LC823455RB-2H [ONSEMI]
Low Power & High-Resolution Audio Processing System SoC for Portable Sound Solution;型号: | LC823455RB-2H |
厂家: | ONSEMI |
描述: | Low Power & High-Resolution Audio Processing System SoC for Portable Sound Solution |
文件: | 总109页 (文件大小:1263K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Low Power &
High-Resolution Audio
Processing System SoC for
Portable Sound Solution
LC823455
Description
www.onsemi.com
LC823455 is an audio processing System−on−Chip (SoC) for
recording and playback, with High−Resolution 32−bit & 192 kHz
audio processing capability that provides the key functions required
for portable audio solutions.
It has a Dual CPU configuration and a DSP providing intensive
processing capability, 4316 KB of internal SRAM that supports the
implementation of large-scale programs for WLAN applications, and
multiple interfaces for increased extensibility. Its features an extensive
range of functions including SBC/AAC codec and Active Noise
Canceller by the DSP, UART and ASRC − applicable for wearable
audio applications. The highly integrated implementation of this rich
set of analog functions results in a miniature footprint with ultra− low
power consumption. This, along with its high performance, makes the
LC823455 suitable for portable audio markets such as Wireless
headsets.
WLCSP120, 4.086x4.086x0.62
CASE 567WG
LFBGA240, 11.0x11.0
CASE 566EY
This document describes features, basic functions, electrical
specifications, characteristics, application diagrams and package
dimension of this SoC.
Features
• Ultra Low Power Consumption
®
®
LFBGA136, 11.0x11.0
CASE 566GB
• Arm Cortex −M3 Dual Core
• Proprietary 32−bit DSP Core (LPDSP32)
• Internal Large−Scale Size SRAM : 4316 KB (4MB + 220 KB)
• High−Resolution 32−bit & 192 kHz Audio Processing Capability
• Several DSP Codes Available for Audio Functions
ORDERING INFORMATION
See detailed ordering and shipping information on page 107 of
this data sheet.
• Hard−Wired Audio Functions Built−In:
MP3 decoder, MP3 encoder,
6 band Equalizer
Synchronous SRC, Asynchronous SRC, etc.
• Analog Blocks Built−in:
System PLL, Audio PLL,
16−bit DAC, Class−D amp, etc.
• USB On−The−Go(OTG) that supports USB2.0 Device and Host
Functions with an Integrated PHY,
eMMC and SD Card I/F,
Serial Flash I/F(Quad) with Cache Memory,
SPI, UART, I2C, etc.
Typical Applications
• Wearable Earbuds
• Wearable Headphone
• Wireless Speaker
• IC Recorder
NOTE:
LC823455RAH−2H and LC823455RB−2H are
under planning.
LC823455RAH−2H : Package Code = RA
LC823455RB−2H : Package Code = RB
© Semiconductor Components Industries, LLC, 2017
1
Publication Order Number:
March, 2021 − Rev. 2
LC823455/D
LC823455
Table of Contents
Abstract . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Terminal Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Pin Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Input/Output Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Electrical Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
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2
LC823455
ABSTRACT
Features
®
♦ Real Time Clock
• Cortex−M3 Dual Core, AMBA (AHB/APB) system
♦ Internal SRAM (4 M-byte)
2 modes below are available
− General RTC mode : RTC w/o key input
− KeyInt RTC mode : RTC w/ key input which
enables power on function
♦ Internal ROM (256 k-byte). Boot code, Standard
Functions
♦ SDRAM Controller (1 * CS)
64M to 256Mbit SDRAM / Mobile SDRAM
♦ External Memory Controller (2 * CS) NOR FLASH,
SRAM, ROM supported, 8/16 bit I/F LCD controller
supported
Internal ROM boot and External memory device
boot available
♦ DMA Controller (8 ch)
♦ SWD (Serial Wire Debug) is supported as the debug
interface
SWV (Serial Wire Viewer) is supported as the trace
interfaceOnly one of Cortex−M3 Dual Core can be
traced
Availability of features explained here depends on
products.
♦ Interrupt Controller (External 90 ch, Internal 83 ch)
♦ SPI (2 ch)
♦ Pseudo SRAM I/F (1 ch)
• MP3 hard wired encoder/decoder
♦ MP3 MPEG1, MPEG2, MPEG2.5
− Sampling rate: 8 kHz,11.025 kHz,12 kHz,
16 kHz, 22.05 kHz, 24 kHz, 32 kHz, 44.1 kHz,
48 kHz
− Bit rate: 8 Kbps to 320 Kbps (Decoder−VBR
supported)
• LPDSP32 system
♦ Internal SRAM (220 kbyte)
♦ Audio codec
♦ Serial Flash I/F (1 ch)
♦ Quad SPI, cache memory (16 k-byte, 4way set
associative, 128 line) function available
♦ UART (3ch)
UART1, UART2: w/flow control (CTS, RTS)
UART0: w/o flow control
♦ I2C (2ch) Single Master, Full/Standard
♦ GPIO (90 ch)
♦ Pin multiplex function (I2C:2 ch, SPI:2 ch, UART:3
ch, MTM:2 ch, DMIC:2 ch x 2)
♦ Plain Timer w/ Watch Dog Timer (1 ch×3)
♦ Multiple Timer (2 ch×4)
♦ 12 bit ADC (8 ch)
♦ SD Card I/F (3 ch)
− MP3
− WMA
− AAC
− SBC
− FLAC, etc.
♦ Audio function
− Active Noise Canceller
− 1−mic/2−mic Noise Canceller for Recorder
− 2−mic Noise Canceller for Hands Free
− Echo Canceller
eSD/eMMC, UHS−I, w/o CPRM
− SD0: eSD/eMMC boot supported (Internal ROM
Boot function)
− SD1: 1.8 V/3.3 V dedicated power supply
− SD2 :
− Variable Speed Control playback etc.
♦ JTAG ICE
♦ USB2.0 Device (HS/FS) Controller,
Host (HS/FS/LS) Controller with OTG Controller,
Integrated PHY.
Xtal (XT1) is required for USB function, 12, 19.2,
24 MHz for device and host with OTG function.
Host and Device share an integrated PHY.
1
MPEG Layer−3 audio coding technology licensed from Fraunhofer IIS and Thomson. Supply of this product does not convey license nor
imply any right to distribute content created with this product in revenue−generating broadcast systems (terrestrial, satellite, cable and/or
other distribution channels), streaming applications (via Internet, intranets and/or networks), other content distribution systems (pay−au-
dio or audio−on−demand applications and the like) or on physical media (compact discs, digital versatile discs, semiconductor chips,
hard drives, memory cards and the like). For details, please visit http://mp3licensing.com/
Supply of this product does not convey license under the relevant intellectual property of Thomson and/or Fraunhofer Gesellschaft nor
imply any right to use this product in any finished end user or ready−to−use final product. An independent license for such use is required.
For details, please visit http://mp3licensing.com/
This product contain technology of Microsoft company ownership, and you cannot distribute or use without getting license from Microsoft
Licensing Company.
2
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3
LC823455
• Bluetooth Protocol Stack available
• Audio clock generation
♦ Dedicated PLL for audio
• Audio
♦ Selectable PLL reference clock
XT1 (12, 19.2, 24 MHz Main xtal)
XTRTC (32.768 kHz RTC xtal)
PCM I/F MCLK0 (/MCLK1), BCK0, BCK1
♦ MP3 hard wired encoder/decoder, MP3 MPEG1,
MPEG2, MPEG2.5
− Sampling rate: 8 kHz,11.025 kHz,12 kHz,16 kHz,
22.05 kHz, 24 kHz, 32 kHz, 44.1 kHz, 48kHz
− Bit rate :8 Kbps to 320 Kbps
(Decoder−VBR supported)
• Power supply
♦ Typical voltage
♦ Other audio functions available
− 6 band Equalizer (EQ3)
− LOGIC(Vdd1),XT1(VddXT1),
PLL1(AVddPLL1), PLL2(AVddPLL2) = 1.0 V
− RTC(VddRTC) = 1.0 V
− Hardware Mixer
− Volume, Mute
− Level Meter
− Audio Timer w/ interrupt generation
− 16/24/32 bit 192 kHz PCM I/F (2ch×2).
Master/slave, I2S
− I/O(Vdd2) = 1.8 V or 3.3 V
− SD1(VddSD1) = 1.8 V or 3.3 V
− ADC(AVddADC) = 1.8V
− USB PHY(DVddUSBPHY1) = 1.0 V,
(AVddUSBPHY2) = 3.3 V,
− SSRC (Synchronous Sampling Rate Converter)
0.25 to 64 conversion capable
− ASRC (Asynchronous Sampling Rate Converter)
Jitter reducing function supporting USB audio
class and Bluetooth streaming
− Beep generator
(AVddUSBPHY18) = 1.8 V
− Class−D Amplifier
(AVddDAMPL,AVddDAMPR) = 1.5 V
− Digital Microphone I/F (2ch x2), Sampling rate :
up to 48 kHz, Support up to 4 PDM Digital
Microphones
− 16 bit Audio DAC (2 ch)
w/ Class−D Amplifier for Head Phone (2 ch).
Requires external LC LPF
3
The product name for which Bluetooth Protocol Stack is available is determined. Please contact our representative for license fee for the
Stack.
Copyright 1999−2014 OpenSynergy GmbH
All rights reserved. All unpublished rights reserved.
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LC823455
Package Codes and Functional Differences
The products with Package Code = “RA” and “RB” are under planning.
Table 1. FUNCTIONAL DIFFERENCES
Package Code
XA
RA
RB
Function
Package
WLP120
BGA240
Available
Available
BGA136
SDRAM Controller
−
−
−
−
External Memory
Controller
SD0
Shared pins with S−Flash
function
Dedicated
Available
Dedicated
P−SRAM
USB2.0
−
−
HS/FS Device
HS/FS Device and
HS/FS Device
HS/FS/LS Host with OTG
12 bit ADC
3ch
8ch
8ch
PLL1
PLL2
Only Internal Loop Filter
Internal / External Loop Filter
Only Internal Loop Filter
XTALINFO[1:0] input
RTCMODE input
BACKUPB input
“00”
Available
Available
Available
“00”
(24 MHz)
(24 MHz)
“0”
Available
Available
(KEYINT RTC mode)
Connected with VDET
internally
KEYINT input
External Interrupt
GPIO
2ch
3ch
2ch
52 ch
52 ch
90 ch
90 ch
53 ch
53 ch
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5
LC823455
Block Diagram
12MHz,
19.2MHz,
24MHz
32.768kHz
XTRTC
SWD/SWV
ICE
JTAG
ICE
XT 1
DMAC
(8ch)
ARM Cortex-M3 ARM Cortex-M3
LPDSP32
PSRAM I/F
(1ch)
Multilayer Bus
EXT4
S-Flash I/F
(1ch)
APB
Bridge
PD -G
SRAM S8
(32Kbyte)
SRAM S9
(220Kbyte)
SRAM S7A
(256Kbyte)
SDRAM
CTRL
Cache
(16 Kbyte)
PD -10
BASIC
PD -E
Reset
Controller
SRAM S5B
(384Kbyte)
SRAM S7B
(224Kbyte)
SRAM S6
(1536Kbyte)
External
Memory
Controller
BUF
(16 Kbyte)
PD -8
PD -7
PD -9
PD -J
USB2.0
USB2.0
Device/Host
(OTG)
USB
PHY
SRAM S2
(256Kbyte)
SRAM S5A
(384Kbyte)
SRAM S4
(256Kbyte)
SRAM S3
(256Kbyte)
XT1
PD -4
PD -6
PD -5
Plain
Timer
(1ch×3)
Multiple
Timer
(2ch×4)
Main
Module
Manager
SRAM S1
(256Kbyte)
ROM
(256Kbyte)
SRAM S0B
(128Kbyte)
SRAM S0A
(128Kbyte)
PD -3
PD -2
PD -1
EXT1
PD -H
12 bit ADC
(8ch )
I2C
(2ch )
UART
(3ch )
SPI
(2ch )
BUF
(512 byte×3)
OSC
System
PLL
SD I/F
(3ch)
PORT0~4
(80 I/O)
PORT5
(10 I/O)
XT1 XTRTC RC
EXT3
RTC
OSC
XTRTC
ATM
BEEP
VOLUME
EQ3
Audio Buffer
(256 Kbyte)
Audio PLL
PD -RTC
MP3
Decoder
PCM
I/F
PCM
I/F
MP3
XT1
AHB CLK
(HCLK)
BCK0/1
MCLK0/1
(PCM I/F)
METER
Encoder
MUTE
SSRC
ASRC
A
N
C
*
16bit Audio
DAC
Digital
Mic
Digital
Mic
MIXER
PD -A
Class-D
AMP
Figure 1. Top−Level Block Diagram
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6
LC823455
Bus Matrix
DMAC
(8ch)
USB2.0
ARM Cortex−M3
LPDSP32
ARM Cortex−M3
System
ROM
SRAM
(Seg 0)
SRAM
(Seg 8)
SRAM
(Seg 9)
BASIC
Peripheral
EXT1
Peripheral
EXT3
Peripheral
EXT4
Peripheral
APB
Peripheral
Figure 2. Bus Matrix
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LC823455
Audio
256KB SRAM divided into
A~ N Audio Buffers
by register settings
Internal
Bus
A buffer
8
MP3
Encoder
RAM
B buffer
Dredirect
Eredirect
Gredirect
Jredirect
BIT1-0、
MONO
16
RAM
Lredirect
Nredirect
24
8
0
1
D
E
C
S
E
L
C buffer
Eredirect
Gredirect
Jredirect
Lredirect
Nredirect
BIT1-0、MONO
24
16
MP3
Decoder
RAM
METER
(DEC)
MUTE
(DEC)
D buffer
E buffer
32
32 Bit conv
24
32
VOLUME
(DEC)
DMCKO0A
DMDIN0A
RAM
RAM
Bit conv
SSRC
S
E
L
24
32
Digtal
Mic0
BIT1-0、MONO
1
0
P
C
M
S
E
L
DMCKO0B
DMDIN0B
32
0
1
S
I
N
S
E
L
32
PCM input
VOLUME
(SP0)
PCM
SP0
DIN0
(PCM input)
Bit conv
BIT1-0、MONO
EQ3
METER
(SP0)
SINGEN
VOLUME
(AMB)
F buffer
Dredirect
Eredirect
Gredirect
Jredirect
Lredirect
Nredirect
BIT1-0、MONO
32
24
PCM output
PCM
PS0
DOUT0
(PCM output)
32
DWNMIX
(PS0)
VOLUME
(PS0)
MUTE
(PS0)
EQ3
MIXER
BTL
BEEP
16 bit
Audio
DAC
LOUT
ROUT
Class−D
AMP
RAM
MCLK0/
BCK0/
LRCK0
METER
(PS0)
METER
(SP1)
G buffer
LRCK0
AudioTimer0
32
32
VOLUME
(SP1)
24
32
RAM
Bit conv
BIT1-0、
Digtal
Mic1
DMCKO1
DMDIN1
P
C
M
1
S
E
L
1
0
MONO
BIT1-0、MONO
H buffer
Dredirect
Eredirect
Gredirect
Jredirect
Lredirect
Nredirect
PCM input
PCM
SP1
DIN1
(PCM input)
DWNMIX
(PS1)
VOLUME
(PS1)
32
PCM output
RAM
PCM
PS1
DOUT1
(PCM output)
METER
MCLK1/
BCK1/
(PS1)
LRCK1
I buffer
Dredirect
Eredirect
Gredirect
Lredirect
Nredirect
BIT1-0、MONO
LRCK1
AudioTimer1
24
24
ASRC
RAM
J buffer
32 Bit conv
RAM
Bit conv
BIT1-0、MONO
K buffer
Dredirect
Eredirect
Gredirect
Jredirect
Nredirect
BIT1-0、MONO
RAM
L buffer
CBIT1-0、
CMONO
RAM
Bit conv
32 Bit conv
BIT1-0、MONO
32
M buffer
Dredirect
Eredirect
Gredirect
Jredirect
Lredirect
BIT1-0、MONO
RAM
N buffer
RAM
CBIT1-0、
CMONO
Bit conv
32 Bit conv
BIT1-0、MONO
Figure 3. Audio
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8
LC823455
Clock Hierarchy
12MHz
19.2MHz
24MHz
FCLKCNT
XT1
PHI1 pin
32.768kHz
Oscillation System
1/1、1/2、1/4、
1/8、1/16
PLL1
1/4
1/2
XT1
(XIN1/XOUT 1 pin)
XTRTC
(XIN32K/XOUT 32K pin )
SYSTEM PLL
(PLL1)
1/4
XT1
1/4
1/2、1/4
PHI0 pin
XTRTC
RC
1/1、1/{(1~63)×2}
BASIC CLK
APB
ADC
1/2、1/4、1/8、
1/16、1/32、1/64
1/{(1~8)
+
(0~63)/64}
MCLKCNTAPB
BASIC
ADCCLK
(Internal)
M3Core0
M3Core1
LPDSP32
SRAM/ROM
INTC
CORECNT
[Note]
M3Core 0, M3Core
switch enabled by the execution of
SPI0
1/{(2~256 )×4}
-
1
and LPDSP 32 has additional clock gating
SCK0
a
dedicated operat.ion
SPI1
1/{(2~256 )×4}
SCK1
PORT 0
PORT 1
PORT 2
PORT 3
PORT 4
PORT 5
RTC
MCLKCNTBASIC
DMAC
Cache
S-Flash I/F
SFCK
1/1、1/2、
1/4、1/8
External Memory
Controller(XMC)
XTRTC
I2C0
1/{(2~65535)×8}
XT1
SCL0
SCL1
USB PHY
USB2.0 Device/Host
(OTG)
I2C1
1/{(2~65535)×8}
MCLKCNTAPB
UART0
1/{(8~16)×
(1~65536)}
APB CLK (PCLK )
1/(1~64)
1/(1~64)
UART1
1/{(8~16)×
(1~65536)}
AHB CLK(HCLK)
MCLKCNTEXT 1
MCLKCNTEXT 1
AHB EXT1
Plain Timer 0
Plain Timer 1
Plain Timer 2
Multiple Timer 0
Multiple Timer 1
Multiple Timer 2
Multiple Timer 3
Audio PLL
UART2
1/{(8~16)×
(1~65536)}
AUDIO Block
CLOCKEN
FS384
FS192
1/2
MP3DEC
MP3ENC
DECCLK 1/2、1/4、
1/8
1/1、1/2、
1/4
ENCCLK 1/4、1/8、
1/16
AUDCLK
FS256
1/1、1/2、
1/3
1/4
AUDIO Control
MIXER
BCK0
BCK1
XT1
AUDIO
PLL
1/2
FS768
FS384
EQ3
XTRTC
(PLL2)
System PLL
1/4
BEEP
MCLK 0/MCLK 1
(input)
OSC System
1/1、1/2、
1/4、1/8
SDCLK0
SSRC
SSRCFCLK
AHB CLK
)
ASRC
1/1、1/2、
1/4、1/8
1/1、1/2、1/4、1/8、
1/16、1/32、1/64、
1/128 、1/256 、1/512
(HCLK
MCLKCNTEXT 1
ASRCFCLK
VOLUME DEC
VOLUME SP 0
VOLUME PS0
VOLUME SP 1
VOLUME PS1
VOLUME AMB
METER DEC
METER SP0
METER PS0
METER SP1
METER PS1
MUTE DEC
MUTE PS0
PCMPS0
SD0(Main Function)
SD0(Card Detect)
SDCLK1
[Note]
-
-
-
Regarding the initial value of switches described in this fig,ure
refer to the appropriate documen.ts
1/1、1/2、1/4、1/8、
1/16、1/32、1/64、
1/128 、1/256 、1/512
MCLKCNTEXT 1
Regarding the frequency of SSRCFCLK and ASRCFCLK,
refer to the SSRC and ASRC Programm’esr Model documents.
SD1(Main Function)
SD1(Card Detect)
ENCCLK frequency should be192 * FS
while FS is Sampling Frequency of MPE1Gmode of MP3.
ex.) ENCCLK should be8.4672MHz to make all of MP
44.1/22.05/11.025 KHz (MPEG1/MPEG2/MPEG2.5).
3 data
SDCLK2
-
DECCLK frequency should be384 * FS
while FS is Sampling Frequency of MPE1Gmode of MP3.
1/1、1/2、1/4、1/8、
1/16、1/32、1/64、
1/128 、1/256 、1/512
ex.) DECCLK should be16.9344MHz to make all of MP
44.1/22.05/11.025 KHz (MPEG1/MPEG2/MPEG2.5).
3 data
MCLKCNTEXT 1
SD2(Main Function)
SD2(Card Detect)
PCMSP0
MCLKCNTEXT 3
AHB EXT3
PCMPS1
AUDIO BUFFER
PCMSP1
AudioTimer 0
AudioTimer 1
SINGEN
AHB EXT4
PSRAM I/F
1/(1~64)
PLL1
MCLKCNTEXT 4
XT1
DigitalMIC0
DigitalMIC1
PCKGEN
[Note]
-
PSM_SCK
Class-D AMP has additional clock source and gating switch
for being used as GPO.
1/1, 1/2,
FS384
1/4
SDRAM CTRL
Damp CTL
Class -D AMP
SDRCLK
FCEDAC
AHB CLK
(EXT4 only)
1/1, 1/2, 1/4, 1/8,
1/16, 1/32
16bit Audio
DAC(Noise Shaping )
MCLK0/MCLK1
)
(output
1/1, 1/2, 1/4
1/8, 1/16
DAC(Main)
1/1, 1/21/4, 1/8,
1/16, 1/32
Figure 4. Clock Hierarchy
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LC823455
Memory Map
All Areas (Cortex−M3)
Figure 5. All Areas (Cortex−M3)
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LC823455
Code Area (Cortex−M3)
Table 2. CODE AREA (CORTEX−M3) − UNREMAPPED (AFTER RESET)
Cortex−M3−0
Cortex−M3−1
I−Bus
System−
Bus
System−
Bus
I−Bus
D−Bus
D−Bus
Address
Master / Slave
DMAC
USB20
0x1C00
0000
Reserved
0x1A00
0000
External memory 1
External memory 0
Reserved
d
d
d
d
0x1800
0000
0x0600
0000
0x0500
0000
S−Flash I/F
d
d
d
(Memory, Cache)
0x0254
0000
Reserved
256 KB Internal ROM
Reserved
0x0250
0000
d
0x0243
7000
0x0240
0000
220 KB Internal SRAM
(seg 9)
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
0x023F
8000
32 KB Internal SRAM
(seg 8)
480 KB
Internal
SRAM
0x023C
0000
224 KB
(seg 7−B)
0x0238
0000
256KB
(seg 7)
(seg 7−A)
0x0220
0000
1536 KB Internal SRAM
(seg 6)
768 KB
Internal
SRAM
0x021A
0000
384 KB
(seg 5−B)
0x0214
0000
384 KB
(seg 5)
(seg 5−A)
0x0210
0000
256 KB Internal SRAM
(seg 4)
0x020C
0000
256 KB Internal SRAM
(seg 3)
0x0208
0000
256 KB Internal SRAM
(seg 2)
0x0204
0000
256 KB Internal SRAM
(seg 1)
256 KB
Internal
SRAM
0x0202
0000
128 KB
(seg 0−B)
0x0200
0000
128 KB
(seg 0)
(seg 0−A)
0x0004
0000
Reserved
0x0000
0000
256 KB Internal ROM
Shadow Area
d
d
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11
LC823455
Table 3. CODE AREA (CORTEX−M3) − REMAPPED (REMAP[1:0]=2’B01)
Cortex−M3−0
Cortex−M3−1
I−Bus
System−
Bus
System−
Bus
I−Bus
D−Bus
D−Bus
Address
Master / Slave
DMAC
USB20
0x1C00
0000
Reserved
0x1A00
0000
External memory 1
External memory 0
Reserved
d
d
d
d
0x1800
0000
0x0600
0000
S−Flash I/F
0x0500
0000
d
d
d
(Memory, Cache)
0x0254
0000
Reserved
256 KB Internal ROM
Reserved
0x0250
0000
d
0x0243
7000
220 KB Internal SRAM
(seg 9)
0x0240
0000
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
32 KB Internal SRAM
(seg 8)
0x023F
8000
224 KB
480 KB
0x023C
0000
(seg 7−B)
Internal
SRAM
256 KB
0x0238
0000
(seg 7)
(seg 7−A)
1536 KB Internal SRAM
(seg 6)
0x0220
0000
384 KB
768 KB
0x021A
0000
(seg 5−B)
Internal
SRAM
384 KB
0x0214
0000
(seg 5)
(seg 5−A)
256 KB Internal SRAM
(seg 4)
0x0210
0000
256 KB Internal SRAM
(seg 3)
0x020C
0000
256 KB Internal SRAM
(seg 2)
0x0208
0000
256 KB Internal SRAM
(seg 1)
0x0204
0000
128 KB
256 KB
0x0202
0000
(seg 0−B)
Internal
SRAM
128 KB
0x0200
0000
(seg 0)
(seg 0−A)
0x0004
0000
Reserved
256 KB
Internal
SRAM
0x0002
0000
128 KB
d
d
d
d
(seg 0−B)
(seg 0)
128 KB
0x0000
0000
Shadow
Area
(seg 0−A)
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12
LC823455
Table 4. CODE AREA (CORTEX−M3) − REMAPPED (REMAP[1:0]=2’B11)
Cortex−M3−0
Cortex−M3−1
I−Bus
System−
Bus
System−
Bus
I−Bus
D−Bus
D−Bus
Address
Master / Slave
DMAC
USB20
0x1C00
0000
Reserved
0x1A00
0000
External memory 1
External memory 0
Reserved
d
d
d
d
0x1800
0000
0x0600
0000
S−Flash I/F
0x0500
0000
d
d
d
(Memory, Cache)
0x0254
0000
Reserved
256 KB Internal ROM
Reserved
0x0250
0000
d
0x0243
7000
220 KB Internal SRAM
(seg 9)
0x0240
0000
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
32 KB Internal SRAM
(seg 8)
0x023F
8000
224 KB
480 KB
0x023C
0000
(seg 7−B)
Internal
SRAM
256 KB
0x0238
0000
(seg 7)
(seg 7−A)
1536KB Internal SRAM
(seg 6)
0x0220
0000
384 KB
768 KB
0x021A
0000
(seg 5−B)
Internal
SRAM
384 KB
0x0214
0000
(seg 5)
(seg 5−A)
256KB Internal SRAM
(seg 4)
0x0210
0000
256KB Internal SRAM
(seg 3)
0x020C
0000
256KB Internal SRAM
(seg 2)
0x0208
0000
256KB Internal SRAM
(seg 1)
0x0204
0000
128 KB
256 KB
0x0202
0000
(seg 0−B)
Internal
SRAM
128 KB
0x0200
0000
(seg 0)
(seg 0−A)
External memory 0
Shadow Area
0x0000
0000
d
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13
LC823455
SRAM Area (Cortex−M3)
Table 5. SRAM AREA (CORTEX−M3)
Cortex−M3−0
Cortex−M3−1
I−Bus D−Bus
System−
Bus
System−
Bus
I−Bus
D−Bus
Address
Master / Slave
DMAC
USB20
0x2600
0000
Reserved
0x2500
0000
S−Flash I/F
d
d
d
d
d
d
(Memory, Cache)
0x2400
0000
S−Flash I/F
(Memory, No Cache)
0x2043
7000
Reserved
0x2040
0000
220 KB Internal SRAM
(seg 9) Shadow area
d
d
d
d
d
d
0x203F
8000
32 KB Internal SRAM
(seg 8) Shadow area
0x203C
0000
480 KB
224 KB
Internal
d
d
d
(seg 7−B)
SRAM
(seg 7)
256 KB
Shadow
0x2038
0000
d
d
d
d
d
d
d
d
d
(seg 7−A)
area
0x2020
0000
1536 KB Internal SRAM
(seg 6) Shadow area
0x201A
0000
768 KB
384 KB
Internal
(seg 5−B)
SRAM
(seg 5)
384 KB
Shadow
0x2014
0000
d
d
d
(seg 5−A)
area
0x2010
0000
256 KB Internal SRAM
(seg 4) Shadow area
d
d
d
d
d
d
d
d
d
d
d
d
0x200C
0000
256 KB Internal SRAM
(seg 3) Shadow area
0x2008
0000
256 KB Internal SRAM
(seg 2) Shadow area
0x2004
0000
256 KB Internal SRAM
(seg 1) Shadow area
256 KB
128 KB
0x2002
0000
Internal
d
d
d
d
d
d
(seg 0−B)
SRAM
(seg 0)
128 KB
Shadow
0x2000
0000
(seg 0−A)
area
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14
LC823455
Other Areas (Cortex−M3)
Table 6. OTHER AREAs (CORTEX−M3)
Cortex−M3−0
Cortex−M3−1
I−Bus D−Bus
System−
System−
Bus
Bus
I−Bus
D−Bus
Address
Master / Slave
DMAC
USB20
0xE010
0000
Reserved
0xE00F
F000
ROM table
d
d
(Note 1)
(Note 1)
0xE00F
E000
CORE REG
d
d
(Note 1)
(Note 1)
0xE004
1000
Reserved
TPIU
0xE004
0000
d
d
(Note 1)
(Note 1)
0xE000
F000
Reserved
NVIC
0xE000
E000
d
d
(Note 1)
(Note 1)
0xE000
3000
Reserved
FPB
0xE000
2000
d
d
(Note 1)
(Note 1)
0xE000
1000
DWT
ITM
d
d
(Note 1)
(Note 1)
0xE000
0000
d
d
(Note 1)
(Note 1)
0x6400
2000
Reserved
PSRAM I/F
SDRAM CTRL
Reserved
SDRAM Memory area
Reserved
RTC
0x6400
1000
d
d
d
d
d
0x6400
0000
0x6200
0000
0x6000
0000
d
d
d
0x4008
F000
0x4008
E000
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
0x4008
D000
UART2
d
d
d
0x4008
C000
UART1
0x4008
B000
UART0
0x4008
A000
I2C1
0x4008
9000
I2C0
0x4008
8800
SPI1
d
d
d
0x4008
8000
SPI0
0x4008
7000
ADC
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15
LC823455
Table 6. OTHER AREAs (CORTEX−M3) (continued)
Cortex−M3−0
Cortex−M3−1
I−Bus D−Bus
System−
Bus
System−
Bus
I−Bus
D−Bus
Address
Master / Slave
DMAC
USB20
0x4008
6000
PORT5
d
d
d
d
d
d
d
d
d
d
d
d
d
d
0x4008
5000
PORT4
PORT3
0x4008
4000
0x4008
3000
PORT2
0x4008
2000
PORT1
0x4008
1000
PORT0
0x4008
0000
System Controller
Reserved
0x4006
5000
0x4006
4000
Audio Controls
MP3 Encoder
MP3 Decoder
Audio Functions
Audio Buffer
Reserved
d
d
d
d
d
d
d
d
d
d
0x4006
3000
0x4006
2000
0x4006
1000
0x4006
0000
d
0x4004
D000
0x4004
C000
SD2
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
0x4004
B000
SD1
0x4004
A000
SD0
0x4004
9000
Plain Timer2
Plain Timer1
Plain Timer0
Multiple Timer3
Multiple Timer2
Multiple Timer1
Multiple Timer0
Audio PLL
0x4004
8000
0x4004
7000
0x4004
6000
0x4004
5000
0x4004
4000
0x4004
3000
0x4004
2000
0x4004
1000
System PLL
OSC System
0x4004
0000
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16
LC823455
Table 6. OTHER AREAs (CORTEX−M3) (continued)
Cortex−M3−0
Cortex−M3−1
I−Bus D−Bus
System−
Bus
System−
Bus
I−Bus
D−Bus
Address
Master / Slave
DMAC
USB20
0x4002
0000
Reserved
0x4001
0000
USB2.0 FIFO
Reserved
d
d
0x4000
7000
0x4000
6000
DSP CMDIF
MUTEX REG
DMAC
d
d
d
d
d
d
d
d
d
d
d
d
d
d
0x4000
5000
0x4000
4000
0x4000
3000
INTC
0x4000
2000
USB2.0 CTL
S−Flash I/F
External MEM CTL
0x4000
1000
0x4000
0000
1. Access from internal peripheral bus(AHB/APB)
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17
LC823455
LPDSP32
Table 7. LPDSP32 − DMA
LPDSP32
DMA
Address
0x40 0000
0x3F 8000
0x3C 0000
0x38 0000
0x20 0000
0x1A 0000
0x14 0000
0x10 0000
0x0C 0000
0x08 0000
0x04 0000
0x02 0000
0x00 0000
Master / Slave
Reserved
32 KB Internal SRAM (seg 8)
d
d
d
d
d
d
d
d
d
d
d
d
480 KB Internal SRAM (seg 7)
224 KB (seg 7−B)
256 KB (seg 7−A)
1536 KB Internal SRAM (seg 6)
768 KB Internal SRAM (seg 5)
384 KB (seg 5−B)
384 KB (seg 5−A)
256 KB Internal SRAM (seg 4)
256 KB Internal SRAM (seg 3)
256 KB Internal SRAM (seg 2)
256 KB Internal SRAM (seg 1)
256 KB Internal SRAM (seg 0)
128 KB (seg 0−B)
128 KB (seg 0−A)
Table 8. LPDSP32 – DMB
LPDSP32
DMB
Address
0xC0 0000
0xBF 8000
0xBC 0000
0xB8 0000
0xA0 0000
0x9A 0000
0x94 0000
0x90 0000
0x8C 0000
0x88 0000
0x84 0000
0x82 0000
0x80 0000
Master / Slave
Reserved
32 KB Internal SRAM (seg 8)
480 KB Internal SRAM (seg 7)
224 KB (seg 7−B)
d
d
d
d
d
d
d
d
d
d
d
d
256 KB (seg 7−A)
1536 KB Internal SRAM (seg 6)
768 KB Internal SRAM (seg 5)
384 KB (seg 5−B)
384 KB (seg 5−A)
256 KB Internal SRAM (seg 4)
256 KB Internal SRAM (seg 3)
256 KB Internal SRAM (seg 2)
256 KB Internal SRAM (seg 1)
256 KB Internal SRAM (seg 0)
128 KB (seg 0−B)
128 KB (seg 0−A)
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18
LC823455
Table 9. LPDSP32 − DMIO
LPDSP32
DMIO
Address
0xF0 2000
0xF0 1000
0xF0 0000
0xD0 0000
0xC6 5000
0xC6 4000
0xC6 3000
0xC6 2000
0xC6 1000
0xC6 0000
0xC4 A000
0xC4 9000
0xC4 8000
0xC4 7000
0xC4 6000
0xC4 5000
0xC4 4000
0xC4 3000
0xC4 2000
0xC4 1000
0xC4 0000
0xC0 7000
0xC0 6000
0xC0 5000
0xC0 4000
0xC0 3000
0xC0 0000
Master / Slave
Reserved
PSRAM I/F
d
d
d
SDRAM CTRL
SDRAM Memory Area
Reserved
Audio Controls
MP3 Encoder
MP3 Decoder
Audio Functions
Audio Buffer
Reserved
d
d
d
d
d
Plain Timer2
Plain Timer1
Plain Timer0
Multiple Timer3
Multiple Timer2
Multiple Timer1
Multiple Timer0
Audio PLL
d
d
d
d
d
d
d
d
d
d
System PLL
OSC System
Reserved
DSP CMDIF
MUTEX REG
DMAC
d
d
d
d
INTC
Reserved
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19
LC823455
Table 10. LPDSP32 − PM
LPDSP32
PM
Address
0x50 3332
0x50 0000
0x4B 0000
0x48 0000
Master / Slave
Reserved
32 KB Internal SRAM (seg 8)
Reserved
d
480 KB Internal SRAM (seg 7)
224 KB (seg 7−B)
256 KB (seg 7−A)
0x41 9998
0x38 0000
0x34 CCCC
0x30 0000
Reserved
1536 KB Internal SRAM (seg 6)
Reserved
768 KB Internal SRAM (seg 5)
384 KB (seg 5−B)
384 KB (seg 5−A)
0x29 9998
0x28 0000
0x21 9998
0x20 0000
0x19 9998
0x18 0000
0x11 9998
0x10 0000
0x09 9998
0x08 0000
Reserved
256 KB Internal SRAM (seg 4)
Reserved
d
d
d
d
256 KB Internal SRAM (seg 3)
Reserved
256 KB Internal SRAM (seg 2)
Reserved
256 KB Internal SRAM (seg 1)
Reserved
256 KB Internal SRAM (seg 0)
128 KB (seg 0−B)
128 KB (seg 0−A)
d
d
0x01 6000
0x00 0000
Reserved
220 KB Internal SRAM (seg 9)
d
2. PM of LPDSP32 cannot access internal SRAM seg5, 6, and 7.
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20
LC823455
TERMINAL FUNCTIONS
XA: Package Code = “XA”, RA: Package Code = “RA”, RB: Package Code = “RB”, (RA and RB are under planning).
Table 11. TERMINAL FUNCTIONS
Terminal Name
Polarity
Direction
Function
Available(d)
Multiplexed
Function
XA
RA
RB
IO POWER
JTAG/SWD
TDO
VddSD1
−
Pos
−
O
I
JTAG test data output
SD I/F Ch1 write protect
GPIO
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
6
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
6
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
6
SDWP1
GPIO21
EXTINT21
TDI
B
I
−
External Interrupt 2−bit1
JTAG test data input
SD I/F Ch1 detect
serial wire view data
GPIO
VddSD1
−
I
SDCD1
SWO
Neg
−
I
O
B
I
GPIO20
EXTINT20
TMS
−
−
External Interrupt 2−bit0
JTAG test data select
SD I/F Ch2 write protect
GPIO
Vdd2
Vdd2
Vdd2
Vdd2
−
I
SDWP2
GPIO28
EXTINT28
TCK
Pos
−
I
B
I
−
External Interrupt 2−bit8
JTAG test clock
Pos
Neg
−
I
SDCD2
GPIO29
EXTINT29
SWDCLK
DMCKO0B
GPIO58
EXTINT58
SWDIO
DMDIN0B
GPIO59
EXTINT59
I
SD I/F Ch2 detect
GPIO
B
I
−
External Interrupt 2−bit9
Serial wire clock
Digital Mic Ch0 Clock B Output
GPIO
Pos
−
I
O
B
I
−
−
External Interrupt 5−bit8
Serial wire Data
−
B
I
−
Digital Mic Ch0 Data B Input
GPIO
−
B
I
−
External Interrupt 5−bit9
Sum
RTC
XIN32K
Pos
−
I
32.768KHz XTAL Input
(XTRTC)
VddRTC
VddRTC
d
d
d
d
d
d
XOUT32K
O
32.768KHzXTAL Output
(XTRTC)
VDET
Neg
Neg
I
RTC power detect Input
VddRTC
VddRTC
d
d
d
d
d
d
RTCINT
O
RTC Interrupt Output (Normal:
Hiz, Interrupt enabled:Low Out-
put)
BACKUPB
Neg
I
RTC backup mode input
VddRTC
d
d
Bonded with VDET internally
for “XA”
KEYINT[2]
−
−
I
I
RTC KEY input can be used
when KeyInt RTC mode
VddRTC
VddRTC
d
d
KEYINT[1:0]
RTC KEY input can be used
when KeyInt RTC mode
d
d
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21
LC823455
Table 11. TERMINAL FUNCTIONS (continued)
Terminal Name
Polarity
Direction
Function
Available(d)
Multiplexed
Function
XA
RA
RB
IO POWER
RTC
RTCMODE
−
I
RTC mode input (Note 3)
VddRTC
d
d
Set General or KeyInt RTC
mode
RTCMODE =
“0” : KeyInt RTC mode
“1” : General RTC mode
Bonded to “0” internally for “XA”
VddRTC
VssRTC
−
−
P
P
RTC power supply
RTC ground
Sum
d
d
d
d
8
d
d
d
d
11
10
EXTERNAL INTERRUPT/GPIO
Vdd2
Vdd2
SDRADDR12
GPIO2A
−
−
−
−
O
B
I
SDRAM address
GPIO
d
d
d
d
EXTINT2A
SCL1
External Interrupt 2−bit10
O
I2C ch1 Clock (open drain out-
put )
d
d
GPIO2B
EXTINT2B
SDA1
−
−
−
B
I
GPIO
d
d
d
d
d
d
d
d
d
External Interrupt 2−bit11
Vdd2
Vdd2
B
I2C ch1 Data (open drain out-
put )
GPIO2C
EXTINT2C
SDRADDR11
DMCKO0A
GPIO2D
−
−
−
−
−
−
−
−
−
−
B
I
GPIO
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
External Interrupt 2−bit12
SDRAM address
Digital Mic Ch0 Clock A Output
GPIO
O
O
B
I
EXTINT2D
EXTINT2E
GPIO2E
External Interrupt 2−bit13
External Interrupt 2−bit14
GPIO
Vdd2
Vdd2
I
B
I
EXTINT2F
GPIO2F
External Interrupt 2−bit15
GPIO
B
* During Internal ROM boot,
this terminal is used as the boot
monitor signal.
Sum
5
6
5
SPI (SERIAL I/F CH0)
SCK0
Vdd2
Vdd2
Vdd2
Neg
−
B
B
I
Serial I/F Ch0 Clock
GPIO
d
d
d
d
d
d
d
d
d
3
d
d
d
d
d
d
d
d
d
3
d
d
d
d
d
d
d
d
d
3
GPIO1D
EXTINT1D
SDI0
−
External Interrupt 1−bit13
Serial I/F Ch0 Data Input
GPIO
−
I
GPIO1E
−
B
I
EXTINT1E
SDO0
−
External Interrupt 1−bit14
Serial I/F Ch0 Data Output
GPIO
−
O
B
I
GPIO1F
−
EXTINT1F
−
External Interrupt 1−bit15
Sum
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22
LC823455
Table 11. TERMINAL FUNCTIONS (continued)
Terminal Name
Polarity
Direction
Function
Available(d)
Multiplexed
Function
XA
RA
RB
IO POWER
S−FLASH I/F / SD I/F CH0 (Note 4)
Vdd2
SFCK
Neg
O
Serial Flash I/F Clock
d
d
d
(QSPI Clock)
GPIO0D
EXTINT0D
SDCLK0
−
−
−
−
B
I
GPIO
d
d
d
d
d
d
d
d
d
d
d
d
External Interrupt 0−bit13
SD I/F Ch0 Clock Output
O
Vdd2
Vdd2
Vdd2
Vdd2
SFDI(QIO0)
I(B)
Serial Flash I/F Data input
(QSPI Data 0)
GPIO0E
EXTINT0E
SDAT00
−
−
−
−
B
I
GPIO
d
d
d
d
d
d
d
d
d
d
d
d
External Interrupt 0−bit14
SD I/F Ch0 Data0
B
SFDO(QIO1)
O(B)
Serial Flash I/F Data output
(QSPI Data 1)
GPIO0F
EXTINT0F
SDAT01
−
−
B
I
GPIO
d
d
d
d
d
d
d
d
d
d
d
d
External Interrupt 0−bit15
SD I/F Ch0 Data1
−
B
SFWP(QIO2)
Neg
O(B)
Serial Flash I/F write protect
(QSPI Data 2)
GPIO11
EXTINT11
−
−
B
I
GPIO
d
d
d
d
d
d
d
d
d
d
d
d
External Interrupt 1−bit1
SD I/F Ch0 Data2
SDAT02
−
B
SFHOLD(QIO3)
Neg
O(B)
Serial Flash I/F hold
(QSPI Data 3)
GPIO12
EXTINT12
SDAT03
−
−
−
B
I
GPIO
d
d
d
5
d
d
d
5
d
d
d
5
External Interrupt 1−bit2
SD I/F Ch0 Data3
Sum
B
I2C
Vdd2
Vdd2
SCL0
−
O
I2C ch0 Clock (open drain out-
put )
d
d
d
GPIO07
EXTINT07
SDA0
−
−
−
B
I
GPIO
d
d
d
d
d
d
d
d
d
External Interrupt 0−bit7
B
I2C ch0 Data (open drain out-
put )
GPIO08
−
−
B
I
GPIO
d
d
2
d
d
2
d
d
2
EXTINT08
External Interrupt 0−bit8
Sum
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23
LC823455
Table 11. TERMINAL FUNCTIONS (continued)
Terminal Name
Polarity
Direction
Function
Available(d)
Multiplexed
Function
XA
RA
RB
IO POWER
UART
Vdd2
TXD1
SDAT20
GPIO04
EXTINT04
RXD1
−
−
O
B
B
I
UART Ch1 transmit Data
SD I/F Ch2 Data 0
GPIO
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
−
−
External Interrupt 0−bit4
UART Ch1 receive Data
SD I/F Ch2 Data 1
GPIO
Vdd2
Vdd2
−
I
SDAT21
GPIO05
EXTINT05
CTS1
−
B
B
I
−
−
External Interrupt 0−bit5
UART Ch1 clear to send
SD I/F Ch2 Data 2
UART Ch0 receive Data
GPIO
Neg
−
I
SDAT22
RXD0
B
I
−
GPIO56
EXTINT56
RTS1
−
B
I
−
External Interrupt 5−bit6
UART Ch1 request to send
SD I/F Ch2 Data 3
UART Ch0 transmit Data
GPIO
Vdd2
Vdd2
Neg
−
O
B
O
B
I
SDAT23
TXD0
−
GPIO57
EXTINT57
TXD2
−
−
External Interrupt 5−bit7
UART Ch2 transmit Data
MTM1 Ch0A
−
O
B
TIOCA10
−
− target signal of pulse−length−
reader function
− output of sentinel−inform−
function
− output of PWM output
GPIO0B
EXTINT0B
RXD2
−
−
−
−
B
I
GPIO
d
d
d
d
d
d
d
d
d
d
d
d
External Interrupt 0−bit11
UART Ch2 receive Data
Vdd2
I
TIOCA11
B
MTM1 Ch1A
− target signal of pulse−length−
reader
function
− output of sentinel−inform−
function
− output of PWM output
GPIO0C
−
−
B
I
GPIO
d
d
6
d
d
6
d
d
6
EXTINT0C
External Interrupt 0−bit12
Sum
TIMER
Vdd2
TIOCA00
−
B
MTM0 Ch0A
d
d
d
− target signal of pulse−length−
reader
function
− output of sentinel−inform−
function
− output of PWM output
SD I/F Ch2 Clock Output
System Clock Output 0
SDCLK2
PHI0
−
−
O
O
d
d
d
d
d
d
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24
LC823455
Table 11. TERMINAL FUNCTIONS (continued)
Terminal Name
Polarity
Direction
Function
Available(d)
Multiplexed
Function
XA
RA
RB
IO POWER
TIMER
GPIO09
EXTINT09
TIOCA01
−
−
−
B
I
GPIO
d
d
d
d
d
d
d
d
d
External Interrupt 0−bit9
Vdd2
B
MTM0 Ch1A
− target signal of pulse−length−
reader
function
− output of sentinel−inform−
function
− output of PWM output
SD I/F Ch2 command line
System Clock Output 1
GPIO
SDCMD2
PHI1
−
−
−
−
−
B
O
B
I
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
GPIO0A
EXTINT0A
TIOCB00
External Interrupt 0−bit10
Vdd2
B
MTM0 Ch0B
− target signal of pulse−length−
reader
function
− output of sentinel−inform−
function
DIN1
−
−
−
−
−
I
I
PCM1 Data Input
Digital Mic Ch0 Data A Input
GPIO
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
DMDIN0A
GPIO02
B
I
EXTINT02
TIOCB01
External Interrupt 0−bit2
Vdd2
B
MTM0 Ch1B
− target signal of pulse−length−
reader
function
− output of sentinel−inform−
function
SFQSCS
Neg
O
Serial Flash I/F QSPI chip se-
lect
d
d
d
During Serial Flash Boot, this is
used as chip select of Serial
Flash
GPIO03
EXTINT03
SDCMD0
TCLKA0
BCK1
−
−
−
−
−
−
−
−
−
−
−
B
I
GPIO
d
d
d
d
d
d
d
d
d
d
d
6
d
d
d
d
d
d
d
d
d
d
d
6
d
d
d
d
d
d
d
d
d
d
d
6
External Interrupt 0−bit3
SD I/F Ch0 command line
MTM0 external Clock A
PCM1 bit Clock
GPIO
B
I
Vdd2
Vdd2
B
B
I
GPIO00
EXTINT00
TCLKB0
LRCK1
External Interrupt 0−bit0
MTM0 external Clock B
PCM1 LR Clock
GPIO
I
B
B
I
GPIO01
EXTINT01
External Interrupt 0−bit1
Sum
PCM I/F
MCLK0
MCLK1
GPIO18
Vdd2
Pos
Pos
−
B
B
B
PCM0 maser Clock
PCM1 master Clock
GPIO
d
d
d
d
d
d
d
d
d
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25
LC823455
Table 11. TERMINAL FUNCTIONS (continued)
Terminal Name
Polarity
Direction
Function
Available(d)
Multiplexed
Function
XA
RA
RB
IO POWER
PCM I/F
EXTINT18
BCK0
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
I
B
O
B
I
External Interrupt 1−bit8
PCM0 bit Clock
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
8
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
8
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
8
Vdd2
DMCKO0B
GPIO19
EXTINT19
LRCK0
Digital Mic Ch0 Clock B Output
GPIO
External Interrupt 1−bit9
PCM0 LR Clock
Vdd2
Vdd2
Vdd2
B
I
DMDIN0B
GPIO1A
EXTINT1A
DIN0
Digital Mic Ch0 Data B Input
GPIO
B
I
External Interrupt 1−bit10
PCM0 Data Input
Digital Mic Ch0 Data A Input
GPIO
I
DMDIN0A
GPIO1B
EXTINT1B
DOUT0
I
B
I
External Interrupt 1−bit11
PCM0 Data Output
Digital Mic Ch0 Clock A Output
GPIO
O
O
B
I
DMCKO0A
GPIO1C
EXTINT1C
BCK1
External Interrupt 1−bit12
PCM1 bit Clock
Vdd2
Vdd2
Vdd2
B
B
I
GPIO13
EXTINT13
LRCK1
GPIO
External Interrupt 1−bit3
PCM1 LR Clock
B
B
I
GPIO14
EXTINT14
DOUT1
GPIO
External Interrupt 1−bit4
PCM1 Data Output
GPIO
O
B
I
GPIO15
EXTINT15
External Interrupt 1−bit5
Sum
SD IF
SDCLK0
−
−
−
−
−
−
−
−
−
−
−
−
O
B
B
O
B
I
SD I/F Ch0 Clock Output
SD I/F Ch0 command line
SD I/F Ch0 Data
SD I/F Ch1 Clock Output
GPIO
Vdd2
Vdd2
d
d
d
d
d
d
d
d
d
d
d
d
12
d
d
d
d
d
d
d
d
d
d
d
d
12
SDCMD0
SDAT0[3:0]
SDCLK1
Vdd2
VddSD1
d
d
d
d
d
d
d
d
d
6
GPIO22
EXTINT22
SDCMD1
GPIO23
External Interrupt 2−bit2
SD I/F Ch1 command line
GPIO
VddSD1
VddSD1
B
B
I
EXTINT23
SDAT1[3:0]
GPIO2[7:4]
EXTINT2[7:4]
External Interrupt 2−bit3
SD I/F Ch1 Data
GPIO
B
B
I
External Interrupt 2−bit7 to bit4
Sum
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26
LC823455
Table 11. TERMINAL FUNCTIONS (continued)
Terminal Name
Polarity
Direction
Function
Available(d)
Multiplexed
Function
XA
RA
RB
IO POWER
PSEUDO SRAM
PSM_SCK
−
Neg
−
O
O
P−SRAM I/F Clock Output
Vdd2
Vdd2
Vdd2
d
d
d
PSM_CS
P−SRAM I/F chip select Output
PSM_SDI(DAT0)
I(B)
P−SRAM I/F Data input(QPI
Data0)
PSM_SDO(DAT1)
−
O(B)
P−SRAM I/F Data output(QPI
Data1)
Vdd2
d
PSM_DAT2
PSM_DAT3
−
−
B
B
P−SRAM I/F QPI Data 2
P−SRAM I/F QPI Data 3
Sum
Vdd2
Vdd2
d
d
6
0
0
SDRAM I/F
SDRCLK
SDRCKE
SDRCS
Neg
Pos
Neg
Neg
Neg
Neg
Pos
O
O
O
O
O
O
O
SDRAM Clock Output
Vdd2
Vdd2
Vdd2
Vdd2
Vdd2
Vdd2
Vdd2
d
d
d
d
d
d
d
SDRAM Clock enable Output
SDRAM chip select Output
SDRAM write enable Output
SDRAM CAS Output
SDRWE
SDRCAS
SDRRAS
SDRDQM[1:0]
SDRAM RAS Output
SDRAM Data mask byte lane
select
SDRADDR[10:0]
SDRBA[1:0]
−
−
−
O
O
B
SDRAM address (Note 5)
SDRAM bank select
SDRAM Data
Vdd2
Vdd2
Vdd2
d
d
SDRDATA[15:0]
d
Sum
0
37
0
EXTERNAL MEMORY I/F
Vdd2
Vdd2
NCS0
GPIO06
EXTINT06
NCS1
Neg
O
B
I
chip select0
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
−
−−
Neg
−
GPIO
External Interrupt 0−bit6
chip select1
O
I
(Note 6)
(Note 6)
RXD0
UART Ch0 receive Data
GPIO
d
d
GPIO10
EXTINT10
NRD
−
B
I
d
d
−
External Interrupt 1−bit0
read enable
d
d
Vdd2
Vdd2
Neg
−
O
B
I
(Note 6)
(Note 6)
GPIO17
EXTINT17
NWRENWRL
DIN0
GPIO
d
d
−
External Interrupt 1−bit7
write enable, write enable low
PCM0 Data Input
GPIO
d
d
Neg
−
O
I
(Note 6)
(Note 6)
d
d
GPIO30
EXTINT30
NHBNWRH
−
B
I
d
d
d
d
−
External Interrupt 3−bit0
Vdd2
Neg
O
high byte select, write enable
high
(Note 6)
(Note 6)
TXD0
DOUT0
−
−
−
−
O
O
B
I
UART Ch0 transmit Data
PCM0 Data Output
GPIO
d
d
d
d
d
d
d
d
d
d
d
d
GPIO31
EXTINT31
External Interrupt 3−bit1
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27
LC823455
Table 11. TERMINAL FUNCTIONS (continued)
Terminal Name
Polarity
Direction
Function
Available(d)
Multiplexed
Function
XA
RA
RB
IO POWER
EXTERNAL MEMORY I/F
NLBEXA0
Vdd2
−
−
−
−
−
−
−
−
−
O
B
I
low byte select, address0
(Note 6)
d
d
d
d
d
d
d
d
d
(Note 6)
GPIO16
GPIO
d
d
d
d
EXTINT16
External Interrupt 1−bit6
Vdd2
Vdd2
EXA[20:15]
O
B
I
address
GPIO4[5:0]
GPIO
EXTINT4[5:0]
EXA[14:9]
External Interrupt 4−bit5 to bit0
O
B
I
address
GPIO
GPIO3[F:A]
EXTINT3[F:A]
External Interrupt 3−bit15 to
bit10
Vdd2
Vdd2
EXA[8:5]
GPIO3[9:6]
EXTINT3[9:6]
EXA4
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
O
B
I
address
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
GPIO
External Interrupt 3−bit9 to bit6
O
O
B
I
address
DOUT1
PCM1 Data Output
GPIO35
GPIO
EXTINT35
EXA3
External Interrupt 3−bit5
Vdd2
O
I
address
(Note 6)
DIN1
PCM1 Data Input
d
d
d
GPIO34
B
I
GPIO
EXTINT34
EXA[2:1]
External Interrupt 3−bit4
Vdd2
Vdd2
O
B
I
address
GPIO3[3:2]
EXTINT3[3:2]
EXD[7:0]
GPIO4[D:6]
EXTINT4[D:6]
GPIO
External Interrupt 3−bit3 to bit2
B
B
I
Data
GPIO
External Interrupt 4−bit13 to
bit6
Vdd2
Vdd2
EXD[15:10]
GPIO5[5:0]
EXTINT5[5:0]
EXD[9:8]
−
−
−
−
−
−
B
B
I
Data
d
d
d
d
d
d
GPIO
External Interrupt 5−bit5 to bit0
B
B
I
Data
GPIO4[F:E]
EXTINT4[F:E]
GPIO
External Interrupt 4−bit15 to
bit14
Sum
5
42
6
XTAL, PLL
XIN1
−
−
−
−
I
XTAL input (XT1)
VddXT1
d
d
d
d
d
d
d
d
d
d
d
d
XOUT1
VddXT1
VssXT1
O
P
P
XTAL output (XT1)
XTAL power supply (XT1)
XTAL ground (XT1)
VddXT1
−
−
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28
LC823455
Table 11. TERMINAL FUNCTIONS (continued)
Terminal Name
Polarity
Direction
Function
Available(d)
Multiplexed
Function
XA
RA
RB
IO POWER
XTAL, PLL
XTALINFO[1: 0]
−
B
XTALINFO[1: 0] =
Vdd2
d
“00” : 24MHz
“01” : 12MHz
“10” : 19.2MHz
“11” : reserved
Used for determining clock fre-
quency setting during internal
ROM boot.
Bonding “00” internally for XA.
VCNT1
AVddPLL1
AVssPLL1
VCNT2
−
−
−
−
−
−
O
P
P
O
P
P
PLL1 VCO control
AVddPLL1
d
d
PLL1 analog power supply
PLL1 analog power ground
PLL2 VCO control
−
d
d
d
d
−
d
AVddPLL2
d
AVddPLL2
AVssPLL2
PLL2 analog power supply
PLL2 analog power ground
Sum
−
−
d
d
8
d
d
d
8
d
12
USB−PHY
USBDP
−
−
−
−
−
−
B
B
B
I
USB D+
AVddUSBPHY2
AVddUSBPHY2
AVddUSBPHY18
−
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
USBDM
USB D−
USBEXT02
USBVBUS
USBID
USB reference resistor
USB 5V VBUS detection
USB identifier
B
P
AVddUSBPHY18
−
DVddUSBPHY1
USB−PHY 1.0V digital power
supply
AVddUSBPHY2
AVddUSBPHY18
AVssUSBPHY
−
−
−
P
P
P
USB−PHY 3.3V analog power
supply
−
−
−
d
d
d
d
d
d
USB−PHY 1.8V analog power
supply
USB−PHY ground
d
d
d
2
2
2
Sum
10
10
10
12 BIT ADC
SIN[7: 3]
−
−
−
−
I
ADC input ch7−3
ADC input ch2−0
ADC analog power supply
ADC analog power ground
Sum
AVddADC
d
d
d
d
SIN[2: 0]
I
AVddADC
d
d
d
5
AVddADC
AVssADC
P
P
−
−
d
d
d
d
10
10
CLASS−D AMP
LOUT
AVddDAMPL
AVddDAMPR
−
−
−
−
−
O
O
O
O
P
Lch Class D AMP Output
d
d
d
d
d
d
d
d
d
d
d
d
d
d
d
GPLOUT
ROUT
General purpose Output (GPO)
Rch Class D AMP Output
GPROUT
AVddDAMPL
General purpose Output (GPO)
Lch Class D AMP analog power
supply
−
−
AVddDAMPR
−
P
Rch Class D AMP analog
power supply
d
d
d
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29
LC823455
Table 11. TERMINAL FUNCTIONS (continued)
Terminal Name
Polarity
Direction
Function
Available(d)
Multiplexed
Function
XA
RA
RB
IO POWER
CLASS−D AMP
AVssDAMPL
−
−
P
P
Lch Class D AMP analog power
ground
−
−
d
d
6
d
d
6
d
d
6
AVssDAMPR
Rch Class D AMP analog
power ground
Sum
OTHER, POWER
BMODE[1: 0]
TEST
−
B
I
Boot mode select
Vdd2
d
d
d
d
d
d
Pos
test mode
VddRTC
Connect to ground.
NRES
IO18V
Neg
−
I
I
SoC reset input
Vdd2
Vdd1
d
d
d
d
d
d
1.8 V IO range select for I/O of
Vdd2
“0” : 3.3 V IO operation
“1” : 1.8 V IO operation
When setting “1”, don’t supply
any voltage over the 1.8 V volt-
age range to Vdd2.
Vdd1
Vdd2
−
−
−
−
−
P
P
P
P
P
Digital core power supply
−
−
−
−
−
d
d
d
6
7
6
Digital IO power supply
d
d
d
6
15
7
VddSD1
Vss1
Digital IO power supply(SDI/F
ch1)
d
d
d
1
1
1
Digital core power ground
d
d
d
6
9
6
Vss2
Digital IO power ground
d
d
d
7
15
8
Sum
31
52
33
All Sum
120
240
136
3. Set according to the General RTC mode or KeyInt RTC mode.
4. S−Flash I/F / SD I/F Ch0 includes SFQSCS / SDCMD0 in Timer.
5. SDRAM address bit is 13 bit including SDRADDR [12:11].
6. This function is not available.
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30
LC823455
Signals Handled by Pin Multiplex Function
The pin multiplex function can be used to assign
low−speed signals to any of GPIOs. The table below shows
the signal functions that can be multiplexed and the GPIOs
that can be assigned.
Table 12. PIN MULTIPLEX FUNCTIONS
Number
Module name
Signal name
Function
Assigned GPIO
GPIO00 to 0F
0
I2C0
SCL0
SDA0
SCL1
SDA1
SCK0
SDI0
I2C ch0 Clock
I2C ch0 Data
I2C ch1 Clock
I2C ch1 Data
GPIO10 to 1F
GPIO20 to 2F
GPIO30 to 3F
GPIO40 to 4F
GPIO50 to 59
1
2
I2C1
SPI0
3
4
Serial I/F Ch0 Clock
Serial I/F Ch0 Data Input
Serial I/F Ch0 Data Output
Serial I/F Ch1 Clock
Serial I/F Ch1 Data Input
Serial I/F Ch1 Data Output
MTM0 external Clock A
MTM0 external Clock B
MTM0 Ch0A
5
6
SDO0
SCK1
SDI1
7
SPI1
8
9
SDO1
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
MTM0
TCLKA0
TCLKB0
TIOCA00
TIOCA01
TIOCB00
TIOCB01
TCLKA1
TCLKB1
TIOCA10
TIOCA11
TIOCB10
TIOCB11
RXD0
MTM0 Ch1A
MTM0 Ch0B
MTM0 Ch1B
MTM1
MTM1 external Clock A
MTM1 external Clock B
MTM1 Ch0A
MTM1 Ch1A
MTM1 Ch0B
MTM1 Ch1B
UART0
UART1
UART Ch0 receive Data
UART Ch0 transmit Data
UART Ch1 receive Data
UART Ch1 transmit Data
UART Ch1 clear to send
UART Ch1 request to send
UART Ch2 receive Data
UART Ch2 transmit Data
UART Ch2 clear to send
UART Ch2 request to send
Digital Mic Ch0 Clock Output
Digital Mic Ch0 Data Input
Digital Mic Ch1 Clock Output
Digital Mic Ch1 Data Input
Power control for WIC Sleep
Reserved
TXD0
RXD1
TXD1
CTS1
RTS1
UART2
RXD2
TXD2
CTS2
RTS2
DMIC0
DMIC1
DMCKO0
DMDIN0
DMCKO1
DMDIN1
WICPOWERDOWN
Reserved
OSC
Reserved
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31
LC823455
Boot Mode
The available boot modes are determined by the values on
the BMODE[1:0] terminal.
Table 13. BOOT MODE
IPL mode
BMODE1
BMODE0
Explanation
Physical
Boot
PD
PD
Internal ROM boot (EMMC Physical Boot with USB download)
(SD card I/F Ch0 + USB Device + EXTINT2F)
470 kꢀ
470 kꢀ
USB
IPL2 is transferred to boot partition1 area of eMMC via USB from PC.
Using Boot operation mode of eMMC, IPL2(program) is copied to internal SRAM
from boot partition1 area of eMMC connected to SDCH0 and is executed.
XT1 must be connected in this mode to boot the ROM.
The connection of XTRTC is arbitrary.
Physical
Boot
PD
PU
Internal ROM boot (EMMC Physical Boot with SD Ch1 download)
(SD card I/F Ch0 + SD card I/F Ch1 + EXTINT2F)
470 kꢀ
470 kꢀ
SD
IPL2 is transferred to boot partition1 area of eMMC from SDCH1.
Using Boot operation mode of eMMC, IPL2(program) is copied to internal SRAM
from boot partition1 area of eMMC connected to SDCH0 and is executed.
Either XT1 or XTRTC is required to boot the ROM.
User Area
Boot
PD
PU or PD
Internal ROM boot (User Area Boot with USB download)
(SD card I/F Ch0 + USB Device + EXTINT2F)
1 kꢀ
470 kꢀ
USB
IPL2 is transferred to user area of eMMC via USB from PC.
IPL2(program) is copied to internal SRAM from user area of eMMC connected to
SDCH0 and is executed.
XT1 must be connected in this mode to boot the ROM.
The connection of XTRTC is arbitrary.
User Area
Boot
PU
PD
Internal ROM boot (User Area Boot with SD Ch1 download)
(SD card I/F Ch0 + SD card I/F Ch1 + EXTINT2F)
470 kꢀ
1 kꢀ
SD
IPL2 is transferred to user area of eMMC from SDCH1.
IPL2(program) is copied to internal SRAM from user area of eMMC connected to
SDCH0 and is executed.
Either XT1 or XTRTC is required to boot the ROM.
SPI Boot
USB
PU
PU
Internal ROM boot (External Serial Flash SPI Boot with USB download)
(S−FLASH I/F + USB Device + EXTINT2F )
470 kꢀ
470 kꢀ
IPL2 is transferred to user area of S−FLASH via USB from PC.
IPL2(program) is copied to internal SRAM from user area of S−FLASH and is
executed.
XT1 must be connected in this mode to boot the ROM.
The connection of XTRTC is arbitrary.
SPI Boot
SD
PD
PU
Internal ROM boot (External Serial Flash SPI Boot with SD Ch1 download)
(S−FLASH I/F + SDcard I/F Ch1 + EXTINT2F)
470 kꢀ
1 kꢀ
IPL2 is transferred to user area of S−FLASH from SDCH1.
IPL2(program) is copied to internal SRAM from user area of S−FLASH and is
executed.
Either XT1 or XTRTC is required to boot the ROM.
QSPI Boot
USB
PU
PU
Internal ROM boot
1 kꢀ
470 kꢀ
(External Serial Flash QSPI Boot with USB download)
(S−Flash I/F(QSPI) + USB Device + EXTINT2F)
The IPL supports the direct write of the program using the DD command from USB.
In this mode, the CPU fetches Serial Flash connected to S/Flash IF directly.
XT1 must be connected in this mode to boot the ROM.
The connection of XTRTC is arbitrary.
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32
LC823455
Table 13. BOOT MODE (continued)
IPL mode
BMODE1
BMODE0
Explanation
QSPI Boot
SD
PU
PD
Internal ROM boot
1 kꢀ
470 kꢀ
(External Serial Flash QSPI Boot with SD Ch1 download)
(S−Flash I/F(QSPI) + SD card I/F Ch1 + EXTINT2F)
IPL2 is transferred to S−FLASH from SDCH1.
In this mode, the CPU fetches from Serial Flash connected to S/Flash IF directly.
Either XT1 or XTRTC is required to boot the ROM.
User Area
Delete
PD
PU
Internal ROM boot (User Area IPL2 deletion)
( SD card I/F Ch0 + EXTINT2F)
1 kꢀ
1 kꢀ
It comes to be able to write IPL2 again at User Area Boot.
Either XT1 or XTRTC is necessary to boot the ROM.
Partition
Delete
PD
PD
Internal ROM boot (Partition Area IPL2 deletion)
(SD card I/F Ch0 + EXTINT2F)
470 kꢀ
1 kꢀ
It comes to be able to write IPL2 again at eMMC Physical Boot.
Either XT1 or XTRTC is necessary to boot the ROM.
SPI All
Erase
PU
PU
Internal ROM boot (All external Serial Flash SPI area deletion)
( S−Flash I/F, + EXTINT2F )
470 kꢀ
1 kꢀ
All of Serial Flash is deleted.
Please select it when you use Serial Flash with SPI.
Either XT1 or XTRTC is required to boot the ROM.
SDCH0 All
Erase
PD
PD
Internal ROM boot (All area deletion )
(SD card I/F Ch0 + EXTINT2F)
1 kꢀ
1 kꢀ
All of eMMC is deleted. The partition area is also erased, which takes time. When
eMMC corresponds to Trim, Trim is done.
Either XT1 or XTRTC is required to boot the ROM.
QSPI All
Erase
PU
PD
Internal ROM boot (All external Serial Flash QSPI area deletion)
(S−Flash I/F(QSPI) + EXTINT2F)
1 kꢀ
1 kꢀ
All of Serial Flash is deleted.
Please use it when you use Serial Flash in the fetch mode of QSPI.
Either XT1 or XTRTC is required to boot the ROM.
External
PU
PD
External memory boot (External−0)
ROM Boot
470 kꢀ
470 kꢀ
In this mode, the CPU fetches external memory connected by the external memory
controller of External0 directly.
Either XT1 or XTRTC is required to boot the ROM.
Hi−z
PU
PU
External memory I/F terminal are Hiz
EXA[20:1], EXD[15:0], NCS[1:0], NRD, NWRENWRL, NHBNWRH, NLBEXA0
SD card I/F Ch0 terminal are Hiz
1 kꢀ
1 kꢀ
SDCLK0, SDCMD0, SDAT0[3:0]
S−Flash(QSPI) terminal are Hiz
SFQSCS, SFCK, SFDI(QIO0), SFDO(QIO1), SFWP(QIO2), SFHOLD(QIO3)
Either XT1 or XTRTC is required to boot the ROM.
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33
LC823455
Boot Port
The ports used while booting are described below.
• SPI Boot / SPI All Erase uses only SFCK, SFDO, SFDI
and SFQSCS switched from TIOCB01. SFHOLD and
SFWP (The function is different according to the
device) are not used
• There is no dedicated SDCH0 pin in the WLP package.
Therefore, when booting from eMMC, the terminals
SFCK, SFQSCS, SFDO, SFDI, SFWP, and SFHOLD
must be switched to SDCLK0, SDCMD0, SDAT00,
SDAT01, SDAT02, and SDAT03. The target is Physical
Boot USB · Physical Boot SD · User Area Boot USB ·
User Area Boot SD · User Area Delete, Partition
Delete, SDCH 0 All Erase
• QSPI Boot / QSPI All Erase uses SFCK, SFDO, SFDI,
SFHOLD, SFWP and SFQSCS switched from
TIOCB01
• External ROM boot uses NCS0 and other terminals
required by the external memory controller. It is
available to packages in which the terminals of external
memory controller are assigned.
• SD Card SDCH1 uses only CMD, DATA, and CLK.
The terminals CD and WP are not used. These three
terminals are controlled only when writing IPL2 from
SDCH1
Table 14. GPIOs USED DURING IPL
(RA and RB are under planning.)
SDCH0
Shared (for XA)
P2F(error notification)
Dedicated (for RA)
Dedicated (for RB)
IPL mode
Physical Boot USB
P2F(error notification)
P0D(SDCLK0), P0E(SDAT00), P0F(SDAT01),
P11(SDAT02), P12(SDAT03), P03(SCMD0)
Physical Boot SD
P2F(error notification),
P2F(error notification),
P22(SDCLK1), P23(SDCMD1), P24(SDDATA10),
P25(SDDATA11), P26(SDDATA12),
P27(SDDATA13), P0D(SDCLK0), P0E(SDAT00),
P0F(SDAT01), P11(SDAT02), P12(SDAT03)
P03(SCMD0)
P22(SDCLK1), P23(SDCMD1),
P24(SDDATA10), P25(SDDATA11),
P26(SDDATA12), P27(SDDATA13)
User Area Boot USB
User Area Boot SD
P2F(error notification),
P2F(error notification)
P0D(SDCLK0), P0E(SDAT00), P0F(SDAT01),
P11(SDAT02), P12(SDAT03), P03(SCMD0)
P2F(error notification)
P2F(error notification),
P0D(SDCLK0), P0E(SDAT00), P0F(SDAT01),
P11(SDAT02), P12(SDAT03), P03(SCMD0),
P22(SDCLK1), P23(SDCMD1), P24(SDDATA10),
P25(SDDATA11),
P22(SDCLK1), P23(SDCMD1),
P24(SDDATA10), P25(SDDATA11),
P26(SDDATA12), P27(SDDATA13)
P26(SDDATA12), P27(SDDATA13)
SPI Boot USB
SPI Boot SD
P2F(error notification)
P2F(error notification),
P0D(SFCK), P03(SFQSCS), P0F(SFDO),
P0E(SFDI)
P0D(SFCK), P03(SFQSCS), P0F(SFDO), P0E(SFDI)
P2F(error notification),
P2F(error notification),
P0D(SFCK), P03(SFQSCS) P0F(SFDO),
P0E(SFDI), P22(SDCLK1), P23(SDCMD1),
P24(SDDATA10), P25(SDDATA11),
P26(SDDATA12), P27(SDDATA13)
P0D(SFCK), P03(SFQSCS) P0F(SFDO), P0E(SFDI),
P22(SDCLK1), P23(SDCMD1), P24(SDDATA10),
P25(SDDATA11),
P26(SDDATA12), P27(SDDATA13)
QSPI Boot USB
QSPI Boot SD
P2F(error notification),
P2F(error notification),
P0D(SFCK), P03(SFQSCS), P0F(SFDO),
P0E(SFDI), P11(SFWP), P12(SFHOLD)
P0D(SFCK), P03(SFQSCS), P0F(SFDO), P0E(SFDI),
P11(SFWP), P12(SFHOLD)
P2F(error notification)
P2F(error notification)
P0D(SFCK), P03(SFQSCS), P0F(SFDO),
P0E(SFDI), P011(SFWP), P12(SFHOLD),
P22(SDCLK1), P23(SDCMD1), P24(SDDATA10),
P25(SDDATA11), P26(SDDATA12),
P27(SDDATA13)
P0D(SFCK), P03(SFQSCS), P0F(SFDO), P0E(SFDI),
P011(SFWP), P12(SFHOLD), P22(SDCLK1), P23(SD-
CMD1),
P24(SDDATA10), P25(SDDATA11),
P26(SDDATA12), P27(SDDATA13)
UserArea Delete
P2F(error notification),
P2F(error notification)
P0D(SDCLK0), P0E(SDAT00), P0F(SDAT01),
P11(SDAT02), P12(SDAT03), P03(SCMD0)
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34
LC823455
Table 14. GPIOs USED DURING IPL (continued)
(RA and RB are under planning.)
SDCH0
Dedicated (for RA)
Shared (for XA)
P2F(error notification),
Dedicated (for RB)
IPL mode
Partition Delete
P2F(error notification)
P0D(SDCLK0), P0E(SDAT00), P0F(SDAT01),
P11(SDAT02), P12(SDAT03), P03(SCMD0)
SPI Erase
P2F(error notification),
P2F(error notification),
P0D(SFCK), P03(SFQSCS), P0F(SPIOUT),
P0E(SFDI)
P0D(SFCK), P03(SFQSCS), P0F(SPIOUT), P0E(SFDI)
P2F(error notification)
SDCH0 All Erase
QSPI All Erase
External ROM Boot
P2F(error notification),
P0D(SDCLK0), P0E(SDAT00), P0F(SDAT01),
P11(SDAT02), P12(SDAT03), P03(SCMD0)
P2F(error notification),
P2F(error notification),
P0D(SFCK), P03(SFQSCS), P0F(SFDO),
P0E(SFDI), P11(SFWP), P12(SFHOLD)
P0D(SFCK), P03(SFQSCS), P0F(SFDO), P0E(SFDI),
P11(SFWP), P12(SFHOLD)
N/A
P06(NCS0), P17(NRD),
P30(NWRENWRL)
N/A
P31(NHBNWRH),
P16(NLBEXA0),
P32(EXA01), P33(EXA02),
P34(EXA03), P35(EXA06),
P36(EXA05), P37(EXA06),
P38(EXA07), P39(EXA08),
P3A(EXA09), P3B(EXA10),
P3C(EXA11), P3D(EXA12),
P3E(EXA13), P3F(EXA14),
P40(EXA15), P41(EXA16),
P42(EXA17), P43(EXA18),
P44(EXA19), P45(EXA20),
P46(EXD00), P47(EXD01),
P48(EXD02), P49(EXD03),
P4A(EXD04), P4B(EXD05),
P4C(EXD06), P4D(EXD07),
P4E(EXD08), P4F(EXD09),
P50(EXD10), P51(EXD11),
P52(EXD12), P53(EXD13),
P54(EXD14), P55(EXD15)
HI−z
SDCLK0 is set to the Hi−z input.
7. In this table, “Pxx” means “GPIOxx”. For example “P2F” means “GPIO2F”.
SDIF PullUp
If using the SDIF port during boot mode, internal PullUp
resistors are used (SDCMD0, SDAT0[3:0] / SDCMD1,
SDAT1[3:0]). Therefore, external PullUp resistors are not
required on the board.
termination of USB connection, as well as error notification
with High/Low of the terminal.
When errors occur during boot sequences, for example
writing of IPL2, GPIO2F reports the sort of error. Moreover,
GPIO2F can indicate the status of USB connection and the
completion of USB file transfer. Additionally, Delete Mode,
completion of Erase, and status of Erase can also be reported
through a sequence of Low/High.
For more detail about the behavior of this port used during
boot, refer to the “IPL detail” chapter in the “LC823455
Sample Software Reference”.
SFQSCS PullUp
If using SFQSCS during boot mode, the initial condition
for terminal P03 relative to SFQSCS is Pull−Up. After
terminal P03 is switched to SFQSCS, the Pull−Up is
released.
GPIO2F
During boot mode, GPIO2F provides notification of the
beginning of USB connection, notification of the
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35
LC823455
PIN ASSIGNMENT
Table 15. PIN ASSIGNMENT
I/O
I
Input
Output
O
B
P
G
Bidirectional
Power
Ground
XA: Package Code = “XA”, RA: Package Code = “RA”, RB: Package Code = “RB”, (RA and RB are under planning).
Table 16.
RA
RB
XA
BGA240
BGA136
WLP120
Input
Type
Output
Type
IO
Pwr Grp
IO
No.
Ball
M13
N14
M12
No.
Ball
−
No.
Ball
−
Circuit Type
PIN NAME
Vdd2
I/O
P
Drive
PU/PD
1
2
3
−
−
−
−
−
−
−
−
Vss2
G
−
−
EXD0/
GPIO46/
EXTINT46
B/
B/
I
Schmitt
Schmitt
Schmitt
Schmitt
Schmitt
Schmitt
3−State
3−State
3−State
3−State
3−State
3−State
2/4/8 mA
2/4/8 mA
2/4/8 mA
2/4/8 mA
2/4/8 mA
2/4/8 mA
PD
PD
PD
PD
PD
PD
Vdd2
Vdd2
Vdd2
Vdd2
Vdd2
Vdd2
3ISD/3T2
(4)(8)
4
5
6
7
8
M14
L13
L14
K11
K13
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
EXA1/
GPIO32/
EXTINT32
O/
B/
I
3ISD/3T2
(4)(8)
EXA11/
GPIO3C/
EXTINT3C
O/
B/
I
3ISD/3T2
(4)(8)
EXA12/
GPIO3D/
EXTINT3D
O/
B/
I
3ISD/3T2
(4)(8)
EXA13/
GPIO3E/
EXTINT3E
O/
B/
I
3ISD/3T2
(4)(8)
EXA14/
GPIO3F/
EXTINT3F
O/
B/
I
3ISD/3T2
(4)(8)
9
R15
R16
1
2
R15
R16
1
2
L10
H8
Vdd1
P
10
NRD/
GPIO17/
EXTINT17
O/
B/
I
Schmitt
Schmitt
3−State
3−State
2/4/8 mA
2 mA
PD
PU
Vdd2
Vdd2
3ISD/3T2
(4)(8)
11
P15
3
P15
3
K9
SWDIO/
DMDIN0B/
GPIO59/
B/
I/
B/
I
3ISU/3T2
EXTINT59
12
13
14
P16
K14
J10
4
−
−
P16
−
4
−
−
G7
−
NLBEXA0/
GPIO16/
EXTINT16
O/
B/
I
Schmitt
Schmitt
Schmitt
3−State
3−State
3−State
2/4/8 mA
2/4/8 mA
2/4/8 mA
PD
PD
PD
Vdd2
Vdd2
Vdd2
3ISD/3T2
(4)(8)
EXD2/
GPIO48/
EXTINT48
B/
B/
I
3ISD/3T2
(4)(8)
−
−
EXA2/
GPIO33/
EXTINT33
O/
B/
I
3ISD/3T2
(4)(8)
15
16
N15
J11
5
−
N15
−
5
−
L9
−
Vss2
G
EXA6/
GPIO37/
EXTINT37
O/
B/
I
Schmitt
Schmitt
Schmitt
3−State
3−State
3−State
2/4/8 mA
2/4/8 mA
2/4/8 mA
PD
PD
Vdd2
Vdd2
Vdd2
3ISD/3T2
(4)(8)
17
18
J13
J14
−
−
−
−
−
−
−
−
EXA7/
GPIO38/
EXTINT38
O/
B/
I
3ISD/3T2
(4)(8)
SDRADDR12/
GPIO2A/
EXTINT2A
O/
B/
I
PU/PD
3ISUD/3T2
(4)(8)
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36
LC823455
Table 16. (continued)
RA
RB
XA
BGA240
BGA136
WLP120
Input
Type
Output
Type
IO
Pwr Grp
IO
No.
Ball
No.
Ball
No.
Ball
Circuit Type
PIN NAME
I/O
Drive
PU/PD
19
20
N16
6
7
N16
6
J8
TDI/
SDCD1/
SWO/
GPIO20/
EXTINT20
I/
I/
O/
B/
I
Schmitt
3−State
2 mA
PU/PD
VddSD1
3ISUD/3T2
M15
M15
7
K8
TDO/
O/
I/
B/
I
Schmitt
3−State
2 mA
PU/PD
VddSD1
3ISUD/3T2
SDWP1/
GPIO21/
EXTINT21
21
22
M16
L15
8
9
M16
L15
8
9
L8
VddSD1
P
H7
SDCMD1/
GPIO23/
EXTINT23
B/
B/
I
CMOS
CMOS
CMOS
3−State
3−State
3−State
2/4/8/10
mA
PU/PD
PU/PD
PU/PD
VddSD1
VddSD1
VddSD1
3ICUD/3T2
(4)(8)(10)
23
24
L16
K12
10
11
L16
K12
10
11
J7
SDAT10/
GPIO24/
EXTINT24
B/
B/
I
2/4/8/10mA
2/4/8/10mA
3ICUD/3T2
(4)(8)(10)
K7
SDAT11/
GPIO25/
EXTINT25
B/
B/
I
3ICUD/3T2
(4)(8)(10)
25
26
J15
12
13
J15
12
13
L7
F5
Vss2
G
K16
K16
SDAT12/
GPIO26/
EXTINT26
B/
B/
I
CMOS
CMOS
CMOS
3−State
3−State
3−State
2/4/8/10mA
2/4/8/10mA
2/4/8/10mA
PU/PD
PU/PD
PU/PD
VddSD1
VddSD1
VddSD1
3ICUD/3T2
(4)(8)(10)
27
28
J12
14
15
J12
14
15
G6
H6
SDAT13/
GPIO27/
EXTINT27
B/
B/
I
3ICUD/3T2
(4)(8)(10)
K15
K15
SDCLK1/
GPIO22/
EXTINT22
O/
B/
I
3ICUD/3T2
(4)(8)(10)
29
30
31
32
33
34
35
36
37
38
J16
H12
H15
H16
G15
G16
H13
F15
F16
E16
16
17
18
19
20
21
−
J16
H12
H15
H16
G15
G16
−
16
−
L6
−
Vss1
RTCMODE
VddRTC
XIN32K
G
I
CMOS
X
−
−
−
−
−
−
VddRTC
VddRTC
1IC
X
17
18
19
20
−
K6
J5
K5
L5
−
P
I
VssRTC
XOUT32K
Keyint2
G
O
I
−
X
−
−
−
PD
−
VddRTC
VddRTC
VddRTC
VddRTC
VddRTC
X
CMOS
CMOS
CMOS
−
−
1ICD
1IC
22
23
24
F15
F16
E16
−
−
BACKUPB
VDET
I
−
−
21
22
J6
H5
I
−
−
−
1IC
RTCINT (Note
8)
O
OD
0.3 mA−OD
−
OD3
39
40
41
42
43
44
45
46
47
48
49
50
51
G12
E15
F12
D15
D14
D16
C15
C14
C16
E13
E14
D13
H10
25
26
27
28
−
G12
E15
F12
D15
−
23
24
25
26
−
G5
H4
L4
K4
−
Keyint0
TEST
I
CMOS
CMOS
CMOS
−
−
−
−
−
−
PD
−
VddRTC
VddRTC
VddRTC
1ICD
1IC
I
Keyint1
AVddPLL1
VCNT1
AVssPLL1
AVddPLL2
VCNT2
AVssPLL2
Vss1
I
PD
1ICD
P
O
G
P
O
G
G
P
G
−
−
1A
1A
−
−
−
−
AVddPLL1
AVddPLL2
1A
1A
29
30
−
D16
C15
−
27
28
−
J4
K3
−
31
−
C16
−
29
−
L3
−
−
−
−
−
Vdd2
−
−
−
−
Vss2
−
−
−
−
EXD4/
GPIO4A/
EXTINT4A
B/
B/
I
Schmitt
Schmitt
3−State
3−State
2/4/8 mA
2/4/8 mA
PD
PD
Vdd2
Vdd2
3ISD/3T2
(4)(8)
52
H11
−
−
−
−
EXD5/
GPIO4B/
EXTINT4B
B/
B/
I
3ISD/3T2
(4)(8)
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37
LC823455
Table 16. (continued)
RA
RB
XA
BGA240
BGA136
WLP120
Input
Type
Output
Type
IO
Pwr Grp
IO
No.
Ball
B15
H14
No.
Ball
B15
−
No.
Ball
L2
−
Circuit Type
PIN NAME
I/O
Drive
PU/PD
PD
53
54
32
−
30
−
Vdd1
P
EXD6/
GPIO4C/
EXTINT4C
B/
B/
I
Schmitt
Schmitt
Schmitt
Schmitt
Schmitt
3−State
3−State
3−State
3−State
3−State
2/4/8 mA
2/4/8 mA
2/4/8 mA
2/4/8 mA
2/4/8 mA
Vdd2
Vdd2
Vdd2
Vdd2
Vdd2
3ISD/3T2
(4)(8)
55
56
57
58
G10
G11
G13
G14
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
EXA19/
GPIO44/
EXTINT44
O/
B/
I
PD
3ISD/3T2
(4)(8)
EXA20/
GPIO45/
EXTINT45
O/
B/
I
PD
3ISD/3T2
(4)(8)
EXD7/
GPIO4D/
EXTINT4D
B/
B/
I
PD
3ISD/3T2
(4)(8)
EXD8/
GPIO4E/
EXTINT4E
B/
B/
I
PD
3ISD/3T2
(4)(8)
59
60
B14
F14
33
−
B14
−
31
−
L1
−
Vss1
G
EXD11/
GPIO51/
EXTINT51
B/
B/
I
Schmitt
Schmitt
Schmitt
Schmitt
3−State
3−State
3−State
3−State
2/4/8 mA
2/4/8 mA
2/4/8 mA
2/4/8 mA
PD
PD
PD
PD
Vdd2
Vdd2
Vdd2
Vdd2
3ISD/3T2
(4)(8)
61
62
63
F13
D12
F11
−
−
−
−
−
−
−
−
−
−
−
−
EXD12/
GPIO52/
EXTINT52
B/
B/
I
3ISD/3T2
(4)(8)
EXD13/
GPIO53/
EXTINT53
B/
B/
I
3ISD/3T2
(4)(8)
EXD14/
GPIO54/
EXTINT54
B/
B/
I
3ISD/3T2
(4)(8)
64
65
C13
A16
−
−
−
−
Vss2
G
34
A16
32
K2
DOUT1/
GPIO15/
EXTINT15
O/
B/
I
Schmitt
Schmitt
Schmitt
3−State
3−State
3−State
2/4/8 mA
2/4/8 mA
2/4/8 mA
PU/PD
PD
Vdd2
Vdd2
Vdd2
3ISUD/3T2
(4)(8)
66
67
D11
F10
−
−
−
−
−
−
−
−
EXD9/
GPIO4F/
EXTINT4F
B/
B/
I
3ISD/3T2
(4)(8)
EXD10/
GPIO50/
EXTINT50
B/
B/
I
PD
3ISD/3T2
(4)(8)
68
69
B16
D10
35
−
B16
−
33
−
K1
−
Vdd2
P
EXD15/
GPIO55/
EXTINT55
B/
B/
I
Schmitt
Schmitt
Schmitt
3−State
3−State
3−State
2/4/8 mA
2/4/8 mA
2/4/8 mA
PD
Vdd2
Vdd2
Vdd2
3ISD/3T2
(4)(8)
70
71
A15
A14
36
37
A15
A14
34
35
J3
BCK1/
GPIO13/
EXTINT13
B/
B/
I
PU/PD
PU/PD
3ISUD/3T2
(4)(8)
G4
MCLK0/
MCLK1/
GPIO18/
EXTINT18
B/
B/
B/
I
3ISUD/3T2
(4)(8)
72
A13
38
A13
36
J2
LRCK1/
GPIO14/
EXTINT14
B/
B/
I
Schmitt
3−State
2/4/8 mA
PU/PD
Vdd2
3ISUD/3T2
(4)(8)
73
74
75
B13
C11
B12
39
−
B13
−
37
−
J1
−
Vss2
Vdd2
G
P
40
B12
38
H3
BCK0/
DMCKO0B/
GPIO19/
B/
O/
B/
I
Schmitt
Schmitt
Schmitt
3−State
3−State
3−State
2/4/8 mA
2/4/8 mA
2/4/8 mA
PU/PD
PU/PD
PU/PD
Vdd2
Vdd2
Vdd2
3ISUD/3T2
(4)(8)
EXTINT19
76
77
A12
B11
41
42
A12
B11
39
40
G3
H2
LRCK0/
DMDIN0B/
GPIO1A/
B/
I/
B/
I
3ISUD/3T2
(4)(8)
EXTINT1A
DIN0/
I/
I/
B/
I
3ISUD/3T2
(4)(8)
DMDIN0A/
GPIO1B/
EXTINT1B
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38
LC823455
Table 16. (continued)
RA
RB
XA
BGA240
BGA136
WLP120
Input
Type
Output
Type
IO
Pwr Grp
IO
No.
Ball
C12
G9
No.
Ball
−
No.
Ball
−
Circuit Type
PIN NAME
Vss2
I/O
G
Drive
PU/PD
78
79
−
−
−
−
−
−
XTALINFO1
B
Schmitt
Schmitt
3−State
2/4/8 mA
PU
Vdd2
Vdd2
3ISU/3T2
(4)(8)
80
81
C10
A11
−
−
−
−
Vdd2
P
43
A11
41
H1
DOUT0/
DMCKO0A
GPIO1C/
O/
O/
B/
I
3−State
2/4/8 mA
PU/PD
3ISUD/3T2
(4)(8)
EXTINT1C
82
83
84
85
A10
B10
F9
44
45
−
A10
B10
−
42
43
−
F4
F3
−
BMODE0
BMODE1
B
B
O
Schmitt
Schmitt
−
3−State
3−State
3−State
3−State
2 mA
2 mA
PU/PD
PU/PD
−
Vdd2
Vdd2
Vdd2
Vdd2
3ISUD/3T2
3ISUD/3T2
3T2(4)(8)
SDRADDR1
2/4/8 mA
2/4/8 mA
D9
−
−
−
−
EXA4/
DOUT1/
GPIO35/
EXTINT35
O/
O/
B/
I
Schmitt
PD
3ISD/3T2
(4)(8)
86
87
88
89
C9
B9
A9
A8
−
−
−
−
SDRADDR0
NRES
O
I
−
3−State
−
2/4/8 mA
−
−
−
Vdd2
Vdd2
3T2(4)(8)
3IS
46
47
48
B9
A9
A8
44
45
46
G1
G2
F1
Schmitt
AVssDAMPR
G
ROUT/
GPROUT
O/
O
−
−
1A
1A
−
−
−
−
AVddDAMPR
AVddDAMPL
1A
1A
90
91
92
A7
A6
A5
49
50
51
A7
A6
A5
47
48
49
F2
E2
E1
AVddDAMPR
AVddDAMPL
P
P
LOUT/
GPLOUT
O/
O
93
94
95
96
97
A4
B8
52
53
−
A4
B8
−
50
51
−
D2
D1
−
AVssDAMPL
Vss1
G
G
O
O
G8
D8
SDRADDR2
SDRADDR3
−
−
3−State
3−State
3−State
2/4/8 mA
2/4/8 mA
2/4/8 mA
−
−
Vdd2
Vdd2
Vdd2
3T2(4)(8)
3T2(4)(8)
−
−
−
−
E12
54
E12
52
E3
SCL1/
GPIO2B/
EXTINT2B
O/
B/
I
Schmitt
PU/PD
3ISUD/3T2
(4)(8)
98
99
E11
E10
55
56
E11
E10
53
54
E4
D3
SDA1/
GPIO2C/
EXTINT2C
B/
B/
I
Schmitt
Schmitt
3−State
3−State
2/4/8 mA
2/4/8 mA
PU/PD
PU/PD
Vdd2
Vdd2
3ISUD/3T2
(4)(8)
SDRADDR11/
DMCKO0A/
GPIO2D/
O/
O/
B/
I
3ISUD/3T2
(4)(8)
EXTINT2D
100
C8
−
−
−
−
SDRDATA0
B
CMOS
3−State
2/4/8 mA
PD
Vdd2
3ICD/3T2
(4)(8)
101
102
B7
C7
57
−
B7
−
55
−
C1
−
Vdd1
P
B
SDRDATA1
CMOS
3−State
3−State
2/4/8 mA
2/4/8 mA
PD
Vdd2
Vdd2
3ICD/3T2
(4)(8)
103
104
105
E9
E8
E7
58
59
60
E9
E8
E7
56
57
58
C2
D4
C3
TCLKA0/
BCK1/
GPIO00/
EXTINT00
I/
B/
B/
I
Schmitt
PU/PD
3ISUD/3T2
(4)(8)
TCLKB0/
LRCK1/
GPIO01/
EXTINT01
I/
B/
B/
I
Schmitt
Schmitt
3−State
3−State
2/4/8 mA
2/4/8 mA
PU/PD
PD
Vdd2
Vdd2
3ISUD/3T2
(4)(8)
NHBNWRH/
TXD0/
DOUT0/
GPIO31/
EXTINT31
O/
O/
O/
B/
I
3ISD/3T2
(4)(8)
106
107
108
C6
B5
D7
−
61
−
−
B5
−
−
59
−
−
B1
−
Vdd2
Vss2
P
G
B
PSM_DAT2
CMOS
3−State
2/4/8/10 mA
PU/PD
Vdd2
3ICUD/3T2
(4)(8)(10)
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39
LC823455
Table 16. (continued)
RA
RB
XA
BGA240
BGA136
WLP120
Input
Type
Output
Type
IO
Pwr Grp
IO
No.
Ball
No.
Ball
No.
Ball
Circuit Type
PIN NAME
I/O
Drive
PU/PD
109
D6
−
−
−
−
PSM_SDO
(DAT1)
O(B)
CMOS
3−State
2/4/8/10 mA
PU/PD
Vdd2
Vdd2
3ICUD/3T2
(4)(8)(10)
110
D5
−
−
−
−
PSM_DAT3
B
CMOS
3−State
2/4/8/10 mA
PU/PD
3ICUD/3T2
(4)(8)(10)
111
112
C5
C4
−
−
−
−
−
−
−
−
SDRADDR4
SDRDATA4
O
B
−
3−State
3−State
2/4/8 mA
2/4/8 mA
−
Vdd2
Vdd2
3T2(4)(8)
CMOS
PD
3ICD/3T2
(4)(8)
113
C3
−
−
−
−
SDRDATA14
B
CMOS
3−State
2/4/8 mA
PD
Vdd2
3ICD/3T2
(4)(8)
114
115
116
B6
D4
D3
62
−
B6
−
60
−
A1
−
Vdd2
Vdd2
P
P
B
−
−
−
−
SDRDATA2
CMOS
CMOS
CMOS
CMOS
CMOS
CMOS
3−State
3−State
3−State
3−State
3−State
3−State
2/4/8 mA
2/4/8 mA
PD
PD
Vdd2
Vdd2
Vdd2
Vdd2
Vdd2
Vdd2
3ICD/3T2
(4)(8)
117
118
119
120
121
E4
E3
F7
F6
F8
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
SDRDATA3
B
B
3ICD/3T2
(4)(8)
SDRDATA15
2/4/8 mA
PD
3ICD/3T2
(4)(8)
PSM_SDI
(DAT0)
I(B)
O
2/4/8/10 mA
2/4/8/10mA
2/4/8/10 mA
PU/PD
PU/PD
PU/PD
3ICUD/3T2
(4)(8)(10)
PSM_CS
3ICUD/3T2
(4)(8)(10)
PSM_SCK
O
3ICUD/3T2
(4)(8)(10)
122
123
F4
F3
−
−
−
−
−
−
−
−
SDRADDR7
SDRDATA5
O
B
−
3−State
3−State
2/4/8 mA
2/4/8 mA
−
Vdd2
Vdd2
3T2(4)(8)
CMOS
PD
3ICD/3T2
(4)(8)
124
G7
−
−
−
−
SDRDATA13
Vss2
B
CMOS
3−State
2/4/8 mA
PD
Vdd2
3ICD/3T2
(4)(8)
125
126
B4
A2
63
64
B4
A2
61
62
A2
B2
G
EXTINT2E/GP
IO2E
I/B
Schmitt
Schmitt
3−State
3−State
2/4/8 mA
2/4/8 mA
PU/PD
PU
Vdd2
Vdd2
3ISUD/3T2
(4)(8)
127
A1
65
A1
63
B3
NCS1/
RXD0/
GPIO10/
EXTINT10
O/
I/
B/
I
3ISU/3T2
(4)(8)
128
129
130
G6
G4
G3
−
−
−
−
−
−
−
−
−
−
−
−
SDRDATA12
SDRDATA6
SDRDATA7
B
B
B
CMOS
CMOS
CMOS
3−State
3−State
3−State
2/4/8 mA
2/4/8 mA
2/4/8 mA
PD
PD
PD
Vdd2
Vdd2
Vdd2
3ICD/3T2
(4)(8)
3ICD/3T2
(4)(8)
3ICD/3T2
(4)(8)
131
132
B3
H7
66
−
B3
−
64
−
A3
−
Vss1
G
B
SDRDATA8
CMOS
Schmitt
Schmitt
3−State
3−State
3−State
2/4/8 mA
2/4/8 mA
2/4/8 mA
PD
Vdd2
Vdd2
Vdd2
3ICD/3T2
(4)(8)
133
134
B2
B1
67
68
B2
B1
65
66
C4
B4
EXTINT2F/
GPIO2F
I/
B
PU/PD
PU/PD
3ISUD/3T2
(4)(8)
TCK/
I/
I/
B/
I
3ISUD/3T2
(4)(8)
SDCD2/
GPIO29/
EXTINT29
135
H6
−
−
−
−
SDRDATA9
B
CMOS
CMOS
3−State
3−State
2/4/8 mA
2/4/8 mA
PD
PD
Vdd2
Vdd2
3ICD/3T2
(4)(8)
136
137
A3
H4
69
−
A3
−
67
−
A4
−
Vdd2
P
B
SDRDATA11
3ICD/3T2
(4)(8)
www.onsemi.com
40
LC823455
Table 16. (continued)
RA
RB
XA
BGA240
BGA136
WLP120
Input
Type
Output
Type
IO
Pwr Grp
IO
No.
Ball
No.
Ball
No.
Ball
Circuit Type
PIN NAME
I/O
Drive
PU/PD
138
H3
−
−
−
−
SDRDATA10
B
CMOS
3−State
2/4/8 mA
PD
Vdd2
Vdd2
3ICD/3T2
(4)(8)
139
C2
70
C2
68
D5
TIOCA01/
SDCMD2/
PHI1/
GPIO0A/
EXTINT0A
B/
B/
O/
B/
I
CMOS
3−State
2/4/8/10 mA
PU/PD
3ICUD/3T2
(4)(8)(10)
140
141
C1
D2
71
72
C1
D2
69
70
C5
B5
TXD1/
SDAT20/
GPIO04/
EXTINT04
O/
B/
B/
I
CMOS
CMOS
3−State
3−State
2/4/8/10 mA
2/4/8/10 mA
PU/PD
PU/PD
Vdd2
Vdd2
3ICUD/3T2
(4)(8)(10)
RXD1/
SDAT21/
GPIO05/
EXTINT05
I/
B/
B/
I
3ICUD/3T2
(4)(8)(10)
142
143
144
J7
D1
E6
−
−
−
−
Vss2
Vdd1
G
P
73
74
D1
E6
71
72
A5
E5
CTS1/
SDAT22/
RXD0/
GPIO56/
EXTINT56
I/
B/
I/
B/
I
CMOS
CMOS
CMOS
3−State
3−State
3−State
2/4/8/10 mA
2/4/8/10 mA
2/4/8/10 mA
PU/PD
PU/PD
PU/PD
Vdd2
Vdd2
Vdd2
3ICUD/3T2
(4)(8)(10)
145
146
E5
E2
75
76
E5
E2
73
74
C6
B6
RTS1/
SDAT23/
TXD0/
GPIO57/
EXTINT57
O/
B/
O/
B/
I
3ICUD/3T2
(4)(8)(10)
TIOCA00/
SDCLK2/
PHI0/
GPIO09/
EXTINT09
B/
O/
O/
B/
I
3ICUD/3T2
(4)(8)(10)
147
148
149
150
151
J6
J4
J3
H9
E1
−
−
−
−
−
−
−
−
SDRADDR5
SDRADDR6
SDRADDR9
Vdd2
O
O
O
P
−
−
−
3−State
3−State
3−State
2/4/8 mA
2/4/8 mA
2/4/8 mA
−
−
−
Vdd2
Vdd2
Vdd2
3T2(4)(8)
3T2(4)(8)
3T2(4)(8)
−
−
−
−
77
78
H9
E1
75
76
A6
D6
TMS/
I/
I/
B/
I
Schmitt
Schmitt
Schmitt
3−State
3−State
3−State
2/4/8 mA
2/4/8 mA
2/4/8 mA
PU/PD
PU/PD
PU/PD
Vdd2
Vdd2
Vdd2
3ISUD/3T2
(4)(8)
SDWP2/
GPIO28/
EXTINT28
152
153
F5
F2
79
80
F5
F2
77
78
E6
D7
TXD2/
O/
B/
B/
I
3ISUD/3T2
(4)(8)
TIOCA10/
GPIO0B/
EXTINT0B
RXD2/
I/
B/
B/
I
3ISUD/3T2
(4)(8)
TIOCA11/
GPIO0C/
EXTINT0C
154
155
156
157
158
K6
K4
F1
K3
G5
−
−
−
−
−
−
−
−
SDRBA1
SDRBA0
Vss2
O
O
G
O
−
−
3−State
3−State
2/4/8 mA
2/4/8 mA
−
−
Vdd2
Vdd2
3T2(4)(8)
3T2(4)(8)
81
−
F1
−
79
−
A7
−
SDRADDR10
−
3−State
3−State
2/4/8 mA
−
Vdd2
Vdd2
3T2(4)(8)
82
G5
80
B7
SFCK/
GPIO0D/
EXTINT0D/
SDCLK0
O/
B/
I/
CMOS
2/4/8/10 mA
PU/PD
3ICUD/3T2
(4)(8)(10)
O
159
160
G2
G1
83
84
G2
G1
81
82
C7
E7
TIOCB01/
SFQSCS/
GPIO03/
EXTINT03/
SDCMD0
B/
O/
B/
I/
CMOS
3−State
2/4/8/10 mA
PU/PD
Vdd2
3ICUD/3T2
(4)(8)(10)
B
SFDO(QIO1)/
GPIO0F/
EXTINT0F/
SDAT01
O(B)/
B/
I/
CMOS
3−State
3−State
2/4/8/10 mA
2/4/8 mA
PU/PD
Vdd2
Vdd2
3ICUD/3T2
(4)(8)(10)
B
161
162
L4
−
−
−
−
SDRRAS
Vdd2
O
P
−
−
3T2(4)(8)
H8
85
H8
83
A8
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41
LC823455
Table 16. (continued)
RA
RB
XA
BGA240
BGA136
WLP120
Input
Type
Output
Type
IO
Pwr Grp
IO
No.
Ball
No.
Ball
No.
Ball
Circuit Type
PIN NAME
I/O
Drive
PU/PD
163
164
165
H5
86
87
88
H5
84
85
86
B8
SFDI(QIO0)/
GPIO0E/
EXTINT0E/
SDAT00
I(B)/
B/
I/
CMOS
CMOS
CMOS
3−State
2/4/8/10 mA
PU/PD
Vdd2
Vdd2
Vdd2
3ICUD/3T2
(4)(8)(10)
B
H2
H1
H2
H1
C8
D8
SFWP(QIO2)/
GPIO11/
EXTINT11/
SDAT02
O(B)/
B/
I/
3−State
3−State
2/4/8/10 mA
2/4/8/10 mA
PU/PD
PU/PD
3ICUD/3T2
(4)(8)(10)
B
SFHOLD(QIO
3)/
GPIO12/
EXTINT12/
SDAT03
O(B)/
B/
I/
3ICUD/3T2
(4)(8)(10)
B
166
167
168
169
L2
L3
M5
J5
89
−
L2
−
87
−
A9
−
Vss1
G
O
O
SDRWE
SDRCKE
−
−
3−State
3−State
3−State
2/4/8 mA
2/4/8 mA
2/4/8 mA
−
−
Vdd2
Vdd2
Vdd2
3T2(4)(8)
3T2(4)(8)
−
−
−
−
90
J5
88
B9
TIOCB00/
DIN1/
DMDIN0A/
GPIO02/
EXTINT02
B/
I/
I/
B/
I
Schmitt
PU/PD
3ISUD/3T2
(4)(8)
170
171
172
173
174
M4
M3
M2
N3
J2
−
−
−
−
−
−
−
−
SDRCLK
SDRCS
IO18V
O
O
I
−
−
3−State
3−State
−
2/4/8/10 mA
2/4/8 mA
−
−
−
−
Vdd2
Vdd2
Vdd1
3T2(4)(8)(10)
3T2(4)(8)
1A
91
−
M2
−
89
−
A10
−
1A
Vss1
G
B
92
J2
−
−
SDAT02
CMOS
CMOS
CMOS
3−State
3−State
3−State
2/4/8/10 mA
2/4/8/10 mA
2/4/8/10 mA
PU/PD
PU/PD
PU/PD
Vdd2
Vdd2
Vdd2
3ICUD/3T2
(4)(8)(10)
175
176
J1
93
94
J1
−
−
−
−
SDAT03
SDAT01
B
B
3ICUD/3T2
(4)(8)(10)
K5
K5
3ICUD/3T2
(4)(8)(10)
177
178
179
180
181
K2
L1
95
96
97
−
K2
L1
M1
−
−
−
−
−
Vdd2
Vss2
P
G
P
O
B
M1
M6
K1
90
−
A11
−
Vdd1
SDRDQM1
SDAT00
−
3−State
3−State
2/4/8 mA
−
Vdd2
Vdd2
3T2(4)(8)
98
K1
−
−
CMOS
2/4/8/10 mA
PU/PD
3ICUD/3T2
(4)(8)(10)
182
183
L6
L5
99
L6
L5
−
−
−
−
SDCLK0
SDCMD0
O
B
−
3−State
3−State
2/4/8/10 mA
2/4/8/10 mA
−
Vdd2
Vdd2
3T2(4)(8)(10)
100
CMOS
PU/PD
3ICUD/3T2
(4)(8)(10)
184
185
186
187
188
189
190
191
192
193
194
195
196
197
198
K7
M7
N5
N4
N1
P1
R1
N2
P2
R2
P3
R3
P4
R4
P5
−
−
−
−
−
−
SDRADDR8
SDRCAS
Vdd2
O
O
P
G
I
−
−
3−State
3−State
2/4/8 mA
2/4/8 mA
−
−
Vdd2
Vdd2
3T2(4)(8)
3T2(4)(8)
−
−
−
−
−
−
−
−
−
−
Vss2
101
102
103
104
105
106
107
108
109
110
111
N1
P1
R1
N2
P2
R2
P3
R3
P4
R4
P5
91
92
93
94
−
B11
B10
C9
C11
−
SIN0
3A
3A
3A
−
−
−
−
−
−
−
−
−
AvddADC
AvddADC
AvddADC
3A
3A
3A
SIN1
I
SIN2
I
AVddADC
SIN3
P
I
3A
3A
3A
3A
3A
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
AvddADC
AvddADC
AvddADC
AvddADC
AvddADC
3A
3A
3A
3A
3A
−
−
SIN4
I
−
−
SIN5
I
−
−
SIN6
I
−
−
SIN7
I
95
96
C10
E8
AVssADC
AVssUSBPHY
G
G
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42
LC823455
Table 16. (continued)
RA
RB
XA
BGA240
BGA136
WLP120
Input
Type
Output
Type
IO
Pwr Grp
IO
No.
Ball
No.
Ball
No.
Ball
Circuit Type
PIN NAME
I/O
Drive
PU/PD
199
R5
112
R5
97
D11
B
3A
3A
−
−
AVddUSBPHY
18
3A
USBEXT0
2
200
201
P6
R6
113
114
P6
R6
98
99
D9
AVddUSBPHY
2
P
B
D10
USBDM
3A
3A
3A
3A
−
−
−
−
AVddUSBPHY
2
3A
3A
202
203
P7
R7
115
116
P7
R7
100
101
E9
AVssUSBPHY
USBDP
G
B
E10
AVddUSBPHY
2
204
P8
117
P8
102
F8
DVddUSBPHY
1
P
205
206
R8
P9
118
119
R8
P9
103
104
F9
I
−
−
−
−
−
USBVBUS
F10
AVddUSBPHY
18
P
207
R9
120
R9
105
F11
B
3A
3A
AVddUSBPHY
18
3A
USBID
208
209
210
211
212
213
214
215
R10
R11
P10
P11
N10
N9
121
122
123
124
−
R10
R11
P10
P11
−
106
107
108
109
−
G8
G9
G10
G11
−
VddXT1
XIN1
P
I
X
−
−
−
−
−
−
VddXT1
VddXT1
X
X
VssXT1
XOUT1
Vss1
G
O
G
P
P
B
X
−
−
−
−
Vdd1
N12
N6
−
−
−
−
Vdd2
−
−
−
−
XTALINFO0
Schmitt
3−State
2/4/8 mA
PU
Vdd2
3ISU/3T2
(4)(8)
216
217
N11
L7
−
−
−
−
Vss2
G
125
L7
110
F7
SDO0/
GPIO1F/
EXTINT1F
O/
B/
I
Schmitt
Schmitt
3−State
3−State
2/4/8 mA
2/4/8 mA
PU/PD
PU/PD
Vdd2
Vdd2
3ISUD/3T2
(4)(8)
218
L8
126
L8
111
F6
SCK0/
GPIO1D/
EXTINT1D
B/
B/
I
3ISUD/3T2
(4)(8)
219
220
N7
J8
−
−
−
−
−
−
−
−
SDRDQM0
O
−
3−State
3−State
2/4/8 mA
2/4/8 mA
−
Vdd2
Vdd2
3T2(4)(8)
EXA15/
GPIO40/
EXTINT40
O/
B/
I
Schmitt
PD
3ISD/3T2
(4)(8)
221
222
R12
K8
127
−
R12
−
112
−
H11
−
Vdd1
P
EXA10/
GPIO3B/
EXTINT3B
O/
B/
I
Schmitt
Schmitt
3−State
3−State
2/4/8 mA
2/4/8 mA
PD
PD
Vdd2
Vdd2
3ISD/3T2
(4)(8)
223
L12
128
L12
−
−
EXA3/
DIN1/
GPIO34/
EXTINT34
O/
I/
B/
I
3ISD/3T2
(4)(8)
224
225
226
227
M8
N8
J9
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
EXA17/
GPIO42/
EXTINT42
O/
B/
I
Schmitt
Schmitt
Schmitt
Schmitt
3−State
3−State
3−State
3−State
2/4/8 mA
2/4/8 mA
2/4/8 mA
2/4/8 mA
PD
PD
PD
PD
Vdd2
Vdd2
Vdd2
Vdd2
3ISD/3T2
(4)(8)
EXD3/
GPIO49/
EXTINT49
B/
B/
I
3ISD/3T2
(4)(8)
EXA16/
GPIO41/
EXTINT41
O/
B/
I
3ISD/3T2
(4)(8)
K9
EXA18/
GPIO43/
EXTINT43
O/
B/
I
3ISD/3T2
(4)(8)
228
229
P12
L9
129
130
P12
L9
113
114
J11
Vss2
G
H10
SCL0/
GPIO07/
EXTINT07
O/
B/
I
Schmitt
3−State
2/4/8 mA
PU/PD
Vdd2
3ISUD/3T2
(4)(8)
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43
LC823455
Table 16. (continued)
RA
RB
XA
BGA240
BGA136
WLP120
Input
Type
Output
Type
IO
Pwr Grp
IO
No.
Ball
No.
Ball
No.
Ball
Circuit Type
PIN NAME
I/O
Drive
PU/PD
230
231
232
233
L10
131
132
−
L10
115
116
−
J10
SDI0/
GPIO1E/
EXTINT1E
I/
B/
I
Schmitt
Schmitt
Schmitt
Schmitt
3−State
2/4/8 mA
PU/PD
Vdd2
Vdd2
Vdd2
Vdd2
3ISUD/3T2
(4)(8)
L11
M9
L11
−
H9
−
SDA0/
GPIO08/
EXTINT08
B/
B/
I
3−State
3−State
3−State
2/4/8 mA
2/4/8 mA
2/4/8 mA
PU/PD
PD
3ISUD/3T2
(4)(8)
EXA9/
GPIO3A/
EXTINT3A
O/
B/
I
3ISD/3T2
(4)(8)
K10
−
−
−
−
NCS0/
GPIO06/
EXTINT06
O/
B/
I
PU
3ISU/3T2
(4)(8)
234
235
R13
M10
133
−
R13
−
117
−
K11
−
Vdd2
P
EXD1/
GPIO47/
EXTINT47
B/
B/
I
Schmitt
Schmitt
Schmitt
Schmitt
3−State
3−State
3−State
3−State
2/4/8 mA
2/4/8 mA
2/4/8 mA
2/4/8 mA
PD
PD
PD
PD
Vdd2
Vdd2
Vdd2
Vdd2
3ISD/3T2
(4)(8)
236
237
238
M11
N13
P14
−
−
−
−
−
−
−
−
EXA5/
GPIO36/
EXTINT36
O/
B/
I
3ISD/3T2
(4)(8)
EXA8/
GPIO39/
EXTINT39
O/
B/
I
3ISD/3T2
(4)(8)
134
P14
118
J9
NWRENWRL/
DIN0/
GPIO30/
O/
I/
B/
I
3ISD/3T2
(4)(8)
EXTINT30
239
240
R14
P13
135
136
R14
P13
119
120
K10
L11
SWDCLK/
DMCKO0B
GPIO58/
I/
O/
B/
I
Schmitt
3−State
2/4/8 mA
PU/PD
Vdd2
3ISUD/3T2
(4)(8)
EXTINT58
Vss1
G
8. RTCINT (open drain Output) 3.6 V tolerant.
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44
LC823455
INPUT/OUTPUT CIRCUIT
Attribute : 3IS
VddIO (Note 9)
PAD
Vss
Attribute : 1IC
Attribute : 1ICD
VddIO (Note 9)
VddIO (Note 9)
PAD
PAD
Vss
Vss
Attribute : 3T2(4)(8)
2/4/8mA
Attribute : OD3
VddIO (Note 9)
PAD
PAD
Out/Hiz
Vss
Vss
Attribute : 3ICUD/3T2(4)(8)(10)
Attribute : 3ICD/3T2(4)(8)
VddIO (Note 9)
VddIO (Note 9)
ON/OFF
DRVcnt
DRVcnt
Out/Hiz
( Note 10)
(Note 10)
PAD
PAD
Out/Hiz
ON/OFF
ON/OFF
Vss
Vss
Attribute : 3ISUD /3T2(4)(8)
VddIO (Note 9)
Attribute : 3ISUD /3T2
ON/OFF
VddIO (Note 9)
ON/OFF
DRVcnt
(Note 10)
PAD
PAD
Out/Hiz
Out/Hiz
ON/OFF
ON/OFF
Vss
Vss
Level Shifter
Figure 6. Input/Output Circuit
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45
LC823455
Attribute : 3ISD/3T2(4)(8)
Attribute : 3ISU/3T2
VddIO (Note 9)
VddIO (Note 9)
ON/OFF
DRVcnt
Out/Hiz
(Note 10)
PAD
PAD
Out/Hiz
ON/OFF
Vss
Vss
Attribute : 3ISU/3T2(4)(8)
VddIO (Note 9)
Attribute : 3A,1A
AVdd *
AVdd *
ON/OFF
DRVcnt
(Note 10)
PAD(Output)
PAD(Input)
PAD
Out/Hiz
AVss*
AVss*
Vss
Attribute : X
Attribute : 3AA
VddXT 1/VddRTC
PAD(Input)
PAD(Output)
PAD(Input)
PAD(Output)
Vss
Level Shifter
9. Vdd2, VddSD1 (IO Pwr Grp of Pin Assignment).
AVss*
AVss*
10.DRVcnt: 2/4/8 mA, 2/4/8/10 mA, etc. Drivability switch control signal.
Figure 6. Input/Output Circuit (continued)
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46
LC823455
XA: Package Code = “XA”, RA: Package Code = “RA”, RB: Package Code = “RB”, (RA and RB are under planning).
Table 17. TERMINAL STATE TABLE
Terminal status
NRES = High(ii)
Default Function
(NRES = Low)
(Note 11)
Terminal status
NRES = Low(i)
(Note 12)
RA
BGA240
RB
BGA136
XA
WLP120
PIN NAME
(Note 12)
TCLKA0/
BCK1/
GPIO00/
EXTINT00
GPIO00
GPIO01
GPIO02
Hiz
Hiz
Hiz
Hiz
D
D
D
D
D
D
TCLKB0/
LRCK1/
GPIO01/
EXTINT01
Hiz
Hiz
TIOCB00/
DIN1/
D
D
D
DMDIN0A/
GPIO02/
EXTINT02/
TIOCB01/
SFQSCS/
GPIO03/
GPIO03
PU
PU (Note 13)
D
D
D
EXTINT03/
SDCMD0
TXD1/
SDAT20/
GPIO04/
EXTINT04
GPIO04
GPIO05
Hiz
Hiz
Hiz
Hiz
D
D
D
D
D
D
RXD1/
SDAT21/
GPIO05/
EXTINT05
NCS0/
GPIO06/
EXTINT06
GPIO06
GPIO07
GPIO08
GPIO09
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
D
D
D
SCL0/
GPIO07/
EXTINT07
D
D
D
D
SDA0/
GPIO08/
EXTINT08
TIOCA00/
SDCLK2/
PHI0/
D
D
D
GPIO09/
EXTINT09
TIOCA01/
SDCMD2/
PHI1/
GPIO0A
Hiz
Hiz
D
D
D
GPIO0A/
EXTINT0A
TXD2/
GPIO0B
GPIO0C
GPIO0D
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
TIOCA10/
GPIO0B/
EXTINT0B
D
D
D
D
D
D
RXD2/
TIOCA11/
GPIO0C/
EXTINT0C
SFCK/
GPIO0D/
EXTINT0D/
D
D
D
SDCLK0
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47
LC823455
Table 17. TERMINAL STATE TABLE (continued)
Terminal status
NRES = High(ii)
Default Function
(NRES = Low)
(Note 11)
Terminal status
NRES = Low(i)
(Note 12)
RA
BGA240
RB
BGA136
XA
WLP120
PIN NAME
(Note 12)
SFDI(QIO0)/
GPIO0E/
EXTINT0E/
SDAT00
GPIO0E
GPIO0F
GPIO10
GPIO11
GPIO12
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
SFDO(QIO1)/
GPIO0F/
EXTINT0F/
SDAT01
Hiz
Hiz
Hiz
Hiz
NCS1/
RXD0/
GPIO10/
EXTINT10
SFWP(QIO2)/
GPIO11/
EXTINT11
SDAT02
SFHOLD(QIO3)/
GPIO12/
EXTINT12
SDAT03
BCK1/
GPIO13/
EXTINT13
GPIO13
GPIO14
GPIO15
GPIO16
GPIO17
GPIO18
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
LRCK1/
GPIO14/
EXTINT14
DOUT1/
GPIO15/
EXTINT15
NLBEXA0/
GPIO16/
EXTINT16
NRD/
GPIO17/
EXTINT17
MCLK0/
MCLK1/
D
D
D
D
D
D
D
D
D
D
D
D
GPIO18/
EXTINT18
BCK0/
DMCKO0B/
GPIO19/
GPIO19
GPIO1A
GPIO1B
GPIO1C
GPIO1D
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
EXTINT19
LRCK0/
DMDIN0B/
GPIO1A/
EXTINT1A
DIN0/
DMDIN0A/
GPIO1B/
EXTINT1B
DOUT0/
DMCKO0A
GPIO1C/
D
D
D
D
D
D
EXTINT1C
SCK0/
GPIO1D/
EXTINT1D
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48
LC823455
Table 17. TERMINAL STATE TABLE (continued)
Terminal status
NRES = High(ii)
Default Function
(NRES = Low)
(Note 11)
Terminal status
NRES = Low(i)
(Note 12)
RA
BGA240
RB
BGA136
XA
WLP120
PIN NAME
(Note 12)
SDI0/
GPIO1E/
EXTINT1E
GPIO1E
GPIO1F
GPIO20
Hiz
Hiz
Hiz
Hiz
D
D
D
D
D
D
SDO0/
GPIO1F/
EXTINT1F
Hiz
Hiz
TDI/
SDCD1/
SWO/
GPIO20/
D
D
D
D
D
D
EXTINT20
TDO/
GPIO21
Hiz
Hiz
SDWP1/
GPIO21/
EXTINT21
SDCLK1/
GPIO22/
EXTINT22
GPIO22
GPIO23
GPIO24
GPIO25
GPIO26
GPIO27
GPIO28
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
SDCMD1/
GPIO23/
EXTINT23
SDAT10/
GPIO24/
EXTINT24
SDAT11/
GPIO25/
EXTINT25
SDAT12/
GPIO26/
EXTINT26
SDAT13/
GPIO27/
EXTINT27
TMS/
SDWP2/
GPIO28/
EXTINT28
D
D
D
D
D
D
TCK/
GPIO29
GPIO2A
Hiz
Hiz
Hiz
Hiz
SDCD2/
GPIO29/
EXTINT29
SDRADDR12/
D
D
D
GPIO2A/
EXTINT2A
SCL1/
GPIO2B/
EXTINT2B
GPIO2B
GPIO2C
GPIO2D
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
D
D
D
D
SDA1/
GPIO2C/
EXTINT2C
SDRADDR11/
DMCKO0A/
D
D
D
D
D
D
GPIO2D/
EXTINT2D
GPIO2E/
EXTINT2E
GPIO2E
Hiz
Hiz
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49
LC823455
Table 17. TERMINAL STATE TABLE (continued)
Terminal status
NRES = High(ii)
Default Function
(NRES = Low)
(Note 11)
Terminal status
NRES = Low(i)
(Note 12)
RA
BGA240
RB
BGA136
XA
WLP120
PIN NAME
(Note 12)
GPIO2F/
EXTINT2F
GPIO2F
Hiz
Hiz (Note 14)
D
D
D
D
D
D
NWRENWRL/
DIN0/
GPIO30/
GPIO30
Hiz
Hiz
Hiz
EXTINT30
NHBNWRH/
TXD0/
GPIO31
Hiz
D
D
D
DOUT0/
GPIO31/
EXTINT31
EXA1/
GPIO32/
EXTINT32
GPIO32
GPIO33
GPIO34
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
D
D
EXA2/
GPIO33/
EXTINT33
EXA3/
DIN1/
GPIO34/
EXTINT34
D
D
D
EXA4/
DOUT1/
GPIO35/
EXTINT35
GPIO35
Hiz
Hiz
EXA5/
GPIO36/
EXTINT36
GPIO36
GPIO37
GPIO38
GPIO39
GPIO3A
GPIO3B
GPIO3C
GPIO3D
GPIO3E
GPIO3F
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
D
D
D
D
D
D
D
D
D
D
EXA6/
GPIO37/
EXTINT37
EXA7/
GPIO38/
EXTINT38
EXA8/
GPIO39/
EXTINT39
EXA9/
GPIO3A/
EXTINT3A
EXA10/
GPIO3B/
EXTINT3B
EXA11/
GPIO3C/
EXTINT3C
EXA12/
GPIO3D/
EXTINT3D
EXA13/
GPIO3E/
EXTINT3E
EXA14/
GPIO3F/
EXTINT3F
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LC823455
Table 17. TERMINAL STATE TABLE (continued)
Terminal status
NRES = High(ii)
Default Function
(NRES = Low)
(Note 11)
Terminal status
NRES = Low(i)
(Note 12)
RA
BGA240
RB
BGA136
XA
WLP120
PIN NAME
(Note 12)
EXA15/
GPIO40/
EXTINT40
GPIO40
GPIO41
GPIO42
GPIO43
GPIO44
GPIO45
GPIO46
GPIO47
GPIO48
GPIO49
GPIO4A
GPIO4B
GPIO4C
GPIO4D
GPIO4E
GPIO4F
GPIO50
GPIO51
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
EXA16/
GPIO41/
EXTINT41
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
EXA17/
GPIO42/
EXTINT42
EXA18/
GPIO43/
EXTINT43
EXA19/
GPIO44/
EXTINT44
EXA20/
GPIO45/
EXTINT45
EXD0/
GPIO46/
EXTINT46
EXD1/
GPIO47/
EXTINT47
EXD2/
GPIO48/
EXTINT48
EXD3/
GPIO49/
EXTINT49
EXD4/
GPIO4A/
EXTINT4A
EXD5/
GPIO4B/
EXTINT4B
EXD6/
GPIO4C/
EXTINT4C
EXD7/
GPIO4D/
EXTINT4D
EXD8/
GPIO4E/
EXTINT4E
EXD9/
GPIO4F/
EXTINT4F
EXD10/
GPIO50/
EXTINT50
EXD11/
GPIO51/
EXTINT51
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LC823455
Table 17. TERMINAL STATE TABLE (continued)
Terminal status
NRES = High(ii)
Default Function
(NRES = Low)
(Note 11)
Terminal status
NRES = Low(i)
(Note 12)
RA
BGA240
RB
BGA136
XA
WLP120
PIN NAME
(Note 12)
EXD12/
GPIO52/
EXTINT52
GPIO52
GPIO53
GPIO54
GPIO55
GPIO56
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
D
D
D
D
EXD13/
GPIO53/
EXTINT53
Hiz
Hiz
Hiz
Hiz
EXD14/
GPIO54/
EXTINT54
EXD15/
GPIO55/
EXTINT55
CTS1/
SDAT22/
RXD0/
D
D
D
GPIO56/
EXTINT56
RTS1/
SDAT23/
TXD0/
GPIO57
Hiz
Hiz
D
D
D
GPIO57/
EXTINT57
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
PSM_CS
PSM_SDI(DAT0)
PSM_SDO(DAT1)
PSM_DAT2
PSM_DAT3
PSM_SCK
SDAT00
PSM_CS
PSM_SDI(DAT0)
PSM_SDO(DAT1)
PSM_DAT2
PSM_DAT3
PSM_SCK
SDAT00
PD
PD
PD
PD
PD
PD
PD
PD
PD
PD
PD
PD
D
D
D
D
D
D
Hiz
Hiz
SDAT01
SDAT01
Hiz
Hiz
SDAT02
SDAT02
Hiz
Hiz
SDAT03
SDAT03
Hiz
Hiz
SDCLK0
SDCLK0
Low
Hiz
Low
Hiz
SDCMD0
SDCMD0
SDRADDR0
SDRADDR1
SDRADDR10
SDRADDR2
SDRADDR3
SDRADDR4
SDRADDR5
SDRADDR6
SDRADDR7
SDRADDR8
SDRADDR9
SDRBA0
SDRADDR0
SDRADDR1
SDRADDR10
SDRADDR2
SDRADDR3
SDRADDR4
SDRADDR5
SDRADDR6
SDRADDR7
SDRADDR8
SDRADDR9
SDRBA0
Low
Low
Low
Low
Low
Low
Low
Low
Low
Low
Low
Low
Low
Low
Low
Low
Low
Low
Low
Low
Low
Low
Low
Low
Low
Low
SDRBA1
SDRBA1
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LC823455
Table 17. TERMINAL STATE TABLE (continued)
Terminal status
NRES = High(ii)
Default Function
(NRES = Low)
(Note 11)
Terminal status
NRES = Low(i)
(Note 12)
RA
BGA240
RB
BGA136
XA
WLP120
PIN NAME
SDRCAS
(Note 12)
High
High
Low
High
Hiz
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
SDRCAS
SDRCKE
High
High
Low
High
Hiz
SDRCKE
SDRCLK
SDRCLK
SDRCS
SDRCS
SDRDATA0
SDRDATA1
SDRDATA10
SDRDATA11
SDRDATA12
SDRDATA13
SDRDATA14
SDRDATA15
SDRDATA2
SDRDATA3
SDRDATA4
SDRDATA5
SDRDATA6
SDRDATA7
SDRDATA8
SDRDATA9
SDRDQM0
SDRDQM1
SDRRAS
SDRDATA0
SDRDATA1
SDRDATA10
SDRDATA11
SDRDATA12
SDRDATA13
SDRDATA14
SDRDATA15
SDRDATA2
SDRDATA3
SDRDATA4
SDRDATA5
SDRDATA6
SDRDATA7
SDRDATA8
SDRDATA9
SDRDQM0
SDRDQM1
SDRRAS
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
High
High
High
High
Hiz
High
High
High
High
Hiz
SDRWE
SDRWE
SWDCLK/
DMCKO0B/
GPIO58/
SWDCLK
D
D
D
D
D
D
EXTINT58
SWDIO/
DMDIN0B/
GPIO59/
SWDIO
Hiz
Hiz
EXTINT59
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
NRES
TEST
NRES
TEST
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
PD
Low
PD
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
Hiz
PD
Low
PD
XTALINFO0
XTALINFO1
BMODE0
BMODE1
IO18V
XTALINFO0
XTALINFO1
BMODE0
BMODE1
IO18V
D
D
D
D
D
D
D
D
D
D
RTCMODE
KEYINT0
USBDM
RTCMODE
KEYINT0
USBDM
D
D
D
KEYINT1
KEYINT1
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LC823455
Table 17. TERMINAL STATE TABLE (continued)
Terminal status
NRES = High(ii)
Default Function
(NRES = Low)
(Note 11)
Terminal status
NRES = Low(i)
(Note 12)
RA
BGA240
RB
BGA136
XA
WLP120
PIN NAME
KEYINT2
BACKUPB
RTCINT
(Note 12)
D
D
D
D
KEYINT2
BACKUPB
RTCINT
VDET
PD
PD
D
D
D
Hiz
Hiz
D
D
−(Not Determined)
−(Not Determined)
VDET
Hiz
Hiz
Hiz
Hiz
LOUT/
GPLOUT
LOUT
D
D
D
D
D
D
ROUT/
GPROUT
ROUT
Hiz
Hiz
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
USBDP
USBID
USBEXT02
USBVBUS
VCNT1
VCNT2
SIN0
USBDP
USBID
USBEXT02
USBVBUS
VCNT1
VCNT2
SIN0
Low
Low
Hiz
Hiz
−(Not Applicable)
Hiz
−(Not Applicable)
Hiz
−(Not Applicable)
−(Not Applicable)
−(Not Applicable)
−(Not Applicable)
−(Not Applicable)
−(Not Applicable)
−(Not Applicable)
−(Not Applicable)
−(Not Applicable)
−(Not Applicable)
−(Not Applicable)
−(Not Applicable)
−(Not Applicable)
−(Not Applicable)
−(Not Applicable)
−(Not Applicable)
−(Not Applicable)
−(Not Applicable)
−(Not Applicable)
−(Not Applicable)
−(Not Applicable)
−(Not Applicable)
−(Not Applicable)
−(Not Applicable)
−(Not Applicable)
−(Not Applicable)
−(Not Applicable)
−(Not Applicable)
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
SIN1
SIN1
SIN2
SIN2
SIN3
SIN3
SIN4
SIN4
SIN5
SIN5
SIN6
SIN6
SIN7
SIN7
D
D
D
D
XIN1
XIN1
XIN32K
XOUT1
XOUT32K
XIN32K
XOUT1
XOUT32K
*“D” Means a port is available for each package. “PD” means pull down.
11. Default function is port function set by NRES = Low.
12.NRES = High(ii) occurs just after NRES = Low(i).
13.This terminal is configured as an output terminal with PU disabled, and used as QSCS for the SPI I/F chip select during serial flash boot mode.
14.This terminal is configured as an output terminal and used as the boot monitor port during Internal ROM boot.
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LC823455
ELECTRICAL SPECIFICATION
Product parametric performance is indicated in the
Electrical Characteristics for the listed test conditions,
unless otherwise noted. Product performance may not be
indicated by the Electrical Characteristics if operated under
different conditions.
Table 18. MAXIMUM RATINGS (*VSS* = 0V)
Item
Symbol
Condition
Ratings
Unit
Maximum power supply voltage
Vdd1
−0.3 to 1.2
V
VddXT1
AVddPLL1
AVddPLL2
VddRTC
DVddUSBPHY1
−0.3 to 1.2
−0.3 to 2.0
V
V
AVddADC
AVddUSBPHY18
AVddDAMPL
AVddDAMPR
Vdd2
VddSD1
−0.3 to 3.65
V
AVddUSBPHY2
Input voltage
VI
−0.3 to
V
V
V
*Vdd*+0.3
VIUSB1
VIUSB2
USBDP,USBDM
terminal
−0.3 to 6.0
USBVBUS
terminal
−0.3 to 6.0
Operating ambient temperature
Topr
Tstg
−20 to +65
°C
°C
Ambient temperature of preservation
−55 to +125
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
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LC823455
Table 19. RECOMMENDATION OPERATING CONDITIONS (TA = −205C to +655C)
Low voltage operation
(Note 15)
High voltage operation
(Note 15)
Min
Typ
Max
Min
1.05
Typ
Max
1.155
Item
Symbol
Condition
Unit
Power supply
voltage
Vdd1
0.95
1.0
1.155
1.1
V
VddXT1
AVddPLL1
AVddPLL2
VddRTC
0.95
0.95
0.95
0.765
0.90
2.7
1.0
1.0
1.0
1.155
1.155
1.155
0.90
1.155
3.6
same as left
same as left
same as left
same as left
same as left
same as left
same as left
same as left
same as left
same as left
same as left
same as left
same as left
same as left
same as left
same as left
same as left
same as left
same as left
same as left
same as left
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
(Note 16)
1.0
3.3
1.8
3.3
1.8
1.8
1.0
1.0
3.3
3.3
1.8
1.8
1.5
1.5
1.5
1.5
Vdd2
(Note 17)
(Note 17)
(Note 18)
(Note 18)
1.7
1.95
3.6
VddSD1
2.7
1.7
1.95
1.95
1.1
AVddADC
1.7
DVddUSBPHY1
(Note 19)
(Note 20)
(Note 19)
(Note 20)
(Note 19)
(Note 20)
0.93
0.93
3.07
2.7
1.155
3.6
AVddUSBPHY2
AVddUSBPHY18
AVddDAMPL
AVddDAMPR
VIN
3.6
1.7
1.95
1.95
1.65
1.95
1.65
1.95
*Vdd*
1.7
0.95
0.95
0.95
0.95
0
(Note 21)
(Note 21)
Input range
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
15.Follow the operating frequency specifications because the operating frequency ranges are specified according to the operating voltage
ranges.
16.APB clock needs 57.5 MHz or less.
17.IO terminals operating at Vdd2 need to be specified for the IO voltage range of either 3.3 V or 1.8 V according to the Vdd2 voltage by using
the IO18 V terminal. When setting 1.8 V IO interface, even for extremely short period, don’t supply not only the 3.3 V voltage range but also
any voltage over the 1.8 V voltage range to Vdd2.
18.IO terminals operating at VddSD1 need to be specified for the IO voltage range of either 3.3V or 1.8V according to the VddSD1 voltage by
setting a register “System Controller” described in the “System Functions User’s Manual”. When setting 1.8 V IO interface, even for extremely
short period, don’t supply not only the 3.3 V voltage range but also any voltage over the 1.8 V voltage range to VddSD1.
19.While USB is used (including USB suspend mode).
20.While USB is not used.
21.While used as GPO (general purpose output) the output of which can be controlled by registers.
The power domains of Vdd1, DVddUSBPHY1, AVddPLL1, AVddPLL2, VddXT1 are divided, and different voltages can be supplied.
The power domains of Vdd2, VddSD1, AVddADC, AVddUSBPHY2, AVdd USBPHY18, AvddDAMPL = AVddDAMPR are divided, and difference
voltages can be supplied.
If power is supplied to one of the power supply pins above, all the other power supply pins should also be supplied.
However, DVddUSBPHY1, AVddUSBPHY18 and AVddUSBPHY2 can all be turned off to reduce leakage current while USB is not used. In
addition, VddRTC can be supplied if BACKUPB is set to low, while other power supply pins are not supplied.
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LC823455
Table 20. RECOMMENDED OPERATING CONDITIONS
Low voltage operation
High voltage operation
Min
Typ
Max
Min
Typ
Max
Item
Symbol
Function
Unit
Xtal Input
frequency
Fxin1
System,
Audio clock
(XT1 oscillator)
12 MHz or 19.2 MHz or 24 MHz
Tolerance: 50 ppm or less
same as left
−
FxinRTC
RTC clock
(XTRTC
32.768 kHz
Tolerance : 50ppm or less
same as left
−
oscillator)
Frc
RC
0.4
(Note 25)
1
2
same as left
same as left
same as left
MHz
ms
(RC oscillator)
(Note 25)
(Note 25)
Time for
Xtal stable
Txin1
3
(Note 26)
TxinRTC
1000
ms
(Note 26)
Internal clock
frequency
Farm
Fahb
Fapb
Fdsp
Cortex−M3
AHB
0
0
0
0
0
115
115
0
0
0
0
170
170
170
170
MHz
MHz
MHz
MHz
MHz
APB
115
DSP
115
Faud
AUDCLK(768fs)
33.8688
16.9344
147.456
same as left
same as left
(Note 22)
Fdec
DECCLK
(Note 23)
0
0
73.728
36.864
MHz
MHz
(MP3 Decoder)
Fenc
ENCCLK
(Note 24)
8.4672
same as left
(MP3 Encoder)
22.Audio blocks run on a clock of 256 * Fs(sampling frequency).
However, Class−D AMP, etc. run at 384 * Fs(sampling frequency).
These clocks are generated from 768 * Fs(Base Clock) divided by 3 and 2 respectively.
23.MP3 Decoder runs on a clock of 384 * Fs(sampling frequency of MPEG1 mode).
It runs on the clock of the same frequency as MPEG1 mode during MPEG2 / 2.5 mode. For example, even when operating in MPEG2 / 2.5
mode(Fs = 22.05 / 11.025 KHz as an example), please supply 16.9344MHz(= 384 * 44.1 KHz) clock which is the same clock frequency as
MPEG1 mode.
24.MP3 Encoder runs on a clock of 192 * Fs(sampling frequency of MPEG1 mode).
It runs on the clock of the same frequency as MPEG1 mode during MPEG2 / 2.5 mode. For example, even when operating in MPEG2 / 2.5
mode(Fs = 22.05 / 11.025 KHz as an example), please supply 8.4672Mhz (= 192 * 44.1 KHz) clock which is the same clock frequency as
MPEG1 mode.
25.Vdd1 = 0.95 V to 1.155 V, Ta = −25_C to +65_C.
26.It is a reference level in Ta = 25_C. Adjustment is necessary by the situation of the set.
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LC823455
Table 21. DC CHARACTERISTICS
(Vdd2 = 2.7 V to 3.6 V, VddSD1 = 2.7 V to 3.6 V, VddRTC = 0.765 V to 1.155 V, Ta = −20°C to +65°C)
Item
Symbol
Pin
(1)(2)(4)
(3)
Condition
Min
Typ
Max
Unit
V
Input H voltage
V
IH
CMOS
0.7 x Vdd2
0.7 x VddSD1
0.75 x Vdd2
0.75 x VddSD1
0.7 x VddRTC
V
Schmitt
(6)(8)
(7)
V
V
(5)(9)
(1)(2)(4)
(3)
CMOS
CMOS
V
Input L voltage
V
IL
0.25 x Vdd2
0.25 x VddSD1
0.2 x Vdd2
V
V
Schmitt
(6)(8)
(7)
V
0.2 x VddSD1
0.2 x VddRTC
V
(5)(9)
CMOS
V
Output H voltage
V
OH
I
I
I
= −2 mA
(10)(11)(12)
(14)(15)(17)
Vdd2 − 0.4
V
OH
(13)(16)
VddSD1 − 0.4
Vdd2 − 0.4
V
V
= −4 mA
(10)
OH
(14)(15)(17)
(16)
VddSD1 − 0.4
Vdd2 − 0.4
V
V
= −8 mA
(10)
OH
(14)(15)(17)
(16)
(14)(15)(17)
(16)
VddSD1 − 0.4
Vdd2 − 0.4
V
V
V
V
I
= −10 mA
OH
VddSD1 − 0.4
Output L voltage
V
OL
I
= 2 mA
= 4 mA
= 8 mA
(10)(11)(12)
(14)(15)(17)
0.4
OL
(13)(16)
0.4
0.4
V
V
I
(10)
OL
(14)(15)(17)
(16)
0.4
0.4
V
V
I
(10)
OL
(14)(15)(17)
(16)
(14)(15)(17)
(16)
0.4
0.4
0.4
0.3
150
80
V
V
I
= 10 mA
= 0.3 mA
OL
V
(18)
I
OL
V
Pull−up resistor
Rup
Rdn
(20)(21)
(22)
30
25
kꢀ
kꢀ
kꢀ
kꢀ
(23)
18
50
Pull−down resistor
(26)
VddRTC =
180
720
0.765 to 0.90 V
VddRTC =
93
280
kꢀ
0.90 to 1.155 V
(19)(21)
(22)
30
25
150
80
kꢀ
kꢀ
kꢀ
ꢁ A
(23)
18
50
Input leak current
I
IL
(1)(2)(3)
(4)(5)(6)
(7)(8)(9)
VI = Vdd*
or
VI = Vss
−10
10
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Table 21. DC CHARACTERISTICS (continued)
(Vdd2 = 2.7 V to 3.6 V, VddSD1 = 2.7 V to 3.6 V, VddRTC = 0.765 V to 1.155 V, Ta = −20°C to +65°C)
Item
Symbol
Pin
Condition
Min
Typ
Max
Unit
Output leak current
I
(11)(12)
(13)(14)(15)
(16)(18)(27)
HiZ output
−10
10
ꢁ A
OZ
Table 22. DC CHARACTERISTICS
(Vdd2 = 1.7 V to 1.95 V, VddSD1 = 1.7 V to 1.95 V, AVddDAMPL = 0.95 V to 1.95 V, AVddDAMPR = 0.95 V to 1.95 V,
Ta = −20°C to +65°C)
Item
Symbol
Pin
Condition
Min
Typ
Max
Unit
Input H voltage
V
(1)(2)(4)
(3)
CMOS
0.7 x Vdd2
0.7 x VddSD1
0.75 x Vdd2
V
V
V
V
V
V
V
V
V
IH
(6)(8)
(7)
Schmitt
CMOS
Schmitt
0.75 x VddSD1
Input L voltage
V
(1)(2)(4)
(3)
0.3 x Vdd2
0.3 x VddSD1
0.25 x Vdd2
IL
(6)(8)
(7)
0.25 x VddSD1
Output H voltage
V
OH
(10)(11)(12)
(14)(15)(17)
I
I
I
= −2 mA
Vdd2 − 0.4
OH
(13)(16)
VddSD1 − 0.4
Vdd2 − 0.4
V
V
(10)
= −4 mA
OH
(14)(15)(17)
(16)
(14)(15)(17)
(16)
VddSD1 − 0.4
Vdd2 − 0.4
V
V
V
V
V
V
= −8 mA
OH
VddSD1 − 0.4
Vdd2 − 0.4
(14)(15)(17)
(16)
I
= −10 mA
OH
VddSD1 − 0.4
AVddDAMPL – 0.4
(24)
I
= −8 mA
OH
(Note 27)
(25)
I
= −8 mA
AVddDAMPR – 0.4
V
V
OH
(Note 27)
Output L voltage
V
OL
(10)(11)(12)
(14)(15)(17)
I
OL
I
OL
I
OL
= 2 mA
= 4 mA
= 8 mA
= 10 mA
0.4
(13)(16)
0.4
0.4
V
V
(10)
(14)(15)(17)
(16)
0.4
0.4
V
V
(10)
(14)(15)(17)
(16)
(14)(15)(17)
(16)
0.4
0.4
0.4
0.4
0.4
200
80
V
V
I
OL
V
(24)
I
I
= 8 mA
= 8 mA
V
OL
(25)
V
OL
Pull−up resistor
Rup
Rdn
(20)(21)
(22)
30
25
18
30
25
18
kꢀ
kꢀ
kꢀ
kꢀ
kꢀ
kꢀ
(23)
50
Pull−down resistor
(19)(21)
(22)
200
80
(23)
50
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Table 22. DC CHARACTERISTICS (continued)
(Vdd2 = 1.7 V to 1.95 V, VddSD1 = 1.7 V to 1.95 V, AVddDAMPL = 0.95 V to 1.95 V, AVddDAMPR = 0.95 V to 1.95 V,
Ta = −20°C to +65°C)
Item
Symbol
Pin
Condition
Min
Typ
Max
Unit
Input leak current
I
IL
(1)(2)(3)
(4)(6)
VI = Vdd*
or
VI = Vss
−10
10
ꢁ A
(7)(8)
Output leak current
I
(11)(12)
(13)(14)(15)
(16)(27)
HiZ output
−10
10
10
ꢁ A
ꢁ A
OZ
(24)(25)
−10
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
(1) SDRDATA15, SDRDATA14, SDRDATA13, SDRDATA12, SDRDATA11, SDRDATA10, SDRDATA9, SDRDATA8, SDRDATA7, SDRDATA6,
SDRDATA5, SDRDATA4, SDRDATA3, SDRDATA2, SDRDATA1, SDRDATA0
(2) SDCLK2(GPIO09), SDCMD2(GPIO0A), SDAT23(GPIO57), SDAT22(GPIO56), SDAT21(GPIO05), SDAT20(GPIO04), PSM_SCK,
PSM_CS, PSM_SDI, PSM_SDO, PSM_DAT2, PSM_DAT3
(3) SDCLK1(GPIO22), SDCMD1(GPIO23), SDAT13(GPIO27), SDAT12(GPIO26), SDAT11(GPIO25), SDAT10(GPIO24)
(4) SDCMD0, SDAT03, SDAT02, SDAT01, SDAT00, SFCK(GPIO0D), SFDI(GPIO0E), SFDO(GPIO0F), SFWP(GPIO11),
SFHOLD(GPIO12), TIOCB01(GPIO03)
(5) RTCMODE, VDET
(6) SDWP2(GPIO28), SDCD2(GPIO29), EXD0(GPIO46), EXD1(GPIO47), EXD2(GPIO48), EXD3(GPIO49), EXD4(GPIO4A),
EXD5(GPIO4B), EXD6(GPIO4C), EXD7(GPIO4D), EXD8(GPIO4E), EXD9(GPIO4F), EXD10(GPIO50), EXD11(GPIO51),
EXD12(GPIO52), EXD13(GPIO53), EXD14(GPIO54), EXD15(GPIO55), EXA1(GPIO32), EXA2(GPIO33), EXA3(GPIO34),
EXA4(GPIO35), EXA5(GPIO36), EXA6(GPIO37), EXA7(GPIO38), EXA8(GPIO39), EXA9(GPIO3A), EXA10(GPIO3B),
EXA11(GPIO3C), EXA12(GPIO3D), EXA13(GPIO3E), EXA14(GPIO3F), EXA15(GPIO40), EXA16(GPIO41), EXA17(GPIO42),
EXA18(GPIO43), EXA19(GPIO44), EXA20(GPIO45), NRD(GPIO17), NLBEXA0(GPIO16), NHBNWRH(GPIO31), NCS1(GPIO10),
NCS0(GPIO06), NWRENWRL(GPIO30), SWDIO(GPIO59), DOUT1(GPIO15), BCK1(GPIO13), MCLK0(GPIO18), LRCK1(GPIO14),
BCK0(GPIO19), LRCK0(GPIO1A), DIN0(GPIO1B), XTALINFO1, DOUT0(GPIO1C), NRES, SCL1(GPIO2B), SDA1(GPIO2C),
TCLKA0(GPIO00), TCLKB0(GPIO01), EXTINT2E(GPIO2E), EXTINT2F(GPIO2F), TXD2(GPIO0B), RXD2(GPIO0C),
TIOCB00(GPIO02), XTALINFO0, SDO0(GPIO1F), SCK0(GPIO1D), SCL0(GPIO07), SDI0(GPIO1E), SDA0(GPIO08),
SWDCLK(GPIO58), SDRADDR12(GPIO2A), SDRADDR11(GPIO2D)
(7) SDWP1(GPIO21), SDCD1(GPIO20)
(8) BMODE0, BMODE1
(9) Keyint2, Keyint0, Keyint1, BACKUPB, TEST
(10) EXD0(GPIO46), EXD1(GPIO47), EXD2(GPIO48), EXD3(GPIO49), EXD4(GPIO4A), EXD5(GPIO4B), EXD6(GPIO4C), EXD7(GPIO4D),
EXD8(GPIO4E), EXD9(GPIO4F), EXD10(GPIO50), EXD11(GPIO51), EXD12(GPIO52), EXD13(GPIO53), EXD14(GPIO54),
EXD15(GPIO55), EXA1(GPIO32), EXA2(GPIO33), EXA3(GPIO34), EXA4(GPIO35), EXA5(GPIO36), EXA6(GPIO37), EXA7(GPIO38),
EXA8(GPIO39), EXA9(GPIO3A), EXA10(GPIO3B), EXA11(GPIO3C), EXA12(GPIO3D), EXA13(GPIO3E), EXA14(GPIO3F),
EXA15(GPIO40), EXA16(GPIO41), EXA17(GPIO42), EXA18(GPIO43), EXA19(GPIO44), EXA20(GPIO45), NRD(GPIO17),
NLBEXA0(GPIO16), NHBNWRH(GPIO31), NCS1(GPIO10), NCS0(GPIO06), NWRENWRL(GPIO30), DOUT1(GPIO15),
BCK1(GPIO13), MCLK0(GPIO18), LRCK1(GPIO14), BCK0(GPIO19), LRCK0(GPIO1A), DIN0(GPIO1B), XTALINFO1,
DOUT0(GPIO1C), SCL1(GPIO2B), SDA1(GPIO2C), TCLKA0(GPIO00), TCLKB0(GPIO01), EXTINT2E(GPIO2E), EXTINT2F(GPIO2F),
TXD2(GPIO0B), RXD2(GPIO0C), TIOCB00(GPIO02), XTALINFO0, SDO0(GPIO1F), SCK0(GPIO1D), SCL0(GPIO07), SDI0(GPIO1E),
SDA0(GPIO08), SWDCLK(GPIO58), SDRADDR0, SDRADDR1, SDRADDR2, SDRADDR3, SDRADDR4, SDRADDR5, SDRADDR6,
SDRADDR7, SDRADDR8, SDRADDR9, SDRADDR10, SDRADDR11(GPIO2D), SDRADDR12(GPIO2A), SDRDATA0, SDRDATA1,
SDRDATA2, SDRDATA3, SDRDATA4, SDRDATA5, SDRDATA6, SDRDATA7, SDRDATA8, SDRDATA9, SDRDATA10, SDRDATA11,
SDRDATA12, SDRDATA13, SDRDATA14, SDRDATA15, SDRBA1, SDRBA0, SDRCKE, SDRCS, SDRWE, SDRCAS, SDRRAS,
SDRDQM1, SDRDQM0, SDWP2(GPIO28), SDCD2(GPIO29)
(11) SWDIO(GPIO59)
(12) BMODE0, BMODE1
(13) SDWP1(GPIO21), SDCD1(GPIO20)
(14) SDCLK0, SDCMD0, SDAT03, SDAT02, SDAT01, SDAT00, SFCK(GPIO0D), SFDI(GPIO0E), SFDO(GPIO0F), SFWP(GPIO11),
SFHOLD(GPIO12), TIOCB01(GPIO03)
(15) SDCLK2(GPIO09), SDCMD2(GPIO0A), SDAT23(GPIO57), SDAT22(GPIO56), SDAT21(GPIO05), SDAT20(GPIO04), PSM_SCK,
PSM_CS, PSM_SDI, PSM_SDO, PSM_DAT2, PSM_DAT3
(16) SDCLK1(GPIO22), SDCMD1(GPIO23), SDAT13(GPIO27), SDAT12(GPIO26), SDAT11(GPIO25), SDAT10(GPIO24),
(17) SDRCLK
(18) RTCINT
(19) EXD0(GPIO46), EXD1(GPIO47), EXD2(GPIO48), EXD3(GPIO49), EXD4(GPIO4A), EXD5(GPIO4B), EXD6(GPIO4C), EXD7(GPIO4D),
EXD8(GPIO4E), EXD9(GPIO4F), EXD10(GPIO50), EXD11(GPIO51), EXD12(GPIO52), EXD13(GPIO53), EXD14(GPIO54),
EXD15(GPIO55), EXA1(GPIO32), EXA2(GPIO33), EXA3(GPIO34), EXA4(GPIO35), EXA5(GPIO36), EXA6(GPIO37), EXA7(GPIO38),
EXA8(GPIO39), EXA9(GPIO3A), EXA10(GPIO3B), EXA11(GPIO3C), EXA12(GPIO3D), EXA13(GPIO3E), EXA14(GPIO3F),
EXA15(GPIO40), EXA16(GPIO41), EXA17(GPIO42), EXA18(GPIO43), EXA19(GPIO44), EXA20(GPIO45), NRD(GPIO17),
NLBEXA0(GPIO16), NHBNWRH(GPIO31), NWRENWRL(GPIO30), SDRDATA0, SDRDATA1, SDRDATA2, SDRDATA3, SDRDATA4,
SDRDATA5, SDRDATA6, SDRDATA7, SDRDATA8, SDRDATA9, SDRDATA10, SDRDATA11, SDRDATA12, SDRDATA13, SDRDATA14,
SDRDATA15
(20) NCS1(GPIO10), NCS0(GPIO06), XTALINFO1, XTALINFO0, SWDIO(GPIO59)
(21) DOUT1(GPIO15), BCK1(GPIO13), MCLK0(GPIO18), LRCK1(GPIO14), BCK0(GPIO19), LRCK0(GPIO1A), DIN0(GPIO1B),
DOUT0(GPIO1C), SCL1(GPIO2B), SDA1(GPIO2C), TCLKA0(GPIO00), TCLKB0(GPIO01), SDO0(GPIO1F), SCK0(GPIO1D),
SCL0(GPIO07), SDI0(GPIO1E), SDA0(GPIO08), EXTINT2E(GPIO2E), EXTINT2F(GPIO2F), TXD2(GPIO0B), RXD2(GPIO0C),
TIOCB00(GPIO02), SWDCLK(GPIO58), SDWP1(GPIO21), SDCD1(GPIO20), SDRADDR11(GPIO2D), SDRADDR12(GPIO2A),
SDWP2(GPIO28), SDCD2(GPIO29)
(22) SDCLK1(GPIO22), SDCMD1(GPIO23), SDAT13(GPIO27), SDAT12(GPIO26), SDAT11(GPIO25), SDAT10(GPIO24),
SDCLK2(GPIO09), SDCMD2(GPIO0A), SDAT23(GPIO57), SDAT22(GPIO56), SDAT21(GPIO05), SDAT20(GPIO04), PSM_SCK,
PSM_CS, PSM_SDI, PSM_SDO, PSM_DAT2, PSM_DAT3, BMODE0, BMODE1
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(23) SDCMD0, SDAT03, SDAT02, SDAT01, SDAT00, SFCK(GPIO0D), SFDI(GPIO0E), SFDO(GPIO0F), SFWP(GPIO11),
SFHOLD(GPIO12), TIOCB01(GPIO03)
(24) LOUT(used as GPLOUT)
(25) ROUT(used as GPROUT)
(26) Keyint0, Keyint1, Keyint2
(27) EXD0(GPIO46), EXD1(GPIO47), EXD2(GPIO48), EXD3(GPIO49), EXD4(GPIO4A), EXD5(GPIO4B), EXD6(GPIO4C), EXD7(GPIO4D),
EXD8(GPIO4E), EXD9(GPIO4F), EXD10(GPIO50), EXD11(GPIO51), EXD12(GPIO52), EXD13(GPIO53), EXD14(GPIO54),
EXD15(GPIO55), EXA1(GPIO32), EXA2(GPIO33), EXA3(GPIO34), EXA4(GPIO35), EXA5(GPIO36), EXA6(GPIO37), EXA7(GPIO38),
EXA8(GPIO39), EXA9(GPIO3A), EXA10(GPIO3B), EXA11(GPIO3C), EXA12(GPIO3D), EXA13(GPIO3E), EXA14(GPIO3F),
EXA15(GPIO40), EXA16(GPIO41), EXA17(GPIO42), EXA18(GPIO43), EXA19(GPIO44), EXA20(GPIO45), NRD(GPIO17),
NLBEXA0(GPIO16), NHBNWRH(GPIO31), NCS1(GPIO10), NCS0(GPIO06), NWRENWRL(GPIO30), DOUT1(GPIO15),
BCK1(GPIO13), MCLK0(GPIO18), LRCK1(GPIO14), BCK0(GPIO19), LRCK0(GPIO1A), DIN0(GPIO1B), XTALINFO1,
DOUT0(GPIO1C), SCL1(GPIO2B), SDA1(GPIO2C), TCLKA0(GPIO00), TCLKB0(GPIO01), EXTINT2E(GPIO2E), EXTINT2F(GPIO2F),
TXD2(GPIO0B), RXD2(GPIO0C), TIOCB00(GPIO02), XTALINFO0, SDO0(GPIO1F), SCK0(GPIO1D), SCL0(GPIO07), SDI0(GPIO1E),
SDA0(GPIO08), SWDCLK(GPIO58), SDRADDR11(GPIO2D), SDRADDR12(GPIO2A), SDRDATA0, SDRDATA1, SDRDATA2,
SDRDATA3, SDRDATA4, SDRDATA5, SDRDATA6, SDRDATA7, SDRDATA8, SDRDATA9, SDRDATA10, SDRDATA11, SDRDATA12,
SDRDATA13, SDRDATA14, SDRDATA15, SDWP2(GPIO28), SDCD2(GPIO29)
27.Set DAMPCTL register as below.
− DZCTL: DSLEEP = 1. (don’t care DSL value)
- DZINP: DZINP13 = 1, other DZINPx = 0
This DC characteristics can be applied while Class−D AMP used as GPO.
PLL Characteristics
PLL1 (System)
Table 23. PLL1 (SYSTEM)
Vdd1 (Note 28) = 0.95 to 1.155 V, AVddPLL1 (Note 28) = 0.95 to 1.155 V, T = −20°C to +65°C
A
Item
Symbol
VCNT1
Fmax
Fmin
Condition
Min
0
Typ
Max
Unit
V
VCO control voltage
AVddPLL1
VCO highest oscillation frequency
VCO lowest oscillation frequency
400
MHz
MHz
MHz
100
10
Phase comparison frequency
(Note 29)
Fref
PLL lock time (Note 29)
Tlock1
Internal loop filter
0.61
1.25
10.1
ms
ms
%
(Note 30)
Fref = 1.0 MHz, 1.2 MHz
Tlock2
External loop filter
(Note 30)
Fref = 1.0 MHz, 1.2 MHz
Jitter (Note 29)
Jitter
VCO frequency = 400 MHz
5.94
28.Power up and power down timing of AVddPLL1 and Vdd1 should be as close as possible.
29.Electrical specifications are based on simulation results.
30.PLL lock time and appropriate LPF circuit depend on phase comparison frequency (Fref).
Table 24. PLL1 SETTING FOR XT1 OSCILLATION
XT1 Frequency
[MHz]
VCO Frequency
[MHz]
PLL1
Divide M
PLL1
Multiply N
Phase Comparison
Frequency Fref [MHz]
12
19.2
24
100 to 400
100.8 to 399.6
100 to 400
12
16
24
100 to 400
84 to 333
100 to 400
1.0
1.2
1.0
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Table 25. LOOP FILTER FOR PLL1
R1[kW]
R2[kW]
PLL1
Xtal
C1[pF]
C2[pF]
(Note 31)
(Note 31)
multiply N
(Note 31)
(Note 31)
Oscillation,
Loop
S3
S2
S1
S0
min
1440
1008
698
485
338
234
163
114
80
max
-
typ
typ
typ
typ
Fref
filter
(Note 31)
(Note 31)
(Note 31)
(Note 31)
Internal
XT1 = 12 MHz,
Fref = 1.0 MHz
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
−
−
−
−
1439
1007
697
484
337
233
162
113
79
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
XT1 = 19.2 MHz,
Fref = 1.2 MHz
1
1
XT1 = 24 MHz,
Fref = 1.0 MHz
0
0
0
0
1
55
1
38
54
1
27
37
1
19
26
0
13
18
0
9
12
0
-
8
0
External
XT1 = 12 MHz,
Fref = 1.0 MHz
−
−
6.8
330
3300
(Note 32)
(Note 32)
(Note 32)
XT1 = 19.2 MHz,
Fref = 1.2 MHz
XT1 = 24 MHz,
Fref = 1.0 MHz
31.Regarding internal loop filter use, appropriate loop filter parameters need to be selected according to PLL1 multiply N value. Regarding
external loop filter use, the loop filter parameters need to be attached externally.
32.Each value must be supplied by external resistor and capacitor. Refer to PLL1 (System) in Application.
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Audio PLL
Table 26. AUDIO PLL
Vdd1 (Note 33) = 0.95 to 1.155 V, AVddPLL2 (Note 33) = 0.95 to 1.155 V, T = −20°C to +65°C
A
Item
Symbol
VCNT2
Fmax
Condition
Min
0
Typ
Max
Unit
V
VCO control voltage
AVddPLL2
VCO highest oscillation
frequency
150
MHz
VCO lowest oscillation
frequency
Fmin
Fref
95
10
MHz
MHz
ms
Phase comparison
frequency (Note 34)
PLL lock time
(Note 34)
Tlock1
Internal loop filter
15.4
(Note 35)
Fref = 96 KHz, 19.2 KHz, 768 KHz,
153.6 KHz, 192 KHz, 38.4 KHz
Tlock2
External loop filter
7.7
ms
(Note 35)
Fref = 96 KHz, 19.2 KHz, 768 KHz,
153.6 KHz, 192 KHz, 38.4 KHz
Jitter (Note 34)
Jitter1
Jitter2
Jitter3
VCO frequency = 98.304 MHz
VCO frequency = 135.4752 MHz
VCO frequency = 147.456 MHz
2.88
3.41
3.59
4.9
5.8
6.1
%
%
%
33.Power up and power down timing of AVddPLL2 and Vdd1 should be as close as possible.
34.Electrical specifications are based on simulation results.
35.PLL lock time and appropriate LPF circuit depend on phase comparison frequency (Fref).
Table 27. PLL2 SETTING FOR XT1 OSCILLATION
XT1 Frequency
[MHz]
VCO Frequency
[MHz] (Note 36)
Sampling
PLL2
Divide M
PLL2
Multiply N
Phase Comparison
Frequency Fref [KHz]
Frequency Fs
12
98.304
135.4752
147.456
8 KHz
16 KHz
125
625
125
1024
96
19.2
96
32 KHz
64 KHz
128 KHz
11.025 KHz
22.05 KHz
44.1 KHz
88.2 KHz
176.4 KHZ
12 KHz
7056
1536
24 KHZ
48 KHz
96 KHz
192 KHz
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Table 27. PLL2 SETTING FOR XT1 OSCILLATION (continued)
XT1 Frequency
[MHz]
VCO Frequency
[MHz] (Note 36)
Sampling
PLL2
Divide M
PLL2
Multiply N
Phase Comparison
Frequency Fref [KHz]
Frequency Fs
19.2
98.304
135.4752
147.456
98.304
8 KHz
25
128
882
192
512
3528
768
768
153.6
768
16 KHz
32 KHz
64 KHz
128 KHz
11.025 KHz
22.05 KHz
44.1 KHz
88.2 KHz
176.4 KHZ
12 KHz
125
25
24 KHZ
48 KHz
96 KHz
192 KHz
8 KHz
24
125
625
125
192
16 KHz
32 KHz
64 KHz
128 KHz
11.025 KHz
22.05 KHz
44.1 KHz
88.2 KHz
176.4 KHZ
12 KHz
135.4752
38.4
147.456
192
24 KHZ
48 KHz
96 KHz
192 KHz
36.VCO frequency = 768×Fs×n (n = 16, 8, 4, 2, and 1)
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Table 28. PLL2 SETTING FOR BCLK
BCLK Frequency
[MHz]
VCO Frequency
Sampling
PLL2
Divide M
PLL2
Multiply N
Phase Comparison
Frequency Fref [KHz]
[MHz] (Note 37)
Frequency Fs
32Fs
0.256
98.304
8 KHz
16 KHz
1
2
384
384
384
256
512
512
256
352.8
384
0.512
1.024
2.048
4.096
0.3528
0.7056
1.4112
2.8224
5.6448
0.384
0.768
1.536
3.072
6.144
0.384
0.768
1.536
3.072
6.144
0.5292
1.0584
2.1168
4.2336
8.4672
0.576
1.152
2.304
4.608
9.216
32 KHz
4
64 KHz
8
128 KHz
11.025 KHz
22.05 KHz
44.1 KHz
88.2 KHz
176.4 KHZ
12 KHz
16
1
135.4752
147.456
98.304
2
4
8
16
1
24 KHZ
2
48 KHz
4
96 KHz
8
192 KHz
8 KHz
16
1
48Fs
384
16 KHz
2
32 KHz
4
64 KHz
8
128 KHz
11.025 KHz
22.05 KHz
44.1 KHz
88.2 KHz
176.4 KHZ
12 KHz
16
2
135.4752
264.6
4
8
16
32
2
147.456
288
24 KHZ
4
48 KHz
8
96 KHz
16
32
192 KHz
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Table 28. PLL2 SETTING FOR BCLK (continued)
BCLK Frequency
[MHz]
VCO Frequency
[MHz] (Note 37)
Sampling
PLL2
Divide M
PLL2
Multiply N
Phase Comparison
Frequency Fref [KHz]
Frequency Fs
64Fs
0.512
98.304
135.4752
147.456
8 KHz
16 KHz
2
4
384
384
384
256
352.8
384
1.024
2.048
32 KHz
8
4.096
64 KHz
16
32
2
8.192
128 KHz
11.025 KHz
22.05 KHz
44.1 KHz
88.2 KHz
176.4 KHZ
12 KHz
0.7056
1.4112
2.8224
5.6448
11.2896
0.768
4
8
16
32
2
1.536
24 KHZ
4
3.072
48 KHz
8
6.144
96 KHz
16
32
12.288
192 KHz
37.VCO frequency = 768×Fs×n (n = 16, 8, 4, 2, and 1)
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Table 29. LOOP FILTER FOR PLL2
R1[kW]
R2[kW]
C1[pF]
C2[pF]
(Note 38)
(Note 38)
(Note 38)
(Note 38)
VCO
Fref
S3
S2
S1
S0
Loop
filter
XT1 or
BCLK
typ
typ
typ
typ
[MHz]
[KHz]
(Note 38)
(Note 38)
(Note 38)
(Note 38)
Internal
XT1 =
12 MHz
98.304
135.4752
147.456
98.304
96
19.2
96
0
1
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
0
1
0
1
0
1
0
1
0
1
0
0
0
0
0
0
0
0
0
1
0
−
−
−
−
0
1
1
1
1
0
0
0
1
1
1
1
1
1
1
1
1
1
0
0
0
0
1
0
1
1
1
1
1
1
1
1
1
1
XT1 =
19.2 MHz
768
153.6
768
192
38.4
192
256
352.8
384
384
264.6
288
256
352.8
384
96
135.4752
147.456
98.304
XT1 =
24 MHz
135.4752
147.456
98.304
BCLK =
32Fs
135.4752
147.456
98.304
BCLK =
48Fs
135.4752
147.456
98.304
BCLK =
64Fs
135.4752
147.456
98.304
External
XT1 =
−
−
17.4
348
19100
12 MHz
(Note 39)
(Note 39)
(Note 39)
135.4752
147.456
98.304
19.2
96
XT1 =
19.2 MHz
768
153.6
768
192
38.4
192
5.97
370
20300
(Note 39)
(Note 39)
(Note 39)
135.4752
147.456
98.304
XT1 =
24 MHz
12.3
348
19300
(Note 39)
(Note 39)
(Note 39)
135.4752
147.456
38.Regarding internal loop filter use, appropriate loop filter parameters must be selected according to this table. Regarding external loop filter
use, the loop filter parameters need to be attached externally.
39.Each value need to be supplied by external resistor and capacitor. Refer to PLL2 (Audio) in Application.
External loop filter depends on XT1 frequency regardless of whether BCLK = 32 Fs, 48Fs, or 64 Fs is used in PLL2.
Class−D AMP
Table 30. CLASS−D AMP
(AvddDAMPL = AVddDAMPR = 1.5 V, T = 25°C)
A
Item
Symbol
condition
Min
Typ
Max
Unit
On resistance
Ron
on resistance is set to minimum by
register (Note 40)
0.61
2.57
ꢀ
40.Set 0x3ff00 to Drivability set register DZINP in “DAMPCTL” described in the “Audio Functions User’s Manual”.
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XTAL Characteristics
Table 31. XTAL CHARACTERISTICS
(Vdd1(Note 41) = 0.95 to 1.155 V, VddXT1 = 0.95 to 1.155 V, T = −20°C to +65°C)
A
Item
Symbol
Min
Typ
Max
Unit
Frequency
Fmax
12
24
MHz
41.Power up and power down timing of VddXT1 and Vdd1 should be as close as possible. Note that the oscillation frequency of XT1 that can
be used with this product depends on the following table.
Table 32. XT1 FREQUENCY
Available Frequency of XT1 (n Means Available)
12 MHz
19.2 MHz
24 MHz
Other than the left
Function to be Used
All functions
n
n
n
(Note 42)
42.The frequencies of XT1 other than 12MHz, 19.2MHz, and 24MHz are not available, because some clock frequencies for PLL are determined
internally based on the XTALINFO[1:0] terminal input during ROM boot.
XTALINFO[1:0] terminal input may be set to a frequency
of 12 MHz, 19.2 MHz, or 24 MHz.
12bit ADC Converter Characteristic
Table 33. 12BIT ADC CONVERTER CHARACTERISTIC
(Vdd1 = 0.95 to 1.155 V, AVddADC = 1.70 to 1.95 V, T = −20°C to +65°C)
A
Item
Symbol
AVDH
AVDL
SIN
Condition
Min
1.70
0
Typ
Max
Unit
V
Pin applied
AVddADC
AVssADC
SIN[7: 0]
ADC power supply voltage
ADC GND voltage
Analog input voltage
ADC resolution
1.95
V
AVDL
AVDH
12
V
BIT
Bit
SIN[7: 0]
ADC operating clock frequency
(Note 43)
Fclk
fSPEED = 0 (Note 44)
fSPEED = 1 (Note 44)
16
MHz
MHz
Cycle
KS/s
KS/s
LSB
LSB
3.2
ADC conversion time
ADC sample rate
Tc
22
Fs
fSPEED = 0 (Note 44)
fSPEED = 1 (Note 44)
727
145
2
Differential Linearity Error (Note 43)
Linearity Error (Note 43)
DNL
INL
−2
−3
SIN[7: 0]
SIN[7: 0]
3
43.Electrical specifications are based on simulation results.
44.Speed control bit in “ADC” described in the “System Functions User’s Manual ”.
USB2.0 PHY Characteristics
The USB−PHY supports the following standards.
• Universal Serial Bus Specification, Revision 2.0
• Battery Charging Specification, Revision 1.2 (ACA is not supported)
• On−The−Go and Embedded Host Supplement to the USB Revision 2.0 Specification, Revision 2.0 (ADP is not
supported)
XA and RB are available to Device only.
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AC CHARACTERISTICS
Reset
• [Condition]
Vdd1 = 0.95 V to 1.155 V, Vdd2 = 1.7 V to 1.95 V or 2.7 V to 3.6 V, T = −20°C to +65°C
A
External load 15 pF to 40 pF
tRESW1
NRES
Figure 7. AC Characteristic − Reset
Table 34.
Item
Resetting active period
Symbol
Condition
Min
Typ
Max
Unit
tRESW1
Time after Vdd* reaches to
recommended operating voltage
400
−
−
ꢁ s
*Refer to the “INTC” chapter in the “System Functions User’s Manual” for more detail if using noise filter, etc.
External Interrupt
• [condition]
Vdd1 = 0.95 V to 1.155 V, Vdd2, VddSD1 = 1.7 to 1.95 V or 2.7 V to 3.6 V, T = −20°C to +65°C
A
External load 15 pF to 40 pF
tEXINTW
EXTINTxx
Figure 8. AC Characteristic − External Interrupt
Table 35.
Item
Symbol
Condition
Min
Typ
Max
Unit
Pulse width of external interrupt
tEXINTW
Set of interruption factor not use noise
filter function
2
−
−
T
45.T: BASICCLK clock rate (frequency = Farm).
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I2C
• [Condition]
Vdd1 = 0.95 V to 1.155 V, Vdd2 = 1.7 V to 1.95 V or 2.7 V to 3.6 V, T = −20°C to +65°C
A
External load 15 pF to 40 pF
SDA
tSU;DAT
tf
tr
tf
tHD;STA
tr
tBUF
tLO
W
SCL
tHD;STA
tSU;STA
tSU;STO
tHD;DAT
tHIGH
Figure 9. AC Characteristic − I2C
Table 36.
Standard mode
Full mode
Min
0
Max
100
−
Min
Max
400
−
Item
Symbol
fSCL
Unit
kHz
ꢁ s
SCL frequency
0
Hold time START (repetition) condition
(After this period, the first clock pulse is generated.)
tHD;STA
4.0
0.6
Low period of SCL
tLOW
tHIGH
4.7
4.0
4.7
5.0
−
−
1.3
0.6
0.6
0
−
−
ꢁ s
ꢁ s
ꢁ s
ꢁ s
High period of SCL
Setup time of repetition START condition
tSU;STA
tHD;DAT
−
−
Data hold time:
3.45
0.9
(for master in accordance with CBUS)
Data setup time
tSU;DAT
Tr
250
−
−
1000
300
−
100
−
−
300
300
−
ns
ns
ns
ꢁ s
ꢁ s
Rise time SDA and SCL
Fall time SDA and SCL
Tf
−
−
Setup time of STOP condition
Time of bus release between STOP and START condition
tSU;STO
tBUF
4.0
4.7
0.6
1.3
−
−
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SPI Interface
• [Condition]
Vdd1 = 0.95 V to 1.155 V, Vdd2 = 1.7 V to 1.95 V or 2.7 V to 3.6 V, T = −20°C to +65°C
A
External load 15 pF to 40 pF
tSCK
tSCKL
tds
tSCKH
SCK0
tdh
SDI0
SDO0
tddo
46.When the polarity of SCK is changed, SCK in this Figure is inverted.
Figure 10. AC Characteristic − SPI Interface
Table 37.
Item
Symbol
tSCK
tSCKL
tSCKH
tds
min
8
typ
max
−
unit
T
SCLK rate
SCLK LOW time
SCLK HIGH time
data setup time
data hold time
data delay time
4
−
T
4
−
T
2
−
T
tdh
2
−
T
tddo
−
2
T
47.T: APB CLK rate (frequency = Fapb).
Serial Flash Interface
• [Condition]
Vdd1 = 0.95 V to 1.155 V, Vdd2 = 1.7 V to 1.95 V or 2.7 V to 3.6 V, T = −20°C to +65°C
A
External load 6 to 30 pF
Clock
(from SoC)
t
t
IH
ISU
Input
(to SoC)
Out put
(from SoC)
t
ODLY(min)
t
ODLY(max)
Figure 11. AC Characteristic − Serial Flash Interface
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• [Applied Pin]
− Clock: SCK1
− Output: SDI1, SDO1, SWP1, SHOLD1, QSCS
− Input: SDI1, SDO1, SWP1, SHOLD1
Table 38.
I/O Voltage (Vdd2)
2.7 V to 3.6 V
1.7 V to 1.95 V
12 pF to 26 pF / 10 mA
6 pF to 12 pF / 8 mA
23 pF to 30 pF / 8 mA
10 pF to 23 pF / 4 mA
External Load / I/O Drivability
Item
Symbol
Min
Max
Min
Max
Unit
SFIFSEL2 = 0 (Note 48)
Clock frequency
Input setup time
Input hold time
f
−
40
−
−
40
−
MHz
ns
clk
t
4.5
6.0
1.0
4.5
6.0
1.0
ISU
t
−
−
ns
IH
Output Delay time
SFIFSEL2 = 1 (Note 48)
Clock frequency
Input setup time
Input hold time
t
t
5.5
5.5
ns
ODLY
f
clk
−
42.5
−
−
42.5
−
MHz
ns
t
4.8
7.0
1.0
4.8
7.0
1.0
ISU
t
−
−
ns
IH
ODLY
Output Delay time
6.8
6.8
ns
48.SFIFSEL2 is the value of S−Flash I/F select register (SFIFSEL) bit2 described in “System Controller” described in the “System Functions
User’s Manual”.
XMC External Memory Bus Timing
(For RA only)
• [Condition]
Vdd1 = 0.95 V to 1.155 V, Vdd2 = 2.7 V to 3.6 V, T = −20°C to +65°C
A
External load 15 pF to 40 pF
External Memory Bus Read
T
EXCYC
PHI
(BASIC clock)
T
EXACC1
EXA[20:1]
T
EXACC2
NCS0, NCS1,
NHBNWRH,
NLBEXA0
T
T
EXACC3
EXRSW
NRD
T
EXRDS
T
EXRDH
EXD[15:0]
Figure 12. AC Characteristics − External Memory Bus Read Timing
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External Memory Bus Write
PHI
(ARM AHB clock)
T
EXWSSA
T
EXWSH
EXA[20 :1]
NCS0, NCS1
NHBNWRH,
NLBEXA0
T
T
EXWSH
EXWSSCS
T
EXWSW
NWRENWRL
T
T
EXWDH
EXWDS
EXD[15 :0]
Figure 13. AC Characteristics − External Memory Bus Write Timing
Table 39.
Item
Symbol
Min
Typ
1T
−
Max
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
CPU clock cycle time
Read data access time
T
−
−
EXCYC
T
−
−
13
EXACC1
T
−
Tacs + 13
EXACC2
T
−
−
Tacs + Tcos + 12
EXACC3
Read data setup time
Read data hold time
T
20
−
−
EXRDS
T
0
−
−
EXRDH
Read strobe pulse width
Write strobe pulse width
Write address setup time
Write strobe setup time
Write strobe hold time
Write data setup time
Write data hold time
T
Tpgwt + 1 T − 12
Tpgwt − 1 T − 5
Tacs + Tcos + 1 T − 10
Tcos + 1 T − 5
Tcoh + 1 T − 5
Tpgwt − 1 T − 10
Tcoh + 1 T − 10
−
−
EXRSW
T
−
−
EXWSW
T
−
−
EXWSSA
T
−
−
EXWSSCS
T
−
−
−
EXWSH
T
−
EXWDS
T
−
Tcoh + 1 T
EXWDH
49.T: BASIC clock rate (frequency = Farm).
Regarding Tacs, Tcos, Tpgwt, Tcoh, refer to the “XMC” chapter in the “System Functions User’s Manual”.
In write operation, even when Tpgwt (programmable wait register) = 0 or 1, equivalent to Tpgwt = 2.
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SDRAM Interface
(For RA only)
• [Condition]
Vdd1 = 0.95 V to 1.155 V, Vdd2 = 1.7 V to 1.95 V or 2.7 V to 3.6 V, T = −20°C to +65°C
A
External load 5 to 15 pF
Clock
t
t
IH
ISU
Input
(to SoC)
Output
(from SoC)
t
ODLY
Figure 14. AC Characteristics − SDRAM Interface
• [Applied Pin]
− Clock: SDRCLK
− Output: SDRCKE, SDRCS, SDRWE, SDRCAS, SDRRAS, SDRDQM[1:0], SDRADDR[10:0], SDRBA[1:0],
SDRDATA[15:0]
− Input: SDRDATA[15:0]
Table 40.
I/O Voltage (Vdd2)
External Load
I/O Drivability
2.7 V to 3.6 V
8 mA
1.7 V to 1.95 V
8 mA
5 pF to 15 pF
Item
Symbol
Min
−
Max
52
−
Min
−
Max
58
−
Unit
MHz
ns
Clock frequency
Input set−up time
Input hold−up time
Output Delay time
f
clk
t
2.8
1.8
1.6
2.8
1.8
1.6
ISU
t
IH
−
−
ns
t
3.4
3.4
ns
ODLY
50.Address becomes valid 1 cycle before the timing when CS becomes active. Address is stable while CS is active.
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PSRAM Interface
(For RA only)
• [Condition]
Vdd1 = 0.95 V to 1.155 V, Vdd2 = 1.7 V to 1.95 V or 2.7 V to 3.6 V, T = −20_C to +65_C
A
External load 6 to 30 pF
Clock
(from SOoC)
tIH
tISU
Input
(to SoC)
Output
(from SoC)
tODLY(min)
tODLY(max)
Figure 15. AC Characteristics − PSRAM Interface
• [Applied Pin]
− Clock: PSM_SCK
− Output: PSM_SDI, PSM_SDO, PSM_DAT2, PSM_DAT3, PSM_CS
− Input: PSM_SDI, PSM_SDO, PSM_DAT2, PSM_DAT3
Table 41.
I/O voltage (Vdd2)
2.7V to 3.6V
1.7V to 1.95V
12pF to 26pF / 10mA
6pF to 12pF / 8mA
23pF to 30pF / 8mA
10pF to 23pF / 4mA
External load / I/O drivability
Item
Symbol
Min
Max
52
Min
Max
100
−
Unit
MHz
ns
Clock frequency
Input setup time
Input hold time
Output Delay time
f
clk
−
−
3
t
4.12
1.5
2
−
−
7
ISU
t
IH
1.5
2
−
ns
t
7
ns
ODLY
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PCM Timing
• [Condition]
Vdd1 = 0.95 V to 1.155 V, Vdd2 = 1.7 V to 1.95 V or 2.7 V to 3.6 V, T = −20°C to +65°C
A
External load 5 pF to 15 pF
Master Mode
tBCKIL
tBCKIH
BCK
DIN
tDINS
tDINH
tLRCKO
tDOUT
LRCK
DOUT
Figure 16. Master Mode
• [Applied Pin]
− Clock: BCK0, BCK1
− Output: LRCK0, LRCK1, DOUT0, DOUT1
− Input: DIN0, DIN1
Table 42.
I/O Voltage (Vdd2)
2.7 V to 3.6 V
1.7 V to 1.95 V
8 pF to 15 pF / 8 mA
5 pF to 8 pF / 4 mA
8 pF to 15 pF / 8 mA
5 pF to 8 pF / 4 mA
External Load / I/O Drivability
Item
Symbol
tBCKIL
tBCKIH
tDINS
Min
38.0
38.0
8.0
Max
−
Min
38.0
38.0
8.0
Mix
−
Unit
ns
BCKI Low period
BCKI High period
DIN setup time
DIN hold time
−
−
ns
−
−
ns
tDINH
9.0
−
8.0
−
ns
LRCK delay time
DOUT delay time
tLRCKO
tDOUT
−13.0
−13.0
13.0
13.0
−11.5
−11.5
11.5
11.5
ns
ns
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Slave Mode
tBCKIL
tBCKIH
BCK
DIN
tDINS
tDINH
tLRCKIH
tLRCKIS
LRCK
DOUT
tDOUT
Figure 17. Slave Mode
• [Applied Pin]
− Clock: BCK0, BCK1
− Output: DOUT0, DOUT1
− Input: LRCK0, LRCK1, DIN0, DIN1
Table 43.
I/O Voltage (Vdd2)
2.7 V to 3.6 V
1.7 V to 1.95 V
8 pF to 15 pF / 8 mA
5 pF to 8 pF / 4 mA
8 pF to 15 pF / 8 mA
5 pF to 8 pF / 4 mA
External Load / I/O Drivability
Item
Symbol
tBCKIL
tBCKIH
tDINS
Min
30.0
30.0
8.0
Max
−
Min
30.0
30.0
8.0
Max
−
Unit
ns
BCKI Low period
BCKI High period
DIN setup time
DIN hold time
−
−
ns
−
−
ns
tDINH
8.0
−
8.0
−
ns
LRCK setup time
LRCK hold time
DOUT delay time
tLRCKIS
tLRCKIH
tDOUT
8.0
−
8.0
−
ns
8.0
−
8.0
−
ns
−13.0
13.0
−11.5
11.5
ns
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SD Card Interface Timing
• [Condition]
Vdd1 = 0.95 V to 1.155 V, Vdd2, VddSD1 = 1.7 V to 1.95 V or 2.7 V to 3.6 V, T = −20°C to +65°C
A
External load 6 to 40 pF
Normal (Default) Mode
t
PP
t
t
WH
WL
Clock
(from SoC)
t
t
TLH
THL
t
t
IH
ISU
Input
(to SoC)
Out put
(from SoC)
t
t
ODLY(min)
ODLY(max)
Figure 18. Normal (Default) Mode
• [Applied Pin]
− Clock: SDCLK0, SDCLK1, SDCLK2
− Output: SDCMD0, SDCMD1, SDCMD2, SDAT0[3:0], SDAT1[3:0], SDAT2[3:0]
− Input: SDCMD0, SDCMD1, SDCMD2, SDAT0[3:0], SDAT1[3:0], SDAT2[3:0]
Table 44.
I/O Voltage (Vdd2, VddSD1)
External Load / I/O Drivability
2.7 V to 3.6 V
12 pF to 40 pF / 10 mA
6 pF to 12 pF / 8 mA
Item
Symbol
Min
Max
25
−
Unit
MHz
ns
Clock Frequency
Clock low time
Clock high time
Clock rise time
Clock fall time
f
PP
0
10
10
−
t
t
WL
−
ns
WH
TLH
THL
t
t
10
10
−
ns
−
ns
Input set−up time
(from SD to SoC)
t
5.9
ns
ISU
Input hold−up time
(from SD to SoC)
t
0
−
ns
ns
IH
Output Delay time during
Data Transfer Mode
(from SoC to SD)
t
5.1
14.0
ODLY
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High−Speed Mode
t
PP
t
t
WH
WL
Clock
(from SoC)
t
t
TLH
THL
t
t
IH
ISU
Input
(to SoC)
Out put
(from SoC)
t
t
ODLY(min)
ODLY(max)
Figure 19. High−Speed Mode
• [Applied Pin]
− Clock: SDCLK0, SDCLK1, SDCLK2
− Output: SDCMD0, SDCMD1, SDCMD2, SDAT0[3:0], SDAT1[3:0], SDAT2[3:0]
− Input: SDCMD0, SDCMD1, SDCMD2, SDAT0[3:0], SDAT1[3:0], SDAT2[3:0]
Table 45.
I/O Voltage (Vdd2, VddSD1)
External Load / I/O Drivability
2.7 V to 3.6 V
12 pF to 40 pF / 10 mA
6 pF to 12 pF / 8 mA
Item
Symbol
Min
0
Max
50
−
Unit
MHz
ns
Clock Frequency
Clock low time
Clock high time
Clock rise time
Clock fall time
f
PP
t
t
7
WL
7
−
ns
WH
TLH
THL
t
t
−
3
ns
−
3
ns
Input set−up time
(from SD to SoC)
t
5.9
−
ns
ISU
Input hold−up time
(from SD to SoC)
t
2.5
−
ns
ns
IH
Output Delay time
(from SoC to SD)
t
14.0
2.0
ODLY
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SDR25 Mode
t
PP
Clock
(from SoC)
t
t
TLH
THL
t
t
IH
ISU
Input
(to SoC)
Out put
(from SoC)
t
t
ODLY(min)
ODLY(max)
Figure 20. SDR25 Mode
• [Applied Pin]
− Clock: SDCLK0, SDCLK1, SDCLK2
− Output: SDCMD0, SDCMD1, SDCMD2, SDAT0[3:0], SDAT1[3:0], SDAT2[3:0]
− Input: SDCMD0, SDCMD1, SDCMD2, SDAT0[3:0], SDAT1[3:0], SDAT2[3:0]
Table 46.
I/O Voltage (Vdd2, VddSD1)
1.7 V to 1.95 V
23 pF to 30 pF / 8 mA
15 pF to 23 pF / 4 mA
10 pF to 15 pF / 2 mA
External Load / I/O Drivability
Item
Symbol
Min
0
Max
50
Unit
MHz
ns
Clock Frequency
Clock rise time
Clock fall time
f
PP
t
−
2.9
2.9
−
TLH
THL
t
−
ns
Input set−up time
(from SD to SoC)
t
5.9
ns
ISU
Input hold−up time
(from SD to SoC)
t
1.5
0.9
−
ns
ns
IH
Output Delay time
(from SoC to SD)
t
17.0
ODLY
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LC823455
SDR50 Mode
t
PP
Clock
(from SoC
t
t
TLH
THL
t
t
IH
ISU
Input
(to SoC)
Out put
(from SoC)
t
t
ODLY(min)
ODLY(max)
Figure 21. SDR50 Mode
• [Applied Pin]
− Clock: SDCLK0, SDCLK1, SDCLK2
− Output: SDCMD0, SDCMD1, SDCMD2, SDAT0[3:0], SDAT1[3:0], SDAT2[3:0]
− Input: SDCMD0, SDCMD1, SDCMD2, SDAT0[3:0], SDAT1[3:0], SDAT2[3:0]
Table 47.
I/O Voltage (Vdd2, VddSD1)
1.7 V to 1.95 V
23 pF to 30 pF / 8 mA
15 pF to 23 pF / 4 mA
10 pF to 15 pF / 2 mA
External Load / I/O Drivability
Item
Symbol
Min
0
Max
57
Unit
MHz
ns
Clock Frequency
Clock rise time
Clock fall time
f
PP
t
−
2.9
2.9
−
TLH
THL
t
−
ns
Input set−up time
(from SD to SoC)
t
8.0
ns
ISU
Input hold−up time
(from SD to SoC)
t
1.4
0.9
−
ns
ns
IH
Output Delay time
(from SoC to SD)
t
14.6
ODLY
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LC823455
DDR50 Mode
t
PP
t
TLH
Clock
(from SoC)
t
THL
t
t
IH
t
t
ISU
ISU
IH
Input
(to SoC)
t
t
ODLY(min)
ODLY(min)
Out put
(from SoC)
t
t
ODLY(max)
ODLY(max)
Figure 22. DDR50 Mode
• [Applied Pin]
− Clock: SDCLK0, SDCLK1, SDCLK2
− Output: SDCMD0, SDCMD1, SDCMD2, SDAT0[3:0], SDAT1[3:0], SDAT2[3:0]
− Input: SDCMD0, SDCMD1, SDCMD2, SDAT0[3:0], SDAT1[3:0], SDAT2[3:0]
Table 48.
I/O Voltage (Vdd2, VddSD1)
1.7 V to 1.95 V
23 pF to 30 pF / 8 mA
15 pF to 23 pF / 4 mA
10 pF to 15 pF / 2 mA
External Load / I/O Drivability
Item
Symbol
Min
0
Max
40
Unit
MHz
ns
Clock Frequency
Clock rise time
Clock fall time
f
PP
t
−
2.9
2.9
−
TLH
THL
t
−
ns
Input set−up time
(from SD to SoC)
t
5.0
ns
ISU
Input hold−up time
(from SD to SoC)
t
1.4
0.9
−
ns
ns
IH
Output Delay time
(from SoCI to SD)
t
9.5
ODLY
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eMMC Interface Timing
• [Condition]
Vdd1 = 0.95 V to 1.155 V, Vdd2, VddSD1 = 1.7 V to 1.95 V or 2.7 V to 3.6 V, T = −20°C to +65°C
A
External load 6 to 40 pF
Normal (Default) Mode
t
PP
t
TLH
Clock
(from SoC)
t
THL
t
t
IH
t
t
IH
ISU
ISU
Input
(to SoC)
t
t
ODLY(min)
ODLY(min)
Out put
(from SoC)
t
t
ODLY(max)
ODLY(max)
Figure 23. Normal (Default) Mode
• [Applied Pin]
− Clock: SDCLK0, SDCLK1, SDCLK2
− Output: SDCMD0, SDCMD1, SDCMD2, SDAT0[3:0], SDAT1[3:0], SDAT2[3:0]
− Input: SDCMD0, SDCMD1, SDCMD2, SDAT0[3:0], SDAT1[3:0], SDAT2[3:0]
Table 49.
I/O Voltage (Vdd2, VddSD1)
2.7 V to 3.6 V
1.7 V to 1.95 V
23 pF to 30 pF / 8 mA
15 pF to 23 pF / 4 mA
10 pF to 15 pF / 2 mA
12 pF to 40 pF / 10 mA
6 pF to 12 pF / 8 mA
External Load / I/O Drivability
Item
Symbol
Min
0
Max
26
−
Min
0
Max
26
−
Unit
MHz
ns
Clock Frequency
Clock low time
Clock high time
Clock rise time
Clock fall time
f
t
PP
10
10
−
10
10
−
WL
t
−
−
ns
WH
t
t
3
3
ns
TLH
THL
−
3
−
3
ns
Input set−up time
(from SD to SoC)
t
11.5
−
11.5
−
ns
ISU
Input hold−up time
(from SD to SoC)
t
9.0
−
9.0
−
ns
ns
IH
Output Delay time
(from SoC to SD)
t
10.0
27.5
10.0
27.5
ODLY
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High−Speed SDR Mode
t
PP
t
t
WH
WL
Clock
(from SoC)
t
t
TLH
THL
t
t
IH
ISU
Input
(to SoC)
Out put
(from SoC)
t
t
ODLY(min)
ODLY(max)
Figure 24. High−Speed SDR Mode
• [Applied Pin]
− Clock: SDCLK0, SDCLK1, SDCLK2
− Output: SDCMD0, SDCMD1, SDCMD2, SDAT0[3:0], SDAT1[3:0], SDAT2[3:0]
− Input: SDCMD0, SDCMD1, SDCMD2, SDAT0[3:0], SDAT1[3:0], SDAT2[3:0]
Table 50.
I/O Voltage (Vdd2, VddSD1)
2.7 V to 3.6 V
1.7 V to 1.95 V
23 pF to 30 pF / 8 mA
15 pF to 23 pF / 4 mA
10 pF to 15 pF / 2 mA
12 pF to 40 pF / 10 mA
6 pF to 12 pF / 8 mA
External Load / I/O Drivability
Item
Symbol
Min
0
Max
52
−
Min
0
Max
52
−
Unit
MHz
ns
Clock Frequency
Clock low time
Clock high time
Clock rise time
Clock fall time
f
t
PP
7
7
WL
t
7
−
7
−
ns
WH
t
t
−
3
−
3
ns
TLH
THL
−
3
−
3
ns
Input set−up time
(from SD to SoC)
t
5.4
−
5.4
−
ns
ISU
Input hold−up time
(from SD to SoC)
t
3.0
3.0
−
3.0
3.0
−
ns
ns
IH
Output Delay time
(from SoC to SD)
t
16.1
16.1
ODLY
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High−Speed DDR Mode
tPP
tTLH
Clock
(from SoC)
tTHL
tISU tIH
tISU tIH
Input
(to SoC)
tODLY(min)
tODLY(min)
Output
(from SoC)
tODLY(max)
tODLY(max)
Figure 25. High−Speed DDR Mode
• [Applied Pin]
− Clock: SDCLK0, SDCLK1, SDCLK2
− Output: SDCMD0, SDCMD1, SDCMD2, SDAT0[3:0], SDAT1[3:0], SDAT2[3:0]
− Input: SDCMD0, SDCMD1, SDCMD2, SDAT0[3:0], SDAT1[3:0], SDAT2[3:0]
Table 51.
I/O Voltage
(Vdd2, VddSD1)
2.7 V to 3.6 V
1.7 V to 1.95 V
23 pF to 30 pF / 8 mA
15 pF to 23 pF / 4 mA
10 pF to 15 pF / 2 mA
12 pF to 40 pF / 10 mA
6 pF to 12 pF / 8 mA
External Load / I/O Drivability
Item
Clock Frequency
Clock rise time
Clock fall time
INPUT CMD
Symbol
Min
0
Max
30
3
Min
0
Max
33
3
Unit
MHz
ns
f
PP
t
−
−
TLH
THL
t
−
3
−
3
ns
Input set−up time
(from SD to SoC)
t
19.5
2.4
−
−
16.4
2.4
−
−
ns
ns
ISU
Input hold−up time
(from SD to SoC)
t
IH
OUTPUT CMD
Output Delay time
(from SoC to SD)
t
3.0
29.0
3.0
26.0
ns
ODLY
INPUT DAT
Input set−up time
(from SD to SoC)
t
9.6
1.4
−
−
8.1
1.4
−
−
ns
ns
ISU
Input hold−up time
(from SD to SoC)
t
IH
OUTPUT DAT
Output Delay time
(from SoC to SD)
t
2.5
14.1
2.5
12.6
ns
ODLY
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Digital Mic Timing
• [Condition]
Vdd1 = 0.95 V to 1.155 V, Vdd2 = 1.7 V to 1.95 V or 2.7 V to 3.6 V, T = −20°C to +65°C
A
External load 15 pF to 40 pF
tCY
DMCKO
tSU
tHLD
tSU
tHLD
DMDIN
Figure 26. Digital Mic Timing
• [Applied Pin]
− Clock: DMCKO0, DMCKO1
− Input: DMDIN0, DMDIN1
Table 52.
Item
Period of clock cycle (Note 51)
Clock duty
Symbol
Min
−
Typ
Max
3.25
40:60
−
Unit
tCY
MHz
60:40
40
Data setup time
tSU
ns
ns
Data hold time
tHLD
0
−
51.Internal clock and register setting.
UART Timing
• [Condition]
Vdd1 = 0.95 V to 1.155 V, Vdd2= 1.7 V to 1.95 V or 2.7 V to 3.6 V, T = −20°C to +65°C
A
External load 10 pF to 30 pF (Vdd2 = 1.7 V to 1.95 V), 10 pF to 40 pF (Vdd2 = 2.7 V to 3.6 V)
CTS Timing
End of the last Stop Bit
Tsetupcts
Tdlycts
CTS1
TXD1
Parity
bit
Start
bit
Stop
Stop
D0
D1
D2
D3
D4
D5
D6
D5
D7
D6
bit1
bit2
Parity
bit
Stop
bit
D7
CTS timing
Figure 27. CTS Timing
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• [Applied Pin]
− Input: CTS1
− Output: TXD1
Table 53.
Item
Condition
Symbol
Min
Max
Unit
Delay time
Completing preparation to transmit the current
TXD data by setting registers at CTS1 = high
Tdlycts
−
6T+20
ns
From the negative edge
CTS Setup time
From end of the last StopBit
Tsetupcts
3T+20
−
ns
(not to transmit the next TXD data)
52.T: UART functional clock rate
53.In using hardware flow control by CTS/RTS, if the CTS setup time above is NOT met, the next TXD data will be transmitted at the time of
having prepared it regardless of the CTS level.
RTS Timing
End of the last Stop Bit
1.5Bit
start
bit
stop
bit1
stop
bit2
parity
bit
D0
D1
D0
D2
D1
D3
D2
D4
D3
D5
D4
D6
D5
D7
D6
RXD1
start
bit
stop
bit
parity
bit
D7
Tdlyrts
RTS1
RTS timing
Figure 28. RTS Timing
• [Applied Pin]
− Input: RXD1
− Output: RTS1
Table 54.
Item
Condition
Symbol
Min
Max
Unit
Delay Time
Receiving the current RXD data with 15 bytes of data existing in the
Reception FIFO or Receiving the current RXD data without using
Reception FIFO
Tdlyrts
−
4T+20
ns
From 1.5 bits before the end of the last StopBit
54.T: UART functional clock rate
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LC823455
APPLICATION
XTAL
For oscillation
XIN
XOUT
R2
R1
C1
C2
Figure 29. For Oscillation
Table 55.
XT1
XTRTC
XIN1/XOUT1
XIN32K/XOUT32K
Symbol
24MHz
32.768 KHz
Example of
RIVER ELETEC
FCX−07L
RIVER ELETEC
TFX−03
crystal device
R1
R2
C1
C2
Open
0 ꢀ
10 Mꢀ
0 ꢀ
10pF
10pF
18pF
18pF
55.Optimize the circuit constant for each product when you use this oscillation cell and ask to the manufacturer of the crystal device to investigate
(matching investigation) because the best circuit constant changes depending on the specification of the crystal device used and the ambient
surrounding (parasitic capacitance etc. of an external substrate).
56.The part values are for reference only. Adjustments may be required depending on the specific setup.
57.The following may be needed as the anti−noise measures of oscillation circuit.
− Components should be as adjacent as possible, with shortened wiring between elements such as this SoC and the crystal device.
− GND of the oscillation circuit should be as close as possible to GND (VSS) of this SoC.
− Do not bring the wiring pattern of the large current drive close to the oscillation circuit.
− Take wide pattern to avoid the effect of interference of other signals.
For input from external clock source (XT1)
Do as follows when using the external clock signal that is generated outside of the SoC by the oscillation module, etc. XT1
can be connected to an external clock signal that is generated outside of the SoC using the circuit shown in Figure 30. However,
XTRTC cannot be connected to an external clock source.
XIN
XOUT
Left open
Clock input
NOTE: Input the signal of full amplitude to XIN (external clock input).
Figure 30. For Input from External Clock Source (XT1)
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Table 56.
Item
Symbol
min
max
unit
H level input voltage
(Note 58)
V
IH
VddXT1× 0.8
VddXT1 + 0.3
V
L level input voltage
(Note 58)
V
IL
−0.3
VddXT1 × 0.25
V
58.There is no VIH/VIL specification at the input part of the xtal oscillator cell. The values are for reference when using external clock source.
• There is a possibility of influencing the signal quality
when there is a long wire pattern on a circuit board of
XOUT (The terminal opens). Therefore, recommend to
cut the wire pattern on a circuit board or no wire pattern
on it
• The xtal oscillator is supposed to be used with quartz
resonator or ceramic resonator, we have no plan to
evaluate this SoC in case of input from external clock
source
PLL1(System)
The configuration of the PLL1 circuit is shown below.
Decoupling capacitors must be placed as close as possible
to the power terminals (AVddPLL1 and AVssPLL1) of this
SoC.
The power supply of PLL1 should be separated from other
power supply lines to eliminate noise.
When using an Internal Loop Filter
VCNT1 must be open in this case.
When using an External Loop Filter
Refer to Table 25 for the recommended values of R2, C1,
and C2.
This SoC
This SoC
Figure 31. PLL1(System) for Internal Loop Filter
Figure 32. PLL1(System) for External Loop Filter
59.The part values are for reference only. Adjustments may be required depending on the specific setup.
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PLL2(Audio)
The configuration of the PLL2 circuit is shown below.
Decoupling capacitors must be placed as close as possible
to the power terminals (AVddPLL2 and AVssPLL2) of this
SoC.
The power supply of PLL2 should be separated from other
power supply lines to eliminate noise.
When using an Internal Loop Filter
VCNT2 must be open in this case.
When using an External Loop Filter
Refer to Table 29 for the recommended values of R2, C1,
and C2.
This SoC
This SoC
Figure 33. PLL2(Audio) for Internal Loop Filter
Figure 34. PLL2(Audio) for External Loop Filter
60.The part values are for reference only. Adjustments may be required depending on the specific setup.
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12bit AD converter
The configuration of the ADC circuit is shown below.
You should supply clean Power and Ground to AVddADC
Power supply decoupling should be done according to the
figure below. At least the 0.1 ꢁ F capacitor should be ceramic
(good quality), and must be placed as close as possible to this
SoC.
and AVssADC.
This SoC
Figure 35. 12bit AD Converter
61.It is important that the wiring resistance is accurate in order to achieve the correct ADC conversion result. Also, pay attention to
maintaining low noise.
62.Unused input pins of SIN[0−7] should be directly connected to AVssADC.
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USB2.0 PHY
The configuration of the USB−PHY circuit is shown below.
USB Device
This SoC
Figure 36. USB 2.0 PHY in Device
USB Host
Figure 37. USB 2.0 PHY in Host
Please refer to the “LC823455 USB2.0 Application
Design Guideline” for details.
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Class−D AMP
The configuration of the Class−D AMP circuit is shown
below.
Single−End Form
Power
+
220ꢁ F or
more
0.1ꢁ F
AVddDAMPL
This SoC
L
0.1ꢁ F
220ꢁ F
Rd
Headphone L−ch
Ron
+
LOUT
(16ꢀ)
Ipk(Irms)
C
10kꢀ
AVssDAMPL
AVddDAMPR
Mute
Nch Power
FET
0.1ꢁ F
L
220ꢁ F
Rd
Headphone R−ch
Ron
+
(16ꢀ)
ROUT
C
10kꢀ
Ipk(Irms)
AVssDAMPR
Mute
Nch Power
FET
Figure 38. Class−D AMP in Single−End Form
BTL Form
Power
+
47ꢁ F or
more
0.1ꢁ F
AVddDAMPL
This SoC
L
0.1ꢁ F
Rd
Ron
LOUT
Headphone
C
Ipk(Irms)
(16ꢀ)
AVssDAMPL
AVddDAMPR
0.1ꢁ F
L
Rd
Ron
ROUT
C
AVssDAMPR
Figure 39. Class−D AMP in BTL Form
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LCR Filter Example
L (mH)
220
C (mF)
0.22
1
Rd (W)
0 − 10
5 − 10
Type A
Type B
47
63.Rd doesn’t include parasitic resistance of L.
64.Add a bypass condenser (0.1 μF) between AVddDAMPL and AVssDAMPL, AVddDAMPR and AVssDAMPR as close as possible to the
terminals
65.Add a large electrolyte capacitor (220μF or more recommended) to AVddDAMPL, AVddDAMPR terminal for Single−End form to reject the
noise and reduce the pumping phenomenon of Class−D AMP.
66.Check the voltage level of AVddDAMPL, AVddDAMPR and make sure not to exceed 1.65 V (recommended operating voltage) by using
playback of 20 Hz, 0db (full scale) sine wave
67.Resistor Rd reduces the output level of Class−D AMP, and is related to the values of L and C used. Please choose a resistance value (Rd)
to fit the actual system. Please note that Rd value must be determined based on the parasitic resistance of the inductor L.
68.While the Class−D AMP outputs LOUT and ROUT are used as GPO, the maximum supply voltage to AVddDAMPL and AVddDAMPR is
1.95 V. In this case, the LC filter cannot be connected to LOUT and ROUT to avoid damage from overvoltage via the pumping phenomenon.
Power Supply
Class−D AMP power supply to (AVddDAMPL,
AVddDAMPR) must use a transient response and good
power supply. When using a power supply where the
transient response is bad and the capacity of the capacitor is
small, a peculiar pumping phenomenon to the Class−D AMP
is generated. The power supply voltage must not exceed the
recommended operating range when the pumping
phenomenon occurs.
The Class−D AMP output is PWM. The power supply
noise affects the output of the Class−D AMP.
Power sources which have large internal impedance such
as dry cell should not be directly connected to the power
supply of the Class−D AMP, and those which have large
switching noise such as switching regulator are not suitable
and need to be taken care of.
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Digital Mic
The configuration of the Digital Mic circuit is shown
below.
Digital
Mic
R−ch
config
This SoC
DMCKO 0A
DMCKO 0B)
(DMCKO 1)
Digital
Mic
(
L−ch
config
DMDIN 0A
(DMDIN 0B)
(DMDIN 1)
Figure 40. Digital Mic Configuration
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I2C
The configuration of the I2C circuit is shown below.
Power
(* 1)
Appropriate resistor value depends on the communication speed
Refer to the I2C specification for the calculation of resistor value.
This SoC
(* 1)
2 kꢀ
2 kꢀ
I2C −device
SCL0
SCL
(SCL1)
SDA0
SDA
(SDA1)
I2C −device
SCL
SDA
Figure 41. I2C Configuration
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S−Flash I/F
The configuration of the S−Flash I/F circuit is shown
below.
Power
* SFQSCS is pulled up internally after hard reset
(The use of the pull−up resistor can be switched off using a register setting.)
This SoC
Vdd2
power
Serial flash memory
GPIO03(SFQSCS)
CS
SFCK
SFDI(QIO0)
SCLK
SI(SIO0)
WP(SIO2)
SFWP(QIO2)
SFHOLD(QIO3)
HOLD(SIO3)
SO(SIO1)
SFDO(QIO1)
Vss2
*
Signals name in parenthesis is name during 4 bit mode
Figure 42. S−Flash I/F Circuit
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RTC
The configuration of the RTC circuit is shown below.
General RTC
VddRTC
Voltage detector
This SoC
VddRTC
VDET
Detect drop
of VddRTC
Vdd1
Voltage detector
Vdd2
BACKUPB
Detect drop of
Vdd1 and Vdd2
power
RTCINT
VssRTC
Timer event output
Usage) Release sleep and power on
Figure 43. Configuration of the General RTC
KEYINT RTC
VddRTC
Voltage detector
This SoC
VddRTC
VDET
Detect drop
of VddRTC
Vdd1
Voltage detector
Vdd2
BACKUPB*
KEYINT[2:0]
Detect drop of
Vdd1 and Vdd2
Wakeup event input
(Any key inputs, VBUS input, etc)
power
Connet to enable of
Regulator
RTCINT(PWRON)
VssRTC
*XA (WLP120) has no BACKUPB terminal, which is connected to VDET internally.
Figure 44. Configuration of the KEYINT RTC
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JTAG
The configuration of the JTAG debug circuit for
LPDSP32 is shown below.
This SoC
* The LPDSP32 can be reset by a JTAG software reset
JTAG
Connector
command issued by the debugger as well as the JTAG
hardware reset signal (TRST). Therefore, the connec-
tion of the JTAG hardware reset signal between the de-
bugger and the SoC is not mandatory.
TCK
TMS
TDI
TCK
* Internal pull down resistor can be used if they are en-
abled before the reset release of LPDSP 32.
TMS
TDI
* The input JTAG signals must be pulled up or down to
avoid being left floating if the JTAG function is not being
used.
* For further information about connecting JTAG sig-
nals, refer to the reference circuit provided by your ICE
tool vendor.
TDO
TDO
Figure 45. JTAG Interface for LPDSP32
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SWD
The configuration of the SWD debug circuit for
Cortex−M3 is shown below.
This SoC
SWD
Connector
SWDCLK
SWDIO
SWDCK
Vdd2
* pull up and pull down can be implemented using
internal registers.
SWDIO
SDO
* Regarding SWD connecter signal, refer to the
document about ICE tool.
SWO
NRES
nSRST
Vdd2
R
C
nRESET
(OpenDrain )
R,C value should be determined based on
the NRES input timing requirement
Figure 46. SWD Interface for Cortex−M3
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100
LC823455
BMODE[1: 0]
The configuration of the BMODE circuit is shown below.
Power
or
ground
power
This SoC
1 kꢀ
or
470 kꢀ
Vdd 2
BMODE
BMODE
* Do not connect capacitance to the BMODE
pins, and avoid long wiring patterns on the board.
These two factors can cause incorrect signal lev-
els to be assigned on BMODE.
0
1
1 kꢀ
or
470 kꢀ
Vss
Power or ground
Figure 47. BMODE Configuration
POWER SUPPLY
• Don’t raise power supply steeply.
• This SoC has circuits to protect from electrostatic
discharge. The rush current flows in accordance with
the steepness of rising curve of power supply.
• Place bypass capacitors at each point closest to each
power supply terminal, and place a power circuit at the
point closest to the power supply terminals which it can
supply.
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LC823455
INTERNAL POWER DOMAIN CONTROL
This SoC has fifteen power isolated region of internal core
for leakage current reduction, these can be power supply
OFF separately. Power isolated region PD−X (X means one
of the fifteen region PD 1 to J) described in the table below.
Power ON / OFF for each power domain is controlled by
the appropriate bit of System Controller of the power control
register (LSISTBY). However, when controlling the power
control register (LSISTBY), you must also control the
ISOLATION control register (ISOCNT) as required. Please
refer to the “System Controller” chapter in the “System
Functions User’s Manual” for details.
Each power domain and its contents, along with the
corresponding flags in the power control register
(LSISTBY) and ISOLATION control register (ISOCNT) is
as follows.
Table 57.
Name
Content
LSISTBY
Bit17 STBY1
ISOCNT
Bit17 ISOCNT1
PD−1
PD-2
PD-3
PD-4
PD-5
PD-6
PD-7
PD-8
PD-9
PD-10
PD−A
PD−E
PD−G
PD−H
PD−J
Internal ROM
Internal SRAM(seg 0B)
Internal SRAM(seg 1)
Internal SRAM(seg 2)
Internal SRAM(seg 3/4)
Internal SRAM(seg 5A)
Internal SRAM(seg 5B)
Internal SRAM(seg 6)
Internal SRAM(seg 7B)
Internal SRAM(seg 7A/8/9)
Audio Block
Bit18 STBY2
Bit19 STBY3
Bit20 STBY4
Bit21 STBY5
Bit22 STBY6
Bit23 STBY7
Bit24 STBY8
Bit25 STBY9
Bit26 STBY10
Bit0 STBYA
Bit4 STBYE
Bit6 STBYG
Bit7 STBYH
Bit9 STBYJ
Bit18 ISOCNT2
Bit19 ISOCNT3
Bit20 ISOCNT4
Bit21 ISOCNT5
Bit22 ISOCNT6
Bit23 ISOCNT7
Bit24 ISOCNT8
Bit25 ISOCNT9
Bit26 ISOCNT10
Bit0 ISOCNTA
Bit4 ISOCNTE
Bit6 ISOCNTG
Bit7 ISOCNTH
Bit9 ISOCNTJ
USB 2.0 Controller SRAM
Cache for S−Flash I/F
SD Card I/F
USB 2.0 PHY
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LC823455
Recommendation
POWER SUPPLY SEQUENCE
The recommended basic sequence for powering on/off of
the power supply lines is as follows. (Simultaneous power
on/off is acceptable)
To ensure system stability, the power supply lines must be
powered on/off in a specific sequence, based on the power
supply group they are in, as described in this section.
• Power on:
Power Supply Groups
The power supply lines of the SoC can be grouped as
follows:
♦ Vdd*(Internal) −> Vdd*(IO) −> Vsig(Signal)
• Power off:
♦ Vsig(Signal) −> Vdd*(IO) −> Vdd*(Internal)
1. Vdd*(Internal) – Internal core, analog power
supply
NOTE:
(1 V power supply)
Vdd1, VddXT1, AVddPLL1, AVddPLL2,
DVddUSBPHY1
During power on, the sequence of Vdd*(Internal) −>
Vdd*(IO) causes a SoC hard reset which prevents IO
glitches. Powering on the Vdd*(IO) lines while the
Vdd*(Internal) lines are powered off may generate glitches
on the IO signals and the flow of through current. It is
recommended that you follow the sequence above in order
to avoid this. In addition, Vsig(Signal) means voltage
appearance of IO signals.
2. Vdd*(IO) – External IO power supply
(1.8 V / 3 V power supply)
Vdd2, VddSD1, AVddUSBPHY2,
AVddUSBPHY18, AVddADC, AVddDAMPL,
AVddDAMPR
3. VddRTC – The RTC power supply
(This is a dedicated power supply line whose
on/off sequence is described separately in the next
section)
In the Vdd*(IO) group, the power on sequence for the
USB PHY must occur in the order AVddUSBPHY18 −>
AVddUSBPHY2, while the power off sequence must occur
in the order AVddUSBPHY2 −> AVddUSBPHY18.
RTC has its own dedicated power supply and power on/off
sequence which is described in the following section.
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103
LC823455
RTC Terminal Control Sequence
A power supply sequence and other terminal control
sequence of RTC are described as follows.
voltage of Vdd1 and Vdd2 power supply, and set
BACKUPB to Low which isolates the VddRTC Domain
from the Vdd1 Domain.
Moreover, to power off the RTC domain as well, it is
necessary to detect the drop in the voltage of the VddRTC
power supply, and set VDET to Low. (The RTC operation
stops).
General RTC mode (RTCMODE = 1)
To power off the domains other than the RTC domain (The
only RTC works), it is necessary to detect the drop in the
Vdd2
2.7V
Vdd2
1 & 2 is a reset condition of the
internal logic circuit.
Min 0ns
Please refer to AC Characteristics :
Reset chapter about the period
when you should meet these2
conditions.
1
NRES
0.2 * Vdd2
VddRTC
VddRTC
Vdd1
Vdd1
0.95V
2
Min 0ns
Min 0ns
BACKUPB
0.2 * VddRTC
VDET
0.2 * VddRTC
XIN32K
Figure 48. Timing Sequence for General RTC Mode
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104
LC823455
(Reference: Internal control logic for isolation based on BACKUPB)
ALL OUTPUT
ALL INPUT
Vdd1 Domain
VddRTC Domain
ALL INPUT
ALL OUTPUT
BACKUPB
Note: Vdd1 can be shut down while BACKUPB = low
Figure 49. Internal Control Logic for Isolation
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LC823455
Keyint RTC Mode (RTCMODE = 0)
source. Either the KEYINT input or the internal RTCINT
signal can generate the power on sequence.
When powering off RTC, it is necessary to detect the drop
in the voltage of the VddRTC power supply, and set VDET
to Low. (The RTC operation stops).
Using a master command from Cortex−M3, the internal
sequencer of the RTC controls the operation of BACKUPB
for isolation and power off. The power off sequence using
the BACKUPB terminal can also be activated by an external
S0
INIT
Wait for
Xtal
S1
S2
S3
Wait for
Vdd1
Power ON
VDET
PWRON
NOP
(RTCINT=HiZ)
oscillation
S8
S4
ISOLATOR off
Wait for
KEYINT or
Sequencer runs on XIN32K
and makes state transition
Internal RTCINT
S7
S6
S5
if
RTCMASTER
ISOLATOR
on
Release Cortex−M3 Core0 reset
Wait for RTC master command
PWROFF
(RTCINT=L)
XIN32K
STATE(Internal)
VDET
S0 S1 S2 S3
S4 S5
S5 S6 S7 S8
S1
RTCINT
(PWRON)
ISOLATOR control
(Internal1:off 0:on)
32kHz clk to
Vdd1 Power Area
(Internal)
RESETB to Vdd1 Power Area
(Internal1:release, 0:reset)
XIN 32K
STATE
(Internal)
Any State
BACKUPB
ISOLATOR control
(Internal1:off 0:on)
32kHz clk to
Vdd1 Power Area
(Internal)
RESETB to Vdd1 Power Area
(Internal1:release, 0:reset)
Figure 50. Timing Sequence for Keyint RTC Mode
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LC823455
ORDERING INFORMATION
Device
Package
Shipping (Qty / Packing)†
LC823455XATBG
WLCSP120, 4.086x4.086
(Pb−Free / Halogen Free)
1000 / Tape & Reel
LC823455RAH−2H
(Under planning)
LFBGA240, 11.0x11.0
880 / Tray JEDEC
880 / Tray JEDEC
(Pb−Free / Halogen Free)
LC823455RB−2H
(Under planning)
LFBGA136, 11.0x11.0
(Pb−Free / Halogen Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Arm, the Arm logo, AMBA, and Cortex are registered trademarks of Arm Limited (or its subsidiaries) in the EU and/or elsewhere.
Bluetooth is a registered trademark of Bluetooth SIG.
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107
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WLCSP120, 4.086x4.086x0.62
CASE 567WG
ISSUE O
DATE 16 APR 2018
GENERIC
MARKING DIAGRAM*
XXX = Specific Device Code
A
= Assembly Location
*This information is generic. Please refer to
XXXXXXXXXXXX
WL = Wafer Lot
YY = Year
WW = Work Week
G
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present. Some products
may not follow the Generic Marking.
AWLYYWW
G
= Pb−Free Package
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON87275G
WLCSP120, 4.086x4.086x0.62
PAGE 1 OF 1
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LC823455XATBG
Low Power & High-Resolution Audio Processing System SoC for Portable Sound Solution
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