MC100EPT23DT [ONSEMI]

Dual Differential LVPECL to LVTTL Translator; 双差分LVPECL到LVTTL翻译
MC100EPT23DT
型号: MC100EPT23DT
厂家: ONSEMI    ONSEMI
描述:

Dual Differential LVPECL to LVTTL Translator
双差分LVPECL到LVTTL翻译

文件: 总8页 (文件大小:68K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MC100EPT23  
3.3VꢀDual Differential  
LVPECL/LVDS to LVTTL  
Translator  
The MC100EPT23 is a dual differential LVPECL/LVDS to LVTTL  
translator. Because LVPECL (Positive ECL) or LVDS levels are used,  
only +3.3 V and ground are required. The small outline 8-lead package  
and the dual gate design of the EPT23 makes it ideal for applications  
which require the translation of a clock and a data signal.  
http://onsemi.com  
MARKING  
DIAGRAMS*  
The EPT23 is available in only the ECL 100K standard. Since there  
are no LVPECL outputs or an external V reference, the EPT23 does  
8
BB  
not require both ECL standard versions. The LVPECL/LVDS inputs  
are differential. Therefore, the MC100EPT23 can accept any standard  
KPT23  
ALYW  
SOIC−8  
D SUFFIX  
CASE 751  
8
differential LVPECL/LVDS input referenced from a V of +3.3 V.  
CC  
1
1
1
1.5 ns Typical Propagation Delay  
Maximum Operating Frequency > 275 MHz  
24 mA LVTTL Outputs  
8
TSSOP−8  
DT SUFFIX  
CASE 948R  
KA23  
ALYW  
8
Operating Range: V = 3.0 V to 3.6 V with GND = 0 V  
CC  
1
Pb−Free Packages are Available  
A = Assembly Location  
L = Wafer Lot  
Y = Year  
W = Work Week  
*For additional marking information, refer to  
Application Note AND8002/D.  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 5 of this data sheet.  
Semiconductor Components Industries, LLC, 2005  
1
Publication Order Number:  
February, 2005 − Rev. 11  
MC100EPT23/D  
MC100EPT23  
Table 1. PIN DESCRIPTION  
D0  
D0  
1
2
8
7
V
CC  
Pin  
Function  
LVTTL Outputs  
Q0, Q1  
D0**, D1**  
D0**, D1**  
Differential LVPECL Inputs  
Q0  
Q1  
LVPECL LVTTL  
V
CC  
Positive Supply  
Ground  
GND  
D1  
D1  
3
4
6
5
** Pins will default to V /2 when left open.  
CC  
GND  
(Top View)  
Figure 1. 8−Lead Pinout and Logic Diagram  
Table 2. ATTRIBUTES  
Characteristics  
Value  
50 kW  
50 kW  
Internal Input Pulldown Resistor  
Internal Input Pullup Resistor  
ESD Protection  
Human Body Model  
Machine Model  
Charged Device Model  
> 1500 V  
> 100 V  
> 2 kV  
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)  
Level 1  
UL 94 V−0 @ 0.125 in  
91 Devices  
Flammability Rating  
Transistor Count  
Oxygen Index: 28 to 34  
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test  
1. For additional information, see Application Note AND8003/D.  
Table 3. MAXIMUM RATINGS  
Symbol  
Parameter  
Condition 1  
GND = 0 V  
Condition 2  
Rating  
Unit  
V
V
CC  
V
I
Power Supply  
Input Voltage  
Output Current  
3.8  
3.8  
GND = 0 V  
V V  
V
I
CC  
I
Continuous  
Surge  
50  
mA  
mA  
out  
100  
T
Operating Temperature Range  
−40 to +85  
°C  
°C  
A
T
Storage Temperature Range  
−65 to +150  
stg  
JA  
q
Thermal Resistance (Junction−to−Ambient)  
0 lfpm  
SOIC−8  
SOIC−8  
190  
130  
°C/W  
°C/W  
500 lfpm  
q
q
Thermal Resistance (Junction−to−Case)  
Thermal Resistance (Junction−to−Ambient)  
Standard Board  
SOIC−8  
41 to 44  
°C/W  
JC  
JA  
0 lfpm  
TSSOP−8  
TSSOP−8  
185  
140  
°C/W  
°C/W  
500 lfpm  
q
Thermal Resistance (Junction−to−Case)  
Wave Solder  
Standard Board  
TSSOP−8  
41 to 44  
265  
°C/W  
°C  
JC  
T
sol  
< 2 to 3 sec @ 248°C  
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit  
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,  
damage may occur and reliability may be affected.  
http://onsemi.com  
2
 
MC100EPT23  
Table 4. PECL DC CHARACTERISTICS V = 3.3 V, GND = 0 V (Note 2)  
CC  
−40°C  
25°C  
Typ  
18  
85°C  
Typ  
18  
Min  
10  
Typ  
18  
Max  
25  
Min  
10  
Max  
25  
Min  
10  
Max  
25  
Symbol  
CCH  
Characteristic  
Power Supply Current (Outputs set to HIGH)  
Power Supply Current (Outputs set to LOW)  
Input HIGH Voltage  
Unit  
mA  
mA  
mV  
mV  
V
I
I
15  
26  
36  
15  
26  
36  
15  
26  
36  
CCL  
V
V
V
2075  
1355  
1.2  
2420 2075  
1675 1355  
2420 2075  
1675 1355  
2420  
1675  
3.3  
IH  
Input LOW Voltage  
IL  
Input HIGH Voltage Common Mode Range  
(Note 3)  
3.3  
1.2  
3.3  
1.2  
IHCMR  
I
I
Input HIGH Current  
Input LOW Current  
150  
150  
150  
0.5  
mA  
mA  
IH  
D
D
−150  
−150  
−150  
−150  
−150  
−150  
IL  
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
2. All values vary 1:1 with V  
.
CC  
3. V  
min varies 1:1 with V , V  
max varies 1:1 with V . The V  
range is referenced to the most positive side of the differential  
IHCMR  
EE IHCMR  
CC  
IHCMR  
input signal.  
Table 5. TTL DC CHARACTERISTICS V = 3.3 V, GND = 0.0 V, T = −40°C to 85°C  
CC  
A
Symbol  
Characteristic  
Output HIGH Voltage  
Condition  
Min  
Typ  
Max  
Unit  
V
V
I
I
= −3.0 mA  
2.4  
OH  
OL  
OH  
V
Output LOW Voltage  
= 24 mA  
0.5  
V
OL  
I
Output Short Circuit Current  
−180  
−50  
mA  
OS  
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
Table 6. AC CHARACTERISTICS V = 3.0 V to 3.6 V, GND = 0.0 V (Note 4)  
CC  
−40°C  
Typ  
25°C  
Typ  
350  
85°C  
Typ  
350  
Min  
Max  
Min  
Max  
Min  
Max  
Symbol  
Characteristic  
Unit  
MHz  
ns  
f
Maximum Frequency (Figure 2)  
275  
350  
275  
275  
max  
t
t
,
Propagation Delay to  
Output Differential (Note 5)  
1.2  
1.2  
1.5  
1.5  
1.8  
1.8  
1.2  
1.1  
1.5  
1.5  
1.8  
1.8  
1.3  
1.1  
1.7  
1.5  
2.4  
1.8  
PLH  
PHL  
t
t
t
Output−to−Output Skew++  
Output−to−Output Skew−−  
Part−to−Part Skew (Note 6)  
15  
35  
70  
60  
80  
500  
15  
40  
70  
70  
80  
500  
30  
40  
140  
125  
80  
500  
ps  
SK+ +  
SK− −  
SKPP  
t
Random Clock Jitter (RMS) (Figure 2)  
5
10  
5
10  
5
10  
ps  
JITTER  
V
Input Voltage Swing (Differential Configuration)  
150  
330  
800 1200 150  
600 900 330  
800 1200 150  
600 900 330  
800 1200 mV  
650 900 ps  
PP  
t t  
r
Output Rise/Fall Times (0.8 V − 2.0 V)  
Q, Q  
f
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
4. Measured with a 750 mV 50% duty−cycle clock source. R = 500 W to GND and C = 20 pF to GND. Refer to Figure 3.  
L
L
5. Reference (V = 3.3V ± 5%; GND = 0 V)  
CC  
6. Skews are measured between outputs under identical conditions.  
http://onsemi.com  
3
 
MC100EPT23  
3.0  
2.0  
1.0  
0.0  
12  
8
V
OL  
0.5 V  
V
OH  
JITTER  
4
0
400  
0
100  
200  
FREQUENCY (MHz)  
300  
Figure 2. Typical VOH / Jitter versus Frequency (255C)  
APPLICATION  
TTL RECEIVER  
CHARACTERISTIC TEST  
C *  
L
R
L
*C includes  
L
fixture  
capacitance  
AC TEST LOAD  
GND  
Figure 3. TTL Output Loading Used for Device Evaluation  
http://onsemi.com  
4
MC100EPT23  
ORDERING INFORMATION  
Device  
Package  
Shipping  
MC100EPT23D  
SOIC−8  
98 Units / Rail  
98 Units / Rail  
MC100EPT23DG  
SOIC−8  
(Pb−Free)  
MC100EPT23DR2  
MC100EPT23DR2G  
SOIC−8  
2500 / Tape & Reel  
2500 / Tape & Reel  
SOIC−8  
(Pb−Free)  
MC100EPT23DT  
TSSOP−8  
100 Units / Rail  
100 Units / Rail  
MC100EPT23DTG  
TSSOP−8  
(Pb−Free)  
MC100EPT23DTR2  
MC100EPT23DTR2G  
TSSOP−8  
2500 / Tape & Reel  
2500 / Tape & Reel  
TSSOP−8  
(Pb−Free)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
Resource Reference of Application Notes  
AN1405/D  
AN1406/D  
AN1503/D  
AN1504/D  
AN1568/D  
AN1642/D  
AND8001/D  
AND8002/D  
AND8020/D  
AND8066/D  
AND8090/D  
ECL Clock Distribution Techniques  
Designing with PECL (ECL at +5.0 V)  
ECLinPSt I/O SPiCE Modeling Kit  
Metastability and the ECLinPS Family  
Interfacing Between LVDS and ECL  
The ECL Translator Guide  
Odd Number Counters Design  
Marking and Date Codes  
Termination of ECL Logic Devices  
Interfacing with ECLinPS  
AC Characteristics of ECL Devices  
http://onsemi.com  
5
MC100EPT23  
PACKAGE DIMENSIONS  
SOIC−8 NB  
D SUFFIX  
PLASTIC SOIC PACKAGE  
CASE 751−07  
NOTES:  
ISSUE AE  
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
−X−  
A
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)  
PER SIDE.  
8
5
4
5. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.127 (0.005) TOTAL  
IN EXCESS OF THE D DIMENSION AT  
MAXIMUM MATERIAL CONDITION.  
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW  
STANDARD IS 751−07.  
S
M
M
B
0.25 (0.010)  
Y
1
K
−Y−  
G
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN  
MAX  
0.197  
0.157  
0.069  
0.020  
A
B
C
D
G
H
J
K
M
N
S
4.80  
3.80  
1.35  
0.33  
5.00 0.189  
4.00 0.150  
1.75 0.053  
0.51 0.013  
C
N X 45  
_
SEATING  
PLANE  
−Z−  
1.27 BSC  
0.050 BSC  
0.10 (0.004)  
0.10  
0.19  
0.40  
0
0.25 0.004  
0.25 0.007  
1.27 0.016  
0.010  
0.010  
0.050  
8
0.020  
0.244  
M
J
H
D
8
0
_
_
_
_
0.25  
5.80  
0.50 0.010  
6.20 0.228  
M
S
S
X
0.25 (0.010)  
Z
Y
SOLDERING FOOTPRINT*  
1.52  
0.060  
7.0  
0.275  
4.0  
0.155  
0.6  
0.024  
1.270  
0.050  
mm  
inches  
ǒ
Ǔ
SCALE 6:1  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
http://onsemi.com  
6
MC100EPT23  
PACKAGE DIMENSIONS  
TSSOP−8  
DT SUFFIX  
PLASTIC TSSOP PACKAGE  
CASE 948R−02  
ISSUE A  
8x K REF  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
M
S
S
V
0.10 (0.004)  
T
U
S
0.15 (0.006) T U  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.  
PROTRUSIONS OR GATE BURRS. MOLD FLASH  
OR GATE BURRS SHALL NOT EXCEED 0.15  
(0.006) PER SIDE.  
4. DIMENSION B DOES NOT INCLUDE INTERLEAD  
FLASH OR PROTRUSION. INTERLEAD FLASH OR  
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)  
PER SIDE.  
2X L/2  
8
5
4
0.25 (0.010)  
B
−U−  
L
1
M
PIN 1  
IDENT  
5. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
6. DIMENSION A AND B ARE TO BE DETERMINED  
AT DATUM PLANE −W−.  
S
0.15 (0.006) T U  
A
−V−  
F
DETAIL E  
MILLIMETERS  
INCHES  
MIN  
DIM MIN  
MAX  
3.10  
3.10  
MAX  
0.122  
0.122  
0.043  
0.006  
0.028  
A
B
C
D
F
2.90  
2.90  
0.80  
0.05  
0.40  
0.114  
0.114  
C
1.10 0.031  
0.15 0.002  
0.70 0.016  
0.10 (0.004)  
−W−  
SEATING  
PLANE  
D
−T−  
G
G
K
L
0.65 BSC  
0.026 BSC  
0.25  
0.40 0.010  
0.016  
4.90 BSC  
0.193 BSC  
0
DETAIL E  
M
0
6
6
_
_
_
_
http://onsemi.com  
7
MC100EPT23  
ECLinPS is a trademark of Semiconductor Components INdustries, LLC (SCILLC).  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 800−282−9855 Toll Free  
USA/Canada  
ON Semiconductor Website: http://onsemi.com  
Order Literature: http://www.onsemi.com/litorder  
Literature Distribution Center for ON Semiconductor  
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA  
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada  
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
Japan: ON Semiconductor, Japan Customer Focus Center  
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051  
Phone: 81−3−5773−3850  
For additional information, please contact your  
local Sales Representative.  
MC100EPT23/D  

相关型号:

MC100EPT23DTG

Dual Differential LVPECL to LVTTL Translator
ONSEMI

MC100EPT23DTR2

Dual Differential LVPECL to LVTTL Translator
ONSEMI

MC100EPT23DTR2G

Dual Differential LVPECL to LVTTL Translator
ONSEMI

MC100EPT23MNR4

3.3V Dual Differential LVPECL/LVDS/CML to LVTTL/LVCMOS Translator
ONSEMI

MC100EPT23MNR4G

3.3V Dual Differential LVPECL/LVDS/CML to LVTTL/LVCMOS Translator
ONSEMI

MC100EPT23_06

3.3V Dual Differential LVPECL/LVDS/CML to LVTTL/LVCMOS Translator
ONSEMI

MC100EPT24

LVTTL/LVCOMS to Differential LVECL Translator
ONSEMI

MC100EPT24D

LVTTL/LVCOMS to Differential LVECL Translator
ONSEMI

MC100EPT24DG

3.3V LVTTL/LVCMOS to Differential LVECL Translator
ONSEMI

MC100EPT24DR2

LVTTL/LVCOMS to Differential LVECL Translator
ONSEMI

MC100EPT24DR2G

3.3V LVTTL/LVCMOS to Differential LVECL Translator
ONSEMI

MC100EPT24DT

3.3V LVTTL/LVCMOS to Differential LVECL Translator
ONSEMI