MBT3904DW1T3G [ONSEMI]

双 NPN 双极晶体管;
MBT3904DW1T3G
型号: MBT3904DW1T3G
厂家: ONSEMI    ONSEMI
描述:

双 NPN 双极晶体管

放大器 PC 光电二极管 小信号双极晶体管
文件: 总8页 (文件大小:138K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MBT3904DW1T1G,  
MBT3904DW2T1G,  
SMBT3904DW1T1G  
Dual General Purpose  
Transistors  
http://onsemi.com  
The MBT3904DW1T1G and MBT3904DW2T1G devices are a  
spinoff of our popular SOT23/SOT323 threeleaded device. It is  
designed for general purpose amplifier applications and is housed in  
the SOT363 sixleaded surface mount package. By putting two  
discrete devices in one package, this device is ideal for lowpower  
surface mount applications where board space is at a premium.  
MARKING  
DIAGRAM  
6
SOT363/SC88/  
SC706  
XX MG  
6
G
CASE 419B  
Features  
1
1
h , 100300  
FE  
XX=MA for MBT3904DW1T1G  
MJ for MBT3904DW2T1G  
M =Date Code  
Low V  
, 0.4 V  
CE(sat)  
Simplifies Circuit Design  
G
= PbFree Package  
Reduces Board Space  
(Note: Microdot may be in either location)  
Reduces Component Count  
Available in 8 mm, 7inch/3,000 Unit Tape and Reel  
(3)  
(2)  
(1)  
Q
S Prefix for Automotive and Other Applications Requiring Unique  
Site and Control Change Requirements; AECQ101 Qualified and  
PPAP Capable  
Q
1
2
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Compliant  
(4)  
(5)  
(6)  
MBT3904DW1T1  
STYLE 1  
MAXIMUM RATINGS  
Rating  
CollectorEmitter Voltage  
CollectorBase Voltage  
EmitterBase Voltage  
Symbol  
Value  
40  
Unit  
Vdc  
(3)  
(2)  
(1)  
V
CEO  
V
CBO  
V
EBO  
60  
Vdc  
Q
2
Q
1
6.0  
Vdc  
Collector Current Continuous  
Electrostatic Discharge  
I
200  
mAdc  
C
ESD  
HBM Class 2  
MM Class B  
(4)  
(5)  
(6)  
MBT3904DW2T1  
STYLE 27  
Stresses exceeding Maximum Ratings may damage the device. Maximum Rat-  
ings are stress ratings only. Functional operation above the Recommended Op-  
erating Conditions is not implied. Extended exposure to stresses above the Re-  
commended Operating Conditions may affect device reliability.  
ORDERING INFORMATION  
Device  
Shipping  
Package  
THERMAL CHARACTERISTICS  
MBT3904DW1T1G  
3000 /  
Tape & Reel  
SOT363  
(PbFree)  
Characteristic  
Symbol  
Max  
Unit  
Total Package Dissipation (Note 1)  
T = 25°C  
A
P
150  
mW  
D
SMBT3904DW1T1G SOT363  
(PbFree)  
3000 /  
Tape & Reel  
Thermal Resistance,  
JunctiontoAmbient  
R
833  
°C/W  
°C  
q
JA  
MBT3904DW2T1G  
3000 /  
Tape & Reel  
SOT363  
(PbFree)  
Junction and Storage  
Temperature Range  
T , T  
J
55 to +150  
stg  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
1. Device mounted on FR4 glass epoxy printed circuit board using the minimum  
recommended footprint.  
© Semiconductor Components Industries, LLC, 2012  
1
Publication Order Number:  
October, 2012 Rev. 9  
MBT3904DW1T1/D  
 
MBT3904DW1T1G, MBT3904DW2T1G, SMBT3904DW1T1G  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
A
Characteristic  
Symbol  
Min  
Max  
Unit  
OFF CHARACTERISTICS  
CollectorEmitter Breakdown Voltage (Note 2)  
(I = 1.0 mAdc, I = 0)  
V
Vdc  
Vdc  
(BR)CEO  
(BR)CBO  
(BR)EBO  
40  
60  
6.0  
C
B
CollectorBase Breakdown Voltage  
(I = 10 mAdc, I = 0)  
V
V
C
E
EmitterBase Breakdown Voltage  
(I = 10 mAdc, I = 0)  
Vdc  
E
C
Base Cutoff Current  
(V = 30 Vdc, V = 3.0 Vdc)  
I
BL  
nAdc  
nAdc  
50  
50  
CE  
EB  
Collector Cutoff Current  
(V = 30 Vdc, V = 3.0 Vdc)  
I
CEX  
CE  
EB  
ON CHARACTERISTICS (Note 2)  
DC Current Gain  
h
FE  
(I = 0.1 mAdc, V = 1.0 Vdc)  
40  
70  
C
CE  
(I = 1.0 mAdc, V = 1.0 Vdc)  
C
CE  
(I = 10 mAdc, V = 1.0 Vdc)  
100  
60  
300  
C
CE  
(I = 50 mAdc, V = 1.0 Vdc)  
C
CE  
(I = 100 mAdc, V = 1.0 Vdc)  
30  
C
CE  
CollectorEmitter Saturation Voltage  
(I = 10 mAdc, I = 1.0 mAdc)  
V
Vdc  
Vdc  
CE(sat)  
0.2  
0.3  
C
B
(I = 50 mAdc, I = 5.0 mAdc)  
C
B
BaseEmitter Saturation Voltage  
(I = 10 mAdc, I = 1.0 mAdc)  
V
BE(sat)  
0.65  
0.85  
0.95  
C
B
(I = 50 mAdc, I = 5.0 mAdc)  
C
B
SMALLSIGNAL CHARACTERISTICS  
CurrentGain Bandwidth Product  
f
MHz  
pF  
T
(I = 10 mAdc, V = 20 Vdc, f = 100 MHz)  
300  
C
CE  
Output Capacitance  
C
obo  
(V = 5.0 Vdc, I = 0, f = 1.0 MHz)  
4.0  
8.0  
CB  
E
Input Capacitance  
C
pF  
ibo  
(V = 0.5 Vdc, I = 0, f = 1.0 MHz)  
EB  
C
Input Impedance  
(V = 10 Vdc, I = 1.0 mAdc, f = 1.0 kHz)  
CE  
h
k W  
ie  
re  
fe  
1.0  
2.0  
10  
12  
C
4  
Voltage Feedback Ratio  
(V = 10 Vdc, I = 1.0 mAdc, f = 1.0 kHz)  
h
h
X 10  
0.5  
0.1  
8.0  
10  
CE  
C
SmallSignal Current Gain  
(V = 10 Vdc, I = 1.0 mAdc, f = 1.0 kHz)  
100  
100  
400  
400  
CE  
C
Output Admittance  
h
mmhos  
dB  
oe  
(V = 10 Vdc, I = 1.0 mAdc, f = 1.0 kHz)  
1.0  
3.0  
40  
60  
CE  
C
Noise Figure  
NF  
(V = 5.0 Vdc, I = 100 mAdc, R = 1.0 k W, f = 1.0 kHz)  
5.0  
4.0  
CE  
C
S
2. Pulse Test: Pulse Width 300 ms; Duty Cycle 2.0%.  
http://onsemi.com  
2
 
MBT3904DW1T1G, MBT3904DW2T1G, SMBT3904DW1T1G  
SWITCHING CHARACTERISTICS  
Characteristic  
(V = 3.0 Vdc, V = 0.5 Vdc)  
Symbol  
Min  
Max  
35  
Unit  
Delay Time  
Rise Time  
Storage Time  
Fall Time  
t
d
CC  
BE  
ns  
(I = 10 mAdc, I = 1.0 mAdc)  
t
r
35  
C
B1  
(V = 3.0 Vdc, I = 10 mAdc)  
t
s
200  
50  
CC  
C
ns  
(I = I = 1.0 mAdc)  
t
f
B1  
B2  
+3 V  
+3 V  
DUTY CYCLE = 2%  
300 ns  
t
1
10 < t < 500 ms  
1
+10.9 V  
DUTY CYCLE = 2%  
+10.9 V  
< 1 ns  
275  
275  
10 k  
10 k  
0
-ꢀ0.5 V  
C < 4 pF*  
s
C < 4 pF*  
s
1N916  
-ꢀ9.1 V′  
< 1 ns  
* Total shunt capacitance of test jig and connectors  
Figure 1. Delay and Rise Time  
Equivalent Test Circuit  
Figure 2. Storage and Fall Time  
Equivalent Test Circuit  
http://onsemi.com  
3
MBT3904DW1T1G, MBT3904DW2T1G, SMBT3904DW1T1G  
TYPICAL TRANSIENT CHARACTERISTICS  
T = 25°C  
J
T = 125°C  
J
10  
5000  
V
= 40 V  
CC  
I /I = 10  
3000  
2000  
7.0  
C B  
5.0  
1000  
700  
C
ibo  
500  
3.0  
2.0  
Q
T
300  
200  
C
obo  
Q
A
100  
70  
1.0  
0.1  
50  
0.2 0.3 0.5 0.7 1.0  
2.0 3.0 5.0 7.0 10  
20 30 40  
1.0  
2.0 3.0 5.0 7.0 10  
20 30 50 70 100  
200  
200  
200  
REVERSE BIAS VOLTAGE (VOLTS)  
I , COLLECTOR CURRENT (mA)  
C
Figure 3. Capacitance  
Figure 4. Charge Data  
500  
500  
I /I = 10  
C B  
V
= 40 V  
CC  
I /I = 10  
300  
200  
300  
200  
C B  
100  
70  
100  
70  
t @ V = 3.0 V  
r CC  
50  
50  
30  
20  
30  
20  
40 V  
15 V  
10  
10  
2.0 V  
7
5
7
5
t @ V = 0 V  
OB  
d
1.0  
2.0 3.0 5.0 7.0 10  
20 30 50 70 100  
200  
1.0  
2.0 3.0 5.0 7.0 10  
20 30 50 70 100  
I , COLLECTOR CURRENT (mA)  
C
I , COLLECTOR CURRENT (mA)  
C
Figure 5. TurnOn Time  
Figure 6. Rise Time  
500  
500  
1
t= t - / t  
8 f  
s
s
V
I
= 40 V  
CC  
300  
200  
300  
200  
I
= I  
B1 B2  
= I  
B1 B2  
I /I = 20  
C B  
I /I = 10  
C B  
I /I = 20  
C B  
100  
70  
100  
70  
I /I = 20  
C B  
50  
50  
I /I = 10  
C B  
I /I = 10  
C B  
30  
20  
30  
20  
10  
10  
7
5
7
5
1.0  
2.0 3.0 5.0 7.0 10  
20 30 50 70 100  
200  
1.0  
2.0 3.0 5.0 7.0 10  
20 30 50 70 100  
I , COLLECTOR CURRENT (mA)  
C
I , COLLECTOR CURRENT (mA)  
C
Figure 7. Storage Time  
Figure 8. Fall Time  
http://onsemi.com  
4
MBT3904DW1T1G, MBT3904DW2T1G, SMBT3904DW1T1G  
TYPICAL AUDIO SMALLSIGNAL CHARACTERISTICS  
NOISE FIGURE VARIATIONS  
(VCE = 5.0 Vdc, TA = 25°C, Bandwidth = 1.0 Hz)  
12  
10  
8
14  
SOURCE RESISTANCE = 200 W  
I = 1.0 mA  
f = 1.0 kHz  
I = 1.0 mA  
C
12  
10  
8
C
I = 0.5 mA  
C
SOURCE RESISTANCE = 200 W  
I = 0.5 mA  
I = 50 mA  
C
C
6
4
I = 100 mA  
C
SOURCE RESISTANCE = 1.0 k  
I = 50 mA  
6
4
2
0
C
2
0
SOURCE RESISTANCE = 500 W  
I = 100 mA  
C
0.1 0.2  
0.4  
1.0 2.0 4.0  
10  
20  
40  
100  
0.1 0.2  
0.4  
1.0 2.0  
4.0  
10  
20  
40  
100  
f, FREQUENCY (kHz)  
R , SOURCE RESISTANCE (k OHMS)  
S
Figure 9. Noise Figure  
Figure 10. Noise Figure  
h PARAMETERS  
(VCE = 10 Vdc, f = 1.0 kHz, TA = 25°C)  
300  
200  
100  
50  
20  
10  
5
100  
70  
50  
30  
2
1
0.1  
0.2 0.3  
0.5  
1.0  
2.0 3.0  
5.0  
10  
0.1  
0.2 0.3  
0.5  
1.0  
2.0 3.0  
5.0  
10  
I , COLLECTOR CURRENT (mA)  
C
I , COLLECTOR CURRENT (mA)  
C
Figure 11. Current Gain  
Figure 12. Output Admittance  
20  
10  
10  
7.0  
5.0  
5.0  
3.0  
2.0  
2.0  
1.0  
0.5  
1.0  
0.7  
0.5  
0.2  
0.1  
0.2 0.3  
0.5  
1.0  
2.0 3.0  
5.0  
10  
0.1  
0.2 0.3  
0.5  
1.0  
2.0 3.0  
5.0  
10  
I , COLLECTOR CURRENT (mA)  
C
I , COLLECTOR CURRENT (mA)  
C
Figure 13. Input Impedance  
Figure 14. Voltage Feedback Ratio  
http://onsemi.com  
5
MBT3904DW1T1G, MBT3904DW2T1G, SMBT3904DW1T1G  
TYPICAL STATIC CHARACTERISTICS  
2.0  
1.0  
T = +125°C  
J
V
CE  
= 1.0 V  
+25°C  
-ꢀ55°C  
0.7  
0.5  
0.3  
0.2  
0.1  
0.1  
0.2  
0.3  
0.5 0.7  
1.0  
2.0  
3.0  
5.0 7.0 10  
20  
30  
50  
70 100  
200  
I , COLLECTOR CURRENT (mA)  
C
Figure 15. DC Current Gain  
1.0  
0.8  
0.6  
0.4  
T = 25°C  
J
I = 1.0 mA  
C
10 mA  
30 mA  
100 mA  
0.2  
0
0.01  
0.02  
0.03  
0.05 0.07 0.1  
0.2  
0.3  
0.5  
0.7  
1.0  
2.0  
3.0  
5.0  
7.0  
10  
I , BASE CURRENT (mA)  
B
Figure 16. Collector Saturation Region  
1.2  
1.0  
0.8  
1.0  
T = 25°C  
J
V
@ I /I =10  
C B  
BE(sat)  
+25°C TO +125°C  
-ꢀ55°C TO +25°C  
0.5  
0
q
FOR V  
CE(sat)  
VC  
V
BE  
@ V =1.0 V  
CE  
0.6  
0.4  
-ꢀ0.5  
-ꢀ1.0  
-ꢀ55°C TO +25°C  
+25°C TO +125°C  
V
@ I /I =10  
C B  
CE(sat)  
q
FOR V  
BE(sat)  
VB  
0.2  
0
-ꢀ1.5  
-ꢀ2.0  
1.0  
2.0  
5.0  
10  
20  
50  
100  
200  
0
20  
40  
60  
80 100 120 140 160 180 200  
I , COLLECTOR CURRENT (mA)  
C
I , COLLECTOR CURRENT (mA)  
C
Figure 17. “ON” Voltages  
Figure 18. Temperature Coefficients  
http://onsemi.com  
6
MBT3904DW1T1G, MBT3904DW2T1G, SMBT3904DW1T1G  
TYPICAL STATIC CHARACTERISTICS  
1000  
1
10 mSec  
100 mSec  
V
= 1 V  
CE  
T = 25°C  
A
1.0 mSec  
0.1  
1.0 Sec  
100  
10  
Thermal  
Limit  
0.01  
0.001  
0.1  
1
10  
100  
1000  
1
10  
, COLLECTOR EMITTER VOLTAGE (V)  
CE  
100  
I , COLLECTOR CURRENT (mA)  
V
C
Figure 19. Current Gain Bandwidth Product  
Figure 20. Safe Operating Area  
http://onsemi.com  
7
MBT3904DW1T1G, MBT3904DW2T1G, SMBT3904DW1T1G  
PACKAGE DIMENSIONS  
SOT363/SC88/SC706  
CASE 419B02  
ISSUE W  
D
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
e
2. CONTROLLING DIMENSION: INCH.  
3. 419B01 OBSOLETE, NEW STANDARD 419B02.  
6
1
5
2
4
3
MILLIMETERS  
DIM MIN NOM MAX  
0.80  
INCHES  
NOM MAX  
1.10 0.031 0.037 0.043  
0.10 0.000 0.002 0.004  
0.008 REF  
MIN  
H
E−  
A
0.95  
0.05  
E
A1 0.00  
A3  
0.20 REF  
0.21  
0.14  
2.00  
1.25  
0.65 BSC  
0.20  
2.10  
b
C
D
E
e
0.10  
0.10  
1.80  
1.15  
0.30 0.004 0.008 0.012  
0.25 0.004 0.005 0.010  
2.20 0.070 0.078 0.086  
1.35 0.045 0.049 0.053  
0.026 BSC  
0.30 0.004 0.008 0.012  
2.20 0.078 0.082 0.086  
b 6 PL  
M
M
E
0.2 (0.008)  
L
0.10  
2.00  
H
E
A3  
STYLE 1:  
STYLE 27:  
PIN 1. EMITTER 2  
2. BASE 2  
PIN 1. BASE 2  
2. BASE 1  
C
3. COLLECTOR 1  
4. EMITTER 1  
5. BASE 1  
3. COLLECTOR 1  
4. EMITTER 1  
5. EMITTER 2  
6. COLLECTOR 2  
A
6. COLLECTOR 2  
A1  
L
SOLDERING FOOTPRINT*  
0.50  
0.0197  
0.65  
0.025  
0.65  
0.025  
0.40  
0.0157  
1.9  
0.0748  
mm  
inches  
ǒ
Ǔ
SCALE 20:1  
*For additional information on our PbFree strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 8002829855 Toll Free  
USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
Japan Customer Focus Center  
Phone: 81358171050  
ON Semiconductor Website: www.onsemi.com  
Order Literature: http://www.onsemi.com/orderlit  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
Phone: 3036752175 or 8003443860 Toll Free USA/Canada  
Fax: 3036752176 or 8003443867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
For additional information, please contact your local  
Sales Representative  
MBT3904DW1T1/D  

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