FPF2286UCX [ONSEMI]
具有极低导通电阻的 OVP，28 V，4 A;
| 型号： | FPF2286UCX |
| 厂家： | 
ONSEMI |
| 描述： | 具有极低导通电阻的 OVP，28 V，4 A |
| 文件： | 总7页 (文件大小：223K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
FPF2286UCX
28 V / 4 A Rated OVP with
Low On-resistance
FPF2286 is an OVP with integrated low on−resistance single channel
switch. The device contains an N−MOSFET that can operate over an
input voltage range of 2.8 V to 23 V and can support a maximum
continuous current of 4 A.
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When the input voltage exceeds the over−voltage threshold, the
internal FET is turned off immediately to prevent damage to the
protected downstream components.
FPF2286 is available in a small 6−bump WLCSP package and
operate over the free−air temperature range of −40°C to +85°C.
WLCSP6
CASE 567UV
Features
• Over−voltage Protection Up to +28 V
• Internal Low R
NMOS Transistors: Typical 25 mW
• Programmable Over−voltage Lockout (OVLO)
♦ Externally Adjustable via OVLO Pin
DS(on)
MARKING DIAGRAM
3FMG
• Active−low Enable Pin (OVLO) for Device
• Super Fast OVLO Response Time: Typical 40 ns
3F = Specific Device Code
• Short Circuit Protection and Auto−restart
M
= Month Code
G
= Pb−Free Package
• Over Temperature Protection (Thermal Shutdown)
• Robust ESD Performance
♦ 2 kV Human Body Model (HBM)
♦ 1 kV Charged Device Model (CDM)
PIN CONNECTIONS
2
1
♦ V Tolerant to 35 V Residue−voltage during Surge Event
IN
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
IN
OUT
A
Compliant
Typical Applications
• Mobile Phones
• PDAs
IN
OUT
GND
B
C
• GPS
OVLO
(Bottom View)
ORDERING INFORMATION
See detailed ordering, marking and shipping information on
page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2018
1
Publication Order Number:
April, 2019 − Rev. 0
FPF2286UCX/D
FPF2286UCX
VBUS
HV Battery
Charger
Travel
Adapter
OUT
IN
1uF
1uF
FPF2286
R1
R2
Legacy USB /
USB Type C connector
OVLO
GND
Figure 1. Application Schematic − Adjustable Option
IN
OUT
Gate Drive
1. 2V
Control
OVLO
0.3V
GND
Figure 2. Simplified Block Diagram
Table 1. PIN FUNCTION DESCRIPTION
Pin No.
A2, B2
A1, B1
C2
Pin Name
IN
Description
Power Input: Switch Input and Device Supply
OUT
Power Output: Switch Output to Load
OVLO Input: Over Voltage Lockout Adjustment Input
Ground
OVLO
GND
C1
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2
FPF2286UCX
Table 2. MAXIMUM RATINGS
Rating
Symbol
Value
Unit
V
Input Voltage Range (Note 1)
V
in
−0.3 to 28
Output Voltage Range
V
out
−0.3 to (V + 0.3)
V
in
Adjustable Input Range
V
OVLO
−0.3 to 23
V
Internal FET continuous current
Maximum Junction Temperature
Storage Temperature Range
I
0 to 4
A
OUT
T
150
°C
°C
kV
kV
°C
J(max)
T
−65 to 150
STG
ESD Capability, Human Body Model (Note 2)
ESD Capability, Charged Device Model (Note 2)
ESD
ESD
2
1
HBM
CDM
Lead Temperature Soldering
T
260
SLD
Reflow (SMD Styles Only), Pb−Free Versions (Note 3)
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTICS, RECOMMENDED OPERATING RANGES and/or APPLICATION INFORMATION for Safe
Operating parameters.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Charged Device Model tested per AEC−Q100−011 (EIA/JESD22−C101)
Latch−up Current Maximum Rating: ≤150 mA per JEDEC standard: JESD78
3. For information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
Table 3. THERMAL CHARACTERISTICS
Rating
Symbol
Value
Unit
Thermal Characteristics, WLCSP−6 (Note 4)
Thermal Resistance, Junction−to−Air (Note 5)
R
121.7
°C/W
θJA
4. Refer to ELECTRICAL CHARACTERISTICS, RECOMMENDED OPERATING RANGES and/or APPLICATION INFORMATION for Safe
Operating parameters.
5. Values based on 2S2P JEDEC std. PCB.
Table 4. RECOMMENDED OPERATING RANGES
Rating
Symbol
Min
2.8
0
Max
23
Unit
V
Supply Voltage on VIN
I/O pins
V
in
V
OVLO
5.5
3.5
V
Output Current
IN Capacitor
I
0
A
out
C
0.1
0.1
−40
mF
mF
°C
in
OUT Capacitor
Ambient Temperature
C
out
T
A
85
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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3
FPF2286UCX
Table 5. ELECTRICAL CHARACTERISTICS
V
= 2.8 to 23 V, C = 0.1 mF, C
= 0.1 mF, T = −40 to 85°C; For typical values V = 5.0 V, I v 3 A, C = 0.1 mF, T = 25°C, for
IN
IN
OUT
A
IN
IN
IN
A
min/max values T = −40°C to 85°C; unless otherwise noted. (Note 6)
A
Parameter
Test Conditions
Symbol
Min
Typ
Max
Unit
LEAKAGE AND QUIESCENT CURRENTS
Input Quiescent Current on VIN
V
V
V
V
= 5 V, V
= 0.6 V
I
Q
85
mA
IN
OVLO
= 20 V, V
= 0.6 V
200
215
IN
OVLO
OVLO
Supply Current during Over Voltage
OVLO Input Leakage Current
= 23 V, V
= 3.0 V, V
= 0 V
I
IN_Q
mA
IN
OUT
= V
I
OVLO
−100
100
2.7
nA
OVLO
OVLO_TH
OVER VOLTAGE AND UNDER VOLTAGE LOCKOUT
Under−Voltage Rising Trip Level for VIN
Under−Voltage Falling Trip Level for VIN
Default Over−Voltage Trip Level
OVLO set threshold
V
V
V
V
rising, T = −40 to 85°C
V
IN_UV_R
2.3
2.5
2.4
V
V
V
V
IN
A
falling, T = −40 to 85°C
V
IN
A
IN_UV_F
IN_OVLO
OVLO_TH
rising, T = −40 to 85°C
V
6.6
6.8
7.0
IN
A
= 1.1 V to 1.3 V, the voltage of
V
1.16
1.19
1.22
OVLO
OVLO to trigger Over Voltage condition
OVLO threshold hysteresis
Adjustable OVLO range
I/O THRESHOLDS
V
2
%
V
HYS_OVLO
OV_MODE = 0, V
> 0.5 V
V
4
23
OVLO
OV_RNG
OVLO Input Threshold Voltage
Voltage Increasing, Logic High
Voltage Decreasing, Logic Low
V
High
Low
V
V
0.3
−
−
−
−
0.15
IH_OVLO
IL_OVLO
RESISTANCE
On−resistance of Power FET
TIMING
V
IN
= 5 V, I
= 500 mA, T = 25°C
r
ON
25
35
mW
OUT
A
De−bounce Time of Power FET turned on
Time from 2.5 V < V < V
to
t
SW_DEB
15
1
ms
ms
ns
IN
IN_OVLO
V
= 0.1 × V
OUT
IN
Switch Turn−On rising Time (Note 8)
Switch Turn−Off Time (Note 8)
V
V
= 5 V, R = 100 W, C = 22 mF,
t
R
IN
L
L
from 0.1 × V to 0.9 × V
OUT
IN
IN
R = 10 W, C = 0 mF, time from V
>
L
L
OUT
IN
V
to V
= 0.9 × V
OVLO
IN
Internal OVP level
External OVP level (Note 9)
40
100
THERMAL SHUTDOWN
Thermal Shutdown Temperature (Note 8)
Thermal Shutdown Hysteresis (Note 8)
T
T
−
−
130
20
−
−
°C
°C
SD
SH
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
6. Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at T = T = 25°C. Low
J
A
duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
7. Refer to the APPLICATION INFORMATION section.
8. Values based on design and/or characterization.
9. Depends on the capacitance on OVLO pin.
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4
FPF2286UCX
Under Voltage Lockout
Function Description
FPF2286 power switch will be turned off when the
voltage on IN is lower than the UVLO threshold V
Whenever VIN voltage ramps up to higher than
General
.
IN_UV_F
FPF2286 is an OVP power switch to protect next stage
system which is optimized to lower voltage working
condition. The device includes ultra low on−resistance
power FET (25 mW) and super fast OVP response time
(40 ns).
V , the power FET will be turned on automatically
IN_UV_R
after t
de−bounce time if there is no OV or OT condition.
DEB
Over Voltage Lockout
The power FET will be turned off whenever VIN voltage
Power MOSFET
higher than V
. The value of V
can be set by
IN_OVLO
IN_OVLO
The FPF2286 integrates an N−type MOSFET with 25 mW
resistance. The power FET can work under 2.8 V ~ 23 V and
up to 4 A DC current capability.
external resistor ladder or just be default value V
.
IN_OVLO
When V
is smaller than V
, V
will be
OVLO
IL_OVLO
OVLO
decided by default value. When V
is larger than
OVLO
V
> V
, the power switch will be turned off once V
IH_OVLO
OVLO
Power Supply
. The external resistor ladder can be decided
OVLO_TH
The FPF2286 is supplied by IN. IN will be firstly supplied
by OUT when the device is working under USB
On−The−Go (OTG) condition.
according to the following equation:
ǒ
Ǔ
VIN_OVLO + VOVLO_TH 1 ) R1ńR2
(eq. 1)
where R1 and R2 are the resistors in Figure 1.
Enable Control
There is no specified enable pin for FPF2286. However,
the OVLO can be used as an active LOW enable pin to be
controlled by a GPIO. When OVLO pin is connected to a
high level (higher than 1.2 V), the internal FET will be
turned off. When OVLO pin is connected to 0 V, the FET
Thermal Shutdown
When the device is in the switch mode, to protect the
device from over temperature, the power switch will be
turned off when the junction temperature exceeds T . The
switch will be turned on again when temperature drop below
SD
will be turned on as long as V is not higher than 6.8 V.
IN
T
− T
.
SD
SH
APPLICATIONS INFORMATION
Input Decoupling (Cin)
the FPF2286 has good thermal conductivity through the
PCB, the junction temperature will be relatively low with
high power applications. The maximum dissipation the
FPF2286 can handle is given by:
A ceramic or tantalum at least 0.1 mF capacitor is
recommended and should be connected close to the
FPF2286 package. Higher capacitance and lower ESR will
improve the overall line and load transient response.
ƪT
ƫ
J(MAX) * TA
PD(MAX)
+
(eq. 2)
Output Decoupling (Cout
)
RqJA
The FPF2286 is a stable component and does not require
a minimum Equivalent Series Resistance (ESR) for the
output capacitor. The minimum output decoupling value is
0.1 mF and can be augmented to fulfill stringent load
transient requirements.
Since T is not recommended to exceed 125°C, then the
J
2
FPF2286 soldered on 645 mm , 1 oz copper area, and the
ambient temperature (T ) is 25°C. The power dissipated by
A
the FPF2286 can be calculated from the following
equations:
Thermal Considerations
PD [ Vin @ IQ@Iout ) Iout 2 @ rON
(eq. 3)
ǒ
Ǔ
As power in the FPF2286 increases, it might become
necessary to provide some thermal relief. The maximum
power dissipation supported by the device is dependent
upon board design and layout. Mounting pad configuration
on the PCB, the board material, and the ambient temperature
affect the rate of junction temperature rise for the part. When
Hints
V and V printed circuit board traces should be as wide
in
out
as possible. Place external components, especially the input
capacitor and TVS, as close as possible to the FPF2286, and
make traces as short as possible.
ORDERING INFORMATION
†
Device
Default OV Level
Marking
Package
Shipping
FPF2286UCX
6.8 V
3F
WLCSP−6L
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D
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5
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WLCSP6 1.3x0.9x0.574
CASE 567UV
ISSUE O
DATE 05 JUL 2017
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON66547G
WLCSP6 1.3x0.9x0.574
PAGE 1 OF 1
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