MBRB4030T4G [ONSEMI]
SWITCHMODE Power Rectifier; 开关模式电源整流器型号: | MBRB4030T4G |
厂家: | ONSEMI |
描述: | SWITCHMODE Power Rectifier |
文件: | 总6页 (文件大小:64K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MBRB4030
Preferred Device
SWITCHMODEt
Power Rectifier
These state−of−the−art devices use the Schottky Barrier principle
with a proprietary barrier metal.
Features
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• Guardring for Stress Protection
• Maximum Die Size
• 175°C Operating Junction Temperature
• Short Heat Sink Tab Manufactured − Not Sheared
• Pb−Free Packages are Available
SCHOTTKY BARRIER
RECTIFIER
40 AMPERES, 30 VOLTS
1
Mechanical Characteristics:
4
• Case: Epoxy, Molded, Epoxy Meets UL 94 V−0
• Weight: 1.7 Grams (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads Readily Solderable
3
4
• Device Meets MSL1 Requirements
• ESD Ratings: Machine Model, C (>400 V)
Human Body Model, 3B (>8000 V)
1
3
2
D PAK
CASE 418B
STYLE 3
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
V
V
30
V
RRM
MARKING DIAGRAM
RWM
R
Average Rectified Forward Current
I
40
80
A
A
AY WW
F(AV)
(At Rated V ) T = +115°C (Note 1)
R
C
B4030G
AKA
Peak Repetitive Forward Current
(At Rated V , Square Wave, 20 kHz),
I
FRM
R
T
= +112°C
C
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz)
I
300
2.0
A
A
FSM
A
Y
WW
= Assembly Location
= Year
= Work Week
Peak Repetitive Reverse Surge Current
(2.0 ms, 1.0 kHz)
I
RRM
B4030 = Device Code
G
AKA
= Pb−Free Package
= Diode Polarity
Storage Temperature Range
T
−65 to +175
−65 to +175
°C
°C
stg
Operating Junction Temperature Range
(Note 2)
T
J
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
Voltage Rate of Change (Rated V )
dv/dt
W
10,000
600
V/ms
R
Reverse Energy (Unclamped Inductive
mJ
Surge), (T = 25°C, L = 3.0 mH)
C
Preferred devices are recommended choices for future use
and best overall value.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Rating applies when pins 1 and 3 are connected.
2. The heat generated must be less than the thermal conductivity from
Junction−to−Ambient: dP /dT < 1/R .
q
JA
D
J
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
September, 2006 − Rev. 6
MBRB4030/D
MBRB4030
THERMAL CHARACTERISTICS
Characteristic
Symbol
Value
1.0
Unit
°C/W
°C/W
Thermal Resistance, Junction−to−Case
R
q
JC
JA
Thermal Resistance, Junction−to−Ambient (Note 4)
R
q
50
ELECTRICAL CHARACTERISTICS
Characteristic
Symbol
Value
Unit
Maximum Instantaneous Forward Voltage (Notes 3 and 5), per Device
V
V
F
(I = 20 A, T = + 25°C)
0.46
0.34
0.55
0.45
F
C
(I = 20 A, T = +150°C)
F
C
(I = 40 A, T = + 25°C)
F
C
(I = 40 A, T = +150°C)
F
C
Maximum Instantaneous Reverse Current (Note 5), per Device
I
mA
R
(Rated DC Voltage, T = + 25°C)
0.35
150
C
(Rated DC Voltage, T = +125°C)
C
3. Rating applies when pins 1 and 3 are connected.
4. Rating applies when surface mounted on the miniumum pad size recommended.
5. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%
ORDERING INFORMATION
†
Device
Package
Shipping
2
MBRB4030
D PAK
50 Units / Rail
50 Units / Rail
2
MBRB4030G
D PAK
(Pb−Free)
2
MBRB4030T4
D PAK
800 Units / Tape & Reel
800 Units / Tape & Reel
2
MBRB4030T4G
D PAK
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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2
MBRB4030
ELECTRICAL CHARACTERISTICS
100
100
T = 150°C
J
T = 150°C
J
10
1.0
0.1
10
1.0
0.1
100°C
100°C
25°C
25°C
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
V , INSTANTANEOUS VOLTAGE (V)
F
V , INSTANTANEOUS VOLTAGE (V)
F
Figure 1. Maximum Forward Voltage
Figure 2. Typical Forward Voltage
1.0
1.0
T = 150°C
J
T = 150°C
J
0.1
0.1
100°C
100°C
0.01
0.01
−3
−3
10
10
−4
−4
25°C
10
10
25°C
−5
−5
10
10
0
5
10
15
20
25
30
0
5
10
15
20
25
30
V , REVERSE VOLTAGE (V)
R
V , REVERSE VOLTAGE (V)
R
Figure 3. Maximum Reverse Current
Figure 4. Typical Reverse Current
4
10
T = 25°C
J
TYPICAL
MAXIMUM
1000
1
10
V , REVERSE VOLTAGE (V)
R
Figure 5. Maximum and Typical Capacitance
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3
MBRB4030
ELECTRICAL CHARACTERISTICS
20
70
R
= 25°C/W
q
JA
DC
DC
60
50
40
30
20
10
0
SURFACE MOUNTED ON
MINIMUM RECOMMENDED
PAD SIZE
π (RESISTIVE LOAD)
SQUARE WAVE
15
10
5
π
(RESISTIVE LOAD)
I
I
PK
SQUARE WAVE
= 5.0 (CAPACITIVE
LOAD)
AV
I
I
PK
= 5.0 (CAPACITIVE
LOAD)
AV
10
20
10
20
0
50
100
150
100
110
120
130
140
150
T , AMBIENT TEMPERATURE (°C)
A
T , CASE TEMPERATURE (°C)
C
Figure 6. Current Derating, Infinite Heatsink
Figure 7. Current Derating
12
50
R
= 50°C/W
q
JA
T = 150°C
J
DC
π (RESISTIVE LOAD)
10
8
40
30
20
10
0
π (RESISTIVE LOAD)
SQUARE WAVE
I
I
PK
= 5.0 (CAPACITIVE
LOAD)
SQUARE WAVE
AV
10
20
I
I
PK
= 5.0 (CAPACITIVE
LOAD)
6
AV
10
20
DC
4
2
0
0
50
100
150
0
10
20
30
40
50
60
70
80
I
, AVERAGE FORWARD CURRENT (A)
T , AMBIENT TEMPERATURE (°C)
A
F(AV)
Figure 8. Current Derating, Free Air
Figure 9. Forward Power Dissipation
1.0
SINGLE PULSE
P
P
pk
pk
DUTY CYCLE, D = t /t
p 1
PEAK POWER, P , is peak of an
pk
equivalent square power pulse.
0.1
t
p
TIME
t
1
DT = P • R [D + (1 − D) • r(t + t ) + r(t ) − r(t )]
q
JL
where
DT = the increase in junction temperature above the lead temperature
pk
JL
1
p
p
1
JL
r(t) = normalized value of transient thermal resistance at time, t, for example,
r(t) = r(t + t ) = normalized value of transient thermal resistance at time, t + t .
1
1
p
p
0.01
0.1
1.0
10
100
1000
t, TIME (ms)
Figure 10. Thermal Response
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4
MBRB4030
PACKAGE DIMENSIONS
D2PAK 3
CASE 418B−04
ISSUE J
NOTES:
C
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 418B−01 THRU 418B−03 OBSOLETE,
NEW STANDARD 418B−04.
E
V
W
−B−
4
INCHES
DIM MIN MAX
MILLIMETERS
MIN
MAX
A
B
C
D
E
F
G
H
J
0.340 0.380
0.380 0.405
0.160 0.190
0.020 0.035
0.045 0.055
0.310 0.350
0.100 BSC
8.64
9.65 10.29
4.06
0.51
1.14
7.87
9.65
A
4.83
0.89
1.40
8.89
S
1
2
3
2.54 BSC
−T−
SEATING
PLANE
0.080
0.018 0.025
0.090 0.110
0.110
2.03
0.46
2.29
1.32
7.11
5.00 REF
2.00 REF
0.99 REF
2.79
0.64
2.79
1.83
8.13
K
W
J
K
L
G
0.052 0.072
0.280 0.320
0.197 REF
0.079 REF
0.039 REF
M
N
P
R
S
V
H
D 3 PL
M
M
B
0.13 (0.005)
T
0.575 0.625 14.60 15.88
0.045 0.055 1.14 1.40
STYLE 3:
VARIABLE
CONFIGURATION
ZONE
PIN 1. ANODE
2. CATHODE
3. ANODE
N
P
R
4. CATHODE
U
L
L
L
M
M
M
F
F
F
VIEW W−W
1
VIEW W−W
2
VIEW W−W
3
SOLDERING FOOTPRINT*
8.38
0.33
1.016
0.04
10.66
0.42
5.08
0.20
3.05
0.12
17.02
0.67
mm
inches
ǒ
Ǔ
SCALE 3:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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5
MBRB4030
SWITCHMODE is a trademark of Semiconductor Components Industries, LLC.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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USA/Canada
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Order Literature: http://www.onsemi.com/litorder
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Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
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2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
For additional information, please contact your
local Sales Representative.
MBRB4030/D
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