FSBF15CH60CT [ONSEMI]

智能功率模块,600V,15A;
FSBF15CH60CT
型号: FSBF15CH60CT
厂家: ONSEMI    ONSEMI
描述:

智能功率模块,600V,15A

局域网 电动机控制
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November 2009  
TM  
Motion - SPM  
FSBF15CH60CT  
Smart Power Module  
Features  
General Description  
It is an advanced motion-smart power module (Motion-SPMTM  
)
UL Certified No.E209204(SPM27-JA package)  
that Fairchild has newly developed and designed to provide  
very compact and high performance ac motor drives mainly tar-  
geting low-power inverter-driven application like air conditioner  
and washing machine. It combines optimized circuit protection  
and drive matched to low-loss IGBTs. System reliability is fur-  
ther enhanced by the integrated under-voltage lock-out and  
short-circuit protection. The high speed built-in HVIC provides  
opto-coupler-less single-supply IGBT gate driving capability that  
further reduce the overall size of the inverter system design.  
Each phase current of inverter can be monitored separately due  
to the divided negative dc terminals.  
600V-15A 3-phase IGBT inverter bridge including control ICs  
for gate driving and protection  
Easy PCB layout due to built in bootstrap diode  
Divided negative dc-link terminals for inverter current sensing  
applications  
Single-grounded power supply due to built-in HVIC  
Isolation rating of 2500Vrms/min.  
Applications  
AC 100V ~ 253V three-phase inverter drive for small power  
ac motor drives  
Home appliances applications like air conditioner and wash-  
ing mashine  
Top View  
Bottom View  
44mm  
26.8mm  
Figure 1.  
©2009 Fairchild Semiconductor Corporation  
FSBF15CH60CT Rev. A  
1
www.fairchildsemi.com  
Integrated Power Functions  
600V-50A IGBT inverter for three-phase DC/AC power conversion (Please refer to Figure 3)  
Integrated Drive, Protection and System Control Functions  
For inverter high-side IGBTs: Gate drive circuit, High voltage isolated high-speed level shifting  
Control circuit under-voltage (UV) protection  
Note) Available bootstrap circuit example is given in Figures 12 and 13.  
For inverter low-side IGBTs: Gate drive circuit, Short circuit protection (SC)  
Control supply circuit under-voltage (UV) protection  
Fault signaling: Corresponding to UV (Low-side supply) and SC faults  
Input interface: 3.3/5V CMOS/LSTTL compatible, Schmitt trigger input  
Pin Configuration  
Top View  
Figure 2.  
2
www.fairchildsemi.com  
FSBF15CH60CT Rev. A  
Pin Descriptions  
Pin Number  
Pin Name  
Pin Description  
Low-side Common Bias Voltage for IC and IGBTs Driving  
Common Supply Ground  
1
VCC(L)  
COM  
IN(UL)  
IN(VL)  
IN(WL)  
VFO  
2
3
Signal Input for Low-side U Phase  
4
Signal Input for Low-side V Phase  
5
Signal Input for Low-side W Phase  
6
Fault Output  
7
CFOD  
CSC  
Capacitor for Fault Output Duration Time Selection  
Capacitor (Low-pass Filter) for Short-Current Detection Input  
Signal Input for High-side U Phase  
8
9
IN(UH)  
VCC(H)  
VB(U)  
VS(U)  
IN(VH)  
VCC(H)  
VB(V)  
VS(V)  
IN(WH)  
VCC(H)  
VB(W)  
VS(W)  
NU  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
High-side Common Bias Voltage for IC and IGBTs Driving  
High-side Bias Voltage for U Phase IGBT Driving  
High-side Bias Voltage Ground for U Phase IGBT Driving  
Signal Input for High-side V Phase  
High-side Common Bias Voltage for IC and IGBTs Driving  
High-side Bias Voltage for V Phase IGBT Driving  
High-side Bias Voltage Ground for V Phase IGBT Driving  
Signal Input for High-side W Phase  
High-side Common Bias Voltage for IC and IGBTs Driving  
High-side Bias Voltage for W Phase IGBT Driving  
High-side Bias Voltage Ground for W Phase IGBT Driving  
Negative DC–Link Input for U Phase  
NV  
Negative DC–Link Input for V Phase  
NW  
Negative DC–Link Input for W Phase  
U
Output for U Phase  
V
Output for V Phase  
W
Output for W Phase  
P
Positive DC–Link Input  
3
www.fairchildsemi.com  
FSBF15CH60CT Rev. A  
Internal Equivalent Circuit and Input/Output Pins  
P (27)  
(19) VB(W)  
VB  
(18) VCC(H)  
VCC  
OUT  
COM  
(17) IN(WH)  
W (26)  
VS  
IN  
(20) VS(W)  
(15) VB(V)  
VB  
(14) VCC(H)  
VCC  
COM  
IN  
OUT  
VS  
(13) IN(VH)  
(16) VS(V)  
V (25)  
(11) VB(U)  
VB  
(10) VCC(H)  
VCC  
COM  
IN  
OUT  
VS  
(9) IN(UH)  
(12) VS(U)  
U (24)  
(8) CSC  
(7) CFOD  
(6) VFO  
OUT(WL)  
OUT(VL)  
C(SC)  
C(FOD)  
VFO  
NW (23)  
NV (22)  
NU (21)  
(5) IN(WL)  
(4) IN(VL)  
(3) IN(UL)  
IN(WL)  
IN(VL)  
IN(UL)  
(2) COM  
(1) VCC(L)  
COM  
VCC  
OUT(UL)  
VSL  
Note:  
1) Inverter low-side is composed of three IGBTs, freewheeling diodes for each IGBT and one control IC. It has gate drive and protection functions.  
2) Inverter power side is composed of four inverter dc-link input terminals and three inverter output terminals.  
3) Inverter high-side is composed of three IGBTs, freewheeling diodes and three drive ICs for each IGBT.  
Figure 3.  
4
www.fairchildsemi.com  
FSBF15CH60CT Rev. A  
Absolute Maximum Ratings (TJ = 25°C, Unless Otherwise Specified)  
Inverter Part  
Symbol  
VPN  
Parameter  
Conditions  
Applied between P- NU, NV, NW  
Applied between P- NU, NV, NW  
Rating  
450  
Units  
Supply Voltage  
V
V
VPN(Surge)  
VCES  
± IC  
Supply Voltage (Surge)  
500  
Collector-emitter Voltage  
600  
V
Each IGBT Collector Current  
Each IGBT Collector Current (Peak)  
Collector Dissipation  
TC = 25°C  
15  
A
± ICP  
PC  
TC = 25°C, Under 1ms Pulse Width  
TC = 25°C per One Chip  
(Note 1)  
30  
A
25  
W
°C  
TJ  
Operating Junction Temperature  
-40 ~ 150  
Note:  
1. The maximum junction temperature rating of the power chips integrated within the SPM is 150°C.  
Control Part  
Symbol  
VCC  
Parameter  
Conditions  
Rating  
20  
Units  
Control Supply Voltage  
Applied between VCC(H), VCC(L) - COM  
V
V
VBS  
High-side Control Bias  
Voltage  
Applied between VB(U) - VS(U), VB(V) - VS(V), VB(W)  
VS(W)  
-
20  
VIN  
Input Signal Voltage  
Applied between IN(UH), IN(VH), IN(WH), IN(UL), IN(VL)  
IN(WL) - COM  
,
-0.3~17  
V
VFO  
IFO  
Fault Output Supply Voltage  
Fault Output Current  
Applied between VFO - COM  
Sink Current at VFO Pin  
-0.3~VCC+0.3  
5
V
mA  
V
VSC  
Current Sensing Input Voltage Applied between CSC - COM  
-0.3~VCC+0.3  
Bootstrap Diode Part  
Symbol  
Parameter  
Conditions  
Rating  
600  
Units  
VRRM  
IF  
Maixmum Repetitive Reverse Voltage  
Forward Current  
V
A
TC = 25°C  
0.5  
IFP  
TJ  
Forward Current (Peak)  
TC = 25°C, Under 1ms Pulse Width  
2
A
Operating Junction Temperature  
-40 ~ 150  
°C  
Total System  
Symbol  
Parameter  
Conditions  
Rating  
Units  
VPN(PROT) Self Protection Supply Voltage Limit  
(Short Circuit Protection Capability)  
VCC = VBS = 13.5 ~ 16.5V  
TJ = 150°C, Non-repetitive, less than 2ms  
400  
V
TSTG  
VISO  
Storage Temperature  
Isolation Voltage  
-40 ~ 150  
2500  
°C  
60Hz, Sinusoidal, AC 1 minute, Connection  
Pins to ceramic substrate  
Vrms  
Thermal Resistance  
Symbol  
Rth(j-c)Q  
Parameter  
Conditions  
Min. Typ. Max. Units  
Junction to Case Thermal Inverter IGBT part (per 1/6 module)  
Resistance  
-
-
-
-
4.9  
5.7  
°C/W  
°C/W  
Rth(j-c)F  
Inverter FWD part (per 1/6 module)  
Note:  
2. For the measurement point of case temperature(T ), please refer to Figure 2.  
C
5
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FSBF15CH60CT Rev. A  
Electrical Characteristics (TJ = 25°C, Unless Otherwise Specified)  
Inverter Part  
Symbol  
Parameter  
Conditions  
Min. Typ. Max. Units  
VCE(SAT)  
Collector-Emitter Saturation VCC = VBS = 15V  
IC = 15A, TJ = 25°C  
-
-
2.2  
V
Voltage  
VIN = 5V  
VF  
FWD Forward Voltage  
Switching Times  
VIN = 0V  
IC = 15A, TJ = 25°C  
-
-
-
-
-
-
-
-
-
-
-
-
-
2.5  
V
ms  
ms  
ms  
ms  
ms  
ms  
ms  
ms  
ms  
ms  
mA  
HS  
tON  
tC(ON)  
tOFF  
tC(OFF)  
trr  
VPN = 300V, VCC = VBS = 15V  
IC = 15A  
VIN = 0V « 5V, Inductive Load  
(Note 3)  
0.85  
0.15  
0.45  
0.10  
0.10  
0.55  
0.25  
0.45  
0.10  
0.15  
-
-
-
-
-
-
-
-
-
-
-
1
LS  
tON  
VPN = 300V, VCC = VBS = 15V  
IC = 15A  
VIN = 0V « 5V, Inductive Load  
(Note 3)  
tC(ON)  
tOFF  
tC(OFF)  
trr  
ICES  
Collector-Emitter  
Leakage Current  
VCE = VCES  
Note:  
3.  
t
and t  
include the propagation delay time of the internal drive IC. t  
and t  
are the switching time of IGBT itself under the given gate driving condition internally.  
C(OFF)  
ON  
OFF  
C(ON)  
For the detailed information, please see Figure 4.  
Control Part  
Symbol  
Parameter  
Conditions  
Min.  
Typ. Max. Units  
IQCCL  
IQCCH  
IQBS  
Quiescent VCC Supply  
Current  
VCC = 15V  
IN(UL, VL, WL) = 0V  
VCC(L) - COM  
-
-
-
-
23  
mA  
mA  
mA  
VCC = 15V  
IN(UH, VH, WH) = 0V  
VCC(H) - COM  
-
-
600  
500  
Quiescent VBS Supply  
Current  
VBS = 15V  
VB(U) - VS(U), VB(V) -VS(V),  
IN(UH, VH, WH) = 0V VB(W) - VS(W)  
VSC = 0V, VFO Circuit: 4.7kW to 5V Pull-up  
VSC = 1V, VFO Circuit: 4.7kW to 5V Pull-up  
VCC = 15V (Note 4)  
VFOH  
VFOL  
Fault Output Voltage  
4.5  
-
-
-
-
V
V
0.8  
0.55  
13.0  
13.4  
12  
VSC(ref)  
UVCCD  
UVCCR  
UVBSD  
UVBSR  
tFOD  
Short Circuit Trip Level  
0.45  
10.7  
11.2  
10  
0.5  
11.9  
12.4  
11  
V
Supply Circuit Under-  
Voltage Protection  
Detection Level  
V
Reset Level  
V
Detection Level  
V
Reset Level  
10.5  
1.0  
2.8  
-
11.5  
1.8  
-
12.5  
-
V
Fault-out Pulse Width  
ON Threshold Voltage  
CFOD = 33nF (Note 5)  
ms  
V
VIN(ON)  
Applied between IN(UH), IN(VH), IN(WH), IN(UL)  
IN(VL), IN(WL) - COM  
,
-
VIN(OFF) OFF Threshold Voltage  
-
0.8  
V
Note:  
4. Short-circuit current protection is functioning only at the low-sides.  
-6  
5. The fault-out pulse width t  
depends on the capacitance value of C  
according to the following approximate equation : C  
= 18.3 x 10 x t  
[F]  
FOD  
FOD  
FOD  
FOD  
6
www.fairchildsemi.com  
FSBF15CH60CT Rev. A  
100% IC 100% IC  
trr  
VCE  
IC  
IC  
VCE  
VIN  
VIN  
tON  
tOFF  
tC(ON)  
tC(OFF)  
VIN(ON)  
VIN(OFF)  
10% VCE  
10% IC  
10% IC 90% IC 10% VCE  
(b) turn-off  
(a) turn-on  
Figure 4. Switching Time Definition  
Switching Loss (Typical)  
SWITCHINGLOSS(OFF) VS. COLLECTORCURRENT  
VCE=300V  
SWITCHINGLOSS(ON) VS. COLLECTORCURRENT  
1000  
900  
800  
700  
600  
500  
400  
300  
200  
100  
0
500  
450  
400  
350  
300  
250  
200  
150  
100  
50  
VCE=300V  
VCC=15V  
VCC=15V  
V =5V  
V =5V  
IN  
IN  
TJ=25  
TJ=150℃  
TJ=25℃  
TJ=150℃  
0
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16 17  
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16 17  
COLLECTOR CURRENT, Ic [AMPERES]  
COLLECTOR CURRENT, Ic [AMPERES]  
Figure 5. Switching Loss Characteristics  
7
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FSBF15CH60CT Rev. A  
Bootstrap Diode Part  
Symbol  
Parameter  
Conditions  
Min. Typ. Max. Units  
VF  
trr  
Forward Voltage  
IF = 0.1A, TC = 25°C  
-
-
2.5  
80  
-
-
V
Reverse Recovery Time  
IF = 0.1A, TC = 25°C  
ns  
Built in Bootstrap Diode VF-IF Characteristic  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
TC=25℃  
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15  
VF [V]  
Note:  
6. Built in bootstrap diode includes around 15resistance characteristic.  
Figure 6. Built in Bootstrap Diode Characteristics  
Recommended Operating Conditions  
Value  
Symbol  
Parameter  
Conditions  
Units  
Min.  
-
Typ. Max.  
VPN  
VCC  
VBS  
Supply Voltage  
Applied between P - NU, NV, NW  
300  
15  
400  
16.5  
18.5  
V
V
V
Control Supply Voltage  
High-side Bias Voltage  
Applied between VCC(H), VCC(L) - COM  
13.5  
13.0  
Applied between VB(U) - VS(U), VB(V) - VS(V)  
VB(W) - VS(W)  
,
15  
dVCC/dt, Control supply variation  
dVBS/dt  
-1  
-
-
-
1
-
V/ms  
ms  
tdead  
Blanking Time for Preventing For Each Input Signal  
1.5  
Arm-short  
fPWM  
VSEN  
PWM Input Signal  
Voltage for Current Sensing  
-20°C £ TJ £ 125°C  
-
20  
4
kHz  
V
Applied between NU, NV, NW - COM  
(Including surge voltage)  
-4  
8
www.fairchildsemi.com  
FSBF15CH60CT Rev. A  
Mechanical Characteristics and Ratings  
Limits  
Parameter  
Conditions  
Units  
Min.  
Typ.  
0.62  
-
Max.  
1.00  
+120  
-
Mounting Torque  
Device Flatness  
Weight  
Mounting Screw: - M3  
Recommended 0.62N•m  
Note Figure 5  
0.51  
N•m  
mm  
g
0
-
15.4  
( + )  
( + )  
Figure 7. Flatness Measurement Position  
Package Marking and Ordering Information  
Device Marking  
Device  
Package  
Reel Size  
Tape Width  
Quantity  
FSBF15CH60CT  
FSBF15CH60CT  
SPM27-JA  
-
-
10  
9
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FSBF15CH60CT Rev. A  
Time Charts of SPMs Protective Function  
Input Signal  
Protection  
RESET  
SET  
RESET  
Circuit State  
UVCCR  
a1  
a6  
UVCCD  
Control  
Supply Voltage  
a3  
a4  
a2  
a7  
Output Current  
a5  
Fault Output Signal  
a1 : Control supply voltage rises: After the voltage rises UVCCR, the circuits start to operate when next input is applied.  
a2 : Normal operation: IGBT ON and carrying current.  
a3 : Under voltage detection (UVCCD).  
a4 : IGBT OFF in spite of control input condition.  
a5 : Fault output operation starts.  
a6 : Under voltage reset (UVCCR).  
a7 : Normal operation: IGBT ON and carrying current.  
Figure 8. Under-Voltage Protection (Low-side)  
Input Signal  
Protection  
RESET  
SET  
RESET  
Circuit State  
UVBSR  
b5  
b1  
Control  
Supply Voltage  
UVBSD  
b2  
b3  
b4  
b6  
Output Current  
High-level (no fault output)  
Fault Output Signal  
b1 : Control supply voltage rises: After the voltage reaches UVBSR, the circuits start to operate when next input is applied.  
b2 : Normal operation: IGBT ON and carrying current.  
b3 : Under voltage detection (UVBSD).  
b4 : IGBT OFF in spite of control input condition, but there is no fault output signal.  
b5 : Under voltage reset (UVBSR  
)
b6 : Normal operation: IGBT ON and carrying current  
Figure 9. Under-Voltage Protection (High-side)  
10  
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FSBF15CH60CT Rev. A  
Lower arms  
control input  
c6  
c7  
Protection  
circuit state  
SET  
RESET  
Internal IGBT  
Gate-Emitter Voltage  
c4  
c3  
c2  
SC  
c1  
c8  
Output Current  
SC Reference Voltage  
Sensing Voltage  
of the shunt  
resistance  
CR circuit time  
constant delay  
c5  
Fault Output Signal  
(with the external shunt resistance and CR connection)  
c1 : Normal operation: IGBT ON and carrying current.  
c2 : Short circuit current detection (SC trigger).  
c3 : Hard IGBT gate interrupt.  
c4 : IGBT turns OFF.  
c5 : Fault output timer operation starts: The pulse width of the fault output signal is set by the external capacitor CFO  
.
c6 : Input “L” : IGBT OFF state.  
c7 : Input “H”: IGBT ON state, but during the active period of fault output the IGBT doesn’t turn ON.  
c8 : IGBT OFF state  
Figure 10. Short-Circuit Current Protection (Low-side Operation only)  
11  
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FSBF15CH60CT Rev. A  
5V-Line  
SPM  
RPF=4.7㏀  
100Ω  
100Ω  
100Ω  
,
,
IN(UH) IN(VH)  
IN  
(WH)  
,
,
IN(UL) IN(VL)  
IN(WL)  
CPU  
VFO  
1nF  
1nF  
1nF  
CPF= 1nF  
COM  
Note:  
1) RC coupling at each input (parts shown dotted) might change depending on the PWM control scheme used in the application and the wiring impedance of the application’s  
printed circuit board. The SPM input signal section integrates 5kW (typ.) pull-down resistor. Therefore, when using an external filtering resistor, please pay attention to the sig-  
nal voltage drop at input terminal.  
2) The logic input is compatible with standard CMOS or LSTTL outputs.  
Figure 11. Recommended CPU I/O Interface Circuit  
These Values depend on PWM Control Algorithm  
One-Leg Diagram of SPM  
P
Vcc VB  
IN  
HO  
VS  
15V-Line  
0.1uF  
22uF  
COM  
Inverter  
Output  
Vcc  
IN OUT  
VSL  
1000uF  
1uF  
COM  
N
Note:  
1) The ceramic capacitor placed between V -COM should be over 1uF and mounted as close to the pins of the SPM as possible.  
CC  
Figure 12. Recommended Bootstrap Operation Circuit and Parameters  
12  
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FSBF15CH60CT Rev. A  
5V line  
15V line  
P (27)  
(19) VB(W)  
(18) VCC(H)  
VB  
VCC  
OUT  
VS  
RS  
RS  
RS  
COM  
IN  
CBS  
CBSC  
(17) IN(WH)  
(20) VS(W)  
W
(26)  
Gating WH  
Gating VH  
Gating UH  
CPS  
(15) VB(V)  
VB  
(14) VCC(H)  
VCC  
OUT  
VS  
COM  
IN  
(13) IN(VH)  
(16) VS(V)  
CBS  
CBSC  
V (25)  
M
CPS  
(11) VB(U)  
VB  
C
P
U
(10) VCC(H)  
VCC  
CDCS  
Vdc  
OUT  
VS  
COM  
IN  
CBSC  
CBS  
(9) IN(UH)  
(12) VS(U)  
U (24)  
CPS  
RF  
RPF  
(8) CSC  
(7) CFOD  
(6) VFO  
CSC  
OUT(WL)  
OUT(VL)  
C(SC)  
C(FOD)  
VFO  
RSW  
NW (23)  
RS  
RS  
CFOD  
Fault  
(5) IN(WL)  
(4) IN(VL)  
(3) IN(UL)  
Gating WL  
Gating VL  
IN(WL)  
IN(VL)  
IN(UL)  
RS  
RS  
RSV  
NV (22)  
Gating UL  
(2) COM  
(1) VCC(L)  
COM  
VCC  
CPF  
CBPF  
CPS  
CPS CPS  
OUT(UL)  
VSL  
RSU  
NU (21)  
CSPC15  
CSP15  
RFW  
Input Signal for  
Short-Circuit Protection  
W-Phase Current  
V-Phase Current  
U-Phase Current  
RFV  
RFU  
CFW  
CFU  
CFV  
Note:  
1) To avoid malfunction, the wiring of each input should be as short as possible. (less than 2-3cm)  
2) By virtue of integrating an application specific type HVIC inside the SPM, direct coupling to CPU terminals without any opto-coupler or transformer isolation is possible.  
3) V output is open collector type. This signal line should be pulled up to the positive side of the 5V power supply with approximately 4.7kW resistance. Please refer to Figure11.  
FO  
4) C  
of around 7 times larger than bootstrap capacitor C is recommended.  
BS  
SP15  
5) V output pulse width should be determined by connecting an external capacitor(C  
FO  
) between C  
(pin7) and COM(pin2). (Example : if C  
= 33 nF, then t = 1.8ms  
FOD  
FOD  
FOD FO  
(typ.)) Please refer to the note 5 for calculation method.  
6) Input signal is High-Active type. There is a 5kW resistor inside the IC to pull down each input signal line to GND. RC coupling circuits is recommended for the prevention  
of input signal oscillation. R time constant should be selected in the range 50~150ns. C should not be less than 1nF. (Recommended R =100, C =1nF)  
C
S
PS  
PS  
S
PS  
7) To prevent errors of the protection function, the wiring around R and C should be as short as possible.  
F
SC  
8) In the short-circuit protection circuit, please select the R C time constant in the range 1.5~2ms.  
F
SC  
9) Each capacitor should be mounted as close to the pins of the SPM as possible.  
10) To prevent surge destruction, the wiring between the smoothing capacitor and the P&GND pins should be as short as possible. The use of a high frequency non-inductive  
capacitor of around 0.1~0.22mF between the P&GND pins is recommended.  
11) Relays are used at almost every systems of electrical equipments of home appliances. In these cases, there should be sufficient distance between the CPU and the relays.  
12) C  
should be over 1mF and mounted as close to the pins of the SPM as possible.  
SPC15  
Figure 13. Typical Application Circuit  
13  
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FSBF15CH60CT Rev. A  
Detailed Package Outline Drawings  
14  
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FSBF15CH60CT Rev. A  
Detailed Package Outline Drawings (Continued)  
15  
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FSBF15CH60CT Rev. A  
Detailed Package Outline Drawings (Continued)  
16  
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FSBF15CH60CT Rev. A  
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intended to be an exhaustive list of all such trademarks.  
Build it Now™  
CorePLUS™  
CorePOWER™  
CROSSVOLT™  
CTL™  
FRFET®  
Programmable Active Droop™  
QFET®  
QS™  
Quiet Series™  
RapidConfigure™  
Global Power ResourceSM  
Green FPS™  
Green FPS™ e-Series™  
GTO™  
TinyBoost™  
TinyBuck™  
TinyLogic®  
TINYOPTO™  
TinyPower™  
TinyPWM™  
TinyWire™  
Current Transfer Logic™  
IntelliMAX™  
ISOPLANAR™  
MegaBuck™  
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MicroFET™  
MicroPak™  
EcoSPARK®  
EfficentMax™  
EZSWITCH™ *  
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SMART START™  
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TriFault Detect™  
mSerDes™  
MillerDrive™  
MotionMax™  
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SuperSOT™-6  
SuperSOT™-8  
SupreMOS™  
SyncFET™  
®
®
Fairchild®  
Motion-SPM™  
Fairchild Semiconductor®  
FACT Quiet Series™  
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UHC®  
Ultra FRFET™  
UniFET™  
VCX™  
VisualMax™  
XS™  
OPTOLOGIC®  
OPTOPLANAR®  
®
FAST®  
FastvCore™  
PDP SPM™  
Power-SPM™  
PowerTrench®  
PowerXS™  
FlashWriter®  
FPS™  
*
The Power Franchise®  
F-PFS™  
* EZSWITCH™ and FlashWriter® are trademarks of System General Corporation, used under license by Fairchild Semiconductor.  
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Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their  
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PRODUCT STATUS DEFINITIONS  
Definition of Terms  
Datasheet Identification  
Product Status  
Definition  
Datasheet contains the design specifications for product development. Specifications  
may change in any manner without notice.  
Advance Information  
Formative / In Design  
Datasheet contains preliminary data; supplementary data will be published at a later  
date. Fairchild Semiconductor reserves the right to make changes at any time without  
notice to improve design.  
Preliminary  
First Production  
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to  
make changes at any time without notice to improve the design.  
No Identification Needed  
Obsolete  
Full Production  
Datasheet contains specifications on a product that is discontinued by Fairchild  
Semiconductor. The datasheet is for reference information only.  
Not In Production  
Rev. I38  
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FSBF15CH60CT Rev. A  
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