J309RLRP [ONSEMI]

TRANSISTOR UHF BAND, Si, N-CHANNEL, RF SMALL SIGNAL, JFET, TO-92, CASE 29-11, TO-226AA, 3 PIN, FET RF Small Signal;
J309RLRP
型号: J309RLRP
厂家: ONSEMI    ONSEMI
描述:

TRANSISTOR UHF BAND, Si, N-CHANNEL, RF SMALL SIGNAL, JFET, TO-92, CASE 29-11, TO-226AA, 3 PIN, FET RF Small Signal

放大器 晶体管
文件: 总5页 (文件大小:63K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
J309, J310  
Preferred Device  
JFET VHF/UHF Amplifiers  
N−Channel — Depletion  
Features  
http://onsemi.com  
Pb−Free Packages are Available*  
1 DRAIN  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
Unit  
3
DrainSource Voltage  
V
25  
Vdc  
GATE  
DS  
GateSource Voltage  
Forward Gate Current  
V
25  
10  
Vdc  
GS  
GF  
I
mAdc  
2 SOURCE  
Total Device Dissipation @ T = 25°C  
P
350  
2.8  
mW  
mW/°C  
A
D
Derate above = 25°C  
Junction Temperature Range  
Storage Temperature Range  
T
−65 to +125  
−65 to +150  
°C  
°C  
J
T
stg  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
TO−92  
CASE 29−11  
STYLE 5  
1
2
3
MARKING DIAGRAM  
J3xx  
AYWW G  
G
J3xx = Device Code  
xx = 09 or 10  
A
Y
= Assembly Location  
= Year  
WW = Work Week  
G
= Pb−Free Package  
(Note: Microdot may be in either location)  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 3 of this data sheet.  
Preferred devices are recommended choices for future use  
and best overall value.  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
March, 2006 − Rev. 1  
J309/D  
J309, J310  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
A
Characteristic  
OFF CHARACTERISTICS  
Symbol  
Min  
Typ  
Max  
Unit  
GateSource Breakdown Voltage  
V
25  
Vdc  
(BR)GSS  
(I = −1.0 mAdc, V = 0)  
G
DS  
Gate Reverse Current  
I
GSS  
(V = −15 Vdc, V = 0, T = 25°C)  
−1.0  
−1.0  
nAdc  
mAdc  
GS  
DS  
DS  
A
A
(V = −15 Vdc, V = 0, T = +125°C)  
GS  
Gate Source Cutoff Voltage  
V
Vdc  
GS(off)  
(V = 10 Vdc, I = 1.0 nAdc)  
J309  
J310  
1.0  
2.0  
4.0  
6.5  
DS  
D
ON CHARACTERISTICS  
(1)  
ZeroGateVoltage Drain Current  
(V = 10 Vdc, V = 0)  
I
mAdc  
Vdc  
DSS  
J309  
J310  
12  
24  
30  
60  
DS  
GS  
Gate−Source Forward Voltage  
(V = 0, I = 1.0 mAdc)  
V
1.0  
GS(f)  
DS  
G
SMALLSIGNAL CHARACTERISTICS  
Common−Source Input Conductance  
Re(y )  
mmhos  
is  
(V = 10 Vdc, I = 10 mAdc, f = 100 MHz)  
J309  
J310  
0.7  
0.5  
DS  
D
Common−Source Output Conductance  
(V = 10 Vdc, I = 10 mAdc, f = 100 MHz)  
Re(y  
)
0.25  
mmhos  
dB  
os  
DS  
D
Common−Gate Power Gain  
(V = 10 Vdc, I = 10 mAdc, f = 100 MHz)  
G
pg  
16  
DS  
D
Common−Source Forward Transconductance  
(V = 10 Vdc, I = 10 mAdc, f = 100 MHz)  
Re(y )  
12  
mmhos  
mmhos  
mmhos  
fs  
DS  
D
Common−Gate Input Conductance  
(V = 10 Vdc, I = 10 mAdc, f = 100 MHz)  
Re(y )  
12  
ig  
DS  
D
Common−Source Forward Transconductance  
(V = 10 Vdc, I = 10 mAdc, f = 1.0 kHz)  
g
fs  
J309  
J310  
10000  
8000  
20000  
18000  
DS  
D
Common−Source Output Conductance  
(V = 10 Vdc, I = 10 mAdc, f = 1.0 kHz)  
g
250  
mmhos  
mmhos  
os  
DS  
D
Common−Gate Forward Transconductance  
(V = 10 Vdc, I = 10 mAdc, f = 1.0 kHz)  
g
fg  
J309  
J310  
13000  
12000  
DS  
D
Common−Gate Output Conductance  
(V = 10 Vdc, I = 10 mAdc, f = 1.0 kHz)  
g
og  
mmhos  
J309  
J310  
100  
150  
DS  
D
Gate−Drain Capacitance  
(V = 0, V = −10 Vdc, f = 1.0 MHz)  
C
C
1.8  
2.5  
pF  
pF  
gd  
DS  
GS  
Gate−Source Capacitance  
(V = 0, V = −10 Vdc, f = 1.0 MHz)  
4.3  
5.0  
gs  
DS  
GS  
FUNCTIONAL CHARACTERISTICS  
Equivalent Short−Circuit Input Noise Voltage  
e
n
10  
Ǹ
nVń Hz  
(V = 10 Vdc, I = 10 mAdc, f = 100 Hz)  
DS  
D
1. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 3.0%.  
http://onsemi.com  
2
J309, J310  
ORDERING INFORMATION  
Device  
Package  
Shipping  
J309  
TO−92  
1000 Units / Bulk  
1000 Units / Bulk  
J309G  
TO−92  
(Pb−Free)  
J310  
TO−92  
J310G  
TO−92  
(Pb−Free)  
J310RLRP  
TO−92  
2000 Units / Tape & Ammo Box  
2000 Units / Tape & Ammo Box  
J310RLRPG  
TO−92  
(Pb−Free)  
J310ZL1  
TO−92  
J310ZL1G  
TO−92  
(Pb−Free)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
70  
60  
50  
40  
30  
20  
10  
0
70  
60  
35  
30  
T
= −ꢀ55°C  
V
= 10 V  
A
DS  
V
= 10 V  
I
T = −ꢀ55°C  
A
DS  
f = 1.0 MHz  
+ꢀ25 °C  
+ꢀ25 °C  
50  
40  
30  
20  
10  
25  
20  
15  
10  
5.0  
0
+ꢀ25 °C  
DSS  
+ꢀ25 °C  
+150°C  
−ꢀ55°C  
+150°C  
+150°C  
+ꢀ25 °C  
−ꢀ55°C  
+150°C  
−1.0  
0
−5.0  
−4.0  
−3.0  
−2.0  
1.0  
, GATE−SOURCE VOLTAGE (VOLTS)  
0
5.0  
4.0  
3.0  
2.0  
I
− V , GATE−SOURCE VOLTAGE (VOLTS)  
GS  
D
V
GS  
I
− V , GATE−SOURCE CUTOFF VOLTAGE (VOLTS)  
GS  
DSS  
Figure 1. Drain Current and Transfer  
Characteristics versus Gate−Source Voltage  
Figure 2. Forward Transconductance  
versus Gate−Source Voltage  
http://onsemi.com  
3
J309, J310  
100 k  
10 k  
10  
120  
96  
72  
48  
24  
0
1.0 k  
R
DS  
Y
fs  
Y
fs  
7.0  
100  
C
gs  
4.0  
V
V
=
ꢀ2.3 V =  
10  
1.0 k  
100  
GS(off)  
GS(off)  
Y
os  
= −ꢀ5.7 V =  
C
gd  
1.0  
0
1.0  
0.01  
0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 20 30 50 100  
10 9.0 8.0 7.0 6.0 5.0 4.0 3.0 2.0 1.0  
0
I , DRAIN CURRENT (mA)  
D
V
, GATE SOURCE VOLTAGE (VOLTS)  
GS  
Figure 3. Common−Source Output  
Admittance and Forward Transconductance  
versus Drain Current  
Figure 4. On Resistance and Junction  
Capacitance versus Gate−Source Voltage  
|S |, |S  
|
|S |, |S |  
12 22  
21  
11  
0.85 0.45  
0.79 0.39  
0.73 0.33  
0.67 0.27  
0.61 0.21  
0.55 0.15  
0.060 1.00  
0.048 0.98  
0.036 0.96  
0.024 0.94  
0.012 0.92  
0.90  
30  
24  
18  
12  
6.0  
0
3.0  
2.4  
1.8  
1.2  
0.6  
S
22  
V
= 10 V  
= 10 mA  
= 25°C  
DS  
I
D
S
21  
T
A
Y
11  
V
= 10 V  
= 10 mA  
= 25°C  
DS  
I
D
T
A
Y
Y
21  
22  
S
11  
S
12  
Y
12  
100  
200  
300  
500 700 1000  
100  
200  
300  
500 700 1000  
f, FREQUENCY (MHz)  
f, FREQUENCY (MHz)  
Figure 5. Common−Gate Y Parameter  
Magnitude versus Frequency  
Figure 6. Common−Gate S Parameter  
Magnitude versus Frequency  
q
, q  
21 11  
q , q  
12 22  
q
, q  
11 12  
q
, q  
21 22  
180° 50°  
170° 40°  
160° 30°  
150° 20°  
140° 10°  
−ꢀ20° 87°  
−ꢀ20°  
−ꢀ20° 120°  
−ꢀ40° 100°  
−ꢀ60° 80°  
−ꢀ80° 60°  
−ꢀ100 ° 40°  
−ꢀ120 ° 20°  
0
q
11  
q
22  
q
21  
−ꢀ40° 86°  
−ꢀ60°  
q
−ꢀ20°  
−ꢀ40°  
−ꢀ60°  
−ꢀ80°  
−ꢀ100 °  
22  
q
21  
−ꢀ80° 85°  
−ꢀ100 °  
−ꢀ120 ° 84°  
−ꢀ140 °  
q
21  
q
12  
q
q
12  
11  
V
I
= 10 V  
V
I
T
A
= 10 V  
= 10 mA  
= 25°C  
DS  
= 10 mA  
= 25°C  
−ꢀ160 ° 83°  
−ꢀ180 °  
DS  
q
11  
D
D
T
A
130°  
0°  
100  
−ꢀ200 ° 82°  
200  
300  
500 700 1000  
100  
200  
300  
500 700 1000  
f, FREQUENCY (MHz)  
f, FREQUENCY (MHz)  
Figure 7. Common−Gate Y Parameter  
Phase−Angle versus Frequency  
Figure 8. S Parameter Phase−Angle  
versus Frequency  
http://onsemi.com  
4
J309, J310  
PACKAGE DIMENSIONS  
TO−92 (TO−226)  
CASE 29−11  
ISSUE AL  
NOTES:  
A
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
B
2. CONTROLLING DIMENSION: INCH.  
3. CONTOUR OF PACKAGE BEYOND DIMENSION R  
IS UNCONTROLLED.  
R
4. LEAD DIMENSION IS UNCONTROLLED IN P AND  
BEYOND DIMENSION K MINIMUM.  
P
L
SEATING  
PLANE  
INCHES  
DIM MIN MAX  
MILLIMETERS  
K
MIN  
4.45  
4.32  
3.18  
MAX  
5.20  
5.33  
4.19  
0.533  
1.39  
2.66  
0.50  
−−−  
A
B
C
D
G
H
J
0.175  
0.170  
0.125  
0.016  
0.045  
0.095  
0.015  
0.500  
0.250  
0.080  
0.205  
0.210  
0.165  
0.021 0.407  
D
X X  
0.055  
0.105  
0.020  
−−− 12.70  
−−−  
1.15  
2.42  
0.39  
G
J
H
V
K
L
6.35  
2.04  
−−−  
2.93  
3.43  
−−−  
C
N
P
R
V
0.105  
2.66  
2.54  
−−−  
−−− 0.100  
SECTION X−X  
0.115  
0.135  
−−−  
−−−  
1
N
−−−  
N
STYLE 5:  
PIN 1. DRAIN  
2. SOURCE  
3. GATE  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
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Order Literature: http://www.onsemi.com/litorder  
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For additional information, please contact your  
local Sales Representative.  
J309/D  

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