LB1668M-TLM-H [ONSEMI]
2âphase Unipolar Brushless Motor Driver;
| 型号： | LB1668M-TLM-H |
| 厂家： | 
ONSEMI |
| 描述： | 2âphase Unipolar Brushless Motor Driver |
| 文件： | 总10页 (文件大小：254K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LB1668M
2‐phase Unipolar Brushless
Motor Driver
Monolithic Digital IC
Overview
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The LB1668M is 2-phase unipolar drive brushless motor driver that
features a wide usable voltage range and a minimal number of required
external components. It also supports the formation of motor lock
protection and automatic recovery circuits.
Features
• Output protection Zener Diodes with Variable Breakdown Voltages
♦ When the Z1 and Z2 Pins are Open: V
♦ When the Z1 and Z2 Pins are Shorted: V
♦ An External Zener Diode can be Connected between Z1 and V
= 57 V
OLM
MFP14S
CASE 751CB
= 32 V
OLM
CC
• Can Support Both 12 V and 24 V Power Supplies by Changing an
External Resistor
MARKING DIAGRAM
• Hall Elements can be Connected Directly
• 1.5 A Output Current Output Transistors Built in
XXXXXXXXXX
YMDDD
• Built-in Rotation Detection Function that Outputs Low when Driven
and High when Stopped
• Motor Lock Protection and Automatic Recovery Functions Built in
• Thermal Shutdown Function
XXXXX = Specific Device Code
Y
= Year
M
= Month
DDD
= Additional Traceability Data
PIN ASSIGNMENT
1
14
V
IN
IN−
RD
IN+
C
Z2
Z1
NC
OUT1
NC
OUT2
NC
NC
GND
7
8
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information on page 7 of
this data sheet.
© Semiconductor Components Industries, LLC, 2013
1
Publication Order Number:
March, 2018 − Rev. 1
LB1668M/D
LB1668M
SPECIFICATIONS
ABSOLUTE MAXIMUM RATINGS (T = 25°C)
A
Symbol
max
Parameter
Maximum Input Current
Output Supply Voltage
Output Current
Conditions
Ratings
200
Unit
mA
V
I
t ≤ 20 ms
CC
V
OUT
Internal
1.5
I
A
OUT
I
/I
RD/FG Flow-in Current
RD/FG Supply Voltage
Allowable Power Dissipation
Operating Temperature
Storage Temperature
10
mA
V
RD FG
V
/V
30
RD FG
P max
With specified board (Note 1)
0.8
W
d
T
−30 to +80
−55 to +150
°C
°C
opr
T
stg
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. .Specified board: 20 mm × 15 mm × 1.5 mm, glass epoxy.
ALLOWABLE OPERATING RANGES (T = 25°C)
A
Symbol
Parameter
Input Current Range
Common-mode Input Voltage Range
Conditions
Ratings
Unit
mA
V
I
6.0 to 50
CC
V
ICM
0 to V −1.5
IN
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
ELECTRICAL CHARACTERISTICS (T = 25°C, I = 10 mA)
A
CC
Symbol
Parameter
Output Limit Voltage
Conditions
Z1, Z2 open
Z1, Z2 short
Min
54
Typ
57
Max
60
Unit
V
V
OLM
OLM
1
2
V
31
33
35
V
V (sat)1
Output Saturation Voltage
I
I
I
I
= 0.5 A
= 1.0 A
= 1.5 A
−
0.95
1.15
1.4
6.7
0
1.2
1.5
2.0
7.0
+7.0
−
V
O
O
V (sat)2
O
−
V
O
V (sat)3
O
−
V
O
V
IN
V
IN
Input Voltage
= 7.0 mA
6.4
−7.0
−250
−
V
CC
V
OFF
Amp Input Offset Voltage
Amp Input Bias Current
mV
nA
V
I
BA
−
V
RD
(sat)
RD Output Saturation Voltage
C Flow-out Current
I
= 5 mA
0.1
3.0
0.44
0.3
3.9
0.59
0.83
0.48
−
RD
I 1
C
2.1
0.31
0.77
0.42
−
mA
mA
V
I 2
C
C Discharge Current
V
1
Comparator Input Threshold Voltage
0.8 V
IN
TH
TH
V
2
0.45 V
180
V
IN
TSD
Thermal Shutdown Current Operating Design target value (Note 2)
Temperature
°C
DTSD
Thermal Shutdown Circuit Hysteresis Design target value (Note 2)
−
40
−
°C
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2. Design target value and si not measured.
www.onsemi.com
2
LB1668M
1.0
0.8
0.6
0.4
Specified board: 20 × 15 × 1.5 mm
glass epoxy
0.2
0.0
−30 −20
0
20
40
60
80
100
Ambient Temperature, T − 5C
A
Figure 1. Pd max − TA
TRUTH TABLE
IN+
H
IN−
L
C
L
OUT1
OUT2
RD
L
H
L
L
H
H
H
L
H
L
L
H
L
H
H
H
H
H
L
H
H
BLOCK DIAGRAM
Figure 2. Block Diagram
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3
LB1668M
APPLICATION CIRCUITS
1. 12 V Power Supply Type
Figure 3. 12 V Power Supply Type
2. 24 V Power Supply Type
Figure 4. 24 V Power Supply Type
3. Circuit for use when large output currents are required and heat dissipation is high.
Figure 5. Circuit for Use when Large Output Currents are Required and Heat Dissipation is High
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4
LB1668M
DESIGN DOCUMENTATION
(See the Sample Application Circuits)
1. Power Supply Voltage (V pin):
3) With a Zener diode inserted between Z1 and
or between Z1 and ground:
IN
The resistor R1 (when V = 12 V, R1 = 330 W,
V
CC
CC
This technique handles 120mm square H speed
applications which require large output currents
and involve large amounts of heat generated in
the IC by dissipating the motor coil switching
loss in external Zener diodes.
and when V = 24, R1 = about 1.2 kW) is
CC
inserted between V and the power supply V
IN
CC
pin. When the I current is set in the range 6 to
CC
50 mA, the V pin will be regulated to be 6.7 V.
IN
Not only does this provide stability with respect to
power supply voltage variations and motor
kickback, but it also provides adequate strength to
withstand surges.
4. Output Protection when the Motor is Lock
(C and FG pins):
This circuit detects motor stopping due to, for
example, overloading, and cuts the coil current. It
also automatically recovers drive and motor
turning from the output stopped state when the
load returns to an appropriate level. The lock
detection time is set with the value of an external
capacitor.
2. Output Transistors (OUT1 and OUT2 Pins)
A Zener diodes with the following characteristics
is inserted between the collector and base of each
output transistor to absorb kickback voltages at
57 V (typical) and provide output protection.
• Sustained output voltage:
When C = 0.47 mF
V = 65 V minimum (design guarantee)
O
• Lock detection time: about 1 s
• Lock protection time:
about 0.5 s (output on)
about 3 s (output off)
• Output current:
I = 1.5 A maximum
O
• Output saturation voltage:
V sat = 1.25 V/1.0 A (typical)
O
The RD pin is an open collector output and outputs
a low level during drive and a high level when
stopped.
• Safe operating range:
I = 1.0 A, V
= 57 V, t = 200 ms
O
OLM
3. Output Circuit Kickback Voltage Protection
(Z1 and Z2 pins):
5. Thermal Shutdown:
This circuit turns the output off in response to coil
shorting or IC overheating.
6. In applications that use an external transistor to
turn the cooling fan power on and off, connect
a capacitor of about 0.47 to 10 mF between the fan
These ICs support output protection that
minimizes kickback noise by changing the
kickback absorption voltage and absorption
method according to the output current and power
supply voltage used.
power supply V and ground to provide
1) When the Z1 and Z2 pins are shorted:
The output protection voltage will be 32 V
CC
a regenerative route for the fan motor coil current.
(typical) using a V = 12 V power supply.
CC
2) When the Z1 and Z2 pins are open:
The output protection voltage will be 57 V
(typical) using a V = 24 V power supply.
CC
Figure 6.
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5
LB1668M
AUTOMATIC RECOVERY CIRCUIT C-PIN VOLTAGE
Figure 7. Automatic Return Circuit C-pin Voltage
1. While the blades are turning, the capacitor is
charged with a current of about 3 mA (typical),
and C is discharged by pulses that correspond to
the motor speed.
capacitor voltage falls under V 2, if the lock
TH
state is not yet cleared the capacitor continues
discharging until V 1. (Note that the output is
TH
turned on at this time.)
2. When the blades lock, the capacitor is no longer
discharged, and the voltage across the capacitor
increases. The output is turned off when that
These operations, i.e. items 2. and 3., are repeated
with a ton:toff ratio of about 1 : 6 to protect the
motor.
voltage reaches 0.8 × V .
4. If the lock is cleared at the point the capacitor
IN
3. When the output is turned off, the capacitor is
voltage reaches V 2, motor rotation is started by
TH
turning the output on.
discharged at about 0.44 mA (typical). When the
Figure 8. VO(sat) − IO
Figure 9. ASO
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6
LB1668M
Figure 10. VIN − ICC
ORDERING INFORMATION
Device
†
Package
Wire Bond
Shipping (Qty / Packing)
LB1668M−TLM−E
MFP14S (225mil)
Au−wire
1,000 / Tape & Reel
1,000 / Tape & Reel
1,000 / Tape & Reel
(Pb−Free)
LB1668M−TLM−H
LB1668M−W−AH
MFP14S (225mil)
(Pb−Free / Halogen Free)
Au−wire
Cu−wire
MFP14S (225mil)
(Pb−Free / Halogen Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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7
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOIC14 W / MFP14S (225 mil)
CASE 751CB
ISSUE A
DATE 25 OCT 2013
SOLDERING FOOTPRINT*
(Unit: mm)
GENERIC
MARKING DIAGRAM*
XXXXXXXXXX
YMDDD
XXXXX = Specific Device Code
Y = Year
M = Month
1.00
0.47
DDD = Additional Traceability Data
NOTE: The measurements are not to guarantee but for reference only.
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
98AON67224E
DOCUMENT NUMBER:
STATUS:
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
DESCRIPTION: SOIC14 W / MFP14S (225 MIL)
PAGE 1 OF2
DOCUMENT NUMBER:
98AON67224E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION FROM SANYO ENACT# S−002 TO ON
SEMICONDUCTOR. REQ. BY D. TRUHITTE.
29 FEB 2012
A
ADDED MARKING AND SOLDER FOOTPRINT INFORMATION. REQ. BY D.
TRUHITTE
25 OCT 2013
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© Semiconductor Components Industries, LLC, 2013
Case Outline Number:
October, 2013 − Rev. A
751CB
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