FSA1208BQX [ONSEMI]
低功耗，八端口，高速隔离开关;
| 型号： | FSA1208BQX |
| 厂家： | 
ONSEMI |
| 描述： | 低功耗，八端口，高速隔离开关 开关 输出元件 |
| 文件： | 总10页 (文件大小：637K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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Is Now
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www.onsemi.com
onsemi andꢀꢀꢀꢀꢀꢀꢀand other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or
subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi
product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without
notice. The information herein is provided “as-is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality,
or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all
liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws,
regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/
or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application
by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized
for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for
implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and holdonsemi and its officers, employees,
subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative
Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others.
FSA1208
Low-Power, Eight-Port, High-Speed Isolation Switch
Features
Description
.
.
.
.
Low On Capacitance: 6 pF Typical
The FSA1208 is a low -pow er, eight-port, high-speed
sw itch. This part is configured as a single-pole, single-
throw sw itch and is optimized for isolating a high-
speed source, such as a DDR memory bus. The
FSA1208 features an extremely low on capacitance
(CON) of 6 pF Superior channel-to-channel crosstalk
minimizes interference.
Low On Resistance: 15 Ω Typical
Low Pow er Consumption: 1 A Maximum
10 μA Maximum ICCT over an Expanded Voltage
Range (VIN=2.3 V, VCC=4.3 V)
.
.
Wide -3 dB Bandw idth: > 400 MHz
The FSA1208 contains special circuitry on the A & B
pins that allow s the device to w ithstand an over-voltage
condition. This device is also designed to minimize
current consumption even w hen the control voltage
applied to the /OE pin is low er than the supply voltage
(VCC). Applications include port isolation and sw itching
in DDR memory modules, portable cell phones, PDAs,
digital cameras, printers, and notebook computers.
Packaged in Space-Saving 20-Lead MLP
(2.5 x 4.5 mm)
.
.
7.5 kV ESD Rating; >16 kV Pow er/GND ESD
Rating
Low COFF Capacitance: 2.5 pF Typical
Applications
.
DIMM DDR Memory
Ordering Information
Operating
Temperature Range
Part Number Top Mark
Package
20-Lead, Quad, Molded Leadless Package
(MLP), 2.5 x 4.5 mm
FSA1208BQX
F1208
-40 to +85°C
DIMM
OE
VCC
DIMM
DIMM Slot
Figure 1. Analog Symbol
© 2008 Semiconductor Components Industries, LLC
October-2017, Rev. 2
Publication Order Number:
FSA1208/D
Pin Configurations
B1
B2
B3
B4
B5
B6
B7
B8
19
18
17
16
15
14
13
12
/OE
NC
GND
20
1
11
10
VCC
A1
A2
A3
A4
A5
A6
A7
A8
2
3
4
5
6
7
8
9
Figure 2. Pin Assignments for MLP (Top Through View)
Pin Definitions
Pin #
20
Name
/OE
Description
Sw itch Enable
A Side of Bus
B Side of Bus
No Connection
Pow er
2-9
12-19
11
A1-A8
B8-B1
NC
1
VCC
10
GND
Ground
Truth Table
/OE
Function
HIGH
LOW
Disconnect
A1-A8=B1-B8
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2
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
VCC
Parameter
Min.
-0.50
-0.50
-0.50
-50
Max.
+5.25
VCC
Unit
V
Supply Voltage
VCNTRL
VSW
DC Input Voltage (/OE)(1)
DC Sw itch I/O Voltage(1)
DC Input Diode Current
DC Output Current
V
5.25
V
I
IK
mA
mA
°C
IOUT
50
+150
7.5
TSTG
Storage Temperature
-65
All Pins
Human Body Model, JEDEC: JESD22-A114 I/O to GND
Pow er to GND
8
16
2
ESD
kV
Charged Device Model, JEDEC: JESD22-C101
Note:
1. The input and output negative ratings may be exceeded if the input and output diode current ratings are
observed.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. ON Semiconductor
does not recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
Parameter
Min.
2.3
0
Max.
4.3
Unit
V
VCC
Supply Voltage
(2)
VCNTRL
Control Input Voltage (S, /OE)
Sw itch I/O Voltage
VCC
VCC
+85
V
VSW
TA
-0.5
-40
V
Operating Temperature
°C
Note:
2. The control input must be held HIGH or LOW; it must not float.
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3
DC Electrical Characteristics
All typical values are at 25°C unless otherw ise specified.
TA=- 40ºC to +85ºC
Min. Typ. Max.
Symbol
Parameter
Conditions
VCC (V)
Units
VIK
VIH
Clamp Diode Voltage
Input Voltage High
I =-18 mA
IN
2.5
2.3 to 3.6
4.3
-1.2
V
V
V
V
V
1.3
1.7
0.5
0.7
2.3 to 3.6
4.3
VIL
Input Voltage Low
I
Control Input Leakage
Off State Leakage
VSW=0 to VCC
4.3
4.3
-1
-2
1
2
µA
µA
IN
IOZ
0 A, B 3.6 V
VSW=0 V, ION=-10 mA
Figure 3
2.5
7
RON
Sw itch On Resistance(3)
Quiescent Supply Current
VSW=1.8 V, ION=-10 mA
Figure 3
2.5
4.3
15
ICC
VIN=0 or VCC, IOUT=0
1
µA
Increase in ICC Current Per
Control Voltage and VCC
ICCT
VIN=1.8 V
2.7
10
µA
Note:
3. Measured by the voltage drop betw een A and B pins at the indicated current through the sw itch.
On resistance is determined by the low er of the voltage on the tw o (A or B ports).
AC Electrical Characteristics
All typical values are for VCC=2.5 V at 25°C unless otherw ise specified.
TA=- 40ºC to +85ºC
Min. Typ. Max.
Symbol
Parameter
Conditions
VCC (V)
2.3 to 3.6
2.3 to 3.6
Units
ns
RL=50 Ω, CL=5 pF
VSW=1.8 V
Figure 4, Figure 5
ton
Turn-On Time, /OE to Output
Turn-Off Time, /OE to Output
15
12
34
25
RL=50 Ω, CL=5 pF
VSW=1.8 V
tuff
ns
Figure 4, Figure 5
RL=50 Ω, CL=5 pF
Figure 4, Figure 6
tad
Propagation Delay(4)
Off Isolation
3.3
0.35
-40
ns
dB
RL=50 Ω, f=400 MHz
Figure 11
OIRR
Xtalk
2.3 to 3.6
2.3 to 3.6
Non-Adjacent Channel
Crosstalk
RL=50 Ω, f=100 MHz
Figure 12
-40
dB
RL=50 Ω, CL=0 pF
Figure 10
1000
750
MHz
MHz
BW
-3dB Bandw idth
2.3 to 3.6
RL=50 Ω, CL=5 pF
Figure 10
Note:
4. Guaranteed by characterization.
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4
High-Speed-Related AC Electrical Characteristics
TA=- 40ºC to +85ºC
Min. Typ. Max.
Symbol
Parameter
Conditions
VCC (V)
Units
tSK(O)
tSK(P)
Channel-to-Channel Skew (5)
CL=5 pF
3.3
3.3
3.3
40
15
60
80
40
ps
ps
ps
Skew of Opposite Transitions
of the Same Output(5)
CL=5 pF
CL=5 pF
tSK(PKG)
Package-to-Package Skew (5)
100
Note:
5. Guaranteed by characterization.
Capacitance
TA=- 40ºC to +85ºC
Min. Typ. Max.
2.0
Symbol
Parameter
Conditions
Units
C
IN
Control Pin Input Capacitance
D+/D- On Capacitance
VCC=0.2 V, f=1 MHz
VCC=2.5 V, /OE=0 V, f=1 MHz
Figure 9
CON
6.0
2.5
pF
VCC and /OE=2.5 V, f=1 MHz
Figure 8
COFF
D1n, D2n Off Capacitance
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5
Test Diagrams
VON
A
n
Bn
V
SW
ION
GND
/O
GND
V
cc
Sel= 0 rV
R
=
/ ION
O
O
Figure 3. On Resistance
A
n
tRISE= 2.5ns
tFALL = 2.5ns
Bn
C
V
SW
V
CC
VOUT
R
R
GND
S
90%
CC /2
90%
CC /2
L
L
Input– V/OE, V
Sel
V
V
GND
10%
10%
90%
GND
V
Sel
V
OH
90%
GND
Output- V
OUT
RL , R , and CL are functions of the application
S
VOL
tON
tOFF
environment (see AC tables for specific values).
CL includes test fixture and stray capacitance.
Figure 4. AC Test Circuit Load
Figure 5. Turn-On / Turn-Off Waveforms
tRISE= 500ps
tFALL = 500ps
+400mV
-400mV
90%
0V
90%
10%
10%
Output
tPHL
tPLH
Figure 6. Propagation Delay
Figure 7. Intra-Pair Skew Test tSK(P)
(try to – 500ps)
A
n
A
Capacitance
Meter
n
/OE
/OE
Capacitance
Meter
V
= 0 or V
cc
Sel
= 0 or V
cc
V
Sel
B
n
B
n
Figure 8. Channel Off Capacitance
Figure 9. Channel On Capacitance
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6
Test Diagrams (Continued)
Network Analyzer
RS
VIN
V
GND
S
GND
VOUT
V
Sel
GND
GND
RT
GND
RS and RT are functions of the application
environment (see AC Tables for specific values).
Figure 10. Bandwidth
Network Analyz r
R
S
V
IN
GND
V
S
R
T
GND
OUT
V
GND
Sel
V
GND
GND
R
T
R andRT ar functions of theapplication
S
GND
environment (seeAC tables for specific Values).
Off isolation = 20 Log (VOUT/ VIN)
Figure 11. Channel Off Isolation
Network Analyz r
N
R
S
V
IN
GND
V
S
GND
V
Sel
GND
R
T
GND
V
OUT
GND
R
T
RS and RT ar functions of theapplication environment
(seeAC tables for specific values).
GND
Crosstalk = 20Log(VOUT / V )
IN
Figure 12. Non-Adjacent Channel-to-Channel Crosstalk
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7
Physical Dimensions
Figure 13. 20-Lead, Molded Leadless Package (MLP)
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8
ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the
United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A
listing of ON Semiconductor’s product/patent coverage maybe accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make
changes without further notice to anyproducts herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitabilityof its products for any
particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of anyproduct or circuit, and specificallydisclaims anyand all
liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor
products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by
ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do varyin different applications and
actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application bycustomer’s technical experts.
ON Semiconductor does not conveyanylicense under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for
use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or
any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs,
damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or
unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in anymanner.
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