FPF2107 [ONSEMI]
全功能负载开关;
| 型号： | FPF2107 |
| 厂家： | 
ONSEMI |
| 描述： | 全功能负载开关 开关 驱动 光电二极管 接口集成电路 |
| 文件： | 总13页 (文件大小：235K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
www.onsemi.com
IntelliMAXt Advanced Load
Management Products
FPF2100 - FPF2107
SOT23−5
CASE 527AH
Description
The FPF2100 through FPF2107 is a family of load switches which
provide full protection to systems and loads which may encounter
large current conditions. These devices contain a 0.125 W
current−limited P−channel MOSFET which can operate over an input
voltage range of 1.8 − 5.5 V. Switch control is by a logic input (ON)
capable of interfacing directly with low voltage control signals. Each
part contains thermal shutdown protection which shuts off the switch
to prevent damage to the part when a continuous over−current
condition causes excessive heating.
MARKING DIAGRAM
&E&E&Y
&O210X&C
&.&O&E&V
When the switch current reaches the current limit, the part operates
in a constant−current mode to prohibit excessive currents from
causing damage. For the FPF2100−FPF2102 and FPF2104−FPF2106,
if the constant current condition still persists after 10 ms, these parts
will shut off the switch and pull the fault signal pin (FLAGB) low.
The FPF2100, FPF2101, FPF2104 and FPF2105, have an auto−restart
feature which will turn the switch on again after 160 ms if the ON pin
is still active. The FPF2102 and FPF2106 do not have this auto−restart
feature so the switch will remain off until the ON pin is cycled.
For the FPF2103 and FPF2107, a current limit condition will
immediately pull the fault signal pin low and the part will remain in
the constant−current mode until the switch current falls below
the current limit. For the FPF2100 through FPF2103, the minimum
current limit is 200 mA while that for the FPF2104 through FPF2107
is 400 mA.
&E
&Y
&O
= Designates Space
= Binary Calendar Year Coding Scheme
= Plant Code identifier
210X = Device Specific Code
X = 0, 1, 2, 3, 4, 5, 6, 7
&C
&.
= Single digit Die Run Code
= Pin One Dot
= Eight−Week Binary Datecoding Scheme
&V
ORDERING INFORMATION
See detailed ordering and shipping information on page 11
of this data sheet.
These parts are available in a space−saving 5 pin SOT23 package.
Features
Applications
• 1.8 to 5.5 V Input Voltage Range
• Controlled Turn−On
• 200 mA and 400 mA Current Limit Options
• Under−Voltage Lockout
• Thermal Shutdown
• < 1 mA Shutdown Current
• Auto Restart
• Fast Current Limit Response Time
♦ 3 ms to Moderate Over Currents
♦ 20 ns to Hard Shorts
• PDAs
• Cell Phones
• GPS Devices
• MP3 Players
• Digital Cameras
• Peripheral Ports
• Hot Swap Supplies
• Fault Blanking
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
© Semiconductor Components Industries, LLC, 2008
1
Publication Order Number:
August, 2021 − Rev. 8
FPF2104/D
FPF2100 − FPF2107
Typical Application Circuit
TO LOAD
V
OUT
V
IN
FPF2100 − FFPF2107
OFF ON
ON
ISET
+
GND
−
Figure 1. Typical Application
Functional Block Diagram
V
IN
UVLO
ON
CONTROL
LOGIC
CURRENT
LIMT
V
OUT
THERMAL
SHUTDOWN
FLAGB
GND
Figure 2. Block Diagram
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2
FPF2100 − FPF2107
Pin Configuration
V
1
2
3
5
4
V
IN
OUT
GND
ON
FLAGB
SOT23−5
Figure 3. Pin Assignment
PIN DESCRIPTIONS
Name
Type
Description
1
2
3
4
V
Supply Input: Input to the power switch and the supply voltage for the IC
IN
GND
ON
Ground
ON Control Input
FLAGB
Fault Output: Active LO, open drain output which indicates an over−current supply,
under−voltage or over−temperature state
5
V
OUT
Switch Output: Output of the power switch
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Min
−0.3
−
Max
6.0
667
125
150
150
−
Unit
V
V
IN
V
IN
, V , ON, FLAGB to GND
OUT
P
D
Power Dissipation at T = 25°C (Note 1)
mW
°C
A
T
Operating Junction Temperature
Storage Temperature
−40
−65
−
J
T
°C
STG
q
Thermal Resistance, Junction to Ambient
Electrostatic Discharge Protection
°C/W
V
JA
ESD
HBM
MM
4000
400
−
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Package power dissipation on 1 square inch pad, 2 oz. copper board.
RECOMMENDED OPERATING RANGE
Symbol
Parameter
Min
1.8
Max
5.5
85
Unit
V
V
IN
Input Voltage
Ambient Operating Temperature
T
A
−40
°C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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3
FPF2100 − FPF2107
ELECTRICAL CHARACTERISTICS
V
IN
= 1.8 to 5.5 V, T = −40 to +85°C unless otherwise noted. Typical values are at V = 3.3 V and T = 25°C.
A
I
N
A
Symbol
Parameter
Test Condition
Min
Typ
Max
Unit
Basic Operation
V
Operating Voltage
Quiescent Current
1.8
−
−
95
110
−
5.5
−
V
IN
Q
I
I
= 0 mA
active
V
V
= 1.8 to 3.3 V
= 3.3 to 5.5 V
mA
OUT
ON
IN
V
−
200
1
IN
I
Shutdown Current
−
mA
mA
SHDN
I
Latch−Off Current (Note 2)
On−Resistance
V
V
V
V
V
V
V
V
V
V
= V , After an Over−Current Fault
−
50
125
150
−
−
LATCHOFF
ON
IN
R
= 3.3 V, I
= 50 mA, T = 25°C
−
160
200
200
−
mW
ON
IN
OUT
OUT
OUT
A
= 3.3 V, I
= 3.3 V, I
= 1.8 V
= 5.5 V
= 1.8 V
= 5.5 V
= 50 mA, T = 85°C
−
IN
A
= 50 mA, T = −40°C to +85°C
65
0.75
1.30
−
IN
A
V
IH
ON Input Logic High Voltage
ON Input Logic Low Voltage
−
V
V
IN
−
−
IN
V
−
0.5
1.0
1
IL
IN
−
−
IN
ON Input Leakage
Off Switch Leakage
= V or GND
−
−
mA
mA
ON
IN
I
= 0 V, V
IN
= 0 V
−
−
1
SWOFF
ON
OUT
@ V = 5.5 V, T = 85°C
A
V
= 0 V, V
IN
= 0 V
A
−
10
100
nA
V
ON
OUT
@ V = 3.3 V, T = 25°C
FLAGB Output Logic Low
Voltage
V
IN
V
IN
V
IN
= 5 V, I
= 10 mA
−
−
−
0.1
0.15
−
0.2
0.3
1
SINK
= 1.8 V, I
= 10 mA
SINK
FLAGB Output High Leakage
Current
= 5 V, Switch On
mA
Protections
I
Current Limit
V
V
= 3.3 V,
OUT
FPF2100, FPF2101,
FPF2102, FPF2103
200
400
300
600
400
800
mA
LIM
IN
= 3.0 V
FPF2104, FPF2105,
FPF2106, FPF2107
Thermal Shutdown
Shutdown Threshold
Return from Shutdown
Hysteresis
−
−
140
130
10
−
−
°C
−
−
UVLO
Under−Voltage Shutdown
V
IN
Increasing
1.5
−
1.6
47
1.7
−
V
Under−Voltage Shutdown
Hysteresis
mV
Dynamic
t
Turn On Time
Turn OffTime
R = 500 W, CL = 0.1 mF
−
−
−
−
5
25
50
−
−
ms
ms
ms
ms
ms
ON
L
t
R = 500 W, CL = 0.1 mF
L
OFF
t
R
V
OUT
V
OUT
Rise Time
Fall Time
R = 500 W, CL = 0.1 mF
L
12
−
t
F
R = 500 W, CL = 0.1 mF
L
136
10
−
t
Over Current Blanking Time
FPF2100, FPF2101, FPF2102, FPF2104,
FPF2105, FPF2106
20
BLANK
t
Auto−Restart Time
FPF2100, FPF2101, FPF2104, FPF2105
80
160
3
320
ms
RSTRT
Short−Circuit Response Time
V
= V = 3.3 V
−
−
ms
IN
ON
Moderate Over−Current Condition
V
IN
= V = 3.3 V, Hard Short
−
20
−
ns
OUT
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2. Applicable only to FPF2102 and FPF2106. Latchoff current does not include current flowing into FLAGB.
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4
FPF2100 − FPF2107
TYPICAL CHARACTERISTICS
120
110
100
90
150
130
110
V
ON
= V
IN
V
IN
= 3.3 V
V
IN
= 5.5 V
90
70
50
80
V
IN
= 1.8 V
35
70
60
1.5
−40
−15
10
60
85
2
2.5
3
3.5
4
4.5
5
5.5
6
T , JUNCTION TEMPERATURE (°C)
J
SUPPLY VOLTAGE (V)
Figure 4. Quiescent Current vs. Input Voltage
Figure 5. Quiescent Current vs. Temperature
500
400
300
200
100
0
700
600
500
400
300
200
100
0
I_SHDN
I_SWOFF
V
IN
= 5.5 V
V
IN
= 5.5 V
V
= 3.3 V
IN
V
IN
= 3.3 V
−40
−15
10
35
60
85
−40
−15
10
35
60
85
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 6. ISHUTDOWN Current vs. Temperature
Figure 7. ISWITCH−OFF Current vs. Temperature
1.4
63
59
55
51
47
43
39
35
FPF2100, 2102, 2103, 2104, 2106, 2107
FPF2101, 2105
1.2
1
V
IN
= 5.5 V
0.8
0.6
0.4
0.2
0
V
IN
= 3.3 V
−40
−15
10
35
60
85
1.5
2
2.5
3
3.5
4
4.5
5
5.5
T , JUNCTION TEMPERATURE (°C)
J
V
IN
, INPUT VOLTAGE (V)
Figure 8. ILATCHOFF vs. Temperature
Figure 9. VIH vs. VIN
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5
FPF2100 − FPF2107
TYPICAL CHARACTERISTICS (continued)
700
600
500
400
300
200
100
0
700
600
FPF2104 − FPF2107
FPF2104 − FPF2107
FPF2100 − FPF2103
500
400
300
200
100
FPF2100 − FPF2103
−40
−15
10
35
60
85
0.3
0.6 0.9 1.2 1.5 1.8 2.1 2.4
2.7
3
T , JUNCTION TEMPERATURE (°C)
J
V
IN
− V
(V)
OUT
Figure 10. Current Limit vs. Output Voltage
Figure 11. Current Limit vs. Temperature
200
180
160
140
120
100
80
160
150
140
130
120
110
100
90
V
IN
= 1.8 V
V
= 3.3 V
IN
V
= 5.5 V
IN
60
−40
−15
10
35
60
85
1
2
3
4
5
6
T , JUNCTION TEMPERATURE (°C)
J
V
IN
, INPUT VOLTAGE (V)
Figure 12. R(ON) vs. VIN
Figure 13. R(ON) vs. Temperature
100
1000
100
10
I
V
= 10 mA
= 3.3 V
I
V
= 10 mA
= 3.3 V
LOAD
LOAD
CC
CC
T
T
OFF
(FALL)
T
(RISE)
T
ON
10
−40
1
−40
−15
10
35
60
85
−15
10
35
60
85
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 14. TON / TOFF vs. Temperature
Figure 15. TRISE / TFALL vs. Temperature
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6
FPF2100 − FPF2107
TYPICAL CHARACTERISTICS (continued)
12
11
10
9
180
160
140
120
100
80
8
7
60
6
40
5
20
4
0
−40
−40
−15
10
35
60
85
−15
10
35
60
85
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 16. TBLANK vs. Temperature
Figure 17. TRESTART vs. Temperature
3
3
V
DRV
V
DRV
2 V/DIV
2 V/DIV
V
OUT
V
OUT
2 V/DIV
2 V/DIV
I
I
OUT
OUT
200 mA/DIV
200 mA/DIV
V
V
FLAGB
FLAGB
2 V/DIV
2 V/DIV
20 ms/DIV
5 ms/DIV
Figure 19. TRESTART Response
Figure 18. TBLANK Response
R = 500 W, C = 0.1 mF
Active High Devices
L
L
R = 500 W, C = 0.1 mF
Active High Devices
L
L
V
ON
V
ON
2 V/DIV
2 V/DIV
I
OUT
I
OUT
10 mA/DIV
10 mA/DIV
200 ns/DIV
100 ms/DIV
Figure 21. TOFF Response
Figure 20. TON Response
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7
FPF2100 − FPF2107
TYPICAL CHARACTERISTICS (continued)
V
= V
ON
IN
C
C
= 10 mF
= 0.1 mF
IN
OUT
Active High Devices
V
IN
2 V/DIV
V /V
IN ON
2 V/DIV
I
OUT
5 A/DIV
I
OUT
200 mA/DIV
V
OUT
2 V/DIV
50 ms/DIV
20 ms/DIV
Figure 23. Current Limit Response
(Switch Power Up to Hard Short)
Figure 22. Short Circuit Response Time
(Output Shorted to GND)
Active High Devices
V
IN
2 V/DIV
V
ON
2 V/DIV
I
OUT
200 mA/DIV
50 ms/DIV
Figure 24. Current Limit Response Time
(Output Shorted to GND by 10 W, Moderate Short)
NOTE:
V
DRV
signal forces the device to go into over−current condition.
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8
FPF2100 − FPF2107
Current Limiting
Description of Operation
The current limit ensures that the current through the
switch doesn’t exceed a maximum value while not limiting
at less than a minimum value. For the FPF2100−FPF2103
the minimum current is 200 mA and the maximum current
is 400 mA and for the FPF2104−FPF2107 the minimum
current is 400mA and the maximum current is 800 mA. The
FPF2100−FPF2103 have a blanking time of 10 ms,
nominally, during which the switch will act as a constant
current source. At the end of the blanking time, the switch
will be turned−off and the FLAGB pin will activate to
indicate that current limiting has occurred. The FPF2103
and FPF2107 have no current limit blanking period so
immediately upon a current limit condition FLAGB is
activated. These parts will remain in a constant current state
until the ON pin is deactivated or the thermal shutdown
turns−off the switch.
The FPF2100−FPF2107 are current limited switches that
protect systems and loads which can be damaged or
disrupted by the application of high currents. The core of
each device is a 0.125 W P−channel MOSFET and a
controller capable of functioning over a wide input
operating range of 1.8 V − 5.5 V. The controller protects
against system malfunctions through current limiting,
under−voltage lockout and thermal shutdown. The current
limit is preset for either 200 mA or 400 mA.
On/Off Control
The ON pin controls the state of the switch. Active HI and
LO versions are available. Refer to the Ordering
Information for details. Activating ON continuously holds
the switch in the on state so long as there is no fault. For all
versions, an under−voltage on V or a junction temperature
IN
in excess of 1505C overrides the ON control to turn off the
switch. In addition, excessive currents will cause the switch
to turn off in FPF2100− FPF2102 and FPF2104−FPF2107.
The FPF2100, FPF2101, FPF2104 and FPF2105 have an
Auto−Restart feature which will automatically turn the
switch on again after 160 ms. For the FPF2102 and
FPF2106, the ON pin must be toggled to turn−on the switch
again. The FPF2103 and FPF2107 do not turn off in
response to a over current condition but instead remain
operating in a constant current mode so long as ON is active
and the thermal shutdown or under−voltage lockout have not
activated.
Reverse Voltage
If the voltage at the V
pin is larger than the V pin,
IN
OUT
large currents may flow and can cause permanent damage to
the device. FPF2100−FPF2107 is designed to control
current flow from V to V
.
IN
OUT
Under−Voltage Lockout
The under−voltage lockout turns−off the switch if the
input voltage drops below the under−voltage lockout
threshold. With the ON pin active the input voltage rising
above the under−voltage lockout threshold will cause a
controlled turn on of the switch which limits current
over−shoots.
Fault Reporting
Upon the detection of an over−current, an input
under−voltage, or an over−temperature condition, the
FLAGB signals the fault mode by activating LO. For the
FPF2100−FPF2102 and FPF2104−FPF2106, the FLAGB
goes LO at the end of the blanking time while FLAGB goes
LO immediately for the FPF2103 and FPF2107. FLAGB
remains LO through the Auto− Restart Time for the
FPF2100, FPF2101 FPF2104 and FPF2105. For the
FPF2102 and FPF2106, FLAGB is latched LO and ON must
be toggled to release it. With the FPF2103 and FPF2107,
FLAGB is LO during the faults and immediately returns HI
at the end of the fault condition. FLAGB is an open−drain
MOSFET which requires a pull−up resistor between VIN
and FLAGB. During shutdown, the pull−down on FLAGB
is disabled to reduce current draw from the supply.
Thermal Shutdown
The thermal shutdown protects the part from internally or
externally generated excessive temperatures. During an
over−temperature condition the FLAGB is activated and the
switch is turned−off. The switch automatically turns−on
again if the temperature of the die drops below the threshold
temperature.
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9
FPF2100 − FPF2107
APPLICATIONS INFORMATION
LOAD
V
V
IN
OUT
R1 = 100 kW
C2 = 0.1 mF
FPF2100−FPF2107
ON FLAGB
Battery
1.8 V − 5.5 V
R2 = 499 W
OFF ON
C1 = 4.7 mF
+
GND
−
Figure 25. Typical Application
Input Capacitor
If the part goes into current limit the maximum power
dissipation will occur when the output is shorted to ground.
For the FPF2100, FPF2101, FPF2104 and FPF2105, the
power dissipation will scale by the Auto−Restart Time,
To limit the voltage drop on the input supply caused by
transient in−rush currents when the switch turns−on into a
discharged load capacitor or a short−circuit, a capacitor
needs to be placed between V and GND. A 4.7 mF ceramic
t , and the Over Current Blanking Time, t , so
RSTRT BLANK
IN
capacitor, C , must be placed close to the V pin. A higher
that the maximum power dissipated is typically,
IN
IN
value of C can be used to further reduce the voltage drop
IN
tBLANK
P(max) +
VIN(max) ILIM(max)
experienced as the switch is turned on into a large capacitive
load.
t
RESTART ) tBLANK
10
+
5.5 0.8 + 260 mW
Output Capacitor
10 ) 160
(eq. 3)
A 0.1 mF capacitor C
and GND. This capacitor will prevent parasitic board
inductances from forcing V below GND when the
switch turns−off. For the FPF2100−FPF2102 and the
FPF2104−FPF2106, the total output capacitance needs to be
kept below a maximum value, C
part from registering an over−current condition and turning
off the switch. The maximum output capacitance can be
determined from the following formula,
, should be placed between V
OUT
OUT
When using the FPF2102 and FPF2106 attention must be
given to the manual resetting of the part. Continuously
resetting the part at a high duty cycle when a short on the
output is present can cause the temperature of the part to
increase. The junction temperature will only be allowed to
increase to the thermal shutdown threshold. Once this
temperature has been reached, toggling ON will not turn on
the switch until the junction temperature drops. For the
FPF2103 and FPF2107, a short on the output will cause the
part to operate in a constant current state dissipating a worst
case power as calculated in Eq. 3 until the thermal shutdown
activates. It will then cycle in and out of thermal shutdown
so long as the ON pin is active and the short is present.
OUT
(max), to prevent the
OUT
ILIM(max) tBLANK(min)
+
COUT(max)
VIN
(eq. 1)
Due to the integral body diode in the PMOS switch, a C
IN
greater than C
is highly recommended. A C
greater
OUT
OUT
than C can cause V
to exceed V when the system
Board Layout
IN
OUT
IN
supply is removed. This could result in current flow through
For best performance, all traces should be as short as
possible. To be most effective, the input and output
capacitors should be placed close to the device to minimize
the effects that parasitic trace inductances may have on
normal and short−circuit operation. Using wide traces for
the body diode from V
to V .
OUT
IN
Power Dissipation
During normal operation as a switch, the power
dissipation is small and has little effect on the operating
temperature of the part. The parts with the higher current
limits will dissipate the most power and that will only
typically be,
V , V
IN OUT
and GND will help minimize parasitic electrical
effects along with minimizing the case to ambient thermal
impedance.
2
P + (ILIM
)
RDS + (0.2)2 0.125 + 80 mW
(eq. 2)
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10
FPF2100 − FPF2107
ORDERING INFORMATION
Current Limit
Current Limit
Blanking Time [ms]
Auto Restart
Time [ms]
†
[mA]
200
200
200
200
400
400
400
400
Part Number
FPF2100
FPF2101
FPF2102
FPF2103
FPF2104
FPF2105
FPF2106
FPF2107
On Pin Activity
Active HI
Top Mark
2100
Shipping
10
10
10
0
160
160
NA
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
Active LO
Active HI
2101
2102
NA
Active HI
2103
10
10
10
0
160
160
NA
Active HI
2104
Active LO
Active HI
2105
2106
NA
Active HI
2107
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D
IntelliMAX is trademark of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other
countries.
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11
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOT−23, 5 Lead
CASE 527AH
ISSUE A
DATE 09 JUN 2021
q
q
q
q
q
q1
q2
GENERIC
MARKING DIAGRAM*
XXXM
XXX = Specific Device Code
M
= Date Code
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON34320E
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