FSLV16211MTDX [ONSEMI]

24 位总线开关;
FSLV16211MTDX
型号: FSLV16211MTDX
厂家: ONSEMI    ONSEMI
描述:

24 位总线开关

开关
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is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
October 2010  
FSLV16211 — 24-Bit Bus Switch  
Features  
Description  
The FSLV16211 is a 24-bit, high-speed, low-voltage  
bus switch. The low on resistance of the switch allows  
inputs to be connected to outputs without adding  
propagation delay or generating additional ground  
bounce noise.  
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5Ω Switch Connection between Two Ports  
Minimal Propagation Delay through the Switch  
Low lCC  
Zero Bounce in Flow-Through Mode  
This design can be used as a 12- or 24-bit bus switch.  
When /OE1 is LOW, port 1A is connected to Port 1B.  
When /OE2 is LOW, port 2A is connected to Port 2B.  
Packaged in Thin-Shrink Small Outline Package  
(TSSOP)  
Ordering Information  
Operating  
Part Number  
Temperature  
Range  
Package  
Packing Method  
56-Lead, Thin Shrink Small Outline Package  
(TSSOP), JEDEC M0-153, 6.1mm Wide  
FSLV16211MTDX  
-40°C to 85°C  
Tape and Reel  
1A  
1A  
1B  
1B  
1
1
12  
12  
/OE  
1
2A  
2B  
2B  
1
1
2A  
12  
12  
/OE  
2
Figure 1. Logic Diagram  
© 2003 Fairchild Semiconductor Corporation  
FSLV16211 Rev. 1.0.2  
www.fairchildsemi.com  
Connection Diagram  
Figure 2. Pin Assignments for TSSOP  
(Top Through View)  
Pin Description  
Pin Name  
Description  
OE1, OE2  
1A, 2A  
1B, 2B  
NC  
Bus Switch Enables  
Bus A  
Bus B  
No Connect  
Truth Table  
Inputs  
Inputs/Outputs  
OE1  
Low  
Low  
High  
High  
OE2  
Low  
High  
Low  
High  
1A,1B  
1A=1B  
1A=1B  
Z
2A, 2B  
2A=2B  
Z
2A=2B  
Z
Z
© 2003 Fairchild Semiconductor Corporation  
FSLV16211 Rev. 1.0.2  
www.fairchildsemi.com  
2
Absolute Maximum Ratings  
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be  
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.  
In addition, extended exposure to stresses above the recommended operating conditions may affect device  
reliability. The absolute maximum ratings are stress ratings only.  
Symbol  
VCC  
Parameter  
Min.  
-0.5  
-0.5  
-0.5  
Max.  
4.6  
Unit  
V
Supply Voltage  
VS  
DC Switch Voltage(1)  
4.6  
V
VIN  
DC Input Voltage  
4.6  
V
IIK  
DC Input Diode Current  
DC Output Sink Current  
DC VCC/GND Current  
Storage Temperature Range  
-50  
mA  
mA  
mA  
°C  
IOUT  
128  
±100  
150  
ICC/IGNG  
TSTG  
Note:  
-65  
1. The input and output negative voltage ratings may be exceeded if the input and output diode current ratings are  
observed.  
Recommended Operating Conditions  
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended  
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not  
recommend exceeding them or designing to Absolute Maximum Ratings.(2)  
Symbol  
VCC  
Parameter  
Power Supply Operating Voltage  
Input Voltage  
Min.  
2.3  
0
Max.  
3.6  
3.6  
3.6  
4.0  
DC  
85  
Unit  
V
VIN  
V
VOUT  
Output Voltage  
0
V
Switch Control Input  
Switch I/O  
Free Air Operating Temperature  
0
ns/V  
ns/V  
°C  
tr, tf  
Input Rise and Fall Time  
0
TA  
-40  
Note:  
2. Unused control inputs must be held HIGH or LOW. They may not float.  
© 2003 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FSLV16211 Rev. 1.0.2  
3
DC Electrical Characteristics  
Not all conditions may appear on all switch types.  
TA = -40°C to +85°C  
VCC  
(V)  
Symbol  
Parameter  
Conditions  
IIN = -18mA  
Unit  
Min.  
Typ.  
Max.  
VIK  
VIH  
Clamp Diode Voltage  
3.0  
-1.2  
V
V
2.3-2.7  
2.7-3.6  
2.3-2.7  
2.7-3.6  
1.7  
2.0  
HIGH Level Control Input  
Voltage  
0.7  
0.8  
LOW Level Control Input  
Voltage  
VIL  
V
Force VI = 3.6V,  
OUT = 0.0A  
2.3  
10  
I
IL  
Input Leakage Current  
µA  
µA  
Force VI = 3.6V  
0 VIN 3.6V  
VIN = VCC or GND,  
0.0  
3.6  
10  
1
ICC  
Quiescent Supply Current  
3.6  
3.6  
10  
I
OUT = 0A  
One Input at 3V Other  
Inputs at VCC or GND  
ICC  
Increase in ICC per Input  
Off-State Leakage  
300  
µA  
µA  
IOZ  
3.6  
3.0  
3.0  
3.0  
2.3  
2.3  
2.3  
2.3  
2.3  
-1  
1
7
0.0 A, B 3.6V  
IIN = 64mA, VI = 0.0V  
IIN = 30mA, VI = 0.0V  
IIN = 15mA, VI = 2.4V  
IIN = 15mA, VI = 3.0V  
IIN = 64mA, VI = 0.0V  
IIN = 30mA, VI = 0.0V  
IIN = 15mA, VI = 1.7V  
IIN = 15mA, VI = 2.0V  
5
5
7
10  
15  
20  
8
RON  
Switch On Resistance  
Ω
5
5
8
10  
15  
20  
AC Electrical Characteristics  
TA=-40°C to +85°C  
CL=30pF, RL=500Ω  
VCC = 2.5V ± 0.20V  
TA=40°C to +85°C  
CL=50pF, RL=500Ω  
VCC=3.3V ± 0.30V  
Symbol  
Parameter  
Unit  
Min.  
Max.  
0.15  
4.7  
Min.  
Max.  
0.25  
7.0  
tPHL, tPLH  
tPHZ, tPLZ  
tPZH, tPZL  
Propagation Delay(3)  
Enable Time  
ns  
ns  
ns  
0.5  
0.5  
1.0  
1.0  
Disable Time  
5.1  
5.5  
Note:  
3. This parameter is guaranteed by design, but is not production tested. The bus switch contributes no propagation  
delay other than the RC delay of the typical on resistance of the switch and the load capacitance when driven by  
an ideal voltage source (zero output impedance).  
© 2003 Fairchild Semiconductor Corporation  
FSLV16211 Rev. 1.0.2  
www.fairchildsemi.com  
4
Capacitance  
TA = +25°C, f = 1MHz, unless otherwise noted. Capacitance is characterized, but not production tested.  
Symbol  
CIN  
Parameter  
Conditions  
VCC – 3.3V  
VCC, /OE= 3.3V  
Min.  
Typ.  
4.5  
Max.  
Unit  
pF  
Control Pin Input Capacitance  
Input/Output Capacitance  
CI/O  
18  
pF  
AC Loading Waveforms  
TEST  
SWITCH  
tPD  
Open  
VIN  
tPLZ/tPZL  
tPHZ/tPZH  
GND  
Figure 3. AC Test Circuit  
Figure 4. AC Waveforms  
VCC  
Symbol  
VMI  
3.3V ± 0.3V  
1.5V  
2.5V ± 0.2V  
VCC/2  
VCC/2  
0.15V  
2 x VCC  
VCC  
VMO  
1.5V  
VMVO  
VIN  
0.3V  
6.0V  
VCCV  
tr/tf  
3.0V  
2ns  
2.5ns  
© 2003 Fairchild Semiconductor Corporation  
FSLV16211 Rev. 1.0.2  
www.fairchildsemi.com  
5
Physical Dimensions  
A
56  
51  
34  
29  
B
8.10  
4.05  
0.2  
C B A  
1
6
23  
28  
0.30  
0.50  
0.1 C  
-C-  
0.50  
0.10  
A
B
C
0.25  
MTD56REV3  
Figure 5. 56-Lead Thin-Shrink Small Outline Package (TSSOP), JEDEC MO153, 6.1mm Wide  
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner  
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify  
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically  
the warranty therein, which covers Fairchild products.  
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:  
http://www.fairchildsemi.com/packaging/.  
© 2003 Fairchild Semiconductor Corporation  
FSLV16211 Rev. 1.0.2  
www.fairchildsemi.com  
6
© 2003 Fairchild Semiconductor Corporation  
FSLV16211 Rev. 1.0.2  
www.fairchildsemi.com  
7
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
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