MBRS3201PT3G [ONSEMI]
肖特基功率整流器，表面贴装，快速软启动，3.0 A，200 V;
| 型号： | MBRS3201PT3G |
| 厂家： | 
ONSEMI |
| 描述： | 肖特基功率整流器，表面贴装，快速软启动，3.0 A，200 V 软启动 |
| 文件： | 总5页 (文件大小：202K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MBRS3201P
200ꢀV, 3ꢀA Schottky
Fast Soft-Recovery
Power Rectifier
SMC Power Surface Mount Package
www.onsemi.com
Features
• Lower Forward Voltage than any Ultrafast Rectifier:
SCHOTTKY RECTIFIER
3 AMPS, 200 VOLTS
V < 0.59 V at 150°C
F
• Fast Switching Speed: Reverse Recovery Time (t ) < 35 ns
RR
• Soft Recovery Characteristics: Softness Factor (t /t ) ≥ 1
b a
• Highly Stable Over Temperature
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
SMC 2−LEAD
CASE 403AC
Benefits
• Significantly Reduced EMI
• Eliminates the Need of Snubber Circuits
• Low Switching and Heat Losses
• Improved Thermal Management
MARKING DIAGRAM
Applications
• Engine and Convenience Control Systems
• Motor Controls
• Battery Chargers and Switching Power Supplies
AYWW
B3xG
G
Mechanical Characteristics
B321
A
Y
WW
G
= Specific Device Code
= Assembly Location*
= Year
= Work Week
= Pb−Free Package
• Small Compact Surface Mount Package with J-Bend Leads
• Rectangular Package for Automated Handling
• Weight: 217 mg (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
(Note: Microdot may be in either location)
Leads are Readily Solderable
* The Assembly Location code (A) is front side
optional. In cases where the Assembly Location is
stamped in the package, the front side assembly
code may be blank.
• ESD Ratings:
♦ Machine Model = A
♦ Human Body Model = 1C
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Maximum for 10 Seconds
• Cathode Polarity Band
ORDERING INFORMATION
†
Device
Package
Shipping
MBRS3201PT3G
SMC 2−Lead
(Pb−Free)
2500 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2015
1
Publication Order Number:
August, 2017 − Rev. 2
MBRS3201P/D
MBRS3201P
MAXIMUM RATINGS
Characteristic
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
200
V
RRM
RWM
R
V
V
Average Rectified Forward Current (Rated V , T = 70°C)
I
F(AV)
3
A
A
R
C
Nonrepetitive Peak Surge Current
Operating Junction Temperature
I
100
FSM
T
J
−55 to +150
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Lead
Symbol
Value
12
Unit
°C/W
°C/W
R
q
JL
Thermal Resistance, Junction−to−Ambient
R
60
q
JA
ELECTRICAL CHARACTERISTICS
Characteristic
Symbol
Value
Unit
Maximum Instantaneous Forward Voltage
V
F
V
(I = 3 A, T = 25°C)
0.84
0.59
F
J
(I = 3 A, T = 150°C)
F
J
Maximum Instantaneous Reverse Current (Rated V )
I
R
R
(Rated DC Voltage, T = 25°C)
1.0
5.0
mA
mA
J
(Rated DC Voltage, T = 150°C)
J
Maximum Reverse Recovery Time
t
rr
ns
(I = 1 A, di/dt = 100 A/ms, V = 30 V)
35
F
R
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
TYPICAL CHARACTERISTICS
100
10
100
10
25°C
25°C
150°C
1.0
0.1
150°C
1.0
0.1
100°C
100°C
0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2
0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
1
1.1 1.2
V , INSTANTANEOUS VOLTAGE (V)
F
V , INSTANTANEOUS VOLTAGE (V)
F
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
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2
MBRS3201P
TYPICAL CHARACTERISTICS
1.0E−01
1.0E−02
1.0E−03
1.0E−04
1.0E−05
1.0E−06
1E−1
1E−2
1E−3
1E−4
1E−5
1E−6
1E−7
1E−8
1E−9
150°C
T
= 150°C
C
T
= 25°C
C
100°C
25°C
0
20 40 60 80 100 120 140 160 180 200
0
20 40 60 80 100 120 140 160 180 200
V , REVERSE VOLTAGE (V)
R
V , REVERSE VOLTAGE (V)
R
Figure 3. Typical Reverse Current
Figure 4. Maximum Reverse Current
1000
100
10
1.0
0
20 40 60 80 100 120 140 160 180 200
V , REVERSE VOLTAGE (V)
R
Figure 5. Typical Capacitance
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
7
6
5
DC
SQUARE
4
3
2
1
0
SQUAREWAVE
DC
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
80
90
100
110
120
130
140
150
160
I , AVERAGE FORWARD CURRENT
O
T , LEAD TEMPERATURE (°C)
L
Figure 6. Power Dissipation
Figure 7. Derating Curve
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3
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SMC 2−LEAD
CASE 403AC
ISSUE B
DATE 27 JUL 2017
SCALE 1:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH. MOLD
FLASH SHALL NOT EXCEED 0.254mm PER SIDE.
4. DIMENSIONS D AND E TO BE DETERMINED AT DATUM H.
5. DIMENSION b SHALL BE MEASURED WITHIN THE AREA
DETERMINED BY DIMENSION L.
HE
E
MILLIMETERS
INCHES
MIN
D
DIM
A
A1
A2
b
c
D
E
H
E
L
MIN
1.95
0.05
1.90
2.90
0.15
5.55
6.60
7.75
0.75
MAX
2.61
0.20
2.41
3.20
0.41
6.25
7.15
8.15
1.60
MAX
0.103
0.008
0.095
0.126
0.016
0.246
0.281
0.321
0.063
0.077
0.002
0.075
0.114
0.006
0.219
0.260
0.305
0.030
c
A1
DETAIL A
TOP VIEW
DETAIL A
A2
A
RECOMMENDED
L
b
SOLDERING FOOTPRINT*
SIDE VIEW
END VIEW
8.750
0.344
GENERIC
MARKING DIAGRAM*
3.790
0.149
2X
AYWW
XXXXG
G
2.250
0.089
mm
inches
ǒ
Ǔ SCALE 4:1
2X
XXXX = Specific Device Code
A
Y
WW
G
= Assembly Location
= Year
= Work Week
*For additional information on our Pb−Free strategy and soldering
details, please download the onsemi Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON97675F
SMC 2−LEAD
PAGE 1 OF 1
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