MC10ELT28DR2G [ONSEMI]

5 V TTL to Differential PECL and Differential PECL to TTL Translator; 5 V TTL至差分PECL与差分PECL至TTL转换器


型号：	MC10ELT28DR2G
厂家：	ONSEMI
描述：	5 V TTL to Differential PECL and Differential PECL to TTL Translator 5 V TTL至差分PECL与差分PECL至TTL转换器转换器
文件：	总9页 (文件大小：143K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

MC10ELT28, MC100ELT28

5 VꢀTTL to Differential

PECL and Differential PECL

to TTL Translator

Description

http://onsemi.com

MARKING DIAGRAMS*

The MC10ELT/100ELT28 is a differential PECL to TTL translator

and a TTL to differential PECL translator in a single package. Because

PECL (Positive ECL) levels are used, only +5 V and ground are

required. The small outline 8-lead package and the dual translation

design of the ELT28 makes it ideal for applications which are sending

and receiving signals across a backplane.

HLT28

ALYW

KLT28

ALYW

The 100 Series contains temperature compensation.

SOIC−8

D SUFFIX

CASE 751

Features

• 3.5 ns Typical PECL to TTL Propagation Delay

• 1.2 ns Typical TTL to PECL Propagation Delay

• PNP TTL Inputs for Minimal Loading

• 24 mA TTL Outputs

• Flow Through Pinouts

• Operating Range V = 4.75 V to 5.25 V with GND= 0 V

HT28

KT28

ALYWG

TSSOP−8

DT SUFFIX

CASE 948R

• Q

Output Will Default High with Inputs Left Open or < 1.3 V

Output Will Default High with Inputs Left Open

TTL

ECL

• Internal PECL Input Pulldown Resistors

• Pb−Free Packages are Available

DFN8

MN SUFFIX

CASE 506AA

= MC10

= MC100

= Assembly Location

= Wafer Lot

5G = MC10

2V = MC100

= Year

= Work Week

= Pb−Free Package

= Date Code

(Note: Microdot may be in either location)

*For additional marking information, refer to

Application Note AND8002/D.

ORDERING INFORMATION

See detailed ordering and shipping information in the package

dimensions section on page 6 of this data sheet.

Publication Order Number:

December, 2006 − Rev. 9

MC10ELT28/D

MC10ELT28, MC100ELT28

Table 1. PIN DESCRIPTION

DECL

Function

QTTL

DTTL

TTL Outputs

QTTL

DTTL

TTL Data Inputs

PECL

TTL

QECL, QECL

DECL, DECL

PECL Differential Outputs

PECL Differential Inputs

Positive Supply

QECL

GND

Ground

GND

Exposed pad must be connected to a

sufficient thermal conduit. Electrically

connect to the most negative supply or

leave floating open.

Figure 1. 8−Lead Pinout (Top View) and Logic

Diagram

Table 2. ATTRIBUTES

Characteristics

Value

ESD Protection

Human Body Model

> 2 kV

Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)

Pb Pkg

Pb−Free Pkg

SOIC−8

Level 1

Level 3

Level 1

TSSOP−8

DFN8

Flammability Rating

Transistor Count

Oxygen Index: 28 to 34

UL 94 V−0 @ 0.125 in

71 Devices

Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test

1. For additional information, see Application Note AND8003/D.

Table 3. MAXIMUM RATINGS

Symbol

Parameter

Positive Power Supply

Condition 1

GND = 0 V

Condition 2

Rating

Unit

Input Voltage

GND = 0 V

V ꢀ V

0 to 6

PECL Output Current

Continuous

Surge

100

out

Operating Temperature Range

−40 to +85

°C

Storage Temperature Range

−65 to +150

stg

Thermal Resistance (Junction−to−Ambient)

0 lfpm

500 lfpm

SOIC−8

190

130

°C/W

Thermal Resistance (Junction−to−Case)

Thermal Resistance (Junction−to−Ambient)

Standard Board

SOIC−8

41 to 44

°C/W

0 lfpm

500 lfpm

TSSOP−8

185

140

°C/W

Thermal Resistance (Junction−to−Case)

Thermal Resistance (Junction−to−Ambient)

Standard Board

TSSOP−8

41 to 44 ± 5%

°C/W

0 lfpm

500 lfpm

DFN8

129

°C/W

sol

Wave Solder

Pb <2 to 3 sec @ 248°C

Pb−Free <2 to 3 sec @ 260°C

265

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

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MC10ELT28, MC100ELT28

Table 4. 10ELT SERIES PECL DC CHARACTERISTICS V = 5.0 V; GND= 0.0 V (Note 2)

−40°C

Typ

25°C

Typ

85°C

Typ

Min

3920

3050

3770

3050

2.2

Max

4110

3350

4110

3500

5.0

Min

4020

3050

3870

3050

2.2

Max

4190

3370

4190

3520

5.0

Min

4090

3050

3940

3050

2.2

Max

4280

3405

4280

3555

5.0

Symbol

Characteristic

Unit

Output HIGH Voltage (Note 3)

Output LOW Voltage (Note 3)

Input HIGH Voltage (Single−Ended)

Input LOW Voltage (Single−Ended)

4010

3200

4105

3210

4185

3227

Input HIGH Voltage Common Mode

Range (Differential) (Note 4)

IHCMR

Input HIGH Current

Input LOW Current

255

175

0.5

0.3

NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit

board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared

operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification

limit values are applied individually under normal operating conditions and not valid simultaneously.

2. Input and output parameters vary 1:1 with V . V can vary ± 0.25 V.

3. PECL outputs are terminated through a 50 W resistor to V − 2 V.

4. V

min varies 1:1 with GND, V

max varies 1:1 with V

IHCMR

Table 5. 100ELT SERIES PECL DC CHARACTERISTICS V = 5.0 V; GND= 0.0 V (Note 5)

−40°C

Typ

25°C

Typ

85°C

Typ

Min

3915

3170

3835

3190

2.2

Max

4120

3445

4120

3525

5.0

Min

3975

3190

3835

3190

2.2

Max

4120

3380

4120

3525

5.0

Min

3975

3190

3835

3190

2.2

Max

4120

3380

4120

3525

5.0

Symbol

Characteristic

Unit

Output HIGH Voltage (Note 6)

Output LOW Voltage (Note 6)

Input HIGH Voltage (Single−Ended)

Input LOW Voltage (Single−Ended)

3995

3305

4045

3295

4050

3295

Input HIGH Voltage Common Mode

Range (Differential) (Note 7)

IHCMR

Input HIGH Current

Input LOW Current

255

175

0.5

NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit

board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared

operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification

limit values are applied individually under normal operating conditions and not valid simultaneously.

5. Input and output parameters vary 1:1 with V . V can vary ± 0.25 V.

6. PECL outputs are terminated through a 50 W resistor to V − 2 V.

7. V

min varies 1:1 with GND, V

max varies 1:1 with V

IHCMR

Table 6. TTL OUTPUT DC CHARACTERISTICS V = 4.75V to 5.25V; T = −40°C to 85°C

Symbol

Characteristic

Output HIGH Voltage

Condition

= −3.0 mA

Min

Typ

Max

Unit

2.4

Output LOW Voltage

= 24 mA

0.5

Power Supply Current

Output Short Circuit Current

CCH

CCL

−150

−60

NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit

board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared

operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification

limit values are applied individually under normal operating conditions and not valid simultaneously.

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MC10ELT28, MC100ELT28

Table 7. TTL INPUT DC CHARACTERISTICS V = 4.75 V to 5.25 V; T = −40°C to 85°C

Symbol

Characteristic

Input HIGH Current

Condition

= 2.7 V

Min

Typ

Max

Unit

Input HIGH Current

Input LOW Current

Input Clamp Diode Voltage

Input HIGH Voltage

Input LOW Voltage

= 7.0 V

= 0.5 V

100

−0.6

−1.2

IHH

= −18 mA

2.0

0.8

NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit

board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared

operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification

limit values are applied individually under normal operating conditions and not valid simultaneously.

Table 8. AC CHARACTERISTICS V = 4.75 V to 5.25 V (Note 8)

−40°C

Typ

25°C

Typ

100

85°C

Typ

Min

Max

Min

Max

Min

Max

Symbol

Characteristic

Maximum Toggle Frequency

Propagation Delay @ 1.5 V

Unit

MHz

TBD

max

PLH

2.0

0.6

5.5

1.2

2.0

0.9

5.5

1.5

2.0

0.6

5.5

1.35

DECL to QTTL

DTTL to QECL

1.2

0.8

Propagation Delay @ 1.5 V

PHL

2.0

0.4

5.5

1.0

2.0

0.5

5.5

1.1

2.0

0.7

5.5

1.3

DECL to QTTL

DTTL to QECL

t , t

Rise/Fall Times

(20% − 80%)

QECL 0.15

1.5

0.15

200

1.5

0.15

200

1.5

PECL Input Swing (Note 9)

200

1000

t /t

Output Rise Time (10% − 90%)

Output Fall Time (10% − 90%)

1.6

1.1

NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit

board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared

operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification

limit values are applied individually under normal operating conditions and not valid simultaneously.

8. R = 500 W to GND and C = 20 pF to GND. Refer to Figure 2.

9. V (min) is the minimum input swing for which AC parameters are guaranteed.

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MC10ELT28, MC100ELT28

APPLICATION

TTL RECEIVER

CHARACTERISTIC TEST

C *

*C includes

fixture

capacitance

AC TEST LOAD

GND

Figure 2. TTL Output Loading Used for Device Evaluation

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MC10ELT28, MC100ELT28

ORDERING INFORMATION

Device

†

Package

Shipping

MC10ELT28D

SOIC−8

98 Units / Rail

MC10ELT28DG

SOIC−8

(Pb−Free)

MC10ELT28DR2

SOIC−8

2500 / Tape & Reel

MC10ELT28DR2G

SOIC−8

(Pb−Free)

MC10ELT28DT

TSSOP−8

100 Units / Rail

MC10ELT28DTG

TSSOP−8

(Pb−Free)

MC10ELT28DTR2

MC10ELT28DTR2G

TSSOP−8

2500 / Tape & Reel

TSSOP−8

(Pb−Free)

MC10ELT28MNR4

MC10ELT28MNR4G

DFN8

1000 / Tape & Reel

DFN8

(Pb−Free)

MC100ELT28D

SOIC−8

98 Units / Rail

MC100ELT28DG

SOIC−8

(Pb−Free)

MC100ELT28DR2

MC100ELT28DR2G

SOIC−8

2500 / Tape & Reel

SOIC−8

(Pb−Free)

MC100ELT28DT

TSSOP−8

100 Units / Rail

MC100ELT28DTG

TSSOP−8

(Pb−Free)

MC100ELT28DTR2

MC100ELT28DTR2G

TSSOP−8

2500 / Tape & Reel

TSSOP−8

(Pb−Free)

MC100ELT28MNR4

MC100ELT28MNR4G

DFN8

1000 / Tape & Reel

DFN8

(Pb−Free)

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

Resource Reference of Application Notes

AN1405/D

AN1406/D

AN1503/D

AN1504/D

AN1568/D

AN1672/D

AND8001/D

AND8002/D

AND8020/D

AND8066/D

AND8090/D

−

ECL Clock Distribution Techniques

Designing with PECL (ECL at +5.0 V)

ECLinPSt I/O SPiCE Modeling Kit

Metastability and the ECLinPS Family

Interfacing Between LVDS and ECL

The ECL Translator Guide

Odd Number Counters Design

Marking and Date Codes

Termination of ECL Logic Devices

Interfacing with ECLinPS

AC Characteristics of ECL Devices

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MC10ELT28, MC100ELT28

PACKAGE DIMENSIONS

SOIC−8 NB

CASE 751−07

ISSUE AH

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A AND B DO NOT INCLUDE

MOLD PROTRUSION.

−X−

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.127 (0.005) TOTAL

IN EXCESS OF THE D DIMENSION AT

MAXIMUM MATERIAL CONDITION.

6. 751−01 THRU 751−06 ARE OBSOLETE. NEW

STANDARD IS 751−07.

0.25 (0.010)

−Y−

MILLIMETERS

DIM MIN MAX

INCHES

MIN

MAX

0.197

0.157

0.069

0.020

4.80

3.80

1.35

0.33

5.00 0.189

4.00 0.150

1.75 0.053

0.51 0.013

N X 45

SEATING

PLANE

−Z−

1.27 BSC

0.050 BSC

0.10 (0.004)

0.10

0.19

0.40

0.25 0.004

0.25 0.007

1.27 0.016

0.010

0.050

0.020

0.244

0.25

5.80

0.50 0.010

6.20 0.228

0.25 (0.010)

SOLDERING FOOTPRINT*

1.52

0.060

7.0

4.0

0.275

0.155

0.6

0.024

1.270

0.050

inches

SCALE 6:1

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

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MC10ELT28, MC100ELT28

PACKAGE DIMENSIONS

TSSOP−8

DT SUFFIX

PLASTIC TSSOP PACKAGE

CASE 948R−02

ISSUE A

8x K REF

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

0.10 (0.004)

T U

0.15 (0.006) T U

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.

PROTRUSIONS OR GATE BURRS. MOLD FLASH

OR GATE BURRS SHALL NOT EXCEED 0.15

(0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE INTERLEAD

FLASH OR PROTRUSION. INTERLEAD FLASH OR

PROTRUSION SHALL NOT EXCEED 0.25 (0.010)

PER SIDE.

2X L/2

0.25 (0.010)

−U−

PIN 1

IDENT

5. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

6. DIMENSION A AND B ARE TO BE DETERMINED

AT DATUM PLANE −W−.

0.15 (0.006) T U

−V−

DETAIL E

MILLIMETERS

INCHES

MIN

DIM MIN

MAX

3.10

MAX

0.122

0.043

0.006

0.028

2.90

0.80

0.05

0.40

0.114

1.10 0.031

0.15 0.002

0.70 0.016

0.10 (0.004)

−W−

SEATING

PLANE

−T−

0.65 BSC

0.026 BSC

0.25

0.40 0.010

0.016

4.90 BSC

0.193 BSC

DETAIL E

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MC10ELT28, MC100ELT28

PACKAGE DIMENSIONS

DFN8

CASE 506AA−01

ISSUE D

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994 .

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.25 AND 0.30 MM FROM TERMINAL.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

PIN ONE

REFERENCE

MILLIMETERS

DIM MIN

MAX

1.00

0.05

0.80

0.00

0.20 REF

0.20

0.30

2 X

2.00 BSC

0.10

1.10

1.30

2.00 BSC

2 X

0.70

0.90

0.50 BSC

0.10

TOP VIEW

0.20

0.25

−−−

0.35

0.10

0.08

8 X

(A3)

SIDE VIEW

SEATING

PLANE

e/2

^{8 X}L

0.10 C A B

^{8 X}b

0.05

NOTE 3

BOTTOM VIEW

ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC).

ON Semiconductor and

are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should

Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,

and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death

associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal

Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

LITERATURE FULFILLMENT:

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5773−3850

ON Semiconductor Website: www.onsemi.com

Order Literature: http://www.onsemi.com/orderlit

Literature Distribution Center for ON Semiconductor

P.O. Box 5163, Denver, Colorado 80217 USA

Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada

Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada

Email: orderlit@onsemi.com

For additional information, please contact your local

Sales Representative

MC10ELT28/D

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MC10ELT28DR2G [ONSEMI]

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