,600V,30A;
FPAM30LH60
型号: FPAM30LH60
厂家: ONSEMI    ONSEMI
描述:

PFC 智能功率模块,600V,30A

功率因数校正
文件: 总13页 (文件大小:854K)
中文:  中文翻译
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2014 7 月  
FPAM30LH60  
®
用于两相交错式功率因数校正的 PFC SPM 2 系列  
特性  
概述  
FPAM30LH60 PFC SPM® 2 模块,为消费、医药和工  
业应用提供非常全面的高性能交错式功率因数校正输入功  
率平台。这些模块综合优化了内置 IGBT 的栅极驱动以最  
小化电磁干扰和能量损耗。同时也提供多重模组保护特  
性,集成欠压闭锁,过流保护,热量监测和故障报告。这  
些模块内的全波整流器和高性能输出二极管,为额外节省  
空间和方便安装起到了重要作用。  
通过 UL E209204 号认证 (UL1557)  
• 600 V - 30 A 两相交错式功率因数校正,包含栅极驱动  
和保护的控制 IC  
采用 DBC (Al2O3) 基板实现非常低的热阻  
全波桥式整流器和高性能输出二极管  
针对 20 kHz 开关频率进行优化  
内置负温度系数热敏电阻可实现温度监测  
绝缘等级:2500 Vrms/ 分钟  
应用  
两相交错式功率因数校正转换器  
相关资料  
即将发布  
1. 封装概览  
封装标识与定购信息  
器件  
器件标识  
封装  
包装类型  
数量  
FPAM30LH60  
FPAM30LH60  
S32EA-032  
Rail  
8
©2012 飞兆半导体公司  
1
www.fairchildsemi.com  
FPAM30LH60 Rev. C3  
集成的驱动、保护和系统控制功能  
对于 IGBT:栅极驱动电路、过流保护 (OCP控制电源欠压锁定 (UVLO)保护  
故障信号:对应 OC UV 故障  
内置热敏电阻:温度监控  
输入接口:高电平有效接口,可用于 3.3 / 5 V 逻辑电平,施密特触发脉冲输入  
引脚布局  
(1)CSC  
(2)COM  
(3)VFO  
(24)P  
(25)P  
(26)PY  
(27)n.c.  
(28)PX  
(4)INX  
(5)INY  
(6)COM  
(7)n.c.  
(8)VCC  
(9)VCC  
Case temperature(T  
detecting point  
C
)
(10)COM  
(11)RTH  
(12)VTH  
(29)X  
(30)Y  
(31)NP  
(13)NR  
(14)NR  
(15)n.c.  
(16)n.c.  
(17)n.c.  
(18)R  
(19)R  
(20)n.c.  
(21)n.c.  
(32)PR  
(22)S  
(23)S  
Dimension unit: millimeter  
2. 俯视图  
©2012 飞兆半导体公司  
2
www.fairchildsemi.com  
FPAM30LH60 Rev. C3  
引脚描述  
引脚号  
1
引脚名  
CSC  
COM  
VFO  
INX  
INY  
N.C  
VCC  
RTH  
VTH  
NR  
引脚描述  
过流检测的信号输入  
公共电源接地  
2,6,10  
3
故障输出  
4
X IGBT 驱动的 PWM 输入  
Y IGBT 驱动的 PWM 输入  
5
7
无连接  
8,9  
适用于 IGBT 驱动的 IC 的公共电源电压  
11  
供热敏电阻使用的串联电阻器  
热敏电阻偏压  
12  
13,14  
15,16,17  
18,19  
20,21  
22,23  
24,25  
26  
整流二极管的直流负端  
无连接  
N.C  
R
R 相的交流输入  
N.C  
S
无连接  
S 相的交流输入  
P
二极管的输出  
二极管的输入  
无连接  
PY  
27  
N.C  
PX  
28  
二极管的输入  
X IGBT 的输出  
Y IGBT 的输出  
IGBT 的直流负端  
29  
X
30  
Y
31  
NP  
32  
PR  
整流二极管的直流正端  
内部等效电路  
(11)RTH  
(24)(25)P  
THERMISTOR  
(12)VTH  
(26)PY  
(28)PX  
(1)CSC  
(3)VFO  
CSC  
VFO  
(29)X  
(30)Y  
(4)INX  
(5)INY  
INX  
OUT X  
INY  
(32)PR  
(8)(9)VCC  
VCC  
(18)(19)R  
(22)(23)S  
(2)(6)(10)  
COM  
OUT Y  
COM  
(31)NP  
(13)(14)NR  
3. 内部框图  
©2012 飞兆半导体公司  
3
www.fairchildsemi.com  
FPAM30LH60 Rev. C3  
绝对最大额定值 TJ = 25°C,除非另有说明。 )  
转换器部分  
符号  
Vi  
参数  
工作条件  
额定值  
264  
单位  
Vrms  
V
施加在 R - S 之间  
输入电源电压  
输出电压  
VPN  
施加在 X - NP, Y - NP, P - PX, P - PY  
施加在 X - NP, Y - NP, P - PX, P - PY  
X - NP, Y - NP 之间的击穿电压  
P - PX, P - PY 之间的击穿电压  
450  
VPN (浪涌)  
VCES  
500  
V
输出电源电压 (浪涌)  
600  
V
集电极 - 发射极之间电压  
VRRM  
600  
V
快速恢复二极管的重复峰值反向电压  
整流器的重复峰值反向电压  
VRRMR  
PR - R, PR - S,  
900  
V
R - NR, S - NR 之间的击穿电压  
*IF  
TC = 25°C, TJ < 125°C  
30  
300  
30  
A
A
A
A
A
A
快速恢复二极管的正向电流  
快速恢复二极管的峰值浪涌电流  
正向整流电流  
*IFSM  
*IFR  
非重复性,60 Hz 单一正弦半波  
TC = 25°C, TJ < 125°C  
*IFSMR  
± *IC  
非重复性,60 Hz 单一正弦半波  
TC = 25°C, TJ < 125°C  
300  
30  
整流器的峰值浪涌电流  
单个 IGBT 的集电极电流  
单个 IGBT 的集电极电流 (峰值)  
± *ICP  
TC = 25°C, TJ < 125°C,  
60  
脉冲宽度小于 1 ms  
*PC  
TJ  
TC = 25°C单个 IGBT  
(注 1)  
107  
W
集电极功耗  
工作结温  
-40 ~ 125  
°C  
注:  
®
1. PFC SPM 产品集成的功率芯片的最大额定结温是 125°C。  
2. 标记为 “ * “ 的为计算值或设计因素。  
控制部分  
符号  
VCC  
VIN  
参数  
工作条件  
额定值  
20  
单位  
V
施加在 VCC - COM 之间  
控制电源电压  
施加在 INX, INY - COM 之间  
施加在 VFO - COM 之间  
-0.3 ~ VCC + 0.3  
-0.3 ~ VCC + 0.3  
1
V
输入信号电压  
VFO  
IFO  
V
故障输出电源电压  
故障输出电流  
V
FO 引脚处的灌电流  
mA  
V
VSC  
施加在 CSC - COM 之间  
-0.3 ~ VCC + 0.3  
电流感测输入电压  
整个系统  
符号  
TSTG  
VISO  
参数  
工作条件  
额定值  
-40 ~ 125  
2500  
单位  
°C  
存储温度  
绝缘电压  
60 Hz弦波形1 分钟接陶瓷基  
板到引脚  
Vrms  
热阻  
符号  
参数  
条件  
工作条件下的单个 IGBT  
工作条件下的单个二极管  
工作条件下的单个整流器  
最小值 典型值 最大值 单位  
Rth(j-c)Q  
Rth(j-c)D  
Rth(j-c)R  
-
-
-
-
-
-
0.93  
1.42  
0.74  
°C/W  
°C/W  
°C/W  
结点 - 壳体的热阻  
©2012 飞兆半导体公司  
4
www.fairchildsemi.com  
FPAM30LH60 Rev. C3  
电气特性 TJ = 25°C,除非另有说明)  
转换器部分  
符号  
VCE(SAT)  
VFF  
参数  
工作条件  
VCC = 15 V, VIN = 5 V, IC =30 A  
IF = 30 A  
最小值 典型值 最大值 单位  
IGBT 饱和电压  
-
-
-
-
-
-
-
-
-
-
1.7  
1.9  
1.10  
11  
2.2  
V
V
2.4  
快速恢复二极管正向电压  
整流器正向电压  
开关特性  
VFR  
IFR = 30 A  
1.25  
V
IRR  
VPN = 400 V, VCC = 15 V, IC = 15 A,  
-
A
V
IN = 0 V 5 V,感性负载 (注 3, 单 个  
tRR  
41  
-
ns  
ns  
ns  
ns  
ns  
A  
IGBT  
tON  
700  
852  
104  
102  
-
-
tOFF  
-
tC(ON)  
tC(OFF)  
ICES  
-
-
VCES = 600 V  
250  
集电极 - 发射极间漏电流  
注:  
3. t t  
包括模块内部驱动 IC 的传输延迟时间。t  
t  
指在内部给定的栅极驱动条件下, IGBT 本身的开关时间。详细信息,请参见图 4。  
C(OFF)  
ON  
OFF  
C(ON)  
100% IC  
100% IC  
tRR  
IRR  
VCE  
IC  
90% IC  
10% IC  
10% VCE  
10% VCE  
10% IC  
VIN  
tON  
tOFF  
tC(OFF)  
tC(ON)  
(a) turn-on  
(b) turn-off  
4. 开关时间的定义  
©2012 飞兆半导体公司  
5
www.fairchildsemi.com  
FPAM30LH60 Rev. C3  
控制部分  
符号  
参数  
工作条件  
最小值 典型值 最大值 单位  
IQCC  
V
CC 静态电源电流  
VCC = 15 V, INX, INY - COM = 0 V, VCC  
-
-
2.65  
mA  
COM 间的电源电流  
IPCC  
VCC = 15 V, fPWM = 20 kHz, Duty = 50% 应用  
-
-
6.0  
mA  
工作 VCC 电源电流  
于单个 IGBT 的 一个 PWM 信号输入 VCC  
COM 间的电源电流  
VFOH  
VFOL  
VSC = 0 V, VFO 电路:10 k5 V 上拉  
VSC = 1 V, VFO 电路:10 k5 V 上拉  
4.5  
-
-
-
-
V
V
V
故障输出电压  
0.5  
0.55  
VSC(Ref) CSC 引脚的过流保护触发电 VCC = 15 V  
平电压  
0.45  
0.50  
UVCCD  
UVCCR  
tFOD  
10.5  
11.0  
30  
2.6  
-
-
-
13.0  
V
V
电源电路欠压保护  
检测电平  
复位电平  
13.5  
-
-
-
s  
V
故障输出脉宽  
导通阈值电压  
关断阈值电压  
热敏电阻的阻值  
VIN(ON)  
VIN(OFF)  
RTH  
施加在 INX, INY - COM 之间  
施加在 INX, INY - COM 之间  
-
-
0.8  
-
V
-
47  
k  
TTH = 25°C (注 4,图 5)  
TTH = 100°C (注 4,图 5)  
-
2.9  
-
k  
注:  
4. T 为热敏电阻自身的温度。若需得到壳体温度 ( T ),请根据具体应用进行实验。  
TH  
C
R-T Curve  
200  
150  
100  
50  
4
3
2
1
95  
100  
105  
110  
115  
120  
125  
Temperature TTH[oC]  
0
0
25  
50  
75  
100  
125  
Temperature TTH[oC]  
5. 内置热敏电阻的 R-T 曲线  
©2012 飞兆半导体公司  
6
www.fairchildsemi.com  
FPAM30LH60 Rev. C3  
推荐工作条件 TJ = 25°C,除非另有说明)  
符号  
参数  
工作条件  
最小值 典型值 最大值 单位  
Vi  
Ii  
施加在 R - S 之间  
TC < 100°C, Vi = 220 V, VO = 360 V,  
PWM = 20 kHz 单个 IGBT  
187  
-
-
-
253  
21  
Vrms  
Arms  
输入电源电压  
输入电流  
f
VPN  
VCC  
施加在 X - NP, Y - NP, P - PX, P - PY  
施加在 VCC - COM 之间  
-
13.5  
-1  
-
-
15.0  
-
400  
V
V
电源电压  
16.5  
控制电源电压  
电源波动  
dVCC/dt  
IFO  
1
1
-
V / s  
mA  
kHz  
V
FO 引脚处的灌电流  
-
故障输出电流  
PWM 输入频率  
fPWM  
-40°C < TJ < 125°C 单个 IGBT  
-
20  
机械特性和额定值  
参数  
工作条件  
最小值 典型值 最大值 单位  
安装螺钉:M4  
建议 0.98 N•m  
建议 10 kg•cm  
0.78  
0.98  
10  
-
1.17  
12  
N•m  
kg•cm  
m  
安装扭矩  
8
0
-
见图 6  
+150  
-
器件平面度  
重量  
32  
g
6. 平面度测量位置  
©2012 飞兆半导体公司  
7
www.fairchildsemi.com  
FPAM30LH60 Rev. C3  
保护功能时序图  
Input Signal  
Protection  
Circuit State  
RESET  
SET  
RESET  
UVCCR  
a1  
a6  
UVCCD  
a2  
Control  
Supply Voltage  
a3  
a4  
a7  
Output Current  
a5  
Fault Output Signal  
a1 : 控制电源电压上升:当电压上升到 UVCCR 后,等到下一个开通信号时,对应的电路才开始动作。  
a2 : 正常工作:IGBT 导通并加载负载电流。  
a3 : 欠压检测 (UVCCD)。  
a4 : 不论控制输入的条件, IGBT 都关断。  
a5 : 故障输出工作启动。  
a6 : 欠压复位 (UVCCR)。  
a7 : 正常工作:IGBT 导通并加载负载电流。  
7. 欠压保护  
(与外部的过流检测电路)  
c1 : 正常工作:IGBT 导通并加载负载电流。  
Input Voltage (VIN)  
c6  
c7  
c2 : 过流检测 (OC 触发)  
c3 : IGBT 栅极硬中断。  
c4 : IGBT 关断。  
Internal IGBT  
Gate-Emitter Voltage  
c4  
c3  
c2  
c5 : 故障输出计时器启动。  
c6 : 输入 “LOW”IGBT 关断状态。  
OC  
c7 : 输入 “HIGHIGBT 导通状态是在故障输出有效的时间  
内, IGBT 不导通。  
c1  
c8 : IGBT 关断状态。  
c8  
Output Current  
Input signal to CSC  
pin for Protection  
SET  
RESET  
c5  
Fault Output Signal  
8. 过流保护  
©2012 飞兆半导体公司  
8
www.fairchildsemi.com  
FPAM30LH60 Rev. C3  
+5 V  
Input signal for over  
current protection  
Current sensing  
RT  
RTH  
VTH  
P
THERMISTOR  
PX  
PY  
+5 V  
RSCF  
CSCF  
CSC  
RFO  
X
Y
VFO  
INX  
L
V
DC  
CF  
L
OUT X  
OUT Y  
PR  
RF  
CF  
V
AC  
INY  
R
S
RF  
+15 V  
VCC  
COM  
DX  
DY  
NR  
NP  
9. 典型应用电路  
注:  
1. 为了避免故障,每个输入端的连线必须尽可能的短 (小于 2 ~ 3 cm。  
2. V 输出是漏极开路型。该信号线应当采用一个能把 I 上升到 1 mA 的电阻上拉至 MCU 或控制电源的正极。  
FO  
FO  
3. 输入信号为高电平有效。在 IC 中,有一个 5 k的电阻将每一个输入信号线下拉接地。应采用 RC 耦合电路,以避免输入信号波动。 R C 常数应当在 50~150ns 范围内选择  
F
F
推荐 R = 100 Ω , C = 1 nF。  
F
F
4. 为避免保护功能出错,应尽可能缩短 R  
C  
周围的连线。  
SCF  
SCF  
5. 在短路保护电路中,R  
, C  
时间常数应在 1.5 ~ 2 μs 范围内进行选择。  
SCF  
SCF  
®
6. 每个电容都应尽可能地靠近 PFC SPM 产品的引脚安装。  
7. 在各种家用电器设备中,几乎都用到了继电器。在这些情况下, MCU / 控制器和继电器之间应留有足够的距离。  
8. 内部负温度系数热敏电阻能用来监控壳体温度,以及保护器件免于过热工作。根据应用选择一个适当的电阻 R  
9. 建议将反向并联二极管 D D ) 与每个 IGBT 相连接。  
T
X
Y
©2012 飞兆半导体公司  
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FPAM30LH60 Rev. C3  
封装轮廓详图  
封装图纸作为一项服务,提供给考虑飞兆半导体元件的客户。具体参数可能会有变化,且不会做出相应通知。请注意图纸上的版本和  
/ 或日期,并联系飞兆半导体代表核实或获得最新版本。封装规格并不扩大飞兆公司全球范围内的条款与条件,尤其是其中涉及飞兆  
公司产品保修的部分。  
随时访问飞兆半导体在线封装网页,可以获取最新的封装图纸:  
http://www.fairchildsemi.com/dwg/MO/MOD32BA.pdf  
©2012 飞兆半导体公司  
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©2012 飞兆半导体公司  
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FPAM30LH60 Rev. C3  
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