LA1654C-X1 [ONSEMI]
时间代码接收集成电路;
| 型号： | LA1654C-X1 |
| 厂家： | 
ONSEMI |
| 描述： | 时间代码接收集成电路 |
| 文件： | 总5页 (文件大小：130K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Ordering number : ENA0205A
LA1654C
Monolithic Linear IC
http://onsemi.com
Time Code Reception IC
Overview
The LA1654C time code reception IC receives long-wave time standard broadcasts (such as the Japanese JJY and
German DCF77 standards) and detects and outputs the time code superposed on the long-wave signal.
Applications can automatically correct their clock's time setting by using the time code received by the LA1654C.
Note that the LA1654C is a bare chip product that is not packaged.
Function
• RF amplifier, rectifier, detector, time code output, and standby circuit.
Features
• Low-voltage operation (operating V
as low as 1.5V).
CC
• Standby mode current drain less than or equal to 0.05μA.
Japan : JJY 40/60kHz
Germany : DCF77 77.5kHz
Specifications
Absolute Maximum Ratings at Ta = 25°C
Parameter
Maximum supply voltage
Allowable power dissipation
Operating temperature
Storage temperature
Symbol
Conditions
Ratings
Unit
V
V
max
5.0
10
CC
Pd max
Ta ≤ 70°C
mW
°C
Topr
Tstg
-20 to +70
-40 to +125
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed,
damage may occur and reliability may be affected.
Recommended Operating Conditions at Ta = 25°C
Ratings
Parameter
Symbol
Conditions
Unit
min
typ
max
3.0
3.6
Recommended supply voltage
Operating supply voltage range
V
1.5
1.1
V
V
CC
V
op
CC
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended
Operating Ranges limits may affect device reliability.
ORDERING INFORMATION
See detailed ordering and shipping information on page 5 of this data sheet.
Semiconductor Components Industries, LLC, 2014
April, 2014
42114NK/92706/12506MSOT B8-7046 No.A0205-1/5
LA1654C
Operating Characteristics at Ta = 25°C, V = 3.0V
CC
* : Packaged in a VSON16 package and measured using the SON11T016-001-MF socket (Yamaichi Electronics Co., Ltd.)
Overall Characteristics
Ratings
Parameter
Symbol
Conditions
Unit
min
30
typ
37
max
50
Quiescent current
Standby mode current drain
I
No input, PAD15 = 0V, PAD10 = 3V
PAD15 = 3.0V
μA
μA
CCO
I
0.05
STB
AGC Amplifier Input Characteristics
Ratings
typ
Parameter
Symbol
Conditions
Unit
min
37.5
100
max
Input impedance
Z
PAD1
800
kΩ
I
Input frequency range
Minimum input voltage
Maximum input voltage
F
PAD1
80.0
1
kHz
IN
V
PAD1 input level
PAD1 input level
μVrms
mVrms
MIN
V
MAX
TCO Output Characteristics - Input signal = PAD1, fin = 40kHz, PAD10 = 3V, PAD15 = 0V
Ratings
typ
Parameter
Symbol
Conditions
Unit
min
2.9
max
3.0
High-level output voltage
Low-level output voltage
V
PAD11 output level
PAD11 output level
V
V
OH
V
0
0.1
OL
Output pulse width
(500 ms input)
T500
T800
T200
V
= 0 to 100dBμV, AM modulation
400
520
730
300
600
ms
IN
(1Hz square wave, duty = 50%, 10:1 modulation)
= 0 to 100dBμV, AM modulation
Output pulse width
(800 ms input)
V
600
200
800
400
ms
ms
IN
(1Hz square wave, duty = 80%, 10:1 modulation)
= 0 to 100dBμV, AM modulation
Output pulse width
(200 ms input)
V
IN
(1Hz square wave, duty = 20%, 10:1 modulation)
STB Control Characteristics
Ratings
typ
Parameter
Symbol
Conditions
Unit
min
2.9
0
max
3.0
0.1
0.1
0.3
Standby on voltage
V
PAD15 DC voltage
PAD15 DC voltage
PAD15 = 3V
V
V
SH
Standby off voltage
V
SL
High-level pin input current
Low-level pin input current
I
μA
μA
SH
I
PAD15 = 0V
SL
HOLD Control Characteristics - PAD15 = 0V
Ratings
typ
Parameter
Symbol
Conditions
Unit
min
0
max
0.1
3.0
0.1
0.3
Hold on voltage
V
PAD10 DC voltage
PAD10 DC voltage
PAD10 = 3V
V
V
HL
Hold off voltage
V
2.9
HH
High-level pin input current
Low-level pin input current
I
μA
μA
HH
I
PAD10 = 0V
HL
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be
indicated by the Electrical Characteristics if operated under different conditions.
No.A0205-2/5
LA1654C
Chip Specifications
Parameter
Chip size
Conditions
Ratings
1.26×2.00
330(±20)
127.5×127.5
105×105
Unit
mm2
μm
μm2
μm2
Chip thickness
Pad size
Pad opening
PAD Coordinates
PAD
X-Axis
Y-Axis
PAD
TEST PAD
X-Axis
Y-Axis
P1
902
1109
1109
1109
1109
1109
1109
1109
1109
926
151
299.5
717.5
508.5
926.5
1073.5
1282.5
1491.5
1700.5
1849
776.5
368.5
151
1849
P2
P9
1849
1747
1600
1453
547
P3A
P3B
P4
P10
P11
P12
P13
P14
P15
P16
151
151
P5
151
P6A
P6B
P7
151
400
151
253
368.5
151
P8
Notes
1. The left upper corner of the Pad Layout Diagram on the following page is the origin, the X axis increases to the right
and the Y axis increases in the downward direction.
2. Units : μm
3. The pad coordinates give the coordinate values of the center of the pads.
4. Both of each of the pairs P3A/P3B (V ) and P6A/P6B (ground) must be bonded.
CC
5. The test pads must not be connected (NC).
No.A0205-3/5
LA1654C
Pad Layout Diagram
PCA00620
Block Diagram
16
15
14
13
12
11
10
9
V
CC
FILTER
REGULATOR
AGC
DECODER
V
CC
V
CC
RECTIFIER
AMP
AGC-AMP
V
CC
GND
1
2
3
4
5
6
7
8
PCA00621
No.A0205-4/5
LA1654C
Test Circuit Diagram
TCO
0.01μF
0.22μF
0.22μF
0.47μF
750kΩ
16
15
14
13
12
11
10
9
4.8MΩ
V
CC
FILTER
REGULATOR
AGC
DECODER
V
CC
V
CC
55kΩ
55kΩ
RECTIFIER
AGC-
AMP
AMP
V
GND
CC
A
6.6MΩ
1
2
3
4
5
6
7
8
50Ω
I
CC
0.47μF
0.1μF
0.47μF
V
CC
3.0V
47kΩ
40kHz crystal
Signal Generator :
Zo=50Ω
PCA00622
ORDERING INFORMATION
Device
Package
Chip
(Pb-Free)
Shipping (Qty / Packing)
2250 / Waffle Pack
LA1654C-X1
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application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental
damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual
performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.
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PS No.A0205-5/5
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