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FPF2303MX [ONSEMI]

双输出电流限值开关;
FPF2303MX
型号： FPF2303MX
厂家： ONSEMI    ONSEMI
描述：

双输出电流限值开关

开关 光电二极管
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June 2009  
FPF2300/02/03  
Dual-Output Current Limit Switch  
Features  
Description  
! 1.8 to 5.5V Input Voltage Range  
! Typical RON = 75mΩ at IN = 5.5V  
! 1.3A Current Limit (Typical)  
! Slew Rate Controlled  
The FPF2300/02/03 are dual-channel load switches of  
IntelliMAX™ family. The FPF2300/02/03 consist of dual,  
independent, current-limited, slew rate controlled, P-  
channel MOSFET power switches. Slew rated turn-on  
prevents inrush current from glitching supply rails. The  
input voltage range operates from 1.8V to 5.5V to fulfill  
today's USB device supply requirements. Switch control  
is accomplished by a logic input (ON) capable of  
interfacing directly with low-voltage control signal.  
! Reversed Current Blocking when Disabled  
! ESD Protected, Above 4000V HBM  
! Independent Thermal Shutdown  
! UVLO  
! RoHS Compliant  
For the FPF2302, if the constant current condition per-  
sists after 10ms, these parts shut down the switch and  
pull the fault signal pin (FLAGB) LOW. The FPF2300 has  
an auto-restart feature that turns the switch on again  
after 504ms if the ON pin is still active. For the FPF2303,  
a current limit condition immediately pulls the fault signal  
pin LOW and the part remains in the constant-current  
mode until the switch current falls below the current limit.  
For the FPF2300 through FPF2303, the current limit is  
typically 1.3A for each switch to align with notebook  
computing applications. FPF2300/02/03 is available in  
both SO8 and MLP 3X3mm 8-lead packages.  
Applications  
! Notebook Computing  
! Peripheral USB Ports  
! Networking / USB Based Equiptment  
Figure 1. 8-Lead SOP  
Figure 2. 8-Lead MLP (3x3mm)  
Ordering Information  
Minimum  
Current Limit  
Auto  
Restart  
ON Pin  
Activity  
PartNumber Current  
Blanking Time  
Mode  
Package  
Eco  
Status  
Limit  
FPF2300MX  
FPF2302MX  
1100mA  
1100mA  
10ms  
10ms  
RoHS  
RoHS  
504ms Active LOW  
Restart 8-Lead SO8  
N/A  
Active LOW Latch Off 8-Lead SO8  
Constant  
FPF2303MX  
FPF2300MPX  
FPF2302MPX  
FPF2303MPX  
1100mA  
1100mA  
1100mA  
1100mA  
0ms  
10ms  
10ms  
0ms  
RoHS  
Green  
Green  
Green  
N/A  
Active LOW  
8-Lead SO8  
Current  
8-Lead Molded Lead-  
less Package (MLP)  
504  
N/A  
N/A  
Active LOW  
Restart  
8-Lead Molded Lead-  
less Package (MLP)  
Active LOW Latch Off  
Constant 8-Lead Molded Lead-  
Current less Package (MLP)  
Active LOW  
For Fairchild’s definition of Eco Status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html.  
© 2009 Fairchild Semiconductor Corporation  
FPF2300/02/03 • Rev. 1.1.3  
www.fairchildsemi.com  
Application Circuit  
FLAGB(A)  
FLAGB(B)  
IN  
FPF2300/2/3  
OFF ON  
OFF ON  
ONA  
OUTA  
TO LOAD A  
TO LOAD B  
CIN  
IN = 1.8V-5.5V  
ONB  
OUTB  
GND  
COUTA  
COUTB  
Figure 3. Typical Application  
Functional Block Diagram  
IN  
UVLO  
REVERSE  
CURRENT  
BLOCKING  
CONTROL  
LOGIC A  
ONA  
CURRENT  
LIMIT A  
OUTA  
THERMAL  
PROTECTION A  
FLAGB(A)  
REVERSE  
CURRENT  
BLOCKING  
ONB  
CONTROL  
LOGIC B  
CURRENT  
LIMIT B  
OUTB  
THERMAL  
PROTECTION B  
FLAGB(B)  
GND  
Figure 4. Block Diagram  
© 2009 Fairchild Semiconductor Corporation  
FPF2300/02/03 • Rev. 1.1.3  
www.fairchildsemi.com  
2
Pin Configuration  
FLAGB(A)  
OUTA  
8
7
6
5
1
2
3
4
GND  
IN  
GND  
IN  
FLAGB(A)  
OUTA  
1
2
3
4
8
7
6
5
9
ONA  
ONB  
OUTB  
OUTB  
ONA  
ONB  
FLAGB(B)  
FLAGB(B)  
SO8  
MLP 3X3mm 8-Lead Bottom View  
Figure 5. Pin Configurations  
Pin Description  
Pin #  
Name  
Function  
1
2
3
4
GND  
IN  
Ground  
Supply Input: Input to the power switch and the supply voltage for the IC.  
ON / OFF control input of power switch A. Active LOW  
ONA  
ONB  
ON / OFF control input of power switch B. Active LOW  
Fault Output B, Active LO, open drain output which indicates an over supply, UVLO  
and thermal shutdown.  
5
FLAGB(B)  
6
7
OUTB  
OUTA  
Switch Output: Output of the power switch B  
Switch Output: Output of the power switch A  
Fault Output A, Active LO, open drain output which indicates an over supply, UVLO  
and thermal shutdown.  
8
FLAGB(A)  
IC Substrate, which can be connected to GND for better thermal performance. Do not  
connect to other pins.  
9(MLP)  
Thermal Pad  
© 2009 Fairchild Semiconductor Corporation  
FPF2300/02/03 • Rev. 1.1.3  
www.fairchildsemi.com  
3
Absolute Maximum Ratings  
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-  
ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-  
tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The  
absolute maximum ratings are stress ratings only.  
Symbol Parameter  
Min.  
Max.  
6.0  
Unit  
IN, OUTA, OUTB, ONA, ONB, FLAGB(A), FLAGB(B) to GND  
-0.3  
V
0.8(1)  
1.4(2)  
0.6(3)  
2.2(4)  
+150  
158(1)  
92(2)  
SO8  
MLP  
PD  
TSTG  
ΘJA  
Power Dissipation  
W
°C  
Storage Temperature  
-65  
SO8  
MLP  
Thermal Resistance, Junction-to-Ambient  
°C/W  
216(3)  
57(4)  
Human Body Model, JESD22-A114  
Charged Device Model, JESD22-C101  
4000  
2000  
ESD  
Electrostatic Discharge Protection  
V
Notes:  
1. Two-layer PCB of 2s0p from JEDEC STD 51-3.  
2. Four-layer PBD of 2s0p from JEDEC STD 51-7.  
3. Soldered thermal pad on a two-layer PCB without vias based on JEDEC STD 51-3.  
4. Soldered thermal pad on a four-layer with two vias connected with GND plane base on JEDEC STD 51-5, 7.  
Recommended Operating Range  
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended  
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not  
recommend exceeding them or designing to absolute maximum ratings.  
Symbol Parameter  
Min.  
1.8  
Max.  
5.5  
Unit  
V
IN  
TA  
Supply Input  
Ambient Operating Temperature  
-40  
+85  
°C  
© 2009 Fairchild Semiconductor Corporation  
FPF2300/02/03 • Rev. 1.1.3  
www.fairchildsemi.com  
4
Electrical Characteristics  
IN = 1.8 to 5.5V, TA = -40 to +85°C unless otherwise noted. Typical values are at IN = 3.3V and TA = 25°C.  
Symbol  
Parameter  
Conditions  
Min. Typ. Max. Units  
Basic Operation  
VIN  
IQ  
Operating Voltage  
1.8  
5.5  
V
Quiescent Current  
IN = 5.5V, VONA = VONB = 0V, IOUT = 0mA  
52.5 94.5  
μA  
V
ONA = VONB = 5.5V, IN = 5.5V  
ISD  
IN Shutdown Current  
3
μA  
OUTA = OUTB = Short to GND,  
IN = 5.5V, IOUT = 200mA, TA = 25°C  
IN = 5.5V, IOUT = 200mA, TA = -40°C to 85°C  
IN = 1.8V  
75  
90  
140  
RON  
On Resistance  
mΩ  
0.8  
1.4  
VIH  
ON Input Logic High Voltage (ON)  
V
IN = 5.5V  
IN = 1.8V  
0.5  
0.9  
1
VIL  
ON Input Logic Low Voltage  
ON Input Leakage  
V
μA  
V
IN = 5.5V  
ION  
VON = IN or GND  
-1  
IN = 5.5V, ISINK = 1mA  
IN = 1.8V, ISINK = 1mA  
0.1  
0.2  
FLAGB Output Logic Low Voltage  
0.15 0.30  
1
FLAGB Output High Leakage Current IN = VON = 5V  
μA  
Protections  
ILIM  
Current Limit  
IN = 3.3V, VOUTA = VOUTB = 3V, TA = 25°C  
1.1  
1.3  
140  
130  
10  
1.5  
A
Shutdown Threshold  
Return from Shutdown  
Hysteresis  
TSD  
Thermal Shutdown  
Under-Voltage Shutdown  
°C  
VUVLO  
IN Increasing  
1.55 1.65 1.75  
50  
V
VUVLO_HYS Under-Voltage Shutdown Hysteresis  
mV  
Dynamic  
tON  
tOFF  
tR  
Turn-On Time  
RL = 500Ω, CL = 0.1μF  
RL = 500Ω  
113.5  
6
μs  
μs  
Turn-Off Time  
OUTA, OUTB Rise Time  
Over-Current Blanking Time  
RL = 500Ω, CL = 0.1μF  
FPF2300, FPF2302  
FPF2303(5)  
13.5  
μs  
tBLANK  
5
5
10  
10  
20  
20  
ms  
ms  
ms  
μs  
tRSTRT_BLANK Startup FLAGB Blanking Time  
tRSRT  
tCLR  
Auto-Restart Time  
FPF2300  
504  
20  
Current Limit Response Time  
IN = 3.3V, Moderate Over-Current Condition  
Note:  
5. FPF2303 has a 10ms startup FLAGB blanking time when the part is turned on via the ON pin to ensure transient load currents settle.  
90%  
90%  
OUT  
10%  
10%  
tR  
tF  
ON  
50%  
50%  
90%  
OUT  
10%  
tDON  
tDOFF  
tOFF = tF + tDOFF  
tON = tR + tDON  
Figure 6. Timing Diagram  
© 2009 Fairchild Semiconductor Corporation  
FPF2300/02/03 • Rev. 1.1.3  
www.fairchildsemi.com  
5
Typical Characteristics  
70.00  
ONA = ONB = 0V  
60.00  
70.00  
60.00  
50.00  
40.00  
30.00  
20.00  
10.00  
0.00  
ONA = ONB = 0V  
IN = 5.5V  
85°C  
50.00  
25°C  
40.00  
30.00  
20.00  
10.00  
0.00  
-40°C  
IN=3.3V  
IN = 1.8V  
1.8 2.2 2.5 2.9 3.3 3.7 4.0 4.4 4.8 5.1 5.5  
-40  
-15  
10  
35  
60  
85  
SUPPLY VOLTAGE (V)  
T, JUNCTION TEMPERATURE (°C)  
J
Figure 7. Quiescent Current vs. Supply Voltage  
Figure 8. Quiescent Current vs. Temperature  
160  
5.00  
IN = ONA = ONB = 5.5V  
OUT = 0V  
ONA = ONB = 0V  
OUT = 200mA  
T = 25°C  
150  
140  
130  
120  
110  
100  
90  
4.50  
4.00  
3.50  
3.00  
2.50  
2.00  
1.50  
1.00  
0.50  
0.00  
I
A
RON B  
RON A  
80  
70  
60  
-40  
-15  
10  
35  
60  
85  
1.8 2.2 2.5 2.9 3.3 3.7 4.0 4.4 4.8 5.1 5.5  
T, JUNCTION TEMPERATURE (°C)  
J
SUPPLY VOLTAGE (V)  
Figure 9. IN Shutdown Current vs. Temperature  
Figure 10. RON vs. Supply Voltage (MLP)  
160  
100  
ONA = ONB = 0V  
IOUT = 200mA  
T = 25°C  
IN = 5.5V  
OUT = 200mA  
ONA = ONB = 0V  
150  
140  
130  
120  
110  
100  
90  
95  
90  
85  
80  
75  
70  
65  
60  
55  
50  
I
A
RON B  
RON A  
RON B  
80  
RON A  
70  
60  
1.8 2.2 2.5 2.9 3.3 3.7 4.0 4.4 4.8 5.1 5.5  
-40  
-15  
10  
35  
60  
85  
SUPPLY VOLTAGE (V)  
T, JUNCTION TEMPERATURE (°C)  
J
Figure 11. RON vs. Temperature (SO8)  
Figure 12. RON vs. Temperature (MLP)  
© 2009 Fairchild Semiconductor Corporation  
FPF2300/02/03 • Rev. 1.1.3  
www.fairchildsemi.com  
6
Typical Characteristics  
90  
1.5  
1.3  
1.0  
0.8  
0.5  
0.3  
0.0  
IN=5.5V  
IOUT = 200mA  
ONA = ONB = 0V  
T = 25°C  
A
85  
80  
75  
70  
65  
60  
55  
50  
V
IL  
R
ON B  
V
IH  
RON A  
-40  
-15  
10  
35  
60  
85  
1.8 2.2 2.5 2.9 3.3 3.7 4.0 4.4 4.8 5.1 5.5  
T, JUNCTION TEMPERATURE (°C)  
J
SUPPLY VOLTAGE (V)  
Figure 13. RON vs. Temperature (SO8)  
Figure 14. ON Threshold Voltage vs. Supply Voltage  
1.2  
1.2  
IN=5.5V  
IN = 5.5V  
IN = 3.3V  
1.0  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
0.8  
0.6  
0.4  
0.2  
0.0  
IN=3.3V  
IN=1.8V  
IN = 1.8V  
-40  
-15  
10  
35  
60  
85  
-40  
-15  
10  
35  
60  
85  
T, JUNCTION TEMPERATURE (°C)  
J
T, JUNCTION TEMPERATURE (°C)  
J
Figure 15. ON High Voltage vs. Temperature  
Figure 16. ON Low Voltage vs. Temperature  
1350  
1350  
TA = 25°C  
IN = 3.3V  
OUTA = OUTB = 3V  
ONA = ONB = 0V  
1340  
1330  
1320  
1310  
1300  
1290  
1280  
1270  
1260  
1250  
1340  
1330  
1320  
1310  
1300  
1290  
1280  
1270  
1260  
1250  
ILIM(Typ)A  
ILIM(Typ)B  
ILIM(Typ)A  
ILIM(Typ)B  
1.8 2.2 2.5 2.9 3.3 3.7 4.0 4.4 4.8 5.1 5.5  
-40  
-15  
10  
35  
60  
85  
SUPPLY VOLTAGE (V)  
T, JUNCTION TEMPERATURE (°C)  
J
Figure 17. Current Limit vs. Supply Voltage  
Figure 18. Current Limit vs. Temperature  
© 2009 Fairchild Semiconductor Corporation  
FPF2300/02/03 • Rev. 1.1.3  
www.fairchildsemi.com  
7
Typical Characteristics  
20  
18  
16  
14  
12  
10  
8
1000  
IN=3.3V  
R = 500 Ohms  
C = 0.1 uF  
L
IN=3.3V  
R = 500 Ohms  
C = 0.1 uF  
L
L
tDON  
L
tR  
100  
10  
1
6
IN=3.3V  
R = 500 Ohms  
IN=3.3V  
R = 500 Ohms  
tF  
tDOFF  
L
L
4
2
0
-40  
-15  
10  
35  
60  
85  
-40  
-15  
10  
35  
60  
85  
T, JUNCTION TEMPERATURE (°C)  
J
T, JUNCTION TEMPERATURE (°C)  
J
Figure 19. tDON / tDOFF vs. Temperature  
Figure 20. tRISE / tFALL vs. Temperature  
10.0  
9.5  
9.0  
8.5  
8.0  
7.5  
7.0  
11.0  
FPF2303  
IN = 3.3V  
ONA = ONB = 0V  
FPF2300/2  
IN = 3.3V  
ONA = ONB = 0V  
10.5  
10.0  
9.5  
9.0  
8.5  
8.0  
7.5  
7.0  
FLAGB(B)  
FLAGB(A)  
FLAGB(B)  
FLAGB(A)  
-40  
-15  
10  
35  
60  
85  
-40  
-15  
10  
35  
60  
85  
T, JUNCTION TEMPERATURE (°C)  
J
T, JUNCTION TEMPERATURE (°C)  
J
Figure 21. tBLANK vs. Temperature  
Figure 22. tRSTRT_BLANK vs. Temperature  
620.0  
600.0  
580.0  
560.0  
540.0  
520.0  
500.0  
FPF2300  
IN=3.3V  
ONA = ONB = 0V  
IN  
2V/DIV  
OUTA  
OUTB  
ON  
2V/DIV  
IN = 5V  
ON = 3.3V  
OUT  
2V/DIV  
C
OUT = 0.1μF  
RL = 500Ω  
-40  
-15  
10  
35  
60  
85  
200μs/DIV  
T, JUNCTION TEMPERATURE (°C)  
J
Figure 23. tRSTRT vs. Temperature  
Figure 24. tON Response  
© 2009 Fairchild Semiconductor Corporation  
FPF2300/02/03 • Rev. 1.1.3  
www.fairchildsemi.com  
8
Typical Characteristics  
IN = 5V  
OUT = 10μF  
RL = 2.8Ω  
C
ON  
2V/DIV  
IN  
2V/DIV  
tBLANK  
FLAGB  
2V/DIV  
ON  
2V/DIV  
IOUT  
1A/DIV  
IN = 5V  
ON = 3.3V  
OUT  
2V/DIV  
C
OUT = 0.1μF  
OUT  
5V/DIV  
RL = 500Ω  
2ms/DIV  
200μs/DIV  
Figure 25. tOFF Response  
Figure 26. Over-Current Blanking Time (FPF2300/2)  
C
OUT = 10μF  
ON  
2V/DIV  
RL = 3.3Ω  
ON  
2V/DIV  
tRSTRT  
tSTART_BLANK  
FLAGB  
2V/DIV  
FLAGB  
2V/DIV  
IOUT  
1A/DIV  
IOUT  
1A/DIV  
IN = 5V  
OUT = 10μF  
RL = 2.8Ω  
OUT  
2V/DIV  
OUT  
5V/DIV  
C
100ms/DIV  
2ms/DIV  
Figure 28. Auto-Restart Time (FPF2300)  
Figure 27. Startup FLAGB Blanking Time (FPF2303)  
IN  
5V/DIV  
IN  
5V/DIV  
IN = 5V  
ON = 3.3V  
RL = 5Ω  
IN = 5V  
ON = 3.3V  
RL = 5Ω  
ON  
5V/DIV  
ON  
5V/DIV  
C
OUT = 470μF  
C
OUT = 47μF  
OUT = 100μF  
COUT = 220μF  
COUT = 470μF  
OUT  
5V/DIV  
IOUT  
1A/DIV  
C
COUT = 220μF  
COUT = 100μF  
COUT = 47μF  
200μs/DIV  
200μs/DIV  
Figure 29. Current Limit at Startup with  
Different Output Capacitor  
Figure 30. Output Voltage at Startup with  
Different Output Capacitor  
© 2009 Fairchild Semiconductor Corporation  
FPF2300/02/03 • Rev. 1.1.3  
www.fairchildsemi.com  
9
Typical Characteristics  
IN  
5V/DIV  
IN  
5V/DIV  
IN = 5V  
ON = 3.3V  
IN = 5V  
ON = 3.3V  
C
C
R
OUTA = 100μF  
OUTB = 100μF  
LA = RLB = 1Ω  
C
C
R
OUTA = 100μF  
OUTB = 100μF  
LA = RLB = 1Ω  
ON  
2V/DIV  
ON  
2V/DIV  
FLAGB(A)  
2V/DIV  
OUTA  
2V/DIV  
FLAGB(B)  
2V/DIV  
OUTB  
2V/DIV  
10ms/DIV  
400μs/DIV  
Figure 32. Startup FLAGB Blanking Time  
Figure 31. Current Limit Response Time Both  
Channels are in OC  
IN  
5V/DIV  
IN  
5V/DIV  
IN = 5V  
IN = 5V  
OUT = 47μF  
CIN = 10μF  
C
C
OUT = 100μF  
CL = 470μF  
RL = 5Ω  
ON  
5V/DIV  
ON  
5V/DIV  
CL = 47μF  
IOUT  
IOUT  
2A/DIV  
500mA/DIV  
OUT  
OUT  
5V/DIV  
5V/DIV  
200μs/DIV  
1ms/DIV  
Figure 33. Inrush Response During Capacitive Load  
Hot Plug-In Event  
Figure 34. Inrush Response During Capacitive and  
Resistive Load Hot Plug-In Event  
© 2009 Fairchild Semiconductor Corporation  
FPF2300/02/03 • Rev. 1.1.3  
www.fairchildsemi.com  
10  
Description of Operation  
The FPF2300, FPF2302, and FPF2303 are dual-output current-  
limit switches designed to meet notebook computer, peripheral  
USB port, and point-of-load (POL) application power requirements.  
Dual-output current can be used where dual or quad USB ports are  
powered by hosts or self-powered hubs. The FPF230X family  
offers control and protection while providing optimum operation  
current for a safe design practice. The core of each switch is a  
typical 75mΩ (IN = 5.5V) P-channel MOSFET and a controller  
capable of functioning over an input operating range of 1.8-5.5V.  
The FPF230X family offers current limiting, UVLO (under-voltage  
lockout), and thermal shutdown protection per each switch. In the  
event of an over-current condition, the load switch limits the load to  
current limit value. The minimum current limit is set to 1100mA.  
startup blanking feature that prevents current faults related to star-  
tup transients from triggering the FLAGB output. The startup blank-  
ing feature is effective for the first 10ms (typical) following device  
turn-on via ON pin.  
The FLAGB outputs are two open-drain MOSFETs that require a  
pull-up resistor on each FLAGB pin. FLAGB can be pulled HIGH to  
a voltage source other than input supply with maximum 5.5V. A  
100KΩ pull-up resistor is recommended. When the ON pin is inac-  
tive, the FLAGB is disabled to reduce current draw from the supply.  
If the FLAGB is not used, the FLAGB can be connected to ground  
on the PCB.  
.
ON  
On/Off Control  
device wakeup  
The ON pin is active LOW for FPF2300/2/3 and controls the state  
of the switch. Pulling the ON pin continuous to LOW holds the  
switch in the ON state. The switch moves into the OFF state when  
the ON pin is pulled HIGH or if a fault is encountered. For all  
IN  
device wakeup  
FLAGB  
versions, an under-voltage on input voltage or  
a junction  
RISE  
TIME  
temperature in excess of 140°C overrides the ON control to turn off  
the switch. In addition, excessive currents cause the switch to turn  
off in the FPF2300 and FPF2302 after a 10ms blanking time. The  
FPF2300 has an auto-restart feature that automatically turns the  
switch ON again after 504ms. For the FPF2302, the ON pin must  
be toggled to turn on the switch again. The FPF2303 does not turn  
off in response to an over-current condition, but remains operating  
in a constant-current mode as long as ON is enabled and the  
thermal shutdown or UVLO is not activated. The ON pin does not  
have a pull-down or pull-up resistor and should not be left floating.  
90% VOUT  
OUT  
ILOAD  
10% VOUT  
ILIMIT  
Figure 35. FLAGB Assertion in Under-Voltage Fault  
Current Limiting  
The current limit ensures that the current through the switch  
doesn't exceed a maximum value, while not limiting at less than a  
minimum value. FPF230X family has dual-output load switches  
being housed in one package. The minimum current at which both  
switches start limiting the load current is set to 1100mA. The  
FPF2300 and FPF2302 have a blanking time of 10ms (typical),  
during which the switch acts as a constant current source. At the  
end of the blanking time, the switch is turned off. The FPF2303 has  
no current limit blanking period, so it remains in a constant current  
state until the ON pin of the affected switch is deactivated or the  
thermal shutdown turns off the switch.  
ON  
VIN  
VOUT  
RL*ILMIT  
ILOAD  
ILIMIT  
Fault Reporting  
Over  
current  
condtion  
Over-current, input under-voltage, and over-temperature fault  
conditions are signaled out by the FLAGB pin going LOW. A UVLO  
fault is reported on both FLAGB(A) and FLAGB(B) simultaneously,  
while over-current and over-temperature condition faults are  
reported independently. FPF2300 and FPF2302 have a current  
fault blanking feature that prevents over-current faults shorter than  
the blanking time (tBLANK(Typ) = 10ms) from triggering the fault  
signal (FLAGB) output.  
FLAGB  
tRSTRT  
tBLANK  
Figure 36. FPF2300 FLAGB Reports While Entering  
into an Over-Current Condition  
Note:  
6.  
If the over-current condition persists beyond the blanking time, the  
FPF2300 pulls the FLAGB pin LOW and shuts the switch off. If the  
ON pin is kept active, an auto-restart feature releases the FLAGB  
pin and turns the switch on again after a 504ms auto-restart time  
(tRSTRT). If the over-current condition persists beyond the blanking  
time, the FPF2302 has a latch-off feature that pulls the FLAGB pin  
LOW and shuts the switch off. The switch is kept off and the  
FLAGB pin kept LOW until the ON pin is toggled. The FPF2303  
responds to an overload condition by immediately pulling the  
FLAGB pin LOW and the switch remains in constant current mode  
until the output overload condition is removed. The FPF2303 has a  
An over-current condition signal loads the output with a  
heavy load current larger than ILIM value.  
© 2009 Fairchild Semiconductor Corporation  
FPF2300/02/03 • Rev. 1.1.3  
www.fairchildsemi.com  
11  
automatically turns on again. To avoid unwanted thermal  
oscillations, a 10°C (typical) thermal hysteresis is implemented  
between thermal shutdown entry and exit temperatures.  
ON  
If output of both switches are connected together and an  
excessive load current activates thermal protection of both, the  
controller can shut down the switches after both FLAGB outputs  
go LOW and turn on both channels again. This provides  
simultaneous switch turn on. Thermal protection is for device  
protection and should not be used as regular operation.  
VIN  
VOUT  
ILOAD  
ILIMIT  
Over  
current  
condtion  
Input Capacitor  
To limit the voltage drop on the input supply caused by transient  
inrush currents when the switch is turned on into discharged  
load capacitors or a short-circuit; an input capacitor, CIN, is  
recommended between IN and GND. The FPF2310/2/3/3L  
features a fast current limit response time of 20μs. An inrush  
current (also known as surge current) could occur during the  
current limit response time while the switch is responding to an  
over-current condition caused by large output capacitors. A  
10μF ceramic capacitor, CIN, is required to provide charges for  
the inrush current and prevent input voltage drop at turn on.  
Higher values of CIN can be used to further reduce voltage drop.  
FLAGB  
Startup  
tBLANK  
Figure 37. FPF2300 FLAGB While and Over-Current  
Condition is Applied  
Note:  
7.  
An over-current condition signal loads the output with a  
heavy load current larger than ILIMIT value.  
Under-Voltage Lockout (UVLO)  
The under-voltage lockout feature turns off the switch if the  
input voltage drops below the under-voltage lockout threshold.  
With the ON pin active (ON pin pulled LOW), the input voltage  
rising above the under-voltage lockout threshold causes a  
controlled turn-on of the switch and limits current overshoot. If a  
device is in UVLO condition, both FLAGBs go LOW and indicate  
the fault condition. The device detects the UVLO condition when  
input voltage goes below UVLO voltage, but remains above  
1.3V (typical).  
Output Capacitor  
A 0.1μF to 1μF capacitor, COUT, should be placed between the  
OUT and GND pins. This capacitor prevents parasitic board  
inductances from forcing output voltage below GND when the  
switch turns off. This capacitor should have a low dissipation  
factor. An X7R MLCC (Multilayer Ceramic Chip) capacitors is  
recommended.  
For the FPF2300 and FPF2302, the total output capacitance  
needs to be kept below a maximum value, COUT(MAX), to  
prevent the part from registering an over-current condition  
beyond the blanking time and shutdown. The maximum output  
capacitance for a giving input voltage can be determined from  
the following:  
Reverse Current Blocking  
Each switch of FPF2300/2/3 has an independent reverse  
current blocking feature that protects input source against  
current flow from output to input. For a standard USB power  
design, this is an important feature that protects the USB host  
from being damaged due to reverse current flow on VBUS. To  
activate the reverse current blocking, the switch must be in OFF  
state (ON pins inactivated) so that no current flows from the  
output to the input. The FLAGB operation is independent of the  
reverse current blocking and does not report a fault condition if  
this feature is activated.  
I
LIM(MIN) x tBLANK(MIN)  
(1)  
COUT(MAX)  
=
VIN  
For example, in a 5V application, COUT(MAX) can be determined  
as:  
1.1A x 5ms  
(2)  
COUT(MAX)(IN = 5V)  
=
=
5
1.1mF  
Thermal Shutdown  
The thermal shutdown protects the device from internally or  
externally generated excessive temperatures. Each switch has  
an individual thermal shutdown protection function and operates  
independently as adjacent switch temperatures increase above  
140°C. If one switch is in normal operation and shutdown  
protection of second switch is activated, the first channel  
continues to operate if the affected channel's heat stays  
confined. The over-temperature in one channel can shut down  
both switches due to rapidly generated excessive load currents  
resulting in very high power dissipation. Generally, a thermally  
improved board layout can provide heat sinking and allow heat  
to stay confined and not affect the second switch operation.  
During an over-temperature condition, the FLAGB is pulled  
LOW and the affected switch is turned off. If the temperature of  
the die drops below the threshold temperature, the switch  
© 2009 Fairchild Semiconductor Corporation  
FPF2300/02/03 • Rev. 1.1.3  
www.fairchildsemi.com  
12  
Application Information  
10KΩ  
10KΩ  
Downstream  
USB Port  
33μF  
33μF  
FLAGB(A)  
FLAGB(B)  
Downstream  
USB Port  
Host  
5V  
IN  
FPF2300/2/3  
OFF ON  
OFF ON  
ONA  
OUTA  
1μF  
Downstream  
USB Port  
ONB  
OUTB  
GND  
33μF  
33μF  
Downstream  
USB Port  
Figure 38. Self Powered 4-Port USB Hub Using a Single FPF230X  
FPF230X is designed to simplify USB port power design based  
on self-powering USB host/hub applications. A self-powering  
USB port is powered by a local 5V power supply, not by an  
upstream port. Each port should supply at least 500mA to each  
downstream function based on USB 2.0 specification. Imple-  
mentation can depend on the number of USB ports and current  
capability per port required in actual power designs. FPF230X  
has 1.1A minimum current limit per output, which can cover two  
ports, as shown in Figure 38. Four USB ports can be imple-  
mented with a single FPF230X part and current limiting is pro-  
vided based on a two-port basis for a cost-effective solution.  
10KΩ  
10KΩ  
FLAGB(A)  
Downstream  
USB Port  
Host  
5V  
IN  
FLAGB(B)  
33μF  
33μF  
FPF2300/2/3  
OFF ON  
OFF ON  
ONA  
OUTA  
1μF  
Downstream  
USB Port  
ONB  
OUTB  
GND  
10KΩ  
10KΩ  
FLAGB(A)  
FLAGB(B)  
Downstream  
USB Port  
IN  
33μF  
33μF  
FPF2300/2/3  
OFF ON  
OFF ON  
ONA  
OUTA  
1μF  
Downstream  
USB Port  
ONB  
OUTB  
GND  
Figure 39. Individual Port Power Management for Self-Powered 4-Port USB Hub  
In Figure 39, each USB port is connected with each output.  
Four USB ports can be implemented with two FPF230X parts.  
Current limiting and control are provided based on a single port.  
Current capability per port has more headroom; up to a mini-  
mum of 1.1A per port.  
© 2009 Fairchild Semiconductor Corporation  
FPF2300/02/03 • Rev. 1.1.3  
www.fairchildsemi.com  
13  
10KΩ  
10KΩ  
FLAGB(A)  
FLAGB(B)  
Host  
5V  
IN  
FPF2300/2/3  
OFF ON  
OFF ON  
ONA  
OUTA  
1μF  
Downstream  
USB Port  
ONB  
OUTB  
GND  
33μF  
Figure 40. Self-Powered USB Port for High Current Demand  
High current, over 2A, is sometimes required to supply enough  
power to downstream functions. As shown in Figure 40, a 2.2A  
minimum load current can be achieved by tying dual outputs  
together.  
Power Dissipation  
During normal operation as a switch, the power dissipation of  
the device is small and has little effect on the operating  
temperature of the part. The maximum power dissipation for  
both switches while the switch is in normal operation occurs just  
before both channels enter into current limit. This may be  
calculated using the formula:  
If the part goes into current limit, the maximum power  
dissipation occurs when the output of switch is shorted to  
ground. For the FPF2300 the power dissipation scales with the  
auto-restart time, tRSTRT, and the over-current blanking time,  
t
BLANK. In this case, the maximum power dissipated for the  
FPF2300 is::  
PD_MAX(Normal Operation) = 2 x (ILIM(MIN))2 x RON(MAX)  
tBLANK  
(3)  
PD_MAX(CurrentLimit) =2 x  
x IN(MAX) x ILIM(MAX)  
tBLANK + tRSTRT  
For example, for a 5V application, maximum normal operation  
power loss while both switches delivering output current up to  
1.1A, can be calculated as:  
(7)  
which results in:  
P
D_MAX(Normal Operation)(IN = 5V) = 2 x (1.1)2 x 0.14  
10  
(4)  
PD_MAX(CurrentLimit) = 2 x  
x 5.5 x 1.5 = 321mW  
(8)  
10 + 504  
338mW  
=
Note that this is below the maximum package power dissipation  
and the thermal shutdown feature protection provides additional  
safety to protect the part from damage due to excessive  
heating. The junction temperature is only able to increase to the  
thermal shutdown threshold. Once this temperature has been  
reached, toggling ON has no affect until the junction  
temperature drops below the thermal shutdown exit  
temperature. For the FPF2303, a short on both outputs causes  
both switches to operate in a constant current state and  
dissipate a worst-case power of:  
The maximum junction temperature should be limited to 125°C  
under normal operation. Junction temperature can be calcu-  
lated using the formula below:  
(5)  
TJ = PD x RθJA + TA  
where:  
TJ is junction temperature;  
P
D is power dissipation across the switch;  
P
MAX = 2 x IN(MAX) x ILIM(MAX) = 2 x 5.5 x1.5 = 16.5 W  
(9)  
RθJA is thermal resistance junction to ambient of the package;  
TA is ambient temperature.  
As both FPF2303 outputs are connected to GND.  
For the example, TJ(MAX)(Normal operation) for an SO8 package  
with TA=25°C while both switches are delivering up to 1.1A is  
calculated as:  
This power dissipation is significant and activates both thermal  
shutdown blocks and the part can cycle in and out of thermal  
shutdown as long as the ON pin is activated (pulled LOW) and  
the output short is present.  
TJ(MAX)(NormalOperation)  
(6)  
= PD_MAX(Normal Operation)(IN = 5V) x 125 + 25  
= 78.4°C  
© 2009 Fairchild Semiconductor Corporation  
FPF2300/02/03 • Rev. 1.1.3  
www.fairchildsemi.com  
14  
PCB Layout Recommendations  
For the best performance, all traces should be as short as  
possible. To be most effective, the input and output capacitors  
should be placed close to the device to minimize the effects that  
parasitic trace inductances may have on normal and short-  
circuit operation. Using wide traces for IN, OUTs, and GND pins  
helps minimize parasitic electrical effects and the case-to-  
ambient thermal impedance.  
Improving Thermal Performance  
Improper layout could result in higher junction temperature and  
triggering the thermal shutdown protection feature. This concern  
is particularly significant for the FPF2303, where both channels  
operate in constant current mode in the overload conditions and  
during fault condition the outputs are shorted, resulting in large  
voltage drop across switches. In this case, power dissipation of  
the switch (PD = (VIN - VOUT) x ILIM(MAX)) could exceed the  
maximum absolute power dissipation of part.  
The following techniques improve the thermal performance of  
this family of devices. These techniques are listed in order of  
the significance of impact.  
Figure 42. Proper Layout of Output and Ground  
Copper Area  
1. Thermal performance of the load switch can be improved  
by connecting the DAP (Die Attach Pad) of MLP 3x3mm  
package to the GND plane of the PCB.  
2. Embedding two exposed through-hole vias into the DAP  
(pin 9) provides a path for heat to transfer to the back GND  
plane of the PCB. A drill size of round, 15 mils (0.4mm),  
with 1-ounce copper plating is recommended to create  
appropriate solder reflow. A smaller size hole prevents the  
solder from penetrating into the via, resulting in device lift-  
up. Similarly, a larger via hole consumes excessive solder  
and may result in voiding of the DAP.  
15mil  
25mil  
Figure 41. Two Through-Hole Open Vias Embedded  
in DAP  
3. The IN, OUTs, and GND pins dissipate most of the heat  
generated during a high load current condition. Figure 42  
illustrates a proper layout for devices in MLP 3x3mm  
packages. IN, OUTs, and GND pins are connected to  
adequate copper so heat may be transferred as efficiently  
as possible out of the device. The low-power FLAGB and  
ON pin traces may be laid out diagonally from the device to  
maximize the area available to the ground pad. Placing the  
input and output capacitors as close to the device as  
possible also contributes to heat dissipation, particularly  
during high load currents.  
© 2009 Fairchild Semiconductor Corporation  
FPF2300/02/03 • Rev. 1.1.3  
www.fairchildsemi.com  
15  
FPF230X Evaluation Board  
The FPF230X evaluation board has components and circuitry to  
demonstrate FPF2300/2/3 load switch functions and features,  
accommodating both the MLP 3x3mm and SO8 packages. The  
state of the each channel can be configured using J1 and J2  
jumpers. In addition, both channels can be controlled by ONA  
and ONB test pints. Thermal performance of the board is  
improved using techniques in the layout recommendations  
section. R3 and R4 resistors are used on the board to sink a  
light load current when switches are activated.  
Figure 44. Bottom and ASB Layers  
Figure 43. Top, SST and AST Layers  
(MLP 3x3mm and SO8)  
Figure 45. Zoom-In to Top Layer  
Releated Resources  
FPF2300/02/03 Evaluation Board User Guide; Power Switch for USB Applications  
© 2009 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FPF2300/02/03 • Rev. 1.1.3  
16  
2.37  
0.10 C  
3.00  
A
B
5
8
2X  
1.99  
3.30  
1.42  
3.00  
(0.65)  
PIN #1 IDENT  
0.10 C  
1
4
0.42 TYP  
TOP VIEW  
2X  
0.65 TYP  
RECOMMENDED LAND PATTERN  
0.80 MAX  
0.10 C  
0.08 C  
(0.20)  
0.05  
0.00  
C
NOTES:  
FRONT VIEW  
SEATING  
PLANE  
A. CONFORMS TO JEDEC REGISTRATION MO-229,  
VARIATION VEEC, DATED 11/2001.  
0.45  
0.20  
B. DIMENSIONS ARE IN MILLIMETERS.  
2.25MAX  
4
1
C. DIMENSIONS AND TOLERANCES PER  
ASME Y14.5M, 2009.  
PIN #1 IDENT  
D. LAND PATTERN RECOMMENDATION IS  
EXISTING INDUSTRY LAND PATTERN.  
1.30MAX  
E. DRAWING FILENAME: MKT-MLP08Drev3  
5
8
0.25  
0.35  
0.10  
0.65  
C A B  
1.95  
0.05  
C
BOTTOM VIEW  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
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coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
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