LM285Z-2.5RM [ONSEMI]
IC 1-OUTPUT TWO TERM VOLTAGE REFERENCE, 2.5 V, PBCY3, PLASTIC, TO-226AA, 3 PIN, Voltage Reference;
| 型号： | LM285Z-2.5RM |
| 厂家： | 
ONSEMI |
| 描述： | IC 1-OUTPUT TWO TERM VOLTAGE REFERENCE, 2.5 V, PBCY3, PLASTIC, TO-226AA, 3 PIN, Voltage Reference 输出元件 |
| 文件： | 总44页 (文件大小：921K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
The LM285/LM385 series are micropower two–terminal bandgap voltage
regulator diodes. Designed to operate over a wide current range of 10 µA to
20 mA, these devices feature exceptionally low dynamic impedance, low
noise and stable operation over time and temperature. Tight voltage
tolerances are achieved by on–chip trimming. The large dynamic operating
range enables these devices to be used in applications with widely varying
supplies with excellent regulation. Extremely low operating current make
these devices ideal for micropower circuitry like portable instrumentation,
regulators and other analog circuitry where extended battery life is required.
The LM285/LM385 series are packaged in a low cost TO–226AA plastic
case and are available in two voltage versions of 1.235 and 2.500 V as
denoted by the device suffix (see Ordering Information table). The LM285 is
specified over a –40°C to +85°C temperature range while the LM385 is rated
from 0°C to +70°C.
MICROPOWER VOLTAGE
REFERENCE DIODES
SEMICONDUCTOR
TECHNICAL DATA
Z SUFFIX
PLASTIC PACKAGE
CASE 29
(Bottom View)
3
2
1
The LM385 is also available in a surface mount plastic package in
voltages of 1.235 and 2.500 V.
N.C.
Cathode
Anode
• Operating Current from 10 µA to 20 mA
• 1.0%, 1.5%, 2.0% and 3.0% Initial Tolerance Grades
• Low Temperature Coefficient
D SUFFIX
PLASTIC PACKAGE
CASE 751
• 1.0 Ω Dynamic Impedance
• Surface Mount Package Available
8
N.C.
1
2
3
4
Cathode
N.C.
(SO–8)
N.C.
N.C.
N.C.
6
5
N.C.
Anode
Standard Application
+
3.3 k
1.5 V
Battery
–
1.235 V
LM385–1.2
Representative Schematic Diagram
Cathode
10 k
360 k
ORDERING INFORMATION
Reverse
Open
for 1.235 V
Operating
Break–
Temperature down
Device
Range
Voltage Tolerance
600 k
8.45 k
LM285D–1.2
LM285Z–1.2
1.235 V
2.500 V
1.235 V
1.235 V
2.500 V
2.500 V
±1.0%
±1.5%
±1.0%
±2.0%
±1.5%
±3.0%
T
= –40° to
+85°C
A
LM285D–2.5
LM285Z–2.5
74.3 k
600 k
LM385BD–1.2
LM385BZ–1.2
Open
for 2.5 V
425 k
LM385D–1.2
LM385Z–1.2
T
= 0° to
+70°C
A
LM385BD–2.5
LM385BZ–2.5
600 k
500 Ω
100 k
LM385D–2.5
LM385Z–2.5
Anode
5–4
MOTOROLA ANALOG IC DEVICE DATA
LM285 LM385, B
MAXIMUM RATINGS (T = 25°C, unless otherwise noted)
A
Rating
Symbol
Value
30
Unit
mA
mA
°C
Reverse Current
Forward Current
I
R
I
F
10
Operating Ambient Temperature Range
T
A
LM285
LM385
– 40 to + 85
0 to +70
Operating Junction Temperature
Storage Temperature Range
T
+ 150
°C
°C
J
T
stg
– 65 to + 150
ELECTRICAL CHARACTERISTICS (T = 25°C, unless otherwise noted)
A
LM285–1.2
Typ
LM385–1.2/LM385B–1.2
Characteristic
Reverse Breakdown Voltage (I
Symbol
Min
Max
Min
Typ
Max
Unit
I
R
20 mA)
V
(BR)R
V
Rmin
LM285–1.2/LM385B–1.2
1.223
1.200
–
1.235
1.247 1.223
1.270 1.210
1.235
–
1.235
–
1.247
1.260
1.260
1.273
T
= T
to T
(Note 1)
–
–
–
A
low
LM385–1.2
= T
high
–
–
1.205
1.192
T
A
to T
(Note 1)
–
low
high
Minimum Operating Current
= 25°C
I
µA
Rmin
T
A
–
–
8.0
–
10
20
–
–
8.0
–
15
20
T
= T
to T (Note 1)
high
A
low
Reverse Breakdown Voltage Change with Current
1.0 mA, T = +25°C
∆V
(BR)R
mV
I
I
–
–
–
–
–
–
–
–
1.0
1.5
10
–
–
–
–
–
–
–
–
1.0
1.5
20
Rmin
= T
R
low
I
A
T
to T
(Note 1)
high
20 mA, T = +25°C
A
1.0 mA
= T
R
A
T
A
to T (Note 1)
20
25
low
high
Reverse Dynamic Impedance
= 100 µA, T = +25°C
Z
0.6
80
60
20
–
–
–
–
–
–
–
–
0.6
80
60
20
–
–
–
–
W
ppm/°C
µV
I
R
A
Average Temperature Coefficient
10 µA 20 mA, T = T
∆V
/∆T
–
–
–
(BR)
I
R
to T
(Note 1)
high
A
low
Wideband Noise (RMS)
= 100 µA, 10 Hz
n
I
R
f
10 kHz
Long Term Stability
= 100 µA, T = +25°C ± 0.1°C
S
ppm/
kHR
I
R
A
5–5
MOTOROLA ANALOG IC DEVICE DATA
LM285 LM385, B
ELECTRICAL CHARACTERISTICS (T = 25°C, unless otherwise noted)
A
LM285–2.5
Typ
LM385–2.5/LM385B–2.5
Characteristic
Reverse Breakdown Voltage (I
Symbol
Min
Max
Min
Typ
Max
Unit
I
R
20 mA)
V
(BR)R
V
Rmin
LM285–2.5/LM385B–2.5
2.462
2.415
–
2.5
–
–
2.538 2.462
2.585 2.436
2.5
–
2.5
–
2.538
2.564
2.575
2.600
T
= T
to T
(Note 1)
A
low
LM385–2.5
= T
high
–
–
2.425
2.400
T
A
to T
(Note 1)
–
–
low
high
Minimum Operating Current
= 25°C
I
µA
Rmin
T
A
–
–
13
–
20
30
–
–
13
–
20
30
T
= T
to T (Note 1)
high
A
low
Reverse Breakdown Voltage Change with Current
1.0 mA, T = +25°C
∆V
(BR)R
mV
I
I
–
–
–
–
–
–
–
–
1.0
1.5
10
–
–
–
–
–
–
–
–
2.0
2.5
20
Rmin
= T
R
low
I
A
T
to T
(Note 1)
high
20 mA, T = +25°C
A
1.0 mA
R
A
T
A
= T
to T (Note 1)
20
25
low
high
Reverse Dynamic Impedance
= 100 µA, T = +25°C
Z
0.6
–
–
–
–
–
–
–
–
0.6
–
–
–
–
W
ppm/°C
µV
I
R
A
Average Temperature Coefficient
20 µA 20 mA, T = T
Wideband Noise (RMS)
= 100 µA, 10 Hz 10 kHz
∆V
/∆T
–
–
–
80
80
(BR)
I
R
to T
(Note 1)
high
A
low
n
120
20
120
20
I
R
f
Long Term Stability
= 100 µA, T = +25°C ± 0.1°C
S
ppm/
kHR
I
R
A
NOTES: 1. T
= – 40°C for LM285–1.2, LM285–2.5
= 0°C for LM385–1.2, LM385B–1.2, LM385–2.5, LM385B–2.5
T
= +85°C for LM285–1.2, LM285–2.5
= +70°C for LM385–1.2, LM385B–1.2, LM385–2.5, LM385B–2.5
low
high
T
high
5–6
MOTOROLA ANALOG IC DEVICE DATA
LM285 LM385, B
TYPICAL PERFORMANCE CURVES FOR LM285–1.2/385–1.2/385B–1.2
Figure 1. Reverse Characteristics
Figure 2. Reverse Characteristics
100
10
10
8.0
6.0
4.0
T = +85°C
A
+25°C
T = +85°C
A
1.0
0.1
–40°C
2.0
0
+25°C
–40°C
–2.0
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0.01
0.1
1.0
10
100
V( , REVERSE VOLTAGE (V)
BR)
I , REVERSE CURRENT (mA)
R
Figure 3. Forward Characteristics
Figure 4. Temperature Drift
1.250
1.240
1.2
1.0
0.8
0.6
0.4
0.2
0
I
= 100 µA
R
T = –40°C
A
1.230
1.220
1.210
+25°C
+85°C
–50
–25
0
25
50
75
100
125
0.01
0.1
1.0
10
100
T , AMBIENT TEMPERATURE (°C)
A
I , FORWARD CURRENT (mA)
F
Figure 5. Noise Voltage
Figure 6. Response Time
875
1.50
1.25
Input
750
625
500
375
250
125
0
100 k
1.00
0.75
0.50
0.25
0
Output
DUT
10
5.0
0
10
100
1.0 K
10 K
100 k
0
0.1 0.2 0.3 0.6 0.7 0.8 0.9 1.0 1.1
t, TIME (ms)
f, FREQUENCY (Hz)
5–7
MOTOROLA ANALOG IC DEVICE DATA
LM285 LM385, B
TYPICAL PERFORMANCE CURVES FOR LM285–2.5/385–2.5/385B–2.5
Figure 7. Reverse Characteristics
Figure 8. Reverse Characteristics
100
10
10
8.0
6.0
4.0
T = +85°C
A
T = +85°C
A
+25°C
–40°C
+25°C
1.0
0.1
2.0
0
–40°C
–2.0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0.01
0.1
1.0
10
100
V( , REVERSE VOLTAGE (V)
BR)
I , REVERSE CURRENT (mA)
R
Figure 9. Forward Characteristics
Figure 10. Temperature Drift
2.520
2.510
2.500
2.490
2.480
2.470
2.460
2.450
1.2
1.0
0.8
0.6
0.4
0.2
0
I
= 100 µA
R
T = –40°C
A
+85°C
+25°C
–50
–25
0
25
50
75
100
125
0.01
0.1
1.0
10
100
T , AMBIENT TEMPERATURE (°C)
A
I , FORWARD CURRENT (mA)
F
Figure 11. Noise Voltage
Figure 12. Response Time
3.00
2.50
Input
1500
100 k
2.00
1.50
1.00
0.50
0
1250
1000
750
500
250
0
Output
DUT
10
5.0
0
10
100
1.0 K
10 K
100 k
0
0.1 0.2 0.3 0.6 0.7 0.8 0.9 1.0 1.1
t, TIME (ms)
f, FREQUENCY (Hz)
5–8
MOTOROLA ANALOG IC DEVICE DATA
Tape and Reel Options
In Brief . . .
Motorola offers the convenience of Tape and Reel
packaging for our growing family of standard integrated circuit
products. Reels are available to support the requirements of
both first and second generation pick–and–place equipment.
The packaging fully conforms to the latest EIA–481A
specification. The antistatic embossed tape provides a
secure cavity, sealed with a peel–back cover tape.
Page
Tape and Reel Configurations . . . . . . . . . . . . . . . . . . . . . 12–2
Tape and Reel Information Table . . . . . . . . . . . . . . . . . . . 12–4
Analog MPQ Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12–5
12–1
MOTOROLA ANALOG IC DEVICE DATA
Tape and Reel Configurations
Mechanical Polarization
SOIC and Micro–8
DEVICES
PLCC DEVICES
Typical
Typical
PIN 1
User Direction of Feed
User Direction of Feed
2
DPAK and D PAK
DEVICES
Typical
User Direction of Feed
SOT–23 (5 Pin)
DEVICES
Typical
SOT–89 (3 Pin)
DEVICES
Typical
SOT–89 (5 Pin)
DEVICES
Typical
User Direction of Feed
User Direction of Feed
User Direction of Feed
12–2
MOTOROLA ANALOG IC DEVICE DATA
Tape and Reel Configurations (continued)
TO–92 Reel Styles
STYLE A
(Preferred)
STYLE E
Carrier Strip
Carrier Strip
Rounded
Side
Flat Side
Adhesive Tape
Adhesive Tape
Feed
Feed
Rounded side of transistor and adhesive tape visible.
Flat side of transistor and adhesive tape visible.
TO–92 Ammo Pack Styles
STYLE P
(Preferred)
STYLE M
Adhesive Tape On
Top Side
Adhesive Tape On
Top Side
Feed
Feed
Rounded Side
Flat Side
Carrier
Strip
Carrier
Strip
Flat side of transistor and
adhesive tape visible.
Rounded side of transistor and
adhesive tape visible.
Label
Label
Style P ammo pack is equivalent to Styles A and B of reel pack
dependent on feed orientation from box.
Style M ammo pack is equivalent to Style E of reel
pack dependent on feed orientation from box.
TO–92 EIA Radial Tape in Fan Fold Box or On Reel
H2A
H2A
H2B
H2B
H
W2
H4
H5
T1
L1
H1
W1
W
L
T
T2
F1
F2
D
P2
P1
P2
P
12–3
MOTOROLA ANALOG IC DEVICE DATA
Tape and Reel Information Table
(1)
Devices
per Reel
Tape Width
(mm)
Reel Size
(inch)
Device
Suffix
Package
SO–8, SOP–8
SO–14
SO–16
12
16
16
2,500
2,500
2,500
13
13
13
R2
R2
R2
SO–16L, SO–8+8L WIDE
SO–20L WIDE
SO–24L WIDE
SO–28L WIDE
SO–28L WIDE
16
24
24
24
32
1,000
1,000
1,000
1,000
1,000
13
13
13
13
13
R2
R2
R2
R2
R3
Micro–8
12
2,500
13
R2
PLCC–20
PLCC–28
PLCC–44
16
24
32
1,000
500
500
13
13
13
R2
R2
R2
PLCC–52
PLCC–68
PLCC–84
32
44
44
500
250
250
13
13
13
R2
R2
R2
(2)
TO–226AA (TO–92)
18
2,000
13
RA, RE, RP, or RM
(Ammo Pack) only
DPAK
16
24
8
2,500
800
13
13
7
RK
R4
TR
T1
2
D PAK
SOT–23 (5 Pin)
3,000
1,000
SOT–89 (3/5 Pin)
(1)
12
7
Minimum order quantity is 1 reel. Distributors/OEM customers may break lots or reels at their option, however broken reels may not be returned.
Integrated circuits in TO–226AA packages are available in Styes A and E only, with optional “Ammo Pack” (Suffix RP or RM). The RA and RP configurations
are preferred. For ordering information please contact your local Motorola Semiconductor Sales Office.
(2)
12–4
MOTOROLA ANALOG IC DEVICE DATA
Analog MPQ Table
Tape/Reel and Ammo Pack
Package Type
Package Code
MPQ
PLCC
Case 775
Case 776
Case 777
0802
0804
0801
1000/reel
500/reel
500/reel
SOIC
Case 751
Case 751A
Case 751B
Case 751G
Case 751D
Case 751E
Case 751F
0095
0096
0097
2003
2005
2008
2009
2500/reel
2500/reel
2500/reel
1000/reel
1000/reel
1000/reel
1000/reel
Micro–8
Case 846A
–
2500/reel
TO–92
Case 29
Case 29
0031
0031
2000/reel
2000/Ammo Pack
DPAK
Case 369A
–
–
–
–
–
2500/reel
800/reel
2
D PAK
Case 936
SOT–23 (5 Pin)
Case 1212
3000/reel
1000/reel
1000/reel
SOT–89 (3 Pin)
Case 1213
SOT–89 (5 Pin)
Case 1214
12–5
MOTOROLA ANALOG IC DEVICE DATA
12–6
MOTOROLA ANALOG IC DEVICE DATA
Packaging Information
In Brief . . .
The packaging availability for each device type is indicated
on the individual data sheets and the Selector Guide. All of the
outline dimensions for the packages are given in this section.
The maximum power consumption an integrated circuit
can tolerate at a given operating ambient temperature can be
found from the equation:
T
– T
A
J(max)
P
=
D(TA)
R
θJA(Typ)
where:
P
= Power Dissipation allowable at a given
operating ambient temperature. This must
be greater than the sum of the products of
the supply voltages and supply currents at
the worst case operating condition.
D(TA)
T
= Maximum operating Junction Temperature
as listed in the Maximum Ratings Section.
J(max)
See individual data sheets for T
information.
J(max)
T
A
= Maximum desired operating Ambient
Temperature
R
= Typical Thermal Resistance Junction-to-
Ambient
θJA(Typ)
13–1
MOTOROLA ANALOG IC DEVICE DATA
Case Outline Dimensions
LP, P, Z SUFFIX
CASE 29-04
NOTES:
Plastic Package
(TO-226AA/TO-92)
ISSUE AD
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
4. DIMENSION F APPLIES BETWEEN P AND L.
DIMENSION D AND J APPLY BETWEEN L AND K
MINIMUM. LEAD DIMENSION IS UNCONTROLLED
IN P AND BEYOND DIMENSION K MINIMUM.
A
B
R
P
INCHES
DIM MIN MAX
MILLIMETERS
L
MIN
4.45
4.32
3.18
0.41
0.41
1.15
2.42
0.39
MAX
5.20
5.33
4.19
0.55
0.48
1.39
2.66
0.50
–––
F
SEATING
PLANE
A
B
C
D
F
G
H
J
0.175 0.205
0.170 0.210
0.125 0.165
0.016 0.022
0.016 0.019
0.045 0.055
0.095 0.105
0.015 0.020
K
1
2
3
D
X X
G
K
L
N
P
0.500
0.250
0.080 0.105
––– 0.100
––– 12.70
–––
J
H
V
6.35
2.04
–––
2.93
3.43
–––
2.66
2.54
–––
C
SECTION X–X
R
V
0.115
0.135
–––
–––
1
–––
N
N
KC, T SUFFIX
CASE 221A-06
Plastic Package
ISSUE Y
SEATING
PLANE
–T–
C
NOTES:
T
F
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
–B–
S
2. CONTROLLING DIMENSION: INCH.
INCHES
DIM MIN MAX
0.560 0.625 14.23 15.87
MILLIMETERS
MIN MAX
4
4
Q
A
A
B
C
D
F
U
0.380 0.420
0.140 0.190
0.020 0.045
0.139 0.155
0.100 BSC
9.66 10.66
1
2
3
3.56
0.51
3.53
4.82
1.14
3.93
H
L
–Y–
G
H
J
2.54 BSC
K
––– 0.280
0.012 0.045
–––
0.31
7.11
1.14
1
2
3
K
L
N
Q
R
S
0.500 0.580 12.70 14.73
R
0.045 0.070
0.200 BSC
1.15
5.08 BSC
1.77
J
0.100 0.135
2.54
2.04
0.51
5.97
0.00
3.42
2.92
1.39
6.47
1.27
G
0.080
0.115
D 3 PL
0.020 0.055
0.235 0.255
0.000 0.050
T
U
M
M
0.25 (0.010)
B
Y
N
13–2
MOTOROLA ANALOG IC DEVICE DATA
TH SUFFIX
CASE 314A-03
Plastic Package
ISSUE D
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
–T–
Y14.5M, 1982.
B
–P–
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.
DIMENSION D INCLUDING PROTRUSION SHALL
NOT EXCEED 0.043 (1.092) MAXIMUM.
C
E
Q
OPTIONAL
CHAMFER
INCHES
DIM MIN MAX
MILLIMETERS
MIN MAX
A
U
F
A
B
C
D
E
F
0.572 0.613 14.529 15.570
0.390 0.415 9.906 10.541
0.170 0.180 4.318 4.572
0.025 0.038 0.635 0.965
0.048 0.055 1.219 1.397
0.570 0.585 14.478 14.859
L
K
1
5
G
J
K
L
Q
S
0.067 BSC
1.702 BSC
G
0.015 0.025 0.381 0.635
0.730 0.745 18.542 18.923
0.320 0.365 8.128 9.271
0.140 0.153 3.556 3.886
0.210 0.260 5.334 6.604
0.468 0.505 11.888 12.827
5X J
S
5X D
M
M
0.014 (0.356)
T P
U
NOTES:
T, TV SUFFIX
CASE 314B-05
Plastic Package
ISSUE J
C
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
B
–P–
OPTIONAL
CHAMFER
Q
F
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.
DIMENSION D INCLUDING PROTRUSION SHALL
NOT EXCEED 0.043 (1.092) MAXIMUM.
E
A
INCHES
DIM MIN MAX
A
B
C
D
E
MILLIMETERS
MIN MAX
0.613 14.529 15.570
0.415 9.906 10.541
U
L
S
V
0.572
0.390
0.170
0.025
0.048
0.850
0.067 BSC
0.166 BSC
0.015
0.900
0.320
0.320 BSC
0.140
–––
0.468
–––
0.090
W
K
0.180 4.318
0.038 0.635
0.055 1.219
4.572
0.965
1.397
F
0.935 21.590 23.749
1
G
H
J
K
L
N
Q
S
1.702 BSC
4.216 BSC
5
0.025 0.381
1.100 22.860 27.940
0.635
5X J
0.365 8.128
9.271
G
M
0.24 (0.610)
T
H
N
8.128 BSC
5X D
0.153 3.556
0.620
0.505 11.888 12.827
0.735 ––– 18.669
0.110 2.286 2.794
3.886
––– 15.748
M
M
0.10 (0.254)
T P
U
V
W
SEATING
PLANE
–T–
B
–Q–
SEATING
PLANE
T SUFFIX
–T–
CASE 314C–01
Plastic Package
ISSUE A
C
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
A
K
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.
DIMENSION D INCLUDING PROTRUSION SHALL
NOT EXCEED 10.92 (0.043) MAXIMUM.
1
2 3 4 5
INCHES
DIM MIN MAX
0.625 15.59
MILLIMETERS
L
MIN
MAX
15.88
10.67
4.83
1
A
B
C
D
E
G
J
0.610
0.380
0.160
0.020
0.035
5
0.420
0.190
0.040
0.055
9.65
4.06
0.51
0.89
1.02
1.40
0.067 BSC
1.702 BSC
0.015
0.500
0.355
0.139
0.025
––– 12.70
0.370
0.147
0.38
0.64
–––
9.40
3.73
K
L
Q
9.02
3.53
G
D 5 PL
M
M
0.356 (0.014)
T Q
J
13–3
MOTOROLA ANALOG IC DEVICE DATA
T, T1 SUFFIX
CASE 314D-03
Plastic Package
ISSUE D
SEATING
PLANE
–T–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
C
–Q–
B
Y14.5M, 1982.
E
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.
DIMENSION D INCLUDING PROTRUSION SHALL
NOT EXCEED 10.92 (0.043) MAXIMUM.
U
A
S
INCHES
DIM MIN MAX
MILLIMETERS
MIN MAX
L
A
B
C
D
E
G
H
J
0.572
0.390
0.170
0.025
0.048
0.613 14.529 15.570
0.415 9.906 10.541
0.180 4.318
0.038 0.635
0.055 1.219
1
2
3
4 5
K
4.572
0.965
1.397
0.067 BSC
1.702 BSC
0.087
0.015
1.020
0.320
0.140
0.105
0.543
0.112 2.210
0.025 0.381
2.845
0.635
1
2
3
4
K
L
Q
U
S
1.065 25.908 27.051
5
0.365 8.128
0.153 3.556
0.117 2.667
9.271
3.886
2.972
J
G
H
0.582 13.792 14.783
D 5 PL
M
M
0.356 (0.014)
T Q
DT-1 SUFFIX
CASE 369-07
Plastic Package
(DPAK)
C
B
R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
V
ISSUE K
E
INCHES
DIM MIN MAX
MILLIMETERS
4
MIN
5.97
6.35
2.19
0.69
0.84
0.94
MAX
6.35
6.73
2.38
0.88
1.01
1.19
4
A
B
C
D
E
F
G
H
J
0.235 0.250
0.250 0.265
0.086 0.094
0.027 0.035
0.033 0.040
0.037 0.047
0.090 BSC
0.034 0.040
0.018 0.023
0.350 0.380
0.175 0.215
0.050 0.090
0.030 0.050
A
1
2
3
S
–T–
SEATING
PLANE
2.29 BSC
1
2
3
K
0.87
0.46
8.89
4.45
1.27
0.77
1.01
0.58
9.65
5.46
2.28
1.27
K
R
S
J
F
V
H
D 3 PL
G
M
0.13 (0.005)
T
DT SUFFIX
CASE 369A-13
Plastic Package
(DPAK)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
SEATING
PLANE
–T–
C
B
ISSUE Y
INCHES
DIM MIN MAX
MILLIMETERS
E
V
R
MIN
5.97
6.35
2.19
0.69
0.84
0.94
MAX
6.35
6.73
2.38
0.88
1.01
1.19
A
B
C
D
E
F
G
H
J
K
L
R
S
U
V
Z
0.235 0.250
0.250 0.265
0.086 0.094
0.027 0.035
0.033 0.040
0.037 0.047
0.180 BSC
4
4
Z
1
A
K
S
1
2
3
3
4.58 BSC
U
0.034 0.040
0.018 0.023
0.87
0.46
2.60
1.01
0.58
2.89
0.102
0.114
0.090 BSC
0.175 0.215
0.020 0.050
2.29 BSC
F
J
4.45
0.51
0.51
0.77
3.51
5.46
1.27
–––
1.27
–––
L
H
0.020
0.030 0.050
0.138 –––
–––
D 2 PL
M
G
0.13 (0.005)
T
13–4
MOTOROLA ANALOG IC DEVICE DATA
DP1, N, P, P1 SUFFIX
CASE 626-05
Plastic Package
ISSUE K
8
5
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
–B–
1
4
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
MILLIMETERS
DIM MIN MAX
9.40 10.16 0.370 0.400
INCHES
MIN MAX
F
A
B
C
D
F
–A–
NOTE 2
6.10
3.94
0.38
1.02
6.60 0.240 0.260
4.45 0.155 0.175
0.51 0.015 0.020
1.78 0.040 0.070
L
G
H
J
K
L
2.54 BSC
0.100 BSC
1.27 0.030 0.050
0.30 0.008 0.012
8
C
0.76
0.20
2.92
1
J
3.43
0.115
0.135
–T–
SEATING
PLANE
7.62 BSC
0.300 BSC
N
M
N
–––
10
–––
10
0.76
1.01 0.030 0.040
M
D
K
G
H
M
M
M
0.13 (0.005)
T A
B
N, P, N-14, P2 SUFFIX
CASE 646-06
Plastic Package
ISSUE L
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. ROUNDED CORNERS OPTIONAL.
14
1
8
B
7
INCHES
DIM MIN MAX
0.770 18.16
MILLIMETERS
A
F
MIN
MAX
19.56
6.60
4.69
0.53
1.78
A
B
C
D
F
0.715
0.240
0.145
0.015
0.040
0.260
0.185
0.021
0.070
6.10
3.69
0.38
1.02
L
14
1
C
G
H
J
K
L
0.100 BSC
2.54 BSC
0.052
0.008
0.115
0.095
0.015
0.135
1.32
0.20
2.92
2.41
0.38
3.43
J
N
0.300 BSC
7.62 BSC
SEATING
PLANE
K
M
N
0
10
0.039
0
0.39
10
1.01
0.015
H
G
D
M
DP2, N, P, PC SUFFIX
CASE 648-08
Plastic Package
ISSUE R
NOTES:
–A–
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
16
1
9
8
B
S
INCHES
DIM MIN MAX
0.770 18.80
MILLIMETERS
MIN
MAX
19.55
6.85
4.44
0.53
1.77
F
A
B
C
D
F
0.740
0.250
0.145
0.015
0.040
C
L
0.270
0.175
0.021
0.70
6.35
3.69
0.39
1.02
16
1
SEATING
PLANE
–T–
G
H
J
K
L
M
S
0.100 BSC
0.050 BSC
2.54 BSC
1.27 BSC
K
M
0.008
0.015
0.130
0.305
10
0.21
0.38
3.30
7.74
10
H
J
0.110
0.295
0
2.80
7.50
0
G
D 16 PL
0.020
0.040
0.51
1.01
M
M
0.25 (0.010)
T A
13–5
MOTOROLA ANALOG IC DEVICE DATA
B, P, P2, V SUFFIX
CASE 648C-03
Plastic Package
(DIP–16)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. INTERNAL LEAD CONNECTION BETWEEN 4 AND
5, 12 AND 13.
–A–
ISSUE C
16
1
9
8
–B–
INCHES
DIM MIN MAX
0.840 18.80
MILLIMETERS
L
MIN
MAX
21.34
6.60
4.69
0.53
A
B
C
D
E
F
0.740
0.240
0.145
0.015
0.050 BSC
0.040
0.100 BSC
0.008
0.115
0.300 BSC
0
0.260
0.185
0.021
6.10
3.69
0.38
NOTE 5
16
1
1.27 BSC
C
0.70
1.02
1.78
G
J
K
L
M
N
2.54 BSC
0.015
0.135
0.20
2.92
0.38
3.43
–T–
SEATING
PLANE
M
N
7.62 BSC
K
10
0.040
0
10
E
0.015
0.39
1.01
J 16 PL
F
G
D 16 PL
M
S
0.13 (0.005)
T B
M
S
0.13 (0.005)
T A
–A–
P SUFFIX
NOTES:
CASE 648E–01
Plastic Package
(DIP–16)
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION A AND B DOES NOT INCLUDE MOLD
PROTRUSION.
5. MOLD FLASH OR PROTRUSIONS SHALL NOT
EXCEED 0.25 (0.010).
R
16
1
9
8
ISSUE O
–B–
6. ROUNDED CORNER OPTIONAL.
M
P
L
INCHES
DIM MIN MAX
0.760 18.80
MILLIMETERS
F
MIN
MAX
19.30
6.60
4.44
0.53
1.77
A
B
C
D
F
0.740
0.245
0.145
0.015
0.050
0.260
0.175
0.021
0.070
6.23
3.69
0.39
1.27
16
J
1
C
G
H
J
K
L
M
P
0.100 BSC
0.050 BSC
2.54 BSC
1.27 BSC
0.21
3.05
7.50
0
5.08 BSC
7.62 BSC
0.39 0.88
–T–
SEATING
PLANE
0.008
0.015
0.140
0.305
10
0.38
3.55
7.74
10
S
0.120
0.295
0
K
H
G
0.200 BSC
0.300 BSC
0.015 0.035
R
S
D 13 PL
M
S
S
0.25 (0.010)
T B
A
P SUFFIX
CASE 649-03
Plastic Package
ISSUE D
P
A
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
13
24
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
L
Q
B
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
1.265
0.540
0.205
0.020
0.060
1
A
B
C
D
F
31.50
13.21
4.70
0.38
1.02
32.13 1.240
13.72 0.520
5.21 0.185
0.51 0.015
1.52 0.040
12
M
J
H
F
C
G
H
J
K
L
M
N
P
2.54 BSC
0.100 BSC
1.65
0.20
2.92
14.99
–––
2.16 0.065
0.30 0.008
3.43
15.49 0.590
10 –––
0.085
0.012
0.135
0.610
10
24
N
0.115
1
K
0.51
0.13
0.51
1.02 0.020
0.38 0.005
0.76 0.020
0.040
0.015
0.030
D
G
SEATING
PLANE
Q
13–6
MOTOROLA ANALOG IC DEVICE DATA
A, B, N, P SUFFIX
CASE 707-02
Plastic Package
ISSUE C
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D),
SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM
MATERIAL CONDITION, IN RELATION TO
SEATING PLANE AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
18
10
9
B
1
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
A
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
0.915
0.260
0.180
0.022
0.070
L
A
B
C
D
F
22.22
6.10
3.56
0.36
1.27
23.24 0.875
6.60 0.240
4.57 0.140
0.56 0.014
1.78 0.050
C
18
1
G
H
J
K
L
2.54 BSC
0.100 BSC
K
N
1.02
0.20
2.92
1.52 0.040
0.30 0.008
3.43
0.060
0.012
0.135
J
M
F
D
SEATING
PLANE
0.115
H
G
7.62 BSC
0.300 BSC
M
N
0
0.51
15
0
15
0.040
1.02 0.020
P SUFFIX
CASE 710-02
Plastic Package
ISSUE B
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D), SHALL
BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL
CONDITION, IN RELATION TO SEATING PLANE
AND EACH OTHER.
28
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
1
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
28
1
15
A
B
C
D
F
36.45 37.21 1.435 1.465
13.72 14.22 0.540 0.560
B
3.94
0.36
1.02
5.08 0.155 0.200
0.56 0.014 0.022
1.52 0.040 0.060
14
G
H
J
K
L
2.54 BSC
0.100 BSC
2.16 0.065 0.085
0.38 0.008 0.015
1.65
0.20
2.92
L
C
A
3.43
0.115
0.135
15.24 BSC
0.600 BSC
N
M
N
0
0.51
15
0
15
1.02 0.020 0.040
J
M
G
H
F
K
SEATING
PLANE
D
P SUFFIX
CASE 711-03
Plastic Package
ISSUE C
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D), SHALL
BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL
CONDITION, IN RELATION TO SEATING PLANE
AND EACH OTHER.
40
1
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
40
21
20
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
B
A
B
C
D
F
51.69 52.45 2.035 2.065
13.72 14.22 0.540 0.560
3.94
0.36
1.02
5.08 0.155 0.200
0.56 0.014 0.022
1.52 0.040 0.060
1
G
H
J
K
L
2.54 BSC
0.100 BSC
2.16 0.065 0.085
0.38 0.008 0.015
L
A
1.65
0.20
2.92
C
3.43
0.115
0.135
N
15.24 BSC
0.600 BSC
M
N
0
0.51
15
0
15
J
1.02 0.020 0.040
K
SEATING
PLANE
M
H
G
F
D
13–7
MOTOROLA ANALOG IC DEVICE DATA
F, P, P-3 SUFFIX
CASE 724-03
Plastic Package
(NDIP–24)
NOTES:
1. CHAMFERED CONTOUR OPTIONAL.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
24
ISSUE D
1
4. CONTROLLING DIMENSION: INCH.
–A–
INCHES
DIM MIN MAX
1.265 31.25
MILLIMETERS
MIN
MAX
32.13
6.85
4.44
0.51
24
1
13
12
A
B
C
D
E
F
1.230
0.250
0.145
0.015
0.050 BSC
0.040
–B–
0.270
0.175
0.020
6.35
3.69
0.38
1.27 BSC
1.02
L
C
0.060
1.52
G
J
K
L
M
N
0.100 BSC
2.54 BSC
0.007
0.110
0.012
0.140
0.18
2.80
0.30
3.55
NOTE 1
–T–
SEATING
PLANE
K
0.300 BSC
7.62 BSC
N
M
0
15
0
15
E
0.020
0.040
0.51
1.01
G
J 24 PL
F
M
M
0.25 (0.010)
T B
D 24 PL
M
M
0.25 (0.010)
T A
H, P, DP SUFFIX
CASE 738-03
Plastic Package
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
–A–
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
20
1
11
B
INCHES
DIM MIN MAX
1.010 1.070 25.66
MILLIMETERS
10
MIN
MAX
27.17
6.60
A
B
C
D
E
F
0.240 0.260
0.150 0.180
0.015 0.022
0.050 BSC
6.10
3.81
0.39
L
4.57
0.55
C
1.27 BSC
0.050 0.070
0.100 BSC
1.27
1.77
20
G
2.54 BSC
1
J
0.008 0.015
0.21
2.80
7.62 BSC
0
0.51
0.38
3.55
K
L
M
N
0.110
0.140
–T–
SEATING
PLANE
K
M
0.300 BSC
0
15
15
1.01
0.020 0.040
N
E
J 20 PL
G
F
M
M
0.25 (0.010)
T B
D 20 PL
M
M
0.25 (0.010)
T A
D, D1, D2 SUFFIX
CASE 751-05
Plastic Package
(SO-8, SOP-8)
ISSUE R
NOTES:
D
A
E
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS ARE IN MILLIMETERS.
3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
C
8
1
5
4
M
M
0.25
B
H
MILLIMETERS
8
h X 45
B
C
DIM MIN
MAX
1.75
0.25
0.49
0.25
5.00
4.00
e
1
A
A1
B
C
D
E
1.35
0.10
0.35
0.18
4.80
3.80
A
SEATING
PLANE
e
H
h
1.27 BSC
0.10
L
5.80
0.25
0.40
0
6.20
0.50
1.25
7
A1
B
L
M
S
S
0.25
C B
A
13–8
MOTOROLA ANALOG IC DEVICE DATA
D SUFFIX
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
CASE 751A-03
Plastic Package
(SO-14)
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
–A–
ISSUE F
14
1
8
7
–B–
P 7 PL
M
M
0.25 (0.010)
B
MILLIMETERS
DIM MIN MAX
INCHES
14
1
MIN
MAX
0.344
0.157
0.068
0.019
0.049
F
A
B
C
D
F
8.55
3.80
1.35
0.35
0.40
8.75 0.337
4.00 0.150
1.75 0.054
0.49 0.014
1.25 0.016
R X 45
G
C
G
J
K
M
P
1.27 BSC
0.050 BSC
–T–
SEATING
PLANE
J
M
0.19
0.10
0
0.25 0.008
0.25 0.004
0.009
0.009
7
K
D 14 PL
7
0
M
S
S
0.25 (0.010)
T B
A
5.80
0.25
6.20 0.228
0.50 0.010
0.244
0.019
R
–A–
D SUFFIX
NOTES:
CASE 751B-05
Plastic Package
(SO-16)
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
16
9
ISSUE J
–B–
P 8 PL
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
M
S
0.25 (0.010)
B
1
8
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
G
MILLIMETERS
DIM MIN MAX
9.80 10.00 0.386 0.393
INCHES
MIN MAX
16
1
A
B
C
D
F
F
K
3.80
1.35
0.35
0.40
4.00 0.150 0.157
1.75 0.054 0.068
0.49 0.014 0.019
1.25 0.016 0.049
R X 45
C
G
J
K
M
P
1.27 BSC
0.050 BSC
0.25 0.008 0.009
0.25 0.004 0.009
–T–
SEATING
PLANE
0.19
0.10
0
J
M
D
16 PL
7
0
7
5.80
0.25
6.20 0.229 0.244
0.50 0.010 0.019
M
S
S
0.25 (0.010)
T B
A
R
DW, FP SUFFIX
–A–
NOTES:
CASE 751D-04
Plastic Package
(SO-20L, SO–20)
ISSUE E
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
20
11
4. MAXIMUM MOLD PROTRUSION 0.150
(0.006) PER SIDE.
10X P
–B–
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
M
M
0.010 (0.25)
B
1
10
J
F
20X D
MILLIMETERS
DIM MIN MAX
12.65 12.95 0.499 0.510
INCHES
MIN MAX
M
S
S
0.010 (0.25) T A
B
A
B
C
D
F
20
7.40
2.35
0.35
0.50
7.60 0.292 0.299
2.65 0.093 0.104
0.49 0.014 0.019
0.90 0.020 0.035
1
R X 45
G
J
K
M
P
1.27 BSC
0.050 BSC
0.32 0.010 0.012
0.25 0.004 0.009
C
0.25
0.10
0
SEATING
PLANE
7
0
7
–T–
10.05 10.55 0.395 0.415
18X G
R
0.25
0.75 0.010 0.029
K
M
13–9
MOTOROLA ANALOG IC DEVICE DATA
DW SUFFIX
CASE 751E-04
Plastic Package
(SO-24L,
SOP (16+4+4)L)
ISSUE E
–A–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
24
13
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
–B– 12X P
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
M
M
0.010 (0.25)
B
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
1
12
24X D
24
J
MILLIMETERS
DIM MIN MAX
INCHES
M
S
S
0.010 (0.25)
T A
B
1
MIN
MAX
0.612
0.299
0.104
0.019
0.035
A
B
C
D
F
15.25
7.40
2.35
0.35
0.41
15.54 0.601
7.60 0.292
2.65 0.093
0.49 0.014
0.90 0.016
F
R X 45
G
J
K
M
P
1.27 BSC
0.050 BSC
0.23
0.13
0
0.32 0.009
0.29 0.005
0.013
0.011
8
C
K
–T–
SEATING
8
0
M
10.05
0.25
10.55 0.395
0.75 0.010
0.415
0.029
PLANE
R
22X G
DW SUFFIX
CASE 751F-04
NOTES:
Plastic Package
(SO-28L, SOIC–28)
ISSUE E
28
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE
1
–A–
15
28
14X P
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
M
M
0.010 (0.25)
B
–B–
1
MILLIMETERS
DIM MIN MAX
INCHES
14
MIN
MAX
0.711
0.299
0.104
0.019
0.035
M
A
B
C
D
F
17.80
7.40
2.35
0.35
0.41
18.05 0.701
7.60 0.292
2.65 0.093
0.49 0.014
0.90 0.016
28X D
R
X 45
M
S
S
0.010 (0.25)
T A
B
G
J
K
M
P
1.27 BSC
0.050 BSC
0.23
0.13
0
0.32 0.009
0.29 0.005
0.013
0.011
8
C
8
0
–T–
SEATING
PLANE
10.01
0.25
10.55 0.395
0.75 0.010
0.415
0.029
26X G
F
R
K
J
DW SUFFIX
CASE 751G-02
Plastic Package
(SO-16L, SOP–16L,
SOP-8+8L)
ISSUE A
–A–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
16
9
–B–
8X P
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
M
M
0.010 (0.25)
B
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
1
8
J
16X D
16
MILLIMETERS
DIM MIN MAX
10.15 10.45 0.400
INCHES
M
S
S
0.010 (0.25)
T A
B
MIN
MAX
1
A
B
C
D
F
0.411
F
7.40
2.35
0.35
0.50
7.60 0.292 0.299
2.65 0.093 0.104
0.49 0.014 0.019
0.90 0.020 0.035
R X 45
G
J
K
M
P
1.27 BSC
0.050 BSC
0.32 0.010 0.012
0.25 0.004 0.009
0.25
0.10
0
C
7
0
7
–T–
M
10.05 10.55 0.395 0.415
0.25 0.75 0.010 0.029
SEATING
14X G
K
PLANE
R
13–10
MOTOROLA ANALOG IC DEVICE DATA
D SUFFIX
16
CASE 751K–01
Plastic Package
(SO–16)
NOTES:
1
1
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2
3
CONTROLLING DIMENSION: MILLIMETER.
DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
–A–
ISSUE O
4
5
MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
16
9
DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
M
–B–
P
MILLIMETERS
DIM MIN MAX
INCHES
F
MIN
MAX
0.393
0.157
0.068
0.019
0.049
A
B
C
D
F
9.80
3.80
1.35
0.35
0.40
10.00 0.368
4.00 0.150
1.75 0.054
0.49 0.014
1.25 0.016
1
8
G
R X 45
G
J
K
M
P
1.27 BSC
0.050 BSC
0.19
0.10
0
0.25 0.008
0.25 0.004
7
0.009
0.009
7
C
SEATING
PLANE
–T–
0
5.80
0.25
6.20 0.229
0.50 0.010
0.244
0.019
14 X D
J
K
R
M
S
S
0.25 (0.010)
T A
B
–A–
DW SUFFIX
CASE 751N–01
Plastic Package
(SOP–16L)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
T
16
9
ISSUE O
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
M
M
–B–
P
0.010 (0.25)
B
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
1
8
16
J
F
MILLIMETERS
DIM MIN MAX
10.15 10.45 0.400
INCHES
13X D
1
MIN
MAX
A
B
C
D
F
0.411
M
S
S
0.010 (0.25)
T A
B
7.40
2.35
0.35
0.50
7.60 0.292 0.299
2.65 0.093 0.104
0.49 0.014 0.019
0.90 0.020 0.035
G
J
K
M
P
R
S
T
1.27 BSC
0.050 BSC
0.32 0.010 0.012
0.25 0.004 0.009
R X 45
0.25
0.10
0
7
0
7
C
10.05 10.55 0.395 0.415
0.25 0.75 0.010 0.029
2.54 BSC
3.81 BSC
–T–
SEATING
PLANE
M
S
0.100 BSC
0.150 BSC
K
9X G
13–11
MOTOROLA ANALOG IC DEVICE DATA
CASE 762-01
Plastic Medium Power Package
(SIP-9)
ISSUE C
9
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
Q
1
M
M
0.25 (0.010)
T A
–A–
MILLIMETERS
DIM MIN MAX
22.40 23.00 0.873 0.897
INCHES
MIN MAX
–C–
U
V
A
B
C
D
E
M
X
6.40
3.45
0.40
9.35
1.40
6.60 0.252 0.260
3.65 0.135 1.143
0.55 0.015 0.021
9.60 0.368 0.377
1.60 0.055 0.062
S
W
E
F
Y
G
H
J
2.54 BSC
0.100 BSC
1.51
1.71 0.059 0.067
0.360 0.400 0.014 0.015
R
B
N
K
M
N
Q
R
S
U
V
W
X
Y
3.95
30 BSC
2.50
3.15
13.60 13.90 0.535 0.547
1.65 1.95 0.064 0.076
22.00 22.20 0.866 0.874
0.55
2.89 BSC
4.20 0.155 0.165
30 BSC
2.70 0.099 0.106
3.45 0.124 0.135
9
1
SEATING
PLANE
–T–
K
M
M
0.25 (0.010)
T C
J
H
G
F
0.75 0.021 0.029
0.113 BSC
0.75 0.025 0.029
D 9 PL
0.65
2.70
M
M
0.25 (0.010)
T A
2.80 0.106
0.110
FN SUFFIX
CASE 775-02
Plastic Package
(PLCC-20)
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
1
ISSUE C
M
S
S
0.007 (0.180) T L–M
N
B
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
M
S
S
N
0.007 (0.180) T L–M
Y BRK
–N–
U
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
D
–L–
Z
–M–
W
D
20
1
S
S
S
0.010 (0.250) T L–M
N
G1
X
V
VIEW D–D
INCHES
DIM MIN MAX
MILLIMETERS
MIN
9.78
9.78
4.20
2.29
0.33
MAX
10.03
10.03
4.57
2.79
0.48
M
S
S
S
A
R
0.007 (0.180) T L–M
N
A
B
C
E
0.385
0.385
0.165
0.090
0.013
0.395
0.395
0.180
0.110
0.019
Z
M
S
0.007 (0.180) T L–M
N
F
M
S
S
H
0.007 (0.180) T L–M
N
G
H
J
0.050 BSC
1.27 BSC
C
0.026
0.020
0.025
0.350
0.350
0.042
0.042
0.042
–––
0.032
–––
–––
0.356
0.356
0.048
0.048
0.056
0.020
10
0.66
0.51
0.64
8.89
8.89
1.07
1.07
1.07
–––
2
0.81
–––
–––
9.04
9.04
1.21
1.21
1.42
0.50
10
E
0.004 (0.100)
K1
K
K
R
U
V
W
X
Y
Z
G
–T– SEATING
J
PLANE
VIEW S
M
S
S
0.007 (0.180) T L–M
N
G1
F
S
S
S
0.010 (0.250) T L–M
N
VIEW S
2
G1 0.310
K1 0.040
0.330
–––
7.88
1.02
8.38
–––
13–12
MOTOROLA ANALOG IC DEVICE DATA
FN SUFFIX
CASE 776-02
Plastic Package
(PLCC–28)
ISSUE D
1
M
S
S
0.007 (0.180)
T L–M
N
B
Z
Y BRK
D
–N–
M
S
S
0.007 (0.180)
T L–M
N
U
–M–
–L–
W
D
S
S
S
0.010 (0.250)
T L–M
N
X
G1
V
28
1
VIEW D–D
M
S
S
S
A
0.007 (0.180)
0.007 (0.180)
T L–M
N
M
S
S
H
0.007 (0.180)
T L–M
N
Z
M
S
T L–M
N
R
K1
C
E
0.004 (0.100)
SEATING
PLANE
G
K
–T–
VIEW S
J
M
S
S
0.007 (0.180)
T L–M
N
F
G1
S
S
S
0.010 (0.250)
T L–M
N
VIEW S
NOTES:
INCHES
DIM MIN MAX
MILLIMETERS
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE
MOLD FLASH. ALLOWABLE MOLD FLASH IS
0.010 (0.250) PER SIDE.
MIN
MAX
12.57
12.57
4.57
2.79
0.48
A
B
C
E
0.485
0.485
0.165
0.090
0.013
0.495 12.32
0.495 12.32
0.180
0.110
0.019
4.20
2.29
0.33
F
G
H
J
0.050 BSC
1.27 BSC
4. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
0.026
0.020
0.025
0.450
0.450
0.042
0.042
0.042
–––
0.032
–––
–––
0.456
0.456
0.048
0.048
0.056
0.020
10
0.66
0.51
0.64
11.43
11.43
1.07
1.07
1.07
–––
0.81
–––
–––
11.58
11.58
1.21
1.21
1.42
0.50
10
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
K
R
U
V
W
X
Y
Z
2
2
G1 0.410
K1 0.040
0.430 10.42
––– 1.02
10.92
–––
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
13–13
MOTOROLA ANALOG IC DEVICE DATA
FN SUFFIX
CASE 777-02
Plastic Package
(PLCC)
M
S
S
0.007(0.180)
T
L–M
N
B
M
S
S
0.007(0.180)
T
L–M
N
U
1
ISSUE C
D
–N–
Z
Y BRK
–M–
–L–
X
G1
S
S
S
0.010 (0.25)
T
L–M
N
VIEW D–D
H
V
W
D
M
S
S
0.007(0.180)
T
L–M
N
44
1
M
M
S
S
S
S
A
R
0.007(0.180)
0.007(0.180)
T
T
L–M
L–M
N
N
K1
Z
K
J
C
F
E
M
S
S
0.007(0.180)
VIEW S
T
L–M
N
0.004 (0.10)
G
SEATING
PLANE
–T–
INCHES
DIM MIN MAX
MILLIMETERS
MIN MAX
G1
VIEW S
A
B
C
E
0.685 0.695 17.40 17.65
0.685 0.695 17.40 17.65
S
S
S
0.010 (0.25)
T
L–M
N
0.165 0.180
0.090 0.110
0.013 0.019
0.050 BSC
4.20
2.29
0.33
4.57
2.79
0.48
NOTES:
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE
TOP AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
F
1. DATUMS –L–, –M–, AND –N– ARE DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010
(0.25) PER SIDE.
G
H
J
1.27 BSC
0.026 0.032
0.66
0.51
0.64
0.81
–––
–––
0.020
0.025
–––
–––
K
R
U
V
W
X
Y
Z
0.650 0.656 16.51 16.66
0.650 0.656 16.51 16.66
0.042 0.048
0.042 0.048
0.042 0.056
––– 0.020
1.07
1.07
1.07
–––
2
1.21
1.21
1.42
0.50
10
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
2
10
G1 0.610 0.630 15.50 16.00
K1 0.040 ––– 1.02 –––
NOTES:
M SUFFIX
CASE 803C
PRELIMINARY
Plastic Package
6
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
–A–
7
8
CONTROLLING DIMENSION: MILLIMETER.
DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
–F–
9
MAXIMUM MOLD PROTRUSION 0.15 (0.008) PER
SIDE.
20
1
11
10
10 DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.006) TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
K
–B–
1
J
20
G
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
0.504
0.215
0.081
0.020
0.032
S 10 PL
A
B
C
D
E
F
12.35
5.10
1.95
0.35
–––
12.80 0.486
5.45 0.201
2.05 0.077
0.50 0.014
M
M
0.13 (0.005)
B
N
0.81
12.40*
–––
0.488*
G
H
J
K
L
M
N
S
1.15
0.59
0.18
1.10
0.05
0
1.39 0.045
0.81 0.023
0.27 0.007
1.50 0.043
0.20 0.001
0.055
0.032
0.011
0.059
0.008
10
C
0.10 (0.004)
E
L
M
10
0
D 20 PL
–T–
SEATING
PLANE
0.50
7.40
0.85 0.020
8.20 0.291
0.033
0.323
M
S
S
0.13 (0.005)
T B
A
*APPROXIMATE
13–14
MOTOROLA ANALOG IC DEVICE DATA
TV SUFFIX
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
CASE 821C-04
Plastic Package
(15-Pin ZIP)
ISSUE D
1
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION R DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
15
5. MOLD FLASH OR PROTRUSIONS SHALL NOT
EXCEED 0.010 (0.250).
6. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL
BE 0.003 (0.076) TOTAL IN EXCESS OF THE D
DIMENSION. AT MAXIMUM MATERIAL CONDITION.
SEATING
PLANE
–T–
C
E
M
B
–Q–
INCHES
DIM MIN MAX
MILLIMETERS
MIN MAX
–P–
U
A
B
C
D
E
0.684 0.694 17.374 17.627
0.784 0.792 19.914 20.116
0.173 0.181 4.395 4.597
0.024 0.031 0.610 0.787
0.058 0.062 1.473 1.574
Y
K
V
A
R
G
H
J
K
L
0.050 BSC
0.169 BSC
0.018 0.024 0.458 0.609
0.700 0.710 17.780 18.034
1.270 BSC
4.293 BSC
S
0.200 BSC
5.080 BSC
PIN 15
M
R
S
U
V
Y
0.148 0.151 3.760 3.835
0.416 0.426 10.567 10.820
0.157 0.167 3.988 4.242
PIN 1
H
L
G
0.105
0.868 REF
0.625 0.639 15.875 16.231
0.115 2.667 2.921
15X D
15X J
22.047 REF
S
M
M
Q
0.010 (0.254)
T P
0.024 (0.610)
T
T SUFFIX
CASE 821D-03
Plastic Package
ISSUE C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION R DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
1
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
15
5. MOLD FLASH OR PROTRUSIONS SHALL NOT
EXCEED 0.010 (0.250).
6. DELETED
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL
BE 0.003 (0.076) TOTAL IN EXCESS OF THE D
DIMENSION. AT MAXIMUM MATERIAL CONDITION.
SEATING
PLANE
Q
–L–
–T–
C
B
E
INCHES
DIM MIN MAX
MILLIMETERS
MIN MAX
–P–
U
A
B
C
D
E
F
0.681 0.694 17.298 17.627
0.784 0.792 19.914 20.116
0.173 0.181 4.395 4.597
0.024 0.031 0.610 0.787
0.058 0.062 1.473 1.574
0.016 0.023 0.407 0.584
A
R
K
G
H
J
K
Q
R
U
Y
0.050 BSC
0.110 BSC
0.018 0.024 0.458 0.609
1.078 1.086 27.382 27.584
0.148 0.151 3.760 3.835
0.416 0.426 10.567 10.820
1.270 BSC
2.794 BSC
Y
PIN 1
PIN 15
H
G
0.110 BSC
0.503 REF
2.794 BSC
12.776 REF
7X F
15X D
15X J
S
M
L
0.010 (0.254)
T P
M
0.024 (0.610)
T
13–15
MOTOROLA ANALOG IC DEVICE DATA
FTB SUFFIX
CASE 824D–01
Plastic Package
(TQFP–44)
1
ISSUE O
L
–T–, –U–, –Z–
–Z–
44
34
33
1
AE
G
AE
DETAIL AA
–T–
L
–U–
F
PLATING
BASE METAL
DETAIL AA
J
11
23
N
12
22
D
M
S
S
0.20 (0.008)
AC T–U
Z
A
SECTION AE–AE
M
S
S
0.20 (0.008)
AB T–U
Z
Z
0.05 (0.002) T–U
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
M
S
S
0.20 (0.008)
AC T–U
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U– AND –Z– TO BE DETERMINED AT
DATUM PLANE –AB–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –AC–.
M
DETAIL AD
–AB–
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUM PLANE –AB–.
E
C
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL NOT
CAUSE THE D DIMENSION TO EXCEED 0.530
(0.021).
0.10 (0.004)
–AC–
H
Y
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
A
B
C
D
E
9.950 10.050 0.392 0.396
9.950 10.050 0.392 0.396
1.400 1.600 0.055 0.063
0.300 0.450 0.012 0.018
1.350 1.450 0.053 0.057
0.300 0.400 0.012 0.016
R
F
G
H
J
K
L
M
N
Q
R
S
V
W
X
Y
0.800 BSC
0.031 BSC
K
0.050 0.150 0.002 0.006
0.090 0.200 0.004 0.008
0.450 0.550 0.018 0.022
8.000 BSC
12 REF
Q
W
X
0.315 BSC
12 REF
VIEW AD
0.090 0.160 0.004 0.006
1
5
1
5
0.100 0.200 0.004 0.008
11.900 12.100 0.469 0.476
11.900 12.100 0.469 0.476
0.200 REF
1.000 REF
12 REF
0.008 REF
0.039 REF
12 REF
13–16
MOTOROLA ANALOG IC DEVICE DATA
FB SUFFIX
CASE 824E–02
Plastic Package
(QFP)
44
1
ISSUE A
S
–L–, –M–, –N–
M
S
S
S
S
0.20 (0.008)
0.20 (0.008)
T L–M
H L–M
N
N
A
M
0.05 (0.002) L–M
PIN 1
IDENT
J1
J1
G
44
34
33
1
VIEW Y
3 PL
F
PLATING
BASE METAL
–L–
–M–
J
B1
D
M
VIEW Y
S
S
0.20 (0.008)
T L–M
N
SECTION J1–J1
11
23
G 40X
44 PL
12
22
–N–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –L–, –M– AND –N– TO BE DETERMINED
AT DATUM PLANE –H–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –T–.
M
VIEW P
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –H–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.530 (0.021).
E
DATUM
C
–H–
PLANE
0.01 (0.004)
–T–
W
Y
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
0.398
0.398
0.087
A
B
C
D
E
9.90
9.90
2.00
0.30
2.00
0.30
10.10 0.390
10.10 0.390
2.21 0.079
0.45 0.0118 0.0177
2.10 0.079
0.40 0.012
1
0.083
0.016
F
R R1
R R2
G
J
K
M
S
V
W
Y
A1
0.80 BSC
0.031 BSC
0.13
0.65
5
0.23 0.005
0.95 0.026
10
0.009
0.037
10
DATUM
PLANE
–H–
5
12.95
12.95
0.000
5
13.45 0.510
13.45 0.510
0.210 0.000
0.530
0.530
0.008
10
K
10
5
2
A1
0.450 REF
0.170 0.005
1.600 REF
0.130
0.300
0.300 0.005
0.018 REF
0.007
0.063 REF
B1 0.130
C1
R1
R2 0.130
1
2
C1
VIEW P
0.005
0.012
0.012
10
5
0
10
7
5
0
7
13–17
MOTOROLA ANALOG IC DEVICE DATA
FB SUFFIX
CASE 840F–01
Plastic Package
ISSUE O
64
1
L
–Z–
64
49
1
48
–T–, –U–, –Z–
P
AE
AE
L
B
V
G
–U–
–T–
DETAIL AA
DETAIL AA
16
33
32
17
BASE
METAL
A
N
M
S
S
S
S
0.20 (0.008)
AB T–U
Z
Z
0.050 (0.002) T–U
S
D
F
M
0.20 (0.008)
AC T–U
M
J
C
E
SECTION AE–AE
–AB–
0.10 (0.004)
–AC–
Y
H
DETAIL AD
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
0.396
0.396
0.063
0.011
0.057
0.009
NOTES:
A
B
C
D
E
F
9.950 10.050 0.392
9.950 10.050 0.392
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
1.400
0.170
1.350
0.170
1.600 0.055
0.270 0.007
1.450 0.053
0.230 0.007
Q
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U– AND –Z– TO BE DETERMINED
AT DATUM PLANE –AC–.
G
H
J
K
L
M
N
P
0.500 BSC
0.020 BSC
R
0.050
0.090
0.450
0.150 0.002
0.200 0.004
0.550 0.018
0.006
0.008
0.022
K
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –AC–.
7.500 BSC
12° REF
0.090 0.160 0.004
0.250 BSC 0.010 BSC
0.295 BSC
12° REF
0.006
W
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.25 (0.010 ) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350 (0.014).
X
°
°
5
Q
R
S
V
W
X
Y
1°
0.100
5
1°
0.200 0.004
DETAIL AD
0.008
0.476
0.476
11.900 12.100 0.469
11.900 12.100 0.469
0.200 REF
1.000 REF
12 REF
0.008 REF
0.039 REF
°
12 REF
°
13–18
MOTOROLA ANALOG IC DEVICE DATA
DM SUFFIX
CASE 846A–02
Plastic Package
(Micro–8)
8
1
ISSUE C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
–A–
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
–B–
K
MILLIMETERS
INCHES
PIN 1 ID
G
DIM MIN
MAX
3.10
3.10
1.10
MIN
0.114
0.114
MAX
0.122
0.122
D 8 PL
A
B
C
D
G
H
J
2.90
2.90
–––
M
S
S
0.08 (0.003)
T B
A
––– 0.043
0.25
0.40 0.010 0.016
0.65 BSC
0.026 BSC
0.15 0.002 0.006
0.23 0.005 0.009
5.05 0.187 0.199
0.70 0.016 0.028
0.05
0.13
4.75
0.40
SEATING
PLANE
–T–
K
L
0.038 (0.0015)
C
L
J
H
13–19
MOTOROLA ANALOG IC DEVICE DATA
FB SUFFIX
CASE 848B-04
Plastic Package
(TQFP–52)
1
52
ISSUE C
L
39
27
26
40
B
B
DETAIL A
–B–
–A–
L
–A–, –B–, –D–
DETAIL A
14
52
1
13
–D–
F
B
M
S
S
S
0.20 (0.008)
H A–B
D
D
0.05 (0.002) A–B
J
N
V
M
S
0.20 (0.008)
C A–B
BASE METAL
D
DETAIL C
M
M
C
M
S
S
0.02 (0.008)
C A–B
D
E
SECTION B–B
DATUM
PLANE
–H–
0.10 (0.004)
H
SEATING
PLANE
–C–
G
MILLIMETERS
DIM MIN MAX
INCHES
NOTES:
MIN
MAX
0.398
0.398
0.096
0.015
0.083
0.013
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS –A–, –B– AND –D– TO BE DETERMINED AT
DATUM PLANE –H–.
U
A
B
C
D
E
9.90
9.90
2.10
0.22
2.00
0.22
10.10 0.390
10.10 0.390
2.45 0.083
0.38 0.009
2.10 0.079
0.33 0.009
F
G
H
J
K
L
0.65 BSC
0.026 BSC
R
–––
0.13
0.65
0.25
0.23 0.005
0.95 0.026
–––
0.010
0.009
0.037
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –C–.
Q
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUM PLANE –H–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT.
7.80 REF
0.307 REF
M
N
Q
R
S
5
0.13
0
0.13
12.95
0.13
0
12.95
0.35
1.6 REF
10
5
10
0.007
7
0.17 0.005
7
0.30 0.005
13.45 0.510
––– 0.005
K
T
0
W
X
0.012
0.530
–––
T
U
V
W
X
–––
0
–––
DETAIL C
13.45 0.510
0.45 0.014
0.530
0.018
0.063 REF
13–20
MOTOROLA ANALOG IC DEVICE DATA
FB SUFFIX
CASE 848D–03
Plastic Package
ISSUE C
1
52
4X
4X TIPS
0.20 (0.008) H L–M N
0.20 (0.008) T L–M N
–X–
X=L, M, N
52
1
40
C
L
39
AB
AB
G
3X VIEW Y
–L–
–M–
B1
VIEW Y
B
V
V1
BASE METAL
F
PLATING
13
14
27
26
J
U
–N–
A1
S1
D
M
S
S
0.13 (0.005)
T L–M
N
A
S
SECTION AB–AB
ROTATED 90 CLOCKWISE
4X θ2
4X θ3
C
0.10 (0.004) T
–H–
–T–
SEATING
PLANE
VIEW AA
MILLIMETERS
INCHES
MIN MAX
0.394 BSC
0.197 BSC
0.394 BSC
0.197 BSC
DIM MIN
MAX
10.00 BSC
5.00 BSC
A
A1
B
B1
C
C1
C2
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
S
0.05 (0.002)
10.00 BSC
5.00 BSC
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –L–, –M– AND –N– TO BE DETERMINED
AT DATUM PLANE –H–.
W
–––
0.05
1.30
0.20
0.45
0.22
1.70
––– 0.067
2 X R R1
0.20 0.002 0.008
1.50 0.051 0.059
0.40 0.008 0.016
0.75 0.018 0.030
0.35 0.009 0.014
θ1
E
F
0.25 (0.010)
C2
θ
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –T–.
G
0.65 BSC
0.026 BSC
GAGE PLANE
J
K
R1
S
S1
U
0.07
0.08
12.00 BSC
6.00 BSC
0.09
12.00 BSC
6.00 BSC
0.20 REF
1.00 REF
0.20 0.003 0.008
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.25 (0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE -H-.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE LEAD WIDTH TO EXCEED 0.46
(0.018). MINIMUM SPACE BETWEEN
0.50 REF
0.020 REF
0.20 0.003 0.008
K
E
0.472 BSC
0.236 BSC
0.16 0.004 0.006
C1
V
0.472 BSC
0.236 BSC
0.008 REF
0.039 REF
Z
V1
W
Z
VIEW AA
PROTRUSION AND ADJACENT LEAD OR
PROTRUSION 0.07 (0.003).
θ
0
0
12
5
7
0
7
–––
–––
θ1
θ2
θ3
0
12
5
REF
13
REF
13
13–21
MOTOROLA ANALOG IC DEVICE DATA
B SUFFIX
CASE 858–01
Plastic Package
ISSUE O
42
1
NOTES:
–A–
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH. MAXIMUM MOLD FLASH 0.25 (0.010).
42
1
22
21
–B–
INCHES
DIM MIN MAX
MILLIMETERS
MIN MAX
L
A
B
C
D
F
G
H
J
1.435 1.465 36.45 37.21
0.540 0.560 13.72 14.22
0.155 0.200
0.014 0.022
0.032 0.046
0.070 BSC
3.94
0.36
0.81
1.778 BSC
7.62 BSC
5.08
0.56
1.17
H
C
K
0.300 BSC
0.008 0.015
0.20
2.92
0.38
3.43
–T–
K
L
0.115
0.135
SEATING
PLANE
0.600 BSC
15.24 BSC
N
G
M
N
0
15
0
0.51
15
1.02
M
F
0.020 0.040
J 42 PL
D 42 PL
M
S
0.25 (0.010)
T B
M
S
0.25 (0.010)
T A
B SUFFIX
CASE 859–01
Plastic Package
(SDIP)
ISSUE O
56
1
–A–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
56
29
28
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH. MAXIMUM MOLD FLASH 0.25 (0.010)
–B–
INCHES
DIM MIN MAX
MILLIMETERS
1
MIN
MAX
52.45
14.22
5.08
A
B
C
D
E
2.035
0.540
0.155
0.014
2.065 51.69
0.560 13.72
0.200
0.022
L
3.94
0.36
0.56
H
C
0.035 BSC
0.89 BSC
F
0.032
0.046
0.81
1.17
G
H
J
K
L
0.070 BSC
0.300 BSC
1.778 BSC
7.62 BSC
–T–
K
0.008
0.115
0.015
0.135
0.20
2.92
0.38
3.43
SEATING
PLANE
0.600 BSC
15.24 BSC
N
G
M
F
M
N
0
15
0
0.51
15
1.02
0.020
0.040
E
J 56 PL
D 56 PL
M
S
0.25 (0.010)
T A
M
S
0.25 (0.010)
T B
13–22
MOTOROLA ANALOG IC DEVICE DATA
FB, FTB SUFFIX
CASE 873-01
Plastic Package
(TQFP–32)
1
ISSUE A
L
17
24
25
16
B
B
P
–B–
–A–
L
V
B
–A–, –B–, –D–
DETAIL A
DETAIL A
32
9
1
8
F
BASE
METAL
–D–
A
M
S
S
0.20 (0.008)
C
A–B
D
0.05 (0.002) A–B
N
J
S
M
S
S
0.20 (0.008)
H A–B
D
D
M
S
S
0.20 (0.008)
C
A–B
D
DETAIL C
M
SECTION B–B
VIEW ROTATED 90 CLOCKWISE
E
C
DATUM
PLANE
–H–
–C–
SEATING
PLANE
0.01 (0.004)
M
H
G
U
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
A
B
C
D
E
F
G
H
J
K
L
M
N
P
Q
R
S
6.95
6.95
1.40
7.10 0.274 0.280
7.10 0.274 0.280
1.60 0.055 0.063
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS –A–, –B– AND –D– TO BE DETERMINED AT
DATUM PLANE –H–.
T
0.273 0.373 0.010 0.015
1.30
0.273
0.80 BSC
–––
0.119
0.33
5.6 REF
6
0.119
0.40 BSC
5
0.15
8.85
0.15
5
8.85
1.00 REF
1.50 0.051 0.059
R
––– 0.010
–––
–H–
0.031 BSC
DATUM
PLANE
0.20
––– 0.008
0.197 0.005 0.008
0.57 0.013 0.022
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –C–.
0.220 REF
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUM PLANE –H–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT.
K
8
6
8
Q
0.135 0.005 0.005
0.016 BSC
10
X
10
5
DETAIL C
0.25 0.006 0.010
9.15 0.348 0.360
0.25 0.006 0.010
T
U
V
X
11
9.15 0.348 0.360
0.039 REF
5
11
13–23
MOTOROLA ANALOG IC DEVICE DATA
T SUFFIX
CASE 894-03
Plastic Package
(23-Pin SZIP)
ISSUE B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
1
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION R DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
5. MOLD FLASH OR PROTRUSIONS SHALL NOT
EXCEED 0.010 (0.250).
23
6. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.003 (0.076) TOTAL IN EXCESS OF
THE D DIMENSION AT MAXIMUM MATERIAL
CONDITION.
C
E
INCHES
DIM MIN MAX
MILLIMETERS
MIN MAX
B
L
K
Y
A
B
C
D
E
0.684
1.183
0.175
0.026
0.058
0.165
0.694 17.374 17.627
1.193 30.048 30.302
0.179
0.031
0.062
0.175
V
–N–
4.445
0.660
1.473
4.191
4.547
0.787
1.574
4.445
M
A
U
F
P
S
F
G
H
J
K
L
M
N
P
0.050 BSC
0.169 BSC
1.270 BSC
4.293 BSC
0.356 0.508
0.014
0.625
0.770
0.148
0.148
0.020
H
0.639 15.875 16.231
0.790 19.558 20.066
0.152
0.152
R
W
3.760
3.760
3.861
3.861
–T–
SEATING
PLANE
0.390 BSC
9.906 BSC
23X J
R
S
U
V
W
Y
0.416
0.157
0.105
0.868 REF
0.200 BSC
0.700
0.424 10.566 10.770
0.167
0.115
3.988
2.667
4.242
2.921
PIN 1
M
0.024 (0.610)
T
PIN 23
22.047 REF
5.080 BSC
G
0.710 17.780 18.034
23X D
M
S
S
0.010 (0.254)
T Q
N
13–24
MOTOROLA ANALOG IC DEVICE DATA
FTA SUFFIX
CASE 932–02
Plastic Package
(TQFP–48)
ISSUE D
1
48
P
4X
0.200 (0.008) AB T–U
Z
DETAIL Y
9
A
A1
48
37
AE
AE
1
36
–T–
–U–
V1
B
V
B1
–T–, –U–, –Z–
12
25
DETAIL Y
13
24
–Z–
S1
M
TOP & BOTTOM
S
R
4X
GAUGE PLANE
0.200 (0.008) AC T–U
Z
0.250 (0.010)
E
C
H
0.080 (0.003) AC
G
–AB–
–AC–
W
Q
K
AD
DETAIL AD
X
BASE METAL
MILLIMETERS
DIM MIN MAX
7.000 BSC
INCHES
MIN
MAX
NOTES:
A
A1
B
0.276 BSC
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
3.500 BSC
7.000 BSC
3.500 BSC
1.400 1.600 0.055 0.063
0.170 0.270 0.007 0.011
0.138 BSC
0.276 BSC
0.138 BSC
N
J
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
AT DATUM PLANE –AB–.
B1
C
D
E
1.350 1.450 0.053 0.057
0.170 0.230 0.007 0.009
F
D
F
G
H
J
K
M
N
P
0.500 BASIC
0.020 BASIC
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –AC–.
0.050 0.150 0.002 0.006
0.090 0.200 0.004 0.008
0.500 0.700 0.020 0.028
12 REF
0.090 0.160 0.004 0.006
0.250 BASIC 0.010 BASIC
M
S
S
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350 (0.014).
0.080 (0.003)
AC T–U
Z
12 REF
SECTION AE–AE
Q
R
1
5
1
5
0.150 0.250 0.006 0.010
S
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
0.354 BSC
0.177 BSC
0.354 BSC
0.177 BSC
0.008 REF
0.039 REF
S1
V
V1
W
X
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
13–25
MOTOROLA ANALOG IC DEVICE DATA
D2T SUFFIX
CASE 936–03
Plastic Package
ISSUE B
1
2
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
3
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS
A AND K.
TERMINAL 4
4. DIMENSIONS U AND V ESTABLISH A MINIMUM
MOUNTING SURFACE FOR TERMINAL 4.
5. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH OR GATE PROTRUSIONS. MOLD FLASH
AND GATE PROTRUSIONS NOT TO EXCEED
0.025 (0.635) MAXIMUM.
K
U
A
S
V
B
H
F
1
2
3
INCHES
DIM MIN MAX
0.403 9.804 10.236
MILLIMETERS
MIN MAX
A
B
C
D
E
F
0.386
0.356
0.170
0.026
0.045
J
D
0.368 9.042
0.180 4.318
0.036 0.660
0.055 1.143
9.347
4.572
0.914
1.397
G
M
0.010 (0.254)
T
0.051 REF
0.100 BSC
0.539 0.579 13.691 14.707
0.125 MAX
0.050 REF
1.295 REF
2.540 BSC
–T–
E
G
H
J
K
L
M
N
P
R
S
U
V
OPTIONAL
CHAMFER
3.175 MAX
1.270 REF
0.000
0.088
0.018
0.058
5
0.010 0.000
0.254
2.591
0.660
1.981
0.102 2.235
0.026 0.457
0.078 1.473
REF
5 REF
C
0.116 REF
0.200 MIN
0.250 MIN
2.946 REF
5.080 MIN
6.350 MIN
M
L
P
N
R
D2T SUFFIX
CASE 936A–02
Plastic Package
(D PAK)
1
NOTES:
2
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS
A AND K.
5
ISSUE A
TERMINAL 6
4. DIMENSIONS U AND V ESTABLISH A MINIMUM
MOUNTING SURFACE FOR TERMINAL 6.
5. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH OR GATE PROTRUSIONS. MOLD FLASH
AND GATE PROTRUSIONS NOT TO EXCEED
0.025 (0.635) MAXIMUM.
U
A
V
S
K
B
H
1
2
3
4
5
INCHES
DIM MIN MAX
0.403 9.804 10.236
MILLIMETERS
MIN MAX
A
B
C
D
E
G
H
K
L
M
N
P
R
S
0.386
0.356
0.170
0.026
0.045
0.067 BSC
0.539
0.050 REF
0.000
0.088
0.018
0.058
5
0.116 REF
0.200 MIN
0.250 MIN
0.368 9.042
0.180 4.318
0.036 0.660
0.055 1.143
1.702 BSC
0.579 13.691 14.707
1.270 REF
9.347
4.572
0.914
1.397
D
M
0.010 (0.254)
T
G
–T–
E
OPTIONAL
CHAMFER
0.010 0.000
0.254
2.591
0.660
1.981
0.102 2.235
0.026 0.457
0.078 1.473
REF
5 REF
2.946 REF
5.080 MIN
6.350 MIN
U
V
C
M
L
P
N
R
13–26
MOTOROLA ANALOG IC DEVICE DATA
20
DT, DTB SUFFIX
CASE 948E–02
Plastic Package
(TSSOP–20)
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
1
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
20X K REF
K
M
S
S
0.10 (0.004)
T U
V
S
K1
0.15 (0.006) T U
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
J J1
20
11
2X L/2
B
SECTION N–N
L
–U–
PIN 1
IDENT
0.25 (0.010)
N
10
1
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
0.260
0.177
0.047
0.006
0.030
M
A
B
C
6.40
4.30
–––
6.60 0.252
4.50 0.169
1.20
S
0.15 (0.006) T U
–––
A
D
F
0.05
0.50
0.15 0.002
0.75 0.020
N
–V–
G
H
J
J1
K
K1
L
0.65 BSC
0.026 BSC
F
0.27
0.09
0.09
0.19
0.19
0.37
0.011
0.015
0.008
0.006
0.012
0.010
0.20 0.004
0.16 0.004
0.30 0.007
0.25 0.007
DETAIL E
C
6.40 BSC
0.252 BSC
M
0
8
0
8
–W–
G
D
H
0.100 (0.004)
–T– SEATING
DETAIL E
PLANE
DTB SUFFIX
CASE 948F–01
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
Plastic Package
1
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
(TSSOP–16, TSSOP–16L)
ISSUE O
16X KREF
M
S
S
0.10 (0.004)
T U
V
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
S
0.15 (0.006) T U
K
K1
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
16
9
2X L/2
J1
SECTION N–N
B
–U–
L
J
PIN 1
IDENT.
8
1
N
MILLIMETERS
DIM MIN MAX
INCHES
0.25 (0.010)
MIN
MAX
0.200
0.177
0.047
0.006
0.030
A
B
C
4.90
4.30
–––
5.10 0.193
4.50 0.169
1.20
S
M
0.15 (0.006) T U
A
–––
D
F
0.05
0.50
0.15 0.002
0.75 0.020
–V–
N
G
H
J
J1
K
K1
L
0.65 BSC
0.026 BSC
0.18
0.09
0.09
0.19
0.19
0.28 0.007
0.20 0.004
0.16 0.004
0.30 0.007
0.25 0.007
0.011
0.008
0.006
0.012
0.010
F
DETAIL E
DETAIL E
6.40 BSC
0.252 BSC
0
C
M
0
8
8
0.10 (0.004)
–W–
H
SEATING
PLANE
–T–
D
G
13–27
MOTOROLA ANALOG IC DEVICE DATA
DTB SUFFIX
CASE 948G–01
Plastic Package
(TSSOP–14)
ISSUE O
14
1
NOTES:
14X K REF
1
DIMENSIONING AND TOLERANCING PER ANSI
M
S
S
Y14.5M, 1982.
0.10 (0.004)
T U
V
2
3
CONTROLLING DIMENSION: MILLIMETER.
DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
S
0.15 (0.006) T U
N
0.25 (0.010)
14
4
5
8
2X L/2
M
B
L
N
–U–
PIN 1
IDENT.
F
7
1
6
7
TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
DETAIL E
S
K
0.15 (0.006) T U
A
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
K1
–V–
A
B
C
4.90
4.30
–––
5.10 0.193 0.200
4.50 0.169 0.177
1.20
J J1
––– 0.047
D
F
0.05
0.50
0.15 0.002 0.006
0.75 0.020 0.030
SECTION N–N
G
H
J
J1
K
K1
L
0.65 BSC
0.026 BSC
0.60 0.020 0.024
0.20 0.004 0.008
0.16 0.004 0.006
0.30 0.007 0.012
0.25 0.007 0.010
0.50
0.09
0.09
0.19
0.19
–W–
C
6.40 BSC
0.252 BSC
0.10 (0.004)
M
0
8
0
8
SEATING
PLANE
–T–
H
G
DETAIL E
D
13–28
MOTOROLA ANALOG IC DEVICE DATA
DTB SUFFIX
CASE 948H–01
Plastic Package
ISSUE O
24
1
24X KREF
M
S
S
0.10 (0.004)
T U
V
S
0.15 (0.006) T U
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
24
13
2X L/2
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
B
–U–
L
PIN 1
IDENT.
12
1
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
S
0.15 (0.006) T U
A
–V–
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
MILLIMETERS
DIM MIN MAX
7.90 0.303
INCHES
MIN
MAX
C
A
B
7.70
4.30
–––
0.311
4.50 0.169 0.177
1.20 ––– 0.047
C
0.10 (0.004)
D
F
G
H
J
J1
K
K1
L
0.05
0.50
0.65 BSC
0.27
0.09
0.09
0.19
0.19
0.15 0.002 0.006
0.75 0.020 0.030
SEATING
PLANE
–T–
G
H
D
0.026 BSC
0.011 0.015
0.37
0.20 0.004 0.008
0.16 0.004 0.006
0.30 0.007 0.012
0.25 0.007 0.010
6.40 BSC
0.252 BSC
M
0
8
0
8
–W–
DETAIL E
N
0.25 (0.010)
K
M
K1
N
J1
F
DETAIL E
SECTION N–N
J
13–29
MOTOROLA ANALOG IC DEVICE DATA
DTB SUFFIX
CASE 948J–01
Plastic Package
(TSSOP–8)
8
1
ISSUE O
NOTES:
8x KREF
1
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
M
S
S
0.10 (0.004)
T U
V
2
3
CONTROLLING DIMENSION: MILLIMETER.
DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
S
0.15 (0.006) T U
K
K1
8
5
2X L/2
4
5
DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
J J1
B
–U–
L
PIN 1
IDENT.
SECTION N–N
4
1
N
6
7
0.25 (0.010)
S
0.15 (0.006) T U
A
M
–V–
MILLIMETERS
INCHES
DIM MIN
MAX
3.10
4.50 0.169
1.20 –––
0.15 0.002
0.75 0.020
MIN
0.114
MAX
0.122
0.177
0.047
0.006
0.030
N
A
B
C
2.90
4.30
–––
F
D
F
0.05
0.50
DETAIL E
G
H
J
J1
K
K1
L
0.65 BSC
0.026 BSC
0.50
0.09
0.09
0.19
0.19
0.60 0.020
0.20 0.004
0.16 0.004
0.30 0.007
0.25 0.007
0.024
0.008
0.006
0.012
0.010
–W–
C
0.10 (0.004)
G
SEE DETAIL E
SEATING
PLANE
–T–
D
6.40 BSC
0.252 BSC
M
0
8
0
8
H
M SUFFIX
CASE 967–01
Plastic Package
(EIAJ–20)
20
1
ISSUE O
NOTES:
1
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2
3
CONTROLLING DIMENSION: MILLIMETER.
DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
L
E
20
11
Q
1
4
5
TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
H
E
E
M
THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
L
1
10
DETAIL P
Z
D
VIEW P
MILLIMETERS
INCHES
MIN MAX
––– 0.081
e
A
DIM MIN
MAX
c
A
A
–––
0.05
0.35
0.18
2.05
0.20 0.002 0.008
0.50 0.014 0.020
0.27 0.007
1
b
c
0.011
D
E
e
12.35 12.80 0.486 0.504
A
b
1
5.10
5.45 0.201 0.215
1.27 BSC
0.050 BSC
8.20 0.291 0.323
0.85 0.020 0.033
1.50 0.043 0.059
M
0.10 (0.004)
0.13 (0.005)
H
7.40
0.50
1.10
0
0.70
–––
E
L
L
E
M
Q
10
0.90 0.028 0.035
0.81 ––– 0.032
10
0
1
Z
13–30
MOTOROLA ANALOG IC DEVICE DATA
FTB SUFFIX
CASE 976–01
Plastic Package
(TQFP–20)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
AT DATUM PLANE –AB–.
20
1
ISSUE O
4X
9
0.200 (0.008) AB T–U Z
5. DIMENSIONS S AND V TO BE DETERMINED AT
DATUM PLANE –AC–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350 (0.014).
A
A1
DETAIL Y
20
16
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
15
1
–T–
–U–
MILLIMETERS
DIM MIN MAX
4.000 BSC
INCHES
MIN MAX
0.157 BSC
0.079 BSC
0.157 BSC
0.079 BSC
V
B
A
A1
B
2.000 BSC
4.000 BSC
2.000 BSC
1.400 1.600 0.055 0.063
0.170 0.270 0.007 0.011
B1
B1
C
D
E
11
5
V1
1.350 1.450 0.053 0.057
0.170 0.230 0.007 0.009
F
G
H
J
K
M
N
P
0.650 BSC
0.026 BSC
0.050 0.150 0.002 0.006
0.090 0.200 0.004 0.008
0.500 0.700 0.020 0.028
12 REF
0.090 0.160 0.004 0.006
0.250 BSC 0.010 BSC
6
10
12 REF
–Z–
S1
Q
R
S
S1
V
V1
W
X
1
5
1
5
S
0.150 0.250 0.006 0.010
6.000 BSC
3.000 BSC
6.000 BSC
3.000 BSC
0.200 REF
1.000 REF
0.236 BSC
0.118 BSC
0.236 BSC
0.118 BSC
0.008 REF
0.039 REF
4X
0.200 (0.008) AB T–U Z
DETAIL AD
J
N
–AB–
–AC–
F
D
0.080 (0.003) AC
S
S
S
0.080 (0.003)
AC T–U
Z
M
SECTION AE–AE
TOP & BOTTOM
R
–T–, –U–, –Z–
C
H
E
AE
G
AE
W
K
X
GAUGE
PLANE
Q
0.250 (0.010)
DETAIL AD
DETAIL Y
13–31
MOTOROLA ANALOG IC DEVICE DATA
FTA SUFFIX
CASE 977–01
Plastic Package
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
24
1
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
AT DATUM PLANE –AB–.
4X
5. DIMENSIONS S AND V TO BE DETERMINED AT
DATUM PLANE –AC–.
9
0.200 (0.008) AB T–U Z
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350 (0.014).
A
A1
24
DETAIL Y
19
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
1
18
–T–
–U–
MILLIMETERS
DIM MIN MAX
4.000 BSC
INCHES
MIN MAX
0.157 BSC
0.079 BSC
0.157 BSC
0.079 BSC
A
A1
B
2.000 BSC
4.000 BSC
2.000 BSC
1.400 1.600 0.055 0.063
0.170 0.270 0.007 0.011
V
B
B1
C
D
E
B1
13
6
1.350 1.450 0.053 0.057
0.170 0.230 0.007 0.009
V1
F
G
H
J
K
M
N
P
0.500 BSC
0.020 BSC
0.050 0.150 0.002 0.006
0.090 0.200 0.004 0.008
0.500 0.700 0.020 0.028
12 REF
0.090 0.160 0.004 0.006
0.250 BSC 0.010 BSC
12 REF
7
12
Q
R
S
S1
V
V1
W
X
1
5
1
5
–Z–
S1
0.150 0.250 0.006 0.010
6.000 BSC
3.000 BSC
6.000 BSC
3.000 BSC
0.200 REF
1.000 REF
0.236 BSC
0.118 BSC
0.236 BSC
0.118 BSC
0.008 REF
0.039 REF
S
4X
0.200 (0.008) AB T–U Z
DETAIL AD
–T–, –U–, –Z–
–AB–
–AC–
AE
AE
0.080 (0.003) AC
M
TOP & BOTTOM
P
R
G
DETAIL Y
C
E
J
N
F
W
GAUGE
Q
D
PLANE
H
K
0.250 (0.010)
X
S
S
S
0.080 (0.003)
AC T–U
Z
DETAIL AD
SECTION AE–AE
13–32
MOTOROLA ANALOG IC DEVICE DATA
N SUFFIX
CASE 1212–01
Plastic Package
(SOT–23)
1
ISSUE O
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
A2
B
A
E
D
S
0.05
3. DATUM C IS A SEATING PLANE.
A1
MILLIMETERS
5
1
4
3
DIM MIN
MAX
0.10
1.30
0.50
0.25
3.00
3.10
1.80
L
A1
A2
B
C
D
E
E1
e
e1
L
0.00
1.00
0.30
0.10
2.80
2.50
1.50
0.95 BSC
1.90 BSC
0.20
0.45
2
E1
C
L1
B
5X
C
M
S
S
0.10
C B
A
e
e1
–––
0.75
L1
H SUFFIX
1
CASE 1213–01
Plastic Package
(SOT–89)
ISSUE O
NOTES:
A
D
A2
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCING
PER ASME Y14.5M, 1994.
C
B
D1
3. DATUM C IS A SEATING PLANE.
MILLIMETERS
DIM MIN
MAX
1.60
0.57
0.52
0.50
4.60
1.70
4.25
2.60
E1
E
A2
B
B1
C
D
D1
E
1.40
0.37
0.32
0.30
4.40
1.50
–––
L1
B
C
M
S
S
0.10
C B
A
E1
e
e1
L1
2.40
1.50 BSC
3.00 BSC
0.80 –––
B1 2X
e
M
S
S
0.10
C B
A
e1
13–33
MOTOROLA ANALOG IC DEVICE DATA
相关型号：
LM285Z-2.5RP
Two Terminal Voltage Reference, 1 Output, 2.5V, BIPolar, PBCY3, PLASTIC, TO-226AA, 3 PIN
MOTOROLA
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