MC10131 [ONSEMI]

Dual TYPE D Master-Slave Flip-Flop; 双D型主从触发器
MC10131
型号: MC10131
厂家: ONSEMI    ONSEMI
描述:

Dual TYPE D Master-Slave Flip-Flop
双D型主从触发器

触发器
文件: 总5页 (文件大小:115K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SEMICONDUCTOR TECHNICAL DATA  
The MC10131 is a dual master–slave type D flip–flop. Asynchronous Set (S)  
and Reset (R) override Clock (C ) and Clock Enable (C ) inputs. Each flip–flop  
C
E
may be clocked separately by holding the common clock in the low state and  
using the enable inputs for the clocking function. If the common clock is to be  
used to clock the flip–flop, the Clock Enable inputs must be in the low state. In  
this case, the enable inputs perform the function of controlling the common  
clock.  
L SUFFIX  
CERAMIC PACKAGE  
CASE 620–10  
The output states of the flip–flop change on the positive transition of the  
clock. A change in the information present at the data (D) input will not affect the  
output information at any other time due to master slave construction.  
P SUFFIX  
PLASTIC PACKAGE  
CASE 648–08  
FN SUFFIX  
PLCC  
CASE 775–02  
P
= 235 mW typ/pkg (No Load)  
= 160 MHz typ  
= 3.0 ns typ  
D
F
Tog  
t
pd  
t , t = 2.5 ns typ (20%–80%)  
r f  
DIP  
PIN ASSIGNMENT  
LOGIC DIAGRAM  
S1  
D1  
5
V
V
CC2  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
CC1  
7
6
2
3
Q1  
Q1  
Q2  
Q2  
R2  
S2  
Q1  
C
E1  
Q1  
R1  
S1  
R1  
4
9
C
C
R2 13  
C
C
E2  
E1  
14  
15  
Q2  
Q2  
C
11  
D2  
D1  
E2  
D2 10  
V
V
V
= PIN 1  
= PIN 16  
= PIN 8  
CC1  
CC2  
EE  
C
C
V
EE  
S2 12  
Pin assignment is for Dual–in–Line Package.  
For PLCC pin assignment, see the Pin Conversion  
Tables on page 6–11 of the Motorola MECL Data  
Book (DL122/D).  
CLOCKED TRUTH TABLE  
R–S TRUTH TABLE  
C
L
D
X
L
Q
R
L
S
L
Q
n+1  
n+1  
Q
Q
n
n
H
H
L
L
H
L
H
H
H
H
H
L
C = C + C A clock H is a clock transition from a  
C.  
H
N.D.  
E
low to a high state.  
N.D. = Not Defined  
3/93  
Motorola, Inc. 1996  
REV 5  
MC10131  
ELECTRICAL CHARACTERISTICS  
Test Limits  
+25°C  
Typ  
Pin  
Under  
Test  
–30°C  
+85°C  
Characteristic  
Power Supply Drain Current  
Input Current  
Symbol  
Unit  
mAdc  
µAdc  
Min  
Max  
Min  
Max  
Min  
Max  
I
E
8
62  
45  
56  
62  
I
4
5
6
7
9
525  
525  
350  
390  
425  
330  
330  
220  
245  
265  
330  
330  
220  
245  
265  
inH  
I
4, 5*  
6, 7, 9*  
0.5  
0.5  
0.5  
0.5  
0.3  
0.3  
µAdc  
inL  
Output Voltage  
Logic 1  
V
2
2
–1.060  
–1.060  
–0.890  
–0.890  
–0.960  
–0.960  
–0.810  
–0.810  
–0.890  
–0.890  
–0.700  
–0.700  
Vdc  
Vdc  
Vdc  
Vdc  
ns  
OH  
Output Voltage  
Logic 0  
Logic 1  
Logic 0  
V
2
3
–1.890  
–1.890  
–1.675  
–1.675  
–1.850  
–1.850  
–1.650  
–1.650  
–1.825  
–1.825  
–1.615  
–1.615  
OL  
Threshold Voltage  
Threshold Voltage  
V
OHA  
2
2
–1.080  
–1.080  
–0.980  
–0.980  
–0.910  
–0.910  
V
OLA  
2
3
–1.655  
–1.655  
–1.630  
–1.630  
–1.595  
–1.595  
Switching Times (50Load)  
Clock Input  
Propagation Delay  
t
t
t
2
2
2
2
1.7  
1.7  
1.7  
1.7  
4.6  
4.6  
4.6  
4.6  
1.8  
1.8  
1.8  
1.8  
3.0  
3.0  
3.0  
3.0  
4.5  
4.5  
4.5  
4.5  
1.8  
1.8  
1.8  
1.8  
5.0  
5.0  
5.0  
5.0  
9+2–  
9+2+  
6+2+  
t
6+2–  
Rise Time  
Fall Time  
Set Input  
(20 to 80%)  
(20 to 80%)  
t
2
2
1.0  
1.0  
4.6  
4.6  
1.1  
1.1  
2.5  
2.5  
4.5  
4.5  
1.1  
1.1  
4.9  
4.9  
2+  
t
2–  
ns  
ns  
Propagation Delay  
t
2
15  
3
1.7  
1.7  
1.7  
1.7  
4.4  
4.4  
4.4  
4.4  
1.8  
1.8  
1.8  
1.8  
2.8  
2.8  
2.8  
2.8  
4.3  
4.3  
4.3  
4.3  
1.8  
1.8  
1.8  
1.8  
4.8  
4.8  
4.8  
4.8  
5+2+  
12+15+  
5+3–  
12+14–  
t
t
t
14  
Reset Input  
Propagation Delay  
t
2
15  
3
1.7  
1.7  
1.7  
1.7  
4.4  
4.4  
4.4  
4.4  
1.8  
1.8  
1.8  
1.8  
2.8  
2.8  
2.8  
2.8  
4.3  
4.3  
4.3  
4.3  
1.8  
1.8  
1.8  
1.8  
4.8  
4.8  
4.8  
4.8  
4+2–  
t
13+15–  
t
4+3–  
t
14  
13+14+  
Setup Time  
Hold Time  
t
7
7
2
2.5  
1.5  
2.5  
1.5  
2.5  
1.5  
ns  
ns  
setup  
t
hold  
Toggle Frequency (Max)  
f
125  
125  
160  
125  
MHz  
tog  
* Individually test each input applying V or V to input under test.  
IH IL  
V
V
IHmax  
Output level to be measured after a clock pulse has been applied to the C Input (Pin 6)  
E
ILmin  
3–9  
MOTOROLA  
MC10131  
ELECTRICAL CHARACTERISTICS (continued)  
TEST VOLTAGE VALUES (Volts)  
@ Test Temperature  
V
V
ILmin  
V
V
V
EE  
IHmax  
IHAmin  
ILAmax  
–30°C  
+25°C  
+85°C  
–0.890  
–0.810  
–0.700  
–1.890  
–1.850  
–1.825  
–1.205  
–1.105  
–1.035  
–1.500  
–1.475  
–1.440  
–5.2  
–5.2  
–5.2  
Pin  
Under  
Test  
TEST VOLTAGE APPLIED TO PINS LISTED BELOW  
(V  
CC  
)
Characteristic  
Power Supply Drain Current  
Input Current  
Symbol  
Gnd  
V
V
ILmin  
V
V
V
EE  
IHmax  
IHAmin  
ILAmax  
I
E
8
8
1, 16  
I
4
5
6
7
9
4
5
6
7
9
8
8
8
8
8
1, 16  
1, 16  
1, 16  
1, 16  
1, 16  
inH  
I
4, 5*  
6, 7, 9*  
*
*
8
8
1, 16  
1, 16  
inL  
Output Voltage  
Logic 1  
Logic 0  
Logic 1  
Logic 0  
V
2
2
5
7
8
8
1, 16  
1, 16  
OH  
Output Voltage  
V
2
3
5
7
8
8
1, 16  
1, 16  
OL  
Threshold Voltage  
Threshold Voltage  
V
OHA  
2
2
5
7
8
8
1, 16  
1, 16  
9
9
V
OLA  
2
3
5
7
8
8
1, 16  
1, 16  
Switching Times  
Clock Input  
(50Load)  
+1.11Vdc  
Pulse In  
Pulse Out  
–3.2 V  
+2.0 V  
Propagation Delay  
t
t
t
2
2
2
2
9
9
6
6
2
2
2
2
8
8
8
8
1, 16  
1, 16  
1, 16  
1, 16  
9+2–  
9+2+  
6+2+  
7
7
t
6+2–  
Rise Time  
Fall Time  
Set Input  
(20 to 80%)  
(20 to 80%)  
t
2
2
7
9
9
2
2
8
8
1, 16  
1, 16  
2+  
t
2–  
Propagation Delay  
t
2
15  
3
5
12  
5
2
15  
3
8
8
8
8
1, 16  
1, 16  
1, 16  
1, 16  
5+2+  
t
t
6
9
12+15+  
t
5+3–  
12+14–  
14  
12  
14  
Reset Input  
Propagation Delay  
t
2
15  
3
4
13  
4
2
15  
3
8
8
8
8
1, 16  
1, 16  
1, 16  
1, 16  
4+2–  
t
6
9
13+15–  
t
4+3–  
t
14  
13  
14  
13+14+  
Setup Time  
Hold Time  
t
7
7
2
6, 7  
6, 7  
6
2
2
2
8
8
8
1, 16  
1, 16  
1, 16  
setup  
t
hold  
Toggle Frequency (Max)  
f
tog  
* Individually test each input applying V or V to input under test.  
IH IL  
V
V
IHmax  
Output level to be measured after a clock pulse has been applied to the C Input (Pin 6)  
E
ILmin  
Each MECL 10,000 series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been  
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained.  
Outputs are terminated through a 50–ohm resistor to –2.0 volts. Test procedures are shown for only one gate. The other gates are tested in the  
same manner.  
MOTOROLA  
3–10  
MC10131  
OUTLINE DIMENSIONS  
FN SUFFIX  
PLASTIC PLCC PACKAGE  
CASE 775–02  
ISSUE C  
M
S
S
0.007 (0.180)  
T
L–M  
N
B
Y BRK  
–M–  
–N–  
M
S
S
0.007 (0.180)  
T
L–M  
N
U
D
D
–L–  
Z
W
20  
1
S
S
S
0.010 (0.250)  
T
L–M  
N
G1  
X
V
VIEW D–D  
M
M
S
S
S
S
A
R
0.007 (0.180)  
0.007 (0.180)  
T
L–M  
L–M  
N
N
Z
T
M
S
S
0.007 (0.180)  
T
L–M  
N
H
C
K1  
E
K
0.004 (0.100)  
–T– SEATING  
G
J
PLANE  
M
S
S
0.007 (0.180)  
T
L–M  
N
F
VIEW S  
G1  
VIEW S  
S
S
S
0.010 (0.250)  
T
L–M  
N
NOTES:  
1. DATUMS –L–, –M–, AND –N– DETERMINED  
INCHES  
MILLIMETERS  
DIM  
MIN  
MAX  
0.395  
0.395  
0.180  
0.110  
0.019  
MIN  
9.78  
9.78  
4.20  
2.29  
0.33  
MAX  
10.03  
10.03  
4.57  
2.79  
0.48  
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC  
BODY AT MOLD PARTING LINE.  
A
B
C
E
0.385  
0.385  
0.165  
0.090  
0.013  
2. DIMENSION G1, TRUE POSITION TO BE  
MEASURED AT DATUM –T–, SEATING PLANE.  
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD  
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)  
PER SIDE.  
4. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
5. CONTROLLING DIMENSION: INCH.  
6. THE PACKAGE TOP MAY BE SMALLER THAN THE  
PACKAGE BOTTOM BY UP TO 0.012 (0.300).  
DIMENSIONS R AND U ARE DETERMINED AT THE  
OUTERMOST EXTREMES OF THE PLASTIC BODY  
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,  
GATE BURRS AND INTERLEAD FLASH, BUT  
INCLUDING ANY MISMATCH BETWEEN THE TOP  
AND BOTTOM OF THE PLASTIC BODY.  
7. DIMENSION H DOES NOT INCLUDE DAMBAR  
PROTRUSION OR INTRUSION. THE DAMBAR  
PROTRUSION(S) SHALL NOT CAUSE THE H  
DIMENSION TO BE GREATER THAN 0.037 (0.940).  
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE  
THE H DIMENSION TO BE SMALLER THAN 0.025  
(0.635).  
F
G
H
J
K
R
U
V
W
X
Y
0.050 BSC  
1.27 BSC  
0.026  
0.020  
0.025  
0.350  
0.350  
0.042  
0.042  
0.042  
–––  
0.032  
–––  
–––  
0.356  
0.356  
0.048  
0.048  
0.056  
0.020  
10  
0.66  
0.51  
0.64  
8.89  
8.89  
1.07  
1.07  
1.07  
–––  
2
0.81  
–––  
–––  
9.04  
9.04  
1.21  
1.21  
1.42  
0.50  
10  
Z
G1  
K1  
2
0.310  
0.040  
0.330  
–––  
7.88  
1.02  
8.38  
–––  
3–11  
MOTOROLA  
MC10131  
OUTLINE DIMENSIONS  
L SUFFIX  
CERAMIC DIP PACKAGE  
CASE 620–10  
–A–  
NOTES:  
ISSUE V  
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION L TO CENTER OF LEAD WHEN  
FORMED PARALLEL.  
4. DIMENSION F MAY NARROW TO 0.76 (0.030)  
WHERE THE LEAD ENTERS THE CERAMIC  
BODY.  
16  
1
9
8
–B–  
C
L
INCHES  
MILLIMETERS  
DIM  
A
B
C
D
MIN  
MAX  
0.785  
0.295  
0.200  
0.020  
MIN  
19.05  
6.10  
–––  
MAX  
19.93  
7.49  
5.08  
0.50  
0.750  
0.240  
–––  
–T–  
SEATING  
PLANE  
0.015  
0.39  
K
N
E
0.050 BSC  
1.27 BSC  
F
0.055  
0.065  
1.40  
1.65  
G
H
K
L
M
N
0.100 BSC  
2.54 BSC  
M
E
0.008  
0.125  
0.015  
0.170  
0.21  
3.18  
0.38  
4.31  
F
J
16 PL  
0.25 (0.010)  
G
0.300 BSC  
7.62 BSC  
M
S
T
B
0
15  
0
15  
D 16 PL  
0.25 (0.010)  
0.020  
0.040  
0.51  
1.01  
M
S
T
A
P SUFFIX  
PLASTIC DIP PACKAGE  
CASE 648–08  
ISSUE R  
NOTES:  
–A–  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION L TO CENTER OF LEADS WHEN  
FORMED PARALLEL.  
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.  
5. ROUNDED CORNERS OPTIONAL.  
16  
1
9
8
B
S
INCHES  
MILLIMETERS  
DIM  
A
B
C
D
F
MIN  
MAX  
0.770  
0.270  
0.175  
0.021  
0.70  
MIN  
18.80  
6.35  
3.69  
0.39  
1.02  
MAX  
19.55  
6.85  
4.44  
0.53  
1.77  
F
0.740  
0.250  
0.145  
0.015  
0.040  
C
L
SEATING  
–T–  
G
H
J
K
L
0.100 BSC  
0.050 BSC  
2.54 BSC  
1.27 BSC  
PLANE  
K
M
0.008  
0.015  
0.130  
0.305  
10  
0.21  
0.38  
3.30  
7.74  
10  
H
J
0.110  
0.295  
0
2.80  
7.50  
0
G
D 16 PL  
0.25 (0.010)  
M
S
0.020  
0.040  
0.51  
1.01  
M
M
T
A
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and  
specificallydisclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola  
datasheetsand/orspecificationscananddovaryindifferentapplicationsandactualperformancemayvaryovertime. Alloperatingparameters,includingTypicals”  
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of  
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other  
applicationsintended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury  
ordeathmayoccur. ShouldBuyerpurchaseoruseMotorolaproductsforanysuchunintendedorunauthorizedapplication,BuyershallindemnifyandholdMotorola  
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees  
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that  
Motorola was negligent regarding the design or manufacture of the part. Motorola and  
Opportunity/Affirmative Action Employer.  
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal  
How to reach us:  
USA/EUROPE/Locations Not Listed: Motorola Literature Distribution;  
JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center,  
P.O. Box 5405, Denver, Colorado 80217. 303–675–2140 or 1–800–441–2447  
3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 81–3–3521–8315  
Mfax : RMFAX0@email.sps.mot.com – TOUCHTONE 602–244–6609  
INTERNET: http://Design–NET.com  
ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park,  
51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298  
MC10131/D  

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