FPF2312MPX [ONSEMI]
双输出可调限流开关;
| 型号： | FPF2312MPX |
| 厂家： | 
ONSEMI |
| 描述： | 双输出可调限流开关 开关 光电二极管 |
| 文件： | 总18页 (文件大小：1051K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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May 2010
FPF2310/12/13/13L
Dual-Output Adjustable Current Limit Switch
Features
Description
1.8 to 5.5V Input Voltage Range
Typical RON = 75mΩ at IN = 5.5V
400~600mA Adjustable Current Limit
10% Current Limit Accuracy from Typical
Slew Rate Controlled
The FPF2310/12/13/13L are dual-channel load switches
of the IntelliMAX™ family. The FPF2310/12/13/13L
consist of dual, independent, current-limited, and slew
rate controlled, P-channel MOSFET power switches.
Slew rated turn-on prevents inrush current from glitching
supply rails. The input voltage range operates from 1.8V
to 5.5V to fulfill USB device supply requirements. Switch
control is accomplished by a logic input (ON) capable of
interfacing directly with low-voltage control signals.
ESD Protected, Above 4000V HBM
Independent Thermal Shutdown
UVLO
Output Discharge
For the FPF2312, if the constant-current condition
persists after 10ms, the part shuts down the switch. The
FPF2310 has an auto-restart feature that turns the
switch on again after 150ms if the ON pin is still active.
FPF2313/13L remains in constant-current mode until the
switch current falls below the current limit. For FPF2310
through FPF2313/13L, the minimum current limit is
400mA-600mA with 10% accuracy (+25°C) for each switch
to comply with USB applications in portable devices.
RoHS Compliant
Applications
Smart Phones
FPF2310M/12/13/13L series is available in a space-
saving, 8-Lead, 3x3mm MLP.
Enterprise Equipment
Peripheral USB Ports and Accessories
Related Resources
FPF2310/12/13/13L Evaluation Board User Guide;
Power Switch for USB Applications
Figure 1. 8-Lead MLP (3x3mm)
Ordering Information
Minimum Current Limit
Auto
Restart Activity
ON Pin
PartNumber Current
Limit
Blanking
Time
Mode
Package
10ms
10ms
8-Lead Molded Leadless Package
8-Lead Molded Leadless Package
FPF2310MPX 400-600mA
FPF2312MPX 400-600mA
150ms Active HIGH Restart
N/A
Active HIGH Latch Off
Constant
Active HIGH
0ms
0ms
8-Lead Molded Leadless Package
8-Lead Molded Leadless Package
FPF2313MPX 400-600mA
FPF2313LMPX 400-600mA
N/A
Current
Constant
Active LOW
N/A
Current
© 2009 Fairchild Semiconductor Corporation
FPF2310/12/13/13L • Rev. 1.1.3
www.fairchildsemi.com
Application Circuit
ISETA
ISETB
IN
FPF2310/12/13/13L*
OFF ON
OFF ON
ONA
OUTA
TO LOAD A
TO LOAD B
IN = 1.8V-5.5V
C
IN
ONB
OUTB
GND
C
C
OUTA
OUTB
*FPF2313L is active LOW
Figure 2. Typical Application
Functional Block Diagram
IN
UVLO
CONTROL
LOGIC A
ONA
CURRENT
LIMIT A
OUTA
ISETA
THERMAL
PROTECTION A
OUTPUT
DISCHARGE
ONB
CONTROL
LOGIC B
CURRENT
LIMIT B
OUTB
ISETB
THERMAL
PROTECTION B
OUTPUT
DISCHARGE
GND
Figure 3. Block Diagram
© 2009 Fairchild Semiconductor Corporation
FPF2310/12/13/13L • Rev. 1.1.3
www.fairchildsemi.com
2
Pin Configuration
ISETA
OUTA
OUTB
ISETB
8
7
6
5
1
2
3
4
GND
IN
9
ONA
ONB
MLP 3X3 8L Bottom View
Figure 4. 8-Lead MLP 3x3mm (Bottom View)
Pin Description
Pin
Name
GND
IN
Function
1
2
3
4
Ground
Supply Input: Input to the power switch and the supply voltage for the IC.
ON / OFF control input of power switch A.
ONA
ONB
ON / OFF control input of power switch B.
Current limit set input for power switch B: A resistor from ISET to ground sets the current limit for
the switch.
5
ISETB
6
7
OUTB
OUTA
Switch Output: output of the power switch B.
Switch Output: output of the power switch A.
Current limit set input for power switch A: A resistor from ISET to ground sets the current limit for
the switch.
8
9
ISETA
IC substrate, which can be connected to GND for better thermal performance. Do not connect to
other pins.
Thermal Pad
© 2009 Fairchild Semiconductor Corporation
FPF2310/12/13/13L • Rev. 1.1.3
www.fairchildsemi.com
3
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-
ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-
tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only.
Symbol Parameter
Min.
Max.
Unit
IN, OUTA, OUTB, ON to GND
-0.3
6.0
V
(1.)
0.6
P
Power Dissipation
W
°C
D
(2.)
2.2
T
Storage Temperature
-65
+150
STG
(1.)
216
Θ
Thermal Resistance, Junction-to-Ambient
°C/W
JA
(2.)
57
Human Body Model, JESD22-A114
Charged Device Model, JESD22-C101
4000
2000
V
V
ESD
Electrostatic Discharge Protection
Notes:
1. Soldered thermal pad on a two-layer PCB without vias based on JEDEC STD 51-3.
2. Soldered thermal pad on a four-layer PCB without vias connected with GND plane based on JEDEC STD51-5, 7.
Recommended Operating Range
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Symbol Parameter
Min.
1.8
Max.
5.5
Unit
V
IN
Supply Input
T
Ambient Operating Temperature
-40
+85
°C
A
© 2009 Fairchild Semiconductor Corporation
FPF2310/12/13/13L • Rev. 1.1.3
www.fairchildsemi.com
4
Electrical Characteristics
IN = 1.8 to 5.5V, T = -40 to +85°C unless otherwise noted. Typical values are at IN = 3.3V and T = 25°C.
A
A
Symbol Parameter
Basic Operation
Conditions
Min. Typ. Max. Units
V
Operating Voltage
1.8
5.5
V
IN
IN = 5.5V, I
= 0mA,
OUT
I
Quiescent Current
52.5
94.5
μA
Q
V
= 5.5V (FPF2310/2/3), V = 0V (FPF2313L)
ON
ON
IN = 5.5V, OUTA = OUTB = Short to GND,
= 0V (FPF2310/2/3), V = 5.5V (FPF2313L)
I
IN Shutdown Current
1
μA
mΩ
Ω
SD
V
ON
ON
IN = 5.5V, I
IN = 5.5V, I
= 200mA, T = 25°C
75
90
140
OUT
OUT
A
R
On Resistance
ON
= 200mA, T = -40°C to +85°C
A
IN = 3.3V, T = 25°C
A
R
Output Pull-Down Resistance
ON Input Logic High Voltage (ON)
70
PD
V
= 0V (FPF2310/2/3), V = 3.3V(FPF2313L)
ON
ON
IN = 1.8V
IN = 5.5V
IN = 1.8V
IN = 5.5V
0.8
1.4
V
V
IH
0.5
0.9
1
V
ON Input Logic Low Voltage
ON Input Leakage
V
IL
I
V
= IN or GND
ON
-1
μA
ON
Protections
IN = 3.3V, OUTA = OUTB = 3V,
= 690Ω, T = 25°C
I
Current Limit
450
500
550
mA
°C
LIM
R
SET
A
Shutdown Threshold
Return from Shutdown
Hysteresis
140
130
10
TSD
Thermal Shutdown
V
Under-Voltage Shutdown
IN Increasing
1.55 1.65
1.75
V
UVLO
Under-Voltage Shutdown
Hysteresis
V
50
mV
UVLO_HYS
Dynamic
t
Turn-On Time
R = 500Ω, C = 0.1μF
111
5
μs
μs
μs
μs
ms
ms
μs
ON
L
L
t
Turn-Off Time
R = 500Ω
L
OFF
t
OUTA, OUTB Rise Time
OUTA, OUTB Fall Time
Over-Current Blanking Time
Auto-Restart Time
R = 500Ω, C = 0.1μF
13
2
R
L
L
t
R = 500Ω
L
F
t
FPF2310, FPF2312
5
10
150
20
20
BLANK
RSTRT
t
FPF2310
75
300
t
Current Limit Response Time
IN = 3.3V, Moderate Over-Current Condition
CLR
90%
90%
OUT
ON
10%
50%
10%
t
t
F
R
50%
90%
OUT
10%
t
t
DOFF
DON
t
= t + t
t
= t + t
OFF F DOFF
ON
R
DON
Figure 5. Timing Diagram
© 2009 Fairchild Semiconductor Corporation
FPF2310/12/13/13L • Rev. 1.1.3
www.fairchildsemi.com
5
Typical Characteristics
60.00
70.00
60.00
50.00
40.00
30.00
20.00
10.00
0.00
ONA = ONB = IN
ONA = ONB = IN
SET = 698 Ohms
55.00
50.00
45.00
40.00
35.00
30.00
25.00
20.00
RSET = 698 Ohms
R
85°C
IN = 3.3V
IN = 5.5V
25°C
IN = 1.8V
-40°C
-40
-15
10
35
60
85
1.8
2.2
2.5
2.9
3.3
3.7
4.0
4.4
4.8
5.1
5.5
85
85
TJ, JUNCTION TEMPERATURE (°C)
SUPPLY VOLTAGE (V)
Figure 6. Quiescent Current vs. Supply Voltage
Figure 7. Quiescent Current vs. Temperature
2.0
2.0
IN = 5.5V
ON = OUT = 0V
SET = 698 Ohms
IN = 5.5V
ON = OUT = 0V
RSET = 698 Ohms
1.8
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
R
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-40
-15
10
35
60
-40
-15
10
35
60
85
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 8. IN Shutdown Current vs. Temperature
Figure 9. RON vs. Supply Voltage
110
85
80
75
70
65
60
ONA = ONB = 0V
SET = 698 Ohms
IOUT = 1mA
TA = 25°C
IN = 5.5V
ONA = ONB = 5.5V
R
IOUT = 200mA
TA = 25°C
R
100
SET = 698 Ohms
90
80
70
60
50
RPD
RPD
A
B
RON
B
RON
A
-40
-15
10
35
60
1.8
2.2
2.5
2.9
3.3
3.7
4.0
4.4
4.8
5.1
5.5
TJ, JUNCTION TEMPERATURE (°C)
SUPPLY VOLTAGE (V)
Figure 10. RON vs. Temperature
Figure 11. RPD vs. Supply Voltage
© 2009 Fairchild Semiconductor Corporation
FPF2310/12/13/13L • Rev. 1.1.3
www.fairchildsemi.com
6
Typical Characteristics
80
75
1.5
1.3
1.0
0.8
0.5
0.3
0.0
RSET = 698 Ohms
TA = 25°C
RPD
A
70
65
60
55
50
V
IH
RPD
B
V
IL
IN = 5.5V
ONA = ONB = 0V
RSET = 698 Ohms
IOUT = 1mA
-40
-15
10
35
60
85
1.8
2.2
2.5
2.9
3.3
3.7
4.0
4.4
4.8
5.1
5.5
TJ, JUNCTION TEMPERATURE (°C)
SUPPLY VOLTAGE (V)
Figure 12. RPD vs. Temperature
Figure 13. ON Threshold Voltage vs. Supply Voltage
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.4
IN = 5.5V
1.2
IN = 5.5V
1.0
IN = 3.3V
IN = 1.8V
IN = 3.3V
0.8
IN = 1.8V
0.6
0.4
0.2
RSET = 698 Ohms
60
RSET = 698 Ohms
60 85
0.0
-40
-40
-15
10
35
85
-15
10
35
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 14. ON High Voltage vs. Temperature
Figure 15. ON Low Voltage vs. Temperature
500
500
IN = 3.3V
OUTA = OUTB = 3V
ONA = ONB = 3.3V
RSET = 698 Ohms
TA = 25°C
498
496
494
492
490
488
486
484
482
480
RSET = 698 Ohms
495
490
485
480
ILIM(Typ)B
ILIM(Typ)A
ILIM(Typ)B
ILIM(Typ)A
-40
-15
10
35
60
85
1.8
2.2
2.5
2.9
3.3
3.7
4.0
4.4
4.8
5.1
5.5
TJ, JUNCTION TEMPERATURE (°C)
SUPPLY VOLTAGE (V)
Figure 16. Current Limit vs. Supply Voltage
Figure 17. Current Limit vs. Temperature
© 2009 Fairchild Semiconductor Corporation
FPF2310/12/13/13L • Rev. 1.1.3
www.fairchildsemi.com
7
Typical Characteristics
1000
20
18
16
14
12
10
8
IN = 3.3V
RL = 500 Ohms
CL = 0.1 uF
RSET = 698 Ohms
IN = 3.3V
RL = 500 Ohms
CL = 0.1 uF
RSET = 698 Ohms
tR
tDON
100
IN = 3.3V
RL = 500 Ohms
IN = 3.3V
RL = 500 Ohms
10
6
tDOFF
RSET = 698 Ohms
RSET = 698 Ohms
4
tF
2
1
0
-40
-15
10
35
60
85
-40
-15
10
35
60
85
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 18. tDON / tDOFF vs. Temperature
Figure 19. tRISE / tFALL vs. Temperature
12.5
12.0
11.5
11.0
10.5
10.0
9.5
200
190
180
170
160
150
140
130
120
110
100
FPF2310/12
IN = 3.3V
FPF2310
IN = 3.3V
ONA = ONB = 3.3V
SET = 698 Ohms
ONA = ONB = 3.3V
SET = 698 Ohms
R
R
OUTA
OUTB
OUTA
OUTB
9.0
8.5
-40
-15
10
35
60
85
-40
-15
10
35
60
85
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 20. tBLANK vs. Temperature
Figure 21. tRSTRT vs. Temperature
IN
IN
5V/DIV
5V/DIV
IN = 5V
ON = 3.3V
C
C
= 10μF
ON
2V/DIV
ON
2V/DIV
IN
= 0.1μF
IN = 5V
OUT
R = 500Ω
ON = 3.3V
L
I
OUT
R
= 680Ω
C
= 0.1μF
SET
OUT
50mA/DIV
R = 500Ω
L
R
= 680Ω
OUT
OUT
SET
5V/DIV
5V/DIV
200μs/DIV
200μs/DIV
Figure 22. tON Response
Figure 23. tOFF Response
© 2009 Fairchild Semiconductor Corporation
FPF2310/12/13/13L • Rev. 1.1.3
www.fairchildsemi.com
8
Typical Characteristics
IN
IN
5V/DIV
5V/DIV
IN = 5V
ON = 3.3
IN = 5V
ON = 3.3
ON
2V/DIV
ON
2V/DIV
C
C
= 10μF
C
C
= 10μF
IN
IN
= 10μF
= 10μF
OUT
OUT
I
I
R = 3.3Ω
R = 3.3Ω
OUT
OUT
L
L
500mA/DIV
500mA/DIV
R
= 680Ω
R
= 680Ω
SET
SET
t
BLANK
OUT
OUT
5V/DIV
5V/DIV
4ms/DIV
40ms/DIV
Figure 24. tBLANK Response (FPF2310/12)
Figure 25. tRSTRT Response (FPF2310)
IN
IN
5V/DIV
5V/DIV
IN = 5V
ON = 3.3
ON
2V/DIV
ON
2V/DIV
IN = 5V
ON = 3.3V
C
= 10μF
IN
C
= 47μF
OUT
R = 10Ω
L
I
OUT
R
= 680Ω
C
= 100μF
SET
OUT
500mA/DIV
OUT
5V/DIV
C
= 47μF
OUT
5V/DIV
OUT
R = 10Ω
L
C
= 220μF
C
= 470μF
OUT
OUT
R
= 680Ω
SET
1ms/DIV
200μs/DIV
Figure 27. Output Voltage Rise Time with
Various Load Capacitor
Figure 26. Current Limit Response with 47μF
IN
5V/DIV
IN
ON
5V/DIV
2V/DIV
ON
2V/DIV
I
C
C
= 470μF
= 220μF
OUT
OUT
OUT
500mA/DIV
C
= 470μF
C
C
= 100μF
= 47μF
OUT
OUT
OUT
IN = 5V
ON = 3.3
IN = 5V
ON = 3.3
C
C
= 220μF
= 100μF
OUT
OUT
R = 10Ω
R = 10Ω
I
L
L
OUT
I
OUT
R
= 680Ω
500mA/DIV
R
= 680Ω
SET
SET
500mA/DIV
C
= 47μF
OUT
8μs/DIV
40μs/DIV
Figure 28. Output Current Inrush at Startup with
Various Load Capacitors
Figure 29. Output Current Inrush at Startup with
Various Load Capacitors
© 2009 Fairchild Semiconductor Corporation
FPF2310/12/13/13L • Rev. 1.1.3
www.fairchildsemi.com
9
Typical Characteristics
IN
IN
5V/DIV
5V/DIV
IN = 5V
ON = 3.3
IN = 5V
C
C
= 100μF
= 100μF
OUTA
OUTB
ON
2V/DIV
ON
2V/DIV
C
C
= 150μF
IN
= 47μF
OUT
C = 150μF
L
R
R
= R = 1Ω
LB
LA
OUTA
500mV/DIV
I
R = 10Ω
OUT
L
= 680Ω
SET
2A/DIV
R
= 680Ω
SET
OUTB
OUT
500mV/DIV
5V/DIV
400μs/DIV
400μs/DIV
Figure 30. Current Limit Response Time Both
Channels are in OC
Figure 31. Inrush Response During Capacitive Load
Hot Plug-In Event
IN
5V/DIV
IN = 5V
ON
2V/DIV
C
C
= 150μF
IN
= 100μF
OUT
C = 47μF
L
R = 10Ω
I
L
OUT
R
= 680Ω
SET
2A/DIV
OUT
5V/DIV
400μs/DIV
Figure 32. Inrush Response During Capacitive and
Resistive Load Hot Plug-In Event
© 2009 Fairchild Semiconductor Corporation
FPF2310/12/13/13L • Rev. 1.1.3
www.fairchildsemi.com
10
Description of Operation
The FPF2310/2/3/3L are dual-output current-limit switches
designed to meet notebook computer, peripheral USB port, and
point-of-load (POL) application power requirements. Dual-output
current can be used where two USB ports are powered by hosts
or self-powered hubs. The FPF231X family offers control and
protection while providing optimum operation current for safe
design practices. The core of each switch is a 75mΩ (IN = 5.5V)
P-channel MOSFET and a controller capable of functioning over
an input operating range of 1.8 to 5.5V. The FPF231X offers
current limiting, UVLO (under-voltage lockout), and thermal
shutdown protection in each switch. In the event of an over-
current condition, the load switch limits the load to current limit
value. The current limit value for each switch can be adjusted
through the ISET pins. 400mA-600mA is adjustable for the
FPF2310 through FPF2313. The minimum current limit is
400mA-600mA with 10% accuracy at +25°C with minimum
variation over temperature.
ON
VIN
VOUT
ILOAD
RL*ILMIT
tBLANK
tRSTRT
ILIMIT
Over
current
condtion
On/Off Control
Figure 33. FPF2310 Performance While Entering into
an Over-Current Condition.
The ON pin is active HIGH for FPF2310/2/3 and controls the
state of the switch. Pulling the ON pin continuous to HIGH holds
the switch in ON state. The switch moves into the OFF state
when the ON pin is pulled LOW or if a fault is encountered.
FPF2313L is active LOW and performs in reverse order. For all
Note:
3.
An over-current condition signal loads the output with a
heavy load current larger than I value.
LIM
versions, an under-voltage on input voltage or
a junction
temperature in excess of 140°C overrides the ON control to turn
off the switch. In addition, excessive currents cause the switch to
turn off in the FPF2310 and FPF2312 after 10ms blanking time.
The FPF2310 has an auto-restart feature that automatically turns
the switch ON again after 150ms. For the FPF2312, the ON pin
must be toggled to turn on the switch again. The FPF2313 and
FPF2313L do not turn off in response to an over-current
condition, but remain operating in a constant-current mode as
long as ON is enabled and the thermal shutdown or UVLO is not
activated. The ON pin does not have a pull-down or pull-up
resistor and should not be left floating.
ON
VIN
wn
do
VOUT
ermal Shut
h
T
Current Limiting
De
v
ic
ILOAD
e
C
o
The current limit ensures that the current through the switch
doesn't exceed a maximum value, while not limiting at less than a
minimum value. FPF231X family has dual-output load switches in
one package. The current limit of each switch is adjustable
through the an external resistor connected to the ISET pin. The
current limit range is from 400mA to 600mA with 10% current limit
tolerance.
ols O
ff
ILIMIT
Over
current
condtion
Figure 34. FPF2313 Performance While Entering into
an Over-Current Condition
The FPF2310 and FPF2312 have a blanking time of 10ms
(t
= 10ms) during which the switch acts as a constant
BLANK(Typ)
Note:
current source.
4
An over-current condition signal loads the output with a
heavy load current larger than I value.
If the over-current condition persists beyond the blanking time,
the FPF2310 latches off and shuts the switch off. If the ON pin is
kept active, an auto-restart feature releases the switch and turns
LIM
the switch on again after a 150ms auto-restart time (t
). If
RSTRT
the over-current condition persists beyond the blanking time, the
FPF2312 has a latch-off feature that shuts the switch off. The
switch is kept off until the ON pin is toggled. The FPF2313/3L
have no current-limit blanking period, so remain in a constant-
current state until the ON pin of the affected switch is deactivated
or the thermal shutdown turns off the switch.
© 2009 Fairchild Semiconductor Corporation
FPF2310/12/13/13L • Rev. 1.1.3
www.fairchildsemi.com
11
Table 1: R
Selection Guide
Output Discharge Resistor
SET
The FPF2310/2/3 and FPF2313L family contains an 70Ω on-
chip output pull-down resistor for quick output discharge when
the switch is turned off. This features become more attractive
when an application requires a large output capacitor to be
discharged when switch turns off. However, the OUT pin should
not be connected directly to the battery source due to the
discharge mechanism of the load switch.
Minimum Typical
Maximum
Current
Limit [mA]
RSET
Current
Limit
Current
Limit
Tolerance
(%)
[Ω]
[mA]
[mA]
511
536
562
590
620
649
681
732
775
607
578
552
526
500
478
455
424
400
674
643
613
584
556
531
506
471
445
742
707
674
642
611
584
556
518
489
10
10
10
10
10
10
10
10
10
Thermal Shutdown
The thermal shutdown protects the device from internally or
externally generated excessive temperatures. Each switch has
an individual thermal shutdown protection function and operates
independently as adjacent switch temperature increases above
140°C. If one switch is in normal operation and shutdown
protection of second switch is activated, the first channel
continues to operate if the affected channel's heat stays
confined. The over-temperature in one channel can shut down
both switches due to rapidly generated excessive load currents
resulting in very high power dissipation. Generally, a thermally
improved board layout can provide heat sinking and allow heat
to stay confined and not affect operation of the second switch.
During an over-temperature condition, the affected switch is
turned off. If the temperature of the die drops below the
threshold temperature, the switch automatically turns on again.
To avoid unwanted thermal oscillations, a 10°C (typical) thermal
hysteresis is implemented between thermal shutdown entry and
exit temperatures.
If output of both switches are connected together and an
excessive load current activates thermal protection of both, the
controller can shutdown the switches after both outputs go LOW
and turn on both channels again. This provides a simultaneous
switch turn on. Thermal protection is for device protection and
should not be used as regular application operation.
R
(Ω)
SET
Figure 35. ILIM vs. RSET
Under-Voltage Lockout (UVLO)
The under-voltage lockout feature turns off the switch if the
input voltage drops below the under-voltage lockout threshold.
With the ON pin is active (ON pin is pulled LOW), the input
voltage rising above the under-voltage lockout threshold causes
a controlled turn-on of the switch and limits current overshoot.
The device detects the UVLO condition when input voltage goes
below UVLO voltage, but remains above 1.3V (typical).
ON
device wake-up
IN
UVLO THRESHOLD
RISE
TIME
90% V
OUT
OUT
10% V
OUT
I
LOAD
I
LIMIT
Figure 36. Under-Voltage Lockout (UVLO)
© 2009 Fairchild Semiconductor Corporation
FPF2310/12/13/13L • Rev. 1.1.3
www.fairchildsemi.com
12
Application Information
ISETA
ISETB
Downstream
USB Port
IN
Host (5V)
1µF
FPF2310/2/3
GND
ONA
ONA
OFF ON
33µF
33µF
OUTA
OUTB
Downstream
USB Port
OFF ON
Figure 37. Typical Application
Power Dissipation
Input Capacitor
To limit the voltage drop on the input supply caused by transient
During normal operation as a switch, the power dissipation of
device is small and has little effect on the operating temperature
of the part. The maximum power dissipation for both switches,
while the switch is in normal operation, occurs just before both
inrush currents when the switch is turned on into discharged
load capacitors or a short-circuit; an input capacitor, C , is
IN
recommended between IN and GND. The FPF2310/2/3/3L
features a fast current limit response time of 20μs. An inrush
current (also known as surge current) could occur during the
current limit response time while the switch is responding to an
over-current condition caused by large output capacitors. A
10μF ceramic capacitor, C , is required to provide charges for
the inrush current and prevent input voltage drop at the turn on.
Higher values of C to further reduce the voltage drop.
channels enter into current limit. This may be calculated using:
2
P
= 2 x (I
) x R
D_MAX(NormalOperation)
LIM(MIN)
ON(MAX)
(4)
For example, for a 5V application maximum normal operation
power loss while both switches delivering output current up to
IN
500mA (I
= 500mA) can be calculated as:
LIM(MIN)
IN
2
P
= 2 x (0.5) x 0.14
D_MAX(NormalOperation)(IN = 5V)
(5)
Output Capacitor
A 0.1μF to 1μF capacitor, C
70mW
=
, should be placed between the
OUT
OUT and GND pins. This capacitor prevents parasitic board
inductances from forcing output voltage below GND when the
switch turns off. This capacitor should have a low dissipation
factor. An X7R MLCC (Multilayer Ceramic Chip) capacitors is
recommended.
The maximum junction temperature should be limited to 125°C
under normal operation. Junction temperature can be
calculated using:
(6)
T = P x R
+ T
A
J
D
θJA
For the FPF2310 and FPF2312, the total output capacitance
where:
T is junction temperature;
needs to be kept below a maximum value, C
, to
OUT(MAX)
J
prevent the part from registering an over-current condition
beyond the blanking time and shutdown. The maximum output
capacitance for a giving input voltage can be determined from
the following:
P
is power dissipation across the switch
D
R
is thermal resistance, junction-to-ambient; and T
θJA
A
is ambient temperature
I
x t
LIM(MIN)
BLANK(MIN)
(2)
For example,
T
for an MLP 3x3mm
C
=
J(MAX)(Normal operation)
OUT(MAX)
V
package with T =25°C while both switches are delivering up to
IN
A
1.1A, is calculated as:
For example, in a 5V application and I
= 500mA using
(3)
T
LIM(MIN)
J(MAX)(NormalOperation)
R
= 620Ω, C
can be determine as:
SET
OUT(MAX)
= P
x 216 + 25
D_MAX(Normal Operation)(IN = 5V)
0.5A x 5ms
(7)
= 40.12°C
C
=
OUT(MAX)(IN = 5V)
5
500μF
=
© 2009 Fairchild Semiconductor Corporation
FPF2310/12/13/13L • Rev. 1.1.3
www.fairchildsemi.com
13
ISETA
ISETB
IN
Host (5V)
1µF
FPF2310/2/3
GND
ONA
ONA
OFF ON
OFF ON
OUTA
OUTB
Downstream
USB Port
33µF
Figure 38. Self-Power USB for High Current Demand
If the part goes into current limit, the maximum power
dissipation occurs when the output of switch is shorted to
ground. For the FPF2310, the power dissipation scales with the
PCB Layout Recommendations
For the best performance, all traces should be as short as
possible. To be most effective, the input and output capacitors
should be placed close to the device to minimize the effects that
parasitic trace inductances may have on normal and short-
circuit operation. Using wide traces for IN, OUTs, and GND pins
helps minimize parasitic electrical effects along with minimizing
the case-to-ambient thermal impedance.
auto-restart time, t
, and the over-current blanking time,
RSTRT
t
. In this case, the maximum power dissipated for the
BLANK
FPF2310 is:
t
BLANK
P
= 2 x
x IN
x I
(MAX) LIM(MAX)
D_MAX(CurrentLimit)
t
+ t
RSTRT
BLANK
(8)
Improving Thermal Performance of the
FPF231X Family of Devices
Which results in:
10
Improper layout could result in higher junction temperature and
triggering the thermal shutdown protection feature. This concern
applies particularly to the FPF2313 and FPF2313L, where both
channels operate in constant-current mode in the overload
conditions and; during fault condition, the outputs are shorted,
resulting to large voltage drop across switches. In this case,
P
= 2 x
x 5.5 x 0.74 = 508mW
(9)
D_MAX(CurrentLimit)
10 + 150
Note that this is below the maximum package power dissipation
and the thermal shutdown feature protection provides additional
safety to protect the part from damage due to excessive
heating. The junction temperature is only able to increase to the
thermal shutdown threshold. Once this temperature has been
reached, toggling ON has no effect until the junction
temperature drops below the thermal shutdown exit
temperature. For the FPF2313 and FPF2313L, a short on the
both outputs causes both switches to operate in a constant-
current state and dissipating a worst-case power of:
power dissipation of the switch (P = (V - V
) x I
)
D
IN
OUT
LIM(MAX)
could exceed the maximum absolute power dissipation of part.
The following techniques improve the thermal performance of
this family of devices. These techniques are listed in order of
the significance of impact.
1. Thermal performance of the load switch can be improved by
connecting the DAP (Die Attach Pad) of MLP 3x3mm
package to the GND plane of the PCB.
P
= IN
x I = 2 x 5.5 x 0.74 = 8.14W
LIM(MAX)
(10)
MAX
(MAX)
2. Embedding two exposed through-hole vias into the DAP (pin
9) provides a path for heat to transfer to the back GND plane
of the PCB. A drill size of round, 15 mils (0.4mm) with 1-
ounce copper plating is recommended to create appropriate
solder reflow. A smaller size hole prevents the solder from
penetrating into the via, resulting in device lift-up. Similarly, a
larger via-hole consumes excessive solder and may result in
voiding the DAP.
As both FPF2313/3L outputs are connected to GND.
This power dissipation is significant and activates both thermal
shutdown blocks. The part cycles in and out of thermal
shutdown as long as the ON pin is activated (pulled LOW) and
the output short is present.
If high current of over 1A is required to supply enough power to
a downstream function, dual outputs can be tied together as
shown in Figure 38.
© 2009 Fairchild Semiconductor Corporation
FPF2310/12/13/13L • Rev. 1.1.3
www.fairchildsemi.com
14
15mil
25mil
Figure 39. Two Through-Hole Open Vias
Embedded in DAP
3. The IN, OUTs, and GND pins dissipate most of the heat
generated during a high-load current condition. The layout
suggested in Figure 39 illustrates a proper layout for devices
in MLP 3x3mm packages. IN, OUTs, and GND pins are
connected to adequate copper so that heat may be
transferred as efficiently as possible out of the device. The
low-power FLAGB and ON pins’ traces may be laid-out
diagonally from the device to maximize the area available to
the ground pad. Placing the input and output capacitors as
close to the device as possible also contributes to heat
dissipation, particularly during high load currents.
Figure 41. Top, SST, and AST Layers
(MLP 3x3mm Package)
Figure 42. Zoom In to Top Layer
Figure 40. Proper Layout of Output and
Ground Copper Area
FPF231X Evaluation Board
FPF231X evaluation board has components and circuitry to
demonstrate FPF2310/2/3/3L load switches functions and
features accommodating both MLP 3x3mm packages. The state
of the each channel can be configured using J1 and J2 jumpers.
In addition, both channels can be controlled by ONA and ONB
test pins. Thermal performance of the board is improved using
techniques recommended in the layout recommendations
section. R3 and R4 resistors are used on the board to sink a
light load current when switches are activated.
Figure 43. Bottom and ASB Layers
© 2009 Fairchild Semiconductor Corporation
FPF2310/12/13/13L • Rev. 1.1.3
www.fairchildsemi.com
15
2.37
0.10 C
3.00
A
B
5
8
2X
1.99
3.30
1.42
3.00
(0.65)
PIN #1 IDENT
0.10 C
1
4
0.42 TYP
TOP VIEW
2X
0.65 TYP
RECOMMENDED LAND PATTERN
0.80 MAX
0.10 C
0.08 C
(0.20)
0.05
0.00
C
NOTES:
FRONT VIEW
SEATING
PLANE
A. CONFORMS TO JEDEC REGISTRATION MO-229,
VARIATION VEEC, DATED 11/2001.
0.45
0.20
B. DIMENSIONS ARE IN MILLIMETERS.
2.25MAX
4
1
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 2009.
PIN #1 IDENT
D. LAND PATTERN RECOMMENDATION IS
EXISTING INDUSTRY LAND PATTERN.
1.30MAX
E. DRAWING FILENAME: MKT-MLP08Drev3
5
8
0.25
0.35
0.10
0.65
C A B
1.95
0.05
C
BOTTOM VIEW
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