LM3900DR2 [ONSEMI]
QUAD OP-AMP, 4MHz BAND WIDTH, PDSO14, PLASTIC, SO-14;型号: | LM3900DR2 |
厂家: | ONSEMI |
描述: | QUAD OP-AMP, 4MHz BAND WIDTH, PDSO14, PLASTIC, SO-14 光电二极管 |
文件: | 总49页 (文件大小:1007K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
QUAD
OPERATIONAL AMPLIFIERS
These internally compensated Norton operational amplifiers are designed
specifically for single positive power supply applications found in industrial
control systems and automotive electronics. Each device contains four
independent amplifiers – making it ideal for applications such as active
filters, multi–channel amplifiers, tachometers, oscillators and other similar
usage.
SEMICONDUCTOR
TECHNICAL DATA
• Single Supply Operation
• Internally Compensated
• Wide Unity Gain Bandwidth: 4.0 MHz Typical
• Low Input Bias Current: 50 nA Typical
• High Open Loop Gain: 1000 V/V Minimum
N, P SUFFIX
PLASTIC PACKAGE
14
CASE 646
1
• Large Output Voltage Swing: (V
– 1) V
CC
pp
D SUFFIX
PLASTIC PACKAGE
14
CASE 751A
1
MAXIMUM RATINGS
(SO–14)
LM2900/
LM3900
Rating
Supply Voltage
Input Current
(I or I
Symbol
MC3301
Unit
V
V
+32
+28
CC
I
5.0
50
mA
in
PIN CONNECTIONS
)
in–
in+
Output Current
I
mA
O
1
2
3
4
5
Input 1
Noninv
Input 2
Power Dissipation (T = +25°C)
P
D
625
5.0
mW
14
13
V
CC
A
1/R
mW/°C
Derate above T = +25°C
θJA
A
Input 3
Noninv
Input 4
Ambient Temperature Range
LM2900
T
A
°C
–40 to +85
0 to +70
–40 to +85
–
–
–
Inv
Input 2
+
+
+
+
12
11
10
LM3900
2
1
4
3
Inv
Input 4
Storage Temperature Range
T
–65 to +150
°C
stg
2
Out
1
4
Out
–
Inv
Input 1
6
7
9
8
3
Inv
Input 3
Gnd
(Top View)
ORDERING INFORMATION
Operating
Temperature Range
Device
LM3900D
LM3900N
Package
SO–14
T
= 0° to +70°C
A
Plastic DIP
LM2900N
MC3301P
T
A
= – 40° to +85°C
2–113
MOTOROLA ANALOG IC DEVICE DATA
MC3301, LM2900, LM3900
ELECTRICAL CHARACTERISTICS (V
= +15 Vdc, R = 5.0 kΩ. T = +25°C [each amplifier], unless otherwise noted.)
L A
CC
LM2900
LM3900
Typ
MC3301
Typ
Characteristic
Symbol
Min
Typ
Max
Min
Max
Min
Max
Unit
Open Loop Voltage Gain
A
V/mV
VOL
f = 100 Hz, R = 5.0 k
1.2
–
2.0
–
–
–
1.2
–
2.0
–
–
–
1.2
–
2.0
–
–
–
L
T
= T
to T (Notes 1, 2)
high
A
low
Input Resistance (Inverting Input)
Output Resistance
r
i
–
–
1.0
8.0
–
–
–
–
1.0
8.0
–
–
–
–
1.0
8.0
–
–
MΩ
kΩ
nA
r
o
Input Bias Current (Inverting Input)
I
–
–
50
–
200
–
–
–
50
–
200
–
–
–
50
–
300
–
IB
T
= T
to T (Note 1)
high
A
low
Slew Rate (C = 100 pF, R = 2.0 k)
SR
V/µs
L
L
Positive Output Swing
–
–
0.5
20
–
–
–
–
0.5
20
–
–
–
–
0.5
20
–
–
Negative Output Swing
Unity Gain Bandwidth
BW
–
4.0
–
–
4.0
–
–
4.0
–
MHz
V
Output Voltage Swing (Note 7)
V
= +15 V, R = 2.0 k
CC
V
L
–
V
13.5
–
14.2
0.03
–
13.5
–
14.2
0.03
–
13.5
–
14.2
0.03
–
High (I
Low (I
= 0, I += 0)
OH
out
in
in
–
V
0.2
0.2
0.2
V
= 10 µA, I += 0)
OL
out
in
in
V
= Maximum Rating, R = ∞
CC
V
L
–
High (I
= 0, I += 0)
in
V
–
29.5
–
–
29.5
–
–
25.5
–
out
in
OH
Output Current
Source
mA
mA
I
6.0
0.5
–
10
0.87
5.0
–
–
–
6.0
0.5
–
10
0.87
5.0
–
–
–
5.0
0.5
–
10
0.87
5.0
5.0
0.5
–
Source
Sink (Note 3)
I
Sink
Low Level Output Current
–
= 1.0 V
OL
I
OL
I
= 5.0 µA, V
in
Supply Current (All Four Amplifiers)
Noninverting Inputs Open
I
–
–
6.9
7.8
10
14
–
–
6.9
7.8
10
14
–
–
6.9
7.8
10
14
DO
Noninverting Inputs Grounded
I
DG
Power Supply Rejection (f = 100 Hz)
PSR
–
55
–
–
55
–
–
55
–
dB
Mirror Gain (T = T
to T
; Notes 1, 4)
A
i
µA
A
low high
0.90
0.90
1.0
1.0
1.1
1.1
0.90
0.90
1.0
1.0
1.1
1.1
0.90
0.90
1.0
1.0
1.1
1.1
I
I
+= 20 µA
in
in
+= 200 µA
∆ Mirror Gain (T =T
low
to T ; Notes1,4)
high
∆A
–
2.0
5.0
–
2.0
5.0
–
2.0
5.0
%
A
i
20 µA ≤ I + ≤ 200 µA
in
MirrorCurrent(T =T
low
toT
;Notes1,5)
–
–
10
500
–
–
–
10
500
–
–
–
10
500
–
µA
A
high
Negative Input Current (Note 6)
1.0
1.0
1.0
mA
NOTES: 1. T
low
=
=
–40°C for LM2900, MC3301
0°C for LM3900
T
= +85°C for LM2900, MC3301
= +70°C for LM3900
high
2. Open loop voltage gain is defined as voltage gain from the inverting input to the output.
3. Sink current is specified for analog operation. When the device is used as a comparator (non–analog operation) where the inverting input is
overdriven, the sink current (low level output current) capability is typically 5.0 mA.
4. This specification indicates the current gain of the current mirror which is used as the noninverting input.
5. Input V
match between the noninverting and inverting inputs occurs for a mirror current (noninverting input current) of approximately 10 µA.
BE
6. Clamp transistors are included to prevent the input voltages from swinging below ground more than approximately –0.3 V. The negative input
currents that may result from large signal overdrive with capacitive input coupling must be limited externally to values of approximately 1.0 mA. If
more than one of the input terminals are simultaneously driven negative, maximum currents are reduced. Common mode biasing can be used to
prevent negative input voltages.
7. When used as a noninverting amplifier, the minimum output voltage is the V
of the inverting input transistor.
BE
2–114
MOTOROLA ANALOG IC DEVICE DATA
MC3301, LM2900, LM3900
Figure 1. Open Loop Voltage Gain
versus Frequency
Figure 2. Open Loop Voltage Gain
versus Supply Voltage
70
60
50
40
30
20
10
0
2500
2000
1500
1000
500
0
100
1.0 k
10 k
100 k
1.0 M
10 M
0
3.0 6.0 9.0 12
15
18 21
24
27
30
FREQUENCY (Hz)
SUPPLY VOLTAGE (Vdc)
Figure 3. Output Resistance
versus Frequency
Figure 4. Supply Current versus
Supply Voltage
10
8.0
6.0
4.0
2.0
0
10 k
1.0 k
100
(Noninverting Inputs Grounded)
I
DG
I
DO
(Noninverting Inputs Open)
0.5 k 1.0 k
5.0 k 10 k
50 k 100 k
500 k 1.0 M
5.0 M
0
3.0 6.0 9.0 12
15
18
21
24
27
30
FREQUENCY
SUPPLY VOLTAGE (Vdc)
Figure 5. Analog Source Current
versus Supply Voltage
Figure 6. Analog Sink Current
versus Supply Voltage
20
1000
800
600
400
200
0
16
12
8.0
4.0
0
V
OL
= 0.4 Vdc
V
OH
= 0.4 Vdc
0
3.0 6.0 9.0
12
15 18
21
24
27 30
0
3.0 6.0 9.0
12
15
18 21
24
27
30
SUPPLY VOLTAGE (Vdc)
SUPPLY VOLTAGE (Vdc)
2–115
MOTOROLA ANALOG IC DEVICE DATA
MC3301, LM2900, LM3900
OPERATION AND APPLICATIONS
Basic Amplifier
The basic amplifier is the common emitter stage shown in
The sink of the device can be forced to exceed the specified
level by keeping the output DC voltage above 1.0 V
resulting in an increase in the distortion appearing at the
output. Closed loop stability is maintained by an on–the–chip
3–pF capacitor shown in Figure 10 on the following page. No
external compensation is required.
Figures 7 and 8. The active load I is buffered from the input
1
transistor by a PNP transistor, Q4, and from the output by an
NPN transistor, Q2. Q2 is biased Class A by the current
source I . The magnitude of I (specified I
) is a limiting
factor in capacitively coupled analog operation at the output.
2
2
sink
Figure 7. Block Diagram
V
CC
14
3
2
–
6
1
–
8
–
11
12
–
# 1
# 4
4
# 2
# 3
10
5
9
+
+
+
13
+
Gnd
7
Operational
Amplifier # 1
Operational
Amplifier # 2
Operational
Amplifier # 3
Operational
Biasing Circuitry
Amplifier # 4
V
CC
14
3
4
6
5
8
9
11
Q6
Q5
Q5
C1
Q5
Q5
Q2
Q4
Q2
Q4
Q2
Q4
C1
3.0 pF
C1
3.0 pF
C1
Q2
10k
Q7
Q4
3.0 pF
3.0 pF
10
Q8
3.5 k
Q1
Q1
Q1
Q1
Q3
Q3
Q3
Q3
Q9
CR1
CR1
CR1
CR1
CR2
560
CR5
Q11
Q10
Q10
Q10
CR3
CR4
Q10
2
1
13
12
7
Gnd
Multiple emitter (8) transistor – one emitter connected to each input.
+
also. In
A noninverting input obtained by adding a current mirror as
shown in Figure 9. Essentially all current which enters the
noninverting input, I , flows through the diode CR1. The
in
collector current is approximately equal to I
in
operation this current flows through an external feedback
resistor which generates the output voltage signal. For
inverting applications, the noninverting input is often used to
set the DC quiescent level at the output. Techniques for doing
this are discussed in the “Normal Design Procedure” section.
+
voltage drop across CR1 corresponds to this input current
magnitude and this same voltage is applied to a matched
device, Q3. Thus Q3 is biased to conduct an emitter current
+
equal to I . Since the alpha current gain of Q3
in
1, its
Figure 8. A Basic Gain Stage
Figure 9. Obtaining A Noninverting Input
V
CC
V
CC
I
1
I
1
Q2
I
in
–
Q2
Q1
Output
( –)
( +)
Q1
I +
in
( –)
Input
Output
I
2
Inputs
I
in
+
Q3
I
2
CR1
2–116
MOTOROLA ANALOG IC DEVICE DATA
MC3301, LM2900, LM3900
Biasing Circuitry
The circuitry common to all four amplifiers is shown in
Figure 11. The purpose of this circuitry is to provide biasing
voltage for the PNP and NPN current sources used in the
amplifiers.
The voltage drops across diodes CR2, CR3 and CR4 are
used as references. The voltage across resistor R1 is the
loading. The voltage across resistor R is the sum of the
2
voltage drops across CR2, CR3 and CR4, minus the V
BE
drops of transistor Q9 and diode CR5; thus the current set is
established by CR5 in all the NPN current sources (Q10,
etc.). This technique results in current source magnitudes
which are relatively independent of the supply voltage. Q11
(Figure 7) provides circuit protection from signals that are
negative with respect to ground.
sum of the drops across CR4 and CR3 minus the V
of Q8.
BE
The PNP current sources (Q5, etc.) are set to the magnitude
V
/R1 by transistor Q6. Transistor Q7 reduces base current
BE
Figure 10. A Basic Operational Amplifier
Figure 11. Biasing Circuitry
V
CC
V
CC
Q5
Q6
V
BE
10 k
CR2
R1
Q2
Q7
( – )
Inputs
Q4
Q1
Output
Q9
3.0 pF
V
BE
R2
V
/R2
R2
BE
Q8
560
Q3
( +)
CR1
CR3
CR4
Q10
CR5
R1 3.5 k
NORMAL DESIGN PROCEDURE
1. Output Q–Point Biasing
A. A number of techniques may be devised to bias the
quiescent output voltage to an acceptable level.
However, in terms of loop gain considerations it is
usually desirable to use the noninverting input to
effect the biasing, as shown in Figures 12 and 13.
The high impedance of the collector of the
noninverting ‘‘current mirror’’ transistor helps to
achieve the maximum loop gain for any particular
configuration. It is desirable that the noninverting
input current be in the 10 µA to 200 µA range.
Choosing the feedback resistor (R ) to be equal to
f
1
/ R will now bias the amplifier output DC level to
2
r
approximately V /2. This allows the maximum
CC
dynamic range of the output voltage.
C. Reference Voltage other than V
(see Figure 14)
The biasing resistor (R ) may be returned to a
CC
r
voltage(V ) other than V
By setting R = R , (still
r
CC.
f r
keeping I +between 10 µA and 200 µA) the output
in
DC level will be equal to V . The expression for
r
determining V
is:
Odc
B.
V
Reference Voltage (see Figures 12 and 13)
CC
The noninverting input is normally returned to the
voltage (which should be well filtered) through
(A )(V )(R )
R
f
r
i
r
r
f
A
i
φ
1 –
V
=
+
Odc
R
R
V
CC
+
a resistor (R ) allowing the input current, (I ) to be
r
in
where φ is the V
(approximately 0.6 Vdc @ +25°C and assumed
drop of the input transistors
BE
within the range of 10 µA to 200 µA.
equal). A is the current mirror gain.
i
2–117
MOTOROLA ANALOG IC DEVICE DATA
MC3301, LM2900, LM3900
Figure 12. Inverting Amplifier
Figure 13. Noninverting Amplifier
R
f
R
i
R
f
R
510 k
(R )(A )
f j
f
A = –
V
510 k
A =
1
V
26
+(mA)
R +
i
1
l
in
for
R
i
ωC
+15 V
V
CC
+15 V
0.1 µF
V
CC
–
BW = 250 kHz
V
1.0 µF
V
in
–
+
0.1 µF
R
V
O
l +
in
i
O
+
C
51 k
+
+
V
in
+5.0 µF
R
i
10 k
R
10 k
R
r
510 k
r
1.0 M
1.0 M
+15 V
A = 10 BW = 150 kHz
V
+15 V
2. Gain Determination
A. Inverting Amplifier
The lower corner frequency is determined by the
coupling capacitors to the input and load resistors.
The upper corner frequency will usually be
determined by the amplifier internal compensation.
The amplifier unity gain bandwidth is typically
400 kHz with 20 dB of closed loop gain or 40 kHz
with 40 dB of closed loop gain. The exception to this
occurs at low gains where the input resistor
selected is large. The pole formed by the amplifier
input capacitance, stray capacitance and the input
resistor may occur before the closed loop gain
intercepts the open loop response curve. The
inverting input capacity is typically 3.0 pF.
The amplifier is normally used in the inverting mode.
The input may be capacitively coupled to avoid
upsetting the DC bias and the output is normally
capacitively coupled to eliminate the DC voltage
across the load. Note that when the output is
capacitively coupled to the load, the value of I
sink
becomes a limitation with respect to the load driving
capabilities of the device if it is direct coupled. In this
configuration, the AC gain is determined by the ratio
of R to R , in the same manner as for a conventional
f
i
operational amplifier:
R
R
f
i
A
V
=
Figure 14. Inverting Amplifier with
Arbitrary Reference
Figure 15. Inverting Amplifier with
A = 100 and V = V
V
r
CC
510 k
R
f
V
CC
+15 V
0.1 µF
C*
R
i
–
0.1 µF
V
in
–
V
in
5.1 k
V
O
V
O
+
+
10 k
1.0 M
R
r
l
in
+
V
+15 V
r
f = 300 Hz, f = 50 kHz
L
V
H
V
r
A = 100
*Select for low frequency response.
2–118
MOTOROLA ANALOG IC DEVICE DATA
MC3301, LM2900, LM3900
B. Noninverting Amplifier
(R )(A )
f
i
A =
These devices may be used in the noninverting mode
(see Figure 13). The amplifier gain in this configuration is
subject to the current mirror gain. In addition, the
resistance of the input diode must be included in the
value of the input resistor. This resistance is
v
26
R +
i
I
in
+(mA)
The bandwidth of the noninverting configuration for a
given R value is essentially independent of the gain
chosen. For R = 510 kΩ the bandwidth will be in excess
of 200 kHz for noninverting of 1, 10, or 100. This is a
result of the loop gain remaining constant for these gains
since the the input resistor is effectively isolated from the
feedback loop.
f
26
f
approximately
Ω, where I +is input current in
in
I
+
in
milliamperes. The noninverting AC gain expression is
given by:
Figure 16. Tachometer Circuit
V
= +12 V
130
CC
Magnetic Pickup
Hysteresis Amplifier
Monostable Multivibrator
R1
Pulse Averaging
C1
0.1 µF
100 k
MSD6100
or equiv
6.1 V
100 k
100 k
R2
10 k
R1
1.0 M
Magnetic
Pickup
Power
Supply
(nonregulated)
–
–
–
4.7 k
Amp 1
+
–
Amp 4
+
Output
Amp 2
+
V
O
C1
0.01 µF
Amp 3
+
R1
1.0 M
500 k
0.01 µF
MSD6100
or equiv
R
Y
10 k
Hysteresis Voltage for Switching
Timing Interval: t 0.7 R1 C1
(V –0.6)
O
A t
i
V
pp
A R2
i
R C1
Y
V =
(V – 1.6)
CC
H
R1
Figure 17. Voltage Regulator
Figure 18. Logic ‘‘OR’’ Gate
V
CC
150 k
Z1
–
V
CC
= +15 Vdc
R2
f
75 k
75 k
75 k
+
A
B
C
–
Q1
+
f = A + B + C
R1
V
O
R2
R1
V
= V +0.6 (1 +
Z1
) – V
BE
O
Q1
Note:
For positive T zeners R2 and R1 can be
C
selected to give T output.
C
2–119
MOTOROLA ANALOG IC DEVICE DATA
MC3301, LM2900, LM3900
Figure 19. Logic ‘‘NAND’’ Gate (Large Fan–In)
Figure 20. Logic ‘‘NOR’’ Gate
V
CC
= +15 Vdc
75 k
75 k
A
–
+
A
B
C
D
E
f
75 k
B
–
75 k
f = A +B +C +D
f
C
D
150 k
+
75 k
150 k
V
= +15 Vdc
CC
f = A +B +C +D
f = A
B
C D • E
V
CC
Figure 21. R–S Flip–Flop
Figure 22. Astable Multivibrator
V
V
CC
CC
V
CC
= +15 Vdc
51 k
0.1 µF
100 k
100 k
100 k
–
–
Q
1.0 M
1.0 M
Q
–
+
+
51 k
V
O
+
22 k
22 k
Reset Set
Figure 23. Positive–Edge Differentiator
Figure 24. Negative–Edge Differentiator
0.001 µF
Output Rise Time ≈ 0.22 ms
Input Change Time Constant ≈ 1.0 ms
0.001 µF
100 k
∆V
in
100 k
–
V
O
0.002 µF
51 k
+
∆V
in
–
0.002 µF
51 k
V
O
150 k
+
V
CC
= +15 Vdc
V
≈ 7.0 Vdc
O(dc)
Output Rise Time ≈ 0.22 ms
Input Change Time Constant ≈ 1.0 ms
2–120
MOTOROLA ANALOG IC DEVICE DATA
MC3301, LM2900, LM3900
Figure 25. Amplifier and Driver for a 50 Ω Line
510 k
+15 V
2N4401
51 k
or equiv
–
V
in
0.1 µF
+
10
10
20 µF
+
1N914
or equiv
V
O
1.2 M
1N914
or equiv
2N4403
or equiv
50
A = 10
5.6 k
V
V = 6.0 V
O
(p–p)
+15 V
Figure 26. Basic Bandpass and Notch Filter
R
R1
BP
C
390 k
R1
T
BP
C × 10
C
R
6
1
390 k
8
V
in
–
–
–
5
4
3
2
R2
9
13
+
+
+
T
T
N
= Center Frequency Gain
= Passband Notch Gain
BP
14
I
r
R × 2
2(R | | QR)
R2
390 k
1
w =
0
V
CC
RC
R1 = QR
R1
T
N
R2
2(R1 | | R3)
R1
R3
R2 =
T
BP
Notch
10
11
12
R3 = T R2
N
C1
7
Figure 27. Bandpass and Notch Filter
62 k
0.005 µF
0.005 µF
100 k
300 k
6
–
8
–
–
100 k
62 k
5
4
9
3
2
Amp 1
Amp 2
Amp 3
13
1
+
+
+
BP
120 k
100 k
V
(Pin 14) = +12 V
CC
100 k
Ground – Pin 7
300 k
Center Frequency 500 Hz
Q = 5
V
CC
V
CC
V
CC
300 k
300 k
Bandpass Gain = 1
11
12
–
Bandpass Output
Notch Output
Pin 4
Pin 10
10
0.1 µF
300 k
Notch
Amp 4
300 k
+
V
in
V
CC
2–121
MOTOROLA ANALOG IC DEVICE DATA
MC3301, LM2900, LM3900
Figure 28. Voltage Regulator
1N3824
or equiv
V
Z
4.3 V
V
= V +0.6 Vdc
Z
O
V
CC
NOTES: 1. R is used to bias the zener.
2. If the zener TC is positive, and equal in
magnitude to the negative TC of the input
to the operational amplifier (≈2.0 mV/°C),
the output is zero–TC. A 7.0 V zener will
give approximately zero–TC.
1.0 Ω/16 W
–
0.1 µF
100
+
V
O
MJE800
or equiv
10
R
5.0 V at 4.0 A
Figure 29. Zero Crossing Detector
V
CC
= +15 V
1.0 M
510 k
1.0 M
510 k
Input
0 V
0 V
–
Output
Magnetic
Pickup
Output
510 k
510 k
+
2–122
MOTOROLA ANALOG IC DEVICE DATA
Tape and Reel Options
In Brief . . .
Motorola offers the convenience of Tape and Reel
packaging for our growing family of standard integrated circuit
products. Reels are available to support the requirements of
both first and second generation pick–and–place equipment.
The packaging fully conforms to the latest EIA–481A
specification. The antistatic embossed tape provides a
secure cavity, sealed with a peel–back cover tape.
Page
Tape and Reel Configurations . . . . . . . . . . . . . . . . . . . . . 12–2
Tape and Reel Information Table . . . . . . . . . . . . . . . . . . . 12–4
Analog MPQ Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12–5
12–1
MOTOROLA ANALOG IC DEVICE DATA
Tape and Reel Configurations
Mechanical Polarization
SOIC and Micro–8
DEVICES
PLCC DEVICES
Typical
Typical
PIN 1
User Direction of Feed
User Direction of Feed
2
DPAK and D PAK
DEVICES
Typical
User Direction of Feed
SOT–23 (5 Pin)
DEVICES
Typical
SOT–89 (3 Pin)
DEVICES
Typical
SOT–89 (5 Pin)
DEVICES
Typical
User Direction of Feed
User Direction of Feed
User Direction of Feed
12–2
MOTOROLA ANALOG IC DEVICE DATA
Tape and Reel Configurations (continued)
TO–92 Reel Styles
STYLE A
(Preferred)
STYLE E
Carrier Strip
Carrier Strip
Rounded
Side
Flat Side
Adhesive Tape
Adhesive Tape
Feed
Feed
Rounded side of transistor and adhesive tape visible.
Flat side of transistor and adhesive tape visible.
TO–92 Ammo Pack Styles
STYLE P
(Preferred)
STYLE M
Adhesive Tape On
Top Side
Adhesive Tape On
Top Side
Feed
Feed
Rounded Side
Flat Side
Carrier
Strip
Carrier
Strip
Flat side of transistor and
adhesive tape visible.
Rounded side of transistor and
adhesive tape visible.
Label
Label
Style P ammo pack is equivalent to Styles A and B of reel pack
dependent on feed orientation from box.
Style M ammo pack is equivalent to Style E of reel
pack dependent on feed orientation from box.
TO–92 EIA Radial Tape in Fan Fold Box or On Reel
H2A
H2A
H2B
H2B
H
W2
H4
H5
T1
L1
H1
W1
W
L
T
T2
F1
F2
D
P2
P1
P2
P
12–3
MOTOROLA ANALOG IC DEVICE DATA
Tape and Reel Information Table
(1)
Devices
per Reel
Tape Width
(mm)
Reel Size
(inch)
Device
Suffix
Package
SO–8, SOP–8
SO–14
SO–16
12
16
16
2,500
2,500
2,500
13
13
13
R2
R2
R2
SO–16L, SO–8+8L WIDE
SO–20L WIDE
SO–24L WIDE
SO–28L WIDE
SO–28L WIDE
16
24
24
24
32
1,000
1,000
1,000
1,000
1,000
13
13
13
13
13
R2
R2
R2
R2
R3
Micro–8
12
2,500
13
R2
PLCC–20
PLCC–28
PLCC–44
16
24
32
1,000
500
500
13
13
13
R2
R2
R2
PLCC–52
PLCC–68
PLCC–84
32
44
44
500
250
250
13
13
13
R2
R2
R2
(2)
TO–226AA (TO–92)
18
2,000
13
RA, RE, RP, or RM
(Ammo Pack) only
DPAK
16
24
8
2,500
800
13
13
7
RK
R4
TR
T1
2
D PAK
SOT–23 (5 Pin)
3,000
1,000
SOT–89 (3/5 Pin)
(1)
12
7
Minimum order quantity is 1 reel. Distributors/OEM customers may break lots or reels at their option, however broken reels may not be returned.
Integrated circuits in TO–226AA packages are available in Styes A and E only, with optional “Ammo Pack” (Suffix RP or RM). The RA and RP configurations
are preferred. For ordering information please contact your local Motorola Semiconductor Sales Office.
(2)
12–4
MOTOROLA ANALOG IC DEVICE DATA
Analog MPQ Table
Tape/Reel and Ammo Pack
Package Type
Package Code
MPQ
PLCC
Case 775
Case 776
Case 777
0802
0804
0801
1000/reel
500/reel
500/reel
SOIC
Case 751
Case 751A
Case 751B
Case 751G
Case 751D
Case 751E
Case 751F
0095
0096
0097
2003
2005
2008
2009
2500/reel
2500/reel
2500/reel
1000/reel
1000/reel
1000/reel
1000/reel
Micro–8
Case 846A
–
2500/reel
TO–92
Case 29
Case 29
0031
0031
2000/reel
2000/Ammo Pack
DPAK
Case 369A
–
–
–
–
–
2500/reel
800/reel
2
D PAK
Case 936
SOT–23 (5 Pin)
Case 1212
3000/reel
1000/reel
1000/reel
SOT–89 (3 Pin)
Case 1213
SOT–89 (5 Pin)
Case 1214
12–5
MOTOROLA ANALOG IC DEVICE DATA
12–6
MOTOROLA ANALOG IC DEVICE DATA
Packaging Information
In Brief . . .
The packaging availability for each device type is indicated
on the individual data sheets and the Selector Guide. All of the
outline dimensions for the packages are given in this section.
The maximum power consumption an integrated circuit
can tolerate at a given operating ambient temperature can be
found from the equation:
T
– T
A
J(max)
P
=
D(TA)
R
θJA(Typ)
where:
P
= Power Dissipation allowable at a given
operating ambient temperature. This must
be greater than the sum of the products of
the supply voltages and supply currents at
the worst case operating condition.
D(TA)
T
= Maximum operating Junction Temperature
as listed in the Maximum Ratings Section.
J(max)
See individual data sheets for T
information.
J(max)
T
A
= Maximum desired operating Ambient
Temperature
R
= Typical Thermal Resistance Junction-to-
Ambient
θJA(Typ)
13–1
MOTOROLA ANALOG IC DEVICE DATA
Case Outline Dimensions
LP, P, Z SUFFIX
CASE 29-04
NOTES:
Plastic Package
(TO-226AA/TO-92)
ISSUE AD
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
4. DIMENSION F APPLIES BETWEEN P AND L.
DIMENSION D AND J APPLY BETWEEN L AND K
MINIMUM. LEAD DIMENSION IS UNCONTROLLED
IN P AND BEYOND DIMENSION K MINIMUM.
A
B
R
P
INCHES
DIM MIN MAX
MILLIMETERS
L
MIN
4.45
4.32
3.18
0.41
0.41
1.15
2.42
0.39
MAX
5.20
5.33
4.19
0.55
0.48
1.39
2.66
0.50
–––
F
SEATING
PLANE
A
B
C
D
F
G
H
J
0.175 0.205
0.170 0.210
0.125 0.165
0.016 0.022
0.016 0.019
0.045 0.055
0.095 0.105
0.015 0.020
K
1
2
3
D
X X
G
K
L
N
P
0.500
0.250
0.080 0.105
––– 0.100
––– 12.70
–––
J
H
V
6.35
2.04
–––
2.93
3.43
–––
2.66
2.54
–––
C
SECTION X–X
R
V
0.115
0.135
–––
–––
1
–––
N
N
KC, T SUFFIX
CASE 221A-06
Plastic Package
ISSUE Y
SEATING
PLANE
–T–
C
NOTES:
T
F
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
–B–
S
2. CONTROLLING DIMENSION: INCH.
INCHES
DIM MIN MAX
0.560 0.625 14.23 15.87
MILLIMETERS
MIN MAX
4
4
Q
A
A
B
C
D
F
U
0.380 0.420
0.140 0.190
0.020 0.045
0.139 0.155
0.100 BSC
9.66 10.66
1
2
3
3.56
0.51
3.53
4.82
1.14
3.93
H
L
–Y–
G
H
J
2.54 BSC
K
––– 0.280
0.012 0.045
–––
0.31
7.11
1.14
1
2
3
K
L
N
Q
R
S
0.500 0.580 12.70 14.73
R
0.045 0.070
0.200 BSC
1.15
5.08 BSC
1.77
J
0.100 0.135
2.54
2.04
0.51
5.97
0.00
3.42
2.92
1.39
6.47
1.27
G
0.080
0.115
D 3 PL
0.020 0.055
0.235 0.255
0.000 0.050
T
U
M
M
0.25 (0.010)
B
Y
N
13–2
MOTOROLA ANALOG IC DEVICE DATA
TH SUFFIX
CASE 314A-03
Plastic Package
ISSUE D
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
–T–
Y14.5M, 1982.
B
–P–
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.
DIMENSION D INCLUDING PROTRUSION SHALL
NOT EXCEED 0.043 (1.092) MAXIMUM.
C
E
Q
OPTIONAL
CHAMFER
INCHES
DIM MIN MAX
MILLIMETERS
MIN MAX
A
U
F
A
B
C
D
E
F
0.572 0.613 14.529 15.570
0.390 0.415 9.906 10.541
0.170 0.180 4.318 4.572
0.025 0.038 0.635 0.965
0.048 0.055 1.219 1.397
0.570 0.585 14.478 14.859
L
K
1
5
G
J
K
L
Q
S
0.067 BSC
1.702 BSC
G
0.015 0.025 0.381 0.635
0.730 0.745 18.542 18.923
0.320 0.365 8.128 9.271
0.140 0.153 3.556 3.886
0.210 0.260 5.334 6.604
0.468 0.505 11.888 12.827
5X J
S
5X D
M
M
0.014 (0.356)
T P
U
NOTES:
T, TV SUFFIX
CASE 314B-05
Plastic Package
ISSUE J
C
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
B
–P–
OPTIONAL
CHAMFER
Q
F
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.
DIMENSION D INCLUDING PROTRUSION SHALL
NOT EXCEED 0.043 (1.092) MAXIMUM.
E
A
INCHES
DIM MIN MAX
A
B
C
D
E
MILLIMETERS
MIN MAX
0.613 14.529 15.570
0.415 9.906 10.541
U
L
S
V
0.572
0.390
0.170
0.025
0.048
0.850
0.067 BSC
0.166 BSC
0.015
0.900
0.320
0.320 BSC
0.140
–––
0.468
–––
0.090
W
K
0.180 4.318
0.038 0.635
0.055 1.219
4.572
0.965
1.397
F
0.935 21.590 23.749
1
G
H
J
K
L
N
Q
S
1.702 BSC
4.216 BSC
5
0.025 0.381
1.100 22.860 27.940
0.635
5X J
0.365 8.128
9.271
G
M
0.24 (0.610)
T
H
N
8.128 BSC
5X D
0.153 3.556
0.620
0.505 11.888 12.827
0.735 ––– 18.669
0.110 2.286 2.794
3.886
––– 15.748
M
M
0.10 (0.254)
T P
U
V
W
SEATING
PLANE
–T–
B
–Q–
SEATING
PLANE
T SUFFIX
–T–
CASE 314C–01
Plastic Package
ISSUE A
C
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
A
K
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.
DIMENSION D INCLUDING PROTRUSION SHALL
NOT EXCEED 10.92 (0.043) MAXIMUM.
1
2 3 4 5
INCHES
DIM MIN MAX
0.625 15.59
MILLIMETERS
L
MIN
MAX
15.88
10.67
4.83
1
A
B
C
D
E
G
J
0.610
0.380
0.160
0.020
0.035
5
0.420
0.190
0.040
0.055
9.65
4.06
0.51
0.89
1.02
1.40
0.067 BSC
1.702 BSC
0.015
0.500
0.355
0.139
0.025
––– 12.70
0.370
0.147
0.38
0.64
–––
9.40
3.73
K
L
Q
9.02
3.53
G
D 5 PL
M
M
0.356 (0.014)
T Q
J
13–3
MOTOROLA ANALOG IC DEVICE DATA
T, T1 SUFFIX
CASE 314D-03
Plastic Package
ISSUE D
SEATING
PLANE
–T–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
C
–Q–
B
Y14.5M, 1982.
E
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.
DIMENSION D INCLUDING PROTRUSION SHALL
NOT EXCEED 10.92 (0.043) MAXIMUM.
U
A
S
INCHES
DIM MIN MAX
MILLIMETERS
MIN MAX
L
A
B
C
D
E
G
H
J
0.572
0.390
0.170
0.025
0.048
0.613 14.529 15.570
0.415 9.906 10.541
0.180 4.318
0.038 0.635
0.055 1.219
1
2
3
4 5
K
4.572
0.965
1.397
0.067 BSC
1.702 BSC
0.087
0.015
1.020
0.320
0.140
0.105
0.543
0.112 2.210
0.025 0.381
2.845
0.635
1
2
3
4
K
L
Q
U
S
1.065 25.908 27.051
5
0.365 8.128
0.153 3.556
0.117 2.667
9.271
3.886
2.972
J
G
H
0.582 13.792 14.783
D 5 PL
M
M
0.356 (0.014)
T Q
DT-1 SUFFIX
CASE 369-07
Plastic Package
(DPAK)
C
B
R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
V
ISSUE K
E
INCHES
DIM MIN MAX
MILLIMETERS
4
MIN
5.97
6.35
2.19
0.69
0.84
0.94
MAX
6.35
6.73
2.38
0.88
1.01
1.19
4
A
B
C
D
E
F
G
H
J
0.235 0.250
0.250 0.265
0.086 0.094
0.027 0.035
0.033 0.040
0.037 0.047
0.090 BSC
0.034 0.040
0.018 0.023
0.350 0.380
0.175 0.215
0.050 0.090
0.030 0.050
A
1
2
3
S
–T–
SEATING
PLANE
2.29 BSC
1
2
3
K
0.87
0.46
8.89
4.45
1.27
0.77
1.01
0.58
9.65
5.46
2.28
1.27
K
R
S
J
F
V
H
D 3 PL
G
M
0.13 (0.005)
T
DT SUFFIX
CASE 369A-13
Plastic Package
(DPAK)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
SEATING
PLANE
–T–
C
B
ISSUE Y
INCHES
DIM MIN MAX
MILLIMETERS
E
V
R
MIN
5.97
6.35
2.19
0.69
0.84
0.94
MAX
6.35
6.73
2.38
0.88
1.01
1.19
A
B
C
D
E
F
G
H
J
K
L
R
S
U
V
Z
0.235 0.250
0.250 0.265
0.086 0.094
0.027 0.035
0.033 0.040
0.037 0.047
0.180 BSC
4
4
Z
1
A
K
S
1
2
3
3
4.58 BSC
U
0.034 0.040
0.018 0.023
0.87
0.46
2.60
1.01
0.58
2.89
0.102
0.114
0.090 BSC
0.175 0.215
0.020 0.050
2.29 BSC
F
J
4.45
0.51
0.51
0.77
3.51
5.46
1.27
–––
1.27
–––
L
H
0.020
0.030 0.050
0.138 –––
–––
D 2 PL
M
G
0.13 (0.005)
T
13–4
MOTOROLA ANALOG IC DEVICE DATA
DP1, N, P, P1 SUFFIX
CASE 626-05
Plastic Package
ISSUE K
8
5
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
–B–
1
4
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
MILLIMETERS
DIM MIN MAX
9.40 10.16 0.370 0.400
INCHES
MIN MAX
F
A
B
C
D
F
–A–
NOTE 2
6.10
3.94
0.38
1.02
6.60 0.240 0.260
4.45 0.155 0.175
0.51 0.015 0.020
1.78 0.040 0.070
L
G
H
J
K
L
2.54 BSC
0.100 BSC
1.27 0.030 0.050
0.30 0.008 0.012
8
C
0.76
0.20
2.92
1
J
3.43
0.115
0.135
–T–
SEATING
PLANE
7.62 BSC
0.300 BSC
N
M
N
–––
10
–––
10
0.76
1.01 0.030 0.040
M
D
K
G
H
M
M
M
0.13 (0.005)
T A
B
N, P, N-14, P2 SUFFIX
CASE 646-06
Plastic Package
ISSUE L
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. ROUNDED CORNERS OPTIONAL.
14
1
8
B
7
INCHES
DIM MIN MAX
0.770 18.16
MILLIMETERS
A
F
MIN
MAX
19.56
6.60
4.69
0.53
1.78
A
B
C
D
F
0.715
0.240
0.145
0.015
0.040
0.260
0.185
0.021
0.070
6.10
3.69
0.38
1.02
L
14
1
C
G
H
J
K
L
0.100 BSC
2.54 BSC
0.052
0.008
0.115
0.095
0.015
0.135
1.32
0.20
2.92
2.41
0.38
3.43
J
N
0.300 BSC
7.62 BSC
SEATING
PLANE
K
M
N
0
10
0.039
0
0.39
10
1.01
0.015
H
G
D
M
DP2, N, P, PC SUFFIX
CASE 648-08
Plastic Package
ISSUE R
NOTES:
–A–
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
16
1
9
8
B
S
INCHES
DIM MIN MAX
0.770 18.80
MILLIMETERS
MIN
MAX
19.55
6.85
4.44
0.53
1.77
F
A
B
C
D
F
0.740
0.250
0.145
0.015
0.040
C
L
0.270
0.175
0.021
0.70
6.35
3.69
0.39
1.02
16
1
SEATING
PLANE
–T–
G
H
J
K
L
M
S
0.100 BSC
0.050 BSC
2.54 BSC
1.27 BSC
K
M
0.008
0.015
0.130
0.305
10
0.21
0.38
3.30
7.74
10
H
J
0.110
0.295
0
2.80
7.50
0
G
D 16 PL
0.020
0.040
0.51
1.01
M
M
0.25 (0.010)
T A
13–5
MOTOROLA ANALOG IC DEVICE DATA
B, P, P2, V SUFFIX
CASE 648C-03
Plastic Package
(DIP–16)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. INTERNAL LEAD CONNECTION BETWEEN 4 AND
5, 12 AND 13.
–A–
ISSUE C
16
1
9
8
–B–
INCHES
DIM MIN MAX
0.840 18.80
MILLIMETERS
L
MIN
MAX
21.34
6.60
4.69
0.53
A
B
C
D
E
F
0.740
0.240
0.145
0.015
0.050 BSC
0.040
0.100 BSC
0.008
0.115
0.300 BSC
0
0.260
0.185
0.021
6.10
3.69
0.38
NOTE 5
16
1
1.27 BSC
C
0.70
1.02
1.78
G
J
K
L
M
N
2.54 BSC
0.015
0.135
0.20
2.92
0.38
3.43
–T–
SEATING
PLANE
M
N
7.62 BSC
K
10
0.040
0
10
E
0.015
0.39
1.01
J 16 PL
F
G
D 16 PL
M
S
0.13 (0.005)
T B
M
S
0.13 (0.005)
T A
–A–
P SUFFIX
NOTES:
CASE 648E–01
Plastic Package
(DIP–16)
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION A AND B DOES NOT INCLUDE MOLD
PROTRUSION.
5. MOLD FLASH OR PROTRUSIONS SHALL NOT
EXCEED 0.25 (0.010).
R
16
1
9
8
ISSUE O
–B–
6. ROUNDED CORNER OPTIONAL.
M
P
L
INCHES
DIM MIN MAX
0.760 18.80
MILLIMETERS
F
MIN
MAX
19.30
6.60
4.44
0.53
1.77
A
B
C
D
F
0.740
0.245
0.145
0.015
0.050
0.260
0.175
0.021
0.070
6.23
3.69
0.39
1.27
16
J
1
C
G
H
J
K
L
M
P
0.100 BSC
0.050 BSC
2.54 BSC
1.27 BSC
0.21
3.05
7.50
0
5.08 BSC
7.62 BSC
0.39 0.88
–T–
SEATING
PLANE
0.008
0.015
0.140
0.305
10
0.38
3.55
7.74
10
S
0.120
0.295
0
K
H
G
0.200 BSC
0.300 BSC
0.015 0.035
R
S
D 13 PL
M
S
S
0.25 (0.010)
T B
A
P SUFFIX
CASE 649-03
Plastic Package
ISSUE D
P
A
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
13
24
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
L
Q
B
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
1.265
0.540
0.205
0.020
0.060
1
A
B
C
D
F
31.50
13.21
4.70
0.38
1.02
32.13 1.240
13.72 0.520
5.21 0.185
0.51 0.015
1.52 0.040
12
M
J
H
F
C
G
H
J
K
L
M
N
P
2.54 BSC
0.100 BSC
1.65
0.20
2.92
14.99
–––
2.16 0.065
0.30 0.008
3.43
15.49 0.590
10 –––
0.085
0.012
0.135
0.610
10
24
N
0.115
1
K
0.51
0.13
0.51
1.02 0.020
0.38 0.005
0.76 0.020
0.040
0.015
0.030
D
G
SEATING
PLANE
Q
13–6
MOTOROLA ANALOG IC DEVICE DATA
A, B, N, P SUFFIX
CASE 707-02
Plastic Package
ISSUE C
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D),
SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM
MATERIAL CONDITION, IN RELATION TO
SEATING PLANE AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
18
10
9
B
1
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
A
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
0.915
0.260
0.180
0.022
0.070
L
A
B
C
D
F
22.22
6.10
3.56
0.36
1.27
23.24 0.875
6.60 0.240
4.57 0.140
0.56 0.014
1.78 0.050
C
18
1
G
H
J
K
L
2.54 BSC
0.100 BSC
K
N
1.02
0.20
2.92
1.52 0.040
0.30 0.008
3.43
0.060
0.012
0.135
J
M
F
D
SEATING
PLANE
0.115
H
G
7.62 BSC
0.300 BSC
M
N
0
0.51
15
0
15
0.040
1.02 0.020
P SUFFIX
CASE 710-02
Plastic Package
ISSUE B
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D), SHALL
BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL
CONDITION, IN RELATION TO SEATING PLANE
AND EACH OTHER.
28
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
1
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
28
1
15
A
B
C
D
F
36.45 37.21 1.435 1.465
13.72 14.22 0.540 0.560
B
3.94
0.36
1.02
5.08 0.155 0.200
0.56 0.014 0.022
1.52 0.040 0.060
14
G
H
J
K
L
2.54 BSC
0.100 BSC
2.16 0.065 0.085
0.38 0.008 0.015
1.65
0.20
2.92
L
C
A
3.43
0.115
0.135
15.24 BSC
0.600 BSC
N
M
N
0
0.51
15
0
15
1.02 0.020 0.040
J
M
G
H
F
K
SEATING
PLANE
D
P SUFFIX
CASE 711-03
Plastic Package
ISSUE C
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D), SHALL
BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL
CONDITION, IN RELATION TO SEATING PLANE
AND EACH OTHER.
40
1
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
40
21
20
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
B
A
B
C
D
F
51.69 52.45 2.035 2.065
13.72 14.22 0.540 0.560
3.94
0.36
1.02
5.08 0.155 0.200
0.56 0.014 0.022
1.52 0.040 0.060
1
G
H
J
K
L
2.54 BSC
0.100 BSC
2.16 0.065 0.085
0.38 0.008 0.015
L
A
1.65
0.20
2.92
C
3.43
0.115
0.135
N
15.24 BSC
0.600 BSC
M
N
0
0.51
15
0
15
J
1.02 0.020 0.040
K
SEATING
PLANE
M
H
G
F
D
13–7
MOTOROLA ANALOG IC DEVICE DATA
F, P, P-3 SUFFIX
CASE 724-03
Plastic Package
(NDIP–24)
NOTES:
1. CHAMFERED CONTOUR OPTIONAL.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
24
ISSUE D
1
4. CONTROLLING DIMENSION: INCH.
–A–
INCHES
DIM MIN MAX
1.265 31.25
MILLIMETERS
MIN
MAX
32.13
6.85
4.44
0.51
24
1
13
12
A
B
C
D
E
F
1.230
0.250
0.145
0.015
0.050 BSC
0.040
–B–
0.270
0.175
0.020
6.35
3.69
0.38
1.27 BSC
1.02
L
C
0.060
1.52
G
J
K
L
M
N
0.100 BSC
2.54 BSC
0.007
0.110
0.012
0.140
0.18
2.80
0.30
3.55
NOTE 1
–T–
SEATING
PLANE
K
0.300 BSC
7.62 BSC
N
M
0
15
0
15
E
0.020
0.040
0.51
1.01
G
J 24 PL
F
M
M
0.25 (0.010)
T B
D 24 PL
M
M
0.25 (0.010)
T A
H, P, DP SUFFIX
CASE 738-03
Plastic Package
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
–A–
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
20
1
11
B
INCHES
DIM MIN MAX
1.010 1.070 25.66
MILLIMETERS
10
MIN
MAX
27.17
6.60
A
B
C
D
E
F
0.240 0.260
0.150 0.180
0.015 0.022
0.050 BSC
6.10
3.81
0.39
L
4.57
0.55
C
1.27 BSC
0.050 0.070
0.100 BSC
1.27
1.77
20
G
2.54 BSC
1
J
0.008 0.015
0.21
2.80
7.62 BSC
0
0.51
0.38
3.55
K
L
M
N
0.110
0.140
–T–
SEATING
PLANE
K
M
0.300 BSC
0
15
15
1.01
0.020 0.040
N
E
J 20 PL
G
F
M
M
0.25 (0.010)
T B
D 20 PL
M
M
0.25 (0.010)
T A
D, D1, D2 SUFFIX
CASE 751-05
Plastic Package
(SO-8, SOP-8)
ISSUE R
NOTES:
D
A
E
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS ARE IN MILLIMETERS.
3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
C
8
1
5
4
M
M
0.25
B
H
MILLIMETERS
8
h X 45
B
C
DIM MIN
MAX
1.75
0.25
0.49
0.25
5.00
4.00
e
1
A
A1
B
C
D
E
1.35
0.10
0.35
0.18
4.80
3.80
A
SEATING
PLANE
e
H
h
1.27 BSC
0.10
L
5.80
0.25
0.40
0
6.20
0.50
1.25
7
A1
B
L
M
S
S
0.25
C B
A
13–8
MOTOROLA ANALOG IC DEVICE DATA
D SUFFIX
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
CASE 751A-03
Plastic Package
(SO-14)
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
–A–
ISSUE F
14
1
8
7
–B–
P 7 PL
M
M
0.25 (0.010)
B
MILLIMETERS
DIM MIN MAX
INCHES
14
1
MIN
MAX
0.344
0.157
0.068
0.019
0.049
F
A
B
C
D
F
8.55
3.80
1.35
0.35
0.40
8.75 0.337
4.00 0.150
1.75 0.054
0.49 0.014
1.25 0.016
R X 45
G
C
G
J
K
M
P
1.27 BSC
0.050 BSC
–T–
SEATING
PLANE
J
M
0.19
0.10
0
0.25 0.008
0.25 0.004
0.009
0.009
7
K
D 14 PL
7
0
M
S
S
0.25 (0.010)
T B
A
5.80
0.25
6.20 0.228
0.50 0.010
0.244
0.019
R
–A–
D SUFFIX
NOTES:
CASE 751B-05
Plastic Package
(SO-16)
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
16
9
ISSUE J
–B–
P 8 PL
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
M
S
0.25 (0.010)
B
1
8
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
G
MILLIMETERS
DIM MIN MAX
9.80 10.00 0.386 0.393
INCHES
MIN MAX
16
1
A
B
C
D
F
F
K
3.80
1.35
0.35
0.40
4.00 0.150 0.157
1.75 0.054 0.068
0.49 0.014 0.019
1.25 0.016 0.049
R X 45
C
G
J
K
M
P
1.27 BSC
0.050 BSC
0.25 0.008 0.009
0.25 0.004 0.009
–T–
SEATING
PLANE
0.19
0.10
0
J
M
D
16 PL
7
0
7
5.80
0.25
6.20 0.229 0.244
0.50 0.010 0.019
M
S
S
0.25 (0.010)
T B
A
R
DW, FP SUFFIX
–A–
NOTES:
CASE 751D-04
Plastic Package
(SO-20L, SO–20)
ISSUE E
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
20
11
4. MAXIMUM MOLD PROTRUSION 0.150
(0.006) PER SIDE.
10X P
–B–
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
M
M
0.010 (0.25)
B
1
10
J
F
20X D
MILLIMETERS
DIM MIN MAX
12.65 12.95 0.499 0.510
INCHES
MIN MAX
M
S
S
0.010 (0.25) T A
B
A
B
C
D
F
20
7.40
2.35
0.35
0.50
7.60 0.292 0.299
2.65 0.093 0.104
0.49 0.014 0.019
0.90 0.020 0.035
1
R X 45
G
J
K
M
P
1.27 BSC
0.050 BSC
0.32 0.010 0.012
0.25 0.004 0.009
C
0.25
0.10
0
SEATING
PLANE
7
0
7
–T–
10.05 10.55 0.395 0.415
18X G
R
0.25
0.75 0.010 0.029
K
M
13–9
MOTOROLA ANALOG IC DEVICE DATA
DW SUFFIX
CASE 751E-04
Plastic Package
(SO-24L,
SOP (16+4+4)L)
ISSUE E
–A–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
24
13
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
–B– 12X P
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
M
M
0.010 (0.25)
B
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
1
12
24X D
24
J
MILLIMETERS
DIM MIN MAX
INCHES
M
S
S
0.010 (0.25)
T A
B
1
MIN
MAX
0.612
0.299
0.104
0.019
0.035
A
B
C
D
F
15.25
7.40
2.35
0.35
0.41
15.54 0.601
7.60 0.292
2.65 0.093
0.49 0.014
0.90 0.016
F
R X 45
G
J
K
M
P
1.27 BSC
0.050 BSC
0.23
0.13
0
0.32 0.009
0.29 0.005
0.013
0.011
8
C
K
–T–
SEATING
8
0
M
10.05
0.25
10.55 0.395
0.75 0.010
0.415
0.029
PLANE
R
22X G
DW SUFFIX
CASE 751F-04
NOTES:
Plastic Package
(SO-28L, SOIC–28)
ISSUE E
28
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE
1
–A–
15
28
14X P
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
M
M
0.010 (0.25)
B
–B–
1
MILLIMETERS
DIM MIN MAX
INCHES
14
MIN
MAX
0.711
0.299
0.104
0.019
0.035
M
A
B
C
D
F
17.80
7.40
2.35
0.35
0.41
18.05 0.701
7.60 0.292
2.65 0.093
0.49 0.014
0.90 0.016
28X D
R
X 45
M
S
S
0.010 (0.25)
T A
B
G
J
K
M
P
1.27 BSC
0.050 BSC
0.23
0.13
0
0.32 0.009
0.29 0.005
0.013
0.011
8
C
8
0
–T–
SEATING
PLANE
10.01
0.25
10.55 0.395
0.75 0.010
0.415
0.029
26X G
F
R
K
J
DW SUFFIX
CASE 751G-02
Plastic Package
(SO-16L, SOP–16L,
SOP-8+8L)
ISSUE A
–A–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
16
9
–B–
8X P
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
M
M
0.010 (0.25)
B
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
1
8
J
16X D
16
MILLIMETERS
DIM MIN MAX
10.15 10.45 0.400
INCHES
M
S
S
0.010 (0.25)
T A
B
MIN
MAX
1
A
B
C
D
F
0.411
F
7.40
2.35
0.35
0.50
7.60 0.292 0.299
2.65 0.093 0.104
0.49 0.014 0.019
0.90 0.020 0.035
R X 45
G
J
K
M
P
1.27 BSC
0.050 BSC
0.32 0.010 0.012
0.25 0.004 0.009
0.25
0.10
0
C
7
0
7
–T–
M
10.05 10.55 0.395 0.415
0.25 0.75 0.010 0.029
SEATING
14X G
K
PLANE
R
13–10
MOTOROLA ANALOG IC DEVICE DATA
D SUFFIX
16
CASE 751K–01
Plastic Package
(SO–16)
NOTES:
1
1
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2
3
CONTROLLING DIMENSION: MILLIMETER.
DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
–A–
ISSUE O
4
5
MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
16
9
DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
M
–B–
P
MILLIMETERS
DIM MIN MAX
INCHES
F
MIN
MAX
0.393
0.157
0.068
0.019
0.049
A
B
C
D
F
9.80
3.80
1.35
0.35
0.40
10.00 0.368
4.00 0.150
1.75 0.054
0.49 0.014
1.25 0.016
1
8
G
R X 45
G
J
K
M
P
1.27 BSC
0.050 BSC
0.19
0.10
0
0.25 0.008
0.25 0.004
7
0.009
0.009
7
C
SEATING
PLANE
–T–
0
5.80
0.25
6.20 0.229
0.50 0.010
0.244
0.019
14 X D
J
K
R
M
S
S
0.25 (0.010)
T A
B
–A–
DW SUFFIX
CASE 751N–01
Plastic Package
(SOP–16L)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
T
16
9
ISSUE O
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
M
M
–B–
P
0.010 (0.25)
B
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
1
8
16
J
F
MILLIMETERS
DIM MIN MAX
10.15 10.45 0.400
INCHES
13X D
1
MIN
MAX
A
B
C
D
F
0.411
M
S
S
0.010 (0.25)
T A
B
7.40
2.35
0.35
0.50
7.60 0.292 0.299
2.65 0.093 0.104
0.49 0.014 0.019
0.90 0.020 0.035
G
J
K
M
P
R
S
T
1.27 BSC
0.050 BSC
0.32 0.010 0.012
0.25 0.004 0.009
R X 45
0.25
0.10
0
7
0
7
C
10.05 10.55 0.395 0.415
0.25 0.75 0.010 0.029
2.54 BSC
3.81 BSC
–T–
SEATING
PLANE
M
S
0.100 BSC
0.150 BSC
K
9X G
13–11
MOTOROLA ANALOG IC DEVICE DATA
CASE 762-01
Plastic Medium Power Package
(SIP-9)
ISSUE C
9
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
Q
1
M
M
0.25 (0.010)
T A
–A–
MILLIMETERS
DIM MIN MAX
22.40 23.00 0.873 0.897
INCHES
MIN MAX
–C–
U
V
A
B
C
D
E
M
X
6.40
3.45
0.40
9.35
1.40
6.60 0.252 0.260
3.65 0.135 1.143
0.55 0.015 0.021
9.60 0.368 0.377
1.60 0.055 0.062
S
W
E
F
Y
G
H
J
2.54 BSC
0.100 BSC
1.51
1.71 0.059 0.067
0.360 0.400 0.014 0.015
R
B
N
K
M
N
Q
R
S
U
V
W
X
Y
3.95
30 BSC
2.50
3.15
13.60 13.90 0.535 0.547
1.65 1.95 0.064 0.076
22.00 22.20 0.866 0.874
0.55
2.89 BSC
4.20 0.155 0.165
30 BSC
2.70 0.099 0.106
3.45 0.124 0.135
9
1
SEATING
PLANE
–T–
K
M
M
0.25 (0.010)
T C
J
H
G
F
0.75 0.021 0.029
0.113 BSC
0.75 0.025 0.029
D 9 PL
0.65
2.70
M
M
0.25 (0.010)
T A
2.80 0.106
0.110
FN SUFFIX
CASE 775-02
Plastic Package
(PLCC-20)
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
1
ISSUE C
M
S
S
0.007 (0.180) T L–M
N
B
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
M
S
S
N
0.007 (0.180) T L–M
Y BRK
–N–
U
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
D
–L–
Z
–M–
W
D
20
1
S
S
S
0.010 (0.250) T L–M
N
G1
X
V
VIEW D–D
INCHES
DIM MIN MAX
MILLIMETERS
MIN
9.78
9.78
4.20
2.29
0.33
MAX
10.03
10.03
4.57
2.79
0.48
M
S
S
S
A
R
0.007 (0.180) T L–M
N
A
B
C
E
0.385
0.385
0.165
0.090
0.013
0.395
0.395
0.180
0.110
0.019
Z
M
S
0.007 (0.180) T L–M
N
F
M
S
S
H
0.007 (0.180) T L–M
N
G
H
J
0.050 BSC
1.27 BSC
C
0.026
0.020
0.025
0.350
0.350
0.042
0.042
0.042
–––
0.032
–––
–––
0.356
0.356
0.048
0.048
0.056
0.020
10
0.66
0.51
0.64
8.89
8.89
1.07
1.07
1.07
–––
2
0.81
–––
–––
9.04
9.04
1.21
1.21
1.42
0.50
10
E
0.004 (0.100)
K1
K
K
R
U
V
W
X
Y
Z
G
–T– SEATING
J
PLANE
VIEW S
M
S
S
0.007 (0.180) T L–M
N
G1
F
S
S
S
0.010 (0.250) T L–M
N
VIEW S
2
G1 0.310
K1 0.040
0.330
–––
7.88
1.02
8.38
–––
13–12
MOTOROLA ANALOG IC DEVICE DATA
FN SUFFIX
CASE 776-02
Plastic Package
(PLCC–28)
ISSUE D
1
M
S
S
0.007 (0.180)
T L–M
N
B
Z
Y BRK
D
–N–
M
S
S
0.007 (0.180)
T L–M
N
U
–M–
–L–
W
D
S
S
S
0.010 (0.250)
T L–M
N
X
G1
V
28
1
VIEW D–D
M
S
S
S
A
0.007 (0.180)
0.007 (0.180)
T L–M
N
M
S
S
H
0.007 (0.180)
T L–M
N
Z
M
S
T L–M
N
R
K1
C
E
0.004 (0.100)
SEATING
PLANE
G
K
–T–
VIEW S
J
M
S
S
0.007 (0.180)
T L–M
N
F
G1
S
S
S
0.010 (0.250)
T L–M
N
VIEW S
NOTES:
INCHES
DIM MIN MAX
MILLIMETERS
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE
MOLD FLASH. ALLOWABLE MOLD FLASH IS
0.010 (0.250) PER SIDE.
MIN
MAX
12.57
12.57
4.57
2.79
0.48
A
B
C
E
0.485
0.485
0.165
0.090
0.013
0.495 12.32
0.495 12.32
0.180
0.110
0.019
4.20
2.29
0.33
F
G
H
J
0.050 BSC
1.27 BSC
4. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
0.026
0.020
0.025
0.450
0.450
0.042
0.042
0.042
–––
0.032
–––
–––
0.456
0.456
0.048
0.048
0.056
0.020
10
0.66
0.51
0.64
11.43
11.43
1.07
1.07
1.07
–––
0.81
–––
–––
11.58
11.58
1.21
1.21
1.42
0.50
10
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
K
R
U
V
W
X
Y
Z
2
2
G1 0.410
K1 0.040
0.430 10.42
––– 1.02
10.92
–––
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
13–13
MOTOROLA ANALOG IC DEVICE DATA
FN SUFFIX
CASE 777-02
Plastic Package
(PLCC)
M
S
S
0.007(0.180)
T
L–M
N
B
M
S
S
0.007(0.180)
T
L–M
N
U
1
ISSUE C
D
–N–
Z
Y BRK
–M–
–L–
X
G1
S
S
S
0.010 (0.25)
T
L–M
N
VIEW D–D
H
V
W
D
M
S
S
0.007(0.180)
T
L–M
N
44
1
M
M
S
S
S
S
A
R
0.007(0.180)
0.007(0.180)
T
T
L–M
L–M
N
N
K1
Z
K
J
C
F
E
M
S
S
0.007(0.180)
VIEW S
T
L–M
N
0.004 (0.10)
G
SEATING
PLANE
–T–
INCHES
DIM MIN MAX
MILLIMETERS
MIN MAX
G1
VIEW S
A
B
C
E
0.685 0.695 17.40 17.65
0.685 0.695 17.40 17.65
S
S
S
0.010 (0.25)
T
L–M
N
0.165 0.180
0.090 0.110
0.013 0.019
0.050 BSC
4.20
2.29
0.33
4.57
2.79
0.48
NOTES:
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE
TOP AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
F
1. DATUMS –L–, –M–, AND –N– ARE DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010
(0.25) PER SIDE.
G
H
J
1.27 BSC
0.026 0.032
0.66
0.51
0.64
0.81
–––
–––
0.020
0.025
–––
–––
K
R
U
V
W
X
Y
Z
0.650 0.656 16.51 16.66
0.650 0.656 16.51 16.66
0.042 0.048
0.042 0.048
0.042 0.056
––– 0.020
1.07
1.07
1.07
–––
2
1.21
1.21
1.42
0.50
10
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
2
10
G1 0.610 0.630 15.50 16.00
K1 0.040 ––– 1.02 –––
NOTES:
M SUFFIX
CASE 803C
PRELIMINARY
Plastic Package
6
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
–A–
7
8
CONTROLLING DIMENSION: MILLIMETER.
DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
–F–
9
MAXIMUM MOLD PROTRUSION 0.15 (0.008) PER
SIDE.
20
1
11
10
10 DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.006) TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
K
–B–
1
J
20
G
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
0.504
0.215
0.081
0.020
0.032
S 10 PL
A
B
C
D
E
F
12.35
5.10
1.95
0.35
–––
12.80 0.486
5.45 0.201
2.05 0.077
0.50 0.014
M
M
0.13 (0.005)
B
N
0.81
12.40*
–––
0.488*
G
H
J
K
L
M
N
S
1.15
0.59
0.18
1.10
0.05
0
1.39 0.045
0.81 0.023
0.27 0.007
1.50 0.043
0.20 0.001
0.055
0.032
0.011
0.059
0.008
10
C
0.10 (0.004)
E
L
M
10
0
D 20 PL
–T–
SEATING
PLANE
0.50
7.40
0.85 0.020
8.20 0.291
0.033
0.323
M
S
S
0.13 (0.005)
T B
A
*APPROXIMATE
13–14
MOTOROLA ANALOG IC DEVICE DATA
TV SUFFIX
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
CASE 821C-04
Plastic Package
(15-Pin ZIP)
ISSUE D
1
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION R DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
15
5. MOLD FLASH OR PROTRUSIONS SHALL NOT
EXCEED 0.010 (0.250).
6. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL
BE 0.003 (0.076) TOTAL IN EXCESS OF THE D
DIMENSION. AT MAXIMUM MATERIAL CONDITION.
SEATING
PLANE
–T–
C
E
M
B
–Q–
INCHES
DIM MIN MAX
MILLIMETERS
MIN MAX
–P–
U
A
B
C
D
E
0.684 0.694 17.374 17.627
0.784 0.792 19.914 20.116
0.173 0.181 4.395 4.597
0.024 0.031 0.610 0.787
0.058 0.062 1.473 1.574
Y
K
V
A
R
G
H
J
K
L
0.050 BSC
0.169 BSC
0.018 0.024 0.458 0.609
0.700 0.710 17.780 18.034
1.270 BSC
4.293 BSC
S
0.200 BSC
5.080 BSC
PIN 15
M
R
S
U
V
Y
0.148 0.151 3.760 3.835
0.416 0.426 10.567 10.820
0.157 0.167 3.988 4.242
PIN 1
H
L
G
0.105
0.868 REF
0.625 0.639 15.875 16.231
0.115 2.667 2.921
15X D
15X J
22.047 REF
S
M
M
Q
0.010 (0.254)
T P
0.024 (0.610)
T
T SUFFIX
CASE 821D-03
Plastic Package
ISSUE C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION R DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
1
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
15
5. MOLD FLASH OR PROTRUSIONS SHALL NOT
EXCEED 0.010 (0.250).
6. DELETED
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL
BE 0.003 (0.076) TOTAL IN EXCESS OF THE D
DIMENSION. AT MAXIMUM MATERIAL CONDITION.
SEATING
PLANE
Q
–L–
–T–
C
B
E
INCHES
DIM MIN MAX
MILLIMETERS
MIN MAX
–P–
U
A
B
C
D
E
F
0.681 0.694 17.298 17.627
0.784 0.792 19.914 20.116
0.173 0.181 4.395 4.597
0.024 0.031 0.610 0.787
0.058 0.062 1.473 1.574
0.016 0.023 0.407 0.584
A
R
K
G
H
J
K
Q
R
U
Y
0.050 BSC
0.110 BSC
0.018 0.024 0.458 0.609
1.078 1.086 27.382 27.584
0.148 0.151 3.760 3.835
0.416 0.426 10.567 10.820
1.270 BSC
2.794 BSC
Y
PIN 1
PIN 15
H
G
0.110 BSC
0.503 REF
2.794 BSC
12.776 REF
7X F
15X D
15X J
S
M
L
0.010 (0.254)
T P
M
0.024 (0.610)
T
13–15
MOTOROLA ANALOG IC DEVICE DATA
FTB SUFFIX
CASE 824D–01
Plastic Package
(TQFP–44)
1
ISSUE O
L
–T–, –U–, –Z–
–Z–
44
34
33
1
AE
G
AE
DETAIL AA
–T–
L
–U–
F
PLATING
BASE METAL
DETAIL AA
J
11
23
N
12
22
D
M
S
S
0.20 (0.008)
AC T–U
Z
A
SECTION AE–AE
M
S
S
0.20 (0.008)
AB T–U
Z
Z
0.05 (0.002) T–U
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
M
S
S
0.20 (0.008)
AC T–U
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U– AND –Z– TO BE DETERMINED AT
DATUM PLANE –AB–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –AC–.
M
DETAIL AD
–AB–
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUM PLANE –AB–.
E
C
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL NOT
CAUSE THE D DIMENSION TO EXCEED 0.530
(0.021).
0.10 (0.004)
–AC–
H
Y
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
A
B
C
D
E
9.950 10.050 0.392 0.396
9.950 10.050 0.392 0.396
1.400 1.600 0.055 0.063
0.300 0.450 0.012 0.018
1.350 1.450 0.053 0.057
0.300 0.400 0.012 0.016
R
F
G
H
J
K
L
M
N
Q
R
S
V
W
X
Y
0.800 BSC
0.031 BSC
K
0.050 0.150 0.002 0.006
0.090 0.200 0.004 0.008
0.450 0.550 0.018 0.022
8.000 BSC
12 REF
Q
W
X
0.315 BSC
12 REF
VIEW AD
0.090 0.160 0.004 0.006
1
5
1
5
0.100 0.200 0.004 0.008
11.900 12.100 0.469 0.476
11.900 12.100 0.469 0.476
0.200 REF
1.000 REF
12 REF
0.008 REF
0.039 REF
12 REF
13–16
MOTOROLA ANALOG IC DEVICE DATA
FB SUFFIX
CASE 824E–02
Plastic Package
(QFP)
44
1
ISSUE A
S
–L–, –M–, –N–
M
S
S
S
S
0.20 (0.008)
0.20 (0.008)
T L–M
H L–M
N
N
A
M
0.05 (0.002) L–M
PIN 1
IDENT
J1
J1
G
44
34
33
1
VIEW Y
3 PL
F
PLATING
BASE METAL
–L–
–M–
J
B1
D
M
VIEW Y
S
S
0.20 (0.008)
T L–M
N
SECTION J1–J1
11
23
G 40X
44 PL
12
22
–N–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –L–, –M– AND –N– TO BE DETERMINED
AT DATUM PLANE –H–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –T–.
M
VIEW P
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –H–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.530 (0.021).
E
DATUM
C
–H–
PLANE
0.01 (0.004)
–T–
W
Y
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
0.398
0.398
0.087
A
B
C
D
E
9.90
9.90
2.00
0.30
2.00
0.30
10.10 0.390
10.10 0.390
2.21 0.079
0.45 0.0118 0.0177
2.10 0.079
0.40 0.012
1
0.083
0.016
F
R R1
R R2
G
J
K
M
S
V
W
Y
A1
0.80 BSC
0.031 BSC
0.13
0.65
5
0.23 0.005
0.95 0.026
10
0.009
0.037
10
DATUM
PLANE
–H–
5
12.95
12.95
0.000
5
13.45 0.510
13.45 0.510
0.210 0.000
0.530
0.530
0.008
10
K
10
5
2
A1
0.450 REF
0.170 0.005
1.600 REF
0.130
0.300
0.300 0.005
0.018 REF
0.007
0.063 REF
B1 0.130
C1
R1
R2 0.130
1
2
C1
VIEW P
0.005
0.012
0.012
10
5
0
10
7
5
0
7
13–17
MOTOROLA ANALOG IC DEVICE DATA
FB SUFFIX
CASE 840F–01
Plastic Package
ISSUE O
64
1
L
–Z–
64
49
1
48
–T–, –U–, –Z–
P
AE
AE
L
B
V
G
–U–
–T–
DETAIL AA
DETAIL AA
16
33
32
17
BASE
METAL
A
N
M
S
S
S
S
0.20 (0.008)
AB T–U
Z
Z
0.050 (0.002) T–U
S
D
F
M
0.20 (0.008)
AC T–U
M
J
C
E
SECTION AE–AE
–AB–
0.10 (0.004)
–AC–
Y
H
DETAIL AD
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
0.396
0.396
0.063
0.011
0.057
0.009
NOTES:
A
B
C
D
E
F
9.950 10.050 0.392
9.950 10.050 0.392
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
1.400
0.170
1.350
0.170
1.600 0.055
0.270 0.007
1.450 0.053
0.230 0.007
Q
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U– AND –Z– TO BE DETERMINED
AT DATUM PLANE –AC–.
G
H
J
K
L
M
N
P
0.500 BSC
0.020 BSC
R
0.050
0.090
0.450
0.150 0.002
0.200 0.004
0.550 0.018
0.006
0.008
0.022
K
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –AC–.
7.500 BSC
12° REF
0.090 0.160 0.004
0.250 BSC 0.010 BSC
0.295 BSC
12° REF
0.006
W
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.25 (0.010 ) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350 (0.014).
X
°
°
5
Q
R
S
V
W
X
Y
1°
0.100
5
1°
0.200 0.004
DETAIL AD
0.008
0.476
0.476
11.900 12.100 0.469
11.900 12.100 0.469
0.200 REF
1.000 REF
12 REF
0.008 REF
0.039 REF
°
12 REF
°
13–18
MOTOROLA ANALOG IC DEVICE DATA
DM SUFFIX
CASE 846A–02
Plastic Package
(Micro–8)
8
1
ISSUE C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
–A–
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
–B–
K
MILLIMETERS
INCHES
PIN 1 ID
G
DIM MIN
MAX
3.10
3.10
1.10
MIN
0.114
0.114
MAX
0.122
0.122
D 8 PL
A
B
C
D
G
H
J
2.90
2.90
–––
M
S
S
0.08 (0.003)
T B
A
––– 0.043
0.25
0.40 0.010 0.016
0.65 BSC
0.026 BSC
0.15 0.002 0.006
0.23 0.005 0.009
5.05 0.187 0.199
0.70 0.016 0.028
0.05
0.13
4.75
0.40
SEATING
PLANE
–T–
K
L
0.038 (0.0015)
C
L
J
H
13–19
MOTOROLA ANALOG IC DEVICE DATA
FB SUFFIX
CASE 848B-04
Plastic Package
(TQFP–52)
1
52
ISSUE C
L
39
27
26
40
B
B
DETAIL A
–B–
–A–
L
–A–, –B–, –D–
DETAIL A
14
52
1
13
–D–
F
B
M
S
S
S
0.20 (0.008)
H A–B
D
D
0.05 (0.002) A–B
J
N
V
M
S
0.20 (0.008)
C A–B
BASE METAL
D
DETAIL C
M
M
C
M
S
S
0.02 (0.008)
C A–B
D
E
SECTION B–B
DATUM
PLANE
–H–
0.10 (0.004)
H
SEATING
PLANE
–C–
G
MILLIMETERS
DIM MIN MAX
INCHES
NOTES:
MIN
MAX
0.398
0.398
0.096
0.015
0.083
0.013
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS –A–, –B– AND –D– TO BE DETERMINED AT
DATUM PLANE –H–.
U
A
B
C
D
E
9.90
9.90
2.10
0.22
2.00
0.22
10.10 0.390
10.10 0.390
2.45 0.083
0.38 0.009
2.10 0.079
0.33 0.009
F
G
H
J
K
L
0.65 BSC
0.026 BSC
R
–––
0.13
0.65
0.25
0.23 0.005
0.95 0.026
–––
0.010
0.009
0.037
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –C–.
Q
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUM PLANE –H–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT.
7.80 REF
0.307 REF
M
N
Q
R
S
5
0.13
0
0.13
12.95
0.13
0
12.95
0.35
1.6 REF
10
5
10
0.007
7
0.17 0.005
7
0.30 0.005
13.45 0.510
––– 0.005
K
T
0
W
X
0.012
0.530
–––
T
U
V
W
X
–––
0
–––
DETAIL C
13.45 0.510
0.45 0.014
0.530
0.018
0.063 REF
13–20
MOTOROLA ANALOG IC DEVICE DATA
FB SUFFIX
CASE 848D–03
Plastic Package
ISSUE C
1
52
4X
4X TIPS
0.20 (0.008) H L–M N
0.20 (0.008) T L–M N
–X–
X=L, M, N
52
1
40
C
L
39
AB
AB
G
3X VIEW Y
–L–
–M–
B1
VIEW Y
B
V
V1
BASE METAL
F
PLATING
13
14
27
26
J
U
–N–
A1
S1
D
M
S
S
0.13 (0.005)
T L–M
N
A
S
SECTION AB–AB
ROTATED 90 CLOCKWISE
4X θ2
4X θ3
C
0.10 (0.004) T
–H–
–T–
SEATING
PLANE
VIEW AA
MILLIMETERS
INCHES
MIN MAX
0.394 BSC
0.197 BSC
0.394 BSC
0.197 BSC
DIM MIN
MAX
10.00 BSC
5.00 BSC
A
A1
B
B1
C
C1
C2
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
S
0.05 (0.002)
10.00 BSC
5.00 BSC
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –L–, –M– AND –N– TO BE DETERMINED
AT DATUM PLANE –H–.
W
–––
0.05
1.30
0.20
0.45
0.22
1.70
––– 0.067
2 X R R1
0.20 0.002 0.008
1.50 0.051 0.059
0.40 0.008 0.016
0.75 0.018 0.030
0.35 0.009 0.014
θ1
E
F
0.25 (0.010)
C2
θ
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –T–.
G
0.65 BSC
0.026 BSC
GAGE PLANE
J
K
R1
S
S1
U
0.07
0.08
12.00 BSC
6.00 BSC
0.09
12.00 BSC
6.00 BSC
0.20 REF
1.00 REF
0.20 0.003 0.008
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.25 (0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE -H-.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE LEAD WIDTH TO EXCEED 0.46
(0.018). MINIMUM SPACE BETWEEN
0.50 REF
0.020 REF
0.20 0.003 0.008
K
E
0.472 BSC
0.236 BSC
0.16 0.004 0.006
C1
V
0.472 BSC
0.236 BSC
0.008 REF
0.039 REF
Z
V1
W
Z
VIEW AA
PROTRUSION AND ADJACENT LEAD OR
PROTRUSION 0.07 (0.003).
θ
0
0
12
5
7
0
7
–––
–––
θ1
θ2
θ3
0
12
5
REF
13
REF
13
13–21
MOTOROLA ANALOG IC DEVICE DATA
B SUFFIX
CASE 858–01
Plastic Package
ISSUE O
42
1
NOTES:
–A–
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH. MAXIMUM MOLD FLASH 0.25 (0.010).
42
1
22
21
–B–
INCHES
DIM MIN MAX
MILLIMETERS
MIN MAX
L
A
B
C
D
F
G
H
J
1.435 1.465 36.45 37.21
0.540 0.560 13.72 14.22
0.155 0.200
0.014 0.022
0.032 0.046
0.070 BSC
3.94
0.36
0.81
1.778 BSC
7.62 BSC
5.08
0.56
1.17
H
C
K
0.300 BSC
0.008 0.015
0.20
2.92
0.38
3.43
–T–
K
L
0.115
0.135
SEATING
PLANE
0.600 BSC
15.24 BSC
N
G
M
N
0
15
0
0.51
15
1.02
M
F
0.020 0.040
J 42 PL
D 42 PL
M
S
0.25 (0.010)
T B
M
S
0.25 (0.010)
T A
B SUFFIX
CASE 859–01
Plastic Package
(SDIP)
ISSUE O
56
1
–A–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
56
29
28
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH. MAXIMUM MOLD FLASH 0.25 (0.010)
–B–
INCHES
DIM MIN MAX
MILLIMETERS
1
MIN
MAX
52.45
14.22
5.08
A
B
C
D
E
2.035
0.540
0.155
0.014
2.065 51.69
0.560 13.72
0.200
0.022
L
3.94
0.36
0.56
H
C
0.035 BSC
0.89 BSC
F
0.032
0.046
0.81
1.17
G
H
J
K
L
0.070 BSC
0.300 BSC
1.778 BSC
7.62 BSC
–T–
K
0.008
0.115
0.015
0.135
0.20
2.92
0.38
3.43
SEATING
PLANE
0.600 BSC
15.24 BSC
N
G
M
F
M
N
0
15
0
0.51
15
1.02
0.020
0.040
E
J 56 PL
D 56 PL
M
S
0.25 (0.010)
T A
M
S
0.25 (0.010)
T B
13–22
MOTOROLA ANALOG IC DEVICE DATA
FB, FTB SUFFIX
CASE 873-01
Plastic Package
(TQFP–32)
1
ISSUE A
L
17
24
25
16
B
B
P
–B–
–A–
L
V
B
–A–, –B–, –D–
DETAIL A
DETAIL A
32
9
1
8
F
BASE
METAL
–D–
A
M
S
S
0.20 (0.008)
C
A–B
D
0.05 (0.002) A–B
N
J
S
M
S
S
0.20 (0.008)
H A–B
D
D
M
S
S
0.20 (0.008)
C
A–B
D
DETAIL C
M
SECTION B–B
VIEW ROTATED 90 CLOCKWISE
E
C
DATUM
PLANE
–H–
–C–
SEATING
PLANE
0.01 (0.004)
M
H
G
U
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
A
B
C
D
E
F
G
H
J
K
L
M
N
P
Q
R
S
6.95
6.95
1.40
7.10 0.274 0.280
7.10 0.274 0.280
1.60 0.055 0.063
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS –A–, –B– AND –D– TO BE DETERMINED AT
DATUM PLANE –H–.
T
0.273 0.373 0.010 0.015
1.30
0.273
0.80 BSC
–––
0.119
0.33
5.6 REF
6
0.119
0.40 BSC
5
0.15
8.85
0.15
5
8.85
1.00 REF
1.50 0.051 0.059
R
––– 0.010
–––
–H–
0.031 BSC
DATUM
PLANE
0.20
––– 0.008
0.197 0.005 0.008
0.57 0.013 0.022
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –C–.
0.220 REF
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUM PLANE –H–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT.
K
8
6
8
Q
0.135 0.005 0.005
0.016 BSC
10
X
10
5
DETAIL C
0.25 0.006 0.010
9.15 0.348 0.360
0.25 0.006 0.010
T
U
V
X
11
9.15 0.348 0.360
0.039 REF
5
11
13–23
MOTOROLA ANALOG IC DEVICE DATA
T SUFFIX
CASE 894-03
Plastic Package
(23-Pin SZIP)
ISSUE B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
1
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION R DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
5. MOLD FLASH OR PROTRUSIONS SHALL NOT
EXCEED 0.010 (0.250).
23
6. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.003 (0.076) TOTAL IN EXCESS OF
THE D DIMENSION AT MAXIMUM MATERIAL
CONDITION.
C
E
INCHES
DIM MIN MAX
MILLIMETERS
MIN MAX
B
L
K
Y
A
B
C
D
E
0.684
1.183
0.175
0.026
0.058
0.165
0.694 17.374 17.627
1.193 30.048 30.302
0.179
0.031
0.062
0.175
V
–N–
4.445
0.660
1.473
4.191
4.547
0.787
1.574
4.445
M
A
U
F
P
S
F
G
H
J
K
L
M
N
P
0.050 BSC
0.169 BSC
1.270 BSC
4.293 BSC
0.356 0.508
0.014
0.625
0.770
0.148
0.148
0.020
H
0.639 15.875 16.231
0.790 19.558 20.066
0.152
0.152
R
W
3.760
3.760
3.861
3.861
–T–
SEATING
PLANE
0.390 BSC
9.906 BSC
23X J
R
S
U
V
W
Y
0.416
0.157
0.105
0.868 REF
0.200 BSC
0.700
0.424 10.566 10.770
0.167
0.115
3.988
2.667
4.242
2.921
PIN 1
M
0.024 (0.610)
T
PIN 23
22.047 REF
5.080 BSC
G
0.710 17.780 18.034
23X D
M
S
S
0.010 (0.254)
T Q
N
13–24
MOTOROLA ANALOG IC DEVICE DATA
FTA SUFFIX
CASE 932–02
Plastic Package
(TQFP–48)
ISSUE D
1
48
P
4X
0.200 (0.008) AB T–U
Z
DETAIL Y
9
A
A1
48
37
AE
AE
1
36
–T–
–U–
V1
B
V
B1
–T–, –U–, –Z–
12
25
DETAIL Y
13
24
–Z–
S1
M
TOP & BOTTOM
S
R
4X
GAUGE PLANE
0.200 (0.008) AC T–U
Z
0.250 (0.010)
E
C
H
0.080 (0.003) AC
G
–AB–
–AC–
W
Q
K
AD
DETAIL AD
X
BASE METAL
MILLIMETERS
DIM MIN MAX
7.000 BSC
INCHES
MIN
MAX
NOTES:
A
A1
B
0.276 BSC
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
3.500 BSC
7.000 BSC
3.500 BSC
1.400 1.600 0.055 0.063
0.170 0.270 0.007 0.011
0.138 BSC
0.276 BSC
0.138 BSC
N
J
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
AT DATUM PLANE –AB–.
B1
C
D
E
1.350 1.450 0.053 0.057
0.170 0.230 0.007 0.009
F
D
F
G
H
J
K
M
N
P
0.500 BASIC
0.020 BASIC
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –AC–.
0.050 0.150 0.002 0.006
0.090 0.200 0.004 0.008
0.500 0.700 0.020 0.028
12 REF
0.090 0.160 0.004 0.006
0.250 BASIC 0.010 BASIC
M
S
S
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350 (0.014).
0.080 (0.003)
AC T–U
Z
12 REF
SECTION AE–AE
Q
R
1
5
1
5
0.150 0.250 0.006 0.010
S
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
0.354 BSC
0.177 BSC
0.354 BSC
0.177 BSC
0.008 REF
0.039 REF
S1
V
V1
W
X
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
13–25
MOTOROLA ANALOG IC DEVICE DATA
D2T SUFFIX
CASE 936–03
Plastic Package
ISSUE B
1
2
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
3
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS
A AND K.
TERMINAL 4
4. DIMENSIONS U AND V ESTABLISH A MINIMUM
MOUNTING SURFACE FOR TERMINAL 4.
5. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH OR GATE PROTRUSIONS. MOLD FLASH
AND GATE PROTRUSIONS NOT TO EXCEED
0.025 (0.635) MAXIMUM.
K
U
A
S
V
B
H
F
1
2
3
INCHES
DIM MIN MAX
0.403 9.804 10.236
MILLIMETERS
MIN MAX
A
B
C
D
E
F
0.386
0.356
0.170
0.026
0.045
J
D
0.368 9.042
0.180 4.318
0.036 0.660
0.055 1.143
9.347
4.572
0.914
1.397
G
M
0.010 (0.254)
T
0.051 REF
0.100 BSC
0.539 0.579 13.691 14.707
0.125 MAX
0.050 REF
1.295 REF
2.540 BSC
–T–
E
G
H
J
K
L
M
N
P
R
S
U
V
OPTIONAL
CHAMFER
3.175 MAX
1.270 REF
0.000
0.088
0.018
0.058
5
0.010 0.000
0.254
2.591
0.660
1.981
0.102 2.235
0.026 0.457
0.078 1.473
REF
5 REF
C
0.116 REF
0.200 MIN
0.250 MIN
2.946 REF
5.080 MIN
6.350 MIN
M
L
P
N
R
D2T SUFFIX
CASE 936A–02
Plastic Package
(D PAK)
1
NOTES:
2
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS
A AND K.
5
ISSUE A
TERMINAL 6
4. DIMENSIONS U AND V ESTABLISH A MINIMUM
MOUNTING SURFACE FOR TERMINAL 6.
5. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH OR GATE PROTRUSIONS. MOLD FLASH
AND GATE PROTRUSIONS NOT TO EXCEED
0.025 (0.635) MAXIMUM.
U
A
V
S
K
B
H
1
2
3
4
5
INCHES
DIM MIN MAX
0.403 9.804 10.236
MILLIMETERS
MIN MAX
A
B
C
D
E
G
H
K
L
M
N
P
R
S
0.386
0.356
0.170
0.026
0.045
0.067 BSC
0.539
0.050 REF
0.000
0.088
0.018
0.058
5
0.116 REF
0.200 MIN
0.250 MIN
0.368 9.042
0.180 4.318
0.036 0.660
0.055 1.143
1.702 BSC
0.579 13.691 14.707
1.270 REF
9.347
4.572
0.914
1.397
D
M
0.010 (0.254)
T
G
–T–
E
OPTIONAL
CHAMFER
0.010 0.000
0.254
2.591
0.660
1.981
0.102 2.235
0.026 0.457
0.078 1.473
REF
5 REF
2.946 REF
5.080 MIN
6.350 MIN
U
V
C
M
L
P
N
R
13–26
MOTOROLA ANALOG IC DEVICE DATA
20
DT, DTB SUFFIX
CASE 948E–02
Plastic Package
(TSSOP–20)
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
1
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
20X K REF
K
M
S
S
0.10 (0.004)
T U
V
S
K1
0.15 (0.006) T U
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
J J1
20
11
2X L/2
B
SECTION N–N
L
–U–
PIN 1
IDENT
0.25 (0.010)
N
10
1
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
0.260
0.177
0.047
0.006
0.030
M
A
B
C
6.40
4.30
–––
6.60 0.252
4.50 0.169
1.20
S
0.15 (0.006) T U
–––
A
D
F
0.05
0.50
0.15 0.002
0.75 0.020
N
–V–
G
H
J
J1
K
K1
L
0.65 BSC
0.026 BSC
F
0.27
0.09
0.09
0.19
0.19
0.37
0.011
0.015
0.008
0.006
0.012
0.010
0.20 0.004
0.16 0.004
0.30 0.007
0.25 0.007
DETAIL E
C
6.40 BSC
0.252 BSC
M
0
8
0
8
–W–
G
D
H
0.100 (0.004)
–T– SEATING
DETAIL E
PLANE
DTB SUFFIX
CASE 948F–01
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
Plastic Package
1
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
(TSSOP–16, TSSOP–16L)
ISSUE O
16X KREF
M
S
S
0.10 (0.004)
T U
V
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
S
0.15 (0.006) T U
K
K1
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
16
9
2X L/2
J1
SECTION N–N
B
–U–
L
J
PIN 1
IDENT.
8
1
N
MILLIMETERS
DIM MIN MAX
INCHES
0.25 (0.010)
MIN
MAX
0.200
0.177
0.047
0.006
0.030
A
B
C
4.90
4.30
–––
5.10 0.193
4.50 0.169
1.20
S
M
0.15 (0.006) T U
A
–––
D
F
0.05
0.50
0.15 0.002
0.75 0.020
–V–
N
G
H
J
J1
K
K1
L
0.65 BSC
0.026 BSC
0.18
0.09
0.09
0.19
0.19
0.28 0.007
0.20 0.004
0.16 0.004
0.30 0.007
0.25 0.007
0.011
0.008
0.006
0.012
0.010
F
DETAIL E
DETAIL E
6.40 BSC
0.252 BSC
0
C
M
0
8
8
0.10 (0.004)
–W–
H
SEATING
PLANE
–T–
D
G
13–27
MOTOROLA ANALOG IC DEVICE DATA
DTB SUFFIX
CASE 948G–01
Plastic Package
(TSSOP–14)
ISSUE O
14
1
NOTES:
14X K REF
1
DIMENSIONING AND TOLERANCING PER ANSI
M
S
S
Y14.5M, 1982.
0.10 (0.004)
T U
V
2
3
CONTROLLING DIMENSION: MILLIMETER.
DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
S
0.15 (0.006) T U
N
0.25 (0.010)
14
4
5
8
2X L/2
M
B
L
N
–U–
PIN 1
IDENT.
F
7
1
6
7
TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
DETAIL E
S
K
0.15 (0.006) T U
A
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
K1
–V–
A
B
C
4.90
4.30
–––
5.10 0.193 0.200
4.50 0.169 0.177
1.20
J J1
––– 0.047
D
F
0.05
0.50
0.15 0.002 0.006
0.75 0.020 0.030
SECTION N–N
G
H
J
J1
K
K1
L
0.65 BSC
0.026 BSC
0.60 0.020 0.024
0.20 0.004 0.008
0.16 0.004 0.006
0.30 0.007 0.012
0.25 0.007 0.010
0.50
0.09
0.09
0.19
0.19
–W–
C
6.40 BSC
0.252 BSC
0.10 (0.004)
M
0
8
0
8
SEATING
PLANE
–T–
H
G
DETAIL E
D
13–28
MOTOROLA ANALOG IC DEVICE DATA
DTB SUFFIX
CASE 948H–01
Plastic Package
ISSUE O
24
1
24X KREF
M
S
S
0.10 (0.004)
T U
V
S
0.15 (0.006) T U
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
24
13
2X L/2
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
B
–U–
L
PIN 1
IDENT.
12
1
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
S
0.15 (0.006) T U
A
–V–
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
MILLIMETERS
DIM MIN MAX
7.90 0.303
INCHES
MIN
MAX
C
A
B
7.70
4.30
–––
0.311
4.50 0.169 0.177
1.20 ––– 0.047
C
0.10 (0.004)
D
F
G
H
J
J1
K
K1
L
0.05
0.50
0.65 BSC
0.27
0.09
0.09
0.19
0.19
0.15 0.002 0.006
0.75 0.020 0.030
SEATING
PLANE
–T–
G
H
D
0.026 BSC
0.011 0.015
0.37
0.20 0.004 0.008
0.16 0.004 0.006
0.30 0.007 0.012
0.25 0.007 0.010
6.40 BSC
0.252 BSC
M
0
8
0
8
–W–
DETAIL E
N
0.25 (0.010)
K
M
K1
N
J1
F
DETAIL E
SECTION N–N
J
13–29
MOTOROLA ANALOG IC DEVICE DATA
DTB SUFFIX
CASE 948J–01
Plastic Package
(TSSOP–8)
8
1
ISSUE O
NOTES:
8x KREF
1
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
M
S
S
0.10 (0.004)
T U
V
2
3
CONTROLLING DIMENSION: MILLIMETER.
DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
S
0.15 (0.006) T U
K
K1
8
5
2X L/2
4
5
DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
J J1
B
–U–
L
PIN 1
IDENT.
SECTION N–N
4
1
N
6
7
0.25 (0.010)
S
0.15 (0.006) T U
A
M
–V–
MILLIMETERS
INCHES
DIM MIN
MAX
3.10
4.50 0.169
1.20 –––
0.15 0.002
0.75 0.020
MIN
0.114
MAX
0.122
0.177
0.047
0.006
0.030
N
A
B
C
2.90
4.30
–––
F
D
F
0.05
0.50
DETAIL E
G
H
J
J1
K
K1
L
0.65 BSC
0.026 BSC
0.50
0.09
0.09
0.19
0.19
0.60 0.020
0.20 0.004
0.16 0.004
0.30 0.007
0.25 0.007
0.024
0.008
0.006
0.012
0.010
–W–
C
0.10 (0.004)
G
SEE DETAIL E
SEATING
PLANE
–T–
D
6.40 BSC
0.252 BSC
M
0
8
0
8
H
M SUFFIX
CASE 967–01
Plastic Package
(EIAJ–20)
20
1
ISSUE O
NOTES:
1
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2
3
CONTROLLING DIMENSION: MILLIMETER.
DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
L
E
20
11
Q
1
4
5
TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
H
E
E
M
THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
L
1
10
DETAIL P
Z
D
VIEW P
MILLIMETERS
INCHES
MIN MAX
––– 0.081
e
A
DIM MIN
MAX
c
A
A
–––
0.05
0.35
0.18
2.05
0.20 0.002 0.008
0.50 0.014 0.020
0.27 0.007
1
b
c
0.011
D
E
e
12.35 12.80 0.486 0.504
A
b
1
5.10
5.45 0.201 0.215
1.27 BSC
0.050 BSC
8.20 0.291 0.323
0.85 0.020 0.033
1.50 0.043 0.059
M
0.10 (0.004)
0.13 (0.005)
H
7.40
0.50
1.10
0
0.70
–––
E
L
L
E
M
Q
10
0.90 0.028 0.035
0.81 ––– 0.032
10
0
1
Z
13–30
MOTOROLA ANALOG IC DEVICE DATA
FTB SUFFIX
CASE 976–01
Plastic Package
(TQFP–20)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
AT DATUM PLANE –AB–.
20
1
ISSUE O
4X
9
0.200 (0.008) AB T–U Z
5. DIMENSIONS S AND V TO BE DETERMINED AT
DATUM PLANE –AC–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350 (0.014).
A
A1
DETAIL Y
20
16
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
15
1
–T–
–U–
MILLIMETERS
DIM MIN MAX
4.000 BSC
INCHES
MIN MAX
0.157 BSC
0.079 BSC
0.157 BSC
0.079 BSC
V
B
A
A1
B
2.000 BSC
4.000 BSC
2.000 BSC
1.400 1.600 0.055 0.063
0.170 0.270 0.007 0.011
B1
B1
C
D
E
11
5
V1
1.350 1.450 0.053 0.057
0.170 0.230 0.007 0.009
F
G
H
J
K
M
N
P
0.650 BSC
0.026 BSC
0.050 0.150 0.002 0.006
0.090 0.200 0.004 0.008
0.500 0.700 0.020 0.028
12 REF
0.090 0.160 0.004 0.006
0.250 BSC 0.010 BSC
6
10
12 REF
–Z–
S1
Q
R
S
S1
V
V1
W
X
1
5
1
5
S
0.150 0.250 0.006 0.010
6.000 BSC
3.000 BSC
6.000 BSC
3.000 BSC
0.200 REF
1.000 REF
0.236 BSC
0.118 BSC
0.236 BSC
0.118 BSC
0.008 REF
0.039 REF
4X
0.200 (0.008) AB T–U Z
DETAIL AD
J
N
–AB–
–AC–
F
D
0.080 (0.003) AC
S
S
S
0.080 (0.003)
AC T–U
Z
M
SECTION AE–AE
TOP & BOTTOM
R
–T–, –U–, –Z–
C
H
E
AE
G
AE
W
K
X
GAUGE
PLANE
Q
0.250 (0.010)
DETAIL AD
DETAIL Y
13–31
MOTOROLA ANALOG IC DEVICE DATA
FTA SUFFIX
CASE 977–01
Plastic Package
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
24
1
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
AT DATUM PLANE –AB–.
4X
5. DIMENSIONS S AND V TO BE DETERMINED AT
DATUM PLANE –AC–.
9
0.200 (0.008) AB T–U Z
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350 (0.014).
A
A1
24
DETAIL Y
19
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
1
18
–T–
–U–
MILLIMETERS
DIM MIN MAX
4.000 BSC
INCHES
MIN MAX
0.157 BSC
0.079 BSC
0.157 BSC
0.079 BSC
A
A1
B
2.000 BSC
4.000 BSC
2.000 BSC
1.400 1.600 0.055 0.063
0.170 0.270 0.007 0.011
V
B
B1
C
D
E
B1
13
6
1.350 1.450 0.053 0.057
0.170 0.230 0.007 0.009
V1
F
G
H
J
K
M
N
P
0.500 BSC
0.020 BSC
0.050 0.150 0.002 0.006
0.090 0.200 0.004 0.008
0.500 0.700 0.020 0.028
12 REF
0.090 0.160 0.004 0.006
0.250 BSC 0.010 BSC
12 REF
7
12
Q
R
S
S1
V
V1
W
X
1
5
1
5
–Z–
S1
0.150 0.250 0.006 0.010
6.000 BSC
3.000 BSC
6.000 BSC
3.000 BSC
0.200 REF
1.000 REF
0.236 BSC
0.118 BSC
0.236 BSC
0.118 BSC
0.008 REF
0.039 REF
S
4X
0.200 (0.008) AB T–U Z
DETAIL AD
–T–, –U–, –Z–
–AB–
–AC–
AE
AE
0.080 (0.003) AC
M
TOP & BOTTOM
P
R
G
DETAIL Y
C
E
J
N
F
W
GAUGE
Q
D
PLANE
H
K
0.250 (0.010)
X
S
S
S
0.080 (0.003)
AC T–U
Z
DETAIL AD
SECTION AE–AE
13–32
MOTOROLA ANALOG IC DEVICE DATA
N SUFFIX
CASE 1212–01
Plastic Package
(SOT–23)
1
ISSUE O
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
A2
B
A
E
D
S
0.05
3. DATUM C IS A SEATING PLANE.
A1
MILLIMETERS
5
1
4
3
DIM MIN
MAX
0.10
1.30
0.50
0.25
3.00
3.10
1.80
L
A1
A2
B
C
D
E
E1
e
e1
L
0.00
1.00
0.30
0.10
2.80
2.50
1.50
0.95 BSC
1.90 BSC
0.20
0.45
2
E1
C
L1
B
5X
C
M
S
S
0.10
C B
A
e
e1
–––
0.75
L1
H SUFFIX
1
CASE 1213–01
Plastic Package
(SOT–89)
ISSUE O
NOTES:
A
D
A2
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCING
PER ASME Y14.5M, 1994.
C
B
D1
3. DATUM C IS A SEATING PLANE.
MILLIMETERS
DIM MIN
MAX
1.60
0.57
0.52
0.50
4.60
1.70
4.25
2.60
E1
E
A2
B
B1
C
D
D1
E
1.40
0.37
0.32
0.30
4.40
1.50
–––
L1
B
C
M
S
S
0.10
C B
A
E1
e
e1
L1
2.40
1.50 BSC
3.00 BSC
0.80 –––
B1 2X
e
M
S
S
0.10
C B
A
e1
13–33
MOTOROLA ANALOG IC DEVICE DATA
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