FSA3031UMX [ONSEMI]
带 Mobile High-Definition Link (MHL™) 的双高速 USB2.0;型号: | FSA3031UMX |
厂家: | ONSEMI |
描述: | 带 Mobile High-Definition Link (MHL™) 的双高速 USB2.0 |
文件: | 总15页 (文件大小:1583K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Is Now Part of
To learn more about ON Semiconductor, please visit our website at
www.onsemi.com
Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers
will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor
product management systems do not have the ability to manage part nomenclature that utilizes an underscore
(_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain
device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated
device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please
email any questions regarding the system integration to Fairchild_questions@onsemi.com.
ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number
of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right
to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON
Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON
Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s
technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA
Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended
or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out
of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor
is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
November 2012
FSA3031 — Dual High-Speed USB2.0 with Mobile
High-Definition Link (MHL™)
Description
Features
The FSA3031 is a bi-directional, low-power, high-speed,
3:1, dual USB2.0 and MHL switch. Configured as a
double-pole, triple-throw (DP3T) switch; it is optimized
for switching between dual high- or full-speed USB and
Mobile High-Definition Link sources (MHL™ Rev. 2.0
specification).
.
Low On Capacitance: 4.6 pF/6.75 pF MHL/USB
(Typical)
.
.
.
Low Power Consumption: 30 μA Maximum
Supports MHL Rev. 2.0
Passes 1080 p/60 fps (3 Gbps) MHL Data Eye
Diagram Mask Compliance
The FSA3031 contains special circuitry on the switch
I/O pins, for applications where the VCC supply is
powered off (VCC=0), that allows the device to withstand
an over-voltage condition. This switch is designed to
minimize current consumption even when the control
voltage applied to the control pins is lower than the
supply voltage (VCC). This feature is especially valuable
to mobile applications, such as cell phones; allowing
direct interface with the general-purpose I/Os of the
baseband processor. Other applications include
switching and connector sharing in portable cell phones,
digital cameras, and notebook computers.
.
.
.
MHL Data Rate: ≥4.7Gbps with Ideal Input Source
Packaged in 12-Lead UMLP (1.8 x 1.8 mm)
Over-Voltage Tolerance (OVT) on all USB Ports
Up to 5.25 V without External Components
Applications
.
Cell Phones and Digital Cameras
IMPORTANT NOTE:
For additional performance information, please contact
interface@fairchildsemi.com.
Ordering Information
Part Number Top Mark Operating Temperature Range
Package
12-Lead, Ultrathin Molded Leadless Package
(UMLP), 1.8 mm x 1.8 mm
FSA3031UMX
LX
-40 to +85°C
Figure 1. Typical Application
All trademarks are the property of their respective owners.
© 2011 Fairchild Semiconductor Corporation
FSA3031 • Rev. 1.0.4
www.fairchildsemi.com
Analog Symbol
Figure 2. Analog Symbol
Table 1. Data Switch Select Truth Table
SEL1(1)
SEL0(1)
Function
0
0
1
1
0
1
0
1
D+/D- connected to USB1+/USB1-
D+/D- connected to USB2+/USB2-
D+/D- connected to MHL+/MHL
D+/D- high impedance
Note:
1. Control inputs should never be left floating or unconnected. To guarantee default switch closure to the USB
position, the SEL[0:1] pins should be tied to GND with a weak pull-down resistor (3 MΩ) to minimize static
current draw.
© 2011 Fairchild Semiconductor Corporation
FSA3031 • Rev. 1.0.4
www.fairchildsemi.com
2
Pin Configuration
1
2
VCC
12
11
10
3
4
USB1+
USB1-
USB2+
USB2-
D+
D-
Bottom View
5
6
9
GND
8
7
Figure 3. Pin Asignments
Figure 4. Top Through View
Pin Definitions
Pin#
1
Name
SEL0
SEL1
USB1+
USB1-
USB2+
USB2-
MHL+
MHL-
GND
D-
Description
Data Switch Select
Data Switch Select
2
3
USB Differential Data (Positive) – Source 1
USB Differential Data (Negative) – Source 1
USB Differential Data (Positive) – Source 2
USB Differential Data (Negative) – Source 2
MHL Differential Data (Positive)
MHL Differential Data (Negative)
Ground
4
5
6
7
8
9
10
11
12
Data Switch Output (Positive)
D+
Data Switch Output (Negative)
Device Power from System
VCC
© 2011 Fairchild Semiconductor Corporation
FSA3031 • Rev. 1.0.4
www.fairchildsemi.com
3
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
VCC
Parameter
Min.
-0.5
Max.
6.0
Unit
V
Supply Voltage
VCNTRL
DC Input Voltage (SEL[1:0])(2)
-0.5
VCC
VCC
VCC
V
USB
MHL
-0.50
-0.50
-50
(3)
VSW
DC Switch I/O Voltage(2)
DC Input Diode Current
V
IIK
mA
mA
mA
mA
mA
°C
USB
MHL
USB
MHL
60
60
150
150
+150
1
IOUT
Switch DC Output Current (Continuous)
Switch DC Output Peak Current
(Pulsed at 1m Duration, <10% Duty Cycle)
IOUTPEAK
TSTG
MSL
Storage Temperature
-65
Moisture Sensitivity Level (JEDEC J-STD-020A)
Human Body Model, JEDEC: JESD22-A114
IEC 61000-4-2, Level 4, for D+/D- and VCC Pins(4)
IEC 61000-4-2, Level 4, for D+/D- and VCC Pins(4)
Charged Device Model, JESD22-C101
All Pins
Contact
Air
4
8
ESD
kV
15
2
Notes:
2. The input and output negative ratings may be exceeded if the input and output diode current ratings are observed.
3. VSW refers to analog data switch paths (USB1, MHL, and USB2).
4. Testing performed in a system environment using TVS diodes.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
Parameter
Min.
2.5
Max.
4.5
Unit
V
VCC
tRAMP(VCC)
ΘJA
Supply Voltage
Power Supply Slew Rate
Thermal Resistance
100
1000
230
4.5
µs/V
C°/W
V
VCNTRL
VSW(USB)
VSW(MHL)
TA
Control Input Voltage (SEL[1:0])(5)
Switch I/O Voltage (USB1/USB2 Switch Paths)
Switch I/O Voltage (MHL Switch Path)
Operating Temperature
0
-0.5
1.65
-40
3.6
V
3.45
+85
V
°C
Note:
5. The control inputs must be held HIGH or LOW; they must not float.
© 2011 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FSA3031 • Rev. 1.0.4
4
DC Electrical Characteristics
All typical values are at TA=25°C unless otherwise specified.
TA=- 40°C to +85°C
Symbol
Parameter
Condition
VCC (V)
Unit
Min. Typ. Max.
VIK
VIH
Clamp Diode Voltage
IIN=-18 mA
2.5
-1.2
V
V
Control Input Voltage,
High SEL[1:0]
2.5 to 4.5
1.0
Control Input Voltage,
Low SEL[1:0]
VIL
IIN
2.5 to 4.5
4.5
0.5
V
Control Input Leakage,
SEL[1:0]
VSW=0 to 3.6 V,
VCNTRL=0 to VCC
-0.5
-0.5
-0.5
0.5
0.5
0.5
µA
µA
µA
Off-State Leakage for Open
MHL Data Paths
VSW=1.65≤ MHL
IOZ(MHL)
IOZ(USB)
4.5
≤ 3.45 V,SEL[1:0]=VCC
Off-State Leakage for Open
USB Data Paths
V
SW=0 ≤ USB≤ 3.6 V,
4.5
SEL[1:0]=VCC
V
SW=1.65≤ MHL ≤ 3.45 V,
On-State Leakage for
ICL(MHL)
4.5
4.5
-0.5
0.5
0.5
µA
µA
SEL0=GND, SEL1=VCC, Other
Side of Switch Float
Closed MHL Data Paths(6)
VSW=0 ≤ USB ≤ 3.6 V
SEL[1:0]=GND or SEL1=GND,
SEL0=VCC, Other Side of
Switch Float
On-State Leakage for
ICL(USB)
-0.5
-0.5
Closed USB Data Paths(6)
Power-Off Leakage Current
(All I/O Ports)
IOFF
VSW=0 V or 3.6 V, Figure 5
0
0.5
6.5
µA
VSW=0.4 V, ION=-8 mA
SEL[1:0]=GND or SEL1=GND,
SEL0=VCC, Figure 6
HS Switch On Resistance
(USB to D Path)
RON(USB)
2.5
3.9
5
Ω
VSW=VCC-1050 mV,
HS Switch On Resistance
(MHL to D Path)
RON(MHL)
∆RON(MHL)
∆RON(USB)
SEL0=GND, SEL1=VCC
,
2.5
2.5
2.5
2.5
Ω
Ω
Ω
Ω
ION=-8 mA, Figure 6
VSW=VCC-1050 mV,
Difference in RON Between
MHL Positive-Negative
SEL0=GND, SEL1=VCC
,
0.03
0.22
1
I
ON=-8 mA, Figure 6,
VSW=0.4 V, ION=-8 mA,
Difference in RON Between
USB Positive-Negative
SEL[1:0]=GND or SEL1=GND,
SEL0=VCC Figure 6
VSW=1.65 to 3.45 V,
RONF(MHL) Flatness for RON MHL Path
SEL0=GND, SEL1=VCC
,
ION=-8 mA, Figure 6
ICC
Quiescent Current
VCNTRL=0 or 4.5 V, IOUT=0
VCNTRL= 1.65 V, IOUT=0
VCNTRL= 2.5 V, IOUT=0
4.5
4.5
4.5
30
18
10
µA
µA
Delta Increase in Quiescent
Current per Control Pin
ICCT
Note:
6. For this test, the data switch is closed with the respective switch pin floating.
© 2011 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FSA3031 • Rev. 1.0.4
5
AC Electrical Characteristics
All typical values are for VCC=3.3 V and TA=25°C unless otherwise specified.
TA=- 40°C to +85°C
Min. Typ. Max.
Symbol
Parameter
Condition
VCC (V)
Unit
USB Turn-On Time,
SEL[1:0] to Output
RL=50 Ω, CL=5 pF, VSW(USB)=0.8 V,
tONUSB
tOFFUSB
tONMHL
2.5 to 3.6
2.5 to 3.6
2.5 to 3.6
445
445
445
600
600
600
600
ns
ns
ns
V
SW(MHL)=3.3 V, Figure 7, Figure 8
RL=50 Ω, CL=5 pF, VSW(USB)=0.8 V,
SW(MHL)=3.3 V, Figure 7, Figure 8
RL=50 Ω, CL=5 pF, VSW(USB)=0.8 V,
SW(MHL)=3.3 V, Figure 7, Figure 8
RL=50 Ω, CL=5 pF, VSW(USB)=0.8 V,
SW(MHL)=3.3 V, Figure 7, Figure 8
USB Turn-Off Time,
SEL[1:0] to Output
V
MHL Turn-On Time,
SEL[1:0] to Output
V
MHL Turn-Off Time,
SEL[1:0] to Output
Propagation Delay(7)
tOFFMHL
tPD
2.5 to 3.6
2.5 to 3.6
2.5 to 3.6
445
0.25
85
ns
ns
ns
V
CL=5 pF, RL=50 Ω, Figure 7, Figure 9
Break-Before-Make
Time(7)
RL=50 Ω, CL=5 pF, VID=VMHL=3.3 V,
VUSB=0.8 V, Figure 11
tBBM
VS=1 Vpk-pk, RL=50 Ω, f=240 MHz,
Figure 12
OIRR(MHL)
OIRR(USB)
XtalkMHL
XtalkUSB
2.5 to 3.6
2.5 to 3.6
2.5 to 3.6
2.5 to 3.6
-41
-36
-41
-37
dB
dB
dB
dB
Off Isolation(7)
VS=400 mVpk-pk, RL=50 Ω,
f=240 MHz, Figure 12
VS=1 Vpk-pk, RL=50 Ω, f=240 MHz,
Figure 13
Non-Adjacent
Channel(7) Crosstalk
VS=400 mVpk-pk, RL=50 Ω,
f=240 MHz, Figure 13
VIN=1 Vpk-pk, MHL Path, Common
Mode Voltage = VCC – 1.1 V,
RL=50 Ω, CL=0 pF, Figure 14
1.87
1.47
Differential -3db
Bandwidth(7)
BW
2.5 to 3.6
GHz
VIN=400 mVpk-pk, USB Path, Common
Mode Voltage = 0.2 V, RL=50 Ω,
CL=0 pF, Figure 14
Note:
7. Guaranteed by characterization.
© 2011 Fairchild Semiconductor Corporation
FSA3031 • Rev. 1.0.4
www.fairchildsemi.com
6
USB High-Speed AC Electrical Characteristics
Typical values are at TA= -40ºC to +85ºC.
Symbol
Parameter
Condition
VCC(V)
Typ. Unit
Skew of Opposite Transitions of the
Same Output(8)
tSK(P)
CL=5 pF, RL=50 Ω, Figure 9
3.0 to 3.6
3.0 to 3.6
7
ps
ps
RL=50 ꢀ, CL=5 pF, tR=tF=500 ps
(10-90%) at 480 Mbps, PN7
tJ
Total Jitter(8)
18
Note:
8. Guaranteed by characterization.
MHL AC Electrical Characteristics
Typical values are at TA= -40ºC to +85ºC.
Symbol
Parameter
Condition
VCC(V)
Typ. Unit
Skew of Opposite Transitions of the
Same Output(9)
tSK(P)
3.0 to 3.6
3
ps
ps
RPU=50 Ω to VCC, CL=0 pF
f=2.25 Gbps, PN7, RPU=50 Ω to
VCC, CL=0 pF
tJ
Total Jitter(9)
3.0 to 3.6
23
Note:
9. Guaranteed by characterization.
Capacitance
Typical values are at TA= -40ºC to +85ºC.
Symbol
Parameter
Control Pin Input Capacitance(10)
Condition
Typ.
2.5
Max.
Unit
pF
CIN
VCC=0 V, f=1 MHz
CON(USB) USB Path On Capacitance(10)
COFF(USB) USB Path Off Capacitance(10)
CON(MHL) MHL Path On Capacitance(10)
COFF(MHL) MHL Path Off Capacitance(10)
VCC=3.3 V, f=240 MHz, Figure 15
VCC=3.3 V, f=240 MHz, Figure 13
VCC=3.3 V, f=240 MHz, Figure 15
VCC=3.3 V, f=240 MHz, Figure 13
6.75
2.5
pF
pF
4.6
pF
2.5
pF
Note:
10. Guaranteed by characterization.
© 2011 Fairchild Semiconductor Corporation
FSA3031 • Rev. 1.0.4
www.fairchildsemi.com
7
Test Diagrams
IDn(OFF)
NC
A
V
SW
Select
GND
V
Sel= 0 orVcc
**Each switch port is tested separately
Figure 5. Off Leakage
iguOResistance
tRISE= 2.5ns
tFALL = 2.5ns
V
CC
90%
90%
V
GND
Input– V , V
SEL1
SEL
V
CNTRL-HI
CNTRL-HI
10%
10%
90%
GND
V
OH
90%
Output- V
OUT
VOL
tON
tOFF
Figure 7. AC Test Circuit Load
Figure 8. Turn-On / Turn-Off Waveforms
tRISE
tFALL
= 500ps
= 500ps
+400mV
-400mV
400mV
90%
0V
90%
50%
50%
Input
0V
10%
10%
tPLH
tPHL
VOH
Output
50%
50%
Output
VOL
tPHL
tPLH
Figure 9. Propagation Delay (tRtF – 500ps)
Figure 10. Intra-Pair Skew Test tSK(P)
© 2011 Fairchild Semiconductor Corporation
FSA3031 • Rev. 1.0.4
www.fairchildsemi.com
8
Test Diagrams
tRISE = 2.5ns
Vcc
HSD
V
90%
Vcc/2
n
Dn
C
Input -
V
V
Sel
SW1
10%
0V
VOUT
GND
L
R
L
SW2
VOUT
GND
0.9*Vout
GND
0.9*Vout
R
S
tBBM
V
Sel
RL , R and CL are function of application
GND
S
environment (see AC Tables for specific values)
CL includes test fixture and stray capacitance
Figure 11. Break-Before-Make Interval Timing
Figure 12. Channel Off Isolation (SDD21)
Figure 13. Non-Adjacent Channel-to-Channel Crosstalk (SDD21)
© 2011 Fairchild Semiconductor Corporation
FSA3031 • Rev. 1.0.4
www.fairchildsemi.com
9
Test Diagrams
RS
VIN
D+
VS
RT
VOUT
Control
VNA
VNA
Source
Return
RS
VIN
D-
VS
RT
VOUT
VS, RS and RT are functions of the application environment (see AC/DC Tables for values).
Figure 14. Insertion Loss (SDD21)
HSD
HSD
n
Capacitance
Meter
n
S
V
S
V
Capacitance
Meter
= 0 or V
cc
Sel
= 0 or V
cc
Sel
HSD
HSD
n
n
Figure 15. Channel Off Capacitance
Figure 16. Channel On Capacitance
Note:
11. HSDn refers to the high-speed data USB or MHL paths.
© 2011 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FSA3031 • Rev. 1.0.4
10
Functional Description
Insertion Loss
One of the key advantages of using the FSA3031 in
mobile digital video applications is the small amount of
insertion loss experienced by the received signal as it
passes through the switch.
Typical Application
Figure 19 shows utilizing the VBAT connection from the
micro-USB connector. The 3M resistors are used to
ensure, for manufacturing test via the micro-USB
connector, that the FSA3031 configures for connectivity
to the baseband or application processor.
This results in minimal degradation of the received eye.
One of the ways to measure the quality of the high data
rate channels is using balanced ports and four-port
differential S-parameter analysis, particularly SDD21.
Bandwidth is measured using the S-parameter SDD21
methodology. Figure 17 exhibits the 1.87 GHz (-3 db)
BW of the MHL path, while Figure 18 exhibits the
1.47 GHz (-3 db) BW of the USB paths.
Figure 19. Typical Application
Figure 17. MHL Path SDD21 Insertion Loss Curve
Figure 18. USB Path SDD21 Insertion Loss Curve
© 2011 Fairchild Semiconductor Corporation
FSA3031 • Rev. 1.0.4
www.fairchildsemi.com
11
Physical Dimensions
(11X)
0.563
2.10
1.80
A
B
0.10 C
0.588
0.40
2X
1
1.80
2.10
PIN#1 IDENT
0.10 C
(12X)
0.20
TOP VIEW
2X
RECOMMENDED
LAND PATTERN
0.55 MAX.
0.152
0.10 C
0.08 C
0.45
0.35
0.10
0.05
0.00
SEATING
PLANE
C
0.10
0.10
SIDE VIEW
DETAIL A
SCALE : 2X
0.35
(11X)
NOTES:
0.45
3
6
A. PACKAGE DOES NOT FULLY CONFORM TO
JEDEC STANDARD.
0.40
B. DIMENSIONS ARE IN MILLIMETERS.
DETAIL A
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
1
PIN#1 IDENT
D. LAND PATTERN RECOMMENDATION IS
BASED ON FSC DESIGN ONLY.
12
9
0.25
0.15
(12X)
BOTTOM VIEW
0.10 C A B
E. DRAWING FILENAME: MKT-UMLP12Arev4.
0.05 C
PACKAGE
EDGE
LEAD
LEAD
OPTION 2
SCALE : 2X
OPTION 1
SCALE : 2X
Figure 20. 12-Lead, Ultrathin Molded Leadless Package (UMLP)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2011 Fairchild Semiconductor Corporation
FSA3031 • Rev. 1.0.4
www.fairchildsemi.com
12
© 2011 Fairchild Semiconductor Corporation
FSA3031 • Rev. 1.0.4
www.fairchildsemi.com
13
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
Literature Distribution Center for ON Semiconductor
19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
For additional information, please contact your local
Sales Representative
© Semiconductor Components Industries, LLC
www.onsemi.com
相关型号:
FSA3157
TinyLogic Low Voltage UHS SPDT Analog Switch or 2:1 Multiplexer/Demultiplexer Bus Switch
FAIRCHILD
FSA3157BFHX_12
Low-Voltage SPDT Analog Switch or 2:1 Multiplexer / De-multiplexer Bus Switch
FAIRCHILD
FSA3157BL6X_12
Low-Voltage SPDT Analog Switch or 2:1 Multiplexer / De-multiplexer Bus Switch
FAIRCHILD
©2020 ICPDF网 联系我们和版权申明