LC898249XHTBG [ONSEMI]

闭环 AF 控制 LSI;
LC898249XHTBG
型号: LC898249XHTBG
厂家: ONSEMI    ONSEMI
描述:

闭环 AF 控制 LSI

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中文:  中文翻译
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DATA SHEET  
www.onsemi.com  
AF Control LSI  
LC898249XH  
Overview  
This LSI is ClosedAuto Focus control LSI equipped with hall  
sensor. It consists of 1 system of feedback circuit and constant current  
driver. It has also a builtin EEPROM and temperature sensor.  
WLCSP6, 0.86x1.75x0.265  
CASE 567XD  
Features  
MARKING DIAGRAM  
Builtin Equalizer Circuit Using Digital Operation  
AF Control Equalizer Circuit  
8249XH  
ALYWW  
Any Coefficient can be Specified by 2wire Serial I/F (TWIF)  
2wire Serial Interface  
2
8249XH = Specific Device Code  
(The Communication Protocol is Compatible with I C)  
A
L
Y
= Assembly Location  
= Wafer Lot  
= Year  
4 Selectable Slave Addresses  
50h(W)/51h(R), 53h(R)  
74h(W)/75h(R), 77h(R)  
E8h(W)/E9h(R), EBh(R)  
WW  
= Work Week  
E4h(W)/E5h(R), E7h(R) factoryconfigured  
Right Side Addresses are Used at the Access of Builtin EEPROM  
Builtin A/D Converter  
ORDERING INFORMATION  
Device  
LC898249XHTBG  
Package  
Shipping  
4000 /  
Tape & Reel  
Builtin D/A Converter  
WLCSP6  
Hall Offset  
Constant Current Bias  
Builtin Hall Sensor  
Si Hall Sensor  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
Builtin EEPROM  
64 Byte (16 Byte / Page)  
Builtin OSC  
Builtin Constant Current Driver  
150 mA  
Package  
WLCSP 6pin (2 x 3 Pin), Thickness Max 0.29 mm,  
with Backside Coat  
Supply Voltage  
VDD (2.6 V to 3.3 V)  
This Device is PbFree, Halogen Free/BFR Free and is RoHS  
Compliant  
© Semiconductor Components Industries, LLC, 2019  
1
Publication Order Number:  
May, 2022 Rev. 1  
LC898249XH/D  
LC898249XH  
PIN DESCRIPTION  
Table 1. PIN DESCRIPTION  
Pin Name  
Description  
I
P
Input  
Power Supply, GND  
NC  
O
Not Connect  
Output  
B
Bidirection  
*Process when pins are not used  
2wire serial interface  
PIN TYPE “O” – Ensure that it is set to OPEN.  
PIN TYPE “I” – OPEN is inhibited. Ensure that it is  
connected to the VDD or VSS even when it is unused.  
(Please contact onsemi for more information about  
selection of VDD or VSS.)  
SCL  
SDA  
I
2wire serial interface clock pin  
2wire serial interface data pin  
B
Driver interface  
OUT1  
OUT2  
O
O
Driver output (to Actuator)  
Driver output (to Actuator)  
PIN TYPE “B” – If you are unsure about processing  
method on the pin description of pin layout table, please  
contact us.  
Note that incorrect processing of unused pins may result in  
defects.  
Power supply pin  
VDD  
VSS  
P
P
Power Supply  
GND  
PIN LAYOUT  
Table 2. PIN LAYOUT  
Circuit Name  
Driver  
Number of PINs  
2
2
2
Power  
Logic  
B
A
A
B
3
2
1
SDA  
SCL  
OUT1  
VDD  
3
2
1
SCL  
SDA  
OUT2  
VSS  
OUT1  
VDD  
OUT2  
VSS  
BOTTOM VIEW  
TOP VIEW  
Figure 1. Pin Layout  
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2
LC898249XH  
BLOCK DIAGRAM  
SDA  
SCL  
2Wire  
Serial I/F  
EEPROM  
Hall  
Offset  
/ Bias  
Control  
logic  
OUT1  
OUT2  
Constant  
Current  
Driver  
AD  
EQ  
Hall  
VGA  
OUT1  
OUT2  
VDD  
VSS  
more than or  
equal to 0.1 mF *  
OSC  
POR  
LDO  
*Consider capacitance of capacitor between VDD and VSS. According to power source environment, attach an additional capacitor in  
camera module.  
Figure 2. Block Diagram  
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3
LC898249XH  
HALL ELEMENT POSITION  
Figure 3. Hall Element Position  
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4
LC898249XH  
ELECTRICAL CHARACTERISTICS  
Table 3. ABSOLUTE MAXIMUM RATINGS (VSS = 0 V)  
Symbol Item  
33 max  
Condition  
Rating  
Unit  
V
V
DD  
Supply voltage  
Ta 25°C  
Ta 25°C  
0.3~4.6  
V 33,V 33  
Input/output voltage  
0.3~V 33 + 0.3  
V
I
O
DD  
Tstg  
Topr  
Storage ambient temperature  
Operating ambient temperature  
55~125  
30~70  
°C  
°C  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
Table 4. ACCEPTABLE OPERATION RANGE (Ta = 30~70°C, VSS = 0 V, 3 V power supply (VDD))  
Symbol  
33  
Item  
Min  
2.6  
0
Typ  
2.8  
Max  
Unit  
V
V
Supply voltage  
3.3  
DD  
V
IN  
Input voltage range  
V
DD  
33  
V
Table 5. DC CHARACTERISTICS (Input / output level at VSS = 0 V, VDD = 2.6 V~3.3V, Ta = 30~70°C)  
Symbol  
VIH  
Item  
Condition  
Min  
1.4  
Typ  
Max  
Unit  
V
Applicable Pins  
Highlevel input voltage  
Lowlevel input voltage  
Lowlevel output voltage  
CMOS compliant schmitt  
SCL, SDA  
VIL  
0.4  
0.2  
V
VOL  
IOL = 2 mA  
V
SDA  
Table 6. DRIVER OUTPUT (OUT1, OUT2) (VSS = 0 V, VDD = 2.8 V, Ta = 25°C)  
Symbol  
Item  
Condition  
Min  
Typ  
Max  
Unit  
Applicable Pins  
Ifull  
Maximum current  
142.5  
150  
157.5  
mA  
OUT1, OUT2  
Table 7. NONVOLATILE MEMORY CHARACTERISTICS  
Symbol  
EN  
Item  
Condition  
Min  
Typ  
Max  
Unit  
Applicable Circuit  
Endurance  
Data retention  
Write time  
10  
1000  
Cycles  
Years  
ms  
EEPROM  
RT  
tWT  
20  
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5
LC898249XH  
AC CHARACTERISTICS  
VDD Supply Timing  
t2  
t3  
VDD  
VSS  
Vbot  
t1  
SCL / SDA  
Figure 4. VDD Supply Timing  
It is available to use 2wire serial interface 5 ms later for Power On Reset of VDD.  
Table 8. VDD SUPPLY TIMING  
Symbol  
Item  
Min  
Typ  
Max  
3
Unit  
ms  
ms  
ms  
V
t1  
t2  
VDD turn on time  
2wire serial interface start time from VDD on  
VDD off time  
5
t3  
100  
Vbot  
Bottom Voltage  
0.1  
AC Specification  
Figure 5 shows interface timing definition and Table 9 shows electric characteristics.  
VIHmin  
SDA  
VILmax  
tBUF  
tHD,DAT tSU,DAT  
tSU,STA tHD,STA  
tf  
tLOW  
tr  
VIHmin  
SCL  
VILmax  
tHD,STA  
tr  
tf  
tSU,STO  
Stop  
Start  
Condition  
Repeated  
Condition  
Start  
Condition Condition  
Figure 5. 2wire Serial Interface Timing Definition  
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6
 
LC898249XH  
Table 9. ELECTRICAL CHARACTERISTICS FOR 2WIRE SERIAL INTERFACE (AC CHARACTERISTICS)  
Fastmode  
Fastmode Plus  
Pin  
Symbol  
Item  
SCL clock frequency  
Name  
Min  
Typ  
Max  
400  
Min  
Typ  
Max  
Unit  
kHz  
ms  
FSCL  
SCL  
1000  
tHD,STA START condition hold time  
SCL  
SDA  
0.6  
0.26  
tLOW  
tHIGH  
SCL clock Low period  
SCL clock High period  
SCL  
SCL  
1.3  
0.6  
0.6  
0.5  
ms  
ms  
ms  
0.26  
0.26  
tSU,STA Setup time for repetition START condition  
SCL  
SDA  
tHD,DAT Data hold time  
SCL  
0
0.9  
0
ms  
ns  
ns  
ns  
ms  
ms  
SDA (Note 1)  
(Note 1)  
tSU,DAT Data setup time  
SCL  
SDA  
100  
50  
tr  
tf  
SDA, SCL rising time  
SDA, SCL falling time  
SCL  
SDA  
300  
300  
120  
120  
SCL  
SDA  
tSU,STO STOP condition setup time  
tBUF Bus free time between STOP and START  
SCL  
SDA  
0.6  
1.3  
0.26  
0.5  
SCL  
SDA  
1. This LSI is designed for a condition with typ. 20 ns of hold time. If SDA signal is unstable around falling point of SCL signal, please implement  
an appropriate treatment on board, such as inserting a resistor.  
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7
 
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
WLCSP6, 0.86x1.75x0.265  
CASE 567XD  
ISSUE O  
DATE 23 OCT 2018  
GENERIC  
MARKING DIAGRAM*  
XXXX = Specific Device Code  
*This information is generic. Please refer to  
A
L
= Assembly Location  
= Wafer Lot  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “G”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
XXXXXX  
ALYWW  
Y
= Year  
WW = Work Week  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON99381G  
WLCSP6, 0.86x1.75x0.265  
PAGE 1 OF 1  
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© Semiconductor Components Industries, LLC, 2018  
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