FSDM07652RWDTU [ONSEMI]

用于 70W 离线反激转换器的 650V 集成电源开关;
FSDM07652RWDTU
型号: FSDM07652RWDTU
厂家: ONSEMI    ONSEMI
描述:

用于 70W 离线反激转换器的 650V 集成电源开关

开关 电源开关 转换器
文件: 总22页 (文件大小:380K)
中文:  中文翻译
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www.fairchildsemi.com  
FSDM07652R  
TM  
Green Mode Fairchild Power Switch (FPS )  
Features  
• Internal Avalanche Rugged Sense FET  
• Advanced Burst-Mode operation consumes under 1 W at  
240VAC & 0.5W load  
• Precision Fixed Operating Frequency (66kHz)  
• Internal Start-up Circuit  
• Pulse by Pulse Current Limiting  
• Abnormal Over Current Protection (AOCP)  
• Over Voltage Protection (OVP)  
OUTPUT POWER TABLE  
(3)  
230VAC ±15%  
85-265VAC  
PRODUCT  
Adapt-  
er  
Open  
Frame  
Adapt- Open  
er  
(1)  
(2)  
(1)  
(2)  
Frame  
FSDM0565R  
FSDM07652R  
60W  
70W  
70W  
80W  
50W  
60W  
60W  
70W  
• Over Load Protection (OLP)  
• Internal Thermal Shutdown Function (TSD)  
• Auto-Restart Mode  
• Under Voltage Lock Out (UVLO) with hysteresis  
• Low Operating Current (2.5mA)  
Table 1. Notes: 1. Typical continuous power in a non-ven-  
tilated enclosed adapter measured at 50°C ambient. 2.  
Maximum practical continuous power in an open frame  
design at 50°C ambient. 3. 230 VAC or 100/115 VAC with  
doubler.  
Built-in Soft Start  
Application  
• SMPS for LCD monitor and STB  
• Adaptor  
Typical Circuit  
Description  
AC  
IN  
DC  
The FSDM07652R is an integrated Pulse Width Modulator  
(PWM) and Sense FET specifically designed for high  
performance offline Switch Mode Power Supplies (SMPS)  
with minimal external components. This device is an  
integrated high voltage power switching regulator which  
combine an avalanche rugged Sense FET with a current mode  
PWM control block. The PWM controller includes integrated  
fixed frequency oscillator, under voltage lockout, leading  
edge blanking (LEB), optimized gate driver, internal soft  
start, temperature compensated precise current sources for a  
loop compensation and self protection circuitry. Compared  
with discrete MOSFET and PWM controller solution, it can  
reduce total cost, component count, size and weight simulta-  
neously increasing efficiency, productivity, and system  
reliability. This device is a basic platform well suited for cost  
effective designs of flyback converters.  
OUT  
Vstr  
PWM  
Drain  
Vfb  
Vcc  
Source  
Figure 1. Typical Flyback Application  
Rev.1.0.6  
©2005 Fairchild Semiconductor Corporation  
FSDM07652R  
Internal Block Diagram  
Vcc  
3
Vstr  
6
Drain  
1
N.C 5  
Istart  
+
0.5/0.7V  
Internal  
Bias  
Vref  
8V/12V  
Vcc good  
-
Vcc  
Idelay  
Vref  
Switching disable  
OSC  
IFB  
S
Q
Vfb  
PWM  
4
Gate  
driver  
R
Q
2.5R  
Soft start  
R
LEB  
VSD  
Vcc  
Vovp  
TSD  
2
GND  
S
Q
Q
R
Vcc good  
AOCP  
Vocp  
Figure 2. Functional Block Diagram of FSDM07652R  
2
FSDM07652R  
Pin Definitions  
Pin Number  
Pin Name  
Pin Function Description  
This pin is the high voltage power Sense FET drain. It is designed to drive the  
transformer directly.  
1
2
Drain  
GND  
This pin is the control ground and the Sense FET source.  
This pin is the positive supply voltage input. During start up, the power is sup-  
plied by an internal high voltage current source that is connected to the Vstr pin.  
When Vcc reaches 12V, the internal high voltage current source is disabled and  
the power is supplied from the auxiliary transformer winding.  
3
Vcc  
This pin is internally connected to the inverting input of the PWM comparator.  
The collector of an opto-coupler is typically tied to this pin. For stable operation,  
a capacitor should be placed between this pin and GND. If the voltage of this pin  
reaches 6.0V, the over load protection is activated resulting in shutdown of the  
4
Vfb  
FPSTM  
-
.
5
6
N.C  
Vstr  
This pin is connected directly to the high voltage DC link. At startup, the internal  
high voltage current source supplies internal bias and charges the external ca-  
pacitor that is connected to the Vcc pin. Once Vcc reaches 12V, the internal cur-  
rent source is disabled.  
Pin Configuration  
TO-220F-6L  
6.Vstr  
5.N.C.  
4.Vfb  
3.Vcc  
2.GND  
1.Drain  
Figure 3. Pin Configuration (Top View)  
3
FSDM07652R  
Absolute Maximum Ratings  
(Ta=25°C, unless otherwise specified)  
Parameter  
Symbol  
Value  
650  
650  
15  
Unit  
V
Drain-source voltage  
Vstr Max Voltage  
V
DSS  
V
STR  
V
(1)  
Pulsed Drain current (Tc=25°C)  
I
A
DM  
DC  
Continuous Drain Current(Tc=25°C)  
Continuous Drain Current(Tc=100°C)  
Single pulsed avalanche energy (2)  
Single pulsed avalanche current (3)  
Supply voltage  
3.8  
A
I
D
2.4  
A
E
I
370  
-
mJ  
A
AS  
AS  
V
20  
V
CC  
Input voltage range  
V
-0.3 to V  
45  
V
FB  
CC  
Total power dissipation(Tc=25°C)  
Operating junction temperature  
Operating ambient temperature  
Storage temperature range  
P (Watt H/S)  
W
°C  
°C  
°C  
kV  
D
T
Internally limited  
-25 to +85  
j
T
A
STG  
-
T
-55 to +150  
ESD Capability, HBM Model (All pins  
excepts for Vstr and Vfb)  
2.0  
(GND-Vstr/Vfb=1.5kV)  
ESD Capability, Machine Model (All pins  
excepts for Vstr and Vfb)  
300  
V
-
(GND-Vstr/Vfb=225V)  
Notes:  
1. Repetitive rating: Pulse width limited by maximum junction temperature  
2. L=14mH, starting Tj=25°C  
3. L=13uH, starting Tj=25°C  
Thermal Impedance  
Parameter  
Symbol  
Value  
49.90  
2.78  
Unit  
°C/W  
°C/W  
(1)  
Junction-to-Ambient Thermal  
Junction-to-Case Thermal  
θJA  
(2)  
θJC  
Notes:  
1. Free standing with no heat-sink under natural convection.  
2. Infinite cooling condition - Refer to the SEMI G30-88.  
4
FSDM07652R  
Electrical Characteristics  
(Ta = 25°C unless otherwise specified)  
Parameter  
Sense FET SECTION  
Symbol  
Condition  
Min. Typ. Max. Unit  
Drain source breakdown voltage  
BV  
DSS  
V
V
= 0V, I = 250µA  
650  
-
-
-
-
V
GS  
D
= 650V, V  
= 520V  
= 0V  
50  
µA  
DS  
GS  
Zero gate voltage drain current  
I
DSS  
V
V
DS  
GS  
-
-
-
200  
1.6  
µA  
= 0V, T = 125°C  
C
Static drain source on resistance (1)  
Output capacitance  
R
V
GS  
= 10V, I = 2.5A  
D
1.4  
DS(ON)  
V
= 0V, V = 25V,  
DS  
GS  
f = 1MHz  
C
-
100  
-
pF  
ns  
OSS  
Turn on delay time  
Rise time  
T
V
DD  
= 325V, I = 5A  
-
-
-
-
22  
60  
-
-
-
-
D(ON)  
D
(MOSFET switching  
time is essentially  
independent of  
T
R
Turn off delay time  
Fall time  
T
115  
65  
D(OFF)  
operating temperature)  
T
F
CONTROL SECTION  
Initial frequency  
F
V
= 3V  
60  
0
66  
1
72  
3
kHz  
%
OSC  
FB  
Voltage stability  
F
13V Vcc 18V  
STABLE  
Temperature stability (2)  
Maximum duty cycle  
Minimum duty cycle  
Start threshold voltage  
Stop threshold voltage  
Feedback source current  
Soft-start time  
F  
-25°C Ta 85°C  
0
±5  
80  
-
±10  
85  
0
%
OSC  
D
MAX  
MIN  
-
-
75  
-
%
D
%
V
V
FB  
V
FB  
V
FB  
V
FB  
=GND  
=GND  
=GND  
=3  
11  
7
12  
8
13  
9
V
START  
V
V
STOP  
I
0.7  
-
0.9  
10  
250  
1.1  
15  
-
mA  
ms  
ns  
FB  
T
S
Leading Edge Blanking time  
BURST MODE SECTION  
T
-
-
LEB  
V
Vcc=14V  
Vcc=14V  
-
-
0.7  
0.5  
-
-
V
V
BURH  
Burst Mode Voltages (2)  
V
BURL  
PROTECTION SECTION  
Peak current limit (4)  
I
V
=5V, V =14V  
FB CC  
2.2  
18  
2.5  
19  
2.8  
20  
A
V
OVER  
Over voltage protection  
V
-
-
OVP  
Abnormal Over current protection  
current (3)  
I
5.54 6.15  
6.77  
A
AOCP  
Thermal shutdown temperature (2)  
Shutdown feedback voltage  
T
130  
5.5  
145  
6.0  
160  
6.5  
°C  
SD  
V
V 5.5V  
FB  
V
SD  
5
FSDM07652R  
Shutdown delay current  
I
V
=5V  
2.8  
3.5  
2.5  
4.2  
5
µA  
DELAY  
FB  
TOTAL DEVICE SECTION  
I
V
FB  
V
FB  
V
FB  
=GND, V =14V  
CC  
OP  
Operating supply current (5)  
I
=GND, V =10V  
CC  
-
mA  
OP(MIN)  
I
=GND, V =18V  
CC  
OP(MAX)  
Notes:  
1. Pulse test : Pulse width 300µS, duty 2%  
2. These parameters, although guaranteed at the design, are not tested in mass production.  
3. These parameters, although guaranteed, are tested in EDS(wafer test) process.  
4. These parameters indicate the inductor current.  
5. This parameter is the current flowing into the control IC.  
6
FSDM07652R  
Comparison Between FS6M07652RTC and FSDM07652R  
Function  
FS6M07652RTC  
FSDM07652R  
FSDM07652R Advantages  
Soft-Start  
Adjustable soft-start Internal soft-start with • Gradually increasing current limit  
time using an  
external capacitor  
typically 10ms (fixed)  
during soft-start further reduces peak  
current and voltage component  
stresses  
• Eliminates external components used  
for soft-start in most applications  
• Reduces or eliminates output  
overshoot  
Burst Mode Operation • Built into controller • Built into controller • Improve light load efficiency  
• Output voltage  
drops to around  
half  
• Output voltage fixed • Reduces no-load consumption  
7
FSDM07652R  
Typical Performance Characteristics  
(These Characteristic Graphs are Normalized at Ta= 25°C)  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
-50 -25  
0
25  
50  
75 100 125  
-50 -25  
0
25  
50  
75 100 125  
Junction Temperature()  
Junction Temperature()  
Operating Current vs. Temp  
Start Threshold Voltage vs. Temp  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
-50 -25  
0
25  
50  
75  
100 125  
-50 -25  
0
25  
50  
75 100 125  
Junction Temperature()  
Junction Temperature()  
Stop Threshold Voltage vs. Temp  
Operating Freqency vs. Temp  
1.2  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
-50 -25  
0
25  
50  
75 100 125  
-50 -25  
0
25  
50  
75 100 125  
Junction Temperature()  
Junction Temperature()  
Maximum Duty vs. Temp  
Feedback Source Current vs. Temp  
8
FSDM07652R  
Typical Performance Characteristics (Continued)  
(These Characteristic Graphs are Normalized at Ta= 25°C)  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
-50 -25  
0
25  
50  
75  
100 125  
-50 -25  
0
25  
50  
75 100 125  
Junction Temperature()  
Junction Temperature()  
ShutDown Feedback Voltage vs. Temp  
ShutDown Delay Current vs. Temp  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
-50 -25  
0
25  
50  
75 100 125  
-50 -25  
0
25  
50  
75  
100 125  
Junction Temperature()  
Junction Temperature()  
Over Voltage Protection vs. Temp  
Burst Mode Enable Voltage vs. Temp  
1.2  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
-50 -25  
0
25  
50  
75  
100 125  
-50 -25  
0
25  
50  
75 100 125  
Junction Temperature()  
Junction Temperature()  
Burst Mode Disable Voltage vs. Temp  
Current Limit vs. Temp  
9
FSDM07652R  
Typical Performance Characteristics (Continued)  
(These Characteristic Graphs are Normalized at Ta= 25°C)  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
-50 -25  
0
25  
50  
75 100 125  
Junction Temperature()  
Soft Start Time vs. Temp  
10  
FSDM07652R  
2.1 Pulse-by-pulse current limit: Because current mode  
control is employed, the peak current through the Sense FET  
is limited by the inverting input of PWM comparator (Vfb*)  
as shown in figure 5. Assuming that the 0.9mA current  
source flows only through the internal resistor (2.5R +R= 2.8  
k), the cathode voltage of diode D2 is about 2.5V. Since D1  
is blocked when the feedback voltage (Vfb) exceeds 2.5V,  
the maximum voltage of the cathode of D2 is clamped at this  
voltage, thus clamping Vfb*. Therefore, the peak value of  
the current through the Sense FET is limited.  
Functional Description  
1. Startup : In previous generations of Fairchild Power  
Switches (FPSTM) the Vcc pin had an external start-up  
resistor to the DC input voltage line. In this generation the  
startup resistor is replaced by an internal high voltage current  
source. At startup, an internal high voltage current source  
supplies the internal bias and charges the external capacitor  
(C ) that is connected to the Vcc pin as illustrated in figure  
vcc  
4. When Vcc reaches 12V, the FPSTM begins switching and  
the internal high voltage current source is disabled. Then, the  
FPSTM continues its normal switching operation and the  
power is supplied from the auxiliary transformer winding  
unless Vcc goes below the stop voltage of 8V.  
2.2 Leading edge blanking (LEB) : At the instant the  
internal Sense FET is turned on, there usually exists a high  
current spike through the Sense FET, caused by primary-side  
capacitance and secondary-side rectifier reverse recovery.  
Excessive voltage across the Rsense resistor would lead to  
incorrect feedback operation in the current mode PWM  
control. To counter this effect, the FPSTM employs a leading  
edge blanking (LEB) circuit. This circuit inhibits the PWM  
VDC  
CVcc  
comparator for a short time (T  
turned on.  
) after the Sense FET is  
LEB  
Vcc  
Vstr  
3
6
Vcc  
Idelay  
Vref  
IFB  
Istart  
Vfb  
Vo  
SenseFET  
OSC  
Vref  
4
H11A817A  
D1  
D2  
8V/12V  
Vcc good  
CB  
2.5R  
+
Gate  
driver  
V *  
Internal  
Bias  
fb  
R
KA431  
-
OLP  
Rsense  
VSD  
Figure 4. Internal startup circuit  
Figure 5. Pulse width modulation (PWM) circuit  
3. Protection Circuit : The FSDM07652R has several self  
protective functions such as over load protection (OLP),  
abnormal over current protection (AOCP), over voltage  
protection (OVP) and thermal shutdown (TSD). Because  
these protection circuits are fully integrated into the IC  
without external components, the reliability can be improved  
without increasing cost. Once the fault condition occurs,  
switching is terminated and the Sense FET remains off. This  
causes Vcc to fall. When Vcc reaches the UVLO stop  
voltage, 8V, the protection is reset and the internal high  
voltage current source charges the Vcc capacitor via the Vstr  
pin. When Vcc reaches the UVLO start voltage,12V, the  
FPSTM resumes its normal operation. In this manner, the  
auto-restart can alternately enable and disable the switching  
of the power Sense FET until the fault condition is  
eliminated (see figure 6).  
2. Feedback Control : FSDM07652R employs current  
mode control, as shown in figure 5. An opto-coupler (such as  
the H11A817A) and shunt regulator (such as the KA431) are  
typically used to implement the feedback network.  
Comparing the feedback voltage with the voltage across the  
Rsense resistor plus an offset voltage makes it possible to  
control the switching duty cycle. When the reference pin  
voltage of the KA431 exceeds the internal reference voltage  
of 2.5V, the H11A817A LED current increases, thus pulling  
down the feedback voltage and reducing the duty cycle. This  
event typically happens when the input voltage is increased  
or the output load is decreased.  
11  
FSDM07652R  
VFB  
Fault  
occurs  
Fault  
Power  
on  
Over load protection  
Vds  
removed  
6.0V  
2.5V  
Vcc  
T12= Cfb*(6.0-2.5)/Idelay  
T1  
Figure 7. Over load protection  
T2  
t
12V  
8V  
t
3.2 Abnormal Over Current Protection (AOCP) : Even  
though the FPSTM has OLP (Over Load Protection) and  
current mode PWM feedback, these are not enough to protect  
the FPSTM when a secondary side diode short or a  
transformer pin short occurs. The FPSTM has an internal  
AOCP (Abnormal Over Current Protection) circuit as shown  
in figure 8. When the gate turn-on signal is applied to the  
power Sense FET, the AOCP block is enabled and monitors  
the current through the sensing resistor. The voltage across  
the resistor is then compared with a preset AOCP level. If the  
sensing resistor voltage is greater than the AOCP level for  
longer than 300ns, the reset signal is applied to the latch,  
resulting in the shutdown of SMPS.  
Normal  
operation  
Fault  
situation  
Normal  
operation  
Figure 6. Auto restart operation  
3.1 Over Load Protection (OLP) : Overload is defined as  
the load current exceeding a pre-set level due to an  
unexpected event. In this situation, the protection circuit  
should be activated in order to protect the SMPS. However,  
even when the SMPS is in the normal operation, the over  
load protection circuit can be activated during the load  
transition. In order to avoid this undesired operation, the over  
load protection circuit is designed to be activated after a  
specified time to determine whether it is a transient situation  
or an overload situation. Because of the pulse-by-pulse  
current limit capability, the maximum peak current through  
the Sense FET is limited, and therefore the maximum input  
power is restricted with a given input voltage. If the output  
consumes beyond this maximum power, the output voltage  
(Vo) decreases below the set voltage. This reduces the  
current through the opto-coupler LED, which also reduces  
the opto-coupler transistor current, thus increasing the  
feedback voltage (Vfb). If Vfb exceeds 2.5V, D1 is blocked  
2.5R  
OSC  
S
Q
Q
PWM  
Gate  
driver  
R
R
LEB  
R
sense  
+
2
AOCP  
and the 3.5uA current source starts to charge C slowly up to  
B
GND  
-
Vaocp  
Vcc. In this condition, Vfb continues increasing until it  
reaches 6V, when the switching operation is terminated as  
shown in figure 7. The delay time for shutdown is the time  
Figure 8. AOCP block  
required to charge C from 2.5V to 6.0V with 3.5uA. In  
B
general, a 10 ~ 50 ms delay time is typical for most  
applications.  
3.3 Over voltage Protection (OVP) : If the secondary side  
feedback circuit were to malfunction or a solder defect  
caused an open in the feedback path, the current through the  
opto-coupler transistor becomes almost zero. Then, Vfb  
climbs up in a similar manner to the over load situation,  
forcing the preset maximum current to be supplied to the  
SMPS until the over load protection is activated. Because  
more energy than required is provided to the output, the  
12  
FSDM07652R  
output voltage may exceed the rated voltage before the over  
load protection is activated, resulting in the breakdown of the  
devices in the secondary side. In order to prevent this  
situation, an over voltage protection (OVP) circuit is  
employed. In general, Vcc is proportional to the output  
voltage and the FPSTM uses Vcc instead of directly  
Vo  
Voset  
VFB  
monitoring the output voltage. If V exceeds 19V, an OVP  
CC  
circuit is activated resulting in the termination of the  
switching operation. In order to avoid undesired activation of  
OVP during normal operation, Vcc should be designed to be  
below 19V.  
0.7V  
0.5V  
Ids  
3.4 Thermal Shutdown (TSD) : The Sense FET and the  
control IC are built in one package. This makes it easy for  
the control IC to detect the heat generation from the Sense  
FET. When the temperature exceeds approximately 150°C,  
the thermal shutdown is activated.  
Vds  
time  
4. Soft Start : The FPSTM has an internal soft start circuit  
that increases PWM comparator inverting input voltage  
together with the Sense FET current slowly after it starts up.  
The typical soft start time is 10msec, The pulse width to the  
power switching device is progressively increased to  
establish the correct working conditions for transformers,  
inductors, and capacitors. The voltage on the output  
capacitors is progressively increased with the intention of  
smoothly establishing the required output voltage. It also  
helps to prevent transformer saturation and reduce the stress  
on the secondary diode during startup.  
Switching  
disabled  
Switching  
disabled  
T4  
T2 T3  
T1  
Figure 9. Waveforms of burst operation  
5. Burst operation : In order to minimize power dissipation  
in standby mode, the FPSTM enters burst mode operation.  
As the load decreases, the feedback voltage decreases. As  
shown in figure 9, the device automatically enters burst  
mode when the feedback voltage drops below  
V (500mV). At this point switching stops and the  
BURL  
output voltages start to drop at a rate dependent on standby  
current load. This causes the feedback voltage to rise. Once  
it passes V (700mV) switching resumes. The feedback  
BURH  
voltage then falls and the process repeats. Burst mode  
operation alternately enables and disables switching of the  
power Sense FET thereby reducing switching loss in  
Standby mode.  
13  
FSDM07652R  
Typical application circuit  
Application  
Output power  
40W  
Input voltage  
Universal input  
(85-265Vac)  
Output voltage (Max current)  
5V (2.0A)  
LCD Monitor  
12V (2.5A)  
Features  
• High efficiency (>81% at 85Vac input)  
• Low zero load power consumption (<300mW at 240Vac input)  
• Low standby mode power consumption (<800mW at 240Vac input and 0.3W load)  
• Low component count  
• Enhanced system reliability through various protection functions  
• Internal soft-start (10ms)  
Key Design Notes  
• Resistors R102 and R105 are employed to prevent start-up at low input voltage. After startup, there is no power loss in these  
resistors since the startup pin is internally disconnected after startup.  
• The delay time for over load protection is designed to be about 50ms with C106 of 47nF. If a faster triggering of OLP is  
required, C106 can be reduced to 10nF.  
• Zener diode ZD102 is used for a safety test such as UL. When the drain pin and feedback pin are shorted, the zener diode  
fails and remains short, which causes the fuse (F1) blown and prevents explosion of the opto-coupler (IC301). This zener  
diode also increases the immunity against line surge.  
1. Schematic  
D202  
MBRF10100  
T1  
EER3016  
L201  
12V, 2.5A  
10  
1
2
C202  
1000uF  
25V  
C201  
1000uF  
25V  
8
C104  
2.2nF  
1kV  
R103  
56k  
2W  
R102  
D101  
C103  
100uF  
400V  
30kΩ  
UF 4007  
3
R105  
BD101  
2KBP06M3N257  
2
40kΩ  
IC1  
FSDM07652R  
6
5
Vstr  
1
1
3
Drain  
Vcc  
D201  
MBRF1045  
L202  
NC  
3
5V, 2A  
4
Vfb  
4
7
4
ZD102  
10V  
D102  
TVR10G  
R104  
5Ω  
C204  
1000uF  
10V  
GND  
2
C105  
22uF  
50V  
C203  
1000uF  
10V  
6
C106  
47nF  
50V  
C102  
220nF  
275VAC  
ZD101  
22V  
5
C301  
4.7nF  
LF101  
23mH  
R201  
1kΩ  
R101  
560kΩ  
1W  
R204  
5.6kΩ  
R202  
1.2kΩ  
R203  
12kΩ  
C205  
47nF  
IC301  
H11A817A  
IC201  
KA431  
F1  
C101  
220nF  
275VAC  
RT1  
5D-9  
FUSE  
250V  
2A  
R205  
5.6kΩ  
14  
FSDM07652R  
2. Transformer Schematic Diagram  
EER3016  
1
2
3
10  
Np/2  
N12V  
9
Np/2  
8
4
5
7
N5V  
6
Na  
3.Winding Specification  
No  
Pin (sf)  
4 5  
Wire  
0.2φ × 1  
Turns  
Winding Method  
Na  
8
Center Winding  
Insulation: Polyester Tape t = 0.050mm, 2Layers  
Np/2 2 1  
0.4φ × 1  
Insulation: Polyester Tape t = 0.050mm, 2Layers  
N12v 10 8  
0.3φ × 3  
Insulation: Polyester Tape t = 0.050mm, 2Layers  
N5v 7 6  
0.3φ × 3  
Insulation: Polyester Tape t = 0.050mm, 2Layers  
Np/2 3 2  
0.4φ × 1  
18  
7
Solenoid Winding  
Center Winding  
Center Winding  
Solenoid Winding  
3
18  
Outer Insulation: Polyester Tape t = 0.050mm, 2Layers  
4.Electrical Characteristics  
Pin  
Specification  
520uH ± 10%  
10uH Max  
Remarks  
100kHz, 1V  
2nd all short  
Inductance  
1 - 3  
1 - 3  
Leakage Inductance  
5. Core & Bobbin  
Core : EER 3016  
Bobbin : EER3016  
Ae(mm2) : 96  
15  
FSDM07652R  
6.Demo Circuit Part List  
Part  
F101  
Value  
2A/250V  
5D-9  
Note  
Part  
Value  
Note  
Fuse  
NTC  
C301  
4.7nF  
Polyester Film Cap.  
Inductor  
RT101  
L201  
L202  
5uH  
5uH  
Wire 1.2mm  
Wire 1.2mm  
Resistor  
R101  
R102  
R103  
R104  
R105  
R201  
R202  
R203  
R204  
R205  
560K  
30K  
56K  
5
1W  
1/4W  
2W  
1/4W  
1/4W  
1/4W  
1/4W  
1/4W  
1/4W  
1/4W  
Diode  
40K  
1K  
D101  
D102  
UF4007  
TVR10G  
1.2K  
12K  
5.6K  
5.6K  
D201  
MBRF1045  
MBRF10100  
Zener Diode  
Zener Diode  
D202  
ZD101  
ZD102  
22V  
10V  
Bridge Diode  
BD101 2KBP06M 3N257  
Bridge Diode  
Capacitor  
C101  
C102  
C103  
C104  
C105  
C106  
C201  
C202  
C203  
C204  
C205  
220nF/275VAC  
220nF/275VAC  
100uF/400V  
2.2nF/1kV  
Box Capacitor  
Line Filter  
Box Capacitor  
LF101  
23mH  
Wire 0.4mm  
Electrolytic Capacitor  
Ceramic Capacitor  
Electrolytic Capacitor  
Ceramic Capacitor  
Electrolytic Capacitor  
Electrolytic Capacitor  
Electrolytic Capacitor  
Electrolytic Capacitor  
Ceramic Capacitor  
IC  
IC101  
IC201  
IC301  
FSDM07652R  
KA431(TL431)  
H11A817A  
FPSTM(7A,650V)  
Voltage reference  
Opto-coupler  
22uF/50V  
47nF/50V  
1000uF/25V  
1000uF/25V  
1000uF/10V  
1000uF/10V  
47nF/50V  
16  
FSDM07652R  
7. Layout  
Figure 10. Layout Considerations for FSDM07652R  
Figure 11. Layout Considerations for FSDM07652R  
17  
FSDM07652R  
Package Dimensions  
TO-220F-6L(Forming)  
18  
FSDM07652R  
Ordering Information  
Product Number  
Package  
TO-220F-6L(Forming)  
Marking Code  
BVdss  
Rds(on)Max.  
1.6 Ω  
FSDM07652RWDTU  
WDTU : Forming Type  
DM07652R  
650V  
19  
FSDM07652R  
DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY  
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY  
LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER  
DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES  
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR  
CORPORATION. As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the body,  
or (b) support or sustain life, and (c) whose failure to  
perform when properly used in accordance with  
instructions for use provided in the labeling, can be  
reasonably expected to result in a significant injury of the  
user.  
2. A critical component in any component of a life support  
device or system whose failure to perform can be  
reasonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
www.fairchildsemi.com  
1/12/05 0.0m 001  
2005 Fairchild Semiconductor Corporation  
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are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
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