MC100E336 [ONSEMI]

3-BIT REGISTERED BUS TRANSCEIVER; 3位寄存总线收发器
MC100E336
型号: MC100E336
厂家: ONSEMI    ONSEMI
描述:

3-BIT REGISTERED BUS TRANSCEIVER
3位寄存总线收发器

总线收发器
文件: 总4页 (文件大小:117K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SEMICONDUCTOR TECHNICAL DATA  
The MC10E/MC100E336 contains three bus transceivers with both  
transmit and receive registers. The bus outputs (BUS0–BUS2) are  
specified for driving a 25bus; the receive outputs (Q0 – Q2) are  
specified for 50. The bus outputs feature a normal HIGH level (V  
) and  
OH  
a cutoff LOW level — when LOW, the outputs go to –2.0V and the output  
emitter-follower is “off”, presenting a high impedance to the bus. The bus  
outputs also feature edge slow-down capacitors.  
3-BIT REGISTERED  
BUS TRANSCEIVER  
25Cutoff Bus Outputs  
50Receiver Outputs  
Transmit and Receive Registers  
1500ps Max. Clock to Bus  
1000ps Max. Clock to Q  
Bus Outputs Feature Internal Edge Slow-Down Capacitors  
Additional Package Ground Pins  
Extended 100E V  
EE  
Range of – 4.2V to – 5.46V  
75kInput Pulldown Resistors  
The Transmit Enable pins (TEN) control whether current data is held in  
the transmit register, or new data is loaded from the A/B inputs. A LOW on  
both of the Bus Enable inputs (BUSEN), when clocked through the  
register, disables the bus outputs to –2.0V.  
FN SUFFIX  
PLASTIC PACKAGE  
CASE 776-02  
The receiver section clocks bus data into the receive registers, after  
gating with the Receive Enable (RXEN) input.  
All registers are clocked by a positive transition of CLK1 or CLK2 (or  
both).  
Additional leadframe grounding is provided through the Ground pins (GND) which should be connected to 0V. The GND pins  
are not electrically connected to the chip.  
LOGIC DIAGRAM  
Pinout: 28-Lead PLCC (Top View)  
TEN2 TEN1  
B
A
NC  
V
Q
2
2
2
CCO  
0
1
D Q  
D Q  
D Q  
25  
25  
25  
CUTOFF  
A
B
BUS0  
0
0
25 24  
23  
22  
21  
20  
19  
BUSEN1  
BUSEN2  
RXEN  
26  
27  
28  
1
18  
17  
16  
15  
14  
13  
12  
GND  
D
50  
Q
0
Q
BUS2  
0
1
V
CC  
CUTOFF  
A
B
BUS1  
1
1
V
Q
EE  
1
D
50  
Q
1
Q
CLK1  
CLK2  
2
V
CCO  
0
1
3
BUS1  
GND  
CUTOFF  
A
B
2
2
BUS2  
A
4
0
D
50  
Q
2
Q
5
6
7
8
9
10  
11  
TEN1  
TEN2  
B
A
B
V
BUS0 GND  
Q
0
0
1
1
CCO  
RXEN  
* All V  
and V pins are tied together on the die.  
CCO  
CC  
BUSEN1  
BUSEN2  
D
Q
CLK1  
CLK2  
12/93  
Motorola, Inc. 1996  
REV 2  
MC10E336 MC100E336  
DC CHARACTERISTICS (V  
= V (min) to V (max); V  
= V  
= GND)  
CCO  
EE  
EE  
EE  
0°C  
typ  
CC  
25°C  
85°C  
Symbol  
Characteristic  
Cut-off Output Voltage  
Input HIGH Current  
min  
max  
min  
typ  
max  
min  
typ  
max  
Unit Condition  
1
V
CUT  
– 2.10  
– 2.03 – 2.10  
– 2.03 – 2.10  
– 2.03  
V
I
IH  
µA  
RXEN  
All Other Inputs  
225  
150  
225  
150  
225  
150  
I
Power Supply Current  
mA  
EE  
10E  
100E  
125  
125  
150  
150  
125  
125  
150  
150  
125  
144  
150  
173  
1. Measured with V = – 2.10V  
TT  
AC CHARACTERISTICS (V  
= V (min) to V (max); V  
EE EE  
= V  
= GND)  
CCO  
EE  
CC  
0°C  
25°C  
85°C  
Symbol  
Characteristic  
min  
typ  
max  
min  
typ  
max  
min  
typ  
max Unit Condition  
t
Propagation Delay to Output  
Clk to Q  
ps  
PLH  
PHL  
t
500  
825  
700  
100  
500  
700  
1000 500  
700  
1000  
Clk to BUS  
1250 1800 825  
1250 1800 825  
1250 1800  
t
Setup Time  
BUS, RXEN  
BUSEN  
ps  
ps  
s
150  
–150  
150  
–150  
150  
–150  
100 – 200  
100 – 200  
100 – 200  
A, B Data  
300  
450  
– 50  
150  
300  
450  
– 50  
150  
300  
450  
– 50  
150  
TEN  
t
h
Hold Time  
BUS, RXEN  
BUSEN  
450  
500  
350  
200  
150  
200  
50  
450  
500  
350  
200  
150  
200  
50  
450  
500  
350  
200  
150  
200  
50  
A, B Data  
TEN  
–150  
–150  
–150  
t
Minimum Pulse Width  
Clk  
ps  
ps  
PW  
400  
400  
300  
400  
300  
t
r
t
f
Rise/Fall Times  
20 - 80% (Qn)  
20 - 80% (BUSn Rise)  
20 - 80% (BUSn Fall)  
300  
500  
300  
450  
800  
500  
700  
450  
800  
500  
700  
450  
800  
500  
700  
1000  
800  
1000 500  
800 300  
1000 500  
800 300  
MOTOROLA  
2–2  
MC10E336 MC100E336  
OUTLINE DIMENSIONS  
FN SUFFIX  
PLASTIC PLCC PACKAGE  
CASE 776–02  
ISSUE D  
M
S
S
0.007 (0.180)  
T
L –M  
N
B
Z
Y BRK  
D
-N-  
M
S
S
0.007 (0.180)  
T
L –M  
N
U
-L-  
-M-  
D
W
X
G1  
S
S
S
0.010 (0.250)  
0.007 (0.180)  
T
L –M  
L –M  
N
V
28  
1
VIEW D-D  
M
M
S
S
S
0.007 (0.180)  
0.007 (0.180)  
T
T
L –M  
L –M  
N
A
R
H
M
S
S
T
N
Z
S
N
K1  
C
E
0.004 (0.100)  
SEATING  
PLANE  
G
K
-T-  
VIEW S  
J
M
S
S
0.007 (0.180)  
T
L –M  
N
F
G1  
VIEW S  
S
S
S
0.010 (0.250)  
T
L –M  
N
NOTES:  
1. DATUMS -L-, -M-, AND -N- DETERMINED  
WHERE TOP OF LEAD SHOULDER EXITS  
PLASTIC BODY AT MOLD PARTING LINE.  
2. DIM G1, TRUE POSITION TO BE MEASURED  
AT DATUM -T-, SEATING PLANE.  
INCHES  
MAX  
MILLIMETERS  
3. DIM R AND U DO NOT INCLUDE MOLD FLASH.  
ALLOWABLE MOLD FLASH IS 0.010 (0.250)  
PER SIDE.  
4. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
DIM  
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1  
K1  
MIN  
MIN  
12.32  
12.32  
4.20  
MAX  
12.57  
12.57  
4.57  
0.485  
0.495  
0.495  
0.180  
0.110  
0.019  
0.485  
0.165  
0.090  
0.013  
2.29  
2.79  
5. CONTROLLING DIMENSION: INCH.  
6. THE PACKAGE TOP MAY BE SMALLER THAN  
THE PACKAGE BOTTOM BY UP TO 0.012  
(0.300). DIMENSIONS R AND U ARE  
DETERMINED AT THE OUTERMOST  
EXTREMES OF THE PLASTIC BODY  
EXCLUSIVE OF MOLD FLASH, TIE BAR  
BURRS, GATE BURRS AND INTERLEAD  
FLASH, BUT INCLUDING ANY MISMATCH  
BETWEEN THE TOP AND BOTTOM OF THE  
PLASTIC BODY.  
7. DIMENSION H DOES NOT INCLUDE DAMBAR  
PROTRUSION OR INTRUSION. THE DAMBAR  
PROTRUSION(S) SHALL NOT CAUSE THE H  
DIMENSION TO BE GREATER THAN 0.037  
(0.940). THE DAMBAR INTRUSION(S) SHALL  
NOT CAUSE THE H DIMENSION TO BE  
SMALLER THAN 0.025 (0.635).  
0.33  
0.48  
0.050 BSC  
1.27 BSC  
0.026  
0.032  
0.456  
0.456  
0.048  
0.048  
0.056  
0.020  
0.66  
0.51  
0.64  
11.43  
11.43  
1.07  
1.07  
1.07  
0.81  
11.58  
11.58  
1.21  
1.21  
1.42  
0.50  
0.020  
0.025  
0.450  
0.450  
0.042  
0.042  
0.042  
2
°
10°  
2°  
10°  
0.410  
0.040  
0.430  
10.42  
1.02  
10.92  
2–3  
MOTOROLA  
MC10E336 MC100E336  
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and  
specificallydisclaims any and all liability, includingwithoutlimitationconsequentialorincidentaldamages. “Typical” parameters which may be provided in Motorola  
datasheetsand/orspecificationscananddovaryindifferentapplicationsandactualperformancemayvaryovertime. Alloperatingparameters,includingTypicals”  
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of  
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other  
applicationsintended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury  
ordeathmayoccur. ShouldBuyerpurchaseoruseMotorolaproductsforanysuchunintendedorunauthorizedapplication,BuyershallindemnifyandholdMotorola  
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees  
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that  
Motorola was negligent regarding the design or manufacture of the part. Motorola and  
Opportunity/Affirmative Action Employer.  
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal  
How to reach us:  
USA/EUROPE/Locations Not Listed: Motorola Literature Distribution;  
JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center,  
P.O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 or 602–303–5454  
3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–81–3521–8315  
MFAX: RMFAX0@email.sps.mot.com – TOUCHTONE 602–244–6609  
INTERNET: http://Design–NET.com  
ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park,  
51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298  
MC10E336/D  

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