MC100H606FN [ONSEMI]
Registered Hex TTL to PECL Translator; 注册六角TTL到PECL翻译![MC100H606FN](http://pdffile.icpdf.com/pdf1/p00197/img/icpdf/MC100H_1112214_icpdf.jpg)
型号: | MC100H606FN |
厂家: | ![]() |
描述: | Registered Hex TTL to PECL Translator |
文件: | 总7页 (文件大小:120K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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MC10H606, MC100H606
Registered Hex TTL to
PECL Translator
Description
The MC10/100H606 is a 6−bit, registered, single supply TTL to
PECL translator. The device features differential PECL outputs as
well as a choice between either a differential PECL clock input or a
TTL clock input. The asynchronous master reset control is a PECL
level input.
http://onsemi.com
With its differential PECL outputs and TTL inputs the H606 device
is ideally suited for the transmit function of a HPPI bus type
board−to−board interface application. The on chip registers simplify
the task of synchronizing the data between the two boards.
The device is available in either ECL standard: the MECL 10H™
PLCC−28
FN SUFFIX
CASE 776
device is compatible with MECL 10KH logic levels, with a V of
CC
+5.0 V while the 100H device is compatible with 100K logic levels,
with a V of +5.0 V.
CC
Features
• Differential 50 W ECL Outputs
• Choice Between Differential PECL or TTL Clock Input
• Single Power Supply
MARKING DIAGRAM*
1
• Multiple Power and Ground Pins to Minimize Noise
• Pb−Free Packages are Available*
MCxxxH606G
AWLYYWW
xxx
= 10 or 100
A
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
WL
YY
WW
G
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
November, 2006 − Rev. 6
MC10H606/D
MC10H606, MC100H606
Table 1. TRUTH TABLE
1 OF 6 BITS
Dn
MR
TCLK/CLK
Qn+1
L
H
X
L
L
H
Z
Z
X
L
H
L
Qn
Qn
Dn
D
Q
Z = LOW to HIGH Transition
CLK
R
CLK
CLK
TCLK
*
MR
VBB
*
1. When using PECL inputs, TCLK must be tied to ground (0 V).
2. When using only one PECL input, the unused PECL input must be tied
to V , and TCLK must be tied to ground (0 V).
BB
3. When using TCLK, both PECL inputs must be tied to ground (0 V).
Figure 1. Logic Diagram
D1 D2
V
D3 D4 D5 V
CCT
CCE
19
25
24
23
22
21
20
26
27
28
18
Q5
D0
Table 2. PIN NAMES
17
16
TCLK
Q5
Q4
Q4
V
PIN
FUNCTION
V
BB
D0 − D5
CLK, CLK
TCLK
TTL Data Inputs
Differential PECL Clock Input
TTL Clock Input
CLK
CLK
MR
15
14
13
12
2
3
4
CCE
MR
Q0 − Q5
Q0 − Q5
PECL Master Reset Input
True PECL Outputs
Inverted PECL Outputs
Q3
Q3
V
CCE
5
6
7
8
9
10
11
V
V
PECL V (+5.0 V)
CCE
CC
TTL V (+5.0 V)
Q0 Q0 GND Q1 Q1 Q2 Q2
CCT
CC
GND
TTL/PECL Ground
Figure 2. Pinout: PLCC−28
(Top View)
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2
MC10H606, MC100H606
Table 3. 10H PECL DC CHARACTERISTICS (V
= V
= 5.0 V ± 5%)
CCT
CCE
T
A
= 0°C
T
A
= 25°C
T = 85°C
A
Min
Max
Min
Max
Min
Max
Symbol
Characteristic
Input HIGH Current
Condition
Unit
mA
I
I
255
0.5
175
0.5
175
0.5
INH
INL
Input LOW Current
mA
V
V
V
V
V
Input HIGH Voltage (Note 4)
Input LOW Voltage (Note 4)
Output HIGH Voltage (Note 4)
Output LOW Voltage (Note 4)
Reference Voltage (Note 4)
V
= 5.0 V
= 5.0 V
= 5.0 V
= 5.0 V
= 5.0 V
3830
3050
3980
3050
3600
4160
3520
4160
3370
3710
3870
3050
4020
3050
3630
4190
3520
4190
3370
3730
3930
3050
4080
3050
3670
4280
3555
4270
3400
3790
mV
mV
mV
mV
mV
IH
CCT
CCT
CCT
CCT
CCT
V
V
V
V
IL
OH
OL
BB
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification
limit values are applied individually under normal operating conditions and not valid simultaneously.
4. PECL V , V , V , V
V
are given for V
= V
= 5.0 V and will vary 1:1 with the power supply.
IL
IH
OL
OH BB
CCT
CCE
Table 4. 100H PECL DC CHARACTERISTICS (V
= V
= 5.0 V ± 5%)
CCT
CCE
T
A
= 0°C
T
A
= 25°C
T = 85°C
A
Min
Max
Min
Max
Min
Max
Symbol
Characteristic
Input HIGH Current
Condition
Unit
mA
I
I
255
0.5
175
0.5
175
0.5
INH
INL
Input LOW Current
mA
V
V
V
V
V
Input HIGH Voltage (Note 5)
Input LOW Voltage (Note 5)
Output HIGH Voltage (Note 5)
Output LOW Voltage (Note 5)
Output Bias Voltage (Note 5)
V
V
V
V
V
= 5.0 V
= 5.0 V
= 5.0 V
= 5.0 V
= 5.0 V
3835
3190
3975
3190
3600
4120
3525
4120
3380
3720
3835
3190
3975
3190
3600
4120
3525
4120
3380
3720
3835
3190
3975
3190
3600
4120
3525
4120
3380
3720
mV
mV
mV
mV
mV
IH
CCT
CCT
CCT
CCT
CCT
IL
OH
OL
BB
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification
limit values are applied individually under normal operating conditions and not valid simultaneously.
5. PECL V , V , V , V
V
are given for V
= V
= 5.0 V and will vary 1:1 with the power supply.
IL
IH
OL
OH BB
CCT
CCE
Table 5. DC CHARACTERISTICS (VCCT = VCCE = 5.0 V ± 5%)
T
A
= 0°C
T
A
= + 25°C
T = + 85°C
A
Min Typ Max Min Typ Max Min Typ Max
Symbol
Characteristic
Supply Current
Condition
Outputs LOW
Outputs HIGH
Unit
mA
mA
mA
I
I
I
18
13
75
30
25
90
18
13
75
30
25
90
18
13
75
30
25
95
CCL
CCH
GND
Supply Current
Supply Current
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
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3
MC10H606, MC100H606
Table 6. TTL DC CHARACTERISTICS (V
= V
= 5.0 V ± 5%)
CCT
CCE
T
A
= 0°C
T
A
= 25°C
T = 85°C
A
Min
Max
Min
Max
Min
Max
Symbol
Characteristic
Input HIGH Voltage
Condition
Unit
V
V
V
V
2.0
2.0
2.0
IH
IL
Input LOW Voltage
Input Clamp Voltage
Input HIGH Current
0.8
0.8
0.8
V
I
= −18 mA
IN
−1.2
−1.2
−1.2
V
IK
I
V
V
= 2.7 V
= 7.0 V
20
100
20
100
20
100
V
IH
IN
IN
I
Input LOW Current
V
= 0.5 V
−0.6
−0.6
−0.6
mA
IL
IN
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
Table 7. AC CHARACTERISTICS (V
= V
= 5.0 V ± 5%)
CCT
CCE
T
A
= 0°C
T
A
= + 25°C
T = + 85°C
A
Min Typ Max Min Typ Max Min Typ Max
Symbol
Characteristic
Condition
50 W to V −2.0 V
Unit
ns
t
Propagation Delay TCLK++
Propagation Delay TCLK+−
Propagation Delay CLK++
Propagation Delay CLK+−
Propagation Delay MR+−
1.75
1.75
1.50
1.50
1.50
3.75 1.75 3.00 3.75 1.75
3.75 1.75 3.00 3.75 1.75
3.50 1.50 2.50 3.50 1.50
3.50 1.50 2.50 3.50 1.50
3.50 1.50 2.50 3.50 1.75
3.75
3.75
3.50
3.50
3.75
PD
CC
t
t
t
t
t
50 W to V −2.0 V
ns
PD
CC
50 W to V −2.0 V
ns
PD
CC
50 W to V −2.0 V
ns
PD
CC
50 W to V −2.0 V
ns
PD
CC
Device Skew
Part−to−Part
Within Device
50 W to V −2.0 V
2.0
0.5
1.0
0.3
2.0
0.5
2.0
0.5
ns
SKEW
CC
t
t
t
t
t
t
t
Setup Time
Hold Time
50 W to V −2.0 V
1.5
1.5
1.5
1.5
0.5
0.5
1.5
1.5
1.5
1.5
0.5
0.5
1.0
1.5
1.5
1.5
1.5
0.5
0.5
ns
ns
ns
ns
ns
ns
ns
S
CC
50 W to V −2.0 V
H
CC
Minimum Pulse Width CLK
Minimum Pulse Width MR
Rise Time
50 W to V −2.0 V
CC
PW
50 W to V −2.0 V
PW
CC
50 W to V −2.0 V
2.0
2.0
1.0
1.0
2.0
2.0
2.0
2.0
2.0
r
CC
Fall Time
50 W to V −2.0 V
CC
f
Reset/Recovery Time
50 W to V −2.0 V
2.5
2.0
2.5
2.5
2.0
RES/REC
CC
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
http://onsemi.com
4
MC10H606, MC100H606
ORDERING INFORMATION
Device
†
Package
Shipping
MC10H606FN
PLCC−28
37 Units / Rail
37 Units / Rail
MC10H606FNG
PLCC−28
(Pb−Free)
MC10H606FNR2
PLCC−28
500 / Tape & Reel
500 / Tape & Reel
MC10H606FNR2G
PLCC−28
(Pb−Free)
MC100H606FN
PLCC−28
37 Units / Rail
37 Units / Rail
MC100H606FNG
PLCC−28
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Resource Reference of Application Notes
AN1405/D
AN1406/D
AN1503/D
AN1504/D
AN1568/D
AN1672/D
AND8001/D
AND8002/D
AND8020/D
AND8066/D
AND8090/D
−
−
−
−
−
−
−
−
−
−
−
ECL Clock Distribution Techniques
Designing with PECL (ECL at +5.0 V)
ECLinPSt I/O SPiCE Modeling Kit
Metastability and the ECLinPS Family
Interfacing Between LVDS and ECL
The ECL Translator Guide
Odd Number Counters Design
Marking and Date Codes
Termination of ECL Logic Devices
Interfacing with ECLinPS
AC Characteristics of ECL Devices
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5
MC10H606, MC100H606
PACKAGE DIMENSIONS
PLCC−28
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 776−02
ISSUE E
M
S
S
N
0.007 (0.180)
T L−M
B
Y BRK
D
−N−
M
S
S
N
0.007 (0.180)
T L−M
U
Z
−M−
−L−
W
D
S
S
S
N
0.010 (0.250)
T L−M
X
G1
V
28
1
VIEW D−D
M
S
S
S
A
0.007 (0.180)
0.007 (0.180)
T L−M
T L−M
N
M
S
S
N
0.007 (0.180)
T L−M
H
Z
M
S
N
R
K1
C
E
0.004 (0.100)
G
K
SEATING
PLANE
−T−
J
M
S
S
N
0.007 (0.180)
T L−M
F
VIEW S
G1
S
S
S
N
0.010 (0.250)
T L−M
VIEW S
NOTES:
INCHES
MILLIMETERS
1. DATUMS −L−, −M−, AND −N− DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM −T−, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE
MOLD FLASH. ALLOWABLE MOLD FLASH IS
0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
DIM MIN
MAX
0.495
0.495
0.180
0.110
0.019
MIN
12.32
12.32
4.20
MAX
12.57
12.57
4.57
A
B
C
E
F
0.485
0.485
0.165
0.090
0.013
2.29
0.33
2.79
0.48
G
H
J
0.050 BSC
1.27 BSC
0.026
0.020
0.025
0.450
0.450
0.042
0.042
0.042
0.032
−−−
−−−
0.66
0.51
0.64
11.43
11.43
1.07
1.07
1.07
−−−
0.81
−−−
K
R
U
V
W
X
Y
Z
−−−
0.456
0.456
0.048
0.048
0.056
11.58
11.58
1.21
1.21
1.42
0.50
10
−−− 0.020
10
2
2
_
_
_
_
G1 0.410
K1 0.040
0.430
−−−
10.42
1.02
10.92
−−−
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
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6
MC10H606, MC100H606
ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC).
MECL 10 H is a trademark of Motorola, Inc.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
For additional information, please contact your local
Sales Representative
MC10H606/D
相关型号:
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MC100H606FNG
IC HEX TTL/CMOS TO PECL TRANSLATOR, COMPLEMENTARY OUTPUT, PQCC28, LEAD FREE, PLASTIC, LCC-28, Level Translator
ONSEMI
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MC100H606FNR2
HEX TTL/CMOS TO PECL TRANSLATOR, COMPLEMENTARY OUTPUT, PQCC28, PLASTIC, LCC-28
MOTOROLA
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MC100H607FNR2
PECL to TTL Translator, 6 Func, True Output, BIPolar, PQCC28, PLASTIC, LCC-28
MOTOROLA
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![](http://pdffile.icpdf.com/pdf2/p00304/img/page/MC100H607FNR_1837214_files/MC100H607FNR_1837214_2.jpg)
MC100H607FNR2G
HEX PECL TO TTL TRANSLATOR, TRUE OUTPUT, PQCC28, LEAD FREE, PLASTIC, LCC-28
ROCHESTER
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