MC10H141L [ONSEMI]

Four−Bit Universal Shift Register; 四位通用移位寄存器
MC10H141L
型号: MC10H141L
厂家: ONSEMI    ONSEMI
描述:

Four−Bit Universal Shift Register
四位通用移位寄存器

移位寄存器 触发器 逻辑集成电路
文件: 总6页 (文件大小:149K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MC10H141  
Four−Bit Universal Shift  
Register  
Description  
The MC10H141 is a fourbit universal shift register. This device is a  
functional/pinout duplication of the standard MECL 10Kpart with  
100% improvement in propagation delay and operation frequency and  
no increase in power supply current.  
http://onsemi.com  
MARKING DIAGRAMS*  
Features  
16  
Shift frequency, 250 MHz Min  
Power Dissipation, 425 mW Typical  
Improved Noise Margin 150 mV (Over Operating Voltage and  
Temperature Range)  
MC10H141L  
AWLYYWW  
1
CDIP16  
L SUFFIX  
CASE 620A  
Voltage Compensated  
MECL 10K Compatible  
PbFree Packages are Available*  
Table 1. TRUTH TABLE  
OUTPUTS  
Q2 Q3  
n + 1 n + 1  
SELECT  
OPERATING  
MODE  
16  
1
S1 S2  
Q0  
Q1  
n + 1  
n + 1  
MC10H141P  
AWLYYWWG  
L
L
Parallel Entry  
D0  
Q1  
D1  
D2  
D3  
16  
L
H
L
Shift Right*  
Shift Left*  
Q2  
Q0  
Q3  
Q1  
DR  
Q2  
n
n
n
n
n
1
H
DL  
Q0  
n
PDIP16  
P SUFFIX  
CASE 648  
H
H
Stop Shift  
Q1  
Q2  
32  
n
n
n
n
*
Outputs as exist after pulse appears at “C” input with  
input conditions as shown (Pulse Positive transition of  
clock input).  
1 20  
10H141G  
AWLYYWW  
20  
1
V
V
CC2  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
CC1  
Q1  
Q0  
DL  
D0  
D1  
S1  
D2  
Q2  
PLLC20  
FN SUFFIX  
CASE 775  
Q3  
C
DR  
D3  
S2  
A
= Assembly Location  
= Wafer Lot  
WL  
YY  
WW  
G
= Year  
= Work Week  
= PbFree Package  
V
EE  
Pin assignment is for DualinLine Package.  
*For additional marking information, refer to  
Application Note AND8002/D.  
Figure 1. Pin Assignment  
*For additional information on our PbFree strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 3 of this data sheet.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
February, 2006 Rev. 8  
MC10H141/D  
MC10H141  
Table 2. MAXIMUM RATINGS  
Symbol  
Characteristic  
Rating  
Unit  
Vdc  
Vdc  
mA  
V
Power Supply (V = 0)  
8.0 to 0  
EE  
CC  
V
Input Voltage (V = 0)  
0 to V  
I
CC  
EE  
I
Output Current  
Continuous  
Surge  
50  
100  
out  
T
A
Operating Temperature Range  
0 to +75  
°C  
T
stg  
Storage Temperature Range Plastic  
Ceramic  
55 to +150  
55 to +165  
°C  
°C  
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit  
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,  
damage may occur and reliability may be affected.  
Table 3. ELECTRICAL CHARACTERISTICS (V = 5.2 V 5% (Note 1)  
EE  
0°  
25°  
75°  
Symbol  
Characteristic  
Power Supply Current  
Input Current High  
Pins 5,6,9,11,12,13  
Min  
Max  
Min  
Max  
Min  
Max  
Unit  
mA  
mA  
I
112  
102  
112  
E
I
inH  
405  
416  
510  
255  
260  
320  
255  
260  
320  
Pins 7,10  
Pin 4  
I
Input Current Low  
High Output Voltage  
Low Output Voltage  
High Input Voltage  
Low Input Voltage  
0.5  
0.5  
0.3  
mA  
inL  
V
1.02  
1.95  
1.17  
1.95  
0.84  
1.63  
0.84  
1.48  
0.98  
1.95  
1.13  
1.95  
0.81  
1.63  
0.81  
1.48  
0.92  
1.95  
1.07  
1.95  
0.735  
1.60  
0.735  
1.45  
Vdc  
Vdc  
Vdc  
Vdc  
OH  
V
OL  
V
IH  
V
IL  
1. Each MECL 10Hseries circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been  
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is  
maintained. Outputs are terminated through a 50 W resistor to 2.0 V.  
Table 4. AC PARAMETERS  
t
Propagation Delay  
1.0  
1.0  
2.0  
1.0  
1.0  
2.0  
1.1  
1.0  
2.1  
ns  
ns  
pd  
t
Hold Time −  
hold  
Data, Select  
Setup Time  
Data  
Select  
t
ns  
set  
1.5  
3.0  
1.5  
3.0  
1.5  
3.0  
t
t
Rise Time  
Fall Time  
0.5  
0.5  
250  
2.4  
2.4  
0.5  
0.5  
250  
2.4  
2.4  
0.5  
0.5  
250  
2.4  
2.4  
ns  
ns  
r
f
f
Shift Frequency  
MHz  
shift  
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
http://onsemi.com  
2
MC10H141  
LOGIC DIAGRAM  
D3  
D2  
D1  
D0  
PARALLEL ENTER  
SHIFT RIGHT  
SHIFT LEFT  
HOLD  
S1  
S2  
1 OF 4  
DECODER  
DR  
DL  
D
C
Q
D
C
Q
D
C
Q
D
C
Q
C
Q3  
Q2  
Q1  
Q0  
V
S
CC1  
CC2  
=
=
=
PIN 1  
PIN 16  
PIN 8  
V
EE  
APPLICATION INFORMATION  
The MC10H141 is a fourbit universal shift register  
information on the positive edge of the clock. The four  
operations are stop shift, shift left, shift right, and parallel  
entry of data. The other six inputs are all data type inputs;  
four for parallel entry data, and one for shifting in from the  
left (DL) and one for shifting in from the right (DR).  
which performs shift left, or shift right, serial/parallel in, and  
serial/parallel out operations with no external gating. Inputs  
S1 and S2 control the four possible operations of the register  
without external gating of the clock. The flipflops shift  
ORDERING INFORMATION  
Device  
Package  
Shipping  
MC10H141FN  
PLLC20  
46 Units / Rail  
46 Units / Rail  
MC10H141FNG  
PLLC20  
(PbFree)  
MC10H141FNR2  
PLLC20  
500 / Tape & Reel  
500 / Tape & Reel  
MC10H141FNR2G  
PLLC20  
(PbFree)  
MC10H141L  
MC10H141P  
MC10H141PG  
CDIP16  
PDIP16  
25 Unit / Rail  
25 Unit / Rail  
25 Unit / Rail  
PDIP16  
(PbFree)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
http://onsemi.com  
3
MC10H141  
PACKAGE DIMENSIONS  
20 LEAD PLLC  
CASE 77502  
ISSUE E  
M
S
S
0.007 (0.180)  
T
L−M  
N
B
Y BRK  
N−  
S
S
N
0.007 (0.180) M  
T
L−M  
U
D
D
L−  
M−  
Z
W
20  
1
S
S
S
N
0.010 (0.250)  
T
L−M  
G1  
X
V
VIEW DD  
M
M
S
S
S
S
A
R
0.007 (0.180)  
0.007 (0.180)  
T
L−M  
L−M  
N
N
Z
T
M
S
S
N
0.007 (0.180)  
T
L−M  
H
C
K1  
E
K
0.004 (0.100)  
G
TSEATING  
PLANE  
J
M
S
S
N
0.007 (0.180)  
T
L−M  
F
VIEW S  
G1  
VIEW S  
S
S
S
0.010 (0.250)  
T
L−M  
N
NOTES:  
INCHES  
MILLIMETERS  
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,  
1982.  
DIM  
A
B
C
E
MIN  
MAX  
0.395  
0.395  
0.180  
0.110  
0.019  
MIN  
9.78  
9.78  
4.20  
2.29  
0.33  
MAX  
10.03  
10.03  
4.57  
2.79  
0.48  
0.385  
0.385  
0.165  
0.090  
0.013  
2. DIMENSIONS IN INCHES.  
3. DATUMS L, M, AND NDETERMINED WHERE TOP  
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD  
PARTING LINE.  
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT  
DATUM T, SEATING PLANE.  
F
G
H
J
K
R
U
V
W
X
Y
0.050 BSC  
1.27 BSC  
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.  
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.  
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER  
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).  
DIMENSIONS R AND U ARE DETERMINED AT THE  
OUTERMOST EXTREMES OF THE PLASTIC BODY  
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE  
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY  
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE  
PLASTIC BODY.  
7. DIMENSION H DOES NOT INCLUDE DAMBAR  
PROTRUSION OR INTRUSION. THE DAMBAR  
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION  
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR  
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO  
BE SMALLER THAN 0.025 (0.635).  
0.026  
0.020  
0.025  
0.350  
0.350  
0.042  
0.042  
0.042  
0.032  
−−−  
−−−  
0.356  
0.356  
0.048  
0.048  
0.056  
0.66  
0.51  
0.64  
8.89  
8.89  
1.07  
1.07  
1.07  
−−−  
2
0.81  
−−−  
−−−  
9.04  
9.04  
1.21  
1.21  
1.42  
0.50  
10  
−−− 0.020  
Z
2
10  
0.330  
−−−  
_
_
_
_
G1 0.310  
K1 0.040  
7.88  
1.02  
8.38  
−−−  
http://onsemi.com  
4
MC10H141  
PACKAGE DIMENSIONS  
CDIP16  
L SUFFIX  
CERAMIC DIP PACKAGE  
CASE 620A01  
ISSUE O  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION L TO CENTER OF LEAD WHEN  
FORMED PARALLEL.  
4. DIMENSION F MAY NARROW TO 0.76 (0.030)  
WHERE THE LEAD ENTERS THE CERAMIC  
BODY.  
B
B
A
A
M
16  
9
8
5
THIS DRAWING REPLACES OBSOLETE  
CASE OUTLINE 620−10.  
L
INCHES  
DIM MIN MAX  
MILLIMETERS  
1
MIN  
19.05  
6.10  
−−−  
MAX  
19.93  
7.49  
5.08  
0.50  
A
B
C
D
E
F
0.750  
0.240  
0.785  
0.295  
16X J  
−−− 0.200  
0.015 0.020  
0.050 BSC  
0.39  
M
0.25 (0.010)  
T
B
1.27 BSC  
E
0.055  
0.065  
1.40  
1.65  
G
H
K
L
0.100 BSC  
2.54 BSC  
F
0.008  
0.125  
0.015  
0.170  
0.21  
3.18  
0.38  
4.31  
0.300 BSC  
7.62 BSC  
M
N
0
0.020  
15  
_
0.040  
0
_
0.51  
15  
_
1.01  
_
C
K
SEATING  
PLANE  
T
N
G
16X D  
M
0.25 (0.010)  
T A  
PDIP16  
P SUFFIX  
PLASTIC DIP PACKAGE  
CASE 64808  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION L TO CENTER OF LEADS WHEN  
FORMED PARALLEL.  
A−  
ISSUE R  
16  
1
9
8
B
S
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.  
5. ROUNDED CORNERS OPTIONAL.  
INCHES  
DIM MIN MAX  
MILLIMETERS  
MIN  
18.80  
6.35  
3.69  
0.39  
1.02  
MAX  
19.55  
6.85  
4.44  
0.53  
1.77  
F
A
B
C
D
F
0.740  
0.250  
0.145  
0.015  
0.040  
0.770  
0.270  
0.175  
0.021  
0.70  
C
L
SEATING  
PLANE  
T−  
G
H
J
0.100 BSC  
0.050 BSC  
2.54 BSC  
1.27 BSC  
K
M
0.008  
0.015  
0.130  
0.305  
10  
0.21  
0.38  
3.30  
7.74  
10  
H
J
K
L
0.110  
0.295  
0
2.80  
7.50  
0
G
D 16 PL  
M
S
_
_
_
_
0.020  
0.040  
0.51  
1.01  
M
M
0.25 (0.010)  
T A  
http://onsemi.com  
5
MC10H141  
MECL 10H and MECL 10K are trademarks of Motorola, Inc.  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 8002829855 Toll Free  
USA/Canada  
ON Semiconductor Website: http://onsemi.com  
Order Literature: http://www.onsemi.com/litorder  
Literature Distribution Center for ON Semiconductor  
P.O. Box 61312, Phoenix, Arizona 850821312 USA  
Phone: 4808297710 or 8003443860 Toll Free USA/Canada  
Fax: 4808297709 or 8003443867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
Japan: ON Semiconductor, Japan Customer Focus Center  
291 Kamimeguro, Meguroku, Tokyo, Japan 1530051  
Phone: 81357733850  
For additional information, please contact your  
local Sales Representative.  
MC10H141/D  

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