MAC97A4G [ONSEMI]

Sensitive Gate Triacs Silicon Bidirectional Thyristors; 敏感的门双向可控硅硅双向晶闸管
MAC97A4G
型号: MAC97A4G
厂家: ONSEMI    ONSEMI
描述:

Sensitive Gate Triacs Silicon Bidirectional Thyristors
敏感的门双向可控硅硅双向晶闸管

栅极 触发装置 可控硅 三端双向交流开关
文件: 总8页 (文件大小:84K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MAC97 Series  
Preferred Device  
Sensitive Gate Triacs  
Silicon Bidirectional Thyristors  
Designed for use in solid state relays, MPU interface, TTL logic and  
any other light industrial or consumer application. Supplied in an  
inexpensive TO−92 package which is readily adaptable for use in  
automatic insertion equipment.  
http://onsemi.com  
Features  
TRIACS  
0.8 AMPERE RMS  
200 thru 600 VOLTS  
One−Piece, Injection−Molded Package  
Blocking Voltage to 600 Volts  
Sensitive Gate Triggering in Four Trigger Modes (Quadrants) for all  
possible Combinations of Trigger Sources, and especially for Circuits  
that Source Gate Drives  
All Diffused and Glassivated Junctions for Maximum Uniformity of  
MT2  
MT1  
Parameters and Reliability  
G
Pb−Free Packages are Available*  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Rating  
Symbol  
Value  
Unit  
MARKING  
DIAGRAMS  
Peak Repetitive Off-State Voltage  
V
V
V
DRM,  
(T = −40 to +110°C) (Note 1)  
J
RRM  
Sine Wave 50 to 60 Hz, Gate Open  
MAC97A4  
MAC97A6  
MAC97A8  
200  
400  
600  
MAC  
97Ax  
AYWWG  
G
On-State RMS Current  
I
0.6  
A
A
T(RMS)  
TO−92 (TO−226AA)  
Full Cycle Sine Wave 50 to 60 Hz  
CASE 029  
STYLE 12  
(T = +50°C)  
C
1
2
3
Peak Non−Repetitive Surge Current  
One Full Cycle, Sine Wave 60 Hz  
I
TSM  
8.0  
(T = 110°C)  
C
2
2
MAC97Ax = Device Code  
x = 4, 6, or 8  
Circuit Fusing Considerations (t = 8.3 ms)  
I t  
0.26  
5.0  
A s  
Peak Gate Voltage  
V
V
W
W
A
GM  
GM  
A
= Assembly Location  
(t v 2.0 ms, T = +80°C)  
C
Y
= Year  
Peak Gate Power  
P
5.0  
0.1  
1.0  
WW  
G
= Work Week  
= Pb−Free Package  
(t v 2.0 ms, T = +80°C)  
C
Average Gate Power  
P
G(AV)  
(Note: Microdot may be in either location)  
(T = 80°C, t v 8.3 ms)  
C
Peak Gate Current  
I
GM  
(t v 2.0 ms, T = +80°C)  
C
PIN ASSIGNMENT  
Operating Junction Temperature Range  
Storage Temperature Range  
T
−40 to +110  
−40 to +150  
°C  
°C  
J
1
2
3
Main Terminal 1  
Gate  
T
stg  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
Main Terminal 2  
1. V  
and V  
for all types can be applied on a continuous basis. Blocking  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 6 of this data sheet.  
DRM  
RRM  
voltages shall not be tested with a constant current source such that the  
voltage ratings of the devices are exceeded.  
Preferred devices are recommended choices for future use  
and best overall value.  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
©
Semiconductor Components Industries, LLC, 2005  
1
Publication Order Number:  
September, 2005 − Rev. 9  
MAC97/D  
 
MAC97 Series  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
75  
Unit  
°C/W  
°C/W  
°C  
Thermal Resistance, Junction−to−Case  
Thermal Resistance, Junction−to−Ambient  
R
q
JC  
JA  
L
R
q
200  
260  
Maximum Lead Temperature for Soldering Purposes for 10 Seconds  
T
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted; Electricals apply in both directions)  
C
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
Peak Repetitive Blocking Current  
I
, I  
DRM RRM  
(V = Rated V  
, V  
DRM  
; Gate Open)  
RRM  
T = 25°C  
10  
100  
mA  
mA  
D
J
T = +110°C  
J
ON CHARACTERISTICS  
Peak On−State Voltage  
V
1.9  
V
TM  
(I = ".85 A Peak; Pulse Width v 2.0 ms, Duty Cycle v 2.0%)  
TM  
Gate Trigger Current (Continuous dc)  
I
mA  
GT  
(V = 12 Vdc, R = 100 W)  
D
L
MT2(+), G(+)  
5.0  
5.0  
5.0  
7.0  
MT2(+), G(−)  
MT2(−), G(−)  
MT2(−), G(+)  
Gate Trigger Voltage (Continuous dc)  
(V = 12 Vdc, R = 100 W)  
MT2(+), G(+) All Types  
MT2(+), G(−) All Types  
MT2(−), G(−) All Types  
MT2(−), G(+) All Types  
V
V
V
GT  
D
L
.66  
.77  
.84  
.88  
2.0  
2.0  
2.0  
2.5  
Gate Non−Trigger Voltage  
V
0.1  
GD  
(V = 12 V, R = 100 W, T = 110°C)  
D
L
J
All Four Quadrants  
Holding Current  
(V = 12 Vdc, Initiating Current = 200 mA, Gate Open)  
D
I
1.5  
2.0  
10  
mA  
H
Turn-On Time  
t
ms  
gt  
(V = Rated V  
, I = 1.0 A pk, I = 25 mA)  
DRM TM G  
D
DYNAMIC CHARACTERISTICS  
Critical Rate−of−Rise of Commutation Voltage  
(V = Rated V , I = .84 A,  
Commutating di/dt = .3 A/ms, Gate Unenergized, T = 50°C)  
dV/dt(c)  
dv/dt  
5.0  
25  
V/ms  
V/ms  
D
DRM TM  
C
Critical Rate of Rise of Off−State Voltage  
(V = Rated V  
, T = 110°C, Gate Open, Exponential Waveform  
D
DRM  
C
http://onsemi.com  
2
MAC97 Series  
Voltage Current Characteristic of Triacs  
(Bidirectional Device)  
+ Current  
Quadrant 1  
MainTerminal 2 +  
Symbol  
Parameter  
V
TM  
V
Peak Repetitive Forward Off State Voltage  
Peak Forward Blocking Current  
DRM  
DRM  
on state  
I
I
H
I
at V  
RRM  
V
Peak Repetitive Reverse Off State Voltage  
Peak Reverse Blocking Current  
RRM  
RRM  
I
RRM  
V
Maximum On State Voltage  
Holding Current  
+ Voltage  
off state  
TM  
I
I
at V  
H
DRM  
DRM  
I
H
Quadrant 3  
MainTerminal 2 −  
V
TM  
Quadrant Definitions for a Triac  
MT2 POSITIVE  
(Positive Half Cycle)  
+
(+) MT2  
(+) MT2  
Quadrant II  
Quadrant I  
(−) I  
(+) I  
GT  
GT  
GATE  
GATE  
MT1  
MT1  
REF  
REF  
I
+ I  
GT  
GT  
(−) MT2  
(−) MT2  
Quadrant III  
Quadrant IV  
(+) I  
(−) I  
GT  
GT  
GATE  
GATE  
MT1  
REF  
MT1  
REF  
MT2 NEGATIVE  
(Negative Half Cycle)  
All polarities are referenced to MT1.  
With in−phase signals (using standard AC lines) quadrants I and III are used.  
http://onsemi.com  
3
MAC97 Series  
110  
100  
90  
110  
100  
T = 30°  
T = 30°  
60°  
90  
80  
70  
60  
50  
60°  
90°  
DC  
DC  
90°  
80  
180°  
180°  
70  
120°  
120°  
60  
a
a
50  
40  
30  
a
a
40  
a = CONDUCTION ANGLE  
a = CONDUCTION ANGLE  
20  
30  
0
0.05  
0.1  
0.15  
0.2  
0.25  
0.3  
0.35  
0.4  
0
0.1  
0.2  
0.3  
0.4  
0.5  
0.6  
0.7  
0.8  
I
, RMS ON−STATE CURRENT (AMPS)  
I
, RMS ON−STATE CURRENT (AMPS)  
T(RMS)  
T(RMS)  
Figure 2. RMS Current Derating  
Figure 1. RMS Current Derating  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
6.0  
4.0  
a
DC  
T = 110°C  
J
a
180°  
2.0  
a = CONDUCTION ANGLE  
25°C  
120°  
1.0  
90°  
0.6  
0.4  
60°  
T = 30°  
0
0.1  
0.2  
0.3  
0.4  
0.5  
0.6  
0.7  
0.8  
I
, RMS ON−STATE CURRENT (AMPS)  
T(RMS)  
0.2  
0.1  
Figure 3. Power Dissipation  
0.06  
0.04  
0.02  
0.01  
0.006  
0.4  
1.2  
2.0  
2.8  
3.6  
4.4  
5.2  
6.0  
V
, INSTANTANEOUS ON-STATE VOLTAGE (VOLTS)  
TM  
Figure 4. On−State Characteristics  
http://onsemi.com  
4
MAC97 Series  
10  
1.0  
5.0  
Z
= R  
@ r(t)  
JC(t)  
Q
Q
JC(t)  
0.1  
3.0  
2.0  
T = 110°C  
J
f = 60 Hz  
CYCLE  
Surge is preceded and followed by rated current.  
0.01  
1.0  
1.0  
3
4
0.1  
1.0  
10  
100  
1S10  
1S10  
2.0 3.0  
5.0  
10  
30  
50  
100  
NUMBER OF CYCLES  
t, TIME (ms)  
Figure 5. Transient Thermal Response  
Figure 6. Maximum Allowable Surge Current  
100  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
Q4  
Q3  
Q2  
Q4  
Q3  
10  
Q1  
Q2  
Q1  
1
0
0.4  
0.3  
−40 −25 −10  
5
20  
35  
50  
65  
80  
95 110  
−40 −25 −10  
5
20  
35  
50  
65  
80  
95 110  
T , JUNCTION TEMPERATURE (°C)  
J
T , JUNCTION TEMPERATURE (°C)  
J
Figure 7. Typical Gate Trigger Current versus  
Junction Temperature  
Figure 8. Typical Gate Trigger Voltage versus  
Junction Temperature  
100  
10  
10  
Q2  
MT2 Negative  
MT2 Positive  
1
Q3  
Q4  
Q1  
1
0
0.1  
−40 −25 −10  
5
20  
35  
50  
65  
80  
95 110  
−40 −25 −10  
5
20  
35  
50  
65  
80  
95 110  
T , JUNCTION TEMPERATURE (°C)  
J
T , JUNCTION TEMPERATURE (°C)  
J
Figure 9. Typical Latching Current versus  
Junction Temperature  
Figure 10. Typical Holding Current versus  
Junction Temperature  
http://onsemi.com  
5
MAC97 Series  
L
1N4007  
L
200 V  
RMS  
ADJUST FOR  
, 60 Hz V  
MEASURE  
I
R
S
I
TM  
AC  
CHARGE  
CONTROL  
+
TRIGGER  
200 V  
CHARGE  
C
ADJUST FOR  
dV/dt  
S
(c)  
MT2  
G
1N914  
51 W  
MT1  
NON-POLAR  
C
L
Note: Component values are for verification of rated (dv/dt) . See AN1048 for additional information.  
c
Figure 11. Simplified Test Circuit to Measure the Critical Rate of Rise of Commutating Voltage (dV/dt)c  
ORDERING & SHIPPING INFORMATION  
Europe  
Equivalent  
MAC97A6RL1  
MAC97A6RL1G  
U.S.  
Shipping  
Description of TO92 Tape Orientation  
Flat side of TO92 & adhesive tape visible  
Flat side of TO92 & adhesive tape visible  
Radial Tape & Reel (2K/Reel)  
Radial Tape & Reel (2K/Reel)  
(Pb−Free)  
MAC97A8RLRM  
MAC97A8RL1  
Radial Tape & Reel (2K/Reel)  
Flat side of TO92 & adhesive tape visible  
Flat side of TO92 & adhesive tape visible  
MAC97A8RLRMG  
MAC97A8RL1G  
Radial Tape & Reel (2K/Reel)  
(Pb−Free)  
MAC97A4  
Bulk in Box (5K/Box)  
N/A, Bulk  
N/A, Bulk  
MAC97A4G  
Bulk in Box (5K/Box)  
(Pb−Free)  
MAC97A6  
Bulk in Box (5K/Box)  
N/A, Bulk  
N/A, Bulk  
MAC97A6G  
Bulk in Box (5K/Box)  
(Pb−Free)  
MAC97A8  
Bulk in Box (5K/Box)  
N/A, Bulk  
N/A, Bulk  
MAC97A8G  
Bulk in Box (5K/Box)  
(Pb−Free)  
MAC97A6RLRF  
Radial Tape & Reel (2K/Reel)  
Round side of TO92 & adhesive tape on reverse side  
Round side of TO92 & adhesive tape on reverse side  
MAC97A6RLRFG  
Radial Tape & Reel (2K/Reel)  
(Pb−Free)  
MAC97A6RLRP  
Radial Tape & Reel (2K/Reel)  
Round side of TO92 & adhesive tape on reverse side  
Round side of TO92 & adhesive tape on reverse side  
MAC97A6RLRPG  
Radial Tape & Reel (2K/Reel)  
(Pb−Free)  
MAC97A8RLRP  
Radial Tape / Fan Fold Box (2K/Box) Round side of TO92 & adhesive tape visible  
MAC97A8RLRPG  
Radial Tape / Fan Fold Box (2K/Box) Round side of TO92 & adhesive tape visible  
(Pb−Free)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
http://onsemi.com  
6
MAC97 Series  
TO−92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL  
H2A  
H2A  
H2B  
H2B  
H
W2  
H4  
H5  
T1  
L1  
H1  
W1  
W
L
T
T2  
F1  
F2  
D
P2  
P1  
P2  
P
Figure 12. Device Positioning on Tape  
Specification  
Millimeter  
Inches  
Min  
Max  
0.1653  
0.020  
0.110  
0.156  
0.3741  
0.039  
0.051  
0.768  
0.649  
0.433  
Min  
Max  
4.2  
Symbol  
D
Item  
Tape Feedhole Diameter  
0.1496  
0.015  
0.0945  
.059  
3.8  
0.38  
2.4  
1.5  
8.5  
0
D2  
F1, F2  
H
Component Lead Thickness Dimension  
Component Lead Pitch  
0.51  
2.8  
Bottom of Component to Seating Plane  
Feedhole Location  
4.0  
H1  
H2A  
H2B  
H4  
H5  
L
0.3346  
0
9.5  
Deflection Left or Right  
1.0  
Deflection Front or Rear  
0
0
1.0  
Feedhole to Bottom of Component  
Feedhole to Seating Plane  
Defective Unit Clipped Dimension  
Lead Wire Enclosure  
0.7086  
0.610  
0.3346  
0.09842  
0.4921  
0.2342  
0.1397  
0.06  
18  
19.5  
16.5  
11  
15.5  
8.5  
2.5  
12.5  
5.95  
3.55  
0.15  
L1  
P
Feedhole Pitch  
0.5079  
0.2658  
0.1556  
0.08  
12.9  
6.75  
3.95  
0.20  
1.44  
0.65  
19  
P1  
Feedhole Center to Center Lead  
First Lead Spacing Dimension  
Adhesive Tape Thickness  
Overall Taped Package Thickness  
Carrier Strip Thickness  
P2  
T
T1  
0.0567  
0.027  
0.7481  
0.2841  
0.01968  
T2  
0.014  
0.6889  
0.2165  
0.0059  
0.35  
17.5  
5.5  
0.15  
W
Carrier Strip Width  
W1  
W2  
Adhesive Tape Width  
6.3  
Adhesive Tape Position  
0.5  
NOTES:  
2. Maximum alignment deviation between leads not to be greater than 0.2 mm.  
3. Defective components shall be clipped from the carrier tape such that the remaining protrusion (L) does not exceed a maximum of 11 mm.  
4. Component lead to tape adhesion must meet the pull test requirements.  
5. Maximum non−cumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches.  
6. Holddown tape not to extend beyond the edge(s) of carrier tape and there shall be no exposure of adhesive.  
7. No more than 1 consecutive missing component is permitted.  
8. A tape trailer and leader, having at least three feed holes is required before the first and after the last component.  
9. Splices will not interfere with the sprocket feed holes.  
http://onsemi.com  
7
MAC97 Series  
PACKAGE DIMENSIONS  
TO−92 (TO−226AA)  
CASE 029−11  
ISSUE AL  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
A
B
2. CONTROLLING DIMENSION: INCH.  
3. CONTOUR OF PACKAGE BEYOND DIMENSION R  
IS UNCONTROLLED.  
R
4. LEAD DIMENSION IS UNCONTROLLED IN P AND  
BEYOND DIMENSION K MINIMUM.  
P
L
SEATING  
PLANE  
INCHES  
DIM MIN MAX  
MILLIMETERS  
K
MIN  
4.45  
4.32  
3.18  
0.407  
1.15  
2.42  
0.39  
MAX  
5.20  
5.33  
4.19  
0.533  
1.39  
2.66  
0.50  
−−−  
A
B
C
D
G
H
J
0.175  
0.170  
0.125  
0.016  
0.045  
0.095  
0.015  
0.500  
0.250  
0.080  
0.205  
0.210  
0.165  
0.021  
0.055  
0.105  
0.020  
−−− 12.70  
−−−  
0.105  
D
X X  
G
J
H
V
K
L
6.35  
2.04  
−−−  
2.93  
3.43  
−−−  
C
N
P
R
V
2.66  
2.54  
−−−  
−−− 0.100  
SECTION X−X  
0.115  
0.135  
−−−  
−−−  
1
N
−−−  
N
STYLE 12:  
PIN 1. MAIN TERMINAL 1  
2. GATE  
3. MAIN TERMINAL 2  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 800−282−9855 Toll Free  
USA/Canada  
ON Semiconductor Website: http://onsemi.com  
Order Literature: http://www.onsemi.com/litorder  
Literature Distribution Center for ON Semiconductor  
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA  
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada  
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
Japan: ON Semiconductor, Japan Customer Focus Center  
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051  
Phone: 81−3−5773−3850  
For additional information, please contact your  
local Sales Representative.  
MAC97/D  

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