LC823455RB-2H [ONSEMI]

Low Power & High-Resolution Audio Processing System SoC for Portable Sound Solution;
LC823455RB-2H
型号: LC823455RB-2H
厂家: ONSEMI    ONSEMI
描述:

Low Power & High-Resolution Audio Processing System SoC for Portable Sound Solution

文件: 总109页 (文件大小:1263K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Low Power &  
High-Resolution Audio  
Processing System SoC for  
Portable Sound Solution  
LC823455  
Description  
www.onsemi.com  
LC823455 is an audio processing System−on−Chip (SoC) for  
recording and playback, with High−Resolution 32−bit & 192 kHz  
audio processing capability that provides the key functions required  
for portable audio solutions.  
It has a Dual CPU configuration and a DSP providing intensive  
processing capability, 4316 KB of internal SRAM that supports the  
implementation of large-scale programs for WLAN applications, and  
multiple interfaces for increased extensibility. Its features an extensive  
range of functions including SBC/AAC codec and Active Noise  
Canceller by the DSP, UART and ASRC − applicable for wearable  
audio applications. The highly integrated implementation of this rich  
set of analog functions results in a miniature footprint with ultra− low  
power consumption. This, along with its high performance, makes the  
LC823455 suitable for portable audio markets such as Wireless  
headsets.  
WLCSP120, 4.086x4.086x0.62  
CASE 567WG  
LFBGA240, 11.0x11.0  
CASE 566EY  
This document describes features, basic functions, electrical  
specifications, characteristics, application diagrams and package  
dimension of this SoC.  
Features  
Ultra Low Power Consumption  
®
®
LFBGA136, 11.0x11.0  
CASE 566GB  
Arm Cortex −M3 Dual Core  
Proprietary 32−bit DSP Core (LPDSP32)  
Internal Large−Scale Size SRAM : 4316 KB (4MB + 220 KB)  
High−Resolution 32−bit & 192 kHz Audio Processing Capability  
Several DSP Codes Available for Audio Functions  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 107 of  
this data sheet.  
Hard−Wired Audio Functions Built−In:  
MP3 decoder, MP3 encoder,  
6 band Equalizer  
Synchronous SRC, Asynchronous SRC, etc.  
Analog Blocks Built−in:  
System PLL, Audio PLL,  
16−bit DAC, Class−D amp, etc.  
USB On−The−Go(OTG) that supports USB2.0 Device and Host  
Functions with an Integrated PHY,  
eMMC and SD Card I/F,  
Serial Flash I/F(Quad) with Cache Memory,  
SPI, UART, I2C, etc.  
Typical Applications  
Wearable Earbuds  
Wearable Headphone  
Wireless Speaker  
IC Recorder  
NOTE:  
LC823455RAH−2H and LC823455RB−2H are  
under planning.  
LC823455RAH−2H : Package Code = RA  
LC823455RB−2H : Package Code = RB  
© Semiconductor Components Industries, LLC, 2017  
1
Publication Order Number:  
March, 2021 − Rev. 2  
LC823455/D  
LC823455  
Table of Contents  
Abstract . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Terminal Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21  
Pin Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36  
Input/Output Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45  
Electrical Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55  
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69  
www.onsemi.com  
2
LC823455  
ABSTRACT  
Features  
®
Real Time Clock  
Cortex−M3 Dual Core, AMBA (AHB/APB) system  
Internal SRAM (4 M-byte)  
2 modes below are available  
− General RTC mode : RTC w/o key input  
− KeyInt RTC mode : RTC w/ key input which  
enables power on function  
Internal ROM (256 k-byte). Boot code, Standard  
Functions  
SDRAM Controller (1 * CS)  
64M to 256Mbit SDRAM / Mobile SDRAM  
External Memory Controller (2 * CS) NOR FLASH,  
SRAM, ROM supported, 8/16 bit I/F LCD controller  
supported  
Internal ROM boot and External memory device  
boot available  
DMA Controller (8 ch)  
SWD (Serial Wire Debug) is supported as the debug  
interface  
SWV (Serial Wire Viewer) is supported as the trace  
interfaceOnly one of Cortex−M3 Dual Core can be  
traced  
Availability of features explained here depends on  
products.  
Interrupt Controller (External 90 ch, Internal 83 ch)  
SPI (2 ch)  
Pseudo SRAM I/F (1 ch)  
MP3 hard wired encoder/decoder  
MP3 MPEG1, MPEG2, MPEG2.5  
− Sampling rate: 8 kHz,11.025 kHz,12 kHz,  
16 kHz, 22.05 kHz, 24 kHz, 32 kHz, 44.1 kHz,  
48 kHz  
− Bit rate: 8 Kbps to 320 Kbps (Decoder−VBR  
supported)  
LPDSP32 system  
Internal SRAM (220 kbyte)  
Audio codec  
Serial Flash I/F (1 ch)  
Quad SPI, cache memory (16 k-byte, 4way set  
associative, 128 line) function available  
UART (3ch)  
UART1, UART2: w/flow control (CTS, RTS)  
UART0: w/o flow control  
I2C (2ch) Single Master, Full/Standard  
GPIO (90 ch)  
Pin multiplex function (I2C:2 ch, SPI:2 ch, UART:3  
ch, MTM:2 ch, DMIC:2 ch x 2)  
Plain Timer w/ Watch Dog Timer (1 ch×3)  
Multiple Timer (2 ch×4)  
12 bit ADC (8 ch)  
SD Card I/F (3 ch)  
− MP3  
− WMA  
− AAC  
− SBC  
− FLAC, etc.  
Audio function  
− Active Noise Canceller  
− 1−mic/2−mic Noise Canceller for Recorder  
− 2−mic Noise Canceller for Hands Free  
− Echo Canceller  
eSD/eMMC, UHS−I, w/o CPRM  
− SD0: eSD/eMMC boot supported (Internal ROM  
Boot function)  
− SD1: 1.8 V/3.3 V dedicated power supply  
− SD2 :  
Variable Speed Control playback etc.  
JTAG ICE  
USB2.0 Device (HS/FS) Controller,  
Host (HS/FS/LS) Controller with OTG Controller,  
Integrated PHY.  
Xtal (XT1) is required for USB function, 12, 19.2,  
24 MHz for device and host with OTG function.  
Host and Device share an integrated PHY.  
1
MPEG Layer3 audio coding technology licensed from Fraunhofer IIS and Thomson. Supply of this product does not convey license nor  
imply any right to distribute content created with this product in revenuegenerating broadcast systems (terrestrial, satellite, cable and/or  
other distribution channels), streaming applications (via Internet, intranets and/or networks), other content distribution systems (payau-  
dio or audioondemand applications and the like) or on physical media (compact discs, digital versatile discs, semiconductor chips,  
hard drives, memory cards and the like). For details, please visit http://mp3licensing.com/  
Supply of this product does not convey license under the relevant intellectual property of Thomson and/or Fraunhofer Gesellschaft nor  
imply any right to use this product in any finished end user or readytouse final product. An independent license for such use is required.  
For details, please visit http://mp3licensing.com/  
This product contain technology of Microsoft company ownership, and you cannot distribute or use without getting license from Microsoft  
Licensing Company.  
2
www.onsemi.com  
3
LC823455  
Bluetooth Protocol Stack available  
Audio clock generation  
Dedicated PLL for audio  
Audio  
Selectable PLL reference clock  
XT1 (12, 19.2, 24 MHz Main xtal)  
XTRTC (32.768 kHz RTC xtal)  
PCM I/F MCLK0 (/MCLK1), BCK0, BCK1  
MP3 hard wired encoder/decoder, MP3 MPEG1,  
MPEG2, MPEG2.5  
− Sampling rate: 8 kHz,11.025 kHz,12 kHz,16 kHz,  
22.05 kHz, 24 kHz, 32 kHz, 44.1 kHz, 48kHz  
− Bit rate :8 Kbps to 320 Kbps  
(Decoder−VBR supported)  
Power supply  
Typical voltage  
Other audio functions available  
− 6 band Equalizer (EQ3)  
− LOGIC(Vdd1),XT1(VddXT1),  
PLL1(AVddPLL1), PLL2(AVddPLL2) = 1.0 V  
− RTC(VddRTC) = 1.0 V  
− Hardware Mixer  
Volume, Mute  
− Level Meter  
− Audio Timer w/ interrupt generation  
− 16/24/32 bit 192 kHz PCM I/F (2ch×2).  
Master/slave, I2S  
− I/O(Vdd2) = 1.8 V or 3.3 V  
− SD1(VddSD1) = 1.8 V or 3.3 V  
− ADC(AVddADC) = 1.8V  
− USB PHY(DVddUSBPHY1) = 1.0 V,  
(AVddUSBPHY2) = 3.3 V,  
− SSRC (Synchronous Sampling Rate Converter)  
0.25 to 64 conversion capable  
− ASRC (Asynchronous Sampling Rate Converter)  
Jitter reducing function supporting USB audio  
class and Bluetooth streaming  
− Beep generator  
(AVddUSBPHY18) = 1.8 V  
− Class−D Amplifier  
(AVddDAMPL,AVddDAMPR) = 1.5 V  
− Digital Microphone I/F (2ch x2), Sampling rate :  
up to 48 kHz, Support up to 4 PDM Digital  
Microphones  
− 16 bit Audio DAC (2 ch)  
w/ Class−D Amplifier for Head Phone (2 ch).  
Requires external LC LPF  
3
The product name for which Bluetooth Protocol Stack is available is determined. Please contact our representative for license fee for the  
Stack.  
Copyright 19992014 OpenSynergy GmbH  
All rights reserved. All unpublished rights reserved.  
www.onsemi.com  
4
LC823455  
Package Codes and Functional Differences  
The products with Package Code = “RA” and “RB” are under planning.  
Table 1. FUNCTIONAL DIFFERENCES  
Package Code  
XA  
RA  
RB  
Function  
Package  
WLP120  
BGA240  
Available  
Available  
BGA136  
SDRAM Controller  
External Memory  
Controller  
SD0  
Shared pins with S−Flash  
function  
Dedicated  
Available  
Dedicated  
P−SRAM  
USB2.0  
HS/FS Device  
HS/FS Device and  
HS/FS Device  
HS/FS/LS Host with OTG  
12 bit ADC  
3ch  
8ch  
8ch  
PLL1  
PLL2  
Only Internal Loop Filter  
Internal / External Loop Filter  
Only Internal Loop Filter  
XTALINFO[1:0] input  
RTCMODE input  
BACKUPB input  
“00”  
Available  
Available  
Available  
“00”  
(24 MHz)  
(24 MHz)  
“0”  
Available  
Available  
(KEYINT RTC mode)  
Connected with VDET  
internally  
KEYINT input  
External Interrupt  
GPIO  
2ch  
3ch  
2ch  
52 ch  
52 ch  
90 ch  
90 ch  
53 ch  
53 ch  
www.onsemi.com  
5
LC823455  
Block Diagram  
12MHz,  
19.2MHz,  
24MHz  
32.768kHz  
XTRTC  
SWD/SWV  
ICE  
JTAG  
ICE  
XT 1  
DMAC  
(8ch)  
ARM Cortex-M3 ARM Cortex-M3  
LPDSP32  
PSRAM I/F  
(1ch)  
Multilayer Bus  
EXT4  
S-Flash I/F  
(1ch)  
APB  
Bridge  
PD -G  
SRAM S8  
(32Kbyte)  
SRAM S9  
(220Kbyte)  
SRAM S7A  
(256Kbyte)  
SDRAM  
CTRL  
Cache  
(16 Kbyte)  
PD -10  
BASIC  
PD -E  
Reset  
Controller  
SRAM S5B  
(384Kbyte)  
SRAM S7B  
(224Kbyte)  
SRAM S6  
(1536Kbyte)  
External  
Memory  
Controller  
BUF  
(16 Kbyte)  
PD -8  
PD -7  
PD -9  
PD -J  
USB2.0  
USB2.0  
Device/Host  
(OTG)  
USB  
PHY  
SRAM S2  
(256Kbyte)  
SRAM S5A  
(384Kbyte)  
SRAM S4  
(256Kbyte)  
SRAM S3  
(256Kbyte)  
XT1  
PD -4  
PD -6  
PD -5  
Plain  
Timer  
(1ch×3)  
Multiple  
Timer  
(2ch×4)  
Main  
Module  
Manager  
SRAM S1  
(256Kbyte)  
ROM  
(256Kbyte)  
SRAM S0B  
(128Kbyte)  
SRAM S0A  
(128Kbyte)  
PD -3  
PD -2  
PD -1  
EXT1  
PD -H  
12 bit ADC  
(8ch )  
I2C  
(2ch )  
UART  
(3ch )  
SPI  
(2ch )  
BUF  
(512 byte×3)  
OSC  
System  
PLL  
SD I/F  
(3ch)  
PORT0~4  
(80 I/O)  
PORT5  
(10 I/O)  
XT1 XTRTC RC  
EXT3  
RTC  
OSC  
XTRTC  
ATM  
BEEP  
VOLUME  
EQ3  
Audio Buffer  
(256 Kbyte)  
Audio PLL  
PD -RTC  
MP3  
Decoder  
PCM  
I/F  
PCM  
I/F  
MP3  
XT1  
AHB CLK  
(HCLK)  
BCK0/1  
MCLK0/1  
(PCM I/F)  
METER  
Encoder  
MUTE  
SSRC  
ASRC  
A
N
C
*
16bit Audio  
DAC  
Digital  
Mic  
Digital  
Mic  
MIXER  
PD -A  
Class-D  
AMP  
Figure 1. Top−Level Block Diagram  
www.onsemi.com  
6
LC823455  
Bus Matrix  
DMAC  
(8ch)  
USB2.0  
ARM Cortex−M3  
LPDSP32  
ARM Cortex−M3  
System  
ROM  
SRAM  
(Seg 0)  
SRAM  
(Seg 8)  
SRAM  
(Seg 9)  
BASIC  
Peripheral  
EXT1  
Peripheral  
EXT3  
Peripheral  
EXT4  
Peripheral  
APB  
Peripheral  
Figure 2. Bus Matrix  
www.onsemi.com  
7
LC823455  
Audio  
256KB SRAM divided into  
A~ N Audio Buffers  
by register settings  
Internal  
Bus  
A buffer  
8
MP3  
Encoder  
RAM  
B buffer  
Dredirect  
Eredirect  
Gredirect  
Jredirect  
BIT1-0、  
MONO  
16  
RAM  
Lredirect  
Nredirect  
24  
8
0
1
D
E
C
S
E
L
C buffer  
Eredirect  
Gredirect  
Jredirect  
Lredirect  
Nredirect  
BIT1-0MONO  
24  
16  
MP3  
Decoder  
RAM  
METER  
(DEC)  
MUTE  
(DEC)  
D buffer  
E buffer  
32  
32 Bit conv  
24  
32  
VOLUME  
(DEC)  
DMCKO0A  
DMDIN0A  
RAM  
RAM  
Bit conv  
SSRC  
S
E
L
24  
32  
Digtal  
Mic0  
BIT1-0MONO  
1
0
P
C
M
S
E
L
DMCKO0B  
DMDIN0B  
32  
0
1
S
I
N
S
E
L
32  
PCM input  
VOLUME  
(SP0)  
PCM  
SP0  
DIN0  
(PCM input)  
Bit conv  
BIT1-0MONO  
EQ3  
METER  
(SP0)  
SINGEN  
VOLUME  
(AMB)  
F buffer  
Dredirect  
Eredirect  
Gredirect  
Jredirect  
Lredirect  
Nredirect  
BIT1-0MONO  
32  
24  
PCM output  
PCM  
PS0  
DOUT0  
(PCM output)  
32  
DWNMIX  
(PS0)  
VOLUME  
(PS0)  
MUTE  
(PS0)  
EQ3  
MIXER  
BTL  
BEEP  
16 bit  
Audio  
DAC  
LOUT  
ROUT  
Class−D  
AMP  
RAM  
MCLK0/  
BCK0/  
LRCK0  
METER  
(PS0)  
METER  
(SP1)  
G buffer  
LRCK0  
AudioTimer0  
32  
32  
VOLUME  
(SP1)  
24  
32  
RAM  
Bit conv  
BIT1-0、  
Digtal  
Mic1  
DMCKO1  
DMDIN1  
P
C
M
1
S
E
L
1
0
MONO  
BIT1-0MONO  
H buffer  
Dredirect  
Eredirect  
Gredirect  
Jredirect  
Lredirect  
Nredirect  
PCM input  
PCM  
SP1  
DIN1  
(PCM input)  
DWNMIX  
(PS1)  
VOLUME  
(PS1)  
32  
PCM output  
RAM  
PCM  
PS1  
DOUT1  
(PCM output)  
METER  
MCLK1/  
BCK1/  
(PS1)  
LRCK1  
I buffer  
Dredirect  
Eredirect  
Gredirect  
Lredirect  
Nredirect  
BIT1-0MONO  
LRCK1  
AudioTimer1  
24  
24  
ASRC  
RAM  
J buffer  
32 Bit conv  
RAM  
Bit conv  
BIT1-0MONO  
K buffer  
Dredirect  
Eredirect  
Gredirect  
Jredirect  
Nredirect  
BIT1-0MONO  
RAM  
L buffer  
CBIT1-0、  
CMONO  
RAM  
Bit conv  
32 Bit conv  
BIT1-0MONO  
32  
M buffer  
Dredirect  
Eredirect  
Gredirect  
Jredirect  
Lredirect  
BIT1-0MONO  
RAM  
N buffer  
RAM  
CBIT1-0、  
CMONO  
Bit conv  
32 Bit conv  
BIT1-0MONO  
Figure 3. Audio  
www.onsemi.com  
8
LC823455  
Clock Hierarchy  
12MHz  
19.2MHz  
24MHz  
FCLKCNT  
XT1  
PHI1 pin  
32.768kHz  
Oscillation System  
1/1、1/2、1/4、  
1/8、1/16  
PLL1  
1/4  
1/2  
XT1  
(XIN1/XOUT 1 pin)  
XTRTC  
(XIN32K/XOUT 32K pin )  
SYSTEM PLL  
(PLL1)  
1/4  
XT1  
1/4  
1/2、1/4  
PHI0 pin  
XTRTC  
RC  
1/1、1/{(1~63)×2}  
BASIC CLK  
APB  
ADC  
1/2、1/4、1/8、  
1/16、1/32、1/64  
1/{(1~8)  
+
(0~63)/64}  
MCLKCNTAPB  
BASIC  
ADCCLK  
(Internal)  
M3Core0  
M3Core1  
LPDSP32  
SRAM/ROM  
INTC  
CORECNT  
[Note]  
M3Core 0, M3Core  
switch enabled by the execution of  
SPI0  
1/{(2~256 )×4}  
-
1
and LPDSP 32 has additional clock gating  
SCK0  
a
dedicated operat.ion  
SPI1  
1/{(2~256 )×4}  
SCK1  
PORT 0  
PORT 1  
PORT 2  
PORT 3  
PORT 4  
PORT 5  
RTC  
MCLKCNTBASIC  
DMAC  
Cache  
S-Flash I/F  
SFCK  
1/1、1/2、  
1/4、1/8  
External Memory  
Controller(XMC)  
XTRTC  
I2C0  
1/{(2~65535)×8}  
XT1  
SCL0  
SCL1  
USB PHY  
USB2.0 Device/Host  
(OTG)  
I2C1  
1/{(2~65535)×8}  
MCLKCNTAPB  
UART0  
1/{(8~16)×  
(1~65536)}  
APB CLK (PCLK )  
1/(1~64)  
1/(1~64)  
UART1  
1/{(8~16)×  
(1~65536)}  
AHB CLK(HCLK)  
MCLKCNTEXT 1  
MCLKCNTEXT 1  
AHB EXT1  
Plain Timer 0  
Plain Timer 1  
Plain Timer 2  
Multiple Timer 0  
Multiple Timer 1  
Multiple Timer 2  
Multiple Timer 3  
Audio PLL  
UART2  
1/{(8~16)×  
(1~65536)}  
AUDIO Block  
CLOCKEN  
FS384  
FS192  
1/2  
MP3DEC  
MP3ENC  
DECCLK 1/2、1/4、  
1/8  
1/1、1/2、  
1/4  
ENCCLK 1/4、1/8、  
1/16  
AUDCLK  
FS256  
1/1、1/2、  
1/3  
1/4  
AUDIO Control  
MIXER  
BCK0  
BCK1  
XT1  
AUDIO  
PLL  
1/2  
FS768  
FS384  
EQ3  
XTRTC  
(PLL2)  
System PLL  
1/4  
BEEP  
MCLK 0/MCLK 1  
(input)  
OSC System  
1/1、1/2、  
1/4、1/8  
SDCLK0  
SSRC  
SSRCFCLK  
AHB CLK  
)
ASRC  
1/1、1/2、  
1/4、1/8  
1/1、1/2、1/4、1/8、  
1/16、1/32、1/64、  
1/128 、1/256 、1/512  
(HCLK  
MCLKCNTEXT 1  
ASRCFCLK  
VOLUME DEC  
VOLUME SP 0  
VOLUME PS0  
VOLUME SP 1  
VOLUME PS1  
VOLUME AMB  
METER DEC  
METER SP0  
METER PS0  
METER SP1  
METER PS1  
MUTE DEC  
MUTE PS0  
PCMPS0  
SD0(Main Function)  
SD0(Card Detect)  
SDCLK1  
[Note]  
-
-
-
Regarding the initial value of switches described in this fig,ure  
refer to the appropriate documen.ts  
1/1、1/2、1/4、1/8、  
1/16、1/32、1/64、  
1/128 、1/256 、1/512  
MCLKCNTEXT 1  
Regarding the frequency of SSRCFCLK and ASRCFCLK,  
refer to the SSRC and ASRC Programmesr Model documents.  
SD1(Main Function)  
SD1(Card Detect)  
ENCCLK frequency should be192 * FS  
while FS is Sampling Frequency of MPE1Gmode of MP3.  
ex.) ENCCLK should be8.4672MHz to make all of MP  
44.1/22.05/11.025 KHz (MPEG1/MPEG2/MPEG2.5).  
3 data  
SDCLK2  
-
DECCLK frequency should be384 * FS  
while FS is Sampling Frequency of MPE1Gmode of MP3.  
1/1、1/2、1/4、1/8、  
1/16、1/32、1/64、  
1/128 、1/256 、1/512  
ex.) DECCLK should be16.9344MHz to make all of MP  
44.1/22.05/11.025 KHz (MPEG1/MPEG2/MPEG2.5).  
3 data  
MCLKCNTEXT 1  
SD2(Main Function)  
SD2(Card Detect)  
PCMSP0  
MCLKCNTEXT 3  
AHB EXT3  
PCMPS1  
AUDIO BUFFER  
PCMSP1  
AudioTimer 0  
AudioTimer 1  
SINGEN  
AHB EXT4  
PSRAM I/F  
1/(1~64)  
PLL1  
MCLKCNTEXT 4  
XT1  
DigitalMIC0  
DigitalMIC1  
PCKGEN  
[Note]  
-
PSM_SCK  
Class-D AMP has additional clock source and gating switch  
for being used as GPO.  
1/1, 1/2,  
FS384  
1/4  
SDRAM CTRL  
Damp CTL  
Class -D AMP  
SDRCLK  
FCEDAC  
AHB CLK  
(EXT4 only)  
1/1, 1/2, 1/4, 1/8,  
1/16, 1/32  
16bit Audio  
DAC(Noise Shaping )  
MCLK0/MCLK1  
)
(output  
1/1, 1/2, 1/4  
1/8, 1/16  
DAC(Main)  
1/1, 1/21/4, 1/8,  
1/16, 1/32  
Figure 4. Clock Hierarchy  
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9
LC823455  
Memory Map  
All Areas (Cortex−M3)  
Figure 5. All Areas (Cortex−M3)  
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10  
LC823455  
Code Area (Cortex−M3)  
Table 2. CODE AREA (CORTEX−M3) − UNREMAPPED (AFTER RESET)  
Cortex−M3−0  
Cortex−M3−1  
I−Bus  
System−  
Bus  
System−  
Bus  
I−Bus  
D−Bus  
D−Bus  
Address  
Master / Slave  
DMAC  
USB20  
0x1C00  
0000  
Reserved  
0x1A00  
0000  
External memory 1  
External memory 0  
Reserved  
d
d
d
d
0x1800  
0000  
0x0600  
0000  
0x0500  
0000  
S−Flash I/F  
d
d
d
(Memory, Cache)  
0x0254  
0000  
Reserved  
256 KB Internal ROM  
Reserved  
0x0250  
0000  
d
0x0243  
7000  
0x0240  
0000  
220 KB Internal SRAM  
(seg 9)  
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
0x023F  
8000  
32 KB Internal SRAM  
(seg 8)  
480 KB  
Internal  
SRAM  
0x023C  
0000  
224 KB  
(seg 7−B)  
0x0238  
0000  
256KB  
(seg 7)  
(seg 7−A)  
0x0220  
0000  
1536 KB Internal SRAM  
(seg 6)  
768 KB  
Internal  
SRAM  
0x021A  
0000  
384 KB  
(seg 5−B)  
0x0214  
0000  
384 KB  
(seg 5)  
(seg 5−A)  
0x0210  
0000  
256 KB Internal SRAM  
(seg 4)  
0x020C  
0000  
256 KB Internal SRAM  
(seg 3)  
0x0208  
0000  
256 KB Internal SRAM  
(seg 2)  
0x0204  
0000  
256 KB Internal SRAM  
(seg 1)  
256 KB  
Internal  
SRAM  
0x0202  
0000  
128 KB  
(seg 0−B)  
0x0200  
0000  
128 KB  
(seg 0)  
(seg 0−A)  
0x0004  
0000  
Reserved  
0x0000  
0000  
256 KB Internal ROM  
Shadow Area  
d
d
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11  
LC823455  
Table 3. CODE AREA (CORTEX−M3) − REMAPPED (REMAP[1:0]=2’B01)  
Cortex−M3−0  
Cortex−M3−1  
I−Bus  
System−  
Bus  
System−  
Bus  
I−Bus  
D−Bus  
D−Bus  
Address  
Master / Slave  
DMAC  
USB20  
0x1C00  
0000  
Reserved  
0x1A00  
0000  
External memory 1  
External memory 0  
Reserved  
d
d
d
d
0x1800  
0000  
0x0600  
0000  
S−Flash I/F  
0x0500  
0000  
d
d
d
(Memory, Cache)  
0x0254  
0000  
Reserved  
256 KB Internal ROM  
Reserved  
0x0250  
0000  
d
0x0243  
7000  
220 KB Internal SRAM  
(seg 9)  
0x0240  
0000  
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
32 KB Internal SRAM  
(seg 8)  
0x023F  
8000  
224 KB  
480 KB  
0x023C  
0000  
(seg 7−B)  
Internal  
SRAM  
256 KB  
0x0238  
0000  
(seg 7)  
(seg 7−A)  
1536 KB Internal SRAM  
(seg 6)  
0x0220  
0000  
384 KB  
768 KB  
0x021A  
0000  
(seg 5−B)  
Internal  
SRAM  
384 KB  
0x0214  
0000  
(seg 5)  
(seg 5−A)  
256 KB Internal SRAM  
(seg 4)  
0x0210  
0000  
256 KB Internal SRAM  
(seg 3)  
0x020C  
0000  
256 KB Internal SRAM  
(seg 2)  
0x0208  
0000  
256 KB Internal SRAM  
(seg 1)  
0x0204  
0000  
128 KB  
256 KB  
0x0202  
0000  
(seg 0−B)  
Internal  
SRAM  
128 KB  
0x0200  
0000  
(seg 0)  
(seg 0−A)  
0x0004  
0000  
Reserved  
256 KB  
Internal  
SRAM  
0x0002  
0000  
128 KB  
d
d
d
d
(seg 0−B)  
(seg 0)  
128 KB  
0x0000  
0000  
Shadow  
Area  
(seg 0−A)  
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12  
LC823455  
Table 4. CODE AREA (CORTEX−M3) − REMAPPED (REMAP[1:0]=2’B11)  
Cortex−M3−0  
Cortex−M3−1  
I−Bus  
System−  
Bus  
System−  
Bus  
I−Bus  
D−Bus  
D−Bus  
Address  
Master / Slave  
DMAC  
USB20  
0x1C00  
0000  
Reserved  
0x1A00  
0000  
External memory 1  
External memory 0  
Reserved  
d
d
d
d
0x1800  
0000  
0x0600  
0000  
S−Flash I/F  
0x0500  
0000  
d
d
d
(Memory, Cache)  
0x0254  
0000  
Reserved  
256 KB Internal ROM  
Reserved  
0x0250  
0000  
d
0x0243  
7000  
220 KB Internal SRAM  
(seg 9)  
0x0240  
0000  
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
32 KB Internal SRAM  
(seg 8)  
0x023F  
8000  
224 KB  
480 KB  
0x023C  
0000  
(seg 7−B)  
Internal  
SRAM  
256 KB  
0x0238  
0000  
(seg 7)  
(seg 7−A)  
1536KB Internal SRAM  
(seg 6)  
0x0220  
0000  
384 KB  
768 KB  
0x021A  
0000  
(seg 5−B)  
Internal  
SRAM  
384 KB  
0x0214  
0000  
(seg 5)  
(seg 5−A)  
256KB Internal SRAM  
(seg 4)  
0x0210  
0000  
256KB Internal SRAM  
(seg 3)  
0x020C  
0000  
256KB Internal SRAM  
(seg 2)  
0x0208  
0000  
256KB Internal SRAM  
(seg 1)  
0x0204  
0000  
128 KB  
256 KB  
0x0202  
0000  
(seg 0−B)  
Internal  
SRAM  
128 KB  
0x0200  
0000  
(seg 0)  
(seg 0−A)  
External memory 0  
Shadow Area  
0x0000  
0000  
d
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13  
LC823455  
SRAM Area (Cortex−M3)  
Table 5. SRAM AREA (CORTEX−M3)  
Cortex−M3−0  
Cortex−M3−1  
I−Bus D−Bus  
System−  
Bus  
System−  
Bus  
I−Bus  
D−Bus  
Address  
Master / Slave  
DMAC  
USB20  
0x2600  
0000  
Reserved  
0x2500  
0000  
S−Flash I/F  
d
d
d
d
d
d
(Memory, Cache)  
0x2400  
0000  
S−Flash I/F  
(Memory, No Cache)  
0x2043  
7000  
Reserved  
0x2040  
0000  
220 KB Internal SRAM  
(seg 9) Shadow area  
d
d
d
d
d
d
0x203F  
8000  
32 KB Internal SRAM  
(seg 8) Shadow area  
0x203C  
0000  
480 KB  
224 KB  
Internal  
d
d
d
(seg 7−B)  
SRAM  
(seg 7)  
256 KB  
Shadow  
0x2038  
0000  
d
d
d
d
d
d
d
d
d
(seg 7−A)  
area  
0x2020  
0000  
1536 KB Internal SRAM  
(seg 6) Shadow area  
0x201A  
0000  
768 KB  
384 KB  
Internal  
(seg 5−B)  
SRAM  
(seg 5)  
384 KB  
Shadow  
0x2014  
0000  
d
d
d
(seg 5−A)  
area  
0x2010  
0000  
256 KB Internal SRAM  
(seg 4) Shadow area  
d
d
d
d
d
d
d
d
d
d
d
d
0x200C  
0000  
256 KB Internal SRAM  
(seg 3) Shadow area  
0x2008  
0000  
256 KB Internal SRAM  
(seg 2) Shadow area  
0x2004  
0000  
256 KB Internal SRAM  
(seg 1) Shadow area  
256 KB  
128 KB  
0x2002  
0000  
Internal  
d
d
d
d
d
d
(seg 0−B)  
SRAM  
(seg 0)  
128 KB  
Shadow  
0x2000  
0000  
(seg 0−A)  
area  
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14  
LC823455  
Other Areas (Cortex−M3)  
Table 6. OTHER AREAs (CORTEX−M3)  
Cortex−M3−0  
Cortex−M3−1  
I−Bus D−Bus  
System−  
System−  
Bus  
Bus  
I−Bus  
D−Bus  
Address  
Master / Slave  
DMAC  
USB20  
0xE010  
0000  
Reserved  
0xE00F  
F000  
ROM table  
d
d
(Note 1)  
(Note 1)  
0xE00F  
E000  
CORE REG  
d
d
(Note 1)  
(Note 1)  
0xE004  
1000  
Reserved  
TPIU  
0xE004  
0000  
d
d
(Note 1)  
(Note 1)  
0xE000  
F000  
Reserved  
NVIC  
0xE000  
E000  
d
d
(Note 1)  
(Note 1)  
0xE000  
3000  
Reserved  
FPB  
0xE000  
2000  
d
d
(Note 1)  
(Note 1)  
0xE000  
1000  
DWT  
ITM  
d
d
(Note 1)  
(Note 1)  
0xE000  
0000  
d
d
(Note 1)  
(Note 1)  
0x6400  
2000  
Reserved  
PSRAM I/F  
SDRAM CTRL  
Reserved  
SDRAM Memory area  
Reserved  
RTC  
0x6400  
1000  
d
d
d
d
d
0x6400  
0000  
0x6200  
0000  
0x6000  
0000  
d
d
d
0x4008  
F000  
0x4008  
E000  
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
0x4008  
D000  
UART2  
d
d
d
0x4008  
C000  
UART1  
0x4008  
B000  
UART0  
0x4008  
A000  
I2C1  
0x4008  
9000  
I2C0  
0x4008  
8800  
SPI1  
d
d
d
0x4008  
8000  
SPI0  
0x4008  
7000  
ADC  
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15  
 
LC823455  
Table 6. OTHER AREAs (CORTEX−M3) (continued)  
Cortex−M3−0  
Cortex−M3−1  
I−Bus D−Bus  
System−  
Bus  
System−  
Bus  
I−Bus  
D−Bus  
Address  
Master / Slave  
DMAC  
USB20  
0x4008  
6000  
PORT5  
d
d
d
d
d
d
d
d
d
d
d
d
d
d
0x4008  
5000  
PORT4  
PORT3  
0x4008  
4000  
0x4008  
3000  
PORT2  
0x4008  
2000  
PORT1  
0x4008  
1000  
PORT0  
0x4008  
0000  
System Controller  
Reserved  
0x4006  
5000  
0x4006  
4000  
Audio Controls  
MP3 Encoder  
MP3 Decoder  
Audio Functions  
Audio Buffer  
Reserved  
d
d
d
d
d
d
d
d
d
d
0x4006  
3000  
0x4006  
2000  
0x4006  
1000  
0x4006  
0000  
d
0x4004  
D000  
0x4004  
C000  
SD2  
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
0x4004  
B000  
SD1  
0x4004  
A000  
SD0  
0x4004  
9000  
Plain Timer2  
Plain Timer1  
Plain Timer0  
Multiple Timer3  
Multiple Timer2  
Multiple Timer1  
Multiple Timer0  
Audio PLL  
0x4004  
8000  
0x4004  
7000  
0x4004  
6000  
0x4004  
5000  
0x4004  
4000  
0x4004  
3000  
0x4004  
2000  
0x4004  
1000  
System PLL  
OSC System  
0x4004  
0000  
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16  
LC823455  
Table 6. OTHER AREAs (CORTEX−M3) (continued)  
Cortex−M3−0  
Cortex−M3−1  
I−Bus D−Bus  
System−  
Bus  
System−  
Bus  
I−Bus  
D−Bus  
Address  
Master / Slave  
DMAC  
USB20  
0x4002  
0000  
Reserved  
0x4001  
0000  
USB2.0 FIFO  
Reserved  
d
d
0x4000  
7000  
0x4000  
6000  
DSP CMDIF  
MUTEX REG  
DMAC  
d
d
d
d
d
d
d
d
d
d
d
d
d
d
0x4000  
5000  
0x4000  
4000  
0x4000  
3000  
INTC  
0x4000  
2000  
USB2.0 CTL  
S−Flash I/F  
External MEM CTL  
0x4000  
1000  
0x4000  
0000  
1. Access from internal peripheral bus(AHB/APB)  
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17  
LC823455  
LPDSP32  
Table 7. LPDSP32 − DMA  
LPDSP32  
DMA  
Address  
0x40 0000  
0x3F 8000  
0x3C 0000  
0x38 0000  
0x20 0000  
0x1A 0000  
0x14 0000  
0x10 0000  
0x0C 0000  
0x08 0000  
0x04 0000  
0x02 0000  
0x00 0000  
Master / Slave  
Reserved  
32 KB Internal SRAM (seg 8)  
d
d
d
d
d
d
d
d
d
d
d
d
480 KB Internal SRAM (seg 7)  
224 KB (seg 7−B)  
256 KB (seg 7−A)  
1536 KB Internal SRAM (seg 6)  
768 KB Internal SRAM (seg 5)  
384 KB (seg 5−B)  
384 KB (seg 5−A)  
256 KB Internal SRAM (seg 4)  
256 KB Internal SRAM (seg 3)  
256 KB Internal SRAM (seg 2)  
256 KB Internal SRAM (seg 1)  
256 KB Internal SRAM (seg 0)  
128 KB (seg 0−B)  
128 KB (seg 0−A)  
Table 8. LPDSP32 – DMB  
LPDSP32  
DMB  
Address  
0xC0 0000  
0xBF 8000  
0xBC 0000  
0xB8 0000  
0xA0 0000  
0x9A 0000  
0x94 0000  
0x90 0000  
0x8C 0000  
0x88 0000  
0x84 0000  
0x82 0000  
0x80 0000  
Master / Slave  
Reserved  
32 KB Internal SRAM (seg 8)  
480 KB Internal SRAM (seg 7)  
224 KB (seg 7−B)  
d
d
d
d
d
d
d
d
d
d
d
d
256 KB (seg 7−A)  
1536 KB Internal SRAM (seg 6)  
768 KB Internal SRAM (seg 5)  
384 KB (seg 5−B)  
384 KB (seg 5−A)  
256 KB Internal SRAM (seg 4)  
256 KB Internal SRAM (seg 3)  
256 KB Internal SRAM (seg 2)  
256 KB Internal SRAM (seg 1)  
256 KB Internal SRAM (seg 0)  
128 KB (seg 0−B)  
128 KB (seg 0−A)  
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18  
LC823455  
Table 9. LPDSP32 − DMIO  
LPDSP32  
DMIO  
Address  
0xF0 2000  
0xF0 1000  
0xF0 0000  
0xD0 0000  
0xC6 5000  
0xC6 4000  
0xC6 3000  
0xC6 2000  
0xC6 1000  
0xC6 0000  
0xC4 A000  
0xC4 9000  
0xC4 8000  
0xC4 7000  
0xC4 6000  
0xC4 5000  
0xC4 4000  
0xC4 3000  
0xC4 2000  
0xC4 1000  
0xC4 0000  
0xC0 7000  
0xC0 6000  
0xC0 5000  
0xC0 4000  
0xC0 3000  
0xC0 0000  
Master / Slave  
Reserved  
PSRAM I/F  
d
d
d
SDRAM CTRL  
SDRAM Memory Area  
Reserved  
Audio Controls  
MP3 Encoder  
MP3 Decoder  
Audio Functions  
Audio Buffer  
Reserved  
d
d
d
d
d
Plain Timer2  
Plain Timer1  
Plain Timer0  
Multiple Timer3  
Multiple Timer2  
Multiple Timer1  
Multiple Timer0  
Audio PLL  
d
d
d
d
d
d
d
d
d
d
System PLL  
OSC System  
Reserved  
DSP CMDIF  
MUTEX REG  
DMAC  
d
d
d
d
INTC  
Reserved  
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19  
LC823455  
Table 10. LPDSP32 − PM  
LPDSP32  
PM  
Address  
0x50 3332  
0x50 0000  
0x4B 0000  
0x48 0000  
Master / Slave  
Reserved  
32 KB Internal SRAM (seg 8)  
Reserved  
d
480 KB Internal SRAM (seg 7)  
224 KB (seg 7−B)  
256 KB (seg 7−A)  
0x41 9998  
0x38 0000  
0x34 CCCC  
0x30 0000  
Reserved  
1536 KB Internal SRAM (seg 6)  
Reserved  
768 KB Internal SRAM (seg 5)  
384 KB (seg 5−B)  
384 KB (seg 5−A)  
0x29 9998  
0x28 0000  
0x21 9998  
0x20 0000  
0x19 9998  
0x18 0000  
0x11 9998  
0x10 0000  
0x09 9998  
0x08 0000  
Reserved  
256 KB Internal SRAM (seg 4)  
Reserved  
d
d
d
d
256 KB Internal SRAM (seg 3)  
Reserved  
256 KB Internal SRAM (seg 2)  
Reserved  
256 KB Internal SRAM (seg 1)  
Reserved  
256 KB Internal SRAM (seg 0)  
128 KB (seg 0−B)  
128 KB (seg 0−A)  
d
d
0x01 6000  
0x00 0000  
Reserved  
220 KB Internal SRAM (seg 9)  
d
2. PM of LPDSP32 cannot access internal SRAM seg5, 6, and 7.  
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20  
LC823455  
TERMINAL FUNCTIONS  
XA: Package Code = “XA”, RA: Package Code = “RA”, RB: Package Code = “RB”, (RA and RB are under planning).  
Table 11. TERMINAL FUNCTIONS  
Terminal Name  
Polarity  
Direction  
Function  
Available(d)  
Multiplexed  
Function  
XA  
RA  
RB  
IO POWER  
JTAG/SWD  
TDO  
VddSD1  
Pos  
O
I
JTAG test data output  
SD I/F Ch1 write protect  
GPIO  
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
6
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
6
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
6
SDWP1  
GPIO21  
EXTINT21  
TDI  
B
I
External Interrupt 2−bit1  
JTAG test data input  
SD I/F Ch1 detect  
serial wire view data  
GPIO  
VddSD1  
I
SDCD1  
SWO  
Neg  
I
O
B
I
GPIO20  
EXTINT20  
TMS  
External Interrupt 2−bit0  
JTAG test data select  
SD I/F Ch2 write protect  
GPIO  
Vdd2  
Vdd2  
Vdd2  
Vdd2  
I
SDWP2  
GPIO28  
EXTINT28  
TCK  
Pos  
I
B
I
External Interrupt 2−bit8  
JTAG test clock  
Pos  
Neg  
I
SDCD2  
GPIO29  
EXTINT29  
SWDCLK  
DMCKO0B  
GPIO58  
EXTINT58  
SWDIO  
DMDIN0B  
GPIO59  
EXTINT59  
I
SD I/F Ch2 detect  
GPIO  
B
I
External Interrupt 2−bit9  
Serial wire clock  
Digital Mic Ch0 Clock B Output  
GPIO  
Pos  
I
O
B
I
External Interrupt 5−bit8  
Serial wire Data  
B
I
Digital Mic Ch0 Data B Input  
GPIO  
B
I
External Interrupt 5−bit9  
Sum  
RTC  
XIN32K  
Pos  
I
32.768KHz XTAL Input  
(XTRTC)  
VddRTC  
VddRTC  
d
d
d
d
d
d
XOUT32K  
O
32.768KHzXTAL Output  
(XTRTC)  
VDET  
Neg  
Neg  
I
RTC power detect Input  
VddRTC  
VddRTC  
d
d
d
d
d
d
RTCINT  
O
RTC Interrupt Output (Normal:  
Hiz, Interrupt enabled:Low Out-  
put)  
BACKUPB  
Neg  
I
RTC backup mode input  
VddRTC  
d
d
Bonded with VDET internally  
for “XA”  
KEYINT[2]  
I
I
RTC KEY input can be used  
when KeyInt RTC mode  
VddRTC  
VddRTC  
d
d
KEYINT[1:0]  
RTC KEY input can be used  
when KeyInt RTC mode  
d
d
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21  
 
LC823455  
Table 11. TERMINAL FUNCTIONS (continued)  
Terminal Name  
Polarity  
Direction  
Function  
Available(d)  
Multiplexed  
Function  
XA  
RA  
RB  
IO POWER  
RTC  
RTCMODE  
I
RTC mode input (Note 3)  
VddRTC  
d
d
Set General or KeyInt RTC  
mode  
RTCMODE =  
“0” : KeyInt RTC mode  
“1” : General RTC mode  
Bonded to “0” internally for “XA”  
VddRTC  
VssRTC  
P
P
RTC power supply  
RTC ground  
Sum  
d
d
d
d
8
d
d
d
d
11  
10  
EXTERNAL INTERRUPT/GPIO  
Vdd2  
Vdd2  
SDRADDR12  
GPIO2A  
O
B
I
SDRAM address  
GPIO  
d
d
d
d
EXTINT2A  
SCL1  
External Interrupt 2−bit10  
O
I2C ch1 Clock (open drain out-  
put )  
d
d
GPIO2B  
EXTINT2B  
SDA1  
B
I
GPIO  
d
d
d
d
d
d
d
d
d
External Interrupt 2−bit11  
Vdd2  
Vdd2  
B
I2C ch1 Data (open drain out-  
put )  
GPIO2C  
EXTINT2C  
SDRADDR11  
DMCKO0A  
GPIO2D  
B
I
GPIO  
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
External Interrupt 2−bit12  
SDRAM address  
Digital Mic Ch0 Clock A Output  
GPIO  
O
O
B
I
EXTINT2D  
EXTINT2E  
GPIO2E  
External Interrupt 2−bit13  
External Interrupt 2−bit14  
GPIO  
Vdd2  
Vdd2  
I
B
I
EXTINT2F  
GPIO2F  
External Interrupt 2−bit15  
GPIO  
B
* During Internal ROM boot,  
this terminal is used as the boot  
monitor signal.  
Sum  
5
6
5
SPI (SERIAL I/F CH0)  
SCK0  
Vdd2  
Vdd2  
Vdd2  
Neg  
B
B
I
Serial I/F Ch0 Clock  
GPIO  
d
d
d
d
d
d
d
d
d
3
d
d
d
d
d
d
d
d
d
3
d
d
d
d
d
d
d
d
d
3
GPIO1D  
EXTINT1D  
SDI0  
External Interrupt 1−bit13  
Serial I/F Ch0 Data Input  
GPIO  
I
GPIO1E  
B
I
EXTINT1E  
SDO0  
External Interrupt 1−bit14  
Serial I/F Ch0 Data Output  
GPIO  
O
B
I
GPIO1F  
EXTINT1F  
External Interrupt 1−bit15  
Sum  
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22  
LC823455  
Table 11. TERMINAL FUNCTIONS (continued)  
Terminal Name  
Polarity  
Direction  
Function  
Available(d)  
Multiplexed  
Function  
XA  
RA  
RB  
IO POWER  
S−FLASH I/F / SD I/F CH0 (Note 4)  
Vdd2  
SFCK  
Neg  
O
Serial Flash I/F Clock  
d
d
d
(QSPI Clock)  
GPIO0D  
EXTINT0D  
SDCLK0  
B
I
GPIO  
d
d
d
d
d
d
d
d
d
d
d
d
External Interrupt 0−bit13  
SD I/F Ch0 Clock Output  
O
Vdd2  
Vdd2  
Vdd2  
Vdd2  
SFDI(QIO0)  
I(B)  
Serial Flash I/F Data input  
(QSPI Data 0)  
GPIO0E  
EXTINT0E  
SDAT00  
B
I
GPIO  
d
d
d
d
d
d
d
d
d
d
d
d
External Interrupt 0−bit14  
SD I/F Ch0 Data0  
B
SFDO(QIO1)  
O(B)  
Serial Flash I/F Data output  
(QSPI Data 1)  
GPIO0F  
EXTINT0F  
SDAT01  
B
I
GPIO  
d
d
d
d
d
d
d
d
d
d
d
d
External Interrupt 0−bit15  
SD I/F Ch0 Data1  
B
SFWP(QIO2)  
Neg  
O(B)  
Serial Flash I/F write protect  
(QSPI Data 2)  
GPIO11  
EXTINT11  
B
I
GPIO  
d
d
d
d
d
d
d
d
d
d
d
d
External Interrupt 1−bit1  
SD I/F Ch0 Data2  
SDAT02  
B
SFHOLD(QIO3)  
Neg  
O(B)  
Serial Flash I/F hold  
(QSPI Data 3)  
GPIO12  
EXTINT12  
SDAT03  
B
I
GPIO  
d
d
d
5
d
d
d
5
d
d
d
5
External Interrupt 1−bit2  
SD I/F Ch0 Data3  
Sum  
B
I2C  
Vdd2  
Vdd2  
SCL0  
O
I2C ch0 Clock (open drain out-  
put )  
d
d
d
GPIO07  
EXTINT07  
SDA0  
B
I
GPIO  
d
d
d
d
d
d
d
d
d
External Interrupt 0−bit7  
B
I2C ch0 Data (open drain out-  
put )  
GPIO08  
B
I
GPIO  
d
d
2
d
d
2
d
d
2
EXTINT08  
External Interrupt 0−bit8  
Sum  
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23  
LC823455  
Table 11. TERMINAL FUNCTIONS (continued)  
Terminal Name  
Polarity  
Direction  
Function  
Available(d)  
Multiplexed  
Function  
XA  
RA  
RB  
IO POWER  
UART  
Vdd2  
TXD1  
SDAT20  
GPIO04  
EXTINT04  
RXD1  
O
B
B
I
UART Ch1 transmit Data  
SD I/F Ch2 Data 0  
GPIO  
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
External Interrupt 0−bit4  
UART Ch1 receive Data  
SD I/F Ch2 Data 1  
GPIO  
Vdd2  
Vdd2  
I
SDAT21  
GPIO05  
EXTINT05  
CTS1  
B
B
I
External Interrupt 0−bit5  
UART Ch1 clear to send  
SD I/F Ch2 Data 2  
UART Ch0 receive Data  
GPIO  
Neg  
I
SDAT22  
RXD0  
B
I
GPIO56  
EXTINT56  
RTS1  
B
I
External Interrupt 5−bit6  
UART Ch1 request to send  
SD I/F Ch2 Data 3  
UART Ch0 transmit Data  
GPIO  
Vdd2  
Vdd2  
Neg  
O
B
O
B
I
SDAT23  
TXD0  
GPIO57  
EXTINT57  
TXD2  
External Interrupt 5−bit7  
UART Ch2 transmit Data  
MTM1 Ch0A  
O
B
TIOCA10  
− target signal of pulse−length−  
reader function  
− output of sentinel−inform−  
function  
− output of PWM output  
GPIO0B  
EXTINT0B  
RXD2  
B
I
GPIO  
d
d
d
d
d
d
d
d
d
d
d
d
External Interrupt 0−bit11  
UART Ch2 receive Data  
Vdd2  
I
TIOCA11  
B
MTM1 Ch1A  
− target signal of pulse−length−  
reader  
function  
− output of sentinel−inform−  
function  
− output of PWM output  
GPIO0C  
B
I
GPIO  
d
d
6
d
d
6
d
d
6
EXTINT0C  
External Interrupt 0−bit12  
Sum  
TIMER  
Vdd2  
TIOCA00  
B
MTM0 Ch0A  
d
d
d
− target signal of pulse−length−  
reader  
function  
− output of sentinel−inform−  
function  
− output of PWM output  
SD I/F Ch2 Clock Output  
System Clock Output 0  
SDCLK2  
PHI0  
O
O
d
d
d
d
d
d
www.onsemi.com  
24  
LC823455  
Table 11. TERMINAL FUNCTIONS (continued)  
Terminal Name  
Polarity  
Direction  
Function  
Available(d)  
Multiplexed  
Function  
XA  
RA  
RB  
IO POWER  
TIMER  
GPIO09  
EXTINT09  
TIOCA01  
B
I
GPIO  
d
d
d
d
d
d
d
d
d
External Interrupt 0−bit9  
Vdd2  
B
MTM0 Ch1A  
− target signal of pulse−length−  
reader  
function  
− output of sentinel−inform−  
function  
− output of PWM output  
SD I/F Ch2 command line  
System Clock Output 1  
GPIO  
SDCMD2  
PHI1  
B
O
B
I
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
GPIO0A  
EXTINT0A  
TIOCB00  
External Interrupt 0−bit10  
Vdd2  
B
MTM0 Ch0B  
− target signal of pulse−length−  
reader  
function  
− output of sentinel−inform−  
function  
DIN1  
I
I
PCM1 Data Input  
Digital Mic Ch0 Data A Input  
GPIO  
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
DMDIN0A  
GPIO02  
B
I
EXTINT02  
TIOCB01  
External Interrupt 0−bit2  
Vdd2  
B
MTM0 Ch1B  
− target signal of pulse−length−  
reader  
function  
− output of sentinel−inform−  
function  
SFQSCS  
Neg  
O
Serial Flash I/F QSPI chip se-  
lect  
d
d
d
During Serial Flash Boot, this is  
used as chip select of Serial  
Flash  
GPIO03  
EXTINT03  
SDCMD0  
TCLKA0  
BCK1  
B
I
GPIO  
d
d
d
d
d
d
d
d
d
d
d
6
d
d
d
d
d
d
d
d
d
d
d
6
d
d
d
d
d
d
d
d
d
d
d
6
External Interrupt 0−bit3  
SD I/F Ch0 command line  
MTM0 external Clock A  
PCM1 bit Clock  
GPIO  
B
I
Vdd2  
Vdd2  
B
B
I
GPIO00  
EXTINT00  
TCLKB0  
LRCK1  
External Interrupt 0−bit0  
MTM0 external Clock B  
PCM1 LR Clock  
GPIO  
I
B
B
I
GPIO01  
EXTINT01  
External Interrupt 0−bit1  
Sum  
PCM I/F  
MCLK0  
MCLK1  
GPIO18  
Vdd2  
Pos  
Pos  
B
B
B
PCM0 maser Clock  
PCM1 master Clock  
GPIO  
d
d
d
d
d
d
d
d
d
www.onsemi.com  
25  
LC823455  
Table 11. TERMINAL FUNCTIONS (continued)  
Terminal Name  
Polarity  
Direction  
Function  
Available(d)  
Multiplexed  
Function  
XA  
RA  
RB  
IO POWER  
PCM I/F  
EXTINT18  
BCK0  
I
B
O
B
I
External Interrupt 1−bit8  
PCM0 bit Clock  
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
8
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
8
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
8
Vdd2  
DMCKO0B  
GPIO19  
EXTINT19  
LRCK0  
Digital Mic Ch0 Clock B Output  
GPIO  
External Interrupt 1−bit9  
PCM0 LR Clock  
Vdd2  
Vdd2  
Vdd2  
B
I
DMDIN0B  
GPIO1A  
EXTINT1A  
DIN0  
Digital Mic Ch0 Data B Input  
GPIO  
B
I
External Interrupt 1−bit10  
PCM0 Data Input  
Digital Mic Ch0 Data A Input  
GPIO  
I
DMDIN0A  
GPIO1B  
EXTINT1B  
DOUT0  
I
B
I
External Interrupt 1−bit11  
PCM0 Data Output  
Digital Mic Ch0 Clock A Output  
GPIO  
O
O
B
I
DMCKO0A  
GPIO1C  
EXTINT1C  
BCK1  
External Interrupt 1−bit12  
PCM1 bit Clock  
Vdd2  
Vdd2  
Vdd2  
B
B
I
GPIO13  
EXTINT13  
LRCK1  
GPIO  
External Interrupt 1−bit3  
PCM1 LR Clock  
B
B
I
GPIO14  
EXTINT14  
DOUT1  
GPIO  
External Interrupt 1−bit4  
PCM1 Data Output  
GPIO  
O
B
I
GPIO15  
EXTINT15  
External Interrupt 1−bit5  
Sum  
SD IF  
SDCLK0  
O
B
B
O
B
I
SD I/F Ch0 Clock Output  
SD I/F Ch0 command line  
SD I/F Ch0 Data  
SD I/F Ch1 Clock Output  
GPIO  
Vdd2  
Vdd2  
d
d
d
d
d
d
d
d
d
d
d
d
12  
d
d
d
d
d
d
d
d
d
d
d
d
12  
SDCMD0  
SDAT0[3:0]  
SDCLK1  
Vdd2  
VddSD1  
d
d
d
d
d
d
d
d
d
6
GPIO22  
EXTINT22  
SDCMD1  
GPIO23  
External Interrupt 2−bit2  
SD I/F Ch1 command line  
GPIO  
VddSD1  
VddSD1  
B
B
I
EXTINT23  
SDAT1[3:0]  
GPIO2[7:4]  
EXTINT2[7:4]  
External Interrupt 2−bit3  
SD I/F Ch1 Data  
GPIO  
B
B
I
External Interrupt 2−bit7 to bit4  
Sum  
www.onsemi.com  
26  
LC823455  
Table 11. TERMINAL FUNCTIONS (continued)  
Terminal Name  
Polarity  
Direction  
Function  
Available(d)  
Multiplexed  
Function  
XA  
RA  
RB  
IO POWER  
PSEUDO SRAM  
PSM_SCK  
Neg  
O
O
P−SRAM I/F Clock Output  
Vdd2  
Vdd2  
Vdd2  
d
d
d
PSM_CS  
P−SRAM I/F chip select Output  
PSM_SDI(DAT0)  
I(B)  
P−SRAM I/F Data input(QPI  
Data0)  
PSM_SDO(DAT1)  
O(B)  
P−SRAM I/F Data output(QPI  
Data1)  
Vdd2  
d
PSM_DAT2  
PSM_DAT3  
B
B
P−SRAM I/F QPI Data 2  
P−SRAM I/F QPI Data 3  
Sum  
Vdd2  
Vdd2  
d
d
6
0
0
SDRAM I/F  
SDRCLK  
SDRCKE  
SDRCS  
Neg  
Pos  
Neg  
Neg  
Neg  
Neg  
Pos  
O
O
O
O
O
O
O
SDRAM Clock Output  
Vdd2  
Vdd2  
Vdd2  
Vdd2  
Vdd2  
Vdd2  
Vdd2  
d
d
d
d
d
d
d
SDRAM Clock enable Output  
SDRAM chip select Output  
SDRAM write enable Output  
SDRAM CAS Output  
SDRWE  
SDRCAS  
SDRRAS  
SDRDQM[1:0]  
SDRAM RAS Output  
SDRAM Data mask byte lane  
select  
SDRADDR[10:0]  
SDRBA[1:0]  
O
O
B
SDRAM address (Note 5)  
SDRAM bank select  
SDRAM Data  
Vdd2  
Vdd2  
Vdd2  
d
d
SDRDATA[15:0]  
d
Sum  
0
37  
0
EXTERNAL MEMORY I/F  
Vdd2  
Vdd2  
NCS0  
GPIO06  
EXTINT06  
NCS1  
Neg  
O
B
I
chip select0  
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
−−  
Neg  
GPIO  
External Interrupt 0−bit6  
chip select1  
O
I
(Note 6)  
(Note 6)  
RXD0  
UART Ch0 receive Data  
GPIO  
d
d
GPIO10  
EXTINT10  
NRD  
B
I
d
d
External Interrupt 1−bit0  
read enable  
d
d
Vdd2  
Vdd2  
Neg  
O
B
I
(Note 6)  
(Note 6)  
GPIO17  
EXTINT17  
NWRENWRL  
DIN0  
GPIO  
d
d
External Interrupt 1−bit7  
write enable, write enable low  
PCM0 Data Input  
GPIO  
d
d
Neg  
O
I
(Note 6)  
(Note 6)  
d
d
GPIO30  
EXTINT30  
NHBNWRH  
B
I
d
d
d
d
External Interrupt 3−bit0  
Vdd2  
Neg  
O
high byte select, write enable  
high  
(Note 6)  
(Note 6)  
TXD0  
DOUT0  
O
O
B
I
UART Ch0 transmit Data  
PCM0 Data Output  
GPIO  
d
d
d
d
d
d
d
d
d
d
d
d
GPIO31  
EXTINT31  
External Interrupt 3−bit1  
www.onsemi.com  
27  
LC823455  
Table 11. TERMINAL FUNCTIONS (continued)  
Terminal Name  
Polarity  
Direction  
Function  
Available(d)  
Multiplexed  
Function  
XA  
RA  
RB  
IO POWER  
EXTERNAL MEMORY I/F  
NLBEXA0  
Vdd2  
O
B
I
low byte select, address0  
(Note 6)  
d
d
d
d
d
d
d
d
d
(Note 6)  
GPIO16  
GPIO  
d
d
d
d
EXTINT16  
External Interrupt 1−bit6  
Vdd2  
Vdd2  
EXA[20:15]  
O
B
I
address  
GPIO4[5:0]  
GPIO  
EXTINT4[5:0]  
EXA[14:9]  
External Interrupt 4−bit5 to bit0  
O
B
I
address  
GPIO  
GPIO3[F:A]  
EXTINT3[F:A]  
External Interrupt 3−bit15 to  
bit10  
Vdd2  
Vdd2  
EXA[8:5]  
GPIO3[9:6]  
EXTINT3[9:6]  
EXA4  
O
B
I
address  
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
GPIO  
External Interrupt 3−bit9 to bit6  
O
O
B
I
address  
DOUT1  
PCM1 Data Output  
GPIO35  
GPIO  
EXTINT35  
EXA3  
External Interrupt 3−bit5  
Vdd2  
O
I
address  
(Note 6)  
DIN1  
PCM1 Data Input  
d
d
d
GPIO34  
B
I
GPIO  
EXTINT34  
EXA[2:1]  
External Interrupt 3−bit4  
Vdd2  
Vdd2  
O
B
I
address  
GPIO3[3:2]  
EXTINT3[3:2]  
EXD[7:0]  
GPIO4[D:6]  
EXTINT4[D:6]  
GPIO  
External Interrupt 3−bit3 to bit2  
B
B
I
Data  
GPIO  
External Interrupt 4−bit13 to  
bit6  
Vdd2  
Vdd2  
EXD[15:10]  
GPIO5[5:0]  
EXTINT5[5:0]  
EXD[9:8]  
B
B
I
Data  
d
d
d
d
d
d
GPIO  
External Interrupt 5−bit5 to bit0  
B
B
I
Data  
GPIO4[F:E]  
EXTINT4[F:E]  
GPIO  
External Interrupt 4−bit15 to  
bit14  
Sum  
5
42  
6
XTAL, PLL  
XIN1  
I
XTAL input (XT1)  
VddXT1  
d
d
d
d
d
d
d
d
d
d
d
d
XOUT1  
VddXT1  
VssXT1  
O
P
P
XTAL output (XT1)  
XTAL power supply (XT1)  
XTAL ground (XT1)  
VddXT1  
www.onsemi.com  
28  
LC823455  
Table 11. TERMINAL FUNCTIONS (continued)  
Terminal Name  
Polarity  
Direction  
Function  
Available(d)  
Multiplexed  
Function  
XA  
RA  
RB  
IO POWER  
XTAL, PLL  
XTALINFO[1: 0]  
B
XTALINFO[1: 0] =  
Vdd2  
d
“00” : 24MHz  
“01” : 12MHz  
“10” : 19.2MHz  
“11” : reserved  
Used for determining clock fre-  
quency setting during internal  
ROM boot.  
Bonding “00” internally for XA.  
VCNT1  
AVddPLL1  
AVssPLL1  
VCNT2  
O
P
P
O
P
P
PLL1 VCO control  
AVddPLL1  
d
d
PLL1 analog power supply  
PLL1 analog power ground  
PLL2 VCO control  
d
d
d
d
d
AVddPLL2  
d
AVddPLL2  
AVssPLL2  
PLL2 analog power supply  
PLL2 analog power ground  
Sum  
d
d
8
d
d
d
8
d
12  
USB−PHY  
USBDP  
B
B
B
I
USB D+  
AVddUSBPHY2  
AVddUSBPHY2  
AVddUSBPHY18  
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
USBDM  
USB D−  
USBEXT02  
USBVBUS  
USBID  
USB reference resistor  
USB 5V VBUS detection  
USB identifier  
B
P
AVddUSBPHY18  
DVddUSBPHY1  
USB−PHY 1.0V digital power  
supply  
AVddUSBPHY2  
AVddUSBPHY18  
AVssUSBPHY  
P
P
P
USB−PHY 3.3V analog power  
supply  
d
d
d
d
d
d
USB−PHY 1.8V analog power  
supply  
USB−PHY ground  
d
d
d
2
2
2
Sum  
10  
10  
10  
12 BIT ADC  
SIN[7: 3]  
I
ADC input ch7−3  
ADC input ch2−0  
ADC analog power supply  
ADC analog power ground  
Sum  
AVddADC  
d
d
d
d
SIN[2: 0]  
I
AVddADC  
d
d
d
5
AVddADC  
AVssADC  
P
P
d
d
d
d
10  
10  
CLASS−D AMP  
LOUT  
AVddDAMPL  
AVddDAMPR  
O
O
O
O
P
Lch Class D AMP Output  
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
GPLOUT  
ROUT  
General purpose Output (GPO)  
Rch Class D AMP Output  
GPROUT  
AVddDAMPL  
General purpose Output (GPO)  
Lch Class D AMP analog power  
supply  
AVddDAMPR  
P
Rch Class D AMP analog  
power supply  
d
d
d
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29  
LC823455  
Table 11. TERMINAL FUNCTIONS (continued)  
Terminal Name  
Polarity  
Direction  
Function  
Available(d)  
Multiplexed  
Function  
XA  
RA  
RB  
IO POWER  
CLASS−D AMP  
AVssDAMPL  
P
P
Lch Class D AMP analog power  
ground  
d
d
6
d
d
6
d
d
6
AVssDAMPR  
Rch Class D AMP analog  
power ground  
Sum  
OTHER, POWER  
BMODE[1: 0]  
TEST  
B
I
Boot mode select  
Vdd2  
d
d
d
d
d
d
Pos  
test mode  
VddRTC  
Connect to ground.  
NRES  
IO18V  
Neg  
I
I
SoC reset input  
Vdd2  
Vdd1  
d
d
d
d
d
d
1.8 V IO range select for I/O of  
Vdd2  
0” : 3.3 V IO operation  
“1” : 1.8 V IO operation  
When setting “1”, don’t supply  
any voltage over the 1.8 V volt-  
age range to Vdd2.  
Vdd1  
Vdd2  
P
P
P
P
P
Digital core power supply  
d
d
d
6
7
6
Digital IO power supply  
d
d
d
6
15  
7
VddSD1  
Vss1  
Digital IO power supply(SDI/F  
ch1)  
d
d
d
1
1
1
Digital core power ground  
d
d
d
6
9
6
Vss2  
Digital IO power ground  
d
d
d
7
15  
8
Sum  
31  
52  
33  
All Sum  
120  
240  
136  
3. Set according to the General RTC mode or KeyInt RTC mode.  
4. S−Flash I/F / SD I/F Ch0 includes SFQSCS / SDCMD0 in Timer.  
5. SDRAM address bit is 13 bit including SDRADDR [12:11].  
6. This function is not available.  
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30  
LC823455  
Signals Handled by Pin Multiplex Function  
The pin multiplex function can be used to assign  
low−speed signals to any of GPIOs. The table below shows  
the signal functions that can be multiplexed and the GPIOs  
that can be assigned.  
Table 12. PIN MULTIPLEX FUNCTIONS  
Number  
Module name  
Signal name  
Function  
Assigned GPIO  
GPIO00 to 0F  
0
I2C0  
SCL0  
SDA0  
SCL1  
SDA1  
SCK0  
SDI0  
I2C ch0 Clock  
I2C ch0 Data  
I2C ch1 Clock  
I2C ch1 Data  
GPIO10 to 1F  
GPIO20 to 2F  
GPIO30 to 3F  
GPIO40 to 4F  
GPIO50 to 59  
1
2
I2C1  
SPI0  
3
4
Serial I/F Ch0 Clock  
Serial I/F Ch0 Data Input  
Serial I/F Ch0 Data Output  
Serial I/F Ch1 Clock  
Serial I/F Ch1 Data Input  
Serial I/F Ch1 Data Output  
MTM0 external Clock A  
MTM0 external Clock B  
MTM0 Ch0A  
5
6
SDO0  
SCK1  
SDI1  
7
SPI1  
8
9
SDO1  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
MTM0  
TCLKA0  
TCLKB0  
TIOCA00  
TIOCA01  
TIOCB00  
TIOCB01  
TCLKA1  
TCLKB1  
TIOCA10  
TIOCA11  
TIOCB10  
TIOCB11  
RXD0  
MTM0 Ch1A  
MTM0 Ch0B  
MTM0 Ch1B  
MTM1  
MTM1 external Clock A  
MTM1 external Clock B  
MTM1 Ch0A  
MTM1 Ch1A  
MTM1 Ch0B  
MTM1 Ch1B  
UART0  
UART1  
UART Ch0 receive Data  
UART Ch0 transmit Data  
UART Ch1 receive Data  
UART Ch1 transmit Data  
UART Ch1 clear to send  
UART Ch1 request to send  
UART Ch2 receive Data  
UART Ch2 transmit Data  
UART Ch2 clear to send  
UART Ch2 request to send  
Digital Mic Ch0 Clock Output  
Digital Mic Ch0 Data Input  
Digital Mic Ch1 Clock Output  
Digital Mic Ch1 Data Input  
Power control for WIC Sleep  
Reserved  
TXD0  
RXD1  
TXD1  
CTS1  
RTS1  
UART2  
RXD2  
TXD2  
CTS2  
RTS2  
DMIC0  
DMIC1  
DMCKO0  
DMDIN0  
DMCKO1  
DMDIN1  
WICPOWERDOWN  
Reserved  
OSC  
Reserved  
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31  
LC823455  
Boot Mode  
The available boot modes are determined by the values on  
the BMODE[1:0] terminal.  
Table 13. BOOT MODE  
IPL mode  
BMODE1  
BMODE0  
Explanation  
Physical  
Boot  
PD  
PD  
Internal ROM boot (EMMC Physical Boot with USB download)  
(SD card I/F Ch0 + USB Device + EXTINT2F)  
470 kꢀ  
470 kꢀ  
USB  
IPL2 is transferred to boot partition1 area of eMMC via USB from PC.  
Using Boot operation mode of eMMC, IPL2(program) is copied to internal SRAM  
from boot partition1 area of eMMC connected to SDCH0 and is executed.  
XT1 must be connected in this mode to boot the ROM.  
The connection of XTRTC is arbitrary.  
Physical  
Boot  
PD  
PU  
Internal ROM boot (EMMC Physical Boot with SD Ch1 download)  
(SD card I/F Ch0 + SD card I/F Ch1 + EXTINT2F)  
470 kꢀ  
470 kꢀ  
SD  
IPL2 is transferred to boot partition1 area of eMMC from SDCH1.  
Using Boot operation mode of eMMC, IPL2(program) is copied to internal SRAM  
from boot partition1 area of eMMC connected to SDCH0 and is executed.  
Either XT1 or XTRTC is required to boot the ROM.  
User Area  
Boot  
PD  
PU or PD  
Internal ROM boot (User Area Boot with USB download)  
(SD card I/F Ch0 + USB Device + EXTINT2F)  
1 kꢀ  
470 kꢀ  
USB  
IPL2 is transferred to user area of eMMC via USB from PC.  
IPL2(program) is copied to internal SRAM from user area of eMMC connected to  
SDCH0 and is executed.  
XT1 must be connected in this mode to boot the ROM.  
The connection of XTRTC is arbitrary.  
User Area  
Boot  
PU  
PD  
Internal ROM boot (User Area Boot with SD Ch1 download)  
(SD card I/F Ch0 + SD card I/F Ch1 + EXTINT2F)  
470 kꢀ  
1 kꢀ  
SD  
IPL2 is transferred to user area of eMMC from SDCH1.  
IPL2(program) is copied to internal SRAM from user area of eMMC connected to  
SDCH0 and is executed.  
Either XT1 or XTRTC is required to boot the ROM.  
SPI Boot  
USB  
PU  
PU  
Internal ROM boot (External Serial Flash SPI Boot with USB download)  
(S−FLASH I/F + USB Device + EXTINT2F )  
470 kꢀ  
470 kꢀ  
IPL2 is transferred to user area of S−FLASH via USB from PC.  
IPL2(program) is copied to internal SRAM from user area of S−FLASH and is  
executed.  
XT1 must be connected in this mode to boot the ROM.  
The connection of XTRTC is arbitrary.  
SPI Boot  
SD  
PD  
PU  
Internal ROM boot (External Serial Flash SPI Boot with SD Ch1 download)  
(S−FLASH I/F + SDcard I/F Ch1 + EXTINT2F)  
470 kꢀ  
1 kꢀ  
IPL2 is transferred to user area of S−FLASH from SDCH1.  
IPL2(program) is copied to internal SRAM from user area of S−FLASH and is  
executed.  
Either XT1 or XTRTC is required to boot the ROM.  
QSPI Boot  
USB  
PU  
PU  
Internal ROM boot  
1 kꢀ  
470 kꢀ  
(External Serial Flash QSPI Boot with USB download)  
(S−Flash I/F(QSPI) + USB Device + EXTINT2F)  
The IPL supports the direct write of the program using the DD command from USB.  
In this mode, the CPU fetches Serial Flash connected to S/Flash IF directly.  
XT1 must be connected in this mode to boot the ROM.  
The connection of XTRTC is arbitrary.  
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32  
 
LC823455  
Table 13. BOOT MODE (continued)  
IPL mode  
BMODE1  
BMODE0  
Explanation  
QSPI Boot  
SD  
PU  
PD  
Internal ROM boot  
1 kꢀ  
470 kꢀ  
(External Serial Flash QSPI Boot with SD Ch1 download)  
(S−Flash I/F(QSPI) + SD card I/F Ch1 + EXTINT2F)  
IPL2 is transferred to S−FLASH from SDCH1.  
In this mode, the CPU fetches from Serial Flash connected to S/Flash IF directly.  
Either XT1 or XTRTC is required to boot the ROM.  
User Area  
Delete  
PD  
PU  
Internal ROM boot (User Area IPL2 deletion)  
( SD card I/F Ch0 + EXTINT2F)  
1 kꢀ  
1 kꢀ  
It comes to be able to write IPL2 again at User Area Boot.  
Either XT1 or XTRTC is necessary to boot the ROM.  
Partition  
Delete  
PD  
PD  
Internal ROM boot (Partition Area IPL2 deletion)  
(SD card I/F Ch0 + EXTINT2F)  
470 kꢀ  
1 kꢀ  
It comes to be able to write IPL2 again at eMMC Physical Boot.  
Either XT1 or XTRTC is necessary to boot the ROM.  
SPI All  
Erase  
PU  
PU  
Internal ROM boot (All external Serial Flash SPI area deletion)  
( S−Flash I/F, + EXTINT2F )  
470 kꢀ  
1 kꢀ  
All of Serial Flash is deleted.  
Please select it when you use Serial Flash with SPI.  
Either XT1 or XTRTC is required to boot the ROM.  
SDCH0 All  
Erase  
PD  
PD  
Internal ROM boot (All area deletion )  
(SD card I/F Ch0 + EXTINT2F)  
1 kꢀ  
1 kꢀ  
All of eMMC is deleted. The partition area is also erased, which takes time. When  
eMMC corresponds to Trim, Trim is done.  
Either XT1 or XTRTC is required to boot the ROM.  
QSPI All  
Erase  
PU  
PD  
Internal ROM boot (All external Serial Flash QSPI area deletion)  
(S−Flash I/F(QSPI) + EXTINT2F)  
1 kꢀ  
1 kꢀ  
All of Serial Flash is deleted.  
Please use it when you use Serial Flash in the fetch mode of QSPI.  
Either XT1 or XTRTC is required to boot the ROM.  
External  
PU  
PD  
External memory boot (External−0)  
ROM Boot  
470 kꢀ  
470 kꢀ  
In this mode, the CPU fetches external memory connected by the external memory  
controller of External0 directly.  
Either XT1 or XTRTC is required to boot the ROM.  
Hi−z  
PU  
PU  
External memory I/F terminal are Hiz  
EXA[20:1], EXD[15:0], NCS[1:0], NRD, NWRENWRL, NHBNWRH, NLBEXA0  
SD card I/F Ch0 terminal are Hiz  
1 kꢀ  
1 kꢀ  
SDCLK0, SDCMD0, SDAT0[3:0]  
S−Flash(QSPI) terminal are Hiz  
SFQSCS, SFCK, SFDI(QIO0), SFDO(QIO1), SFWP(QIO2), SFHOLD(QIO3)  
Either XT1 or XTRTC is required to boot the ROM.  
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33  
LC823455  
Boot Port  
The ports used while booting are described below.  
SPI Boot / SPI All Erase uses only SFCK, SFDO, SFDI  
and SFQSCS switched from TIOCB01. SFHOLD and  
SFWP (The function is different according to the  
device) are not used  
There is no dedicated SDCH0 pin in the WLP package.  
Therefore, when booting from eMMC, the terminals  
SFCK, SFQSCS, SFDO, SFDI, SFWP, and SFHOLD  
must be switched to SDCLK0, SDCMD0, SDAT00,  
SDAT01, SDAT02, and SDAT03. The target is Physical  
Boot USB · Physical Boot SD · User Area Boot USB ·  
User Area Boot SD · User Area Delete, Partition  
Delete, SDCH 0 All Erase  
QSPI Boot / QSPI All Erase uses SFCK, SFDO, SFDI,  
SFHOLD, SFWP and SFQSCS switched from  
TIOCB01  
External ROM boot uses NCS0 and other terminals  
required by the external memory controller. It is  
available to packages in which the terminals of external  
memory controller are assigned.  
SD Card SDCH1 uses only CMD, DATA, and CLK.  
The terminals CD and WP are not used. These three  
terminals are controlled only when writing IPL2 from  
SDCH1  
Table 14. GPIOs USED DURING IPL  
(RA and RB are under planning.)  
SDCH0  
Shared (for XA)  
P2F(error notification)  
Dedicated (for RA)  
Dedicated (for RB)  
IPL mode  
Physical Boot USB  
P2F(error notification)  
P0D(SDCLK0), P0E(SDAT00), P0F(SDAT01),  
P11(SDAT02), P12(SDAT03), P03(SCMD0)  
Physical Boot SD  
P2F(error notification),  
P2F(error notification),  
P22(SDCLK1), P23(SDCMD1), P24(SDDATA10),  
P25(SDDATA11), P26(SDDATA12),  
P27(SDDATA13), P0D(SDCLK0), P0E(SDAT00),  
P0F(SDAT01), P11(SDAT02), P12(SDAT03)  
P03(SCMD0)  
P22(SDCLK1), P23(SDCMD1),  
P24(SDDATA10), P25(SDDATA11),  
P26(SDDATA12), P27(SDDATA13)  
User Area Boot USB  
User Area Boot SD  
P2F(error notification),  
P2F(error notification)  
P0D(SDCLK0), P0E(SDAT00), P0F(SDAT01),  
P11(SDAT02), P12(SDAT03), P03(SCMD0)  
P2F(error notification)  
P2F(error notification),  
P0D(SDCLK0), P0E(SDAT00), P0F(SDAT01),  
P11(SDAT02), P12(SDAT03), P03(SCMD0),  
P22(SDCLK1), P23(SDCMD1), P24(SDDATA10),  
P25(SDDATA11),  
P22(SDCLK1), P23(SDCMD1),  
P24(SDDATA10), P25(SDDATA11),  
P26(SDDATA12), P27(SDDATA13)  
P26(SDDATA12), P27(SDDATA13)  
SPI Boot USB  
SPI Boot SD  
P2F(error notification)  
P2F(error notification),  
P0D(SFCK), P03(SFQSCS), P0F(SFDO),  
P0E(SFDI)  
P0D(SFCK), P03(SFQSCS), P0F(SFDO), P0E(SFDI)  
P2F(error notification),  
P2F(error notification),  
P0D(SFCK), P03(SFQSCS) P0F(SFDO),  
P0E(SFDI), P22(SDCLK1), P23(SDCMD1),  
P24(SDDATA10), P25(SDDATA11),  
P26(SDDATA12), P27(SDDATA13)  
P0D(SFCK), P03(SFQSCS) P0F(SFDO), P0E(SFDI),  
P22(SDCLK1), P23(SDCMD1), P24(SDDATA10),  
P25(SDDATA11),  
P26(SDDATA12), P27(SDDATA13)  
QSPI Boot USB  
QSPI Boot SD  
P2F(error notification),  
P2F(error notification),  
P0D(SFCK), P03(SFQSCS), P0F(SFDO),  
P0E(SFDI), P11(SFWP), P12(SFHOLD)  
P0D(SFCK), P03(SFQSCS), P0F(SFDO), P0E(SFDI),  
P11(SFWP), P12(SFHOLD)  
P2F(error notification)  
P2F(error notification)  
P0D(SFCK), P03(SFQSCS), P0F(SFDO),  
P0E(SFDI), P011(SFWP), P12(SFHOLD),  
P22(SDCLK1), P23(SDCMD1), P24(SDDATA10),  
P25(SDDATA11), P26(SDDATA12),  
P27(SDDATA13)  
P0D(SFCK), P03(SFQSCS), P0F(SFDO), P0E(SFDI),  
P011(SFWP), P12(SFHOLD), P22(SDCLK1), P23(SD-  
CMD1),  
P24(SDDATA10), P25(SDDATA11),  
P26(SDDATA12), P27(SDDATA13)  
UserArea Delete  
P2F(error notification),  
P2F(error notification)  
P0D(SDCLK0), P0E(SDAT00), P0F(SDAT01),  
P11(SDAT02), P12(SDAT03), P03(SCMD0)  
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34  
 
LC823455  
Table 14. GPIOs USED DURING IPL (continued)  
(RA and RB are under planning.)  
SDCH0  
Dedicated (for RA)  
Shared (for XA)  
P2F(error notification),  
Dedicated (for RB)  
IPL mode  
Partition Delete  
P2F(error notification)  
P0D(SDCLK0), P0E(SDAT00), P0F(SDAT01),  
P11(SDAT02), P12(SDAT03), P03(SCMD0)  
SPI Erase  
P2F(error notification),  
P2F(error notification),  
P0D(SFCK), P03(SFQSCS), P0F(SPIOUT),  
P0E(SFDI)  
P0D(SFCK), P03(SFQSCS), P0F(SPIOUT), P0E(SFDI)  
P2F(error notification)  
SDCH0 All Erase  
QSPI All Erase  
External ROM Boot  
P2F(error notification),  
P0D(SDCLK0), P0E(SDAT00), P0F(SDAT01),  
P11(SDAT02), P12(SDAT03), P03(SCMD0)  
P2F(error notification),  
P2F(error notification),  
P0D(SFCK), P03(SFQSCS), P0F(SFDO),  
P0E(SFDI), P11(SFWP), P12(SFHOLD)  
P0D(SFCK), P03(SFQSCS), P0F(SFDO), P0E(SFDI),  
P11(SFWP), P12(SFHOLD)  
N/A  
P06(NCS0), P17(NRD),  
P30(NWRENWRL)  
N/A  
P31(NHBNWRH),  
P16(NLBEXA0),  
P32(EXA01), P33(EXA02),  
P34(EXA03), P35(EXA06),  
P36(EXA05), P37(EXA06),  
P38(EXA07), P39(EXA08),  
P3A(EXA09), P3B(EXA10),  
P3C(EXA11), P3D(EXA12),  
P3E(EXA13), P3F(EXA14),  
P40(EXA15), P41(EXA16),  
P42(EXA17), P43(EXA18),  
P44(EXA19), P45(EXA20),  
P46(EXD00), P47(EXD01),  
P48(EXD02), P49(EXD03),  
P4A(EXD04), P4B(EXD05),  
P4C(EXD06), P4D(EXD07),  
P4E(EXD08), P4F(EXD09),  
P50(EXD10), P51(EXD11),  
P52(EXD12), P53(EXD13),  
P54(EXD14), P55(EXD15)  
HI−z  
SDCLK0 is set to the Hi−z input.  
7. In this table, “Pxx” means “GPIOxx”. For example “P2F” means “GPIO2F”.  
SDIF PullUp  
If using the SDIF port during boot mode, internal PullUp  
resistors are used (SDCMD0, SDAT0[3:0] / SDCMD1,  
SDAT1[3:0]). Therefore, external PullUp resistors are not  
required on the board.  
termination of USB connection, as well as error notification  
with High/Low of the terminal.  
When errors occur during boot sequences, for example  
writing of IPL2, GPIO2F reports the sort of error. Moreover,  
GPIO2F can indicate the status of USB connection and the  
completion of USB file transfer. Additionally, Delete Mode,  
completion of Erase, and status of Erase can also be reported  
through a sequence of Low/High.  
For more detail about the behavior of this port used during  
boot, refer to the “IPL detail” chapter in the “LC823455  
Sample Software Reference”.  
SFQSCS PullUp  
If using SFQSCS during boot mode, the initial condition  
for terminal P03 relative to SFQSCS is Pull−Up. After  
terminal P03 is switched to SFQSCS, the Pull−Up is  
released.  
GPIO2F  
During boot mode, GPIO2F provides notification of the  
beginning of USB connection, notification of the  
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35  
LC823455  
PIN ASSIGNMENT  
Table 15. PIN ASSIGNMENT  
I/O  
I
Input  
Output  
O
B
P
G
Bidirectional  
Power  
Ground  
XA: Package Code = “XA”, RA: Package Code = “RA”, RB: Package Code = “RB”, (RA and RB are under planning).  
Table 16.  
RA  
RB  
XA  
BGA240  
BGA136  
WLP120  
Input  
Type  
Output  
Type  
IO  
Pwr Grp  
IO  
No.  
Ball  
M13  
N14  
M12  
No.  
Ball  
No.  
Ball  
Circuit Type  
PIN NAME  
Vdd2  
I/O  
P
Drive  
PU/PD  
1
2
3
Vss2  
G
EXD0/  
GPIO46/  
EXTINT46  
B/  
B/  
I
Schmitt  
Schmitt  
Schmitt  
Schmitt  
Schmitt  
Schmitt  
3−State  
3−State  
3−State  
3−State  
3−State  
3−State  
2/4/8 mA  
2/4/8 mA  
2/4/8 mA  
2/4/8 mA  
2/4/8 mA  
2/4/8 mA  
PD  
PD  
PD  
PD  
PD  
PD  
Vdd2  
Vdd2  
Vdd2  
Vdd2  
Vdd2  
Vdd2  
3ISD/3T2  
(4)(8)  
4
5
6
7
8
M14  
L13  
L14  
K11  
K13  
EXA1/  
GPIO32/  
EXTINT32  
O/  
B/  
I
3ISD/3T2  
(4)(8)  
EXA11/  
GPIO3C/  
EXTINT3C  
O/  
B/  
I
3ISD/3T2  
(4)(8)  
EXA12/  
GPIO3D/  
EXTINT3D  
O/  
B/  
I
3ISD/3T2  
(4)(8)  
EXA13/  
GPIO3E/  
EXTINT3E  
O/  
B/  
I
3ISD/3T2  
(4)(8)  
EXA14/  
GPIO3F/  
EXTINT3F  
O/  
B/  
I
3ISD/3T2  
(4)(8)  
9
R15  
R16  
1
2
R15  
R16  
1
2
L10  
H8  
Vdd1  
P
10  
NRD/  
GPIO17/  
EXTINT17  
O/  
B/  
I
Schmitt  
Schmitt  
3−State  
3−State  
2/4/8 mA  
2 mA  
PD  
PU  
Vdd2  
Vdd2  
3ISD/3T2  
(4)(8)  
11  
P15  
3
P15  
3
K9  
SWDIO/  
DMDIN0B/  
GPIO59/  
B/  
I/  
B/  
I
3ISU/3T2  
EXTINT59  
12  
13  
14  
P16  
K14  
J10  
4
P16  
4
G7  
NLBEXA0/  
GPIO16/  
EXTINT16  
O/  
B/  
I
Schmitt  
Schmitt  
Schmitt  
3−State  
3−State  
3−State  
2/4/8 mA  
2/4/8 mA  
2/4/8 mA  
PD  
PD  
PD  
Vdd2  
Vdd2  
Vdd2  
3ISD/3T2  
(4)(8)  
EXD2/  
GPIO48/  
EXTINT48  
B/  
B/  
I
3ISD/3T2  
(4)(8)  
EXA2/  
GPIO33/  
EXTINT33  
O/  
B/  
I
3ISD/3T2  
(4)(8)  
15  
16  
N15  
J11  
5
N15  
5
L9  
Vss2  
G
EXA6/  
GPIO37/  
EXTINT37  
O/  
B/  
I
Schmitt  
Schmitt  
Schmitt  
3−State  
3−State  
3−State  
2/4/8 mA  
2/4/8 mA  
2/4/8 mA  
PD  
PD  
Vdd2  
Vdd2  
Vdd2  
3ISD/3T2  
(4)(8)  
17  
18  
J13  
J14  
EXA7/  
GPIO38/  
EXTINT38  
O/  
B/  
I
3ISD/3T2  
(4)(8)  
SDRADDR12/  
GPIO2A/  
EXTINT2A  
O/  
B/  
I
PU/PD  
3ISUD/3T2  
(4)(8)  
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36  
 
LC823455  
Table 16. (continued)  
RA  
RB  
XA  
BGA240  
BGA136  
WLP120  
Input  
Type  
Output  
Type  
IO  
Pwr Grp  
IO  
No.  
Ball  
No.  
Ball  
No.  
Ball  
Circuit Type  
PIN NAME  
I/O  
Drive  
PU/PD  
19  
20  
N16  
6
7
N16  
6
J8  
TDI/  
SDCD1/  
SWO/  
GPIO20/  
EXTINT20  
I/  
I/  
O/  
B/  
I
Schmitt  
3−State  
2 mA  
PU/PD  
VddSD1  
3ISUD/3T2  
M15  
M15  
7
K8  
TDO/  
O/  
I/  
B/  
I
Schmitt  
3−State  
2 mA  
PU/PD  
VddSD1  
3ISUD/3T2  
SDWP1/  
GPIO21/  
EXTINT21  
21  
22  
M16  
L15  
8
9
M16  
L15  
8
9
L8  
VddSD1  
P
H7  
SDCMD1/  
GPIO23/  
EXTINT23  
B/  
B/  
I
CMOS  
CMOS  
CMOS  
3−State  
3−State  
3−State  
2/4/8/10  
mA  
PU/PD  
PU/PD  
PU/PD  
VddSD1  
VddSD1  
VddSD1  
3ICUD/3T2  
(4)(8)(10)  
23  
24  
L16  
K12  
10  
11  
L16  
K12  
10  
11  
J7  
SDAT10/  
GPIO24/  
EXTINT24  
B/  
B/  
I
2/4/8/10mA  
2/4/8/10mA  
3ICUD/3T2  
(4)(8)(10)  
K7  
SDAT11/  
GPIO25/  
EXTINT25  
B/  
B/  
I
3ICUD/3T2  
(4)(8)(10)  
25  
26  
J15  
12  
13  
J15  
12  
13  
L7  
F5  
Vss2  
G
K16  
K16  
SDAT12/  
GPIO26/  
EXTINT26  
B/  
B/  
I
CMOS  
CMOS  
CMOS  
3−State  
3−State  
3−State  
2/4/8/10mA  
2/4/8/10mA  
2/4/8/10mA  
PU/PD  
PU/PD  
PU/PD  
VddSD1  
VddSD1  
VddSD1  
3ICUD/3T2  
(4)(8)(10)  
27  
28  
J12  
14  
15  
J12  
14  
15  
G6  
H6  
SDAT13/  
GPIO27/  
EXTINT27  
B/  
B/  
I
3ICUD/3T2  
(4)(8)(10)  
K15  
K15  
SDCLK1/  
GPIO22/  
EXTINT22  
O/  
B/  
I
3ICUD/3T2  
(4)(8)(10)  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
J16  
H12  
H15  
H16  
G15  
G16  
H13  
F15  
F16  
E16  
16  
17  
18  
19  
20  
21  
J16  
H12  
H15  
H16  
G15  
G16  
16  
L6  
Vss1  
RTCMODE  
VddRTC  
XIN32K  
G
I
CMOS  
X
VddRTC  
VddRTC  
1IC  
X
17  
18  
19  
20  
K6  
J5  
K5  
L5  
P
I
VssRTC  
XOUT32K  
Keyint2  
G
O
I
X
PD  
VddRTC  
VddRTC  
VddRTC  
VddRTC  
VddRTC  
X
CMOS  
CMOS  
CMOS  
1ICD  
1IC  
22  
23  
24  
F15  
F16  
E16  
BACKUPB  
VDET  
I
21  
22  
J6  
H5  
I
1IC  
RTCINT (Note  
8)  
O
OD  
0.3 mA−OD  
OD3  
39  
40  
41  
42  
43  
44  
45  
46  
47  
48  
49  
50  
51  
G12  
E15  
F12  
D15  
D14  
D16  
C15  
C14  
C16  
E13  
E14  
D13  
H10  
25  
26  
27  
28  
G12  
E15  
F12  
D15  
23  
24  
25  
26  
G5  
H4  
L4  
K4  
Keyint0  
TEST  
I
CMOS  
CMOS  
CMOS  
PD  
VddRTC  
VddRTC  
VddRTC  
1ICD  
1IC  
I
Keyint1  
AVddPLL1  
VCNT1  
AVssPLL1  
AVddPLL2  
VCNT2  
AVssPLL2  
Vss1  
I
PD  
1ICD  
P
O
G
P
O
G
G
P
G
1A  
1A  
AVddPLL1  
AVddPLL2  
1A  
1A  
29  
30  
D16  
C15  
27  
28  
J4  
K3  
31  
C16  
29  
L3  
Vdd2  
Vss2  
EXD4/  
GPIO4A/  
EXTINT4A  
B/  
B/  
I
Schmitt  
Schmitt  
3−State  
3−State  
2/4/8 mA  
2/4/8 mA  
PD  
PD  
Vdd2  
Vdd2  
3ISD/3T2  
(4)(8)  
52  
H11  
EXD5/  
GPIO4B/  
EXTINT4B  
B/  
B/  
I
3ISD/3T2  
(4)(8)  
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37  
LC823455  
Table 16. (continued)  
RA  
RB  
XA  
BGA240  
BGA136  
WLP120  
Input  
Type  
Output  
Type  
IO  
Pwr Grp  
IO  
No.  
Ball  
B15  
H14  
No.  
Ball  
B15  
No.  
Ball  
L2  
Circuit Type  
PIN NAME  
I/O  
Drive  
PU/PD  
PD  
53  
54  
32  
30  
Vdd1  
P
EXD6/  
GPIO4C/  
EXTINT4C  
B/  
B/  
I
Schmitt  
Schmitt  
Schmitt  
Schmitt  
Schmitt  
3−State  
3−State  
3−State  
3−State  
3−State  
2/4/8 mA  
2/4/8 mA  
2/4/8 mA  
2/4/8 mA  
2/4/8 mA  
Vdd2  
Vdd2  
Vdd2  
Vdd2  
Vdd2  
3ISD/3T2  
(4)(8)  
55  
56  
57  
58  
G10  
G11  
G13  
G14  
EXA19/  
GPIO44/  
EXTINT44  
O/  
B/  
I
PD  
3ISD/3T2  
(4)(8)  
EXA20/  
GPIO45/  
EXTINT45  
O/  
B/  
I
PD  
3ISD/3T2  
(4)(8)  
EXD7/  
GPIO4D/  
EXTINT4D  
B/  
B/  
I
PD  
3ISD/3T2  
(4)(8)  
EXD8/  
GPIO4E/  
EXTINT4E  
B/  
B/  
I
PD  
3ISD/3T2  
(4)(8)  
59  
60  
B14  
F14  
33  
B14  
31  
L1  
Vss1  
G
EXD11/  
GPIO51/  
EXTINT51  
B/  
B/  
I
Schmitt  
Schmitt  
Schmitt  
Schmitt  
3−State  
3−State  
3−State  
3−State  
2/4/8 mA  
2/4/8 mA  
2/4/8 mA  
2/4/8 mA  
PD  
PD  
PD  
PD  
Vdd2  
Vdd2  
Vdd2  
Vdd2  
3ISD/3T2  
(4)(8)  
61  
62  
63  
F13  
D12  
F11  
EXD12/  
GPIO52/  
EXTINT52  
B/  
B/  
I
3ISD/3T2  
(4)(8)  
EXD13/  
GPIO53/  
EXTINT53  
B/  
B/  
I
3ISD/3T2  
(4)(8)  
EXD14/  
GPIO54/  
EXTINT54  
B/  
B/  
I
3ISD/3T2  
(4)(8)  
64  
65  
C13  
A16  
Vss2  
G
34  
A16  
32  
K2  
DOUT1/  
GPIO15/  
EXTINT15  
O/  
B/  
I
Schmitt  
Schmitt  
Schmitt  
3−State  
3−State  
3−State  
2/4/8 mA  
2/4/8 mA  
2/4/8 mA  
PU/PD  
PD  
Vdd2  
Vdd2  
Vdd2  
3ISUD/3T2  
(4)(8)  
66  
67  
D11  
F10  
EXD9/  
GPIO4F/  
EXTINT4F  
B/  
B/  
I
3ISD/3T2  
(4)(8)  
EXD10/  
GPIO50/  
EXTINT50  
B/  
B/  
I
PD  
3ISD/3T2  
(4)(8)  
68  
69  
B16  
D10  
35  
B16  
33  
K1  
Vdd2  
P
EXD15/  
GPIO55/  
EXTINT55  
B/  
B/  
I
Schmitt  
Schmitt  
Schmitt  
3−State  
3−State  
3−State  
2/4/8 mA  
2/4/8 mA  
2/4/8 mA  
PD  
Vdd2  
Vdd2  
Vdd2  
3ISD/3T2  
(4)(8)  
70  
71  
A15  
A14  
36  
37  
A15  
A14  
34  
35  
J3  
BCK1/  
GPIO13/  
EXTINT13  
B/  
B/  
I
PU/PD  
PU/PD  
3ISUD/3T2  
(4)(8)  
G4  
MCLK0/  
MCLK1/  
GPIO18/  
EXTINT18  
B/  
B/  
B/  
I
3ISUD/3T2  
(4)(8)  
72  
A13  
38  
A13  
36  
J2  
LRCK1/  
GPIO14/  
EXTINT14  
B/  
B/  
I
Schmitt  
3−State  
2/4/8 mA  
PU/PD  
Vdd2  
3ISUD/3T2  
(4)(8)  
73  
74  
75  
B13  
C11  
B12  
39  
B13  
37  
J1  
Vss2  
Vdd2  
G
P
40  
B12  
38  
H3  
BCK0/  
DMCKO0B/  
GPIO19/  
B/  
O/  
B/  
I
Schmitt  
Schmitt  
Schmitt  
3−State  
3−State  
3−State  
2/4/8 mA  
2/4/8 mA  
2/4/8 mA  
PU/PD  
PU/PD  
PU/PD  
Vdd2  
Vdd2  
Vdd2  
3ISUD/3T2  
(4)(8)  
EXTINT19  
76  
77  
A12  
B11  
41  
42  
A12  
B11  
39  
40  
G3  
H2  
LRCK0/  
DMDIN0B/  
GPIO1A/  
B/  
I/  
B/  
I
3ISUD/3T2  
(4)(8)  
EXTINT1A  
DIN0/  
I/  
I/  
B/  
I
3ISUD/3T2  
(4)(8)  
DMDIN0A/  
GPIO1B/  
EXTINT1B  
www.onsemi.com  
38  
LC823455  
Table 16. (continued)  
RA  
RB  
XA  
BGA240  
BGA136  
WLP120  
Input  
Type  
Output  
Type  
IO  
Pwr Grp  
IO  
No.  
Ball  
C12  
G9  
No.  
Ball  
No.  
Ball  
Circuit Type  
PIN NAME  
Vss2  
I/O  
G
Drive  
PU/PD  
78  
79  
XTALINFO1  
B
Schmitt  
Schmitt  
3−State  
2/4/8 mA  
PU  
Vdd2  
Vdd2  
3ISU/3T2  
(4)(8)  
80  
81  
C10  
A11  
Vdd2  
P
43  
A11  
41  
H1  
DOUT0/  
DMCKO0A  
GPIO1C/  
O/  
O/  
B/  
I
3−State  
2/4/8 mA  
PU/PD  
3ISUD/3T2  
(4)(8)  
EXTINT1C  
82  
83  
84  
85  
A10  
B10  
F9  
44  
45  
A10  
B10  
42  
43  
F4  
F3  
BMODE0  
BMODE1  
B
B
O
Schmitt  
Schmitt  
3−State  
3−State  
3−State  
3−State  
2 mA  
2 mA  
PU/PD  
PU/PD  
Vdd2  
Vdd2  
Vdd2  
Vdd2  
3ISUD/3T2  
3ISUD/3T2  
3T2(4)(8)  
SDRADDR1  
2/4/8 mA  
2/4/8 mA  
D9  
EXA4/  
DOUT1/  
GPIO35/  
EXTINT35  
O/  
O/  
B/  
I
Schmitt  
PD  
3ISD/3T2  
(4)(8)  
86  
87  
88  
89  
C9  
B9  
A9  
A8  
SDRADDR0  
NRES  
O
I
3−State  
2/4/8 mA  
Vdd2  
Vdd2  
3T2(4)(8)  
3IS  
46  
47  
48  
B9  
A9  
A8  
44  
45  
46  
G1  
G2  
F1  
Schmitt  
AVssDAMPR  
G
ROUT/  
GPROUT  
O/  
O
1A  
1A  
AVddDAMPR  
AVddDAMPL  
1A  
1A  
90  
91  
92  
A7  
A6  
A5  
49  
50  
51  
A7  
A6  
A5  
47  
48  
49  
F2  
E2  
E1  
AVddDAMPR  
AVddDAMPL  
P
P
LOUT/  
GPLOUT  
O/  
O
93  
94  
95  
96  
97  
A4  
B8  
52  
53  
A4  
B8  
50  
51  
D2  
D1  
AVssDAMPL  
Vss1  
G
G
O
O
G8  
D8  
SDRADDR2  
SDRADDR3  
3−State  
3−State  
3−State  
2/4/8 mA  
2/4/8 mA  
2/4/8 mA  
Vdd2  
Vdd2  
Vdd2  
3T2(4)(8)  
3T2(4)(8)  
E12  
54  
E12  
52  
E3  
SCL1/  
GPIO2B/  
EXTINT2B  
O/  
B/  
I
Schmitt  
PU/PD  
3ISUD/3T2  
(4)(8)  
98  
99  
E11  
E10  
55  
56  
E11  
E10  
53  
54  
E4  
D3  
SDA1/  
GPIO2C/  
EXTINT2C  
B/  
B/  
I
Schmitt  
Schmitt  
3−State  
3−State  
2/4/8 mA  
2/4/8 mA  
PU/PD  
PU/PD  
Vdd2  
Vdd2  
3ISUD/3T2  
(4)(8)  
SDRADDR11/  
DMCKO0A/  
GPIO2D/  
O/  
O/  
B/  
I
3ISUD/3T2  
(4)(8)  
EXTINT2D  
100  
C8  
SDRDATA0  
B
CMOS  
3−State  
2/4/8 mA  
PD  
Vdd2  
3ICD/3T2  
(4)(8)  
101  
102  
B7  
C7  
57  
B7  
55  
C1  
Vdd1  
P
B
SDRDATA1  
CMOS  
3−State  
3−State  
2/4/8 mA  
2/4/8 mA  
PD  
Vdd2  
Vdd2  
3ICD/3T2  
(4)(8)  
103  
104  
105  
E9  
E8  
E7  
58  
59  
60  
E9  
E8  
E7  
56  
57  
58  
C2  
D4  
C3  
TCLKA0/  
BCK1/  
GPIO00/  
EXTINT00  
I/  
B/  
B/  
I
Schmitt  
PU/PD  
3ISUD/3T2  
(4)(8)  
TCLKB0/  
LRCK1/  
GPIO01/  
EXTINT01  
I/  
B/  
B/  
I
Schmitt  
Schmitt  
3−State  
3−State  
2/4/8 mA  
2/4/8 mA  
PU/PD  
PD  
Vdd2  
Vdd2  
3ISUD/3T2  
(4)(8)  
NHBNWRH/  
TXD0/  
DOUT0/  
GPIO31/  
EXTINT31  
O/  
O/  
O/  
B/  
I
3ISD/3T2  
(4)(8)  
106  
107  
108  
C6  
B5  
D7  
61  
B5  
59  
B1  
Vdd2  
Vss2  
P
G
B
PSM_DAT2  
CMOS  
3−State  
2/4/8/10 mA  
PU/PD  
Vdd2  
3ICUD/3T2  
(4)(8)(10)  
www.onsemi.com  
39  
LC823455  
Table 16. (continued)  
RA  
RB  
XA  
BGA240  
BGA136  
WLP120  
Input  
Type  
Output  
Type  
IO  
Pwr Grp  
IO  
No.  
Ball  
No.  
Ball  
No.  
Ball  
Circuit Type  
PIN NAME  
I/O  
Drive  
PU/PD  
109  
D6  
PSM_SDO  
(DAT1)  
O(B)  
CMOS  
3−State  
2/4/8/10 mA  
PU/PD  
Vdd2  
Vdd2  
3ICUD/3T2  
(4)(8)(10)  
110  
D5  
PSM_DAT3  
B
CMOS  
3−State  
2/4/8/10 mA  
PU/PD  
3ICUD/3T2  
(4)(8)(10)  
111  
112  
C5  
C4  
SDRADDR4  
SDRDATA4  
O
B
3−State  
3−State  
2/4/8 mA  
2/4/8 mA  
Vdd2  
Vdd2  
3T2(4)(8)  
CMOS  
PD  
3ICD/3T2  
(4)(8)  
113  
C3  
SDRDATA14  
B
CMOS  
3−State  
2/4/8 mA  
PD  
Vdd2  
3ICD/3T2  
(4)(8)  
114  
115  
116  
B6  
D4  
D3  
62  
B6  
60  
A1  
Vdd2  
Vdd2  
P
P
B
SDRDATA2  
CMOS  
CMOS  
CMOS  
CMOS  
CMOS  
CMOS  
3−State  
3−State  
3−State  
3−State  
3−State  
3−State  
2/4/8 mA  
2/4/8 mA  
PD  
PD  
Vdd2  
Vdd2  
Vdd2  
Vdd2  
Vdd2  
Vdd2  
3ICD/3T2  
(4)(8)  
117  
118  
119  
120  
121  
E4  
E3  
F7  
F6  
F8  
SDRDATA3  
B
B
3ICD/3T2  
(4)(8)  
SDRDATA15  
2/4/8 mA  
PD  
3ICD/3T2  
(4)(8)  
PSM_SDI  
(DAT0)  
I(B)  
O
2/4/8/10 mA  
2/4/8/10mA  
2/4/8/10 mA  
PU/PD  
PU/PD  
PU/PD  
3ICUD/3T2  
(4)(8)(10)  
PSM_CS  
3ICUD/3T2  
(4)(8)(10)  
PSM_SCK  
O
3ICUD/3T2  
(4)(8)(10)  
122  
123  
F4  
F3  
SDRADDR7  
SDRDATA5  
O
B
3−State  
3−State  
2/4/8 mA  
2/4/8 mA  
Vdd2  
Vdd2  
3T2(4)(8)  
CMOS  
PD  
3ICD/3T2  
(4)(8)  
124  
G7  
SDRDATA13  
Vss2  
B
CMOS  
3−State  
2/4/8 mA  
PD  
Vdd2  
3ICD/3T2  
(4)(8)  
125  
126  
B4  
A2  
63  
64  
B4  
A2  
61  
62  
A2  
B2  
G
EXTINT2E/GP  
IO2E  
I/B  
Schmitt  
Schmitt  
3−State  
3−State  
2/4/8 mA  
2/4/8 mA  
PU/PD  
PU  
Vdd2  
Vdd2  
3ISUD/3T2  
(4)(8)  
127  
A1  
65  
A1  
63  
B3  
NCS1/  
RXD0/  
GPIO10/  
EXTINT10  
O/  
I/  
B/  
I
3ISU/3T2  
(4)(8)  
128  
129  
130  
G6  
G4  
G3  
SDRDATA12  
SDRDATA6  
SDRDATA7  
B
B
B
CMOS  
CMOS  
CMOS  
3−State  
3−State  
3−State  
2/4/8 mA  
2/4/8 mA  
2/4/8 mA  
PD  
PD  
PD  
Vdd2  
Vdd2  
Vdd2  
3ICD/3T2  
(4)(8)  
3ICD/3T2  
(4)(8)  
3ICD/3T2  
(4)(8)  
131  
132  
B3  
H7  
66  
B3  
64  
A3  
Vss1  
G
B
SDRDATA8  
CMOS  
Schmitt  
Schmitt  
3−State  
3−State  
3−State  
2/4/8 mA  
2/4/8 mA  
2/4/8 mA  
PD  
Vdd2  
Vdd2  
Vdd2  
3ICD/3T2  
(4)(8)  
133  
134  
B2  
B1  
67  
68  
B2  
B1  
65  
66  
C4  
B4  
EXTINT2F/  
GPIO2F  
I/  
B
PU/PD  
PU/PD  
3ISUD/3T2  
(4)(8)  
TCK/  
I/  
I/  
B/  
I
3ISUD/3T2  
(4)(8)  
SDCD2/  
GPIO29/  
EXTINT29  
135  
H6  
SDRDATA9  
B
CMOS  
CMOS  
3−State  
3−State  
2/4/8 mA  
2/4/8 mA  
PD  
PD  
Vdd2  
Vdd2  
3ICD/3T2  
(4)(8)  
136  
137  
A3  
H4  
69  
A3  
67  
A4  
Vdd2  
P
B
SDRDATA11  
3ICD/3T2  
(4)(8)  
www.onsemi.com  
40  
LC823455  
Table 16. (continued)  
RA  
RB  
XA  
BGA240  
BGA136  
WLP120  
Input  
Type  
Output  
Type  
IO  
Pwr Grp  
IO  
No.  
Ball  
No.  
Ball  
No.  
Ball  
Circuit Type  
PIN NAME  
I/O  
Drive  
PU/PD  
138  
H3  
SDRDATA10  
B
CMOS  
3−State  
2/4/8 mA  
PD  
Vdd2  
Vdd2  
3ICD/3T2  
(4)(8)  
139  
C2  
70  
C2  
68  
D5  
TIOCA01/  
SDCMD2/  
PHI1/  
GPIO0A/  
EXTINT0A  
B/  
B/  
O/  
B/  
I
CMOS  
3−State  
2/4/8/10 mA  
PU/PD  
3ICUD/3T2  
(4)(8)(10)  
140  
141  
C1  
D2  
71  
72  
C1  
D2  
69  
70  
C5  
B5  
TXD1/  
SDAT20/  
GPIO04/  
EXTINT04  
O/  
B/  
B/  
I
CMOS  
CMOS  
3−State  
3−State  
2/4/8/10 mA  
2/4/8/10 mA  
PU/PD  
PU/PD  
Vdd2  
Vdd2  
3ICUD/3T2  
(4)(8)(10)  
RXD1/  
SDAT21/  
GPIO05/  
EXTINT05  
I/  
B/  
B/  
I
3ICUD/3T2  
(4)(8)(10)  
142  
143  
144  
J7  
D1  
E6  
Vss2  
Vdd1  
G
P
73  
74  
D1  
E6  
71  
72  
A5  
E5  
CTS1/  
SDAT22/  
RXD0/  
GPIO56/  
EXTINT56  
I/  
B/  
I/  
B/  
I
CMOS  
CMOS  
CMOS  
3−State  
3−State  
3−State  
2/4/8/10 mA  
2/4/8/10 mA  
2/4/8/10 mA  
PU/PD  
PU/PD  
PU/PD  
Vdd2  
Vdd2  
Vdd2  
3ICUD/3T2  
(4)(8)(10)  
145  
146  
E5  
E2  
75  
76  
E5  
E2  
73  
74  
C6  
B6  
RTS1/  
SDAT23/  
TXD0/  
GPIO57/  
EXTINT57  
O/  
B/  
O/  
B/  
I
3ICUD/3T2  
(4)(8)(10)  
TIOCA00/  
SDCLK2/  
PHI0/  
GPIO09/  
EXTINT09  
B/  
O/  
O/  
B/  
I
3ICUD/3T2  
(4)(8)(10)  
147  
148  
149  
150  
151  
J6  
J4  
J3  
H9  
E1  
SDRADDR5  
SDRADDR6  
SDRADDR9  
Vdd2  
O
O
O
P
3−State  
3−State  
3−State  
2/4/8 mA  
2/4/8 mA  
2/4/8 mA  
Vdd2  
Vdd2  
Vdd2  
3T2(4)(8)  
3T2(4)(8)  
3T2(4)(8)  
77  
78  
H9  
E1  
75  
76  
A6  
D6  
TMS/  
I/  
I/  
B/  
I
Schmitt  
Schmitt  
Schmitt  
3−State  
3−State  
3−State  
2/4/8 mA  
2/4/8 mA  
2/4/8 mA  
PU/PD  
PU/PD  
PU/PD  
Vdd2  
Vdd2  
Vdd2  
3ISUD/3T2  
(4)(8)  
SDWP2/  
GPIO28/  
EXTINT28  
152  
153  
F5  
F2  
79  
80  
F5  
F2  
77  
78  
E6  
D7  
TXD2/  
O/  
B/  
B/  
I
3ISUD/3T2  
(4)(8)  
TIOCA10/  
GPIO0B/  
EXTINT0B  
RXD2/  
I/  
B/  
B/  
I
3ISUD/3T2  
(4)(8)  
TIOCA11/  
GPIO0C/  
EXTINT0C  
154  
155  
156  
157  
158  
K6  
K4  
F1  
K3  
G5  
SDRBA1  
SDRBA0  
Vss2  
O
O
G
O
3−State  
3−State  
2/4/8 mA  
2/4/8 mA  
Vdd2  
Vdd2  
3T2(4)(8)  
3T2(4)(8)  
81  
F1  
79  
A7  
SDRADDR10  
3−State  
3−State  
2/4/8 mA  
Vdd2  
Vdd2  
3T2(4)(8)  
82  
G5  
80  
B7  
SFCK/  
GPIO0D/  
EXTINT0D/  
SDCLK0  
O/  
B/  
I/  
CMOS  
2/4/8/10 mA  
PU/PD  
3ICUD/3T2  
(4)(8)(10)  
O
159  
160  
G2  
G1  
83  
84  
G2  
G1  
81  
82  
C7  
E7  
TIOCB01/  
SFQSCS/  
GPIO03/  
EXTINT03/  
SDCMD0  
B/  
O/  
B/  
I/  
CMOS  
3−State  
2/4/8/10 mA  
PU/PD  
Vdd2  
3ICUD/3T2  
(4)(8)(10)  
B
SFDO(QIO1)/  
GPIO0F/  
EXTINT0F/  
SDAT01  
O(B)/  
B/  
I/  
CMOS  
3−State  
3−State  
2/4/8/10 mA  
2/4/8 mA  
PU/PD  
Vdd2  
Vdd2  
3ICUD/3T2  
(4)(8)(10)  
B
161  
162  
L4  
SDRRAS  
Vdd2  
O
P
3T2(4)(8)  
H8  
85  
H8  
83  
A8  
www.onsemi.com  
41  
LC823455  
Table 16. (continued)  
RA  
RB  
XA  
BGA240  
BGA136  
WLP120  
Input  
Type  
Output  
Type  
IO  
Pwr Grp  
IO  
No.  
Ball  
No.  
Ball  
No.  
Ball  
Circuit Type  
PIN NAME  
I/O  
Drive  
PU/PD  
163  
164  
165  
H5  
86  
87  
88  
H5  
84  
85  
86  
B8  
SFDI(QIO0)/  
GPIO0E/  
EXTINT0E/  
SDAT00  
I(B)/  
B/  
I/  
CMOS  
CMOS  
CMOS  
3−State  
2/4/8/10 mA  
PU/PD  
Vdd2  
Vdd2  
Vdd2  
3ICUD/3T2  
(4)(8)(10)  
B
H2  
H1  
H2  
H1  
C8  
D8  
SFWP(QIO2)/  
GPIO11/  
EXTINT11/  
SDAT02  
O(B)/  
B/  
I/  
3−State  
3−State  
2/4/8/10 mA  
2/4/8/10 mA  
PU/PD  
PU/PD  
3ICUD/3T2  
(4)(8)(10)  
B
SFHOLD(QIO  
3)/  
GPIO12/  
EXTINT12/  
SDAT03  
O(B)/  
B/  
I/  
3ICUD/3T2  
(4)(8)(10)  
B
166  
167  
168  
169  
L2  
L3  
M5  
J5  
89  
L2  
87  
A9  
Vss1  
G
O
O
SDRWE  
SDRCKE  
3−State  
3−State  
3−State  
2/4/8 mA  
2/4/8 mA  
2/4/8 mA  
Vdd2  
Vdd2  
Vdd2  
3T2(4)(8)  
3T2(4)(8)  
90  
J5  
88  
B9  
TIOCB00/  
DIN1/  
DMDIN0A/  
GPIO02/  
EXTINT02  
B/  
I/  
I/  
B/  
I
Schmitt  
PU/PD  
3ISUD/3T2  
(4)(8)  
170  
171  
172  
173  
174  
M4  
M3  
M2  
N3  
J2  
SDRCLK  
SDRCS  
IO18V  
O
O
I
3−State  
3−State  
2/4/8/10 mA  
2/4/8 mA  
Vdd2  
Vdd2  
Vdd1  
3T2(4)(8)(10)  
3T2(4)(8)  
1A  
91  
M2  
89  
A10  
1A  
Vss1  
G
B
92  
J2  
SDAT02  
CMOS  
CMOS  
CMOS  
3−State  
3−State  
3−State  
2/4/8/10 mA  
2/4/8/10 mA  
2/4/8/10 mA  
PU/PD  
PU/PD  
PU/PD  
Vdd2  
Vdd2  
Vdd2  
3ICUD/3T2  
(4)(8)(10)  
175  
176  
J1  
93  
94  
J1  
SDAT03  
SDAT01  
B
B
3ICUD/3T2  
(4)(8)(10)  
K5  
K5  
3ICUD/3T2  
(4)(8)(10)  
177  
178  
179  
180  
181  
K2  
L1  
95  
96  
97  
K2  
L1  
M1  
Vdd2  
Vss2  
P
G
P
O
B
M1  
M6  
K1  
90  
A11  
Vdd1  
SDRDQM1  
SDAT00  
3−State  
3−State  
2/4/8 mA  
Vdd2  
Vdd2  
3T2(4)(8)  
98  
K1  
CMOS  
2/4/8/10 mA  
PU/PD  
3ICUD/3T2  
(4)(8)(10)  
182  
183  
L6  
L5  
99  
L6  
L5  
SDCLK0  
SDCMD0  
O
B
3−State  
3−State  
2/4/8/10 mA  
2/4/8/10 mA  
Vdd2  
Vdd2  
3T2(4)(8)(10)  
100  
CMOS  
PU/PD  
3ICUD/3T2  
(4)(8)(10)  
184  
185  
186  
187  
188  
189  
190  
191  
192  
193  
194  
195  
196  
197  
198  
K7  
M7  
N5  
N4  
N1  
P1  
R1  
N2  
P2  
R2  
P3  
R3  
P4  
R4  
P5  
SDRADDR8  
SDRCAS  
Vdd2  
O
O
P
G
I
3−State  
3−State  
2/4/8 mA  
2/4/8 mA  
Vdd2  
Vdd2  
3T2(4)(8)  
3T2(4)(8)  
Vss2  
101  
102  
103  
104  
105  
106  
107  
108  
109  
110  
111  
N1  
P1  
R1  
N2  
P2  
R2  
P3  
R3  
P4  
R4  
P5  
91  
92  
93  
94  
B11  
B10  
C9  
C11  
SIN0  
3A  
3A  
3A  
AvddADC  
AvddADC  
AvddADC  
3A  
3A  
3A  
SIN1  
I
SIN2  
I
AVddADC  
SIN3  
P
I
3A  
3A  
3A  
3A  
3A  
AvddADC  
AvddADC  
AvddADC  
AvddADC  
AvddADC  
3A  
3A  
3A  
3A  
3A  
SIN4  
I
SIN5  
I
SIN6  
I
SIN7  
I
95  
96  
C10  
E8  
AVssADC  
AVssUSBPHY  
G
G
www.onsemi.com  
42  
LC823455  
Table 16. (continued)  
RA  
RB  
XA  
BGA240  
BGA136  
WLP120  
Input  
Type  
Output  
Type  
IO  
Pwr Grp  
IO  
No.  
Ball  
No.  
Ball  
No.  
Ball  
Circuit Type  
PIN NAME  
I/O  
Drive  
PU/PD  
199  
R5  
112  
R5  
97  
D11  
B
3A  
3A  
AVddUSBPHY  
18  
3A  
USBEXT0  
2
200  
201  
P6  
R6  
113  
114  
P6  
R6  
98  
99  
D9  
AVddUSBPHY  
2
P
B
D10  
USBDM  
3A  
3A  
3A  
3A  
AVddUSBPHY  
2
3A  
3A  
202  
203  
P7  
R7  
115  
116  
P7  
R7  
100  
101  
E9  
AVssUSBPHY  
USBDP  
G
B
E10  
AVddUSBPHY  
2
204  
P8  
117  
P8  
102  
F8  
DVddUSBPHY  
1
P
205  
206  
R8  
P9  
118  
119  
R8  
P9  
103  
104  
F9  
I
USBVBUS  
F10  
AVddUSBPHY  
18  
P
207  
R9  
120  
R9  
105  
F11  
B
3A  
3A  
AVddUSBPHY  
18  
3A  
USBID  
208  
209  
210  
211  
212  
213  
214  
215  
R10  
R11  
P10  
P11  
N10  
N9  
121  
122  
123  
124  
R10  
R11  
P10  
P11  
106  
107  
108  
109  
G8  
G9  
G10  
G11  
VddXT1  
XIN1  
P
I
X
VddXT1  
VddXT1  
X
X
VssXT1  
XOUT1  
Vss1  
G
O
G
P
P
B
X
Vdd1  
N12  
N6  
Vdd2  
XTALINFO0  
Schmitt  
3−State  
2/4/8 mA  
PU  
Vdd2  
3ISU/3T2  
(4)(8)  
216  
217  
N11  
L7  
Vss2  
G
125  
L7  
110  
F7  
SDO0/  
GPIO1F/  
EXTINT1F  
O/  
B/  
I
Schmitt  
Schmitt  
3−State  
3−State  
2/4/8 mA  
2/4/8 mA  
PU/PD  
PU/PD  
Vdd2  
Vdd2  
3ISUD/3T2  
(4)(8)  
218  
L8  
126  
L8  
111  
F6  
SCK0/  
GPIO1D/  
EXTINT1D  
B/  
B/  
I
3ISUD/3T2  
(4)(8)  
219  
220  
N7  
J8  
SDRDQM0  
O
3−State  
3−State  
2/4/8 mA  
2/4/8 mA  
Vdd2  
Vdd2  
3T2(4)(8)  
EXA15/  
GPIO40/  
EXTINT40  
O/  
B/  
I
Schmitt  
PD  
3ISD/3T2  
(4)(8)  
221  
222  
R12  
K8  
127  
R12  
112  
H11  
Vdd1  
P
EXA10/  
GPIO3B/  
EXTINT3B  
O/  
B/  
I
Schmitt  
Schmitt  
3−State  
3−State  
2/4/8 mA  
2/4/8 mA  
PD  
PD  
Vdd2  
Vdd2  
3ISD/3T2  
(4)(8)  
223  
L12  
128  
L12  
EXA3/  
DIN1/  
GPIO34/  
EXTINT34  
O/  
I/  
B/  
I
3ISD/3T2  
(4)(8)  
224  
225  
226  
227  
M8  
N8  
J9  
EXA17/  
GPIO42/  
EXTINT42  
O/  
B/  
I
Schmitt  
Schmitt  
Schmitt  
Schmitt  
3−State  
3−State  
3−State  
3−State  
2/4/8 mA  
2/4/8 mA  
2/4/8 mA  
2/4/8 mA  
PD  
PD  
PD  
PD  
Vdd2  
Vdd2  
Vdd2  
Vdd2  
3ISD/3T2  
(4)(8)  
EXD3/  
GPIO49/  
EXTINT49  
B/  
B/  
I
3ISD/3T2  
(4)(8)  
EXA16/  
GPIO41/  
EXTINT41  
O/  
B/  
I
3ISD/3T2  
(4)(8)  
K9  
EXA18/  
GPIO43/  
EXTINT43  
O/  
B/  
I
3ISD/3T2  
(4)(8)  
228  
229  
P12  
L9  
129  
130  
P12  
L9  
113  
114  
J11  
Vss2  
G
H10  
SCL0/  
GPIO07/  
EXTINT07  
O/  
B/  
I
Schmitt  
3−State  
2/4/8 mA  
PU/PD  
Vdd2  
3ISUD/3T2  
(4)(8)  
www.onsemi.com  
43  
LC823455  
Table 16. (continued)  
RA  
RB  
XA  
BGA240  
BGA136  
WLP120  
Input  
Type  
Output  
Type  
IO  
Pwr Grp  
IO  
No.  
Ball  
No.  
Ball  
No.  
Ball  
Circuit Type  
PIN NAME  
I/O  
Drive  
PU/PD  
230  
231  
232  
233  
L10  
131  
132  
L10  
115  
116  
J10  
SDI0/  
GPIO1E/  
EXTINT1E  
I/  
B/  
I
Schmitt  
Schmitt  
Schmitt  
Schmitt  
3−State  
2/4/8 mA  
PU/PD  
Vdd2  
Vdd2  
Vdd2  
Vdd2  
3ISUD/3T2  
(4)(8)  
L11  
M9  
L11  
H9  
SDA0/  
GPIO08/  
EXTINT08  
B/  
B/  
I
3−State  
3−State  
3−State  
2/4/8 mA  
2/4/8 mA  
2/4/8 mA  
PU/PD  
PD  
3ISUD/3T2  
(4)(8)  
EXA9/  
GPIO3A/  
EXTINT3A  
O/  
B/  
I
3ISD/3T2  
(4)(8)  
K10  
NCS0/  
GPIO06/  
EXTINT06  
O/  
B/  
I
PU  
3ISU/3T2  
(4)(8)  
234  
235  
R13  
M10  
133  
R13  
117  
K11  
Vdd2  
P
EXD1/  
GPIO47/  
EXTINT47  
B/  
B/  
I
Schmitt  
Schmitt  
Schmitt  
Schmitt  
3−State  
3−State  
3−State  
3−State  
2/4/8 mA  
2/4/8 mA  
2/4/8 mA  
2/4/8 mA  
PD  
PD  
PD  
PD  
Vdd2  
Vdd2  
Vdd2  
Vdd2  
3ISD/3T2  
(4)(8)  
236  
237  
238  
M11  
N13  
P14  
EXA5/  
GPIO36/  
EXTINT36  
O/  
B/  
I
3ISD/3T2  
(4)(8)  
EXA8/  
GPIO39/  
EXTINT39  
O/  
B/  
I
3ISD/3T2  
(4)(8)  
134  
P14  
118  
J9  
NWRENWRL/  
DIN0/  
GPIO30/  
O/  
I/  
B/  
I
3ISD/3T2  
(4)(8)  
EXTINT30  
239  
240  
R14  
P13  
135  
136  
R14  
P13  
119  
120  
K10  
L11  
SWDCLK/  
DMCKO0B  
GPIO58/  
I/  
O/  
B/  
I
Schmitt  
3−State  
2/4/8 mA  
PU/PD  
Vdd2  
3ISUD/3T2  
(4)(8)  
EXTINT58  
Vss1  
G
8. RTCINT (open drain Output) 3.6 V tolerant.  
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44  
LC823455  
INPUT/OUTPUT CIRCUIT  
Attribute : 3IS  
VddIO (Note 9)  
PAD  
Vss  
Attribute : 1IC  
Attribute : 1ICD  
VddIO (Note 9)  
VddIO (Note 9)  
PAD  
PAD  
Vss  
Vss  
Attribute : 3T2(4)(8)  
2/4/8mA  
Attribute : OD3  
VddIO (Note 9)  
PAD  
PAD  
Out/Hiz  
Vss  
Vss  
Attribute : 3ICUD/3T2(4)(8)(10)  
Attribute : 3ICD/3T2(4)(8)  
VddIO (Note 9)  
VddIO (Note 9)  
ON/OFF  
DRVcnt  
DRVcnt  
Out/Hiz  
( Note 10)  
(Note 10)  
PAD  
PAD  
Out/Hiz  
ON/OFF  
ON/OFF  
Vss  
Vss  
Attribute : 3ISUD /3T2(4)(8)  
VddIO (Note 9)  
Attribute : 3ISUD /3T2  
ON/OFF  
VddIO (Note 9)  
ON/OFF  
DRVcnt  
(Note 10)  
PAD  
PAD  
Out/Hiz  
Out/Hiz  
ON/OFF  
ON/OFF  
Vss  
Vss  
Level Shifter  
Figure 6. Input/Output Circuit  
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45  
LC823455  
Attribute : 3ISD/3T2(4)(8)  
Attribute : 3ISU/3T2  
VddIO (Note 9)  
VddIO (Note 9)  
ON/OFF  
DRVcnt  
Out/Hiz  
(Note 10)  
PAD  
PAD  
Out/Hiz  
ON/OFF  
Vss  
Vss  
Attribute : 3ISU/3T2(4)(8)  
VddIO (Note 9)  
Attribute : 3A,1A  
AVdd *  
AVdd *  
ON/OFF  
DRVcnt  
(Note 10)  
PAD(Output)  
PAD(Input)  
PAD  
Out/Hiz  
AVss*  
AVss*  
Vss  
Attribute : X  
Attribute : 3AA  
VddXT 1/VddRTC  
PAD(Input)  
PAD(Output)  
PAD(Input)  
PAD(Output)  
Vss  
Level Shifter  
9. Vdd2, VddSD1 (IO Pwr Grp of Pin Assignment).  
AVss*  
AVss*  
10.DRVcnt: 2/4/8 mA, 2/4/8/10 mA, etc. Drivability switch control signal.  
Figure 6. Input/Output Circuit (continued)  
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46  
 
LC823455  
XA: Package Code = “XA”, RA: Package Code = “RA”, RB: Package Code = “RB”, (RA and RB are under planning).  
Table 17. TERMINAL STATE TABLE  
Terminal status  
NRES = High(ii)  
Default Function  
(NRES = Low)  
(Note 11)  
Terminal status  
NRES = Low(i)  
(Note 12)  
RA  
BGA240  
RB  
BGA136  
XA  
WLP120  
PIN NAME  
(Note 12)  
TCLKA0/  
BCK1/  
GPIO00/  
EXTINT00  
GPIO00  
GPIO01  
GPIO02  
Hiz  
Hiz  
Hiz  
Hiz  
D
D
D
D
D
D
TCLKB0/  
LRCK1/  
GPIO01/  
EXTINT01  
Hiz  
Hiz  
TIOCB00/  
DIN1/  
D
D
D
DMDIN0A/  
GPIO02/  
EXTINT02/  
TIOCB01/  
SFQSCS/  
GPIO03/  
GPIO03  
PU  
PU (Note 13)  
D
D
D
EXTINT03/  
SDCMD0  
TXD1/  
SDAT20/  
GPIO04/  
EXTINT04  
GPIO04  
GPIO05  
Hiz  
Hiz  
Hiz  
Hiz  
D
D
D
D
D
D
RXD1/  
SDAT21/  
GPIO05/  
EXTINT05  
NCS0/  
GPIO06/  
EXTINT06  
GPIO06  
GPIO07  
GPIO08  
GPIO09  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
D
D
D
SCL0/  
GPIO07/  
EXTINT07  
D
D
D
D
SDA0/  
GPIO08/  
EXTINT08  
TIOCA00/  
SDCLK2/  
PHI0/  
D
D
D
GPIO09/  
EXTINT09  
TIOCA01/  
SDCMD2/  
PHI1/  
GPIO0A  
Hiz  
Hiz  
D
D
D
GPIO0A/  
EXTINT0A  
TXD2/  
GPIO0B  
GPIO0C  
GPIO0D  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
TIOCA10/  
GPIO0B/  
EXTINT0B  
D
D
D
D
D
D
RXD2/  
TIOCA11/  
GPIO0C/  
EXTINT0C  
SFCK/  
GPIO0D/  
EXTINT0D/  
D
D
D
SDCLK0  
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47  
 
LC823455  
Table 17. TERMINAL STATE TABLE (continued)  
Terminal status  
NRES = High(ii)  
Default Function  
(NRES = Low)  
(Note 11)  
Terminal status  
NRES = Low(i)  
(Note 12)  
RA  
BGA240  
RB  
BGA136  
XA  
WLP120  
PIN NAME  
(Note 12)  
SFDI(QIO0)/  
GPIO0E/  
EXTINT0E/  
SDAT00  
GPIO0E  
GPIO0F  
GPIO10  
GPIO11  
GPIO12  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
SFDO(QIO1)/  
GPIO0F/  
EXTINT0F/  
SDAT01  
Hiz  
Hiz  
Hiz  
Hiz  
NCS1/  
RXD0/  
GPIO10/  
EXTINT10  
SFWP(QIO2)/  
GPIO11/  
EXTINT11  
SDAT02  
SFHOLD(QIO3)/  
GPIO12/  
EXTINT12  
SDAT03  
BCK1/  
GPIO13/  
EXTINT13  
GPIO13  
GPIO14  
GPIO15  
GPIO16  
GPIO17  
GPIO18  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
LRCK1/  
GPIO14/  
EXTINT14  
DOUT1/  
GPIO15/  
EXTINT15  
NLBEXA0/  
GPIO16/  
EXTINT16  
NRD/  
GPIO17/  
EXTINT17  
MCLK0/  
MCLK1/  
D
D
D
D
D
D
D
D
D
D
D
D
GPIO18/  
EXTINT18  
BCK0/  
DMCKO0B/  
GPIO19/  
GPIO19  
GPIO1A  
GPIO1B  
GPIO1C  
GPIO1D  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
EXTINT19  
LRCK0/  
DMDIN0B/  
GPIO1A/  
EXTINT1A  
DIN0/  
DMDIN0A/  
GPIO1B/  
EXTINT1B  
DOUT0/  
DMCKO0A  
GPIO1C/  
D
D
D
D
D
D
EXTINT1C  
SCK0/  
GPIO1D/  
EXTINT1D  
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48  
LC823455  
Table 17. TERMINAL STATE TABLE (continued)  
Terminal status  
NRES = High(ii)  
Default Function  
(NRES = Low)  
(Note 11)  
Terminal status  
NRES = Low(i)  
(Note 12)  
RA  
BGA240  
RB  
BGA136  
XA  
WLP120  
PIN NAME  
(Note 12)  
SDI0/  
GPIO1E/  
EXTINT1E  
GPIO1E  
GPIO1F  
GPIO20  
Hiz  
Hiz  
Hiz  
Hiz  
D
D
D
D
D
D
SDO0/  
GPIO1F/  
EXTINT1F  
Hiz  
Hiz  
TDI/  
SDCD1/  
SWO/  
GPIO20/  
D
D
D
D
D
D
EXTINT20  
TDO/  
GPIO21  
Hiz  
Hiz  
SDWP1/  
GPIO21/  
EXTINT21  
SDCLK1/  
GPIO22/  
EXTINT22  
GPIO22  
GPIO23  
GPIO24  
GPIO25  
GPIO26  
GPIO27  
GPIO28  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
SDCMD1/  
GPIO23/  
EXTINT23  
SDAT10/  
GPIO24/  
EXTINT24  
SDAT11/  
GPIO25/  
EXTINT25  
SDAT12/  
GPIO26/  
EXTINT26  
SDAT13/  
GPIO27/  
EXTINT27  
TMS/  
SDWP2/  
GPIO28/  
EXTINT28  
D
D
D
D
D
D
TCK/  
GPIO29  
GPIO2A  
Hiz  
Hiz  
Hiz  
Hiz  
SDCD2/  
GPIO29/  
EXTINT29  
SDRADDR12/  
D
D
D
GPIO2A/  
EXTINT2A  
SCL1/  
GPIO2B/  
EXTINT2B  
GPIO2B  
GPIO2C  
GPIO2D  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
D
D
D
D
SDA1/  
GPIO2C/  
EXTINT2C  
SDRADDR11/  
DMCKO0A/  
D
D
D
D
D
D
GPIO2D/  
EXTINT2D  
GPIO2E/  
EXTINT2E  
GPIO2E  
Hiz  
Hiz  
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49  
LC823455  
Table 17. TERMINAL STATE TABLE (continued)  
Terminal status  
NRES = High(ii)  
Default Function  
(NRES = Low)  
(Note 11)  
Terminal status  
NRES = Low(i)  
(Note 12)  
RA  
BGA240  
RB  
BGA136  
XA  
WLP120  
PIN NAME  
(Note 12)  
GPIO2F/  
EXTINT2F  
GPIO2F  
Hiz  
Hiz (Note 14)  
D
D
D
D
D
D
NWRENWRL/  
DIN0/  
GPIO30/  
GPIO30  
Hiz  
Hiz  
Hiz  
EXTINT30  
NHBNWRH/  
TXD0/  
GPIO31  
Hiz  
D
D
D
DOUT0/  
GPIO31/  
EXTINT31  
EXA1/  
GPIO32/  
EXTINT32  
GPIO32  
GPIO33  
GPIO34  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
D
D
EXA2/  
GPIO33/  
EXTINT33  
EXA3/  
DIN1/  
GPIO34/  
EXTINT34  
D
D
D
EXA4/  
DOUT1/  
GPIO35/  
EXTINT35  
GPIO35  
Hiz  
Hiz  
EXA5/  
GPIO36/  
EXTINT36  
GPIO36  
GPIO37  
GPIO38  
GPIO39  
GPIO3A  
GPIO3B  
GPIO3C  
GPIO3D  
GPIO3E  
GPIO3F  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
D
D
D
D
D
D
D
D
D
D
EXA6/  
GPIO37/  
EXTINT37  
EXA7/  
GPIO38/  
EXTINT38  
EXA8/  
GPIO39/  
EXTINT39  
EXA9/  
GPIO3A/  
EXTINT3A  
EXA10/  
GPIO3B/  
EXTINT3B  
EXA11/  
GPIO3C/  
EXTINT3C  
EXA12/  
GPIO3D/  
EXTINT3D  
EXA13/  
GPIO3E/  
EXTINT3E  
EXA14/  
GPIO3F/  
EXTINT3F  
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50  
LC823455  
Table 17. TERMINAL STATE TABLE (continued)  
Terminal status  
NRES = High(ii)  
Default Function  
(NRES = Low)  
(Note 11)  
Terminal status  
NRES = Low(i)  
(Note 12)  
RA  
BGA240  
RB  
BGA136  
XA  
WLP120  
PIN NAME  
(Note 12)  
EXA15/  
GPIO40/  
EXTINT40  
GPIO40  
GPIO41  
GPIO42  
GPIO43  
GPIO44  
GPIO45  
GPIO46  
GPIO47  
GPIO48  
GPIO49  
GPIO4A  
GPIO4B  
GPIO4C  
GPIO4D  
GPIO4E  
GPIO4F  
GPIO50  
GPIO51  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
EXA16/  
GPIO41/  
EXTINT41  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
EXA17/  
GPIO42/  
EXTINT42  
EXA18/  
GPIO43/  
EXTINT43  
EXA19/  
GPIO44/  
EXTINT44  
EXA20/  
GPIO45/  
EXTINT45  
EXD0/  
GPIO46/  
EXTINT46  
EXD1/  
GPIO47/  
EXTINT47  
EXD2/  
GPIO48/  
EXTINT48  
EXD3/  
GPIO49/  
EXTINT49  
EXD4/  
GPIO4A/  
EXTINT4A  
EXD5/  
GPIO4B/  
EXTINT4B  
EXD6/  
GPIO4C/  
EXTINT4C  
EXD7/  
GPIO4D/  
EXTINT4D  
EXD8/  
GPIO4E/  
EXTINT4E  
EXD9/  
GPIO4F/  
EXTINT4F  
EXD10/  
GPIO50/  
EXTINT50  
EXD11/  
GPIO51/  
EXTINT51  
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51  
LC823455  
Table 17. TERMINAL STATE TABLE (continued)  
Terminal status  
NRES = High(ii)  
Default Function  
(NRES = Low)  
(Note 11)  
Terminal status  
NRES = Low(i)  
(Note 12)  
RA  
BGA240  
RB  
BGA136  
XA  
WLP120  
PIN NAME  
(Note 12)  
EXD12/  
GPIO52/  
EXTINT52  
GPIO52  
GPIO53  
GPIO54  
GPIO55  
GPIO56  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
D
D
D
D
EXD13/  
GPIO53/  
EXTINT53  
Hiz  
Hiz  
Hiz  
Hiz  
EXD14/  
GPIO54/  
EXTINT54  
EXD15/  
GPIO55/  
EXTINT55  
CTS1/  
SDAT22/  
RXD0/  
D
D
D
GPIO56/  
EXTINT56  
RTS1/  
SDAT23/  
TXD0/  
GPIO57  
Hiz  
Hiz  
D
D
D
GPIO57/  
EXTINT57  
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
PSM_CS  
PSM_SDI(DAT0)  
PSM_SDO(DAT1)  
PSM_DAT2  
PSM_DAT3  
PSM_SCK  
SDAT00  
PSM_CS  
PSM_SDI(DAT0)  
PSM_SDO(DAT1)  
PSM_DAT2  
PSM_DAT3  
PSM_SCK  
SDAT00  
PD  
PD  
PD  
PD  
PD  
PD  
PD  
PD  
PD  
PD  
PD  
PD  
D
D
D
D
D
D
Hiz  
Hiz  
SDAT01  
SDAT01  
Hiz  
Hiz  
SDAT02  
SDAT02  
Hiz  
Hiz  
SDAT03  
SDAT03  
Hiz  
Hiz  
SDCLK0  
SDCLK0  
Low  
Hiz  
Low  
Hiz  
SDCMD0  
SDCMD0  
SDRADDR0  
SDRADDR1  
SDRADDR10  
SDRADDR2  
SDRADDR3  
SDRADDR4  
SDRADDR5  
SDRADDR6  
SDRADDR7  
SDRADDR8  
SDRADDR9  
SDRBA0  
SDRADDR0  
SDRADDR1  
SDRADDR10  
SDRADDR2  
SDRADDR3  
SDRADDR4  
SDRADDR5  
SDRADDR6  
SDRADDR7  
SDRADDR8  
SDRADDR9  
SDRBA0  
Low  
Low  
Low  
Low  
Low  
Low  
Low  
Low  
Low  
Low  
Low  
Low  
Low  
Low  
Low  
Low  
Low  
Low  
Low  
Low  
Low  
Low  
Low  
Low  
Low  
Low  
SDRBA1  
SDRBA1  
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52  
LC823455  
Table 17. TERMINAL STATE TABLE (continued)  
Terminal status  
NRES = High(ii)  
Default Function  
(NRES = Low)  
(Note 11)  
Terminal status  
NRES = Low(i)  
(Note 12)  
RA  
BGA240  
RB  
BGA136  
XA  
WLP120  
PIN NAME  
SDRCAS  
(Note 12)  
High  
High  
Low  
High  
Hiz  
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
SDRCAS  
SDRCKE  
High  
High  
Low  
High  
Hiz  
SDRCKE  
SDRCLK  
SDRCLK  
SDRCS  
SDRCS  
SDRDATA0  
SDRDATA1  
SDRDATA10  
SDRDATA11  
SDRDATA12  
SDRDATA13  
SDRDATA14  
SDRDATA15  
SDRDATA2  
SDRDATA3  
SDRDATA4  
SDRDATA5  
SDRDATA6  
SDRDATA7  
SDRDATA8  
SDRDATA9  
SDRDQM0  
SDRDQM1  
SDRRAS  
SDRDATA0  
SDRDATA1  
SDRDATA10  
SDRDATA11  
SDRDATA12  
SDRDATA13  
SDRDATA14  
SDRDATA15  
SDRDATA2  
SDRDATA3  
SDRDATA4  
SDRDATA5  
SDRDATA6  
SDRDATA7  
SDRDATA8  
SDRDATA9  
SDRDQM0  
SDRDQM1  
SDRRAS  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
High  
High  
High  
High  
Hiz  
High  
High  
High  
High  
Hiz  
SDRWE  
SDRWE  
SWDCLK/  
DMCKO0B/  
GPIO58/  
SWDCLK  
D
D
D
D
D
D
EXTINT58  
SWDIO/  
DMDIN0B/  
GPIO59/  
SWDIO  
Hiz  
Hiz  
EXTINT59  
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
NRES  
TEST  
NRES  
TEST  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
PD  
Low  
PD  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
Hiz  
PD  
Low  
PD  
XTALINFO0  
XTALINFO1  
BMODE0  
BMODE1  
IO18V  
XTALINFO0  
XTALINFO1  
BMODE0  
BMODE1  
IO18V  
D
D
D
D
D
D
D
D
D
D
RTCMODE  
KEYINT0  
USBDM  
RTCMODE  
KEYINT0  
USBDM  
D
D
D
KEYINT1  
KEYINT1  
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53  
LC823455  
Table 17. TERMINAL STATE TABLE (continued)  
Terminal status  
NRES = High(ii)  
Default Function  
(NRES = Low)  
(Note 11)  
Terminal status  
NRES = Low(i)  
(Note 12)  
RA  
BGA240  
RB  
BGA136  
XA  
WLP120  
PIN NAME  
KEYINT2  
BACKUPB  
RTCINT  
(Note 12)  
D
D
D
D
KEYINT2  
BACKUPB  
RTCINT  
VDET  
PD  
PD  
D
D
D
Hiz  
Hiz  
D
D
−(Not Determined)  
−(Not Determined)  
VDET  
Hiz  
Hiz  
Hiz  
Hiz  
LOUT/  
GPLOUT  
LOUT  
D
D
D
D
D
D
ROUT/  
GPROUT  
ROUT  
Hiz  
Hiz  
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
USBDP  
USBID  
USBEXT02  
USBVBUS  
VCNT1  
VCNT2  
SIN0  
USBDP  
USBID  
USBEXT02  
USBVBUS  
VCNT1  
VCNT2  
SIN0  
Low  
Low  
Hiz  
Hiz  
−(Not Applicable)  
Hiz  
−(Not Applicable)  
Hiz  
−(Not Applicable)  
−(Not Applicable)  
−(Not Applicable)  
−(Not Applicable)  
−(Not Applicable)  
−(Not Applicable)  
−(Not Applicable)  
−(Not Applicable)  
−(Not Applicable)  
−(Not Applicable)  
−(Not Applicable)  
−(Not Applicable)  
−(Not Applicable)  
−(Not Applicable)  
−(Not Applicable)  
−(Not Applicable)  
−(Not Applicable)  
−(Not Applicable)  
−(Not Applicable)  
−(Not Applicable)  
−(Not Applicable)  
−(Not Applicable)  
−(Not Applicable)  
−(Not Applicable)  
−(Not Applicable)  
−(Not Applicable)  
−(Not Applicable)  
−(Not Applicable)  
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
SIN1  
SIN1  
SIN2  
SIN2  
SIN3  
SIN3  
SIN4  
SIN4  
SIN5  
SIN5  
SIN6  
SIN6  
SIN7  
SIN7  
D
D
D
D
XIN1  
XIN1  
XIN32K  
XOUT1  
XOUT32K  
XIN32K  
XOUT1  
XOUT32K  
*“D” Means a port is available for each package. “PD” means pull down.  
11. Default function is port function set by NRES = Low.  
12.NRES = High(ii) occurs just after NRES = Low(i).  
13.This terminal is configured as an output terminal with PU disabled, and used as QSCS for the SPI I/F chip select during serial flash boot mode.  
14.This terminal is configured as an output terminal and used as the boot monitor port during Internal ROM boot.  
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54  
 
LC823455  
ELECTRICAL SPECIFICATION  
Product parametric performance is indicated in the  
Electrical Characteristics for the listed test conditions,  
unless otherwise noted. Product performance may not be  
indicated by the Electrical Characteristics if operated under  
different conditions.  
Table 18. MAXIMUM RATINGS (*VSS* = 0V)  
Item  
Symbol  
Condition  
Ratings  
Unit  
Maximum power supply voltage  
Vdd1  
−0.3 to 1.2  
V
VddXT1  
AVddPLL1  
AVddPLL2  
VddRTC  
DVddUSBPHY1  
−0.3 to 1.2  
−0.3 to 2.0  
V
V
AVddADC  
AVddUSBPHY18  
AVddDAMPL  
AVddDAMPR  
Vdd2  
VddSD1  
−0.3 to 3.65  
V
AVddUSBPHY2  
Input voltage  
VI  
−0.3 to  
V
V
V
*Vdd*+0.3  
VIUSB1  
VIUSB2  
USBDP,USBDM  
terminal  
−0.3 to 6.0  
USBVBUS  
terminal  
−0.3 to 6.0  
Operating ambient temperature  
Topr  
Tstg  
−20 to +65  
°C  
°C  
Ambient temperature of preservation  
−55 to +125  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
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55  
LC823455  
Table 19. RECOMMENDATION OPERATING CONDITIONS (TA = −205C to +655C)  
Low voltage operation  
(Note 15)  
High voltage operation  
(Note 15)  
Min  
Typ  
Max  
Min  
1.05  
Typ  
Max  
1.155  
Item  
Symbol  
Condition  
Unit  
Power supply  
voltage  
Vdd1  
0.95  
1.0  
1.155  
1.1  
V
VddXT1  
AVddPLL1  
AVddPLL2  
VddRTC  
0.95  
0.95  
0.95  
0.765  
0.90  
2.7  
1.0  
1.0  
1.0  
1.155  
1.155  
1.155  
0.90  
1.155  
3.6  
same as left  
same as left  
same as left  
same as left  
same as left  
same as left  
same as left  
same as left  
same as left  
same as left  
same as left  
same as left  
same as left  
same as left  
same as left  
same as left  
same as left  
same as left  
same as left  
same as left  
same as left  
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
(Note 16)  
1.0  
3.3  
1.8  
3.3  
1.8  
1.8  
1.0  
1.0  
3.3  
3.3  
1.8  
1.8  
1.5  
1.5  
1.5  
1.5  
Vdd2  
(Note 17)  
(Note 17)  
(Note 18)  
(Note 18)  
1.7  
1.95  
3.6  
VddSD1  
2.7  
1.7  
1.95  
1.95  
1.1  
AVddADC  
1.7  
DVddUSBPHY1  
(Note 19)  
(Note 20)  
(Note 19)  
(Note 20)  
(Note 19)  
(Note 20)  
0.93  
0.93  
3.07  
2.7  
1.155  
3.6  
AVddUSBPHY2  
AVddUSBPHY18  
AVddDAMPL  
AVddDAMPR  
VIN  
3.6  
1.7  
1.95  
1.95  
1.65  
1.95  
1.65  
1.95  
*Vdd*  
1.7  
0.95  
0.95  
0.95  
0.95  
0
(Note 21)  
(Note 21)  
Input range  
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond  
the Recommended Operating Ranges limits may affect device reliability.  
15.Follow the operating frequency specifications because the operating frequency ranges are specified according to the operating voltage  
ranges.  
16.APB clock needs 57.5 MHz or less.  
17.IO terminals operating at Vdd2 need to be specified for the IO voltage range of either 3.3 V or 1.8 V according to the Vdd2 voltage by using  
the IO18 V terminal. When setting 1.8 V IO interface, even for extremely short period, don’t supply not only the 3.3 V voltage range but also  
any voltage over the 1.8 V voltage range to Vdd2.  
18.IO terminals operating at VddSD1 need to be specified for the IO voltage range of either 3.3V or 1.8V according to the VddSD1 voltage by  
setting a register “System Controller” described in the “System Functions User’s Manual”. When setting 1.8 V IO interface, even for extremely  
short period, don’t supply not only the 3.3 V voltage range but also any voltage over the 1.8 V voltage range to VddSD1.  
19.While USB is used (including USB suspend mode).  
20.While USB is not used.  
21.While used as GPO (general purpose output) the output of which can be controlled by registers.  
The power domains of Vdd1, DVddUSBPHY1, AVddPLL1, AVddPLL2, VddXT1 are divided, and different voltages can be supplied.  
The power domains of Vdd2, VddSD1, AVddADC, AVddUSBPHY2, AVdd USBPHY18, AvddDAMPL = AVddDAMPR are divided, and difference  
voltages can be supplied.  
If power is supplied to one of the power supply pins above, all the other power supply pins should also be supplied.  
However, DVddUSBPHY1, AVddUSBPHY18 and AVddUSBPHY2 can all be turned off to reduce leakage current while USB is not used. In  
addition, VddRTC can be supplied if BACKUPB is set to low, while other power supply pins are not supplied.  
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56  
 
LC823455  
Table 20. RECOMMENDED OPERATING CONDITIONS  
Low voltage operation  
High voltage operation  
Min  
Typ  
Max  
Min  
Typ  
Max  
Item  
Symbol  
Function  
Unit  
Xtal Input  
frequency  
Fxin1  
System,  
Audio clock  
(XT1 oscillator)  
12 MHz or 19.2 MHz or 24 MHz  
Tolerance: 50 ppm or less  
same as left  
FxinRTC  
RTC clock  
(XTRTC  
32.768 kHz  
Tolerance : 50ppm or less  
same as left  
oscillator)  
Frc  
RC  
0.4  
(Note 25)  
1
2
same as left  
same as left  
same as left  
MHz  
ms  
(RC oscillator)  
(Note 25)  
(Note 25)  
Time for  
Xtal stable  
Txin1  
3
(Note 26)  
TxinRTC  
1000  
ms  
(Note 26)  
Internal clock  
frequency  
Farm  
Fahb  
Fapb  
Fdsp  
Cortex−M3  
AHB  
0
0
0
0
0
115  
115  
0
0
0
0
170  
170  
170  
170  
MHz  
MHz  
MHz  
MHz  
MHz  
APB  
115  
DSP  
115  
Faud  
AUDCLK(768fs)  
33.8688  
16.9344  
147.456  
same as left  
same as left  
(Note 22)  
Fdec  
DECCLK  
(Note 23)  
0
0
73.728  
36.864  
MHz  
MHz  
(MP3 Decoder)  
Fenc  
ENCCLK  
(Note 24)  
8.4672  
same as left  
(MP3 Encoder)  
22.Audio blocks run on a clock of 256 * Fs(sampling frequency).  
However, Class−D AMP, etc. run at 384 * Fs(sampling frequency).  
These clocks are generated from 768 * Fs(Base Clock) divided by 3 and 2 respectively.  
23.MP3 Decoder runs on a clock of 384 * Fs(sampling frequency of MPEG1 mode).  
It runs on the clock of the same frequency as MPEG1 mode during MPEG2 / 2.5 mode. For example, even when operating in MPEG2 / 2.5  
mode(Fs = 22.05 / 11.025 KHz as an example), please supply 16.9344MHz(= 384 * 44.1 KHz) clock which is the same clock frequency as  
MPEG1 mode.  
24.MP3 Encoder runs on a clock of 192 * Fs(sampling frequency of MPEG1 mode).  
It runs on the clock of the same frequency as MPEG1 mode during MPEG2 / 2.5 mode. For example, even when operating in MPEG2 / 2.5  
mode(Fs = 22.05 / 11.025 KHz as an example), please supply 8.4672Mhz (= 192 * 44.1 KHz) clock which is the same clock frequency as  
MPEG1 mode.  
25.Vdd1 = 0.95 V to 1.155 V, Ta = 25_C to +65_C.  
26.It is a reference level in Ta = 25_C. Adjustment is necessary by the situation of the set.  
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57  
 
LC823455  
Table 21. DC CHARACTERISTICS  
(Vdd2 = 2.7 V to 3.6 V, VddSD1 = 2.7 V to 3.6 V, VddRTC = 0.765 V to 1.155 V, Ta = −20°C to +65°C)  
Item  
Symbol  
Pin  
(1)(2)(4)  
(3)  
Condition  
Min  
Typ  
Max  
Unit  
V
Input H voltage  
V
IH  
CMOS  
0.7 x Vdd2  
0.7 x VddSD1  
0.75 x Vdd2  
0.75 x VddSD1  
0.7 x VddRTC  
V
Schmitt  
(6)(8)  
(7)  
V
V
(5)(9)  
(1)(2)(4)  
(3)  
CMOS  
CMOS  
V
Input L voltage  
V
IL  
0.25 x Vdd2  
0.25 x VddSD1  
0.2 x Vdd2  
V
V
Schmitt  
(6)(8)  
(7)  
V
0.2 x VddSD1  
0.2 x VddRTC  
V
(5)(9)  
CMOS  
V
Output H voltage  
V
OH  
I
I
I
= 2 mA  
(10)(11)(12)  
(14)(15)(17)  
Vdd2 0.4  
V
OH  
(13)(16)  
VddSD1 0.4  
Vdd2 0.4  
V
V
= 4 mA  
(10)  
OH  
(14)(15)(17)  
(16)  
VddSD1 0.4  
Vdd2 0.4  
V
V
= 8 mA  
(10)  
OH  
(14)(15)(17)  
(16)  
(14)(15)(17)  
(16)  
VddSD1 0.4  
Vdd2 0.4  
V
V
V
V
I
= 10 mA  
OH  
VddSD1 0.4  
Output L voltage  
V
OL  
I
= 2 mA  
= 4 mA  
= 8 mA  
(10)(11)(12)  
(14)(15)(17)  
0.4  
OL  
(13)(16)  
0.4  
0.4  
V
V
I
(10)  
OL  
(14)(15)(17)  
(16)  
0.4  
0.4  
V
V
I
(10)  
OL  
(14)(15)(17)  
(16)  
(14)(15)(17)  
(16)  
0.4  
0.4  
0.4  
0.3  
150  
80  
V
V
I
= 10 mA  
= 0.3 mA  
OL  
V
(18)  
I
OL  
V
Pull−up resistor  
Rup  
Rdn  
(20)(21)  
(22)  
30  
25  
kꢀ  
kꢀ  
kꢀ  
kꢀ  
(23)  
18  
50  
Pull−down resistor  
(26)  
VddRTC =  
180  
720  
0.765 to 0.90 V  
VddRTC =  
93  
280  
kꢀ  
0.90 to 1.155 V  
(19)(21)  
(22)  
30  
25  
150  
80  
kꢀ  
kꢀ  
kꢀ  
A  
(23)  
18  
50  
Input leak current  
I
IL  
(1)(2)(3)  
(4)(5)(6)  
(7)(8)(9)  
VI = Vdd*  
or  
VI = Vss  
10  
10  
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LC823455  
Table 21. DC CHARACTERISTICS (continued)  
(Vdd2 = 2.7 V to 3.6 V, VddSD1 = 2.7 V to 3.6 V, VddRTC = 0.765 V to 1.155 V, Ta = −20°C to +65°C)  
Item  
Symbol  
Pin  
Condition  
Min  
Typ  
Max  
Unit  
Output leak current  
I
(11)(12)  
(13)(14)(15)  
(16)(18)(27)  
HiZ output  
10  
10  
A  
OZ  
Table 22. DC CHARACTERISTICS  
(Vdd2 = 1.7 V to 1.95 V, VddSD1 = 1.7 V to 1.95 V, AVddDAMPL = 0.95 V to 1.95 V, AVddDAMPR = 0.95 V to 1.95 V,  
Ta = −20°C to +65°C)  
Item  
Symbol  
Pin  
Condition  
Min  
Typ  
Max  
Unit  
Input H voltage  
V
(1)(2)(4)  
(3)  
CMOS  
0.7 x Vdd2  
0.7 x VddSD1  
0.75 x Vdd2  
V
V
V
V
V
V
V
V
V
IH  
(6)(8)  
(7)  
Schmitt  
CMOS  
Schmitt  
0.75 x VddSD1  
Input L voltage  
V
(1)(2)(4)  
(3)  
0.3 x Vdd2  
0.3 x VddSD1  
0.25 x Vdd2  
IL  
(6)(8)  
(7)  
0.25 x VddSD1  
Output H voltage  
V
OH  
(10)(11)(12)  
(14)(15)(17)  
I
I
I
= 2 mA  
Vdd2 0.4  
OH  
(13)(16)  
VddSD1 0.4  
Vdd2 0.4  
V
V
(10)  
= 4 mA  
OH  
(14)(15)(17)  
(16)  
(14)(15)(17)  
(16)  
VddSD1 0.4  
Vdd2 0.4  
V
V
V
V
V
V
= 8 mA  
OH  
VddSD1 0.4  
Vdd2 0.4  
(14)(15)(17)  
(16)  
I
= 10 mA  
OH  
VddSD1 0.4  
AVddDAMPL – 0.4  
(24)  
I
= 8 mA  
OH  
(Note 27)  
(25)  
I
= 8 mA  
AVddDAMPR – 0.4  
V
V
OH  
(Note 27)  
Output L voltage  
V
OL  
(10)(11)(12)  
(14)(15)(17)  
I
OL  
I
OL  
I
OL  
= 2 mA  
= 4 mA  
= 8 mA  
= 10 mA  
0.4  
(13)(16)  
0.4  
0.4  
V
V
(10)  
(14)(15)(17)  
(16)  
0.4  
0.4  
V
V
(10)  
(14)(15)(17)  
(16)  
(14)(15)(17)  
(16)  
0.4  
0.4  
0.4  
0.4  
0.4  
200  
80  
V
V
I
OL  
V
(24)  
I
I
= 8 mA  
= 8 mA  
V
OL  
(25)  
V
OL  
Pull−up resistor  
Rup  
Rdn  
(20)(21)  
(22)  
30  
25  
18  
30  
25  
18  
kꢀ  
kꢀ  
kꢀ  
kꢀ  
kꢀ  
kꢀ  
(23)  
50  
Pull−down resistor  
(19)(21)  
(22)  
200  
80  
(23)  
50  
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59  
 
LC823455  
Table 22. DC CHARACTERISTICS (continued)  
(Vdd2 = 1.7 V to 1.95 V, VddSD1 = 1.7 V to 1.95 V, AVddDAMPL = 0.95 V to 1.95 V, AVddDAMPR = 0.95 V to 1.95 V,  
Ta = −20°C to +65°C)  
Item  
Symbol  
Pin  
Condition  
Min  
Typ  
Max  
Unit  
Input leak current  
I
IL  
(1)(2)(3)  
(4)(6)  
VI = Vdd*  
or  
VI = Vss  
10  
10  
A  
(7)(8)  
Output leak current  
I
(11)(12)  
(13)(14)(15)  
(16)(27)  
HiZ output  
10  
10  
10  
A  
A  
OZ  
(24)(25)  
−10  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
(1) SDRDATA15, SDRDATA14, SDRDATA13, SDRDATA12, SDRDATA11, SDRDATA10, SDRDATA9, SDRDATA8, SDRDATA7, SDRDATA6,  
SDRDATA5, SDRDATA4, SDRDATA3, SDRDATA2, SDRDATA1, SDRDATA0  
(2) SDCLK2(GPIO09), SDCMD2(GPIO0A), SDAT23(GPIO57), SDAT22(GPIO56), SDAT21(GPIO05), SDAT20(GPIO04), PSM_SCK,  
PSM_CS, PSM_SDI, PSM_SDO, PSM_DAT2, PSM_DAT3  
(3) SDCLK1(GPIO22), SDCMD1(GPIO23), SDAT13(GPIO27), SDAT12(GPIO26), SDAT11(GPIO25), SDAT10(GPIO24)  
(4) SDCMD0, SDAT03, SDAT02, SDAT01, SDAT00, SFCK(GPIO0D), SFDI(GPIO0E), SFDO(GPIO0F), SFWP(GPIO11),  
SFHOLD(GPIO12), TIOCB01(GPIO03)  
(5) RTCMODE, VDET  
(6) SDWP2(GPIO28), SDCD2(GPIO29), EXD0(GPIO46), EXD1(GPIO47), EXD2(GPIO48), EXD3(GPIO49), EXD4(GPIO4A),  
EXD5(GPIO4B), EXD6(GPIO4C), EXD7(GPIO4D), EXD8(GPIO4E), EXD9(GPIO4F), EXD10(GPIO50), EXD11(GPIO51),  
EXD12(GPIO52), EXD13(GPIO53), EXD14(GPIO54), EXD15(GPIO55), EXA1(GPIO32), EXA2(GPIO33), EXA3(GPIO34),  
EXA4(GPIO35), EXA5(GPIO36), EXA6(GPIO37), EXA7(GPIO38), EXA8(GPIO39), EXA9(GPIO3A), EXA10(GPIO3B),  
EXA11(GPIO3C), EXA12(GPIO3D), EXA13(GPIO3E), EXA14(GPIO3F), EXA15(GPIO40), EXA16(GPIO41), EXA17(GPIO42),  
EXA18(GPIO43), EXA19(GPIO44), EXA20(GPIO45), NRD(GPIO17), NLBEXA0(GPIO16), NHBNWRH(GPIO31), NCS1(GPIO10),  
NCS0(GPIO06), NWRENWRL(GPIO30), SWDIO(GPIO59), DOUT1(GPIO15), BCK1(GPIO13), MCLK0(GPIO18), LRCK1(GPIO14),  
BCK0(GPIO19), LRCK0(GPIO1A), DIN0(GPIO1B), XTALINFO1, DOUT0(GPIO1C), NRES, SCL1(GPIO2B), SDA1(GPIO2C),  
TCLKA0(GPIO00), TCLKB0(GPIO01), EXTINT2E(GPIO2E), EXTINT2F(GPIO2F), TXD2(GPIO0B), RXD2(GPIO0C),  
TIOCB00(GPIO02), XTALINFO0, SDO0(GPIO1F), SCK0(GPIO1D), SCL0(GPIO07), SDI0(GPIO1E), SDA0(GPIO08),  
SWDCLK(GPIO58), SDRADDR12(GPIO2A), SDRADDR11(GPIO2D)  
(7) SDWP1(GPIO21), SDCD1(GPIO20)  
(8) BMODE0, BMODE1  
(9) Keyint2, Keyint0, Keyint1, BACKUPB, TEST  
(10) EXD0(GPIO46), EXD1(GPIO47), EXD2(GPIO48), EXD3(GPIO49), EXD4(GPIO4A), EXD5(GPIO4B), EXD6(GPIO4C), EXD7(GPIO4D),  
EXD8(GPIO4E), EXD9(GPIO4F), EXD10(GPIO50), EXD11(GPIO51), EXD12(GPIO52), EXD13(GPIO53), EXD14(GPIO54),  
EXD15(GPIO55), EXA1(GPIO32), EXA2(GPIO33), EXA3(GPIO34), EXA4(GPIO35), EXA5(GPIO36), EXA6(GPIO37), EXA7(GPIO38),  
EXA8(GPIO39), EXA9(GPIO3A), EXA10(GPIO3B), EXA11(GPIO3C), EXA12(GPIO3D), EXA13(GPIO3E), EXA14(GPIO3F),  
EXA15(GPIO40), EXA16(GPIO41), EXA17(GPIO42), EXA18(GPIO43), EXA19(GPIO44), EXA20(GPIO45), NRD(GPIO17),  
NLBEXA0(GPIO16), NHBNWRH(GPIO31), NCS1(GPIO10), NCS0(GPIO06), NWRENWRL(GPIO30), DOUT1(GPIO15),  
BCK1(GPIO13), MCLK0(GPIO18), LRCK1(GPIO14), BCK0(GPIO19), LRCK0(GPIO1A), DIN0(GPIO1B), XTALINFO1,  
DOUT0(GPIO1C), SCL1(GPIO2B), SDA1(GPIO2C), TCLKA0(GPIO00), TCLKB0(GPIO01), EXTINT2E(GPIO2E), EXTINT2F(GPIO2F),  
TXD2(GPIO0B), RXD2(GPIO0C), TIOCB00(GPIO02), XTALINFO0, SDO0(GPIO1F), SCK0(GPIO1D), SCL0(GPIO07), SDI0(GPIO1E),  
SDA0(GPIO08), SWDCLK(GPIO58), SDRADDR0, SDRADDR1, SDRADDR2, SDRADDR3, SDRADDR4, SDRADDR5, SDRADDR6,  
SDRADDR7, SDRADDR8, SDRADDR9, SDRADDR10, SDRADDR11(GPIO2D), SDRADDR12(GPIO2A), SDRDATA0, SDRDATA1,  
SDRDATA2, SDRDATA3, SDRDATA4, SDRDATA5, SDRDATA6, SDRDATA7, SDRDATA8, SDRDATA9, SDRDATA10, SDRDATA11,  
SDRDATA12, SDRDATA13, SDRDATA14, SDRDATA15, SDRBA1, SDRBA0, SDRCKE, SDRCS, SDRWE, SDRCAS, SDRRAS,  
SDRDQM1, SDRDQM0, SDWP2(GPIO28), SDCD2(GPIO29)  
(11) SWDIO(GPIO59)  
(12) BMODE0, BMODE1  
(13) SDWP1(GPIO21), SDCD1(GPIO20)  
(14) SDCLK0, SDCMD0, SDAT03, SDAT02, SDAT01, SDAT00, SFCK(GPIO0D), SFDI(GPIO0E), SFDO(GPIO0F), SFWP(GPIO11),  
SFHOLD(GPIO12), TIOCB01(GPIO03)  
(15) SDCLK2(GPIO09), SDCMD2(GPIO0A), SDAT23(GPIO57), SDAT22(GPIO56), SDAT21(GPIO05), SDAT20(GPIO04), PSM_SCK,  
PSM_CS, PSM_SDI, PSM_SDO, PSM_DAT2, PSM_DAT3  
(16) SDCLK1(GPIO22), SDCMD1(GPIO23), SDAT13(GPIO27), SDAT12(GPIO26), SDAT11(GPIO25), SDAT10(GPIO24),  
(17) SDRCLK  
(18) RTCINT  
(19) EXD0(GPIO46), EXD1(GPIO47), EXD2(GPIO48), EXD3(GPIO49), EXD4(GPIO4A), EXD5(GPIO4B), EXD6(GPIO4C), EXD7(GPIO4D),  
EXD8(GPIO4E), EXD9(GPIO4F), EXD10(GPIO50), EXD11(GPIO51), EXD12(GPIO52), EXD13(GPIO53), EXD14(GPIO54),  
EXD15(GPIO55), EXA1(GPIO32), EXA2(GPIO33), EXA3(GPIO34), EXA4(GPIO35), EXA5(GPIO36), EXA6(GPIO37), EXA7(GPIO38),  
EXA8(GPIO39), EXA9(GPIO3A), EXA10(GPIO3B), EXA11(GPIO3C), EXA12(GPIO3D), EXA13(GPIO3E), EXA14(GPIO3F),  
EXA15(GPIO40), EXA16(GPIO41), EXA17(GPIO42), EXA18(GPIO43), EXA19(GPIO44), EXA20(GPIO45), NRD(GPIO17),  
NLBEXA0(GPIO16), NHBNWRH(GPIO31), NWRENWRL(GPIO30), SDRDATA0, SDRDATA1, SDRDATA2, SDRDATA3, SDRDATA4,  
SDRDATA5, SDRDATA6, SDRDATA7, SDRDATA8, SDRDATA9, SDRDATA10, SDRDATA11, SDRDATA12, SDRDATA13, SDRDATA14,  
SDRDATA15  
(20) NCS1(GPIO10), NCS0(GPIO06), XTALINFO1, XTALINFO0, SWDIO(GPIO59)  
(21) DOUT1(GPIO15), BCK1(GPIO13), MCLK0(GPIO18), LRCK1(GPIO14), BCK0(GPIO19), LRCK0(GPIO1A), DIN0(GPIO1B),  
DOUT0(GPIO1C), SCL1(GPIO2B), SDA1(GPIO2C), TCLKA0(GPIO00), TCLKB0(GPIO01), SDO0(GPIO1F), SCK0(GPIO1D),  
SCL0(GPIO07), SDI0(GPIO1E), SDA0(GPIO08), EXTINT2E(GPIO2E), EXTINT2F(GPIO2F), TXD2(GPIO0B), RXD2(GPIO0C),  
TIOCB00(GPIO02), SWDCLK(GPIO58), SDWP1(GPIO21), SDCD1(GPIO20), SDRADDR11(GPIO2D), SDRADDR12(GPIO2A),  
SDWP2(GPIO28), SDCD2(GPIO29)  
(22) SDCLK1(GPIO22), SDCMD1(GPIO23), SDAT13(GPIO27), SDAT12(GPIO26), SDAT11(GPIO25), SDAT10(GPIO24),  
SDCLK2(GPIO09), SDCMD2(GPIO0A), SDAT23(GPIO57), SDAT22(GPIO56), SDAT21(GPIO05), SDAT20(GPIO04), PSM_SCK,  
PSM_CS, PSM_SDI, PSM_SDO, PSM_DAT2, PSM_DAT3, BMODE0, BMODE1  
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(23) SDCMD0, SDAT03, SDAT02, SDAT01, SDAT00, SFCK(GPIO0D), SFDI(GPIO0E), SFDO(GPIO0F), SFWP(GPIO11),  
SFHOLD(GPIO12), TIOCB01(GPIO03)  
(24) LOUT(used as GPLOUT)  
(25) ROUT(used as GPROUT)  
(26) Keyint0, Keyint1, Keyint2  
(27) EXD0(GPIO46), EXD1(GPIO47), EXD2(GPIO48), EXD3(GPIO49), EXD4(GPIO4A), EXD5(GPIO4B), EXD6(GPIO4C), EXD7(GPIO4D),  
EXD8(GPIO4E), EXD9(GPIO4F), EXD10(GPIO50), EXD11(GPIO51), EXD12(GPIO52), EXD13(GPIO53), EXD14(GPIO54),  
EXD15(GPIO55), EXA1(GPIO32), EXA2(GPIO33), EXA3(GPIO34), EXA4(GPIO35), EXA5(GPIO36), EXA6(GPIO37), EXA7(GPIO38),  
EXA8(GPIO39), EXA9(GPIO3A), EXA10(GPIO3B), EXA11(GPIO3C), EXA12(GPIO3D), EXA13(GPIO3E), EXA14(GPIO3F),  
EXA15(GPIO40), EXA16(GPIO41), EXA17(GPIO42), EXA18(GPIO43), EXA19(GPIO44), EXA20(GPIO45), NRD(GPIO17),  
NLBEXA0(GPIO16), NHBNWRH(GPIO31), NCS1(GPIO10), NCS0(GPIO06), NWRENWRL(GPIO30), DOUT1(GPIO15),  
BCK1(GPIO13), MCLK0(GPIO18), LRCK1(GPIO14), BCK0(GPIO19), LRCK0(GPIO1A), DIN0(GPIO1B), XTALINFO1,  
DOUT0(GPIO1C), SCL1(GPIO2B), SDA1(GPIO2C), TCLKA0(GPIO00), TCLKB0(GPIO01), EXTINT2E(GPIO2E), EXTINT2F(GPIO2F),  
TXD2(GPIO0B), RXD2(GPIO0C), TIOCB00(GPIO02), XTALINFO0, SDO0(GPIO1F), SCK0(GPIO1D), SCL0(GPIO07), SDI0(GPIO1E),  
SDA0(GPIO08), SWDCLK(GPIO58), SDRADDR11(GPIO2D), SDRADDR12(GPIO2A), SDRDATA0, SDRDATA1, SDRDATA2,  
SDRDATA3, SDRDATA4, SDRDATA5, SDRDATA6, SDRDATA7, SDRDATA8, SDRDATA9, SDRDATA10, SDRDATA11, SDRDATA12,  
SDRDATA13, SDRDATA14, SDRDATA15, SDWP2(GPIO28), SDCD2(GPIO29)  
27.Set DAMPCTL register as below.  
DZCTL: DSLEEP = 1. (don’t care DSL value)  
- DZINP: DZINP13 = 1, other DZINPx = 0  
This DC characteristics can be applied while ClassD AMP used as GPO.  
PLL Characteristics  
PLL1 (System)  
Table 23. PLL1 (SYSTEM)  
Vdd1 (Note 28) = 0.95 to 1.155 V, AVddPLL1 (Note 28) = 0.95 to 1.155 V, T = −20°C to +65°C  
A
Item  
Symbol  
VCNT1  
Fmax  
Fmin  
Condition  
Min  
0
Typ  
Max  
Unit  
V
VCO control voltage  
AVddPLL1  
VCO highest oscillation frequency  
VCO lowest oscillation frequency  
400  
MHz  
MHz  
MHz  
100  
10  
Phase comparison frequency  
(Note 29)  
Fref  
PLL lock time (Note 29)  
Tlock1  
Internal loop filter  
0.61  
1.25  
10.1  
ms  
ms  
%
(Note 30)  
Fref = 1.0 MHz, 1.2 MHz  
Tlock2  
External loop filter  
(Note 30)  
Fref = 1.0 MHz, 1.2 MHz  
Jitter (Note 29)  
Jitter  
VCO frequency = 400 MHz  
5.94  
28.Power up and power down timing of AVddPLL1 and Vdd1 should be as close as possible.  
29.Electrical specifications are based on simulation results.  
30.PLL lock time and appropriate LPF circuit depend on phase comparison frequency (Fref).  
Table 24. PLL1 SETTING FOR XT1 OSCILLATION  
XT1 Frequency  
[MHz]  
VCO Frequency  
[MHz]  
PLL1  
Divide M  
PLL1  
Multiply N  
Phase Comparison  
Frequency Fref [MHz]  
12  
19.2  
24  
100 to 400  
100.8 to 399.6  
100 to 400  
12  
16  
24  
100 to 400  
84 to 333  
100 to 400  
1.0  
1.2  
1.0  
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Table 25. LOOP FILTER FOR PLL1  
R1[kW]  
R2[kW]  
PLL1  
Xtal  
C1[pF]  
C2[pF]  
(Note 31)  
(Note 31)  
multiply N  
(Note 31)  
(Note 31)  
Oscillation,  
Loop  
S3  
S2  
S1  
S0  
min  
1440  
1008  
698  
485  
338  
234  
163  
114  
80  
max  
-
typ  
typ  
typ  
typ  
Fref  
filter  
(Note 31)  
(Note 31)  
(Note 31)  
(Note 31)  
Internal  
XT1 = 12 MHz,  
Fref = 1.0 MHz  
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1439  
1007  
697  
484  
337  
233  
162  
113  
79  
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
XT1 = 19.2 MHz,  
Fref = 1.2 MHz  
1
1
XT1 = 24 MHz,  
Fref = 1.0 MHz  
0
0
0
0
1
55  
1
38  
54  
1
27  
37  
1
19  
26  
0
13  
18  
0
9
12  
0
-
8
0
External  
XT1 = 12 MHz,  
Fref = 1.0 MHz  
6.8  
330  
3300  
(Note 32)  
(Note 32)  
(Note 32)  
XT1 = 19.2 MHz,  
Fref = 1.2 MHz  
XT1 = 24 MHz,  
Fref = 1.0 MHz  
31.Regarding internal loop filter use, appropriate loop filter parameters need to be selected according to PLL1 multiply N value. Regarding  
external loop filter use, the loop filter parameters need to be attached externally.  
32.Each value must be supplied by external resistor and capacitor. Refer to PLL1 (System) in Application.  
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Audio PLL  
Table 26. AUDIO PLL  
Vdd1 (Note 33) = 0.95 to 1.155 V, AVddPLL2 (Note 33) = 0.95 to 1.155 V, T = −20°C to +65°C  
A
Item  
Symbol  
VCNT2  
Fmax  
Condition  
Min  
0
Typ  
Max  
Unit  
V
VCO control voltage  
AVddPLL2  
VCO highest oscillation  
frequency  
150  
MHz  
VCO lowest oscillation  
frequency  
Fmin  
Fref  
95  
10  
MHz  
MHz  
ms  
Phase comparison  
frequency (Note 34)  
PLL lock time  
(Note 34)  
Tlock1  
Internal loop filter  
15.4  
(Note 35)  
Fref = 96 KHz, 19.2 KHz, 768 KHz,  
153.6 KHz, 192 KHz, 38.4 KHz  
Tlock2  
External loop filter  
7.7  
ms  
(Note 35)  
Fref = 96 KHz, 19.2 KHz, 768 KHz,  
153.6 KHz, 192 KHz, 38.4 KHz  
Jitter (Note 34)  
Jitter1  
Jitter2  
Jitter3  
VCO frequency = 98.304 MHz  
VCO frequency = 135.4752 MHz  
VCO frequency = 147.456 MHz  
2.88  
3.41  
3.59  
4.9  
5.8  
6.1  
%
%
%
33.Power up and power down timing of AVddPLL2 and Vdd1 should be as close as possible.  
34.Electrical specifications are based on simulation results.  
35.PLL lock time and appropriate LPF circuit depend on phase comparison frequency (Fref).  
Table 27. PLL2 SETTING FOR XT1 OSCILLATION  
XT1 Frequency  
[MHz]  
VCO Frequency  
[MHz] (Note 36)  
Sampling  
PLL2  
Divide M  
PLL2  
Multiply N  
Phase Comparison  
Frequency Fref [KHz]  
Frequency Fs  
12  
98.304  
135.4752  
147.456  
8 KHz  
16 KHz  
125  
625  
125  
1024  
96  
19.2  
96  
32 KHz  
64 KHz  
128 KHz  
11.025 KHz  
22.05 KHz  
44.1 KHz  
88.2 KHz  
176.4 KHZ  
12 KHz  
7056  
1536  
24 KHZ  
48 KHz  
96 KHz  
192 KHz  
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Table 27. PLL2 SETTING FOR XT1 OSCILLATION (continued)  
XT1 Frequency  
[MHz]  
VCO Frequency  
[MHz] (Note 36)  
Sampling  
PLL2  
Divide M  
PLL2  
Multiply N  
Phase Comparison  
Frequency Fref [KHz]  
Frequency Fs  
19.2  
98.304  
135.4752  
147.456  
98.304  
8 KHz  
25  
128  
882  
192  
512  
3528  
768  
768  
153.6  
768  
16 KHz  
32 KHz  
64 KHz  
128 KHz  
11.025 KHz  
22.05 KHz  
44.1 KHz  
88.2 KHz  
176.4 KHZ  
12 KHz  
125  
25  
24 KHZ  
48 KHz  
96 KHz  
192 KHz  
8 KHz  
24  
125  
625  
125  
192  
16 KHz  
32 KHz  
64 KHz  
128 KHz  
11.025 KHz  
22.05 KHz  
44.1 KHz  
88.2 KHz  
176.4 KHZ  
12 KHz  
135.4752  
38.4  
147.456  
192  
24 KHZ  
48 KHz  
96 KHz  
192 KHz  
36.VCO frequency = 768×Fs×n (n = 16, 8, 4, 2, and 1)  
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Table 28. PLL2 SETTING FOR BCLK  
BCLK Frequency  
[MHz]  
VCO Frequency  
Sampling  
PLL2  
Divide M  
PLL2  
Multiply N  
Phase Comparison  
Frequency Fref [KHz]  
[MHz] (Note 37)  
Frequency Fs  
32Fs  
0.256  
98.304  
8 KHz  
16 KHz  
1
2
384  
384  
384  
256  
512  
512  
256  
352.8  
384  
0.512  
1.024  
2.048  
4.096  
0.3528  
0.7056  
1.4112  
2.8224  
5.6448  
0.384  
0.768  
1.536  
3.072  
6.144  
0.384  
0.768  
1.536  
3.072  
6.144  
0.5292  
1.0584  
2.1168  
4.2336  
8.4672  
0.576  
1.152  
2.304  
4.608  
9.216  
32 KHz  
4
64 KHz  
8
128 KHz  
11.025 KHz  
22.05 KHz  
44.1 KHz  
88.2 KHz  
176.4 KHZ  
12 KHz  
16  
1
135.4752  
147.456  
98.304  
2
4
8
16  
1
24 KHZ  
2
48 KHz  
4
96 KHz  
8
192 KHz  
8 KHz  
16  
1
48Fs  
384  
16 KHz  
2
32 KHz  
4
64 KHz  
8
128 KHz  
11.025 KHz  
22.05 KHz  
44.1 KHz  
88.2 KHz  
176.4 KHZ  
12 KHz  
16  
2
135.4752  
264.6  
4
8
16  
32  
2
147.456  
288  
24 KHZ  
4
48 KHz  
8
96 KHz  
16  
32  
192 KHz  
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Table 28. PLL2 SETTING FOR BCLK (continued)  
BCLK Frequency  
[MHz]  
VCO Frequency  
[MHz] (Note 37)  
Sampling  
PLL2  
Divide M  
PLL2  
Multiply N  
Phase Comparison  
Frequency Fref [KHz]  
Frequency Fs  
64Fs  
0.512  
98.304  
135.4752  
147.456  
8 KHz  
16 KHz  
2
4
384  
384  
384  
256  
352.8  
384  
1.024  
2.048  
32 KHz  
8
4.096  
64 KHz  
16  
32  
2
8.192  
128 KHz  
11.025 KHz  
22.05 KHz  
44.1 KHz  
88.2 KHz  
176.4 KHZ  
12 KHz  
0.7056  
1.4112  
2.8224  
5.6448  
11.2896  
0.768  
4
8
16  
32  
2
1.536  
24 KHZ  
4
3.072  
48 KHz  
8
6.144  
96 KHz  
16  
32  
12.288  
192 KHz  
37.VCO frequency = 768×Fs×n (n = 16, 8, 4, 2, and 1)  
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Table 29. LOOP FILTER FOR PLL2  
R1[kW]  
R2[kW]  
C1[pF]  
C2[pF]  
(Note 38)  
(Note 38)  
(Note 38)  
(Note 38)  
VCO  
Fref  
S3  
S2  
S1  
S0  
Loop  
filter  
XT1 or  
BCLK  
typ  
typ  
typ  
typ  
[MHz]  
[KHz]  
(Note 38)  
(Note 38)  
(Note 38)  
(Note 38)  
Internal  
XT1 =  
12 MHz  
98.304  
135.4752  
147.456  
98.304  
96  
19.2  
96  
0
1
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
0
1
0
1
0
1
0
1
0
1
0
0
0
0
0
0
0
0
0
1
0
0
1
1
1
1
0
0
0
1
1
1
1
1
1
1
1
1
1
0
0
0
0
1
0
1
1
1
1
1
1
1
1
1
1
XT1 =  
19.2 MHz  
768  
153.6  
768  
192  
38.4  
192  
256  
352.8  
384  
384  
264.6  
288  
256  
352.8  
384  
96  
135.4752  
147.456  
98.304  
XT1 =  
24 MHz  
135.4752  
147.456  
98.304  
BCLK =  
32Fs  
135.4752  
147.456  
98.304  
BCLK =  
48Fs  
135.4752  
147.456  
98.304  
BCLK =  
64Fs  
135.4752  
147.456  
98.304  
External  
XT1 =  
17.4  
348  
19100  
12 MHz  
(Note 39)  
(Note 39)  
(Note 39)  
135.4752  
147.456  
98.304  
19.2  
96  
XT1 =  
19.2 MHz  
768  
153.6  
768  
192  
38.4  
192  
5.97  
370  
20300  
(Note 39)  
(Note 39)  
(Note 39)  
135.4752  
147.456  
98.304  
XT1 =  
24 MHz  
12.3  
348  
19300  
(Note 39)  
(Note 39)  
(Note 39)  
135.4752  
147.456  
38.Regarding internal loop filter use, appropriate loop filter parameters must be selected according to this table. Regarding external loop filter  
use, the loop filter parameters need to be attached externally.  
39.Each value need to be supplied by external resistor and capacitor. Refer to PLL2 (Audio) in Application.  
External loop filter depends on XT1 frequency regardless of whether BCLK = 32 Fs, 48Fs, or 64 Fs is used in PLL2.  
Class−D AMP  
Table 30. CLASS−D AMP  
(AvddDAMPL = AVddDAMPR = 1.5 V, T = 25°C)  
A
Item  
Symbol  
condition  
Min  
Typ  
Max  
Unit  
On resistance  
Ron  
on resistance is set to minimum by  
register (Note 40)  
0.61  
2.57  
40.Set 0x3ff00 to Drivability set register DZINP in “DAMPCTL” described in the “Audio Functions User’s Manual”.  
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XTAL Characteristics  
Table 31. XTAL CHARACTERISTICS  
(Vdd1(Note 41) = 0.95 to 1.155 V, VddXT1 = 0.95 to 1.155 V, T = −20°C to +65°C)  
A
Item  
Symbol  
Min  
Typ  
Max  
Unit  
Frequency  
Fmax  
12  
24  
MHz  
41.Power up and power down timing of VddXT1 and Vdd1 should be as close as possible. Note that the oscillation frequency of XT1 that can  
be used with this product depends on the following table.  
Table 32. XT1 FREQUENCY  
Available Frequency of XT1 (n Means Available)  
12 MHz  
19.2 MHz  
24 MHz  
Other than the left  
Function to be Used  
All functions  
n
n
n
(Note 42)  
42.The frequencies of XT1 other than 12MHz, 19.2MHz, and 24MHz are not available, because some clock frequencies for PLL are determined  
internally based on the XTALINFO[1:0] terminal input during ROM boot.  
XTALINFO[1:0] terminal input may be set to a frequency  
of 12 MHz, 19.2 MHz, or 24 MHz.  
12bit ADC Converter Characteristic  
Table 33. 12BIT ADC CONVERTER CHARACTERISTIC  
(Vdd1 = 0.95 to 1.155 V, AVddADC = 1.70 to 1.95 V, T = −20°C to +65°C)  
A
Item  
Symbol  
AVDH  
AVDL  
SIN  
Condition  
Min  
1.70  
0
Typ  
Max  
Unit  
V
Pin applied  
AVddADC  
AVssADC  
SIN[7: 0]  
ADC power supply voltage  
ADC GND voltage  
Analog input voltage  
ADC resolution  
1.95  
V
AVDL  
AVDH  
12  
V
BIT  
Bit  
SIN[7: 0]  
ADC operating clock frequency  
(Note 43)  
Fclk  
fSPEED = 0 (Note 44)  
fSPEED = 1 (Note 44)  
16  
MHz  
MHz  
Cycle  
KS/s  
KS/s  
LSB  
LSB  
3.2  
ADC conversion time  
ADC sample rate  
Tc  
22  
Fs  
fSPEED = 0 (Note 44)  
fSPEED = 1 (Note 44)  
727  
145  
2
Differential Linearity Error (Note 43)  
Linearity Error (Note 43)  
DNL  
INL  
−2  
−3  
SIN[7: 0]  
SIN[7: 0]  
3
43.Electrical specifications are based on simulation results.  
44.Speed control bit in “ADC” described in the “System Functions User’s Manual ”.  
USB2.0 PHY Characteristics  
The USB−PHY supports the following standards.  
Universal Serial Bus Specification, Revision 2.0  
Battery Charging Specification, Revision 1.2 (ACA is not supported)  
On−The−Go and Embedded Host Supplement to the USB Revision 2.0 Specification, Revision 2.0 (ADP is not  
supported)  
XA and RB are available to Device only.  
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LC823455  
AC CHARACTERISTICS  
Reset  
[Condition]  
Vdd1 = 0.95 V to 1.155 V, Vdd2 = 1.7 V to 1.95 V or 2.7 V to 3.6 V, T = −20°C to +65°C  
A
External load 15 pF to 40 pF  
tRESW1  
NRES  
Figure 7. AC Characteristic − Reset  
Table 34.  
Item  
Resetting active period  
Symbol  
Condition  
Min  
Typ  
Max  
Unit  
tRESW1  
Time after Vdd* reaches to  
recommended operating voltage  
400  
s  
*Refer to the “INTC” chapter in the “System Functions User’s Manual” for more detail if using noise filter, etc.  
External Interrupt  
[condition]  
Vdd1 = 0.95 V to 1.155 V, Vdd2, VddSD1 = 1.7 to 1.95 V or 2.7 V to 3.6 V, T = 20°C to +65°C  
A
External load 15 pF to 40 pF  
tEXINTW  
EXTINTxx  
Figure 8. AC Characteristic − External Interrupt  
Table 35.  
Item  
Symbol  
Condition  
Min  
Typ  
Max  
Unit  
Pulse width of external interrupt  
tEXINTW  
Set of interruption factor not use noise  
filter function  
2
T
45.T: BASICCLK clock rate (frequency = Farm).  
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LC823455  
I2C  
[Condition]  
Vdd1 = 0.95 V to 1.155 V, Vdd2 = 1.7 V to 1.95 V or 2.7 V to 3.6 V, T = 20°C to +65°C  
A
External load 15 pF to 40 pF  
SDA  
tSU;DAT  
tf  
tr  
tf  
tHD;STA  
tr  
tBUF  
tLO  
W
SCL  
tHD;STA  
tSU;STA  
tSU;STO  
tHD;DAT  
tHIGH  
Figure 9. AC Characteristic − I2C  
Table 36.  
Standard mode  
Full mode  
Min  
0
Max  
100  
Min  
Max  
400  
Item  
Symbol  
fSCL  
Unit  
kHz  
s  
SCL frequency  
0
Hold time START (repetition) condition  
(After this period, the first clock pulse is generated.)  
tHD;STA  
4.0  
0.6  
Low period of SCL  
tLOW  
tHIGH  
4.7  
4.0  
4.7  
5.0  
1.3  
0.6  
0.6  
0
s  
s  
s  
s  
High period of SCL  
Setup time of repetition START condition  
tSU;STA  
tHD;DAT  
Data hold time:  
3.45  
0.9  
(for master in accordance with CBUS)  
Data setup time  
tSU;DAT  
Tr  
250  
1000  
300  
100  
300  
300  
ns  
ns  
ns  
s  
s  
Rise time SDA and SCL  
Fall time SDA and SCL  
Tf  
Setup time of STOP condition  
Time of bus release between STOP and START condition  
tSU;STO  
tBUF  
4.0  
4.7  
0.6  
1.3  
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LC823455  
SPI Interface  
[Condition]  
Vdd1 = 0.95 V to 1.155 V, Vdd2 = 1.7 V to 1.95 V or 2.7 V to 3.6 V, T = 20°C to +65°C  
A
External load 15 pF to 40 pF  
tSCK  
tSCKL  
tds  
tSCKH  
SCK0  
tdh  
SDI0  
SDO0  
tddo  
46.When the polarity of SCK is changed, SCK in this Figure is inverted.  
Figure 10. AC Characteristic − SPI Interface  
Table 37.  
Item  
Symbol  
tSCK  
tSCKL  
tSCKH  
tds  
min  
8
typ  
max  
unit  
T
SCLK rate  
SCLK LOW time  
SCLK HIGH time  
data setup time  
data hold time  
data delay time  
4
T
4
T
2
T
tdh  
2
T
tddo  
2
T
47.T: APB CLK rate (frequency = Fapb).  
Serial Flash Interface  
[Condition]  
Vdd1 = 0.95 V to 1.155 V, Vdd2 = 1.7 V to 1.95 V or 2.7 V to 3.6 V, T = 20°C to +65°C  
A
External load 6 to 30 pF  
Clock  
(from SoC)  
t
t
IH  
ISU  
Input  
(to SoC)  
Out put  
(from SoC)  
t
ODLY(min)  
t
ODLY(max)  
Figure 11. AC Characteristic − Serial Flash Interface  
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LC823455  
[Applied Pin]  
− Clock: SCK1  
− Output: SDI1, SDO1, SWP1, SHOLD1, QSCS  
− Input: SDI1, SDO1, SWP1, SHOLD1  
Table 38.  
I/O Voltage (Vdd2)  
2.7 V to 3.6 V  
1.7 V to 1.95 V  
12 pF to 26 pF / 10 mA  
6 pF to 12 pF / 8 mA  
23 pF to 30 pF / 8 mA  
10 pF to 23 pF / 4 mA  
External Load / I/O Drivability  
Item  
Symbol  
Min  
Max  
Min  
Max  
Unit  
SFIFSEL2 = 0 (Note 48)  
Clock frequency  
Input setup time  
Input hold time  
f
40  
40  
MHz  
ns  
clk  
t
4.5  
6.0  
1.0  
4.5  
6.0  
1.0  
ISU  
t
ns  
IH  
Output Delay time  
SFIFSEL2 = 1 (Note 48)  
Clock frequency  
Input setup time  
Input hold time  
t
t
5.5  
5.5  
ns  
ODLY  
f
clk  
42.5  
42.5  
MHz  
ns  
t
4.8  
7.0  
1.0  
4.8  
7.0  
1.0  
ISU  
t
ns  
IH  
ODLY  
Output Delay time  
6.8  
6.8  
ns  
48.SFIFSEL2 is the value of S−Flash I/F select register (SFIFSEL) bit2 described in “System Controller” described in the “System Functions  
User’s Manual”.  
XMC External Memory Bus Timing  
(For RA only)  
[Condition]  
Vdd1 = 0.95 V to 1.155 V, Vdd2 = 2.7 V to 3.6 V, T = 20°C to +65°C  
A
External load 15 pF to 40 pF  
External Memory Bus Read  
T
EXCYC  
PHI  
(BASIC clock)  
T
EXACC1  
EXA[20:1]  
T
EXACC2  
NCS0, NCS1,  
NHBNWRH,  
NLBEXA0  
T
T
EXACC3  
EXRSW  
NRD  
T
EXRDS  
T
EXRDH  
EXD[15:0]  
Figure 12. AC Characteristics − External Memory Bus Read Timing  
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LC823455  
External Memory Bus Write  
PHI  
(ARM AHB clock)  
T
EXWSSA  
T
EXWSH  
EXA[20 :1]  
NCS0, NCS1  
NHBNWRH,  
NLBEXA0  
T
T
EXWSH  
EXWSSCS  
T
EXWSW  
NWRENWRL  
T
T
EXWDH  
EXWDS  
EXD[15 :0]  
Figure 13. AC Characteristics − External Memory Bus Write Timing  
Table 39.  
Item  
Symbol  
Min  
Typ  
1T  
Max  
Unit  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
CPU clock cycle time  
Read data access time  
T
EXCYC  
T
13  
EXACC1  
T
Tacs + 13  
EXACC2  
T
Tacs + Tcos + 12  
EXACC3  
Read data setup time  
Read data hold time  
T
20  
EXRDS  
T
0
EXRDH  
Read strobe pulse width  
Write strobe pulse width  
Write address setup time  
Write strobe setup time  
Write strobe hold time  
Write data setup time  
Write data hold time  
T
Tpgwt + 1 T − 12  
Tpgwt − 1 T − 5  
Tacs + Tcos + 1 T − 10  
Tcos + 1 T − 5  
Tcoh + 1 T − 5  
Tpgwt − 1 T − 10  
Tcoh + 1 T − 10  
EXSW  
T
EXWSW  
T
EXWSSA  
T
EXWSSCS  
T
EXWSH  
T
EXWDS  
T
Tcoh + 1 T  
EXWDH  
49.T: BASIC clock rate (frequency = Farm).  
Regarding Tacs, Tcos, Tpgwt, Tcoh, refer to the “XMC” chapter in the “System Functions User’s Manual”.  
In write operation, even when Tpgwt (programmable wait register) = 0 or 1, equivalent to Tpgwt = 2.  
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LC823455  
SDRAM Interface  
(For RA only)  
[Condition]  
Vdd1 = 0.95 V to 1.155 V, Vdd2 = 1.7 V to 1.95 V or 2.7 V to 3.6 V, T = 20°C to +65°C  
A
External load 5 to 15 pF  
Clock  
t
t
IH  
ISU  
Input  
(to SoC)  
Output  
(from SoC)  
t
ODLY  
Figure 14. AC Characteristics − SDRAM Interface  
[Applied Pin]  
− Clock: SDRCLK  
− Output: SDRCKE, SDRCS, SDRWE, SDRCAS, SDRRAS, SDRDQM[1:0], SDRADDR[10:0], SDRBA[1:0],  
SDRDATA[15:0]  
− Input: SDRDATA[15:0]  
Table 40.  
I/O Voltage (Vdd2)  
External Load  
I/O Drivability  
2.7 V to 3.6 V  
8 mA  
1.7 V to 1.95 V  
8 mA  
5 pF to 15 pF  
Item  
Symbol  
Min  
Max  
52  
Min  
Max  
58  
Unit  
MHz  
ns  
Clock frequency  
Input set−up time  
Input hold−up time  
Output Delay time  
f
clk  
t
2.8  
1.8  
1.6  
2.8  
1.8  
1.6  
ISU  
t
IH  
ns  
t
3.4  
3.4  
ns  
ODLY  
50.Address becomes valid 1 cycle before the timing when CS becomes active. Address is stable while CS is active.  
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LC823455  
PSRAM Interface  
(For RA only)  
[Condition]  
Vdd1 = 0.95 V to 1.155 V, Vdd2 = 1.7 V to 1.95 V or 2.7 V to 3.6 V, T = 20_C to +65_C  
A
External load 6 to 30 pF  
Clock  
(from SOoC)  
tIH  
tISU  
Input  
(to SoC)  
Output  
(from SoC)  
tODLY(min)  
tODLY(max)  
Figure 15. AC Characteristics − PSRAM Interface  
[Applied Pin]  
− Clock: PSM_SCK  
− Output: PSM_SDI, PSM_SDO, PSM_DAT2, PSM_DAT3, PSM_CS  
− Input: PSM_SDI, PSM_SDO, PSM_DAT2, PSM_DAT3  
Table 41.  
I/O voltage (Vdd2)  
2.7V to 3.6V  
1.7V to 1.95V  
12pF to 26pF / 10mA  
6pF to 12pF / 8mA  
23pF to 30pF / 8mA  
10pF to 23pF / 4mA  
External load / I/O drivability  
Item  
Symbol  
Min  
Max  
52  
Min  
Max  
100  
Unit  
MHz  
ns  
Clock frequency  
Input setup time  
Input hold time  
Output Delay time  
f
clk  
3
t
4.12  
1.5  
2
7
ISU  
t
IH  
1.5  
2
ns  
t
7
ns  
ODLY  
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LC823455  
PCM Timing  
[Condition]  
Vdd1 = 0.95 V to 1.155 V, Vdd2 = 1.7 V to 1.95 V or 2.7 V to 3.6 V, T = 20°C to +65°C  
A
External load 5 pF to 15 pF  
Master Mode  
tBCKIL  
tBCKIH  
BCK  
DIN  
tDINS  
tDINH  
tLRCKO  
tDOUT  
LRCK  
DOUT  
Figure 16. Master Mode  
[Applied Pin]  
− Clock: BCK0, BCK1  
− Output: LRCK0, LRCK1, DOUT0, DOUT1  
− Input: DIN0, DIN1  
Table 42.  
I/O Voltage (Vdd2)  
2.7 V to 3.6 V  
1.7 V to 1.95 V  
8 pF to 15 pF / 8 mA  
5 pF to 8 pF / 4 mA  
8 pF to 15 pF / 8 mA  
5 pF to 8 pF / 4 mA  
External Load / I/O Drivability  
Item  
Symbol  
tBCKIL  
tBCKIH  
tDINS  
Min  
38.0  
38.0  
8.0  
Max  
Min  
38.0  
38.0  
8.0  
Mix  
Unit  
ns  
BCKI Low period  
BCKI High period  
DIN setup time  
DIN hold time  
ns  
ns  
tDINH  
9.0  
8.0  
ns  
LRCK delay time  
DOUT delay time  
tLRCKO  
tDOUT  
−13.0  
−13.0  
13.0  
13.0  
−11.5  
−11.5  
11.5  
11.5  
ns  
ns  
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LC823455  
Slave Mode  
tBCKIL  
tBCKIH  
BCK  
DIN  
tDINS  
tDINH  
tLRCKIH  
tLRCKIS  
LRCK  
DOUT  
tDOUT  
Figure 17. Slave Mode  
[Applied Pin]  
− Clock: BCK0, BCK1  
− Output: DOUT0, DOUT1  
− Input: LRCK0, LRCK1, DIN0, DIN1  
Table 43.  
I/O Voltage (Vdd2)  
2.7 V to 3.6 V  
1.7 V to 1.95 V  
8 pF to 15 pF / 8 mA  
5 pF to 8 pF / 4 mA  
8 pF to 15 pF / 8 mA  
5 pF to 8 pF / 4 mA  
External Load / I/O Drivability  
Item  
Symbol  
tBCKIL  
tBCKIH  
tDINS  
Min  
30.0  
30.0  
8.0  
Max  
Min  
30.0  
30.0  
8.0  
Max  
Unit  
ns  
BCKI Low period  
BCKI High period  
DIN setup time  
DIN hold time  
ns  
ns  
tDINH  
8.0  
8.0  
ns  
LRCK setup time  
LRCK hold time  
DOUT delay time  
tLRCKIS  
tLRCKIH  
tDOUT  
8.0  
8.0  
ns  
8.0  
8.0  
ns  
−13.0  
13.0  
−11.5  
11.5  
ns  
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LC823455  
SD Card Interface Timing  
[Condition]  
Vdd1 = 0.95 V to 1.155 V, Vdd2, VddSD1 = 1.7 V to 1.95 V or 2.7 V to 3.6 V, T = 20°C to +65°C  
A
External load 6 to 40 pF  
Normal (Default) Mode  
t
PP  
t
t
WH  
WL  
Clock  
(from SoC)  
t
t
TLH  
THL  
t
t
IH  
ISU  
Input  
(to SoC)  
Out put  
(from SoC)  
t
t
ODLY(min)  
ODLY(max)  
Figure 18. Normal (Default) Mode  
[Applied Pin]  
− Clock: SDCLK0, SDCLK1, SDCLK2  
− Output: SDCMD0, SDCMD1, SDCMD2, SDAT0[3:0], SDAT1[3:0], SDAT2[3:0]  
− Input: SDCMD0, SDCMD1, SDCMD2, SDAT0[3:0], SDAT1[3:0], SDAT2[3:0]  
Table 44.  
I/O Voltage (Vdd2, VddSD1)  
External Load / I/O Drivability  
2.7 V to 3.6 V  
12 pF to 40 pF / 10 mA  
6 pF to 12 pF / 8 mA  
Item  
Symbol  
Min  
Max  
25  
Unit  
MHz  
ns  
Clock Frequency  
Clock low time  
Clock high time  
Clock rise time  
Clock fall time  
f
PP  
0
10  
10  
t
t
WL  
ns  
WH  
TLH  
THL  
t
t
10  
10  
ns  
ns  
Input set−up time  
(from SD to SoC)  
t
5.9  
ns  
ISU  
Input hold−up time  
(from SD to SoC)  
t
0
ns  
ns  
IH  
Output Delay time during  
Data Transfer Mode  
(from SoC to SD)  
t
5.1  
14.0  
ODLY  
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LC823455  
High−Speed Mode  
t
PP  
t
t
WH  
WL  
Clock  
(from SoC)  
t
t
TLH  
THL  
t
t
IH  
ISU  
Input  
(to SoC)  
Out put  
(from SoC)  
t
t
ODLY(min)  
ODLY(max)  
Figure 19. High−Speed Mode  
[Applied Pin]  
− Clock: SDCLK0, SDCLK1, SDCLK2  
− Output: SDCMD0, SDCMD1, SDCMD2, SDAT0[3:0], SDAT1[3:0], SDAT2[3:0]  
− Input: SDCMD0, SDCMD1, SDCMD2, SDAT0[3:0], SDAT1[3:0], SDAT2[3:0]  
Table 45.  
I/O Voltage (Vdd2, VddSD1)  
External Load / I/O Drivability  
2.7 V to 3.6 V  
12 pF to 40 pF / 10 mA  
6 pF to 12 pF / 8 mA  
Item  
Symbol  
Min  
0
Max  
50  
Unit  
MHz  
ns  
Clock Frequency  
Clock low time  
Clock high time  
Clock rise time  
Clock fall time  
f
PP  
t
t
7
WL  
7
ns  
WH  
TLH  
THL  
t
t
3
ns  
3
ns  
Input set−up time  
(from SD to SoC)  
t
5.9  
ns  
ISU  
Input hold−up time  
(from SD to SoC)  
t
2.5  
ns  
ns  
IH  
Output Delay time  
(from SoC to SD)  
t
14.0  
2.0  
ODLY  
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LC823455  
SDR25 Mode  
t
PP  
Clock  
(from SoC)  
t
t
TLH  
THL  
t
t
IH  
ISU  
Input  
(to SoC)  
Out put  
(from SoC)  
t
t
ODLY(min)  
ODLY(max)  
Figure 20. SDR25 Mode  
[Applied Pin]  
− Clock: SDCLK0, SDCLK1, SDCLK2  
− Output: SDCMD0, SDCMD1, SDCMD2, SDAT0[3:0], SDAT1[3:0], SDAT2[3:0]  
− Input: SDCMD0, SDCMD1, SDCMD2, SDAT0[3:0], SDAT1[3:0], SDAT2[3:0]  
Table 46.  
I/O Voltage (Vdd2, VddSD1)  
1.7 V to 1.95 V  
23 pF to 30 pF / 8 mA  
15 pF to 23 pF / 4 mA  
10 pF to 15 pF / 2 mA  
External Load / I/O Drivability  
Item  
Symbol  
Min  
0
Max  
50  
Unit  
MHz  
ns  
Clock Frequency  
Clock rise time  
Clock fall time  
f
PP  
t
2.9  
2.9  
TLH  
THL  
t
ns  
Input set−up time  
(from SD to SoC)  
t
5.9  
ns  
ISU  
Input hold−up time  
(from SD to SoC)  
t
1.5  
0.9  
ns  
ns  
IH  
Output Delay time  
(from SoC to SD)  
t
17.0  
ODLY  
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LC823455  
SDR50 Mode  
t
PP  
Clock  
(from SoC  
t
t
TLH  
THL  
t
t
IH  
ISU  
Input  
(to SoC)  
Out put  
(from SoC)  
t
t
ODLY(min)  
ODLY(max)  
Figure 21. SDR50 Mode  
[Applied Pin]  
− Clock: SDCLK0, SDCLK1, SDCLK2  
− Output: SDCMD0, SDCMD1, SDCMD2, SDAT0[3:0], SDAT1[3:0], SDAT2[3:0]  
− Input: SDCMD0, SDCMD1, SDCMD2, SDAT0[3:0], SDAT1[3:0], SDAT2[3:0]  
Table 47.  
I/O Voltage (Vdd2, VddSD1)  
1.7 V to 1.95 V  
23 pF to 30 pF / 8 mA  
15 pF to 23 pF / 4 mA  
10 pF to 15 pF / 2 mA  
External Load / I/O Drivability  
Item  
Symbol  
Min  
0
Max  
57  
Unit  
MHz  
ns  
Clock Frequency  
Clock rise time  
Clock fall time  
f
PP  
t
2.9  
2.9  
TLH  
THL  
t
ns  
Input set−up time  
(from SD to SoC)  
t
8.0  
ns  
ISU  
Input hold−up time  
(from SD to SoC)  
t
1.4  
0.9  
ns  
ns  
IH  
Output Delay time  
(from SoC to SD)  
t
14.6  
ODLY  
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LC823455  
DDR50 Mode  
t
PP  
t
TLH  
Clock  
(from SoC)  
t
THL  
t
t
IH  
t
t
ISU  
ISU  
IH  
Input  
(to SoC)  
t
t
ODLY(min)  
ODLY(min)  
Out put  
(from SoC)  
t
t
ODLY(max)  
ODLY(max)  
Figure 22. DDR50 Mode  
[Applied Pin]  
− Clock: SDCLK0, SDCLK1, SDCLK2  
− Output: SDCMD0, SDCMD1, SDCMD2, SDAT0[3:0], SDAT1[3:0], SDAT2[3:0]  
− Input: SDCMD0, SDCMD1, SDCMD2, SDAT0[3:0], SDAT1[3:0], SDAT2[3:0]  
Table 48.  
I/O Voltage (Vdd2, VddSD1)  
1.7 V to 1.95 V  
23 pF to 30 pF / 8 mA  
15 pF to 23 pF / 4 mA  
10 pF to 15 pF / 2 mA  
External Load / I/O Drivability  
Item  
Symbol  
Min  
0
Max  
40  
Unit  
MHz  
ns  
Clock Frequency  
Clock rise time  
Clock fall time  
f
PP  
t
2.9  
2.9  
TLH  
THL  
t
ns  
Input set−up time  
(from SD to SoC)  
t
5.0  
ns  
ISU  
Input hold−up time  
(from SD to SoC)  
t
1.4  
0.9  
ns  
ns  
IH  
Output Delay time  
(from SoCI to SD)  
t
9.5  
ODLY  
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LC823455  
eMMC Interface Timing  
[Condition]  
Vdd1 = 0.95 V to 1.155 V, Vdd2, VddSD1 = 1.7 V to 1.95 V or 2.7 V to 3.6 V, T = 20°C to +65°C  
A
External load 6 to 40 pF  
Normal (Default) Mode  
t
PP  
t
TLH  
Clock  
(from SoC)  
t
THL  
t
t
IH  
t
t
IH  
ISU  
ISU  
Input  
(to SoC)  
t
t
ODLY(min)  
ODLY(min)  
Out put  
(from SoC)  
t
t
ODLY(max)  
ODLY(max)  
Figure 23. Normal (Default) Mode  
[Applied Pin]  
− Clock: SDCLK0, SDCLK1, SDCLK2  
− Output: SDCMD0, SDCMD1, SDCMD2, SDAT0[3:0], SDAT1[3:0], SDAT2[3:0]  
− Input: SDCMD0, SDCMD1, SDCMD2, SDAT0[3:0], SDAT1[3:0], SDAT2[3:0]  
Table 49.  
I/O Voltage (Vdd2, VddSD1)  
2.7 V to 3.6 V  
1.7 V to 1.95 V  
23 pF to 30 pF / 8 mA  
15 pF to 23 pF / 4 mA  
10 pF to 15 pF / 2 mA  
12 pF to 40 pF / 10 mA  
6 pF to 12 pF / 8 mA  
External Load / I/O Drivability  
Item  
Symbol  
Min  
0
Max  
26  
Min  
0
Max  
26  
Unit  
MHz  
ns  
Clock Frequency  
Clock low time  
Clock high time  
Clock rise time  
Clock fall time  
f
t
PP  
10  
10  
10  
10  
WL  
t
ns  
WH  
t
t
3
3
ns  
TLH  
THL  
3
3
ns  
Input set−up time  
(from SD to SoC)  
t
11.5  
11.5  
ns  
ISU  
Input hold−up time  
(from SD to SoC)  
t
9.0  
9.0  
ns  
ns  
IH  
Output Delay time  
(from SoC to SD)  
t
10.0  
27.5  
10.0  
27.5  
ODLY  
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LC823455  
High−Speed SDR Mode  
t
PP  
t
t
WH  
WL  
Clock  
(from SoC)  
t
t
TLH  
THL  
t
t
IH  
ISU  
Input  
(to SoC)  
Out put  
(from SoC)  
t
t
ODLY(min)  
ODLY(max)  
Figure 24. High−Speed SDR Mode  
[Applied Pin]  
− Clock: SDCLK0, SDCLK1, SDCLK2  
− Output: SDCMD0, SDCMD1, SDCMD2, SDAT0[3:0], SDAT1[3:0], SDAT2[3:0]  
− Input: SDCMD0, SDCMD1, SDCMD2, SDAT0[3:0], SDAT1[3:0], SDAT2[3:0]  
Table 50.  
I/O Voltage (Vdd2, VddSD1)  
2.7 V to 3.6 V  
1.7 V to 1.95 V  
23 pF to 30 pF / 8 mA  
15 pF to 23 pF / 4 mA  
10 pF to 15 pF / 2 mA  
12 pF to 40 pF / 10 mA  
6 pF to 12 pF / 8 mA  
External Load / I/O Drivability  
Item  
Symbol  
Min  
0
Max  
52  
Min  
0
Max  
52  
Unit  
MHz  
ns  
Clock Frequency  
Clock low time  
Clock high time  
Clock rise time  
Clock fall time  
f
t
PP  
7
7
WL  
t
7
7
ns  
WH  
t
t
3
3
ns  
TLH  
THL  
3
3
ns  
Input set−up time  
(from SD to SoC)  
t
5.4  
5.4  
ns  
ISU  
Input hold−up time  
(from SD to SoC)  
t
3.0  
3.0  
3.0  
3.0  
ns  
ns  
IH  
Output Delay time  
(from SoC to SD)  
t
16.1  
16.1  
ODLY  
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High−Speed DDR Mode  
tPP  
tTLH  
Clock  
(from SoC)  
tTHL  
tISU tIH  
tISU tIH  
Input  
(to SoC)  
tODLY(min)  
tODLY(min)  
Output  
(from SoC)  
tODLY(max)  
tODLY(max)  
Figure 25. High−Speed DDR Mode  
[Applied Pin]  
− Clock: SDCLK0, SDCLK1, SDCLK2  
− Output: SDCMD0, SDCMD1, SDCMD2, SDAT0[3:0], SDAT1[3:0], SDAT2[3:0]  
− Input: SDCMD0, SDCMD1, SDCMD2, SDAT0[3:0], SDAT1[3:0], SDAT2[3:0]  
Table 51.  
I/O Voltage  
(Vdd2, VddSD1)  
2.7 V to 3.6 V  
1.7 V to 1.95 V  
23 pF to 30 pF / 8 mA  
15 pF to 23 pF / 4 mA  
10 pF to 15 pF / 2 mA  
12 pF to 40 pF / 10 mA  
6 pF to 12 pF / 8 mA  
External Load / I/O Drivability  
Item  
Clock Frequency  
Clock rise time  
Clock fall time  
INPUT CMD  
Symbol  
Min  
0
Max  
30  
3
Min  
0
Max  
33  
3
Unit  
MHz  
ns  
f
PP  
t
TLH  
THL  
t
3
3
ns  
Input set−up time  
(from SD to SoC)  
t
19.5  
2.4  
16.4  
2.4  
ns  
ns  
ISU  
Input hold−up time  
(from SD to SoC)  
t
IH  
OUTPUT CMD  
Output Delay time  
(from SoC to SD)  
t
3.0  
29.0  
3.0  
26.0  
ns  
ODLY  
INPUT DAT  
Input set−up time  
(from SD to SoC)  
t
9.6  
1.4  
8.1  
1.4  
ns  
ns  
ISU  
Input hold−up time  
(from SD to SoC)  
t
IH  
OUTPUT DAT  
Output Delay time  
(from SoC to SD)  
t
2.5  
14.1  
2.5  
12.6  
ns  
ODLY  
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Digital Mic Timing  
[Condition]  
Vdd1 = 0.95 V to 1.155 V, Vdd2 = 1.7 V to 1.95 V or 2.7 V to 3.6 V, T = 20°C to +65°C  
A
External load 15 pF to 40 pF  
tCY  
DMCKO  
tSU  
tHLD  
tSU  
tHLD  
DMDIN  
Figure 26. Digital Mic Timing  
[Applied Pin]  
− Clock: DMCKO0, DMCKO1  
− Input: DMDIN0, DMDIN1  
Table 52.  
Item  
Period of clock cycle (Note 51)  
Clock duty  
Symbol  
Min  
Typ  
Max  
3.25  
40:60  
Unit  
tCY  
MHz  
60:40  
40  
Data setup time  
tSU  
ns  
ns  
Data hold time  
tHLD  
0
51.Internal clock and register setting.  
UART Timing  
[Condition]  
Vdd1 = 0.95 V to 1.155 V, Vdd2= 1.7 V to 1.95 V or 2.7 V to 3.6 V, T = 20°C to +65°C  
A
External load 10 pF to 30 pF (Vdd2 = 1.7 V to 1.95 V), 10 pF to 40 pF (Vdd2 = 2.7 V to 3.6 V)  
CTS Timing  
End of the last Stop Bit  
Tsetupcts  
Tdlycts  
CTS1  
TXD1  
Parity  
bit  
Start  
bit  
Stop  
Stop  
D0  
D1  
D2  
D3  
D4  
D5  
D6  
D5  
D7  
D6  
bit1  
bit2  
Parity  
bit  
Stop  
bit  
D7  
CTS timing  
Figure 27. CTS Timing  
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LC823455  
[Applied Pin]  
− Input: CTS1  
− Output: TXD1  
Table 53.  
Item  
Condition  
Symbol  
Min  
Max  
Unit  
Delay time  
Completing preparation to transmit the current  
TXD data by setting registers at CTS1 = high  
Tdlycts  
6T+20  
ns  
From the negative edge  
CTS Setup time  
From end of the last StopBit  
Tsetupcts  
3T+20  
ns  
(not to transmit the next TXD data)  
52.T: UART functional clock rate  
53.In using hardware flow control by CTS/RTS, if the CTS setup time above is NOT met, the next TXD data will be transmitted at the time of  
having prepared it regardless of the CTS level.  
RTS Timing  
End of the last Stop Bit  
1.5Bit  
start  
bit  
stop  
bit1  
stop  
bit2  
parity  
bit  
D0  
D1  
D0  
D2  
D1  
D3  
D2  
D4  
D3  
D5  
D4  
D6  
D5  
D7  
D6  
RXD1  
start  
bit  
stop  
bit  
parity  
bit  
D7  
Tdlyrts  
RTS1  
RTS timing  
Figure 28. RTS Timing  
[Applied Pin]  
− Input: RXD1  
− Output: RTS1  
Table 54.  
Item  
Condition  
Symbol  
Min  
Max  
Unit  
Delay Time  
Receiving the current RXD data with 15 bytes of data existing in the  
Reception FIFO or Receiving the current RXD data without using  
Reception FIFO  
Tdlyrts  
4T+20  
ns  
From 1.5 bits before the end of the last StopBit  
54.T: UART functional clock rate  
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LC823455  
APPLICATION  
XTAL  
For oscillation  
XIN  
XOUT  
R2  
R1  
C1  
C2  
Figure 29. For Oscillation  
Table 55.  
XT1  
XTRTC  
XIN1/XOUT1  
XIN32K/XOUT32K  
Symbol  
24MHz  
32.768 KHz  
Example of  
RIVER ELETEC  
FCX−07L  
RIVER ELETEC  
TFX−03  
crystal device  
R1  
R2  
C1  
C2  
Open  
0 ꢀ  
10 Mꢀ  
0 ꢀ  
10pF  
10pF  
18pF  
18pF  
55.Optimize the circuit constant for each product when you use this oscillation cell and ask to the manufacturer of the crystal device to investigate  
(matching investigation) because the best circuit constant changes depending on the specification of the crystal device used and the ambient  
surrounding (parasitic capacitance etc. of an external substrate).  
56.The part values are for reference only. Adjustments may be required depending on the specific setup.  
57.The following may be needed as the anti−noise measures of oscillation circuit.  
− Components should be as adjacent as possible, with shortened wiring between elements such as this SoC and the crystal device.  
− GND of the oscillation circuit should be as close as possible to GND (VSS) of this SoC.  
− Do not bring the wiring pattern of the large current drive close to the oscillation circuit.  
Take wide pattern to avoid the effect of interference of other signals.  
For input from external clock source (XT1)  
Do as follows when using the external clock signal that is generated outside of the SoC by the oscillation module, etc. XT1  
can be connected to an external clock signal that is generated outside of the SoC using the circuit shown in Figure 30. However,  
XTRTC cannot be connected to an external clock source.  
XIN  
XOUT  
Left open  
Clock input  
NOTE: Input the signal of full amplitude to XIN (external clock input).  
Figure 30. For Input from External Clock Source (XT1)  
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Table 56.  
Item  
Symbol  
min  
max  
unit  
H level input voltage  
(Note 58)  
V
IH  
VddXT1× 0.8  
VddXT1 + 0.3  
V
L level input voltage  
(Note 58)  
V
IL  
−0.3  
VddXT1 × 0.25  
V
58.There is no VIH/VIL specification at the input part of the xtal oscillator cell. The values are for reference when using external clock source.  
There is a possibility of influencing the signal quality  
when there is a long wire pattern on a circuit board of  
XOUT (The terminal opens). Therefore, recommend to  
cut the wire pattern on a circuit board or no wire pattern  
on it  
The xtal oscillator is supposed to be used with quartz  
resonator or ceramic resonator, we have no plan to  
evaluate this SoC in case of input from external clock  
source  
PLL1(System)  
The configuration of the PLL1 circuit is shown below.  
Decoupling capacitors must be placed as close as possible  
to the power terminals (AVddPLL1 and AVssPLL1) of this  
SoC.  
The power supply of PLL1 should be separated from other  
power supply lines to eliminate noise.  
When using an Internal Loop Filter  
VCNT1 must be open in this case.  
When using an External Loop Filter  
Refer to Table 25 for the recommended values of R2, C1,  
and C2.  
This SoC  
This SoC  
Figure 31. PLL1(System) for Internal Loop Filter  
Figure 32. PLL1(System) for External Loop Filter  
59.The part values are for reference only. Adjustments may be required depending on the specific setup.  
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PLL2(Audio)  
The configuration of the PLL2 circuit is shown below.  
Decoupling capacitors must be placed as close as possible  
to the power terminals (AVddPLL2 and AVssPLL2) of this  
SoC.  
The power supply of PLL2 should be separated from other  
power supply lines to eliminate noise.  
When using an Internal Loop Filter  
VCNT2 must be open in this case.  
When using an External Loop Filter  
Refer to Table 29 for the recommended values of R2, C1,  
and C2.  
This SoC  
This SoC  
Figure 33. PLL2(Audio) for Internal Loop Filter  
Figure 34. PLL2(Audio) for External Loop Filter  
60.The part values are for reference only. Adjustments may be required depending on the specific setup.  
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12bit AD converter  
The configuration of the ADC circuit is shown below.  
You should supply clean Power and Ground to AVddADC  
Power supply decoupling should be done according to the  
figure below. At least the 0.1 F capacitor should be ceramic  
(good quality), and must be placed as close as possible to this  
SoC.  
and AVssADC.  
This SoC  
Figure 35. 12bit AD Converter  
61.It is important that the wiring resistance is accurate in order to achieve the correct ADC conversion result. Also, pay attention to  
maintaining low noise.  
62.Unused input pins of SIN[0−7] should be directly connected to AVssADC.  
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USB2.0 PHY  
The configuration of the USB−PHY circuit is shown below.  
USB Device  
This SoC  
Figure 36. USB 2.0 PHY in Device  
USB Host  
Figure 37. USB 2.0 PHY in Host  
Please refer to the “LC823455 USB2.0 Application  
Design Guideline” for details.  
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Class−D AMP  
The configuration of the Class−D AMP circuit is shown  
below.  
Single−End Form  
Power  
+
220F or  
more  
0.1F  
AVddDAMPL  
This SoC  
L
0.1F  
220F  
Rd  
Headphone Lch  
Ron  
+
LOUT  
(16)  
Ipk(Irms)  
C
10kꢀ  
AVssDAMPL  
AVddDAMPR  
Mute  
Nch Power  
FET  
0.1F  
L
220F  
Rd  
Headphone Rch  
Ron  
+
(16)  
ROUT  
C
10kꢀ  
Ipk(Irms)  
AVssDAMPR  
Mute  
Nch Power  
FET  
Figure 38. Class−D AMP in Single−End Form  
BTL Form  
Power  
+
47F or  
more  
0.1F  
AVddDAMPL  
This SoC  
L
0.1F  
Rd  
Ron  
LOUT  
Headphone  
C
Ipk(Irms)  
(16)  
AVssDAMPL  
AVddDAMPR  
0.1F  
L
Rd  
Ron  
ROUT  
C
AVssDAMPR  
Figure 39. Class−D AMP in BTL Form  
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LCR Filter Example  
L (mH)  
220  
C (mF)  
0.22  
1
Rd (W)  
0 − 10  
5 − 10  
Type A  
Type B  
47  
63.Rd doesnt include parasitic resistance of L.  
64.Add a bypass condenser (0.1 μF) between AVddDAMPL and AVssDAMPL, AVddDAMPR and AVssDAMPR as close as possible to the  
terminals  
65.Add a large electrolyte capacitor (220μF or more recommended) to AVddDAMPL, AVddDAMPR terminal for Single−End form to reject the  
noise and reduce the pumping phenomenon of Class−D AMP.  
66.Check the voltage level of AVddDAMPL, AVddDAMPR and make sure not to exceed 1.65 V (recommended operating voltage) by using  
playback of 20 Hz, 0db (full scale) sine wave  
67.Resistor Rd reduces the output level of Class−D AMP, and is related to the values of L and C used. Please choose a resistance value (Rd)  
to fit the actual system. Please note that Rd value must be determined based on the parasitic resistance of the inductor L.  
68.While the Class−D AMP outputs LOUT and ROUT are used as GPO, the maximum supply voltage to AVddDAMPL and AVddDAMPR is  
1.95 V. In this case, the LC filter cannot be connected to LOUT and ROUT to avoid damage from overvoltage via the pumping phenomenon.  
Power Supply  
Class−D AMP power supply to (AVddDAMPL,  
AVddDAMPR) must use a transient response and good  
power supply. When using a power supply where the  
transient response is bad and the capacity of the capacitor is  
small, a peculiar pumping phenomenon to the Class−D AMP  
is generated. The power supply voltage must not exceed the  
recommended operating range when the pumping  
phenomenon occurs.  
The Class−D AMP output is PWM. The power supply  
noise affects the output of the Class−D AMP.  
Power sources which have large internal impedance such  
as dry cell should not be directly connected to the power  
supply of the Class−D AMP, and those which have large  
switching noise such as switching regulator are not suitable  
and need to be taken care of.  
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Digital Mic  
The configuration of the Digital Mic circuit is shown  
below.  
Digital  
Mic  
R−ch  
config  
This SoC  
DMCKO 0A  
DMCKO 0B)  
(DMCKO 1)  
Digital  
Mic  
(
L−ch  
config  
DMDIN 0A  
(DMDIN 0B)  
(DMDIN 1)  
Figure 40. Digital Mic Configuration  
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LC823455  
I2C  
The configuration of the I2C circuit is shown below.  
Power  
(* 1)  
Appropriate resistor value depends on the communication speed  
Refer to the I2C specification for the calculation of resistor value.  
This SoC  
(* 1)  
2 kꢀ  
2 kꢀ  
I2C −device  
SCL0  
SCL  
(SCL1)  
SDA0  
SDA  
(SDA1)  
I2C −device  
SCL  
SDA  
Figure 41. I2C Configuration  
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LC823455  
S−Flash I/F  
The configuration of the S−Flash I/F circuit is shown  
below.  
Power  
* SFQSCS is pulled up internally after hard reset  
(The use of the pull−up resistor can be switched off using a register setting.)  
This SoC  
Vdd2  
power  
Serial flash memory  
GPIO03(SFQSCS)  
CS  
SFCK  
SFDI(QIO0)  
SCLK  
SI(SIO0)  
WP(SIO2)  
SFWP(QIO2)  
SFHOLD(QIO3)  
HOLD(SIO3)  
SO(SIO1)  
SFDO(QIO1)  
Vss2  
*
Signals name in parenthesis is name during 4 bit mode  
Figure 42. S−Flash I/F Circuit  
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LC823455  
RTC  
The configuration of the RTC circuit is shown below.  
General RTC  
VddRTC  
Voltage detector  
This SoC  
VddRTC  
VDET  
Detect drop  
of VddRTC  
Vdd1  
Voltage detector  
Vdd2  
BACKUPB  
Detect drop of  
Vdd1 and Vdd2  
power  
RTCINT  
VssRTC  
Timer event output  
Usage) Release sleep and power on  
Figure 43. Configuration of the General RTC  
KEYINT RTC  
VddRTC  
Voltage detector  
This SoC  
VddRTC  
VDET  
Detect drop  
of VddRTC  
Vdd1  
Voltage detector  
Vdd2  
BACKUPB*  
KEYINT[2:0]  
Detect drop of  
Vdd1 and Vdd2  
Wakeup event input  
(Any key inputs, VBUS input, etc)  
power  
Connet to enable of  
Regulator  
RTCINT(PWRON)  
VssRTC  
*XA (WLP120) has no BACKUPB terminal, which is connected to VDET internally.  
Figure 44. Configuration of the KEYINT RTC  
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LC823455  
JTAG  
The configuration of the JTAG debug circuit for  
LPDSP32 is shown below.  
This SoC  
* The LPDSP32 can be reset by a JTAG software reset  
JTAG  
Connector  
command issued by the debugger as well as the JTAG  
hardware reset signal (TRST). Therefore, the connec-  
tion of the JTAG hardware reset signal between the de-  
bugger and the SoC is not mandatory.  
TCK  
TMS  
TDI  
TCK  
* Internal pull down resistor can be used if they are en-  
abled before the reset release of LPDSP 32.  
TMS  
TDI  
* The input JTAG signals must be pulled up or down to  
avoid being left floating if the JTAG function is not being  
used.  
* For further information about connecting JTAG sig-  
nals, refer to the reference circuit provided by your ICE  
tool vendor.  
TDO  
TDO  
Figure 45. JTAG Interface for LPDSP32  
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LC823455  
SWD  
The configuration of the SWD debug circuit for  
Cortex−M3 is shown below.  
This SoC  
SWD  
Connector  
SWDCLK  
SWDIO  
SWDCK  
Vdd2  
* pull up and pull down can be implemented using  
internal registers.  
SWDIO  
SDO  
* Regarding SWD connecter signal, refer to the  
document about ICE tool.  
SWO  
NRES  
nSRST  
Vdd2  
R
C
nRESET  
(OpenDrain )  
R,C value should be determined based on  
the NRES input timing requirement  
Figure 46. SWD Interface for Cortex−M3  
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LC823455  
BMODE[1: 0]  
The configuration of the BMODE circuit is shown below.  
Power  
or  
ground  
power  
This SoC  
1 kꢀ  
or  
470 kꢀ  
Vdd 2  
BMODE  
BMODE  
* Do not connect capacitance to the BMODE  
pins, and avoid long wiring patterns on the board.  
These two factors can cause incorrect signal lev-  
els to be assigned on BMODE.  
0
1
1 kꢀ  
or  
470 kꢀ  
Vss  
Power or ground  
Figure 47. BMODE Configuration  
POWER SUPPLY  
Don’t raise power supply steeply.  
This SoC has circuits to protect from electrostatic  
discharge. The rush current flows in accordance with  
the steepness of rising curve of power supply.  
Place bypass capacitors at each point closest to each  
power supply terminal, and place a power circuit at the  
point closest to the power supply terminals which it can  
supply.  
www.onsemi.com  
101  
LC823455  
INTERNAL POWER DOMAIN CONTROL  
This SoC has fifteen power isolated region of internal core  
for leakage current reduction, these can be power supply  
OFF separately. Power isolated region PD−X (X means one  
of the fifteen region PD 1 to J) described in the table below.  
Power ON / OFF for each power domain is controlled by  
the appropriate bit of System Controller of the power control  
register (LSISTBY). However, when controlling the power  
control register (LSISTBY), you must also control the  
ISOLATION control register (ISOCNT) as required. Please  
refer to the “System Controller” chapter in the “System  
Functions User’s Manual” for details.  
Each power domain and its contents, along with the  
corresponding flags in the power control register  
(LSISTBY) and ISOLATION control register (ISOCNT) is  
as follows.  
Table 57.  
Name  
Content  
LSISTBY  
Bit17 STBY1  
ISOCNT  
Bit17 ISOCNT1  
PD−1  
PD-2  
PD-3  
PD-4  
PD-5  
PD-6  
PD-7  
PD-8  
PD-9  
PD-10  
PD−A  
PD−E  
PD−G  
PD−H  
PD−J  
Internal ROM  
Internal SRAM(seg 0B)  
Internal SRAM(seg 1)  
Internal SRAM(seg 2)  
Internal SRAM(seg 3/4)  
Internal SRAM(seg 5A)  
Internal SRAM(seg 5B)  
Internal SRAM(seg 6)  
Internal SRAM(seg 7B)  
Internal SRAM(seg 7A/8/9)  
Audio Block  
Bit18 STBY2  
Bit19 STBY3  
Bit20 STBY4  
Bit21 STBY5  
Bit22 STBY6  
Bit23 STBY7  
Bit24 STBY8  
Bit25 STBY9  
Bit26 STBY10  
Bit0 STBYA  
Bit4 STBYE  
Bit6 STBYG  
Bit7 STBYH  
Bit9 STBYJ  
Bit18 ISOCNT2  
Bit19 ISOCNT3  
Bit20 ISOCNT4  
Bit21 ISOCNT5  
Bit22 ISOCNT6  
Bit23 ISOCNT7  
Bit24 ISOCNT8  
Bit25 ISOCNT9  
Bit26 ISOCNT10  
Bit0 ISOCNTA  
Bit4 ISOCNTE  
Bit6 ISOCNTG  
Bit7 ISOCNTH  
Bit9 ISOCNTJ  
USB 2.0 Controller SRAM  
Cache for S−Flash I/F  
SD Card I/F  
USB 2.0 PHY  
www.onsemi.com  
102  
LC823455  
Recommendation  
POWER SUPPLY SEQUENCE  
The recommended basic sequence for powering on/off of  
the power supply lines is as follows. (Simultaneous power  
on/off is acceptable)  
To ensure system stability, the power supply lines must be  
powered on/off in a specific sequence, based on the power  
supply group they are in, as described in this section.  
Power on:  
Power Supply Groups  
The power supply lines of the SoC can be grouped as  
follows:  
Vdd*(Internal) −> Vdd*(IO) −> Vsig(Signal)  
Power off:  
Vsig(Signal) −> Vdd*(IO) −> Vdd*(Internal)  
1. Vdd*(Internal) – Internal core, analog power  
supply  
NOTE:  
(1 V power supply)  
Vdd1, VddXT1, AVddPLL1, AVddPLL2,  
DVddUSBPHY1  
During power on, the sequence of Vdd*(Internal) −>  
Vdd*(IO) causes a SoC hard reset which prevents IO  
glitches. Powering on the Vdd*(IO) lines while the  
Vdd*(Internal) lines are powered off may generate glitches  
on the IO signals and the flow of through current. It is  
recommended that you follow the sequence above in order  
to avoid this. In addition, Vsig(Signal) means voltage  
appearance of IO signals.  
2. Vdd*(IO) – External IO power supply  
(1.8 V / 3 V power supply)  
Vdd2, VddSD1, AVddUSBPHY2,  
AVddUSBPHY18, AVddADC, AVddDAMPL,  
AVddDAMPR  
3. VddRTC – The RTC power supply  
(This is a dedicated power supply line whose  
on/off sequence is described separately in the next  
section)  
In the Vdd*(IO) group, the power on sequence for the  
USB PHY must occur in the order AVddUSBPHY18 −>  
AVddUSBPHY2, while the power off sequence must occur  
in the order AVddUSBPHY2 −> AVddUSBPHY18.  
RTC has its own dedicated power supply and power on/off  
sequence which is described in the following section.  
www.onsemi.com  
103  
LC823455  
RTC Terminal Control Sequence  
A power supply sequence and other terminal control  
sequence of RTC are described as follows.  
voltage of Vdd1 and Vdd2 power supply, and set  
BACKUPB to Low which isolates the VddRTC Domain  
from the Vdd1 Domain.  
Moreover, to power off the RTC domain as well, it is  
necessary to detect the drop in the voltage of the VddRTC  
power supply, and set VDET to Low. (The RTC operation  
stops).  
General RTC mode (RTCMODE = 1)  
To power off the domains other than the RTC domain (The  
only RTC works), it is necessary to detect the drop in the  
Vdd2  
2.7V  
Vdd2  
1 & 2 is a reset condition of the  
internal logic circuit.  
Min 0ns  
Please refer to AC Characteristics :  
Reset chapter about the period  
when you should meet these2  
conditions.  
1
NRES  
0.2 * Vdd2  
VddRTC  
VddRTC  
Vdd1  
Vdd1  
0.95V  
2
Min 0ns  
Min 0ns  
BACKUPB  
0.2 * VddRTC  
VDET  
0.2 * VddRTC  
XIN32K  
Figure 48. Timing Sequence for General RTC Mode  
www.onsemi.com  
104  
LC823455  
(Reference: Internal control logic for isolation based on BACKUPB)  
ALL OUTPUT  
ALL INPUT  
Vdd1 Domain  
VddRTC Domain  
ALL INPUT  
ALL OUTPUT  
BACKUPB  
Note: Vdd1 can be shut down while BACKUPB = low  
Figure 49. Internal Control Logic for Isolation  
www.onsemi.com  
105  
LC823455  
Keyint RTC Mode (RTCMODE = 0)  
source. Either the KEYINT input or the internal RTCINT  
signal can generate the power on sequence.  
When powering off RTC, it is necessary to detect the drop  
in the voltage of the VddRTC power supply, and set VDET  
to Low. (The RTC operation stops).  
Using a master command from Cortex−M3, the internal  
sequencer of the RTC controls the operation of BACKUPB  
for isolation and power off. The power off sequence using  
the BACKUPB terminal can also be activated by an external  
S0  
INIT  
Wait for  
Xtal  
S1  
S2  
S3  
Wait for  
Vdd1  
Power ON  
VDET  
PWRON  
NOP  
(RTCINT=HiZ)  
oscillation  
S8  
S4  
ISOLATOR off  
Wait for  
KEYINT or  
Sequencer runs on XIN32K  
and makes state transition  
Internal RTCINT  
S7  
S6  
S5  
if  
RTCMASTER  
ISOLATOR  
on  
Release CortexM3 Core0 reset  
Wait for RTC master command  
PWROFF  
(RTCINT=L)  
XIN32K  
STATE(Internal)  
VDET  
S0 S1 S2 S3  
S4 S5  
S5 S6 S7 S8  
S1  
RTCINT  
(PWRON)  
ISOLATOR control  
(Internal1:off 0:on)  
32kHz clk to  
Vdd1 Power Area  
(Internal)  
RESETB to Vdd1 Power Area  
(Internal1:release, 0:reset)  
XIN 32K  
STATE  
(Internal)  
Any State  
BACKUPB  
ISOLATOR control  
(Internal1:off 0:on)  
32kHz clk to  
Vdd1 Power Area  
(Internal)  
RESETB to Vdd1 Power Area  
(Internal1:release, 0:reset)  
Figure 50. Timing Sequence for Keyint RTC Mode  
www.onsemi.com  
106  
LC823455  
ORDERING INFORMATION  
Device  
Package  
Shipping (Qty / Packing)†  
LC823455XATBG  
WLCSP120, 4.086x4.086  
(Pb−Free / Halogen Free)  
1000 / Tape & Reel  
LC823455RAH−2H  
(Under planning)  
LFBGA240, 11.0x11.0  
880 / Tray JEDEC  
880 / Tray JEDEC  
(Pb−Free / Halogen Free)  
LC823455RB−2H  
(Under planning)  
LFBGA136, 11.0x11.0  
(Pb−Free / Halogen Free)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
Arm, the Arm logo, AMBA, and Cortex are registered trademarks of Arm Limited (or its subsidiaries) in the EU and/or elsewhere.  
Bluetooth is a registered trademark of Bluetooth SIG.  
www.onsemi.com  
107  
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
WLCSP120, 4.086x4.086x0.62  
CASE 567WG  
ISSUE O  
DATE 16 APR 2018  
GENERIC  
MARKING DIAGRAM*  
XXX = Specific Device Code  
A
= Assembly Location  
*This information is generic. Please refer to  
XXXXXXXXXXXX  
WL = Wafer Lot  
YY = Year  
WW = Work Week  
G
device data sheet for actual part marking.  
Pb−Free indicator, “G” or microdot “ G”,  
may or may not be present. Some products  
may not follow the Generic Marking.  
AWLYYWW  
G
= Pb−Free Package  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON87275G  
WLCSP120, 4.086x4.086x0.62  
PAGE 1 OF 1  
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