MC10H125ML2 [ONSEMI]
QUAD ECL TO TTL TRANSLATOR, TRUE OUTPUT, PDSO16;
| 型号： | MC10H125ML2 |
| 厂家： | 
ONSEMI |
| 描述： | QUAD ECL TO TTL TRANSLATOR, TRUE OUTPUT, PDSO16 光电二极管 输出元件 |
| 文件： | 总8页 (文件大小：148K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MC10H125
Quad MECL−to−TTL
Translator
Description
The MC10H125 is a quad translator for interfacing data and control
signals between the MECL section and saturated logic section of
digital systems. The 10H part is a functional/pinout duplication of the
standard MECL 10K™ family part, with 100% improvement in
propagation delay, and no increase in power−supply current.
Outputs of unused translators will go to low state when their inputs
are left open.
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MARKING DIAGRAMS*
16
MC10H125L
AWLYYWW
Features
• Propagation Delay, 2.5 ns Typical
1
• Voltage Compensated
CDIP−16
L SUFFIX
CASE 620A
• Improved Noise Margin 150 mV
(Over Operating Voltage and Temperature Range)
• MECL 10K Compatible
• Pb−Free Packages are Available*
16
1
MC10H125P
AWLYYWWG
16
1
PDIP−16
P SUFFIX
CASE 648
10H125
ALYWG
SOEIAJ−16
CASE 966
1 20
10H125G
AWLYYWW
20
1
PLLC−20
FN SUFFIX
CASE 775
A
= Assembly Location
= Year
WL, L = Wafer Lot
YY, Y
WW, W = Work Week
G
= Pb−Free Package
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
February, 2006 − Rev. 12
MC10H125/D
MC10H125
2
3
4
V
GND
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
BB
6
7
A
D
in
in
in
5
A
D
in
10
11
12
A
B
D
out
out
out
C
out
14
15
13
1
B
C
in
in
in
V
*
BB
B
C
in
GND = Pin 16
V
V
( +5.0 Vdc) = Pin 9
( −5.2 Vdc) = Pin 8
V
V
CC
EE
EE
CC
Pin assignment is for Dual−in−Line Package.
For PLCC pin assignment, see the Pin Conversion
Tables.
*V to be used to supply bias to the MC10H125
only and bypassed (when used) with 0.01 mF to
BB
0.1 mF capacitor to ground (0 V). V can source <
BB
1.0 mA.
Figure 1. Logic Diagram
Figure 2. Pin Assignment
Table 1. DIP CONVERSION TABLES
16−Pin DIL to 20−Pin PLCC
16 PIN DIL
1
2
2
3
3
4
4
5
5
7
6
8
7
9
8
9
10 11 12 13 14 15 16
20 PIN PLCC
10 12 13 14 15 17 18 19 20
20−Pin DIL to 20−Pin PLCC
20 PIN DIL
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
9
9
10 11 12 13 14 15 16 17 18 19 20
10 11 12 13 14 15 16 17 18 19 20
20 PIN PLCC
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2
MC10H125
Table 2. MAXIMUM RATINGS
Symbol
Characteristic
Rating
−8.0 to 0
0 to +7.0
Unit
Vdc
Vdc
Vdc
°C
V
Power Supply (V = 5.0 V)
CC
EE
CC
V
Power Supply (V = −5.2 V)
EE
V
Input Voltage (V = 5.0 V)
0 to V
EE
I
CC
T
Operating Temperature Range
Storage Temperature Range
0 to +75
A
T
stg
− Plastic
− Ceramic
−55 to +150
−55 to +165
°C
°C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
Table 3. ELECTRICAL CHARACTERISTICS (V = −5.2 V +5%; V = 5.0 V + 5.0 %) (Note 2)
EE
CC
0°
25°
75°
Min
Max
Min
Max
Min
Max
Symbol
Characteristic
Negative Power
Unit
I
−
44
−
40
−
44
mA
E
Supply Drain
Current
I
I
Positive Power Supply
Drain Current
−
−
63
40
−
−
63
40
−
−
63
40
mA
mA
mA
CCH
I
CCL
I
Input Current
−
225
1.5
−
−
145
1.0
−
−
145
1.0
−
inH
Input Leakage Current
High Output Voltage
−
−
−
mA
CBO
V
2.5
2.5
2.5
Vdc
OH
I
= −1.0 mA
OH
V
Low Output Voltage
−
0.5
−
0.5
−
0.5
Vdc
OL
I
= +20 mA
OL
V
High Input Voltage (Note 1)
Low Input Voltage (Note 1)
Short Circuit Current
−1.17
−1.95
60
−0.84
−1.48
150
−1.13
−1.95
60
−0.81
−1.48
150
−1.07
−1.95
50
−0.735
−1.45
150
Vdc
Vdc
mA
Vdc
V
IH
V
IL
I
OS
V
Reference Voltage
−1.38
−
−1.27
−
−1.35
−1.25
−1.31
−1.19
BB
V
Common Mode
Range (Note 3)
−2.85 to +0.3
CMR
Typical
V
Input Sensitivity (Note 4)
150
mV
PP
1. When V is used as the reference voltage.
BB
2. Each MECL 10Hꢀ series circuit has been designed to meet the specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is
maintained.
3. Differential input not to exceed 1.0 Vdc.
4. 150 mV
differential input required to obtain full logic swing on output.
p−p
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3
MC10H125
Table 4. AC CHARACTERISTICS
0°
25°
75°
Min
0.8
0.3
0.3
Max
3.3
1.2
1.2
Min
0.85
0.3
Max
3.35
1.2
Min
0.9
0.3
0.3
Max
3.4
1.2
1.2
Symbol
Characteristic
Unit
ns
t
Propagation Delay
Rise Time (Note 5)
Fall Time (Note 5)
pd
t
t
ns
r
0.3
1.2
ns
f
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
5. Output Voltage = 1.0 V to 2.0 V. R = 500 W to GND and C = 25 pF to GND. Refer to Figure 1.
L
L
APPLICATION
TTL RECEIVER
CHARACTERISTIC TEST
C *
L
R
L
*C includes
L
fixture
capacitance
AC TEST LOAD
GND
Figure 1. TTL Output Loading Used for Device Evaluation
APPLICATION INFORMATION
The MC10H125 incorporates differential inputs and
Schottky TTL “totem pole” outputs. Differential inputs
allow for use as an inverting/non−inverting translator or as
An advantage of this device is that MECL−level
information can be received, via balanced twisted pair lines,
in the TTL equipment. This isolates the MECL−logic from
the noisy TTL environment. Power supply requirements are
ground, +5.0 V and −5.2 V.
a differential line receiver. The V reference voltage is
BB
available on Pin 1 for use in single−ended input biasing. The
outputs of the MC10H125 go to a low−logic level whenever
the inputs are left floating, and a high−logic output level is
achieved with a minimum input level of 150 mV
.
p−p
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4
MC10H125
ORDERING INFORMATION
Device
†
Package
Shipping
MC10H125FN
PLLC−20
46 Units / Rail
46 Units / Rail
MC10H125FNG
PLLC−20
(Pb−Free)
MC10H125FNR2
PLLC−20
500 / Tape & Reel
500 / Tape & Reel
MC10H125FNR2G
PLLC−20
(Pb−Free)
MC10H125L
MC10H125M
MC10H125MG
CDIP−16
25 Unit / Rail
50 Unit / Rail
50 Unit / Rail
SOEIAJ−16
SOEIAJ−16
(Pb−Free)
MC10H125MEL
SOEIAJ−16
2000 / Tape & Reel
2000 / Tape & Reel
MC10H125MELG
SOEIAJ−16
(Pb−Free)
MC10H125P
PDIP−16
25 Unit / Rail
25 Unit / Rail
MC10H125PG
PDIP−16
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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5
MC10H125
PACKAGE DIMENSIONS
20 LEAD PLLC
CASE 775−02
ISSUE E
M
S
S
0.007 (0.180)
T
L−M
N
B
Y BRK
−N−
S
S
N
0.007 (0.180) M
T
L−M
U
D
D
−L−
−M−
Z
W
20
1
S
S
S
N
0.010 (0.250)
T
L−M
G1
X
V
VIEW D−D
M
M
S
S
S
S
A
R
0.007 (0.180)
0.007 (0.180)
T
L−M
L−M
N
N
Z
T
M
S
S
N
0.007 (0.180)
T
L−M
H
C
K1
E
K
0.004 (0.100)
G
−T− SEATING
PLANE
J
M
S
S
N
0.007 (0.180)
T
L−M
F
VIEW S
G1
VIEW S
S
S
S
0.010 (0.250)
T
L−M
N
NOTES:
INCHES
MILLIMETERS
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,
1982.
DIM
A
B
C
E
MIN
MAX
0.395
0.395
0.180
0.110
0.019
MIN
9.78
9.78
4.20
2.29
0.33
MAX
10.03
10.03
4.57
2.79
0.48
0.385
0.385
0.165
0.090
0.013
2. DIMENSIONS IN INCHES.
3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
DATUM −T−, SEATING PLANE.
F
G
H
J
K
R
U
V
W
X
Y
0.050 BSC
1.27 BSC
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
0.026
0.020
0.025
0.350
0.350
0.042
0.042
0.042
0.032
−−−
−−−
0.356
0.356
0.048
0.048
0.056
0.66
0.51
0.64
8.89
8.89
1.07
1.07
1.07
−−−
2
0.81
−−−
−−−
9.04
9.04
1.21
1.21
1.42
0.50
10
−−− 0.020
Z
2
10
0.330
−−−
_
_
_
_
G1 0.310
K1 0.040
7.88
1.02
8.38
−−−
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6
MC10H125
PACKAGE DIMENSIONS
SOEIAJ−16
CASE 966−01
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
L
16
9
E
Q
1
H
E
E
M
_
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
1
8
L
DETAIL P
Z
D
VIEW P
e
MILLIMETERS
INCHES
MIN MAX
−−− 0.081
A
DIM MIN
MAX
2.05
0.20
0.50
0.20
10.50
5.45
c
A
−−−
0.05
0.35
0.10
9.90
5.10
A
1
0.002
0.008
0.020
0.011
0.413
0.215
b
c
0.014
0.007
0.390
0.201
D
E
A
1
b
e
1.27 BSC
0.050 BSC
0.10 (0.004)
M
H
0.13 (0.005)
7.40
0.50
1.10
8.20
0.85
1.50
0.291
0.020
0.043
0.323
0.033
0.059
E
L
L
E
0
10
10
0.035
M
Q
0
0.028
_
_
_
_
0.70
−−−
0.90
0.78
1
Z
−−− 0.031
CDIP−16
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620A−01
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
B
B
A
A
M
16
9
8
5
THIS DRAWING REPLACES OBSOLETE
CASE OUTLINE 620−10.
L
INCHES
DIM MIN MAX
MILLIMETERS
1
MIN
19.05
6.10
−−−
MAX
19.93
7.49
5.08
0.50
A
B
C
D
E
F
0.750
0.240
0.785
0.295
16X J
−−− 0.200
0.015 0.020
0.050 BSC
0.39
M
0.25 (0.010)
T
B
1.27 BSC
E
0.055
0.065
1.40
1.65
G
H
K
L
0.100 BSC
2.54 BSC
F
0.008
0.125
0.015
0.170
0.21
3.18
0.38
4.31
0.300 BSC
7.62 BSC
M
N
0
0.020
15
_
0.040
0
_
0.51
15
_
1.01
_
C
K
N
SEATING
PLANE
T
G
16X D
M
0.25 (0.010)
T A
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7
MC10H125
PACKAGE DIMENSIONS
PDIP−16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648−08
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
−A−
16
1
9
8
B
S
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
INCHES
DIM MIN MAX
MILLIMETERS
MIN
18.80
6.35
3.69
0.39
1.02
MAX
19.55
6.85
4.44
0.53
1.77
F
A
B
C
D
F
0.740
0.250
0.145
0.015
0.040
0.770
0.270
0.175
0.021
0.70
C
L
SEATING
PLANE
−T−
G
H
J
0.100 BSC
0.050 BSC
2.54 BSC
1.27 BSC
K
M
0.008
0.015
0.130
0.305
10
0.21
0.38
3.30
7.74
10
H
J
K
L
0.110
0.295
0
2.80
7.50
0
G
D 16 PL
M
S
_
_
_
_
0.020
0.040
0.51
1.01
M
M
0.25 (0.010)
T A
MECL 10H and MECL 10K are trademarks of Motorola, Inc.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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Phone: 81−3−5773−3850
For additional information, please contact your
local Sales Representative.
MC10H125/D
相关型号：
MC10H125MNG
QUAD TTL TO ECL TRANSLATOR, COMPLEMENTARY OUTPUT, QCC16, 3 X 3 MM, 0.50 MM PITCH, LEAD FREE, QFN-16
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