MC10H161 [ONSEMI]
Binary to 1-8 Decoder(Low); 二，以1-8译码器（低）
| 型号： | MC10H161 |
| 厂家： | 
ONSEMI |
| 描述： | Binary to 1-8 Decoder(Low) |
| 文件： | 总4页 (文件大小：123K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SEMICONDUCTOR TECHNICAL DATA
The MC10H161 provides parallel decoding of a three bit binary word to one
of eight lines. The MC10H161 is useful in high–speed multiplexer/demultiplexer
applications.
L SUFFIX
CERAMIC PACKAGE
CASE 620–10
The MC10H161 is designed to decode a three bit input word to one of eight
output lines. The MC10H161 output will be low when selected while all other
output are high. The enable inputs, when either or both are high, force all
outputs high.
The MC10H161 is a true parallel decoder. This eliminates unequal parallel
path delay times found in other decoder designs. These devices are ideally
suited for multiplexer/demultiplexer applications.
P SUFFIX
PLASTIC PACKAGE
CASE 648–08
FN SUFFIX
PLCC
CASE 775–02
•
•
•
Propagation Delay, 1.0 ns Typical
Power Dissipation, 315 mW Typical (same as MECL 10K)
Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
LOGIC DIAGRAM
E0
E1 15
2
6
5
Q0
Q1
•
•
Voltage Compensated
MECL 10K–Compatible
V
V
V
= Pin 1
= Pin 16
= Pin 8
CC1
CC2
EE
4
3
Q2
Q3
A
7
9
MAXIMUM RATINGS
13 Q4
12 Q5
Characteristic
Symbol
Rating
Unit
Vdc
Vdc
mA
B
Power Supply (V
= 0)
V
EE
–8.0 to 0
CC
Input Voltage (V
= 0)
V
I
0 to V
EE
11 Q6
10 Q7
CC
Output Current— Continuous
— Surge
I
50
100
out
C
14
TRUTH TABLE
Operating Temperature Range
T
0 to +75
°C
A
ENABLE
INPUTS
E1 E0
INPUTS
OUTPUTS
Storage Temperature Range— Plastic
— Ceramic
T
stg
–55 to +150
–55 to +165
°C
°C
C
B
A Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7
L
L
L
L
L
L
L
L
H
X
L
L
L
L
L
L
L
L
X
H
L
L
L
L
L
H
H
L
L
H
L
H
L
H
L
H
X
X
L
H
L
H
H
L
H
H
H
H
H
H
H
H
H
H
L
H
H
H
H
H
H
H
H
H
H
L
H
H
H
H
H
H
H
H
H
H
L
H
H
H
H
H
H
H
H
H
H
L
H
H
H
H
H
H
H
H
H
H
L
H
H
H
H
H
H
H
H
H
ELECTRICAL CHARACTERISTICS (V
0°
= –5.2 V ±5%) (See Note)
H
H
H
H
H
H
H
H
EE
L
25°
75°
H
H
H
H
X
X
L
Characteristic
Power Supply Current
Input Current High
Input Current Low
High Output Voltage
Low Output Voltage
High Input Voltage
Low Input Voltage
Symbol Min
Max
84
Min
—
Max
76
Min
—
Max
84
Unit
H
H
X
X
I
E
—
—
mA
µA
µA
H
H
I
465
—
—
275
—
—
275
—
inH
I
0.5
0.5
0.3
inL
DIP
V
OH
–1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc
–1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc
–1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc
–1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc
PIN ASSIGNMENT
V
OL
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
V
CC2
CC1
E0
V
IH
E1
V
IL
Q3
Q2
Q1
Q0
A
C
AC PARAMETERS
Q4
Propagation Delay
Data
t
pd
ns
Q5
Q6
0.6
0.8
2.0
2.3
0.65
0.8
2.1
2.4
0.7
0.9
2.2
2.5
Enable
Q7
B
Rise Time
Fall Time
t
0.55
0.55
1.7
1.7
0.65
0.65
1.8
1.8
0.7
0.7
1.9
1.9
ns
ns
r
V
EE
t
f
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
Tables on page 6–11 of the Motorola MECL Data
Book (DL122/D).
NOTE:
Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table,
afterthermalequilibriumhasbeenestablished.Thecircuitisinatestsocketormountedonaprintedcircuit
board and transverse air flow greater than 500 Iinear fpm is maintained. Outputs are terminated through
a 50–ohm resistor to –2.0 volts.
3/93
Motorola, Inc. 1996
REV 5
MC10H161
TYPICAL APPLICATIONS
FIGURE 1 — HIGH SPEED 16–BIT MULTIPLEXER/DEMULTIPLEXER
Control Selection
15 14 13 12 11 10
9
8
7
6 5 4 3 2 1 0
S0
S1
MC10H136
C
R
A
B
C
D
E1
C
B
E1
C
B
MC10H164
MC10H164
D0
A
A
D0
S0
S1
S0
S1
MC10H136
C
R
A
B
C
D
C
R
E0
E0
E1
C
B
E1
C
B
MC10H161
MC10H161
Start/Stop
A
A
15 14 1312 11 10
9
8
7
6 5 4 3 2 1 0
FIGURE 2 — 1–OF–64 LINE MULTIPLEXER
A
B C
E
E
E
D
out
MC10H164
A
B C
D
D
out
out
MC10H164
A
B C
MC10H164
MSB
LSB
Q7
Q6
Q5
Q4
Q3
Q2
Q1
Q0
A
B C
14
9
E
E
D
D
out
out
MC10H164
MC10H161
A
B C
7
MC10H164
A
B C
E
E
D
D
out
out
MC10H164
A
B C
MC10H164
The Bit chosen is dependent on six–bit
code present on inputs 7, 9, 14 of the
MC10H161 and the A, B, C inputs of the
MC10H164.
A
B C
E
D
out
MC10H164
MOTOROLA
2–250
MC10H161
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
M
S
S
0.007 (0.180)
T
L–M
N
B
Y BRK
–M–
–N–
M
S
S
0.007 (0.180)
T
L–M
N
U
D
D
–L–
Z
W
20
1
S
S
S
0.010 (0.250)
T
L–M
N
G1
X
V
VIEW D–D
M
M
S
S
S
S
A
R
0.007 (0.180)
0.007 (0.180)
T
L–M
L–M
N
N
Z
T
M
S
S
0.007 (0.180)
T
L–M
N
H
C
K1
E
K
0.004 (0.100)
–T– SEATING
G
J
PLANE
M
S
S
0.007 (0.180)
T
L–M
N
F
VIEW S
G1
VIEW S
S
S
S
0.010 (0.250)
T
L–M
N
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
INCHES
MILLIMETERS
DIM
MIN
MAX
0.395
0.395
0.180
0.110
0.019
MIN
9.78
9.78
4.20
2.29
0.33
MAX
10.03
10.03
4.57
2.79
0.48
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
A
B
C
E
0.385
0.385
0.165
0.090
0.013
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
F
G
H
J
K
R
U
V
W
X
Y
0.050 BSC
1.27 BSC
0.026
0.020
0.025
0.350
0.350
0.042
0.042
0.042
–––
0.032
–––
–––
0.356
0.356
0.048
0.048
0.056
0.020
10
0.66
0.51
0.64
8.89
8.89
1.07
1.07
1.07
–––
2
0.81
–––
–––
9.04
9.04
1.21
1.21
1.42
0.50
10
Z
G1
K1
2
0.310
0.040
0.330
–––
7.88
1.02
8.38
–––
2–251
MOTOROLA
MC10H161
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
–A–
NOTES:
ISSUE V
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
16
1
9
8
–B–
C
L
INCHES
MILLIMETERS
DIM
A
B
C
D
MIN
MAX
0.785
0.295
0.200
0.020
MIN
19.05
6.10
–––
MAX
19.93
7.49
5.08
0.50
0.750
0.240
–––
–T–
SEATING
PLANE
0.015
0.39
K
N
E
0.050 BSC
1.27 BSC
F
0.055
0.065
1.40
1.65
G
H
K
L
M
N
0.100 BSC
2.54 BSC
M
E
0.008
0.125
0.015
0.170
0.21
3.18
0.38
4.31
F
J 16 PL
G
0.300 BSC
7.62 BSC
M
S
0.25 (0.010)
T B
0
15
0
15
D 16 PL
0.25 (0.010)
0.020
0.040
0.51
1.01
M
S
T
A
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
–A–
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
16
1
9
8
B
S
INCHES
MILLIMETERS
DIM
A
B
C
D
F
MIN
MAX
0.770
0.270
0.175
0.021
0.70
MIN
18.80
6.35
3.69
0.39
1.02
MAX
19.55
6.85
4.44
0.53
1.77
F
0.740
0.250
0.145
0.015
0.040
C
L
SEATING
–T–
G
H
J
K
L
0.100 BSC
0.050 BSC
2.54 BSC
1.27 BSC
PLANE
K
M
0.008
0.015
0.130
0.305
10
0.21
0.38
3.30
7.74
10
H
J
0.110
0.295
0
2.80
7.50
0
G
D 16 PL
0.25 (0.010)
M
S
0.020
0.040
0.51
1.01
M
M
T
A
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MC10H161/D
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