FPF2108 [ONSEMI]
IntelliMAX ™ 先进负载管理产品;
| 型号： | FPF2108 |
| 厂家： | 
ONSEMI |
| 描述： | IntelliMAX ™ 先进负载管理产品 |
| 文件： | 总13页 (文件大小：227K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
www.onsemi.com
IntelliMAXt Advanced Load
Management Products
FPF2108 - FPF2110
SOT−23, 5 Lead
CASE 527AH
General Description
The FPF2108−FPF2110 is a series of load switches which provides
full protection to systems and loads which may encounter large current
conditions. This devices contain a 0.125 W current−limited P−channel
MOSFET which can operate over an input voltage range
of 1.8 V−5.5 V. Internally, reverse current blocking prevents current
from flowing when the MOSFET is off and the output voltage is
higher than the input voltage. Switch control is by a logic input (ON)
capable of interfacing directly with low voltage control signals. Each
part contains thermal shutdown protection which shuts off the switch
to prevent damage to the part when a continuous over−current
condition causes excessive heating.
When the switch current reaches the current limit, the part operates
in a constant−current mode to prohibit excessive currents
from causing damage. For the FPF2108, if the constant current
condition still persists after 10 ms, the part will shut off the switch
and pull the fault signal pin (FLAGB) low. The switch will remain off
until the ON pin is cycled. For the FPF2109 and FPF2110, a current
limit condition will immediately pull the fault signal pin low
and the part will remain in the constant−current mode until the switch
current falls below the current limit. The minimum current limit is
200 mA for the FPF2109 while that for the FPF2108 and FPF2110 is
400 mA.
MARKING DIAGRAM
&E&E&Y
&O21xx&C
&.&O&E&V
&E
&Y
&O
= Designates Space
= Binary Calendar Year Coding Scheme
= Plant Code Identifier
21xx = Device Specific Code
xx = 08, 09 or 10
&C
&.
&V
= Single Digit Die Run Code
= Pin One Dot
= Eight−Week Binary Datecoding Scheme
ORDERING INFORMATION
See detailed ordering and shipping information on page 11
of this data sheet.
These parts are available in a space−saving 5 pin SOT23 package.
Features
• 1.8 V to 5.5 V Input Voltage Range
• Controlled Turn−On
• 200 mA and 400 mA Current Limit Options
• Undervoltage Lockout
• Thermal Shutdown
• <2 mA Shutdown Current
• Fast Current Limit Response Time
♦ 3 ms to Moderate Over Currents
♦ 20 ns to Hard Shorts
• Reverse Current Blocking
• Fault Blanking
• These Devices are Pb−Free and Halide Free and are RoHS Compliant
Applications
• PDAs
• Cell Phones
• GPS Devices
• MP3 Players
• Digital Cameras
• Peripheral Ports
• Hot Swap Supplies
© Semiconductor Components Industries, LLC, 2008
1
Publication Order Number:
April, 2022 − Rev. 5
FPF2110/D
FPF2108 − FPF2110
TYPICAL APPLICATION CIRCUIT
TO LOAD
V
OUT
V
IN
FPF2108 − FPF2110
OFF ON
ON
FLAGB
+
GND
−
Figure 1. Typical Application Circuit
FUNCTIONAL BLOCK DIAGRAM
V
IN
UVLO
REVERSE
CURRENT
BLOCKING
ON
CONTROL
LOGIC
CURRENT
LIMIT
V
OUT
FLAGB
THERMAL
SHUTDOWN
GND
Figure 2. Functional Block Diagram
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2
FPF2108 − FPF2110
PIN CONFIGURATION
V
5
4
1
2
3
V
IN
OUT
GND
ON
FLAGB
SOT23−5
Figure 3. Pin Configuration
PIN DESCRIPTION
Pin
1
Name
Description
V
IN
Supply Input: Input to the power switch and the supply voltage for the IC
2
GND
ON
Ground
3
ON Control Input
4
FLAGB
Fault Output: Active LO, open drain output which indicates an over current supply, under voltage or over
temperature state.
5
V
OUT
Switch Output: Output of the power switch
ABSOLUTE MAXIMUM RATINGS
Parameter
Min
−0.3
−
Max
6
Unit
V
V
IN
, V , ON, FLAGB to GND
OUT
Power Dissipation @ T = 25°C (Note 1)
667
125
150
150
−
mW
°C
A
Operating Temperature Range
Storage Temperature
−40
−65
−
°C
Thermal Resistance, Junction to Ambient
Electrostatic Discharge Protection
°C/W
V
HBM
MM
4000
400
−
V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Package power dissipation on 1square inch pad, 2 oz copper board.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
1.8
Max
5.5
85
Unit
V
V
IN
Input Voltage
T
A
Ambient Operating Temperature
−40
°C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
www.onsemi.com
3
FPF2108 − FPF2110
ELECTRICAL CHARACTERISTICS
(V = 1.8 to 5.5 V, T = −40°C to +85°C unless otherwise noted. Typical values are V = 3.3 V and T = 25°C.)
IN
A
IN
A
Symbol
Parameter
Test Conditions
Min
Typ
−
Max
5.5
−
Unit
V
V
Operating Voltage
Quiescent Current
1.8
−
IN
Q
I
I
= 0 mA
V
V
= 1.8 V to 3.3 V
= 3.3 V to 5.5 V
95
110
−
mA
OUT
IN
Von active
−
200
2
IN
I
Shutdown Current
−
mA
mA
SHDN
I
Reverse Block Leakage Current
Latch−Off Current (Note 2)
On−Resistance
−
−
1
BLOCK
I
V
V
V
V
= V , after an over−current fault
−
50
125
150
−
−
mA
LATCHOFF
ON
IN
R
= 3.3 V, I
= 50 mA, T = 25°C
−
160
200
200
mW
ON
IN
IN
IN
OUT
OUT
OUT
A
= 3.3 V, I
= 50 mA, T = 85°C
−
A
= 3.3 V, I
= 50 mA,
65
T = −40°C to 85°C
A
V
ON Input Logic High Voltage
ON Input Logic Low Voltage
V
V
V
V
V
V
V
V
V
= 1.8 V
= 5.5 V
= 1.8 V
= 5.5 V
0.75
1.30
−
−
−
−
−
V
V
IH
IN
IN
V
−
0.5
1.0
1
IL
IN
−
−
IN
ON Input Leakage
= V or GND
−
−
mA
mA
V
ON
ON
IN
I
Off Switch Leakage
= 0 V, V
= 0 V
−
−
1
SWOFF
OUT
FLAGB Output Logic Low Voltage
= 5 V, I
= 10 mA
−
0.1
0.15
−
0.2
0.3
1
IN
IN
IN
SINK
= 1.8 V, I
= 10 mA
−
SINK
FLAGB Output High Leakage
Current
= 5 V, Switch on
−
mA
PROTECTIONS
I
Current Limit
V
V
= 3.3 V,
FPF2109
200
400
−
300
600
140
130
10
400
800
−
mA
LIM
IN
= 3.0 V
OUT
FPF2108, FPF2110
Thermal Shutdown
Shutdown Threshold
Return from Shutdown
Hysteresis
°C
−
−
−
−
UVLO
Under Voltage Shutdown
V
IN
Increasing
1.5
−
1.6
47
1.7
−
V
Under Voltage Shutdown
Hysteresis
mV
DYNAMIC
t
Turn On Time
Turn Off Time
R = 500 W, C = 0.1 mF
−
−
−
−
5
−
25
50
12
136
10
3
−
−
ms
ms
ms
ms
ms
ms
ON
L
L
t
R = 500 W, C = 0.1 mF
L L
OFF
t
R
V
OUT
V
OUT
Rise Time
Fall Time
R = 500 W, C = 0.1 mF
−
L
L
t
F
R = 500 W, C = 0.1 mF
−
L
L
t
Over Current Blanking Time
Short Circuit Response Time
FPF2108
20
−
BLANK
V
= V = 3.3 V.
ON
IN
Moderate Over−Current Condition.
V
IN
= V = 3.3 V. Hard Short.
−
20
−
ns
ON
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2. Applicable only to FPF2108. Latchoff current does not include current flowing into FLAGB.
www.onsemi.com
4
FPF2108 − FPF2110
TYPICAL CHARACTERISTICS
120
110
100
90
150
130
110
V
ON
= V
IN
V
IN
= 3.3 V
V
IN
= 5.5 V
90
70
50
80
V
IN
= 1.8 V
70
60
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
SUPPLY VOLTAGE (V)
−40
−15
10
35
60
85
T , JUNCTION TEMPERATURE (°C)
J
Figure 4. Quiescent Current vs. Input Voltage
Figure 5. Quiescent Current vs. Temperature
2500
2000
1500
1000
500
2000
1500
1000
I_SHDN
I_SWOFF
V
= 5.5 V
IN
V
= 5.5 V
IN
V
IN
= 3.3 V
500
0
V
IN
= 3.3 V
35
0
−40
−15
10
35
60
85
−40
−15
10
60
85
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 6. ISHUTDOWN Current vs. Temperature
Figure 7. ISWITCH−OFF Current vs. Temperature
0.20
0.18
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0.00
1.4
1.2
1
0.8
0.6
0.4
0.2
0
V
= 5.5 V
IN
V
IN
= 3.3 V
60
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
SUPPLY VOLTAGE (V)
−40
−15
10
35
85
T , JUNCTION TEMPERATURE (°C)
J
Figure 8. Reverse Current vs. VOUT
Figure 9. Reverse Current vs. Temperature
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5
FPF2108 − FPF2110
TYPICAL CHARACTERISTICS (continued)
700
600
500
400
300
200
100
0
700
600
500
400
300
200
100
FPF2108, FPF2110
FPF2108, FPF2110
FPF2109
FPF2109
−40
−15
10
35
60
85
0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7
3
T , JUNCTION TEMPERATURE (°C)
J
V
IN
− V
(V)
OUT
Figure 10. Current Limit vs. Output Voltage
Figure 11. Current Limit vs. Temperature
200
180
160
140
120
100
80
1.4
1.2
1
FPF2109, FPF2110
FPF2108
V
IN
= 1.8 V
0.8
0.6
0.4
0.2
0
V
IN
= 3.3 V
V
IN
= 5.5 V
60
−40
4.5
V , INPUT VOLTAGE (V)
IN
−15
10
35
60
85
1.5
2.0
2.5
3.0
3.5
4.0
5.0
5.5
T , JUNCTION TEMPERATURE (°C)
J
Figure 12. R(ON) vs. Temperature
Figure 13. VIH vs. VIN
100
1000
100
I
V
= 10 mA
= 3.3 V
I
V
= 10 mA
= 3.3 V
LOAD
LOAD
CC
CC
T
OFF
T
(FALL)
T
(RISE)
T
ON
10
1
10
−40
−40
−15
10
35
60
85
−15
10
35
60
85
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 14. TON/TOFF vs. Temperature
Figure 15. TRISE/TFALL vs. Temperature
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6
FPF2108 − FPF2110
TYPICAL CHARACTERISTICS (continued)
12
11
10
9
V
DRV
2 V/DIV
V
OUT
2 V/DIV
8
7
I
OUT
200 mA/DIV
6
V
FLAGB
5
2 V/DIV
4
−15
10
35
60
85
−40
5 ms/DIV
T , JUNCTION TEMPERATURE (°C)
J
Figure 16. TBLANK vs. Temperature
Figure 17. TBLANK Response
(VDRV signal forces the device to go
into overcurrent conditions.)
R = 500 W, CL 0.1 mF
Active High Devices
L
R = 500 W, CL 0.1 mF
Active High Devices
L
V
ON
V
ON
2 V/DIV
2 V/DIV
I
OUT
I
OUT
10 mA/DIV
10 mA/DIV
100 ms/DIV
200 ns/DIV
Figure 18. TON Response
Figure 19. TOFF Response
V
= V
ON
IN
C
C
= 10 mF
IN
Active High Devices
V
IN
= 0.1 mF
OUT
2 V/DIV
Active High Devices
V /V
IN ON
2 V/DIV
I
OUT
5 A/DIV
I
OUT
200 mA/DIV
V
OUT
2 V/DIV
20 ms/DIV
50 ms/DIV
Figure 20. Short Circuit Response Time
(Output Shorted to GND)
Figure 21. Current Limit Response
(Switch power up to hard short.)
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7
FPF2108 − FPF2110
TYPICAL CHARACTERISTICS (continued)
Active High Devices
V
IN
2 V/DIV
V
ON
2 V/DIV
I
OUT
200 mA/DIV
50 ms/DIV
Figure 22. Current Limit Response Time
(Output Shorted to GND by 10 W, moderate short.)
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8
FPF2108 − FPF2110
DESCRIPTION OF OPERATION
Current Limiting
The FPF2108−FPF2110 is a current limited switch that
protects systems and loads which can be damaged or
disrupted by the application of high currents. The core of the
device is a 0.125 W P−channel MOSFET and a controller
capable of functioning over a wide input operating range of
1.8 V−5.5 V. The controller protects against system
malfunctions through current limiting, under−voltage
lockout and thermal shutdown. The current limit is preset for
either 200 mA or 400 mA.
The current limit ensures that the current through the
switch doesn’t exceed a maximum value while not limiting
at less than a minimum value. For the FPF2109 the
minimum current is 200 mA and the maximum current is
400 mA and for the FPF2108 and FPF2110 the minimum
current is 400 mA and the maximum current is 800 mA. The
FPF2108 has a blanking time of 10 ms, nominally, during
which the switch will act as a constant current source. At the
end of the blanking time, the switch will be turned−off and
the FLAGB pin will activate to indicate that current limiting
has occurred. The FPF2109 and FPF2110 have no current
limit blanking period so immediately upon a current limit
condition FLAGB is activated. These parts will remain in a
constant current state until the ON pin is deactivated or the
thermal shutdown turns−off the switch.
On/Off Control
The ON pin controls the state of the switch. Active HI and
LO versions are available. Refer to the Ordering
Information for details. Activating ON continuously holds
the switch in the on state so long as there is no fault. For all
versions, an under−voltage on V or a junction temperature
IN
in excess of 150°C overrides the ON control to turn off the
switch. For FPF2108, the ON pin must be toggled to turn on
the switch again. The FPF2109 and FPF2110 do not turn off
in response to a over current condition but instead remain
operating in a constant current mode so long as ON is active
and the thermal shutdown or under−voltage lockout have not
activated. When the MOSFET is off, the body diode is
disabled so no current can flow through it.
Under−Voltage Lockout
The under−voltage lockout turns−off the switch if the
input voltage drops below the under−voltage lockout
threshold. With the ON pin active the input voltage rising
above the under−voltage lockout threshold will cause a
controlled turn on of the switch which limits current
over−shoots.
Thermal Shutdown
Fault Reporting
The thermal shutdown protects the part from internally or
externally generated excessive temperatures. During an
over−temperature condition the FLAGB is activated and the
switch is turned−off. The switch automatically turns−on
again if the temperature of the die drops below the threshold
temperature.
Upon the detection of an over−current, an input
under−voltage, or an over−temperature condition, the
FLAGB signals the fault mode by activating LO. For the
FPF2108, the FLAGB goes LO at the end of the blanking
time while FLAGB goes LO immediately for the FPF2109
and FPF2110. For the FPF2108, FLAGB is latched LO and
ON must be toggled to release it. With the FPF2109 and
FPF2110, FLAGB is LO during the faults and immediately
returns HI at the end of the fault condition. FLAGB is an
open−drain MOSFET which requires a pull−up resistor
between V and FLAGB. During shutdown, the pull−down
IN
on FLAGB is disabled to reduce current draw from the
supply.
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9
FPF2108 − FPF2110
APPLICATION INFORMATION
Typical Application
LOAD
R1 = 100 kW
V
OUT
V
IN
FPF2108 − FPF2110
Battery
1.8 V−5.5 V
OFF ON
C1 = 4.7 mF
ON
FLAGB
+
R2 = 499 W
GND
C2 = 0.1 mF
−
Figure 23. Typical Application
Board Layout
Input Capacitor
To limit the voltage drop on the input supply caused by
transient in−rush currents when the switch turns−on into a
discharged load capacitor or a short−circuit, a capacitor
For best performance, all traces should be as short as
possible. To be most effective, the input and output
capacitors should be placed close to the device to minimize
the effects that parasitic trace inductances may have on
normal and short−circuit operation. Using wide traces for
needs to be placed between V and GND. A 4.7 mF ceramic
IN
capacitor, C , must be placed close to the V pin. A higher
IN
IN
value of C can be used to further reduce the voltage drop
V , V
IN OUT
and GND will help minimize parasitic electrical
IN
experienced as the switch is turned on into a large capacitive
load.
effects along with minimizing the case to ambient thermal
impedance.
Output Capacitor
A 0.1 mF capacitor C , should be placed between V
OUT OUT
and GND. This capacitor will prevent parasitic board
inductances from forcing V
below GND when the
OUT
switch turns−off.
Power Dissipation
During normal operation as a switch, the power
dissipation is small and has little effect on the operating
temperature of the part. The parts with the higher current
limits will dissipate the most power and that will only
2
2
typically be, P = (I ) * R = (0.8) * 0.125 = 80 mW.
LIM
DS
When in current limit the maximum power dissipation will
occur when the output is shorted to ground. A short on the
output will cause the part to operate in a constant current
state until the thermal shutdown activates. It will then cycle
in and out of thermal shutdown so long as the ON pin is
active and the short is present.
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10
FPF2108 − FPF2110
ORDERING INFORMATION
Current Limit
Blanking Time
[ms]
Current Limit
Auto−Restart
Time [ms]
ON Pin
Activity
†
[mA]
400
200
400
Part Number
FPF2108
Top Mark
2108
Shipping
10
0
NA
NA
NA
Active LO
Active HI
Active HI
3000 /
Tape & Reel
FPF2109
FPF2110
2109
0
2110
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
IntelliMAX is a trademark of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other
countries.
www.onsemi.com
11
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOT−23, 5 Lead
CASE 527AH
ISSUE A
DATE 09 JUN 2021
q
q
q
q
q
q1
q2
GENERIC
MARKING DIAGRAM*
XXXM
XXX = Specific Device Code
M
= Date Code
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON34320E
SOT−23, 5 LEAD
PAGE 1 OF 1
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