MC100E445 [ONSEMI]

5V ECL 4-Bit Serial/Parallel Converter; 5V ECL 4位串行/并行转换器
MC100E445
型号: MC100E445
厂家: ONSEMI    ONSEMI
描述:

5V ECL 4-Bit Serial/Parallel Converter
5V ECL 4位串行/并行转换器

转换器
文件: 总13页 (文件大小:156K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MC10E445, MC100E445  
5VꢀECL 4-Bit Serial/Parallel  
Converter  
Description  
The MC10/100E445 is an integrated 4-bit serial to parallel data  
converter. The device is designed to operate for NRZ data rates of up to  
2.0 Gb/s. The chip generates a divide by 4 and a divide by 8 clock for  
both 4-bit conversion and a two chip 8-bit conversion function. The  
conversion sequence was chosen to convert the first serial bit to Q0, the  
second to Q1 etc.  
Two selectable serial inputs provide a loopback capability for testing  
purposes when the device is used in conjunction with the E446 parallel to  
serial converter.  
http://onsemi.com  
PLCC28  
FN SUFFIX  
CASE 776  
The start bit for conversion can be moved using the SYNC input. A  
single pulse applied asynchronously for at least two input clock cycles  
shifts the start bit for conversion from Qn to Qn1. For each additional  
shift required an additional pulse must be applied to the SYNC input.  
Asserting the SYNC input will force the internal clock dividers to  
“swallow” a clock pulse, effectively shifting a bit from the Qn to the Qn1  
output (see Timing Diagram B).  
The MODE input is used to select the conversion mode of the device.  
With the MODE input LOW, or open, the device will function as a 4-bit  
converter. When the mode input is driven HIGH the data on the output will  
change on every eighth clock cycle thus allowing for an 8-bit conversion  
scheme using two E445’s. When cascaded in an 8-bit conversion scheme  
the devices will not operate at the 2.0 Gb/s data rate of a single device.  
Refer to the applications section of this data sheet for more information on  
cascading the E445.  
MARKING DIAGRAM*  
1 28  
MCxxxE445FNG  
AWLYYWW  
xxx  
A
WL  
YY  
WW  
G
= 10 or 100  
= Assembly Location  
= Wafer Lot  
= Year  
= Work Week  
= PbFree Package  
Upon power-up the internal flip-flops will attain a random state. To  
synchronize multiple E445’s in a system the master reset must be asserted.  
The V pin, an internally generated voltage supply, is available to this  
BB  
*For additional marking information, refer to  
Application Note AND8002/D.  
device only. For single-ended input conditions, the unused differential  
input is connected to V as a switching reference voltage. V may also  
BB  
BB  
rebias AC coupled inputs. When used, decouple V and V via a  
BB  
CC  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 11 of this data sheet.  
0.01 mF capacitor and limit current sourcing or sinking to 0.5 mA. When  
not used, V should be left open.  
BB  
The 100 Series contains temperature compensation.  
Features  
On-Chip Clock ÷4 and ÷8  
ESD Protection: Human Body Model; > 2 kV,  
Machine Model; > 100 V  
2.0 Gb/s Data Rate Capability  
Differential Clock and Serial Inputs  
Meets or Exceeds JEDEC Spec EIA/JESD78  
IC Latchup Test  
Moisture Sensitivity Level: Pb = 1; PbFree = 3  
For Additional Information, see Application Note  
AND8003/D  
Flammability Rating: UL 94 V0 @ 0.125 in,  
Oxygen Index: 28 to 34  
Transistor Count = 528 devices  
V Output for Single-Ended Input Applications  
BB  
Asynchronous Data Synchronization  
Mode Select to Expand to 8-Bits  
PECL Mode Operating Range: V = 4.2 V to 5.7 V  
CC  
with V = 0 V  
EE  
NECL Mode Operating Range: V = 0 V  
CC  
PECL Mode Operating Range: V = 4.2 V to 5.7 V  
CC  
with V = 4.2 V to 5.7 V  
EE  
with V = 0 V  
EE  
Internal Input 50 kW Pulldown Resistors  
PbFree Packages are Available*  
*For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting  
Techniques Reference Manual, SOLDERRM/D.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
November, 2006 Rev. 12  
MC10E445/D  
MC10E445, MC100E445  
Table 1. PIN DESCRIPTION  
SINA SINA  
MODE NC V  
CCO  
PIN  
FUNCTION  
25 24 23 22 21 20 19  
18  
SINA, SINA  
SINB, SINB  
SEL  
ECL Differential Serial Data Input A  
ECL Differential Serial Data Input B  
ECL Serial Input Selector Pin  
ECL Parallel Data Outputs  
ECL Differential Clock Inputs  
ECL Differential ÷4 Clock Output  
ECL Differential ÷8 Clock Output  
ECL Conversion Mode 4-Bit/8-Bit  
ECL Conversion Synchronizing Input  
Reference Voltage Output  
Positive Supply  
SINB 26  
SINB 27  
SEL 28  
SOUT  
SOUT  
17  
16  
15  
14  
13  
12  
Q0Q3  
CLK, CLK  
CL/4, CL/4  
CL/8, CL/8  
MODE  
V
CC  
MC10E445  
V
1
2
3
4
Q0  
Q1  
V
EE  
SYNCH  
CLK  
CLK  
V
V
V
BB  
CC  
EE  
, V  
CCO  
CCO  
Negative Supply  
NC  
No Connect  
V
Q2  
BB  
5
6
7
8
9
10 11  
CL/8 CL/8 V  
CL/4 CL/4 V Q3  
CCO  
CCO  
* All V and V  
pins are tied together on the die.  
CCO  
CC  
Warning: All V , V  
, and V pins must be externally con-  
CCO EE  
CC  
nected to Power Supply to guarantee proper operation.  
Figure 1. Pinout: PLCC28 (Top View)  
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2
MC10E445, MC100E445  
SINB  
SINB  
SINA  
D
Q
D
D
D
D
Q
Q
Q
Q
Q3  
Q2  
SINA  
SEL  
D
D
D
Q
Q
Q
Q1  
Q0  
SOUT  
SOUT  
1
0
MODE  
CL/4  
CL/4  
Out  
÷4  
CLK  
CLK  
InOut  
Latch  
R
EN  
CL/8  
CL/8  
Out  
÷2  
D
Q
D
SYNC  
R
Q
RESET  
V
BB  
Figure 2. Logic Diagram  
Table 2. FUNCTION TABLES  
Mode  
Conversion  
SEL  
Serial Input  
L
H
4-Bit  
8-Bit  
H
L
A
B
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3
MC10E445, MC100E445  
Table 3. MAXIMUM RATINGS  
Symbol  
Parameter  
Condition 1  
Condition 2  
Rating  
Unit  
V
V
PECL Mode Power Supply  
V
= 0 V  
8
V
CC  
I
EE  
PECL Mode Input Voltage  
NECL Mode Input Voltage  
V
V
= 0 V  
= 0 V  
V V  
6
6  
V
V
EE  
CC  
I
CC  
V V  
I
EE  
I
I
Output Current  
Continuous  
Surge  
50  
100  
mA  
mA  
out  
V
Sink/Source  
BB  
± 0.5  
mA  
°C  
BB  
T
Operating Temperature Range  
Storage Temperature Range  
0 to +85  
A
T
65 to +150  
°C  
stg  
q
Thermal Resistance (JunctiontoAmbient) 0 lfpm  
500 lfpm  
PLCC28  
PLCC28  
63.5  
43.5  
°C/W  
°C/W  
JA  
q
Thermal Resistance (JunctiontoCase)  
Standard Board  
PLCC28  
22 to 26  
°C/W  
°C  
JC  
T
sol  
Wave Solder  
Pb  
PbFree  
265  
265  
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the  
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect  
device reliability.  
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4
MC10E445, MC100E445  
Table 4. 10E SERIES PECL DC CHARACTERISTICS V  
= 5.0 V; V = 0.0 V (Note 1)  
EE  
CCx  
0°C  
25°C  
Typ  
85°C  
Typ  
Symbol  
Characteristic  
Power Supply Current  
Min  
Typ  
154  
Max  
185  
Min  
Max  
185  
Min  
Max  
185  
Unit  
mA  
mV  
mV  
mV  
mV  
mV  
V
I
154  
154  
EE  
V
Output HIGH Voltage (Note 2)  
Output HIGH Voltage sout/sout  
Output LOW Voltage (Note 2)  
Input HIGH Voltage (SingleEnded)  
Input LOW Voltage (SingleEnded)  
Output Voltage Reference  
3980  
3975  
3050  
3830  
3050  
3.62  
2.2  
4070  
4160  
4170  
3370  
4160  
3520  
3.74  
4.6  
4020  
3975  
3050  
3870  
3050  
3.65  
2.2  
4105  
4190  
4170  
3370  
4190  
3520  
3.75  
4.6  
4090  
3975  
3050  
3940  
3050  
3.69  
2.2  
4185  
4280  
4170  
3405  
4280  
3555  
3.81  
4.6  
OH  
VOH  
sout  
V
V
V
V
V
3210  
3995  
3285  
3210  
4030  
3285  
3227  
4110  
3302  
OL  
IH  
IL  
BB  
Input HIGH Voltage Common Mode  
Range (Differential Configuration)  
(Note 3)  
V
IHCMR  
I
I
Input HIGH Current  
Input LOW Current  
150  
150  
150  
mA  
mA  
IH  
IL  
0.5  
0.3  
0.5  
0.25  
0.3  
0.2  
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
1. Input and output parameters vary 1:1 with V . V can vary 0.46 V / +0.06 V.  
CC  
EE  
2. Outputs are terminated through a 50 W resistor to V 2.0 V.  
CC  
3. V  
min varies 1:1 with V , max varies 1:1 with V  
.
IHCMR  
EE  
CC  
Table 5. 10E SERIES NECL DC CHARACTERISTICS V  
= 0.0 V; V = 5.0 V (Note 4)  
EE  
CCx  
0°C  
Typ  
154  
25°C  
Typ  
85°C  
Typ  
Symbol  
Characteristic  
Power Supply Current  
Min  
Max  
185  
Min  
Max  
185  
Min  
Max  
185  
Unit  
mA  
mV  
mV  
I
154  
154  
EE  
V
Output HIGH Voltage (Note 5)  
Output HIGH Voltage sout/sout  
Output LOW Voltage (Note 5)  
Input HIGH Voltage (SingleEnded)  
Input LOW Voltage (SingleEnded)  
Output Voltage Reference  
1020 930  
1025  
840  
980  
895  
810  
910  
815  
720  
830  
OH  
VOH  
830 1025  
830 1025  
sout  
V
V
V
V
V
1950 1790 1630 1950 1790 1630 1950 1773 1595 mV  
1170 1005 840 1130 970 810 1060 970 720 mV  
1950 1715 1480 1950 1715 1480 1950 1698 1445 mV  
OL  
IH  
IL  
1.38  
2.8  
1.27 1.35  
1.25 1.31  
1.19  
0.4  
V
V
BB  
Input HIGH Voltage Common Mode  
Range (Differential Configuration)  
(Note 6)  
0.4  
2.8  
0.4  
2.8  
IHCMR  
I
I
Input HIGH Current  
Input LOW Current  
150  
150  
150  
mA  
mA  
IH  
IL  
0.5  
0.3  
0.5  
0.065  
0.3  
0.2  
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
4. Input and output parameters vary 1:1 with V . V can vary 0.46 V / +0.06 V.  
CC  
EE  
5. Outputs are terminated through a 50 W resistor to V 2.0 V.  
CC  
6. V  
min varies 1:1 with V , max varies 1:1 with V  
.
IHCMR  
EE  
CC  
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5
 
MC10E445, MC100E445  
Table 6. 100E SERIES PECL DC CHARACTERISTICS V  
= 5.0 V; V = 0.0 V (Note 7)  
EE  
CCx  
0°C  
25°C  
Typ  
85°C  
Typ  
177  
Symbol  
Characteristic  
Power Supply Current  
Min  
Typ  
154  
Max  
185  
Min  
Max  
185  
Min  
Max  
Unit  
mA  
mV  
mV  
mV  
mV  
mV  
V
I
154  
212  
EE  
V
Output HIGH Voltage (Note 8)  
Output HIGH Voltage sout/sout  
Output LOW Voltage (Note 8)  
Input HIGH Voltage (SingleEnded)  
Input LOW Voltage (SingleEnded)  
Output Voltage Reference  
3975  
3975  
3190  
3835  
3190  
3.62  
2.2  
4050  
4120  
4170  
3380  
4120  
3525  
3.74  
4.6  
3975  
3975  
3190  
3835  
3190  
3.62  
2.2  
4050  
4120  
4170  
3380  
4120  
3525  
3.74  
4.6  
3975 4050 4120  
3975 4170  
OH  
VOH  
sout  
V
V
V
V
V
3295  
3975  
3355  
3255  
3975  
3355  
3190 3260 3380  
3835 3975 4120  
3190 3355 3525  
OL  
IH  
IL  
3.62  
2.2  
3.74  
4.6  
BB  
Input HIGH Voltage Common Mode Range  
(Differential Configuration Configuration)  
(Note 9)  
V
IHCMR  
I
I
Input HIGH Current  
Input LOW Current  
150  
150  
150  
mA  
mA  
IH  
IL  
0.5  
0.3  
0.5  
0.25  
0.5  
0.2  
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
7. Input and output parameters vary 1:1 with V . V can vary 0.46 V / +0.8 V.  
CC  
EE  
8. Outputs are terminated through a 50 W resistor to V 2.0 V.  
CC  
9. V  
min varies 1:1 with V , max varies 1:1 with V  
.
IHCMR  
EE  
CC  
Table 7. 100E SERIES NECL DC CHARACTERISTICS V  
= 0.0 V; V = 5.0 V (Note 10)  
EE  
CCx  
0°C5  
Typ  
154  
25°C  
Typ  
154  
85°C  
Typ  
177  
Symbol  
Characteristic  
Power Supply Current  
Min  
Max  
Min  
Max  
Min  
Max  
212  
Unit  
mA  
mV  
mV  
I
185  
185  
EE  
V
Output HIGH Voltage (Note 11)  
Output HIGH Voltage sout/sout  
Output LOW Voltage (Note 11)  
Input HIGH Voltage (SingleEnded)  
Input LOW Voltage (SingleEnded)  
Output Voltage Reference  
1025 950  
1025  
880 1025 950  
830 1025  
880 1025 950  
830 1025  
880  
830  
OH  
VOH  
sout  
V
V
V
V
V
1810 1705 1620 1810 1745 1620 1810 1740 1620 mV  
1165 1025 880 1165 1025 880 1165 1025 880 mV  
1810 1645 1475 1810 1645 1475 1810 1645 1475 mV  
OL  
IH  
IL  
1.38  
2.8  
1.26 1.38  
1.26 1.38  
1.26  
0.4  
V
V
BB  
Input HIGH Voltage Common Mode  
Range (Differential) Configuration  
(Note 12)  
0.4  
2.8  
0.4  
2.8  
IHCMR  
I
I
Input HIGH Current  
Input LOW Current  
150  
150  
150  
mA  
mA  
IH  
IL  
0.5  
0.3  
0.5  
0.25  
0.5  
0.2  
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification  
limit values are applied individually under normal operating conditions and not valid simultaneously.  
10.Input and output parameters vary 1:1 with V . V can vary 0.46 V / +0.8 V.  
CC  
EE  
11. Outputs are terminated through a 50 W resistor to V 2.0 V.  
CC  
12.V  
min varies 1:1 with V , max varies 1:1 with V  
.
IHCMR  
EE  
CC  
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6
 
MC10E445, MC100E445  
Table 8. AC CHARACTERISTICS V  
= 5.0 V; V = 0.0 V or V  
= 0.0 V; V = 5.0 V (Note 13)  
CCx EE  
CCx  
EE  
0°C  
25°C  
85°C  
Symbol  
Characteristic  
Min  
Typ  
Max  
Min  
Typ  
Max  
Min  
Typ  
Max  
Unit  
f
Maximum Conversion Frequency  
2.0  
2.0  
2.0  
Gb/s  
NRZ  
MAX  
t
t
Propagation Delay to Output  
CLK to Q, Reset to Q  
CLK to SOUT (Diff)  
CLK to CL/4(Diff)  
ps  
PLH  
PHL  
1500  
800  
1100  
1100  
1800  
975  
1325  
1325  
2100  
1150  
1550  
1550  
1500  
800  
1100  
1100  
1800  
975  
1325  
1325  
2100  
1150  
1550  
1550  
1500  
800  
1100  
1100  
1800  
975  
1325  
1325  
2100  
1150  
1550  
1550  
CLK to CL/8(Diff)  
t
t
Setup Time  
SINA, SINB  
SEL  
ps  
ps  
s
100 250  
100 250  
100 250  
0
200  
0
200  
0
200  
Hold Time  
h
SINA, SINB, SEL  
450  
500  
300  
300  
450  
500  
300  
300  
450  
500  
300  
300  
t
t
Reset Recovery Time  
ps  
ps  
RR  
Minimum Pulse Width  
CLK, MR  
PW  
400  
150  
400  
150  
400  
150  
t
Random Clock Jitter (RMS)  
< 1  
< 1  
< 1  
ps  
JITTER  
V
Input Voltage Swing  
(Differential Configuration)  
1000  
1000  
1000  
mV  
PP  
t
t
Rise/Fall Times 20%80%  
ps  
r
f
SOUT  
Other  
100  
200  
225  
425  
350  
650  
100  
200  
225  
425  
350  
650  
100  
200  
225  
425  
350  
650  
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
13.10 Series: V can vary 0.46 V / +0.06 V.  
EE  
100 Series: V can vary 0.46 V / +0.8 V.  
EE  
14.Devices are designed to meet the AC specifications shown in the above table, after thermal equilibrium has been established. The circuit  
is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 lfpm is maintained.  
tRR  
Reset  
CLK / CLK  
Figure 3.  
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MC10E445, MC100E445  
CLK  
SIN  
Dn-4  
Dn-3  
Dn-2  
Dn-1  
Dn  
Dn+1 Dn+2 Dn+3  
RESET  
Q0  
Dn-4  
Dn-3  
Dn-2  
Dn-1  
Dn  
Q1  
Dn+1  
Q2  
Dn+2  
Q3  
Dn+3  
SOUT  
CL/4  
CL/8  
Dn-4  
Dn-3  
Dn-2  
Dn-1  
Dn  
Dn+1 Dn+2 Dn+3  
Timing Diagram A. 1:4 Serial to Parallel Conversion  
CLK  
SIN  
Dn-4  
Dn-3  
Dn-2  
Dn-1  
Dn  
Dn+1 Dn+2 Dn+3 Dn+4  
RESET  
SYNC  
Q0  
Dn-4  
Dn-3  
Dn-2  
Dn-1  
Dn+1  
Q1  
Dn+2  
Q2  
Dn+3  
Q3  
Dn+4  
SOUT  
CL/4  
CL/8  
Dn-4  
Dn-3  
Dn-2  
Dn-1  
Dn  
Dn+1 Dn+2 Dn+3 Dn+4  
Timing Diagram B. 1:4 Serial to Parallel Conversion With SYNC Pulse  
Figure 4. Timing Diagrams  
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MC10E445, MC100E445  
APPLICATIONS INFORMATION  
CLOCK  
CLOCK  
The MC10E/100E445 is an integrated 1:4 serial to parallel  
converter. The chip is designed to work with the E446 device  
to provide both transmission and receiving of a high speed  
serial data path. The E445, can convert up to a 2.0 Gb/s NRZ  
data stream into 4-bit parallel data. The device also provides  
a divide by four clock output to be used to synchronize the  
parallel data with the rest of the system.  
E445a  
E445b  
SERIAL  
INPUT  
DATA  
SIN  
SIN  
SOUT  
SOUT  
SIN  
SIN  
Q3 Q2 Q1 Q0  
Q3 Q2 Q1 Q0  
The E445 features multiplexed dual serial inputs to  
provide test loop capability when used in conjunction with  
the E446. Figure 5 illustrates the loop test architecture. The  
architecture allows for the electrical testing of the link  
without requiring actual transmission over the serial data  
path medium. The SINA serial input of the E445 has an extra  
buffer delay and thus should be used as the loop back serial  
input.  
Q7 Q6 Q5 Q4  
Q3 Q2 Q1 Q0  
PARALLEL OUTPUT DATA  
100ps  
CLOCK  
CLK  
SOUT  
SOUT  
TO SERIAL  
MEDIUM  
T
PARALLEL  
DATA  
pd  
to SOUT  
800 ps  
1150 ps  
SINA  
SINA  
PARALLEL  
DATA  
Figure 6. Cascaded 1:8 Converter Architecture  
FROM  
SERIAL  
MEDIUM  
SINB  
SINB  
With a minimum delay of 800 ps on this output the clock  
for the lower order E445 cannot be delayed more than 800 ps  
relative to the clock of the first E445 without potentially  
missing a bit of information. Because the setup time on the  
serial input pin is negative coincident excursions on the data  
and clock inputs of the E445 will result in correct operation.  
Figure 5. Loopback Test Architecture  
The E445 features a differential serial output and a divide  
by 8 clock output to facilitate the cascading of two devices  
to build a 1:8 demultiplexer. Figure 6 illustrates the  
architecture for a 1:8 demultiplexer using two E445’s; the  
timing diagram for this configuration can be found on the  
following page. Notice the serial outputs (SOUT) of the  
lower order converter feed the serial inputs of the the higher  
order device. This feed through of the serial inputs bounds  
the upper end of the frequency of operation. The clock to  
serial output propagation delay plus the setup time of the  
serial input pins must fit into a single clock period for the  
cascade architecture to function properly. Using the worst  
case values for these two parameters from the data sheet,  
TPD CLK to SOUT = 1150 ps and tS for SIN = 100 ps,  
yields a minimum period of 1050 ps or a clock frequency of  
950 MHz.  
The clock frequency is significantly lower than that of a  
single converter, to increase this frequency some games can  
be played with the clock input of the higher order E445. By  
delaying the clock feeding the second E445 relative to the  
clock of the first E445 the frequency of operation can be  
increased. The delay between the two clocks can be  
increased until the minimum delay of clock to serial out  
would potentially cause a serial bit to be swallowed  
(Figure 7).  
CLOCK A  
CLOCK B  
T
CLK  
to SOUT  
pd  
800 ps  
1150 ps  
Figure 7. Cascade Frequency Limitation  
Perhaps the easiest way to delay the second clock relative  
to the first is to take advantage of the differential clock inputs  
of the E445. By connecting the clock for the second E445 to  
the complementary clock input pin the device will clock a  
half a clock period after the first E445 (Figure 8). Utilizing  
this simple technique will raise the potential conversion  
frequency up to 1.4 GHz. The divide by eight clock of the  
second E445 should be used to synchronize the parallel data  
to the rest of the system as the parallel data of the two E445’s  
will no longer be synchronized. This skew problem between  
the outputs can be worked around as the parallel information  
will be static for eight more clock pulses.  
http://onsemi.com  
9
 
MC10E445, MC100E445  
CLOCK  
CLOCK  
700ps  
(1.4GHz)  
100ps  
E445a  
E445b  
CLOCK A  
SERIAL  
INPUT  
DATA  
SIN  
SIN  
SOUT  
SOUT  
SIN  
SIN  
CLOCK B  
T
CLK  
to SOUT  
pd  
Q3 Q2 Q1 Q0  
Q3 Q2 Q1 Q0  
800ps  
1150ps  
Q7 Q6 Q5 Q4  
Q3 Q2 Q1 Q0  
PARALLEL OUTPUT DATA  
Figure 8. Extended Frequency 1:8 Demultiplexer  
CLK  
SINa  
Dn-4  
Dn-3  
Dn-2  
Dn-1  
Dn  
Dn+1 Dn+2 Dn+3  
Dn-4  
Dn-3  
Dn-2  
Dn-1  
Dn  
Q0  
Q1  
Q2  
Q3  
Q4 (Q0 a)  
Q5 (Q1 a)  
Q6 (Q2 a)  
Q7 (Q3 a)  
SOUTa  
SOUTb  
CL/4a  
Dn+1  
Dn+2  
Dn+3  
Dn-4  
Dn-3  
Dn-2  
Dn-1  
Dn  
Dn+1 Dn+2 Dn+3  
Dn-3 Dn-2 Dn-1  
Dn-4  
Dn  
Dn+1  
CL/4b  
CL/8a  
CL/8b  
Figure 9. Timing Diagram A. 1:8 Serial to Parallel Conversion  
http://onsemi.com  
10  
MC10E445, MC100E445  
Z = 50 W  
Q
Q
D
D
o
Receiver  
Device  
Driver  
Device  
Z = 50 W  
o
50 W  
50 W  
V
TT  
V
= V 2.0 V  
TT  
CC  
Figure 10. Typical Termination for Output Driver and Device Evaluation  
(See Application Note AND8020/D Termination of ECL Logic Devices.)  
ORDERING INFORMATION  
Device  
Package  
Shipping  
MC10E445FN  
PLCC28  
37 Units / Rail  
37 Units / Rail  
MC10E445FNG  
PLCC28  
(PbFree)  
MC10E445FNR2  
PLCC28  
500 / Tape & Reel  
500 / Tape & Reel  
MC10E445FNR2G  
PLCC28  
(PbFree)  
MC100E445FN  
PLCC28  
37 Units / Rail  
37 Units / Rail  
MC100E445FNG  
PLCC28  
(PbFree)  
MC100E445FNR2  
MC100E445FNR2G  
PLCC28  
500 / Tape & Reel  
500 / Tape & Reel  
PLCC28  
(PbFree)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
Resource Reference of Application Notes  
AN1405/D  
AN1406/D  
AN1503/D  
AN1504/D  
AN1568/D  
AN1672/D  
AND8001/D  
AND8002/D  
AND8020/D  
AND8066/D  
AND8090/D  
ECL Clock Distribution Techniques  
Designing with PECL (ECL at +5.0 V)  
ECLinPSt I/O SPiCE Modeling Kit  
Metastability and the ECLinPS Family  
Interfacing Between LVDS and ECL  
The ECL Translator Guide  
Odd Number Counters Design  
Marking and Date Codes  
Termination of ECL Logic Devices  
Interfacing with ECLinPS  
AC Characteristics of ECL Devices  
http://onsemi.com  
11  
MC10E445, MC100E445  
PACKAGE DIMENSIONS  
PLCC28  
FN SUFFIX  
PLASTIC PLCC PACKAGE  
CASE 77602  
ISSUE E  
M
S
S
N
0.007 (0.180)  
T L−M  
B
Y BRK  
D
N−  
M
S
S
N
0.007 (0.180)  
T L−M  
U
Z
M−  
L−  
W
D
S
S
S
N
0.010 (0.250)  
T L−M  
X
G1  
V
28  
1
VIEW DD  
M
S
S
S
A
0.007 (0.180)  
0.007 (0.180)  
T L−M  
T L−M  
N
M
S
S
N
0.007 (0.180)  
T L−M  
H
Z
M
S
N
R
K1  
C
E
0.004 (0.100)  
G
K
SEATING  
PLANE  
T−  
J
M
S
S
N
0.007 (0.180)  
T L−M  
F
VIEW S  
G1  
S
S
S
N
0.010 (0.250)  
T L−M  
VIEW S  
NOTES:  
INCHES  
MILLIMETERS  
1. DATUMS −L−, −M−, AND −N− DETERMINED  
WHERE TOP OF LEAD SHOULDER EXITS  
PLASTIC BODY AT MOLD PARTING LINE.  
2. DIMENSION G1, TRUE POSITION TO BE  
MEASURED AT DATUM −T−, SEATING PLANE.  
3. DIMENSIONS R AND U DO NOT INCLUDE  
MOLD FLASH. ALLOWABLE MOLD FLASH IS  
0.010 (0.250) PER SIDE.  
4. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
5. CONTROLLING DIMENSION: INCH.  
6. THE PACKAGE TOP MAY BE SMALLER THAN  
THE PACKAGE BOTTOM BY UP TO 0.012  
(0.300). DIMENSIONS R AND U ARE  
DETERMINED AT THE OUTERMOST  
EXTREMES OF THE PLASTIC BODY  
EXCLUSIVE OF MOLD FLASH, TIE BAR  
BURRS, GATE BURRS AND INTERLEAD  
FLASH, BUT INCLUDING ANY MISMATCH  
BETWEEN THE TOP AND BOTTOM OF THE  
PLASTIC BODY.  
DIM MIN  
MAX  
0.495  
0.495  
0.180  
0.110  
0.019  
MIN  
12.32  
12.32  
4.20  
MAX  
12.57  
12.57  
4.57  
A
B
C
E
F
0.485  
0.485  
0.165  
0.090  
0.013  
2.29  
0.33  
2.79  
0.48  
G
H
J
0.050 BSC  
1.27 BSC  
0.026  
0.020  
0.025  
0.450  
0.450  
0.042  
0.042  
0.042  
0.032  
−−−  
−−−  
0.66  
0.51  
0.64  
11.43  
11.43  
1.07  
1.07  
1.07  
−−−  
0.81  
−−−  
K
R
U
V
W
X
Y
Z
−−−  
0.456  
0.456  
0.048  
0.048  
0.056  
11.58  
11.58  
1.21  
1.21  
1.42  
0.50  
10  
−−− 0.020  
10  
2
2
_
_
_
_
G1 0.410  
K1 0.040  
0.430  
−−−  
10.42  
1.02  
10.92  
−−−  
7. DIMENSION H DOES NOT INCLUDE DAMBAR  
PROTRUSION OR INTRUSION. THE DAMBAR  
PROTRUSION(S) SHALL NOT CAUSE THE H  
DIMENSION TO BE GREATER THAN 0.037  
(0.940). THE DAMBAR INTRUSION(S) SHALL  
NOT CAUSE THE H DIMENSION TO BE  
SMALLER THAN 0.025 (0.635).  
http://onsemi.com  
12  
MC10E445, MC100E445  
ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC).  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 8002829855 Toll Free  
USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
Japan Customer Focus Center  
Phone: 81357733850  
ON Semiconductor Website: www.onsemi.com  
Order Literature: http://www.onsemi.com/orderlit  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
Phone: 3036752175 or 8003443860 Toll Free USA/Canada  
Fax: 3036752176 or 8003443867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
For additional information, please contact your local  
Sales Representative  
MC10E445/D  

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