LB11660FV [ONSEMI]

Half-pre Motor Driver Single-Phase Full-Wave Drive;
LB11660FV
型号: LB11660FV
厂家: ONSEMI    ONSEMI
描述:

Half-pre Motor Driver Single-Phase Full-Wave Drive

电动机控制 光电二极管
文件: 总10页 (文件大小:129K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
LB11660FV  
Monolithic Digital IC  
Half-pre Motor Driver  
Single-Phase Full-Wave,  
for Fan Motor  
www.onsemi.com  
Overview  
The LB11660FV is a single-phase bipolar drive half-predriver motor driver  
that can easily implement a direct PWM driver motor driver circuit with  
excellent efficiency. The LB11660FV is particularly well suited for the  
miniature fans used in servers.  
Features  
SSOP16 (225mil)  
Single-phase full-wave drive (15V, 1.5A transistors are built in)  
Half predriver with integrated high side transistor  
Built-in variable speed function controlled by an external input  
The LB11660FV can implement quiet, low-vibration variable speed control  
using externally clocked high side transistor direct PWM drive.  
Minimum speed setting pin  
Current limiter circuit  
(The limit value is determined by Rf; I = 1A when RF = 0.5)  
O
Built-in kickback absorption circuit  
Soft switching circuit makes low current consumption, low loss, and low  
noise drive possible at phase switching  
Built-in HB  
Built-in lock protection and automatic recovery circuits  
(built-in on/off ratio switching circuit controlled by the supply voltage)  
FG (speed detection) output  
Built-in thermal protection circuit (design guarantee)  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 10 of this data sheet.  
© Semiconductor Components Industries, LLC, 2015  
August 2015 - Rev. 1  
1
Publication Order Number :  
LB11660FV/D  
LB11660FV  
Specifications  
Absolute Maximum Ratings at Ta = 25C  
Parameter  
Symbol  
Conditions  
Ratings  
Unit  
V
V
maximum supply voltage  
V
max  
CC  
20  
20  
CC  
VM maximum supply voltage  
VM max  
V
OUT pin maximum output  
current  
I
max  
Rf 0.39  
1.5  
OUT  
A
OUT pin output voltage 1  
V
max 1  
max 2  
20  
26.5  
30  
V
V
OUT  
OUT pin output voltage 2  
V
T 0.4s  
OUT  
PRE pin maximum source  
current  
IPSO max  
mA  
PRE pin maximum sink current  
IPSI max  
VP max  
HB max  
VTH max  
VFG max  
IFG max  
Pd max  
Topr  
7  
mA  
PRE pin output voltage  
HB maximum output current  
VTH input pin voltage  
FG output pin voltage  
FG output current  
20  
V
mA  
V
10  
7
18  
V
mA  
W
10  
Allowable power dissipation  
Operating temperature  
Storage temperature  
When mounted on a circuit board *1  
*2  
0.8  
C  
C  
30 to +90  
55 to +150  
Tstg  
*1 Specified circuit board : 114.3 76.1 1.6mm3, glass epoxy.  
*2: Tj max is 150°C. This device must be used under conditions such that the chip temperature does not exceed Tj = 150°C during operation.  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed,  
damage may occur and reliability may be affected.  
Recommended Operating Conditions at Ta = 25C  
Parameter  
Symbol  
Conditions  
Ratings  
Unit  
V
V
V
supply voltage  
V
4 to 15  
3 to 15  
CC  
CC  
supply voltage  
VM  
ILIM  
VTH  
VICM  
V
V
V
V
M
Current limiter operation range  
VTH input level voltage range  
0.6 to 1.2  
0 to 6  
Hall sensor input common-mode  
input voltage range  
0.2 to 3  
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended  
Operating Ranges limits may affect device reliability.  
www.onsemi.com  
2
LB11660FV  
Electrical Characteristics Unless otherwise specified Ta 25C, V  
= 12V  
CC  
Ratings  
typ  
Parameter  
Symbol  
Conditions  
Unit  
mA  
min  
max  
12  
Circuit current  
I
1
Drive mode  
IHB = 5mA  
9
CC  
HB voltage  
VHB  
V6VREG  
VCTH  
VCTL  
1.05  
1.25  
6
1.40  
6.20  
3.8  
V
V
V
V
6VREG voltage  
6VREG = 5mA  
5.80  
3.4  
CT pin high-level voltage  
CT pin low-level voltage  
ICT pin charge current 1  
ICT pin charge current 2  
ICT pin discharge current 1  
ICT pin discharge current 2  
3.6  
1.6  
2.2  
1.8  
0.15  
0.44  
15  
1.4  
1.8  
ICTC1  
ICTC2  
ICTD1  
ICTD2  
RCT1  
V
V
V
V
V
= 12V  
= 6V  
1.7  
2.7  
A  
A  
CC  
CC  
CC  
CC  
CC  
1.3  
2.3  
= 12V  
= 6V  
0.11  
0.34  
12  
0.19  
0.54  
18  
A  
A  
ICT charge/discharge current  
ratio 1  
= 12V  
Times  
ICT charge/discharge current  
ratio 2  
RCT2  
VRCT  
IBVTH  
V
= 6V  
3
6
4
5
Times  
V
CC  
ICT charge/discharge ratio  
threshold voltage  
VTH bias current  
6.6  
7.3  
2  
1  
0
A  
OUT output high saturation  
voltage  
V
I
I
I
= 200mA, RL = 1  
= 5mA  
0.6  
0.8  
V
OH  
O
O
O
PRE output low saturation  
voltage  
V
0.2  
0.9  
0.4  
1.2  
V
V
PL  
PRE output high saturation  
voltage  
V
= 20mA  
PH  
Current limiter  
VRf  
V
VM  
450  
2.2  
500  
2.5  
550  
2.8  
mV  
V
CC  
PWM output pin high-level  
voltage  
VPWMH  
PWM output pin low-level  
voltage  
VPWML  
0.4  
0.5  
0.7  
V
PWM external C charge current  
IPWM1  
IPWM2  
23  
18  
14  
A  
A  
PWM external C discharge  
current  
18  
24  
30  
PWM oscillator frequency  
FPWM  
VHN  
C = 200pF  
19  
23  
15  
27  
25  
kHz  
mV  
Hall sensor input sensitivity  
Zero peak value (including offset and  
hysteresis)  
FG output pin low-level voltage  
FG output pin leakage current  
Thermal protection circuit  
VFG/RD  
IFGL/IRDL  
THD  
IFG/RD = 5mA  
0.2  
0.3  
30  
V
VFG/RD = 7V  
A  
C  
Design target value*3  
150  
180  
210  
*3: This is a design guarantee and is not tested in individual units. The thermal protection circuit is included to prevent any thermal damage to the IC. Since this  
would imply operation outside the IC's guaranteed temperature range, the application thermal design must be such that the thermal protection circuit will  
not operate if the fan is operating constantly.  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be  
indicated by the Electrical Characteristics if operated under different conditions.  
www.onsemi.com  
3
LB11660FV  
Package Dimensions  
unit : mm  
SSOP16 (225mil)  
CASE 565AM  
ISSUE A  
GENERIC  
MARKING DIAGRAM*  
SOLDERING FOOTPRINT*  
5.80  
(Unit: mm)  
1.0  
0.32  
XXXXXXXXXX  
YMDDD  
XXXXX = Specific Device Code  
Y = Year  
0.65  
M = Month  
DDD = Additional Traceability Data  
NOTE: The measurements are not to guarantee but for reference only.  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
*For additional information on our Pb-Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
www.onsemi.com  
4
LB11660FV  
Pin Assignment  
16  
15  
1
2
3
VM  
OUT2  
PRE2  
OUT1  
PRE1  
14  
13  
12  
GND  
6VREG  
CT  
4
5
6
7
8
V
CC  
LB11660FV  
VTH  
RMI  
11  
IN-  
10 HB  
CPWM  
FG  
9
IN+  
Top view  
Truth Table  
IN-  
IN+  
Low  
High  
Low  
High  
Low  
High  
VTH  
Low  
CPWM  
High  
CT  
OUT1  
OUT2  
Off  
PRE1  
Low  
PRE2  
High  
Low  
FG  
Low  
Off  
Mode  
High  
Low  
High  
Low  
High  
Low  
High  
Off  
During rotation drive  
High  
Off  
High  
Low  
Low  
During rotation   
Off  
High  
Low  
Low  
Off  
High  
-
Low  
-
regeneration  
Off  
Off  
High  
Low  
Off  
Off  
High  
Low  
Low  
Off  
Lock protection  
High  
Off  
Off  
High  
CPWM – High is the state where CPWM > VTH, and CPWM– Low is the state where CPWM < VTH.  
www.onsemi.com  
5
LB11660FV  
Application Circuit Example 1  
*4  
Rf  
*2  
V
VM  
CC  
CM = 4.7F or  
more  
HB  
IN-  
IN+  
H
*5  
*7  
FG  
6VREG  
RMI  
R3  
R4  
OUT2  
OUT1  
*9  
*3  
PRE1  
PRE2  
Control valtage  
VTH  
CPWM  
CT  
CP = 200pF *f = 23kHz  
CP = 100pF *f = 46kHz  
*6  
*1  
CT = 0.47 to 1F  
GND  
*1.Power supply and ground lines  
The IC ground is the control current power supply system ground, and the external n-channel transistor ground is the motor power  
supply system ground.  
These two systems should be formed from separate lines and the control system external components should be connected to the  
IC ground.  
*2. Regeneration power supply stabilization capacitor  
Use a 4.7µF/25V capacitor at least for CM, which is the power supply stabilization capacitor for both PWM drive and kickback  
absorption.  
The capacitor CM must be connected to prevent destruction of the IC when power is applied or removed.  
*3.Speed Control  
(1) Control voltage  
The PWM duty is determined by comparing the VTH pin voltage with the PWM oscillator waveform.  
When the VTH voltage falls, the on duty increases and when the VTH voltage falls below the PWM output low level, the duty will  
go to 100%.  
(2) Thermistor  
For thermistor applications, normally the 6VREG level will be resistor divided and the divided level input to the VTH pin.  
The PWM duty is changed by changes in the VTH pin voltage due to changes in temperature.  
*4. Current limiter setting  
The current limiter circuit operates if the voltage across the resistor between V  
and the VM pin exceeds 0.5V.  
Since the current limiter circuit applies limitation at a current determined by I = VRf/Rf (where VRf = 0.5V (typical), Rf:  
CC  
O
resistance of the current detection resistor), the current limiter will operate at I = 1A when Rf = 0.5.  
O
The resistor RF must be connected in the circuit and it must have a value such that the circuit operates within the recommended  
current limiter operating range.  
www.onsemi.com  
6
LB11660FV  
*5.Hall sensor input  
Lines that are as short as possible must be used to prevent noise from entering the system. The Hall sensor input circuit consists of  
a comparator with hysteresis (20mV). We recommend that the Hall sensor input level be at least three times this hysteresis, i.e. at  
least 60mVp-p.  
*6.PWM oscillator frequency setting capacitor  
The PWM oscillator oscillates at f = 23kHz when CP is 200pF and at f = 46kHz when CP is 100pF, and this frequency becomes the  
PWM reference frequency.  
Note that the PWM frequency is given approximately by the following equation.  
f [kHz] (4.6×106) ÷C [pF]  
*7.FG output  
This is an open collector output, and a rotation count detection function can be implemented using this FG output, which  
corresponds to the phase switching. This pin must be left open if unused.  
*8.HB pin  
This pin provides a Hall effect sensor bias constant-voltage output of 1.25V.  
*9.RMI pin  
This pin is the speed control minimum speed setting.  
The minimum output duty is set by R3 and R4. Leave R4 open to have the motor stop when the duty is 0%.  
Rotation Control Timing Chart  
Duty 100%  
PWM  
duty(%)  
Minimum  
output duty  
Duty 0%  
RMI  
VPWML  
VPWMH  
VTH(V)  
Minimum speed  
setting rotation  
PWM control variable speed mode  
Full speed mode  
VTH voltage  
RMI voltage  
2.5V  
0.5V  
CPWM  
0V  
ON  
On duty  
OFF  
www.onsemi.com  
7
LB11660FV  
Application Circuit Example 2  
Mounting circuit board (Component values are provided for reference purposes)  
D1  
R1  
C1  
V
VM  
CC  
R5  
HB  
IN-  
H
IN+  
FG  
6VREG  
RMI  
C2  
R3  
OUT2  
OUT1  
R4  
Q1  
R2  
PRE1  
PRE2  
Control voltage  
VTH  
Q2  
C3  
(C7)  
(C6)  
CPWM  
CT  
C4  
C5  
GND  
Parts List  
D1 : SBM30-03-Tr (Our product)  
Q1, 2 : CPH3418 (Our product)  
R1  
R2  
R3  
R4  
R5  
C1  
C2  
C3  
C4  
C5  
: 0.51  
: 15k  
: 39k  
: 20k  
: 2.2  
size 3225  
size 1608  
size 1608  
size 1608  
size 1608  
: 4.7F/25V size 3216  
: 2.2F  
: 2.2F  
: 220pF  
: 0.47F  
size 1608  
size 1608  
size 1005  
size 1608  
C6, 7 : No connection  
www.onsemi.com  
8
LB11660FV  
Application Circuit Example 3  
No minimum speed setting, thermistor input used  
RL  
V
VM  
CM = 4.7F or  
CC  
more  
HB  
IN-  
*8  
H
*5  
IN+  
FG  
6VREG  
RMI  
R3  
OUT2  
OUT1  
RTU  
TH  
PRE1  
PRE2  
VTH  
CPWM  
CT  
CP = 200pF *f = 23kHz  
CP = 100pF *f = 43kHz  
CT = 0.47 to 1F  
GND  
www.onsemi.com  
9
LB11660FV  
Internal Equivalent Circuit Diagram  
FG  
Thermal  
protection circuit  
V
CC  
VM  
Constant voltage  
1.25V  
Delay circuit  
6VREG  
OUT2  
OUT1  
Control  
circuit  
M
HB  
HALL  
PRE1  
PRE2  
IN+  
IN-  
Predriver  
Predriver  
Delay circuit  
Amplifier with  
hysteresis  
Oscillator  
circuit  
Charge/discharge  
circuit  
CPWM  
CT  
GND  
VTH  
RMI  
ORDERING INFORMATION  
Device  
Package  
SSOP16 (225mil)  
(Pb-Free / Halogen Free)  
Wire Bond  
Au-Wire  
Shipping (Qty / Packing)  
90 / Fan-Fold  
LB11660FV-MPB-H  
LB11660FV-TLM-H  
LB11660FV-W-AH  
SSOP16 (225mil)  
(Pb-Free / Halogen Free)  
Au-Wire  
Cu-Wire  
2000 / Tape & Reel  
2000 / Tape & Reel  
SSOP16 (225mil)  
(Pb-Free / Halogen Free)  
† For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D. http://www.onsemi.com/pub_link/Collateral/BRD8011-D.PDF  
ON Semiconductor and the ON logo are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiariesin the United States  
and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of  
SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. SCILLC reserves the right to make changes without  
further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitabilityof its products for any particular purpose,  
nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including  
without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can  
and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each  
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are  
not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applicationsintended to support or  
sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers,  
employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of,  
directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was  
negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all  
applicable copyright laws and is not for resale in any manner.  
www.onsemi.com  
10  

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