FPF2495BUCX [ONSEMI]

28 V, Over-Voltage, Over-Current Protection Load Switch with Adjustable Current-Limit Control;
FPF2495BUCX
型号: FPF2495BUCX
厂家: ONSEMI    ONSEMI
描述:

28 V, Over-Voltage, Over-Current Protection Load Switch with Adjustable Current-Limit Control

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IntelliMAXE 28 V,  
Over-Voltage, Over-Current  
Protection Load Switch with  
Adjustable Current-Limit  
Control  
www.onsemi.com  
FPF2495B  
Description  
The FPF2495B advanced loadmanagement switch targets  
applications requiring a highly integrated solution. It disconnects  
loads powered from the DC power rail (<6 V) with stringent offstate  
current targets and high load capacitances (<100 mF). The FPF2495B  
consists of a slewrate controlled lowimpedance MOSFET switch  
(100 mW maximum) and integrated analog features. The slewrate  
controlled turnon characteristic prevents inrush current and the  
resulting excessive voltage droop on power rails. FPF2495B has  
overvoltage protection and overtemperature protection.  
The FPF2495B has a ReverseCurrent Blocking (RCB) function  
WLCSP9 1.22x1.22x0.581  
CASE 567SU  
MARKING DIAGRAM  
that obstructs unwanted reverse current from V  
to V during OFF  
OUT  
IN  
states. The exceptionally low offstate current drain (<2 mA  
maximum) facilitates compliance with standby power requirements.  
TX&K  
&.&2&Z  
The input voltage range operates from 2.5 V to 5.5 V to support a  
DC  
wide range of applications in consumer, optical, medical, storage,  
portable, and industrialdevice power management. Switch control is  
managed by a logic input (active HIGH) capable of interfacing  
directly with lowvoltage control signal / GeneralPurpose Input /  
Output (GPIO) without an external pulldown resistor.  
The device is packaged in advanced, fully “green” compliant,  
1.22 mm x 1.22 mm, WaferLevel ChipScale Package (WLCSP).  
TX  
= ON Semiconductor Logo  
= Specific Device Code  
= Lot Code  
= Numeric Date Code  
= Assembly Plant Code  
&K  
&2  
&Z  
Features  
V : 2.5 V~5.5 V  
IN  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 2 of  
this data sheet.  
28 V Absolute Ratings at V  
OUT  
Current Capability: 2.8 A  
Adjustable Current Limit: 0.05 A ~ 2.5 A (Typ.)  
0.1 A~2.5 A with 10% Accuracy  
< 0.1 A with 15% Accuracy  
Applications  
Smart Phones, Tablet PCs  
Storage, DSLR, and Portable Devices  
R : Typ. 70 m& Max. 100 mat 5 V and 1 A I  
ON  
IN  
OUT  
Output OVP: Min. = 5.6 V, Typ. = 5.8 V, Max. = 6 V  
No Output Discharge During Off State  
OpenDrain OCP on FLAGB  
Thermal Shutdown  
UnderVoltage Lockout (UVLO)  
ReverseCurrent Blocking (RCB) during OFF  
Logic CMOS IO Meets JESD76 Standard for GPIO Interface and  
Related Power Supply Requirements  
ESD Protected:  
Human Body Model: >2 kV  
Charged Device Model: >2.5 kV  
IEC 6100042 Air Discharge: >15 kV  
IEC 6100042 Contact Discharge: >8 kV  
© Semiconductor Components Industries, LLC, 2012  
1
Publication Order Number:  
April, 2020 Rev. 2  
FPF2495B/D  
FPF2495B  
ORDERING INFORMATION  
Operating  
Temperature Range  
Part Number  
Package  
Packing Method  
Top Mark  
FPF2495BUCX  
40 to 85°C  
9Ball, WLCSP, 3x3 Array, 0.4 mm Pitch,  
Back Side Lamination  
Tape & Reel  
TX  
Application Diagram  
Battery  
VIO  
Rpullup  
USB  
Vin  
Vout  
Vout  
5V Boost  
Connector  
OTG  
CIN  
COUT  
Device  
ON  
IO  
OCP  
FLAGB  
FPF2495B  
GND  
ISET  
AP  
IO  
1. C and C  
capacitors recommended for improvement of device stability.  
IN  
OUT  
Figure 1. Typical Application  
Functional Block Diagram  
HV Power Device  
RCB  
VIN  
VOUT  
Current  
Limit  
OVP  
UVLO  
Control Logic  
ISET  
ON  
OCFLAGB  
Charge  
Pump  
Thermal  
Shutdown  
IntelliMAX  
FPF2495B  
GND  
Figure 2. Functional Block Diagram  
www.onsemi.com  
2
FPF2495B  
Pin Configurations  
1
2
3
2
3
1
A
B
A
B
VOUT  
VIN  
GND  
VIN  
GND  
VOUT  
VOUT  
ON  
VIN  
GND  
ISET  
VIN  
GND  
ISET  
VOUT  
ON  
OCFLAGB  
OCFLAGB  
Figure 3. Pin Assignments (Top View)  
Figure 4. Pin Assignments (Bottom View)  
PIN DESCRIPTION  
Pin #  
A3, B3  
A1, B1  
A2  
Name  
Description  
V
OUT  
Switch Output  
V
IN  
Supply Input: Input to the power switch  
Ground (true device ground)  
GND  
ON  
B2  
C3  
ON/OFF Control Input: Active HIGH GPIO  
Logic HIGH  
Logic LOW  
Switch Enable  
Switch Disable  
compatible  
C1  
C2  
OC  
Fault Output: Active LOW, opendrain output that indicates an input over current.  
FLAGB  
External pullup resistor to V is required.  
CC  
I
Current Limit Set Input: A resistor from ISET to ground sets the current limit for the switch.  
SET  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
Parameters  
Min.  
0.3  
0.3  
Max.  
28.0  
6.0  
Unit  
V
PIN  
V
OUT  
to GND, V  
to V  
IN  
V
OUT  
ON V FLAGB, I to GND  
SET  
,
IN,  
I
Maximum Continuous Switch Current (Note 1)  
2.8  
A
W
SW  
t
Total Power Dissipation at T = 25°C  
1.0  
PD  
A
T
Operating Junction Temperature  
Storage Junction Temperature  
40  
65  
+150  
+150  
°C  
J
T
°C  
STG  
q
Thermal Resistance, JunctiontoAmbient  
(1inch Square Pad of 2 oz. Copper)  
95  
(Note 2)  
°C/W  
JA  
110  
(Note 3)  
ESD  
Electrostatic Discharge Capability  
Human Body Model, JESD22A114  
Charged Device Model, JESD22C101  
Air Discharge (V to GND)  
2.0  
2.5  
kV  
IEC6100042 System Level  
V
V
15.0  
8.0  
IN, ON, OUT  
Contact Discharge (V  
V
V
to GND)  
IN, ON, OUT  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
1. Maximum Junction Temperature = 85°C.  
www.onsemi.com  
3
 
FPF2495B  
2. Measured using 2S2P JEDEC std. PCB.  
3. Measured using 2S2P JEDEC PCB cold plate method.  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Parameters  
Min.  
2.5  
Max.  
5.5  
Unit  
V
V
IN  
Supply Voltage  
Ambient Operating Temperature  
T
A
40  
85  
°C  
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond  
the Recommended Operating Ranges limits may affect device reliability.  
ELECTRICAL CHARACTERISTICS  
Unless otherwise noted; V = 2.5 to 5.5 V, T = 40 to +85°C; typical values are at V = 5 V and T = 25°C.  
IN  
A
IN  
A
Symbol  
Parameters  
Condition  
Min.  
Typ.  
Max.  
Unit  
BASIC OPERATION  
V
Input Voltage  
2.5  
5.5  
2
V
IN  
Q(OFF)  
I
Off Supply Current  
Shutdown Current  
Quiescent Current  
On Resistance  
V
V
= GND, V  
= Open  
OUT  
1
mA  
mA  
mA  
mW  
ON  
I
= 5.5 V, V  
= 0 V, V = GND  
0.1  
65  
70  
75  
70  
4.0  
100  
100  
105  
SD(OFF)  
IN  
OUT  
ON  
I
Q
I
= 0 mA  
= 5.0 V, I  
= 3.7 V, I  
= 5.0 V, I  
OUT  
R
V
IN  
V
IN  
V
IN  
V
IN  
V
IN  
V
IN  
V
IN  
V
IN  
= 1 A  
ON  
OUT  
OUT  
OUT  
= 1 A  
(6)  
R
On Resistance  
= 1.5 A  
mW  
V
ON  
V
IH  
ON Input Logic HIGH Voltage  
ON Input Logic LOW Voltage  
= 2.5 V to 5.5 V  
= 2.5 V to 5.5 V  
1.15  
V
0.65  
0.2  
0.30  
1
V
IL  
IL_FLAG  
V
FLAGB Output Logic LOW  
Voltage  
V
= 5 V, I  
= 10 mA  
0.1  
SINK  
= 2.5 V, I  
= 10 mA  
0.15  
SINK  
I
FLAGB Output HIGH Leakage  
Current  
= 5 V, Switch On  
mA  
FLAGB_LK  
I
On Input Leakage  
V
V
= 0 V to V  
IN  
1.0  
mA  
ON  
ON  
R
PullDown Resistance at ON  
Pin  
= 2.5~5.5 V, V = HIGH,  
T = 40 to 85°C  
14  
MW  
ON_PD  
IN  
ON  
A
OVERVOLTAGE PROTECTION  
V
Output OVP Lockout  
V
V
V
V
Rising Threshold  
5.50  
1
5.80  
5.50  
0.3  
6.00  
OV_TRIP  
OUT  
OUT  
OUT  
Falling Threshold  
Falling Threshold  
OUT  
Output OVP Hysteresis  
V
HYS  
(6)  
(6)  
t
OVP Response Time  
I
= 0.5 A, C = 1 mF, T = 25°C,  
4
ms  
OVP  
OUT  
L
A
V
from 5.5 V to 6.0 V  
OUT  
OVERCURRENT PROTECTION  
I
Current Limit  
mA  
V
V
= 5 V, R  
OUT  
(Note 4)  
= 20000 W,  
42  
50  
58  
LIM  
IN  
SET  
= 1.68 to 5 V with 15% Accuracy  
V
V
= 5 V, R  
OUT  
(Note 4)  
= 2100 W,  
450  
900  
500  
550  
1100  
IN  
SET  
= 1.68 to 5 V with 10% Accuracy  
V
V
= 5 V, R  
= 1070 W,  
1000  
IN  
OUT  
SET  
= 1.68 to 5 V with 10% Accuracy  
(Note 4)  
V
UnderVoltage Lockout  
V
V
V
Increasing  
2.4  
2.2  
200  
7
UVLO  
IN  
IN  
Decreasing  
V
UVLO Hysteresis  
RCB Current  
mV  
mA  
ms  
UVLO_HYS  
I
V
ON  
= 0 V, V  
= 5.5 V,  
RCB  
OUT  
t
Hard OverCurrent Response  
Time  
Moderate OverCurrent Condition,  
I I , V = 0 V  
OUT  
6
HOCP  
LIM OUT  
www.onsemi.com  
4
FPF2495B  
ELECTRICAL CHARACTERISTICS (continued)  
Unless otherwise noted; V = 2.5 to 5.5 V, T = 40 to +85°C; typical values are at V = 5 V and T = 25°C.  
IN  
A
IN  
A
Symbol  
Parameters  
Condition  
Min.  
Typ.  
Max.  
Unit  
OVERCURRENT PROTECTION  
t
OverCurrent Response Time  
Moderate OverCurrent Condition,  
I V  
7
8
ms  
ms  
°C  
OCP  
I
V
OUT  
LIM OUT  
IN  
t
OverCurrent Flag Response  
Time  
When OverCurrent Occurs to Flag  
Pulling LOW  
OC_FLAG  
TSD  
Thermal Shutdown  
Shutdown Threshold  
Return from Shutdown  
Hysteresis  
150  
130  
20  
DYNAMIC CHARACTERISTICS  
TurnOn Delay (Note 5, 6)  
Rise Time (Note 5, 6)  
V
A
= 5 V, R = 100 W, C = 1 mF,  
t
0.67  
0.69  
1.36  
0.01  
0.22  
0.23  
0.65  
0.65  
1.3  
ms  
ms  
ms  
ms  
ms  
ms  
ms  
ms  
ms  
ms  
IN  
L
L
DON  
T = 25°C, R  
= 2040 W  
SET  
t
R
V
OUT  
t
TurnOn Time (Note 5, 7)  
TurnOff Delay (Note 6, 5)  
ON  
t
DOFF  
t
F
V
OUT  
Fall Time (Note 6, 5)  
t
TurnOff Time (Note 8, 5)  
TurnOn Delay (Note 6, 9)  
OFF  
V
IN  
= 5 V, R = 3.8 W, C = 10 mF,  
t
0.78  
0.82  
1.6  
L
L
DON  
T = 40 to 85°C, R  
= 634 Ω  
A
SET  
t
R
V
OUT  
Rise Time (Note 6, 9)  
t
TurnOn Time (Note 7, 9)  
TurnOff Delay (Note 6, 9)  
VOUT Fall Time (Note 6, 9)  
TurnOff Time (Note 8, 9)  
ON  
t
4
10  
DOFF  
t
F
76  
120  
130  
ms  
t
80  
ms  
OFF  
4. Characterization based on 1% tolerance resistor.  
5. This parameter is guaranteed by design and characterization; not production tested.  
6. t  
/t  
/t /t are defined in Figure 5 below.  
DON DOFF  
R
F
.
7. t = t + t  
ON  
OFF  
R
F
DON  
8. t  
= t + t  
.
DOFF  
9. This parameter is guaranteed by design.  
TIMING DIAGRAM  
90%  
where:  
VON  
t
t
t
t
= Delay On Time  
DON  
10%  
= V  
Rise Time  
R
OUT  
= TurnOn Time  
ON  
DOFF  
= Delay Off Time  
Fall Time  
OUT  
t = V  
F
t
= Turn Off Time  
OFF  
90%  
90%  
VOUT  
10%  
10%  
tdON  
tR  
tdOFF  
tF  
tON  
tOFF  
Figure 5. Timing Diagram  
www.onsemi.com  
5
 
FPF2495B  
OPERATION AND APPLICATION DESCRIPTION  
Input Capacitor  
using Table 1. Resistor tolerance of 1% or less is  
recommended.  
To limit the voltage drop on the input supply caused by  
transient inrush current when the switch turns on into  
discharge load capacitor; a capacitor must be placed in  
Table 1. CURRENT LIMIT SETTINGS BY RSET (Note10)  
between the V and GND pins. A highvalue capacitor on  
IN  
Min. Current Typ. Current Max. Current  
C
IN  
can be used to reduce the voltage drop in highcurrent  
Limit (mA)  
2250  
2025  
1800  
1570  
1350  
1125  
900  
Limit (mA)  
2500  
2250  
2000  
1750  
1500  
1250  
1000  
900  
Limit (mA)  
2750  
2475  
2200  
1920  
1650  
1375  
1100  
990  
R
W
SET  
applications.  
420  
469  
528  
604  
680  
866  
Output Capacitor  
An output capacitor should be placed between the V  
and GND pins. This capacitor prevents parasitic board  
inductance from forcing V below GND when the switch  
is on. This capacitor also prevents reverse inrush current  
from creating a voltage spike that could damage the device  
OUT  
OUT  
in the case of a V  
short.  
OUT  
1070  
1200  
1330  
1500  
1740  
2100  
2320  
2550  
2940  
3400  
4020  
4990  
6490  
9530  
20000  
Fault Reporting  
Upon the detection of an overcurrent, OC_FLAGB  
signal the fault by activating LOW.  
810  
720  
800  
880  
630  
700  
770  
Current Limiting  
540  
600  
660  
The current limit ensures that the current through the  
switch does not exceed the maximum set value, while not  
limiting the minimum value. The current at which the parts  
limit is adjustable through the selection of the external  
resistor connected to the ISET pin. Information for selecting  
the resistor is found in the section below. The device acts as  
a constantcurrent source when the load draws more than the  
maximum value set by the device until thermal shutdown  
occurs. The device recovers if the die temperature drops  
below the threshold temperature.  
450  
500  
550  
405  
450  
495  
360  
400  
440  
315  
350  
385  
270  
300  
330  
225  
250  
275  
180  
200  
220  
135  
150  
165  
UnderVoltage Lockout (UVLO)  
90  
100  
110  
The undervoltage lockout turns the switch off if the input  
voltage drops below the lockout threshold. With the ON pin  
active, the input voltage rising above the UVLO threshold  
releases the lockout and enables the switch.  
42  
50  
58  
10.Table values based on 1% tolerance resistor.  
11. For 50 mA setting, tolerance is 15% with 1%.  
If current limit is not used it is OK for the I  
connected with GND, but the maximum current must be less  
than the maximum current capability of 2.8 A.  
pin to be  
SET  
ReverseCurrent Blocking  
The reversecurrent blocking feature protects the input  
source against current flow from output to input when the  
load switch is off.  
BOARD LAYOUT  
For best performance, all traces should be as short as  
possible. To be most effective, the input and output  
capacitors should be placed close to the device to minimize  
the effect that parasitic trace inductance may have on normal  
and shortcircuit operation. Using wide traces for VIN,  
VOUT, GND helps minimize parasitic electrical effects  
along with minimizing the casetoambient thermal  
impedance.  
Thermal Shutdown  
The thermal shutdown protects the die from internally or  
externally generated excessive temperature. During an  
overtemperature condition, the switch is turned off. The  
switch automatically turns on again if the temperature of the  
die drops below the threshold temperature.  
Setting Current Limit  
The current limit is set with an external resistor connected  
between the I  
and GND pins. The resistor is selected  
SET  
www.onsemi.com  
6
 
FPF2495B  
TYPICAL PERFORMANCE CHARACTERISTICS  
T = 25°C  
A
Figure 1. tON Response  
Figure 2. OVP Response (Increase VOUT to OVP  
Trip Point)  
Figure 4. tOFF Response  
Figure 3. OC_FLAGB Response Time  
(Toggle RLOAD from High to Low Resistance)  
Figure 5. tOCP Response Time  
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7
FPF2495B  
PRODUCTSPECIFIC DIMENSIONS  
Parts  
D
E
X
Y
FPF2495BUCX  
1220 mm 30 mm  
1220 mm 30 mm  
210 mm  
210 mm  
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8
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
WLCSP9 1.22x1.22x0.581  
CASE 567SU  
ISSUE A  
DATE 22 APR 2020  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON16618G  
WLCSP9 1.22x1.22x0.581  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
© Semiconductor Components Industries, LLC, 2019  
www.onsemi.com  
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, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates  
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TECHNICAL PUBLICATIONS:  
Technical Library: www.onsemi.com/design/resources/technicaldocumentation  
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