LV5695P-E [ONSEMI]
Multi-Power Supply System IC for Car Audio Systems; 多电源系统IC为汽车音响系统
| 型号： | LV5695P-E |
| 厂家： | 
ONSEMI |
| 描述： | Multi-Power Supply System IC for Car Audio Systems |
| 文件： | 总13页 (文件大小：255K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Ordering number : ENA1972A
LV5695P
Monolithic Linear IC
Multi-Power Supply System IC
http://onsemi.com
for Car Audio Systems
Overview
LV5695P is a multiple voltage regulator for car audio system, which allows reduction of quiescent current. This IC has
5 systems of voltage regulator pre-driver which two high side switch for external devices. The following protection
circuits are integrated: over current protector, overvoltage protector and Thermal Shut Down.
Features
• Quiescent current 50μA (Typ. when only VDD is in operation)
• Five channel regulator
For V : V
DD OUT
For SWD5V: V
is 5.0V/3.3V(Operation always), I max is 300mA
O
is 5.0V, I max is 500mA
OUT
O
For CD: V
OUT
is 8.0V, I max is 2000mA
O
For illumination: V
is 8.5V, I max is 500mA
OUT
O
For audio systems: V
is 8.45V, I max is 800mA
O
OUT
• Two high side switch:
AMP: Voltage difference between input and output is 0.5V, I max is 500mA
O
ANT: Voltage difference between input and output is 0.5V, I max is 350mA
O
• Over current protector
• Overvoltage protector (Without V -OUT) Clamp voltage is 28V (typical)
DD
• Thermal Shut down 175ºC (typical)
• Pch-LDMOS is used for power output block.
(Warning) The protector functions only improve the IC’s tolerance and they do not guarantee the safety of the IC if used under the
conditions out of safety range or ratings. Use of the IC such as use under over current protection range or thermal shutdown state may
degrade the IC’s reliability and eventually damage the IC.
Semiconductor Components Industries, LLC, 2013
August, 2013
O2611 SY 20111018-S00003/82411 SY 20110718-S00006 No.A1972-1/13
LV5695P
Specifications
Absolute Maximum Ratings at Ta = 25°C
Parameter
Power supply voltage
Power dissipation
Conditions
Conditions
Ratings
Unit
V
V
max
36
1.5
CC
Pd max
(*1)
IC unit
W
W
W
V
At using Al heat sink (50×50×1.5mm3)
5.6
At infinity heat sink
32.5
Peak voltage
V
peak
Regarding Bias wave, refer to below the pulse.
50
CC
Operating temperature
Storage temperature
Junction temperature
Topr
-40 to +85
-55 to +150
150
°C
°C
°C
Tstg
Tj max
*1 : Ta ≤ 25°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating
Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
Recommended Operating range at Ta = 25°C
Parameter
Conditions
Ratings
Unit
V
Power supply voltage rating 1
Power supply voltage rating 2
Power supply voltage rating 3
V
output ON, SWD output ON
7 to 16
10.3 to 16
10 to 16
DD
ILM output ON
Audio output ON, CD output ON
V
V
* V 1 should be as follows: V 1>V -0.7V
CC CC CC
Electrical Characteristics at Ta = 25°C(*2), V
= V 1=14.4V
CC
CC
Ratings
typ
Parameter
Symbol
Conditions
Unit
min
max
100
Current drain
I
V
no load, CTRL1/2/3 = ⎡L/L/L⎦
50
μA
CC
DD
CTRL1/2/3 Input
Low input voltage
Middle input voltage 1
Middle input voltage 2
High input voltage
Input impedance
V
V
V
V
1
0
0.8
1.9
2.9
280
0.3
1.4
2.4
5.5
520
V
V
IL
1
1.06
2.13
3.2
IM
IM
IH
2
V
V
R
Input voltage ≤ 3.3V
400
kΩ
IN
IKV
DD
input.
Low input voltage
High input voltage
V
2
-
-
-
0.7
-
V
V
IL
V
2
IKV
DD
V
1-0.7
IH
CC
V
output(5V/3.3V)
DD
Output voltage
V
V
11
12
I
I
1 = 200mA, IKV
1 = 200mA, IKV
= V
1
4.85
3.2
5.0
3.3
5.15
3.4
V
V
O
O
DD
CC
= GND
O
O
DD
Output current
I
1
V
11 ≥ 4.7V, V 12 ≥ 3.1V
300
mA
mV
mV
V
O
O
O
Line regulation
Load regulation
Dropout voltage 1
Dropout voltage 2
Ripple rejection
ΔV
ΔV
V
1
1
7.5V < V 1 < 16V, I 1 = 200mA
30
70
70
150
1.6
0.8
OLN
CC
1mA < I 1 < 200mA
O
OLD
O
1
I
I
1 = 200mA (V
output 5V time)
output 5V time)
0.8
0.4
40
DROP
O
O
DD
DD
V
1’
1 = 100mA (V
V
DROP
R
1
f = 120Hz, I 1 = 200mA
30
dB
REJ
O
AUDIO (8.45V) Output ; CTRL2 = ⎡M1 or H⎦
AUDIO output voltage 1
AUDIO output current
Line regulation
V
3
I
3 = 650mA
O
8.196
800
8.45
8.7
V
mA
mV
mV
V
O
I
3
V 3 ≥ 8.0V
O
O
ΔV
ΔV
V
3
3
10V < V
CC
< 16V, I 3 = 650mA
30
100
0.7
0.2
50
90
200
1.2
OLN
O
Load regulation
1mA < I 3 < 650mA
O
OLD
Dropout voltage 1
Dropout voltage 2
Ripple rejection
3
I
I
3 = 650mA
3 = 200mA
DROP
O
V
3’
0.35
V
DROP
O
R
3
f = 120Hz, I 3 = 650mA
40
dB
REJ
O
ILM (8.5V) Output ; CTRL1 = ⎡M1 or H⎦
ILM output voltage
ILM output current
V
4
I
4 = 350mA
O
8.245
500
8.5
8.755
V
O
I
4
V
4 ≥ 8.1V
mA
O
O
Continued on next page.
No.A1972-2/13
LV5695P
Continued from preceding page.
Ratings
typ
Parameter
Symbol
Conditions
Unit
min
max
100
Line regulation
ΔV
ΔV
V
4
4
10.8V < V
CC
< 16V, I 4 = 350mA
40
mV
mV
V
OLN
O
Load regulation
1mA < I 4 < 350mA
70
1.0
0.3
50
150
1.5
0.6
OLD
O
Dropout voltage 1
Dropout voltage 2
Ripple rejection
4
I
I
4 = 350mA
4 = 100mA
DROP
O
V
4’
V
DROP
O
R
4
f = 120Hz, I 4 = 350mA
40
dB
REJ
5
O
AMP_HS-SW; CTRL3 = ⎡M2 or H⎦
Output voltage
V
I
5 = 500mA
V
V
-0.5
-0.5
5.0
V
V
-1.0
-1.0
V
O
O
CC
CC
Output current
I
5
V -1.0 ≥ ΔV
CC
5
6
500
350
mA
O
O
ANT_HS-SW; CTRL3 = ⎡M1 or H⎦
Output voltage
V
6
I
6 = 300mA
V
O
O
CC
CC
Output current
I
6
V -1.0 ≥ ΔV
CC
mA
O
O
SWD5V; CTRL2 = ⎡M2 or H⎦
SWD output voltage
SWD output current
Line regulation
V
7
I
7 = 350mA
4.85
500
5.15
V
O
O
I
7
V
7 ≥ 4.7V
mA
mV
mV
V
O
O
ΔV
ΔV
V
7
10V < V
CC
< 16V, I 7 = 350mA
30
70
70
150
1.6
OLN
O
Load regulation
7
1mA < I 7 < 350mA
O
OLD
Dropout voltage
7
I
7 = 350mA
O
0.8
50
DROP
Ripple rejection
R
7
f = 120Hz, I 7 = 350mA
40
dB
REJ
O
CD(8.0V output); CTRL1 = ⎡ M2 or H⎦
CD output voltage
CD output current
Line regulation
V
81
I
8 = 1300mA
O
7.76
8.0
8.24
V
mA
mV
mV
V
O
I
8
V
81 ≥ 7.6V
2000
O
O
ΔV
ΔV
V
8
10.5V < V
CC
< 16V, I 8 = 1300mA
40
70
100
200
1.95
0.7
OLN
O
Load regulation
Dropout voltage 1
Dropout voltage 2
Ripple rejection
8
10mA < I 8 < 1300mA
O
OLD
8
I
I
8 = 1300mA
1.3
DROP
O
O
V
8’
8 = 350mA
0.35
50
V
DROP
R
8
f = 120Hz, I 8 = 1300mA
40
dB
REJ
O
*2: The entire specification has been defined based on the tests performed under the conditions where Tj and Ta (=25°C) are almost equal. There tests were
performed with pulse load to minimize the increase of junction temperature (Tj).
No.A1972-3/13
LV5695P
Package Dimensions
unit : mm (typ)
3395
21.6
(20.0)
HEAT SPREADER
HEAT SINK
(15.8)
3.0
(R1.75)
0.4
1
15
2.54 2.54
(1.91)
1.27
0.7
HZIP15J
• Allowable power dissipation derating curve
Pd max -- Ta
Aluminum heat sink mounting conditions
8
tightening torque : 39N⋅cm, using silicone grease
7
Aluminum heat sink (50 × 50 × 1.5mm3) when using
6
5.6
5
4
3
2
1.5
1
Independent IC
0
0
20
40
60
80
100
120
140 150 160
Ambient temperature, Ta -- °C
• Waveform applied during surge test
50V
90%
10%
16V
5msec
100msec
No.A1972-4/13
LV5695P
CTRL Pin Output Truth Table(Each output can be independently controlled by four value input.)
INANT
CTRL3
INAMP
AMP
OFF
OFF
ON
ANT
OFF
ON
L
L
L
H
L
L
M1
M2
H
H
H
OFF
ON
H
ON
CTRL2
L
SWD5V
OFF
OFF
ON
AUDIO
OFF
ON
CTRL1
CD
OFF
OFF
ON
ILM
OFF
ON
L
M1
M2
H
M1
M2
H
OFF
ON
OFF
ON
ON
ON
INAMP
CTL3
INANT
(Warning) Usage of CTRL2
When CTRL pin transits between L and M2, since it passes M1, ILM,/AUDIO/ANT is turned on for a moment. Likewise,
when CTRL pin transits between H and M1, since it passes M2, ILM/AUDIO/ANT is turned off for a moment.
To avoid operation failure by the above factors, please refer to the following precautions.
• Do not connect parasitic capacitor to CTRL as much as possible.
• If use of capacitor for CTRL is required, keep the resistance value as low as possible.
• Make sure that the output load capacitor has enough marjin against the voltage fluctuation due to instantaneous
ON/OFF.
No.A1972-5/13
LV5695P
z Block Diagram
V
CC
AMP
out
AMP_SW(V
-0.5V)
CC
500mA
ANT
out
ANT_SW(V
-0.5V)
CC
350mA
Over
Voltage
Protection
Start
up
-
Vref
+
ILM output(8.5V)
500mA
-
+
AUDIO output(8.45V)
800mA
CTRL1
CTRL2
OUTPUT
Control
-
+
CTRL3
SWD output(5V)
500mA
-
+
CD output(8V)
2000mA
Thermal
Shut Down
V
1(V
power supply input)
DD
GND
CC
V
CC
-
+
V
output(3.3/5V)
300mA
DD
IKV :V (3.3/5V) changeing pin
DD DD
IKV =V 1:5V
DD CC
IKV =GND:3.3V
DD
No.A1972-6/13
LV5695P
Pin Function
Pin No.
Pin name
Description
Equivalent Circuit
1
ILM
ILM output pin
V
15
1
CC
ON when CTRL1 = M1, H
8.5V/0.5A
2
GND
2
3
GND
CD
GND pin
CD output pin
ON when CTRL1 = M2, H
8.0V/2A
V
15
CC
3
2
GND
4
6
8
CTRL1
CTRL2
CTRL3
CTRL1/2/3 input pin
Four values input
15
V
CC
4
6
8
2
GND
5
AUDIO
AUDIO output pin
ON when CTRL2 = M1, H
8.45V/0.8A
V
15
CC
5
2
GND
Continued on next page.
No.A1972-7/13
LV5695P
Continued from preceding page.
Pin No.
7
Pin name
SWD
Description
Equivalent Circuit
SWD output pin
V
15
7
CC
ON when CTRL2 = M2, H
5V/0.5A
2
GND
9
ANT
ANT output pin
V
15
CC
ON when CTRL3 = M1, H
V
-0.5V/350mA
CC
11
EXT output pin
ON when CTRL2 = M2, H
V
-0.5V/500mA
CC
11
9
2
GND
10
12
NC
(GND)
IKV
DD
V
V
voltage change control input pin
DD
CC
V
14
12
CC
1/GND
2
GND
13
V
V
output pin
DD
DD
V
14
CC
5.0V/0.3A(IKV
= V 1)
CC
= GND)
DD
DD
3.3V/0.3A(IKV
13
2
GND
1
14
15
V
V
1
V
power supply pin
CC
DD
Power supply pin
V
CC
15
2
V
14
CC
CC
GND
No.A1972-8/13
LV5695P
Timing Chart
28V
28V
V
CC
(15PIN)
V
1
CC
(14PIN)
5.8V
V
output
DD
(5V time)
(13PIN)
H
M2
CTRL1 input
(4PIN)
M1
L
H
M2
CTRL2 input
(6PIN)
M1
L
H
M2
CTRL3 input
(8PIN)
M1
L
ILM output
(1PIN)
CD output
(3PIN)
AUDIO output
(5PIN)
SWD output
(7PIN)
ANT output
(9PIN)
AMP output
(11PIN)
*Usage condition: Use under typical value.
No.A1972-9/13
LV5695P
Example of applied circuit
2
4
6
8
10
12
14
1
3
5
7
9
11
13
15
C9
C10
C11 C16
C12
C15
+
+
+
+
CTRL1
CTRL2
CTRL3
C14
C13
D1
R1
D2
D3
D4
D5
+
V
DD
C8
C6
C4
C2
C5
C3
+
C1
+
C7
+
+
ANT
AMP
ILM
CD
AUDIO
SWD
V
CC
Peripheral parts list
Name of part
Description
Recommended value
Remarks
C2, C4, C6, C8, C12
C1, C3, C5, C7, C11
C14, C16
Output stabilization capacitor
Output stabilization capacitor
10μF or more*
0.22μF or more*
100μF or more
0.22μF or more
2.2μF or more
10 to 100kΩ
Electrolytic capacitor
Ceramic capacitor
Power supply bypass capacitor
Oscillation prevention capacitor
These capacitors must be placed near
the V and GND pins.
CC
C13, C15
C9, C10
AMP/ANT output stabilization capacitor
R1
D1
Resistance for protection
Diode for prevention of backflow
Diode for internal element protection
D2, D3, D4, D5
SB1003M3
note)The circuit diagram and the values are only tentative which are subject to change.
* : Make sure that the capacitors of the output pins are 10μF or higher and ESR is 10Ω or lower in total and temperature characteristics and accuracy are taken
into consideration. Also the E-cap should have good high frequency characteristics.
Caution for implementing LV5695P to a system board
The package of LV5695P is HZIP15J which has some metal exposures other than connection pins and heatsink as shown in the
diagram below. The electrical potentials of (2) and (3) are the same as those of pin 15 and pin 1, respectively. (2) (=pin 15) is the V
CC
pin and (3) (=pin 1) is the ILM (regulator) output pin. When you implement the IC to the set board, make sure that the bolts and the
heatsink are out of touch from (2) and (3). If the metal exposures touch the bolts which has the same electrical potential with GND,
GND short occurs in ILM output and V . The exposures of (1) are connected to heatsink which has the same electrical potential with
CC
substrate of the IC chip (GND). Therefore, (1) and GND electrical potential of the set board can connect each other.
· HZIP15J outline
Heat-sink side
Heat-sink
Same potential
15PIN
2
Same potential
Heat-sink
1
Same potential
1PIN
Same potential
1
3
Heat-sink
Same potential
1
:Metal exposure
Heat-sink side
:Metal exposure
<Side view of HZIP15J>
<Top view of HZIP15J>
No.A1972-10/13
LV5695P
· Frame diagram (LV5695P) *In the system power supply other than LV5695P, pin assignment may differ.
Metal exposure 1
Metal exposure 3
Metal exposure 2
Metal exposure 1
LV5695
Metal exposure 1
Metal exposure 1
15PIN
1PIN
No.A1972-11/13
LV5695P
HZIP15J Heat sink attachment
Heat sinks are used to lower the semiconductor device junction temperature by leading the head generated by the device to
the outer environment and dissipating that heat.
a. Unless otherwise specified, for power ICs with tabs and power ICs with attached heat sinks, solder must not be
applied to the heat sink or tabs.
b. Heat sink attachment
· Use flat-head screws to attach heat sinks.
· Use also washer to protect the package.
· Use tightening torques in the ranges 39-59Ncm(4-6kgcm) .
· If tapping screws are used, do not use screws with a diameter larger
than the holes in the semiconductor device itself.
Binding head
machine screw
Countersunk head
mashine screw
· Do not make gap, dust, or other contaminants to get between the
semiconductor device and the tab or heat sink.
Heat sink
· Take care a position of via hole .
gap
· Do not allow dirt, dust, or other contaminants to get between the
semiconductor device and the tab or heat sink.
· Verify that there are no press burrs or screw-hole burrs on the heat sink.
· Warping in heat sinks and printed circuit boards must be no more than
0.05 mm between screw holes, for either concave or convex warping.
· Twisting must be limited to under 0.05 mm.
· Heat sink and semiconductor device are mounted in parallel.
Take care of electric or compressed air drivers
Via hole
· The speed of these torque wrenches should never exceed 700 rpm, and
should typically be about 400 rpm.
c. Silicone grease
· Spread the silicone grease evenly when mounting heat sinks.
· Our company recommends YG-6260 (Momentive Performance Materials Japan LLC)
d. Mount
· First mount the heat sink on the semiconductor device, and then mount that assembly on the printed circuit board.
· When attaching a heat sink after mounting a semiconductor device into the printed circuit board, when tightening
up a heat sink with the screw, the mechanical stress which is impossible to the semiconductor device and the pin
doesn't hang.
e. When mounting the semiconductor device to the heat sink using jigs, etc.,
· Take care not to allow the device to ride onto the jig or positioning dowel.
· Design the jig so that no unreasonable mechanical stress is not applied to the semiconductor device.
f. Heat sink screw holes
· Be sure that chamfering and shear drop of heat sinks must not be larger than the diameter of screw head used.
· When using nuts, do not make the heat sink hole diameters larger than the diameter of the head of the screws used.
A hole diameter about 15% larger than the diameter of the screw is desirable.
· When tap screws are used, be sure that the diameter of the holes in the heat sink are not too small. A diameter about
15% smaller than the diameter of the screw is desirable.
g. There is a method to mount the semiconductor device to the heat sink by using a spring band. But this method is not
recommended because of possible displacement due to fluctuation of the spring force with time or vibration.
No.A1972-12/13
LV5695P
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warranty, representation or guarantee regarding the suitabilityof its products for any particular purpose, nor does SCILLC assume any liability arising out of the
application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental
damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual
performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical
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PS No.A1972-13/13
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