FSDM07652RWDTU [ONSEMI]
用于 70W 离线反激转换器的 650V 集成电源开关;型号: | FSDM07652RWDTU |
厂家: | ONSEMI |
描述: | 用于 70W 离线反激转换器的 650V 集成电源开关 开关 电源开关 转换器 |
文件: | 总22页 (文件大小:380K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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FSDM07652R
TM
Green Mode Fairchild Power Switch (FPS )
Features
• Internal Avalanche Rugged Sense FET
• Advanced Burst-Mode operation consumes under 1 W at
240VAC & 0.5W load
• Precision Fixed Operating Frequency (66kHz)
• Internal Start-up Circuit
• Pulse by Pulse Current Limiting
• Abnormal Over Current Protection (AOCP)
• Over Voltage Protection (OVP)
OUTPUT POWER TABLE
(3)
230VAC ±15%
85-265VAC
PRODUCT
Adapt-
er
Open
Frame
Adapt- Open
er
(1)
(2)
(1)
(2)
Frame
FSDM0565R
FSDM07652R
60W
70W
70W
80W
50W
60W
60W
70W
• Over Load Protection (OLP)
• Internal Thermal Shutdown Function (TSD)
• Auto-Restart Mode
• Under Voltage Lock Out (UVLO) with hysteresis
• Low Operating Current (2.5mA)
Table 1. Notes: 1. Typical continuous power in a non-ven-
tilated enclosed adapter measured at 50°C ambient. 2.
Maximum practical continuous power in an open frame
design at 50°C ambient. 3. 230 VAC or 100/115 VAC with
doubler.
•
Built-in Soft Start
Application
• SMPS for LCD monitor and STB
• Adaptor
Typical Circuit
Description
AC
IN
DC
The FSDM07652R is an integrated Pulse Width Modulator
(PWM) and Sense FET specifically designed for high
performance offline Switch Mode Power Supplies (SMPS)
with minimal external components. This device is an
integrated high voltage power switching regulator which
combine an avalanche rugged Sense FET with a current mode
PWM control block. The PWM controller includes integrated
fixed frequency oscillator, under voltage lockout, leading
edge blanking (LEB), optimized gate driver, internal soft
start, temperature compensated precise current sources for a
loop compensation and self protection circuitry. Compared
with discrete MOSFET and PWM controller solution, it can
reduce total cost, component count, size and weight simulta-
neously increasing efficiency, productivity, and system
reliability. This device is a basic platform well suited for cost
effective designs of flyback converters.
OUT
Vstr
PWM
Drain
Vfb
Vcc
Source
Figure 1. Typical Flyback Application
Rev.1.0.6
©2005 Fairchild Semiconductor Corporation
FSDM07652R
Internal Block Diagram
Vcc
3
Vstr
6
Drain
1
N.C 5
Istart
+
0.5/0.7V
Internal
Bias
Vref
8V/12V
Vcc good
-
Vcc
Idelay
Vref
Switching disable
OSC
IFB
S
Q
Vfb
PWM
4
Gate
driver
R
Q
2.5R
Soft start
R
LEB
VSD
Vcc
Vovp
TSD
2
GND
S
Q
Q
R
Vcc good
AOCP
Vocp
Figure 2. Functional Block Diagram of FSDM07652R
2
FSDM07652R
Pin Definitions
Pin Number
Pin Name
Pin Function Description
This pin is the high voltage power Sense FET drain. It is designed to drive the
transformer directly.
1
2
Drain
GND
This pin is the control ground and the Sense FET source.
This pin is the positive supply voltage input. During start up, the power is sup-
plied by an internal high voltage current source that is connected to the Vstr pin.
When Vcc reaches 12V, the internal high voltage current source is disabled and
the power is supplied from the auxiliary transformer winding.
3
Vcc
This pin is internally connected to the inverting input of the PWM comparator.
The collector of an opto-coupler is typically tied to this pin. For stable operation,
a capacitor should be placed between this pin and GND. If the voltage of this pin
reaches 6.0V, the over load protection is activated resulting in shutdown of the
4
Vfb
FPSTM
-
.
5
6
N.C
Vstr
This pin is connected directly to the high voltage DC link. At startup, the internal
high voltage current source supplies internal bias and charges the external ca-
pacitor that is connected to the Vcc pin. Once Vcc reaches 12V, the internal cur-
rent source is disabled.
Pin Configuration
TO-220F-6L
6.Vstr
5.N.C.
4.Vfb
3.Vcc
2.GND
1.Drain
Figure 3. Pin Configuration (Top View)
3
FSDM07652R
Absolute Maximum Ratings
(Ta=25°C, unless otherwise specified)
Parameter
Symbol
Value
650
650
15
Unit
V
Drain-source voltage
Vstr Max Voltage
V
DSS
V
STR
V
(1)
Pulsed Drain current (Tc=25°C)
I
A
DM
DC
Continuous Drain Current(Tc=25°C)
Continuous Drain Current(Tc=100°C)
Single pulsed avalanche energy (2)
Single pulsed avalanche current (3)
Supply voltage
3.8
A
I
D
2.4
A
E
I
370
-
mJ
A
AS
AS
V
20
V
CC
Input voltage range
V
-0.3 to V
45
V
FB
CC
Total power dissipation(Tc=25°C)
Operating junction temperature
Operating ambient temperature
Storage temperature range
P (Watt H/S)
W
°C
°C
°C
kV
D
T
Internally limited
-25 to +85
j
T
A
STG
-
T
-55 to +150
ESD Capability, HBM Model (All pins
excepts for Vstr and Vfb)
2.0
(GND-Vstr/Vfb=1.5kV)
ESD Capability, Machine Model (All pins
excepts for Vstr and Vfb)
300
V
-
(GND-Vstr/Vfb=225V)
Notes:
1. Repetitive rating: Pulse width limited by maximum junction temperature
2. L=14mH, starting Tj=25°C
3. L=13uH, starting Tj=25°C
Thermal Impedance
Parameter
Symbol
Value
49.90
2.78
Unit
°C/W
°C/W
(1)
Junction-to-Ambient Thermal
Junction-to-Case Thermal
θJA
(2)
θJC
Notes:
1. Free standing with no heat-sink under natural convection.
2. Infinite cooling condition - Refer to the SEMI G30-88.
4
FSDM07652R
Electrical Characteristics
(Ta = 25°C unless otherwise specified)
Parameter
Sense FET SECTION
Symbol
Condition
Min. Typ. Max. Unit
Drain source breakdown voltage
BV
DSS
V
V
= 0V, I = 250µA
650
-
-
-
-
V
GS
D
= 650V, V
= 520V
= 0V
50
µA
DS
GS
Zero gate voltage drain current
I
DSS
V
V
DS
GS
-
-
-
200
1.6
µA
= 0V, T = 125°C
C
Static drain source on resistance (1)
Output capacitance
R
V
GS
= 10V, I = 2.5A
D
1.4
Ω
DS(ON)
V
= 0V, V = 25V,
DS
GS
f = 1MHz
C
-
100
-
pF
ns
OSS
Turn on delay time
Rise time
T
V
DD
= 325V, I = 5A
-
-
-
-
22
60
-
-
-
-
D(ON)
D
(MOSFET switching
time is essentially
independent of
T
R
Turn off delay time
Fall time
T
115
65
D(OFF)
operating temperature)
T
F
CONTROL SECTION
Initial frequency
F
V
= 3V
60
0
66
1
72
3
kHz
%
OSC
FB
Voltage stability
F
13V ≤ Vcc ≤ 18V
STABLE
Temperature stability (2)
Maximum duty cycle
Minimum duty cycle
Start threshold voltage
Stop threshold voltage
Feedback source current
Soft-start time
∆F
-25°C ≤ Ta ≤ 85°C
0
±5
80
-
±10
85
0
%
OSC
D
MAX
MIN
-
-
75
-
%
D
%
V
V
FB
V
FB
V
FB
V
FB
=GND
=GND
=GND
=3
11
7
12
8
13
9
V
START
V
V
STOP
I
0.7
-
0.9
10
250
1.1
15
-
mA
ms
ns
FB
T
S
Leading Edge Blanking time
BURST MODE SECTION
T
-
-
LEB
V
Vcc=14V
Vcc=14V
-
-
0.7
0.5
-
-
V
V
BURH
Burst Mode Voltages (2)
V
BURL
PROTECTION SECTION
Peak current limit (4)
I
V
=5V, V =14V
FB CC
2.2
18
2.5
19
2.8
20
A
V
OVER
Over voltage protection
V
-
-
OVP
Abnormal Over current protection
current (3)
I
5.54 6.15
6.77
A
AOCP
Thermal shutdown temperature (2)
Shutdown feedback voltage
T
130
5.5
145
6.0
160
6.5
°C
SD
V
V ≥ 5.5V
FB
V
SD
5
FSDM07652R
Shutdown delay current
I
V
=5V
2.8
3.5
2.5
4.2
5
µA
DELAY
FB
TOTAL DEVICE SECTION
I
V
FB
V
FB
V
FB
=GND, V =14V
CC
OP
Operating supply current (5)
I
=GND, V =10V
CC
-
mA
OP(MIN)
I
=GND, V =18V
CC
OP(MAX)
Notes:
1. Pulse test : Pulse width ≤ 300µS, duty ≤ 2%
2. These parameters, although guaranteed at the design, are not tested in mass production.
3. These parameters, although guaranteed, are tested in EDS(wafer test) process.
4. These parameters indicate the inductor current.
5. This parameter is the current flowing into the control IC.
6
FSDM07652R
Comparison Between FS6M07652RTC and FSDM07652R
Function
FS6M07652RTC
FSDM07652R
FSDM07652R Advantages
Soft-Start
Adjustable soft-start Internal soft-start with • Gradually increasing current limit
time using an
external capacitor
typically 10ms (fixed)
during soft-start further reduces peak
current and voltage component
stresses
• Eliminates external components used
for soft-start in most applications
• Reduces or eliminates output
overshoot
Burst Mode Operation • Built into controller • Built into controller • Improve light load efficiency
• Output voltage
drops to around
half
• Output voltage fixed • Reduces no-load consumption
7
FSDM07652R
Typical Performance Characteristics
(These Characteristic Graphs are Normalized at Ta= 25°C)
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-50 -25
0
25
50
75 100 125
-50 -25
0
25
50
75 100 125
Junction Temperature(℃)
Junction Temperature(℃)
Operating Current vs. Temp
Start Threshold Voltage vs. Temp
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-50 -25
0
25
50
75
100 125
-50 -25
0
25
50
75 100 125
Junction Temperature(℃)
Junction Temperature(℃)
Stop Threshold Voltage vs. Temp
Operating Freqency vs. Temp
1.2
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.0
0.8
0.6
0.4
0.2
0.0
-50 -25
0
25
50
75 100 125
-50 -25
0
25
50
75 100 125
Junction Temperature(℃)
Junction Temperature(℃)
Maximum Duty vs. Temp
Feedback Source Current vs. Temp
8
FSDM07652R
Typical Performance Characteristics (Continued)
(These Characteristic Graphs are Normalized at Ta= 25°C)
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-50 -25
0
25
50
75
100 125
-50 -25
0
25
50
75 100 125
Junction Temperature(℃)
Junction Temperature(℃)
ShutDown Feedback Voltage vs. Temp
ShutDown Delay Current vs. Temp
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-50 -25
0
25
50
75 100 125
-50 -25
0
25
50
75
100 125
Junction Temperature(℃)
Junction Temperature(℃)
Over Voltage Protection vs. Temp
Burst Mode Enable Voltage vs. Temp
1.2
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.0
0.8
0.6
0.4
0.2
0.0
-50 -25
0
25
50
75
100 125
-50 -25
0
25
50
75 100 125
Junction Temperature(℃)
Junction Temperature(℃)
Burst Mode Disable Voltage vs. Temp
Current Limit vs. Temp
9
FSDM07652R
Typical Performance Characteristics (Continued)
(These Characteristic Graphs are Normalized at Ta= 25°C)
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-50 -25
0
25
50
75 100 125
Junction Temperature(℃)
Soft Start Time vs. Temp
10
FSDM07652R
2.1 Pulse-by-pulse current limit: Because current mode
control is employed, the peak current through the Sense FET
is limited by the inverting input of PWM comparator (Vfb*)
as shown in figure 5. Assuming that the 0.9mA current
source flows only through the internal resistor (2.5R +R= 2.8
kΩ), the cathode voltage of diode D2 is about 2.5V. Since D1
is blocked when the feedback voltage (Vfb) exceeds 2.5V,
the maximum voltage of the cathode of D2 is clamped at this
voltage, thus clamping Vfb*. Therefore, the peak value of
the current through the Sense FET is limited.
Functional Description
1. Startup : In previous generations of Fairchild Power
Switches (FPSTM) the Vcc pin had an external start-up
resistor to the DC input voltage line. In this generation the
startup resistor is replaced by an internal high voltage current
source. At startup, an internal high voltage current source
supplies the internal bias and charges the external capacitor
(C ) that is connected to the Vcc pin as illustrated in figure
vcc
4. When Vcc reaches 12V, the FPSTM begins switching and
the internal high voltage current source is disabled. Then, the
FPSTM continues its normal switching operation and the
power is supplied from the auxiliary transformer winding
unless Vcc goes below the stop voltage of 8V.
2.2 Leading edge blanking (LEB) : At the instant the
internal Sense FET is turned on, there usually exists a high
current spike through the Sense FET, caused by primary-side
capacitance and secondary-side rectifier reverse recovery.
Excessive voltage across the Rsense resistor would lead to
incorrect feedback operation in the current mode PWM
control. To counter this effect, the FPSTM employs a leading
edge blanking (LEB) circuit. This circuit inhibits the PWM
VDC
CVcc
comparator for a short time (T
turned on.
) after the Sense FET is
LEB
Vcc
Vstr
3
6
Vcc
Idelay
Vref
IFB
Istart
Vfb
Vo
SenseFET
OSC
Vref
4
H11A817A
D1
D2
8V/12V
Vcc good
CB
2.5R
+
Gate
driver
V *
Internal
Bias
fb
R
KA431
-
OLP
Rsense
VSD
Figure 4. Internal startup circuit
Figure 5. Pulse width modulation (PWM) circuit
3. Protection Circuit : The FSDM07652R has several self
protective functions such as over load protection (OLP),
abnormal over current protection (AOCP), over voltage
protection (OVP) and thermal shutdown (TSD). Because
these protection circuits are fully integrated into the IC
without external components, the reliability can be improved
without increasing cost. Once the fault condition occurs,
switching is terminated and the Sense FET remains off. This
causes Vcc to fall. When Vcc reaches the UVLO stop
voltage, 8V, the protection is reset and the internal high
voltage current source charges the Vcc capacitor via the Vstr
pin. When Vcc reaches the UVLO start voltage,12V, the
FPSTM resumes its normal operation. In this manner, the
auto-restart can alternately enable and disable the switching
of the power Sense FET until the fault condition is
eliminated (see figure 6).
2. Feedback Control : FSDM07652R employs current
mode control, as shown in figure 5. An opto-coupler (such as
the H11A817A) and shunt regulator (such as the KA431) are
typically used to implement the feedback network.
Comparing the feedback voltage with the voltage across the
Rsense resistor plus an offset voltage makes it possible to
control the switching duty cycle. When the reference pin
voltage of the KA431 exceeds the internal reference voltage
of 2.5V, the H11A817A LED current increases, thus pulling
down the feedback voltage and reducing the duty cycle. This
event typically happens when the input voltage is increased
or the output load is decreased.
11
FSDM07652R
VFB
Fault
occurs
Fault
Power
on
Over load protection
Vds
removed
6.0V
2.5V
Vcc
T12= Cfb*(6.0-2.5)/Idelay
T1
Figure 7. Over load protection
T2
t
12V
8V
t
3.2 Abnormal Over Current Protection (AOCP) : Even
though the FPSTM has OLP (Over Load Protection) and
current mode PWM feedback, these are not enough to protect
the FPSTM when a secondary side diode short or a
transformer pin short occurs. The FPSTM has an internal
AOCP (Abnormal Over Current Protection) circuit as shown
in figure 8. When the gate turn-on signal is applied to the
power Sense FET, the AOCP block is enabled and monitors
the current through the sensing resistor. The voltage across
the resistor is then compared with a preset AOCP level. If the
sensing resistor voltage is greater than the AOCP level for
longer than 300ns, the reset signal is applied to the latch,
resulting in the shutdown of SMPS.
Normal
operation
Fault
situation
Normal
operation
Figure 6. Auto restart operation
3.1 Over Load Protection (OLP) : Overload is defined as
the load current exceeding a pre-set level due to an
unexpected event. In this situation, the protection circuit
should be activated in order to protect the SMPS. However,
even when the SMPS is in the normal operation, the over
load protection circuit can be activated during the load
transition. In order to avoid this undesired operation, the over
load protection circuit is designed to be activated after a
specified time to determine whether it is a transient situation
or an overload situation. Because of the pulse-by-pulse
current limit capability, the maximum peak current through
the Sense FET is limited, and therefore the maximum input
power is restricted with a given input voltage. If the output
consumes beyond this maximum power, the output voltage
(Vo) decreases below the set voltage. This reduces the
current through the opto-coupler LED, which also reduces
the opto-coupler transistor current, thus increasing the
feedback voltage (Vfb). If Vfb exceeds 2.5V, D1 is blocked
2.5R
OSC
S
Q
Q
PWM
Gate
driver
R
R
LEB
R
sense
+
2
AOCP
and the 3.5uA current source starts to charge C slowly up to
B
GND
-
Vaocp
Vcc. In this condition, Vfb continues increasing until it
reaches 6V, when the switching operation is terminated as
shown in figure 7. The delay time for shutdown is the time
Figure 8. AOCP block
required to charge C from 2.5V to 6.0V with 3.5uA. In
B
general, a 10 ~ 50 ms delay time is typical for most
applications.
3.3 Over voltage Protection (OVP) : If the secondary side
feedback circuit were to malfunction or a solder defect
caused an open in the feedback path, the current through the
opto-coupler transistor becomes almost zero. Then, Vfb
climbs up in a similar manner to the over load situation,
forcing the preset maximum current to be supplied to the
SMPS until the over load protection is activated. Because
more energy than required is provided to the output, the
12
FSDM07652R
output voltage may exceed the rated voltage before the over
load protection is activated, resulting in the breakdown of the
devices in the secondary side. In order to prevent this
situation, an over voltage protection (OVP) circuit is
employed. In general, Vcc is proportional to the output
voltage and the FPSTM uses Vcc instead of directly
Vo
Voset
VFB
monitoring the output voltage. If V exceeds 19V, an OVP
CC
circuit is activated resulting in the termination of the
switching operation. In order to avoid undesired activation of
OVP during normal operation, Vcc should be designed to be
below 19V.
0.7V
0.5V
Ids
3.4 Thermal Shutdown (TSD) : The Sense FET and the
control IC are built in one package. This makes it easy for
the control IC to detect the heat generation from the Sense
FET. When the temperature exceeds approximately 150°C,
the thermal shutdown is activated.
Vds
time
4. Soft Start : The FPSTM has an internal soft start circuit
that increases PWM comparator inverting input voltage
together with the Sense FET current slowly after it starts up.
The typical soft start time is 10msec, The pulse width to the
power switching device is progressively increased to
establish the correct working conditions for transformers,
inductors, and capacitors. The voltage on the output
capacitors is progressively increased with the intention of
smoothly establishing the required output voltage. It also
helps to prevent transformer saturation and reduce the stress
on the secondary diode during startup.
Switching
disabled
Switching
disabled
T4
T2 T3
T1
Figure 9. Waveforms of burst operation
5. Burst operation : In order to minimize power dissipation
in standby mode, the FPSTM enters burst mode operation.
As the load decreases, the feedback voltage decreases. As
shown in figure 9, the device automatically enters burst
mode when the feedback voltage drops below
V (500mV). At this point switching stops and the
BURL
output voltages start to drop at a rate dependent on standby
current load. This causes the feedback voltage to rise. Once
it passes V (700mV) switching resumes. The feedback
BURH
voltage then falls and the process repeats. Burst mode
operation alternately enables and disables switching of the
power Sense FET thereby reducing switching loss in
Standby mode.
13
FSDM07652R
Typical application circuit
Application
Output power
40W
Input voltage
Universal input
(85-265Vac)
Output voltage (Max current)
5V (2.0A)
LCD Monitor
12V (2.5A)
Features
• High efficiency (>81% at 85Vac input)
• Low zero load power consumption (<300mW at 240Vac input)
• Low standby mode power consumption (<800mW at 240Vac input and 0.3W load)
• Low component count
• Enhanced system reliability through various protection functions
• Internal soft-start (10ms)
Key Design Notes
• Resistors R102 and R105 are employed to prevent start-up at low input voltage. After startup, there is no power loss in these
resistors since the startup pin is internally disconnected after startup.
• The delay time for over load protection is designed to be about 50ms with C106 of 47nF. If a faster triggering of OLP is
required, C106 can be reduced to 10nF.
• Zener diode ZD102 is used for a safety test such as UL. When the drain pin and feedback pin are shorted, the zener diode
fails and remains short, which causes the fuse (F1) blown and prevents explosion of the opto-coupler (IC301). This zener
diode also increases the immunity against line surge.
1. Schematic
D202
MBRF10100
T1
EER3016
L201
12V, 2.5A
10
1
2
C202
1000uF
25V
C201
1000uF
25V
8
C104
2.2nF
1kV
R103
56kΩ
2W
R102
D101
C103
100uF
400V
30kΩ
UF 4007
3
R105
BD101
2KBP06M3N257
2
40kΩ
IC1
FSDM07652R
6
5
Vstr
1
1
3
Drain
Vcc
D201
MBRF1045
L202
NC
3
5V, 2A
4
Vfb
4
7
4
ZD102
10V
D102
TVR10G
R104
5Ω
C204
1000uF
10V
GND
2
C105
22uF
50V
C203
1000uF
10V
6
C106
47nF
50V
C102
220nF
275VAC
ZD101
22V
5
C301
4.7nF
LF101
23mH
R201
1kΩ
R101
560kΩ
1W
R204
5.6kΩ
R202
1.2kΩ
R203
12kΩ
C205
47nF
IC301
H11A817A
IC201
KA431
F1
C101
220nF
275VAC
RT1
5D-9
FUSE
250V
2A
R205
5.6kΩ
14
FSDM07652R
2. Transformer Schematic Diagram
EER3016
1
2
3
10
Np/2
N12V
9
Np/2
8
4
5
7
N5V
6
Na
3.Winding Specification
No
Pin (s→f)
4 → 5
Wire
0.2φ × 1
Turns
Winding Method
Na
8
Center Winding
Insulation: Polyester Tape t = 0.050mm, 2Layers
Np/2 2 → 1
0.4φ × 1
Insulation: Polyester Tape t = 0.050mm, 2Layers
N12v 10 → 8
0.3φ × 3
Insulation: Polyester Tape t = 0.050mm, 2Layers
N5v 7 → 6
0.3φ × 3
Insulation: Polyester Tape t = 0.050mm, 2Layers
Np/2 3 → 2
0.4φ × 1
18
7
Solenoid Winding
Center Winding
Center Winding
Solenoid Winding
3
18
Outer Insulation: Polyester Tape t = 0.050mm, 2Layers
4.Electrical Characteristics
Pin
Specification
520uH ± 10%
10uH Max
Remarks
100kHz, 1V
2nd all short
Inductance
1 - 3
1 - 3
Leakage Inductance
5. Core & Bobbin
Core : EER 3016
Bobbin : EER3016
Ae(mm2) : 96
15
FSDM07652R
6.Demo Circuit Part List
Part
F101
Value
2A/250V
5D-9
Note
Part
Value
Note
Fuse
NTC
C301
4.7nF
Polyester Film Cap.
Inductor
RT101
L201
L202
5uH
5uH
Wire 1.2mm
Wire 1.2mm
Resistor
R101
R102
R103
R104
R105
R201
R202
R203
R204
R205
560K
30K
56K
5
1W
1/4W
2W
1/4W
1/4W
1/4W
1/4W
1/4W
1/4W
1/4W
Diode
40K
1K
D101
D102
UF4007
TVR10G
1.2K
12K
5.6K
5.6K
D201
MBRF1045
MBRF10100
Zener Diode
Zener Diode
D202
ZD101
ZD102
22V
10V
Bridge Diode
BD101 2KBP06M 3N257
Bridge Diode
Capacitor
C101
C102
C103
C104
C105
C106
C201
C202
C203
C204
C205
220nF/275VAC
220nF/275VAC
100uF/400V
2.2nF/1kV
Box Capacitor
Line Filter
Box Capacitor
LF101
23mH
Wire 0.4mm
Electrolytic Capacitor
Ceramic Capacitor
Electrolytic Capacitor
Ceramic Capacitor
Electrolytic Capacitor
Electrolytic Capacitor
Electrolytic Capacitor
Electrolytic Capacitor
Ceramic Capacitor
IC
IC101
IC201
IC301
FSDM07652R
KA431(TL431)
H11A817A
FPSTM(7A,650V)
Voltage reference
Opto-coupler
22uF/50V
47nF/50V
1000uF/25V
1000uF/25V
1000uF/10V
1000uF/10V
47nF/50V
16
FSDM07652R
7. Layout
Figure 10. Layout Considerations for FSDM07652R
Figure 11. Layout Considerations for FSDM07652R
17
FSDM07652R
Package Dimensions
TO-220F-6L(Forming)
18
FSDM07652R
Ordering Information
Product Number
Package
TO-220F-6L(Forming)
Marking Code
BVdss
Rds(on)Max.
1.6 Ω
FSDM07652RWDTU
WDTU : Forming Type
DM07652R
650V
19
FSDM07652R
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1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, and (c) whose failure to
perform when properly used in accordance with
instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury of the
user.
2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
www.fairchildsemi.com
1/12/05 0.0m 001
2005 Fairchild Semiconductor Corporation
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