FR015L3EZ [ONSEMI]

低压侧逆向偏置/逆向极性保护器;
FR015L3EZ
型号: FR015L3EZ
厂家: ONSEMI    ONSEMI
描述:

低压侧逆向偏置/逆向极性保护器

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October 2014  
FR015L3EZ (15m, -20V)  
Low-Side Reverse Bias / Reverse Polarity Protector  
Features  
Description  
.
.
Up to -20V Reverse-Bias Protection  
Reverse bias is an increasingly common fault event that  
may be generated by user error, improperly installed  
Nano Seconds of Reverse-Bias Blocking  
Response Time  
batteries,  
automotive  
environments,  
erroneous  
connections to third-party chargers, negative “hot plug”  
transients, inductive transients, and readily available  
negatively biased rouge USB chargers.  
.
.
.
.
.
.
.
+12V 24-Hour “Withstand” Rating  
15mTypical Series Resistance at 3.0V  
18mTypical Series Resistance at 2.1V  
Integrated TVS Over Voltage Suppression  
MicroFET2x2mm Package Size  
RoHs Compliant  
Fairchild circuit protection is proud to offer a new type of  
reverse bias protection devices. The FR devices are low  
resistance, series switches that, in the event of a  
reverse bias condition, shut off power and block the  
negative voltage to help protect downstream circuits.  
The FR devices are optimized for the application to offer  
best in class reverse bias protection and voltage  
capabilities while minimizing size, series voltage drop,  
and normal operating power consumption.  
USB VBUS Compatible  
Applications  
In the event of a reverse bias application, FR015L3EZ  
devices effectively provide a full voltage block and can  
easily protect -0.3V rated silicon.  
.
.
.
.
.
.
.
.
.
.
3V+ Battery Operated Systems  
Reverse Battery Protection  
2 to 5 Cell Alkaline Battery Operated Systems  
USB 1.0, 2.0 and 3.0 Devices  
USB Charging  
From a power perspective, in normal bias, a 15mFR  
device in a 0.1A application will generate only 1.5mV of  
voltage drop or 0.15mW of power loss. In reverse bias,  
FR devices dissipate less then 10µW in a 3V reverse  
bias event. This type of performance is not possible with  
a diode solution.  
Mobile Devices  
Mobile Medical  
Benefits extend beyond the device. Due to low power  
dissipation, not only is the device small, but heat sinking  
requirements and cost can be minimized as well.  
Toys  
Any DC Barrel Jack Powered Device  
Any DC Devices subject to Negative Hot Plug or  
Inductive Transients  
Ordering Information  
Operating  
Part Number Temperature  
Range  
Top  
Mark  
Package  
Packing Method  
6-Lead, Molded Leadless Package (MLP), Dual, 3000 on Tape & Reel;  
-55°C ~ 125°C  
FR015L3EZ  
019L  
Non-JEDEC, 2mm Square, Single-Tied DAP  
7-inch Reel, 12mm Tape  
© 2012 Fairchild Semiconductor Corporation  
FR015L3EZ • Rev. A2  
www.fairchildsemi.com  
1
Diagrams  
CTL  
Power  
Switch  
Startup Diode  
Inrush Reducer  
NEG  
PO  
OV Bypass  
Protection  
Figure 1. Block Diagram  
Figure 2. Typical Schematic  
Pin Configuration  
Pin 1  
CTL  
NEG  
POS  
MicroFET 2x2 mm  
Figure 3. Pin Assignments  
Pin Definitions  
Name  
Pin  
Description  
The ground of the load circuit to be protected. Current flows into this pin during normal bias  
operation.  
POS  
4
The control pin of the device. A positive voltage on this pin with regard to NEG pin turns the  
switch on and a negative voltage turns the switch to a high impedance state.  
CTL  
3
The ground of the input power source. Current flows out of this pin during normal bias  
operation.  
NEG  
1, 2, 5, 6  
© 2012 Fairchild Semiconductor Corporation  
FR015L3EZ • Rev. A2  
www.fairchildsemi.com  
2
Absolute Maximum Ratings  
Values are at TA=25°C unless otherwise noted.  
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be  
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.  
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.  
The absolute maximum ratings are stress ratings only.  
Symbol  
Parameter  
Value  
Unit  
Steady-State Normal Operating Voltage between CTL and NEG Pins  
(VIN = V+ MAX_OP, IIN = 1.5A, Switch On)  
V+ MAX_OP  
+8  
24-Hour Normal Operating Voltage Withstand Capability between CTL and  
NEG Pins (VIN = V+ 24, IIN = 1.5A, Switch On) (1)  
V+ 24  
12  
V
Steady-State Reverse Bias Standoff Voltage between CTL and NEG Pins  
V- MAX_OP  
-20  
(VIN = V- MAX_OP  
)
IIN  
TJ  
Input Current  
VIN = 3V, Continuous(2) (see Figure 4)  
8
A
Operating Junction Temperature  
TA = 25°C(2) (see Figure 4)  
TA = 25°C(2) (see Figure 5)  
150  
2.4  
°C  
PD  
Power Dissipation  
W
A
0.9  
IDIODE_CONT Steady-State Diode Continuous Forward Current from POS to NEG  
IDIODE_PULSE Pulsed Diode Forward Current from POS to NEG (300µs Pulse)  
Human Body Model, JESD22-A114  
2
190  
2500  
2000  
5000  
7000  
300  
3000  
Charged Device Model, JESD22-C101  
Electrostatic  
Discharge  
Capability  
Contact  
Air  
ESD  
POS is shorted to CTL  
V
System Model,  
IEC61000-4-2  
Contact  
Air  
No external connection  
between POS and CTL  
Notes:  
1. The V+24 rating is NOT a survival guarantee. It is a statistically calculated survivability reference point taken on  
qualification devices, where the predicted failure rate is less than 0.01% at the specified voltage for 24 hours. It is  
intended to indicate the device’s ability to withstand transient events that exceed the recommended operating  
voltage rating. Specification is based on qualification devices tested using accelerated destructive testing at  
higher voltages, as well as production pulse testing at the V+24 level. Production device field life results may vary.  
Results are also subject to variation based on implementation, environmental considerations, and circuit  
dynamics. Systems should never be designed with the intent to normally operate at V+24 levels. Contact Fairchild  
Semiconductor for additional information.  
2. The device power dissipation and thermal resistance (Rθ) are characterized with device mounted on the following  
FR4 printed circuit boards, as shown in Figure 4 and Figure 5  
Figure 4. 1 Square Inch of 2-ounce copper  
Figure 5. Minimum Pads of 2-ounce Copper  
Thermal Characteristics  
Symbol  
RθJA  
Parameter  
Value  
60  
Unit  
Thermal Resistance, Junction to Ambient(2) (see Figure 4)  
Thermal Resistance, Junction to Ambient(2) (see Figure 5)  
°C/W  
RθJA  
150  
© 2012 Fairchild Semiconductor Corporation  
FR015L3EZ • Rev. A2  
www.fairchildsemi.com  
3
Electrical Characteristics  
Values are at TA = 25°C unless otherwise noted.  
Symbol  
Parameter  
Conditions  
Min. Typ. Max. Unit  
Positive Bias Characteristics  
VIN = +1.7V, IIN = 1.5A  
VIN = +2.1V, IIN = 1.5A  
VIN = +3V, IIN = 1.5A  
VIN = +5V, IIN = 1.5A  
22  
18  
15  
14  
30  
25  
20  
19  
RON  
Device Resistance, Switch On  
mꢀ  
VIN = +3V, IIN = 1.5A,  
TJ = 125°C  
22  
30  
Input Voltage, VIN, at which Voltage  
at POS, VPOS, Reaches a Certain  
Level at Given Current  
VON  
0.7  
1.0  
1.3  
V
I
IN = 100mA, VPOS = 50mV,  
VNEG = 0V  
VON / TJ  
Temperature Coefficient of VON  
-1.7  
mV/°C  
A
IDIODE_CONT  
Continuous Diode Forward Current VCTL = VPOS  
2
VCTL = VPOS, IDIODE = 3A,  
Pulse width < 300µs  
VF  
Diode Forward Voltage  
0.65  
0.80  
0.95  
V
Bias Current Flowing out of NEG  
Pin during Normal Bias Operation  
VCTL = 8V, VNEG = 0V,  
No Load  
IBIAS  
10  
µA  
Negative Bias Characteristics  
V- MAX_OP  
Reverse Bias Breakdown Voltage  
-20  
V
IIN = -250µA, VCTL = VPOS =0V  
V- MAX_OP  
TJ  
/
Reverse Bias Breakdown Voltage  
Temperature Coefficient  
16  
mV/°C  
VNEG = 16V,  
VCTL = VPOS = 0V  
Leakage Current from NEG to POS  
in Reverse-Bias Condition  
I-  
1
µA  
ns  
VNEG = 2.7V, VCTL = 0V,  
Time to Respond to Negative Bias  
Condition  
tRN  
CLOAD = 10µF, Reverse Bias  
50  
Startup Inrush Current = 0.2A  
Integrated TVS Performance  
VZ  
Breakdown Voltage @ IT  
IT = 1mA  
12  
13  
2
14.5  
10  
V
VCTL – VPOS = 8V  
Leakage Current from CTL to POS,  
NEG is Open  
IR  
µA  
VCTL – VPOS = -8V  
VCTL > VPOS  
-2  
-10  
0.6  
Max Pulse  
IPPM  
Current from  
A
V
IEC61000-4-5  
CTL to POS  
VCTL < VPOS  
VCTL > VPOS  
VCTL < VPOS  
0.4  
8x20µs pulse,  
Clamping  
Voltage form  
CTL to POS  
15.0  
14.3  
NEG is Open  
VC  
Dynamic Characteristics  
Input Capacitance between CTL  
and NEG  
CI  
900  
133  
V
IN = 3V, VNEG = VPOS = 0V,  
Switch Capacitance between POS  
and NEG  
CS  
pF  
f = 1MHz  
Output Capacitance between CTL  
and POS  
CO  
RC  
967  
2
Control Internal Resistance  
© 2012 Fairchild Semiconductor Corporation  
FR015L3EZ • Rev. A2  
www.fairchildsemi.com  
4
Typical Characteristics  
TJ = 25°C unless otherwise specified.  
40  
35  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
30  
Input Voltage, VIN = 1.7V  
25  
2.1V  
3V  
5V  
20  
15  
10  
0
4
8
12  
16  
20  
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
IIN, INPUT CURRENT (A)  
IIN, INPUT CURRENT (A)  
Figure 6. Switch On Resistance vs. Switch Current  
Figure 7. Minimum Input Voltage to Turn On Switch  
vs. Current at 50mV Switch Voltage Drop  
1.0  
24  
TJ = 25oC  
IIN = 0.1A  
21  
0.8  
IIN = 0.1A  
18  
VIN = 3V  
0.6  
0.9A  
15  
0.4  
12  
8V  
1.5A  
0.2  
9
0.0  
0.5  
6
-75 -50 -25  
0
25  
50 75 100 125 150  
2.0  
3.5  
5.0  
6.5  
8.0  
TJ, JUNCTION TEMPERATURE (oC)  
VIN, INPUT VOLTAGE (V)  
Figure 8. Effective Switch Resistance RSW vs.  
Input Voltage VIN  
Figure 9. Switch On Resistance vs. Junction  
Temperature at 0.1A  
24  
100  
10  
1
IIN = 1.5A  
21  
18  
VIN = 3V  
15  
8V  
12  
9
6
0.1  
1E-3  
0.01  
0.1  
1
10  
100  
1000  
-75 -50 -25  
0
25 50 75 100 125 150  
TJ, JUNCTION TEMPERATURE (oC)  
t, PULSE WIDTH (s)  
Figure 10. Switch On Resistance vs. Junction  
Temperature at 1.5A  
Figure 11. Single-Pulse Maximum Power vs. Time  
© 2012 Fairchild Semiconductor Corporation  
FR015L3EZ • Rev. A2  
www.fairchildsemi.com  
5
(Continued)  
Typical Characteristics  
TJ = 25°C unless otherwise specified.  
100  
VPOS = VCTL = 0V  
10  
TJ = 125oC  
1
0.1  
25oC  
-55oC  
0.01  
1E-3  
0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1  
VF, STARTUP DIODE FORWARD VOLTAGE (V)  
Figure 12. Startup Diode Current vs. Forward Voltage  
© 2012 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FR015L3EZ • Rev. A2  
6
Application Test Configurations  
Figure 13. Startup Test Circuit – Normal Bias with FR015L3EZ Device  
Figure 14. Startup Test Circuit – Reverse Bias with FR015L3EZ Device  
© 2012 Fairchild Semiconductor Corporation  
FR015L3EZ • Rev. A2  
www.fairchildsemi.com  
7
Application Test Configurations  
Figure 15. Startup Test Circuit – No Reverse Polarity Protection  
Typical Application Waveforms  
VIN, 2V/div. The input voltage between CTL and NEG  
VOUT, 2V/div. The output voltage between CTL and POS  
VD, 1V/div. The startup diode voltage between POS and NEG  
iIN, 5A/div. The input current flowing out of NEG  
Time: 2µs/div  
Figure 16. Normal Bias Startup Waveform, VIN=3V, V1=3V, C1=5200µF, C2=C3=10µF, R1=R2=33k, R3=2ꢀ  
© 2012 Fairchild Semiconductor Corporation  
FR015L3EZ • Rev. A2  
www.fairchildsemi.com  
8
Typical Application Waveforms (Continued)  
VIN, 5V/div. The input voltage between CTL and NEG  
VD, 5V/div. The startup diode voltage between POS and NEG  
VOUT, 0.5V/div. The output voltage between CTL and POS  
Time: 100ns/div  
Figure 17. Reverse Bias Startup Waveform, VIN=3V, V1=3V, C1=5200µF, C2=C3=10µF, R1=R2=33k, R3=2ꢀ  
VIN, 1V/div. The voltage applied on the load circuit  
iIN, 10A/div. The input current  
Time: 2µs/div  
Figure 18. Startup Waveform without FR015L3EZ Device, VIN=3V, V1=3V, C1=5200µF, C2=C3=10µF,  
R1=R2=33k, R3=2ꢀ  
© 2012 Fairchild Semiconductor Corporation  
FR015L3EZ • Rev. A2  
www.fairchildsemi.com  
9
Application Information  
The FR015L3EZ is capable of being turned on at a  
voltage as low as 1.5V, therefore is especially suitable  
for low voltage application like AA, AAA or single  
lithium-ion battery operated devices. The voltage and  
current waveforms in Figure 16 and Figure 18 are both  
captured with a 2load at 3V input.  
Figure 16, while the reverse bias protector is present,  
the input voltage, VIN, and the output voltage, VO, are  
separated and look different. When this reverse bias  
protector is removed, VIN and VO merge, as shown in  
Figure 18 as VIN. This VIN is also the voltage applied to  
the load circuit. It can be seen that, with reverse bias  
protection, the voltage applied to the load and the  
current flowing into the load look very much the same as  
without reverse bias protection.  
When the DC power source is connected to the circuit  
(refer to Figure 1 and Figure 2), the built-in startup diode  
initially conducts the current such that the load circuit  
powers up. Due to the initial diode voltage drop, the  
FR015L3EZ effectively reduces the peak inrush current  
of a hot plug event. Under these test conditions, the  
input inrush current reaches about 19A peak. While the  
current flows, the input voltage increases. The speed of  
this input voltage increase depends on the time constant  
formed by the load resistance R3 and load capacitance  
C3, assuming the input voltage source holds itself during  
turn on. The larger the time constant, the slower the  
input voltage increase. As the input voltage approaches  
a level equal to the protector’s turn-on voltage, VON, the  
protector turns on and operates in Low-Resistance  
Mode as defined by VIN and operating current IIN.  
In Figure 16, negative voltage spikes are seen on VIN  
and VD before VIN starts to rise from 0; and in both  
Figures 16 and 18, negative input current is seen after  
FR015L3EZ is fully turned on. These phenomena are a  
combined effect of parasitic inductance and all the  
capacitors in the input voltage control circuit enclosed in  
the broken line as shown in Figures 13 to 15. This is not  
a problem as long as the load circuit doesn’t see a  
negative voltage at anytime, which is what the reverse  
bias protector is meant for. Indeed, we can see from  
Figures 16 and 18, the output voltage on the load circuit  
is always equal to or greater than 0V.  
In the event of a negative voltage transient between  
CTL and NEG, or when the DC power source, VIN, is  
reversely connected to the circuit, while no residual  
voltage presents between CTL and POS, the device  
blocks the flow of current and holds off the voltage,  
thereby protecting the load circuit. Figure 17 shows the  
startup waveforms while a passive load circuit is  
reversely biased. It can be clearly seen that the output  
voltage is near 0 or at a level that is harmless to the  
load circuit.  
Benefits of Reverse Bias Protection  
The most important benefit is, of course, to prevent  
accidently reverse-biased voltage from damaging the  
load circuit. Another benefit is that the peak startup  
inrush current can be reduced. How fast the input  
voltage rises, the input/output capacitance, the input  
voltage, and how heavy the load is determine how much  
the inrush current can be reduced. In this specific 3V /  
2A application, for example, the inrush current has been  
reduced from 24A to 19A, a 21% reduction. This can  
offer a system designer the option of increasing C3 while  
keeping “effective” load circuit capacitance down.  
Figure 18 shows the voltage and current waveforms  
when no reverse bias protection is implemented. In  
© 2012 Fairchild Semiconductor Corporation  
FR015L3EZ • Rev. A2  
www.fairchildsemi.com  
10  
0.05 C  
2.0  
A
2X  
B
2.0  
1.70  
1.00  
(0.20)  
No Traces  
allowed in  
this Area  
0.05 C  
4
6
PIN#1 IDENT  
0.10 C  
TOP VIEW  
2X  
1.05  
2.30  
ꢀꢁꢂꢃ“ꢀꢁꢀꢃ  
ꢀꢁꢄꢀ“ꢀꢁꢀꢃ  
0.47(6X)  
0.08 C  
1
3
SIDE VIEW  
C
ꢀꢁꢀꢄꢃ“ꢀꢁꢀꢄꢃ  
SEATING  
PLANE  
0.40(6X)  
0.65  
RECOMMENDED  
LAND PATTERN OPT 1  
ꢄꢁꢀꢀ“ꢀꢁꢀꢃ  
(0.15)  
(0.50)  
ꢀꢁꢇꢀ“ꢀꢁꢀꢃ  
(0.20)4X  
ꢀꢁꢉꢀ“ꢀꢁꢀꢃ  
PIN #1 IDENT  
1.70  
0.45  
(0.20)  
1
3
1.00  
ꢀꢁꢄꢅ“ꢀꢁꢀꢃ  
(6X)  
ꢀꢁꢃꢆ“ꢀꢁꢀꢃ  
ꢈꢁꢀꢀ“ꢀꢁꢀꢃ  
4
6
(0.50)  
ꢄꢁꢀꢀ“ꢀꢁꢀꢃ  
1.05  
0.66  
2.30  
6
4
(6X)  
C A B  
C
ꢀꢁꢇꢀ“ꢀꢁꢀꢃ  
0.47(6X)  
0.65  
0.10  
1
3
1.30  
BOTTOM VIEW  
0.05  
0.40(7X)  
RECOMMENDED  
LAND PATTERN OPT 2  
0.65  
NOTES:  
A. PACKAGE DOES NOT FULLY CONFORM  
TO JEDEC MO-229 REGISTRATION  
B. DIMENSIONS ARE IN MILLIMETERS.  
C. DIMENSIONS AND TOLERANCES PER  
ASME Y14.5M, 2009.  
D. LAND PATTERN RECOMMENDATION IS  
EXISTING INDUSTRY LAND PATTERN.  
E. DRAWING FILENAME: MKT-MLP06Lrev4.  
ON Semiconductor and  
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ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
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