MC10H424 [ONSEMI]
Quad TTL-to-ECL Translator with ECL Strobe; 四TTL至ECL转换器与ECL频闪
| 型号： | MC10H424 |
| 厂家： | 
ONSEMI |
| 描述： | Quad TTL-to-ECL Translator with ECL Strobe |
| 文件： | 总4页 (文件大小：106K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SEMICONDUCTOR TECHNICAL DATA
The MC10H424 is a Quad TTL–to–ECL translator with an ECL strobe.
Power supply requirements are ground, +5.0 volts, and –5.2 volts.
L SUFFIX
CERAMIC PACKAGE
CASE 620–10
•
•
Propagation Delay, 1.5 ns Typical
Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
P SUFFIX
PLASTIC PACKAGE
CASE 648–08
•
•
Voltage Compensated
MECL 10K — Compatible
FN SUFFIX
PLCC
MAXIMUM RATINGS
CASE 775–02
Characteristic
= 5.0 V)
Symbol
Rating
–8.0 to 0
0 to +7.0
Unit
Vdc
Vdc
Vdc
Vdc
mA
Power Supply (V
Power Supply (V
V
CC
EE
= – 5.2 V)
V
EE
CC
LOGIC DIAGRAM
Input Voltage (ECL)
Input Voltage (TTL)
V
I
0 to V
EE
V
I
0 to V
CC
5
6
4
2
Output Current — Continuous
— Surge
I
50
100
out
Operating Temperature Range
T
A
0 to +75
°C
°C
7
10
11
3
1
Storage Temperature Range — Plastic
— Ceramic
T
–55 to +150
–55 to +165
stg
12
15
ELECTRICAL CHARACTERISTICS (V
= –5.2 V ± 5%, V
= 5.0 V ± 5.0%)
EE
CC
0°
25°
75°
Characteristic
Symbol
Min
Max
Min
Max
Min
Max
Unit
13
14
Negative Power Supply
Drain Current
I
—
72
—
66
—
72
mAdc
E
Positive Power Supply
Drain Current
I
—
—
—
16
25
50
—
—
—
16
25
50
—
—
—
18
25
50
mAdc
mAdc
µAdc
CCH
GND = PIN 16
V
V
(+5.0 VDC)
(–5.2 VDC)
=
=
PIN 9
PIN 8
I
CC
EE
CCL
Reverse Current Pin
5,7,10,11
I
R
Forward Current Pin
5,7,10,11
I
—
–3.2
—
–3.2
—
–3.2
mAdc
F
DIP
Input HIGH Current Pin 6
Input LOW Current Pin 6
Input Breakdown Voltage
Input Clamp Voltage
I
—
0.5
5.5
—
450
—
—
0.5
5.5
—
310
—
—
0.3
5.5
—
310
—
µAdc
µAdc
Vdc
Vdc
Vdc
Vdc
Vdc
PIN ASSIGNMENT
inH
I
inL
V
—
—
—
(BR)in
B
GND
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
OUT
V
I
–1.5
–1.5
–1.5
–0.735
–1.60
—
C
D
D
C
A
B
A
OUT
OUT
OUT
OUT
OUT
OUT
OUT
High Output Voltage
V
–1.02 –0.84 –0.98 –0.81 –0.92
–1.95 –1.63 –1.95 –1.63 –1.95
OH
Low Output Voltage
V
OL
High Input Voltage Pin
5,7,10,11
V
2.0
—
2.0
—
+2.0
IH
Low Input Voltage Pin
5,7,10,11
V
—
0.8
—
0.8
—
0.8
Vdc
A
IL
IN
COMMON
STROBE
D
C
V
IN
High Input Voltage Pin 6
Low Input Voltage Pin 6
V
–1.17 –0.84 –1.13 –0.81 –1.07
–1.95 –1.48 –1.95 –1.48 –1.95
–0.735
–1.45
Vdc
Vdc
IH
V
B
IL
IN
IN
V
CC
EE
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
Tables on page 6–11 of the Motorola MECL Data
Book (DL122/D).
3/93
REV 5
Motorola, Inc. 1996
MC10H424
AC PARAMETERS
NOTE:
EachMECL10Hseriescircuithasbeendesignedtomeetthedcspecifications
shown in the test table, after thermal equilibrium has been established. The
circuit is in a test socket or mounted on a printed circuit board and transverse
air flow greater than 500 Ifpm is maintained. Outputs are terminated through
a 50–ohm resistor to –2.1 volts.
Propaga-
tion Delay
Data
t
pd
ns
0.5 2.2 0.5 2.3 0.5 2.4
0.5 2.2 0.5 2.3 0.5 2.4
Strobe
Rise Time
Fall Time
t
0.5 2.0 0.5 2.0 0.5 2.2 ns
0.5 2.0 0.5 2.0 0.5 2.2 ns
r
t
f
APPLICATIONS INFORMATION
The MC10H424 has TTL–compatible inputs, an ECL strobe
and MECL complementary open–emitter outputs that allow
use as an inverting/non–inverting translator or as a differential
line driver. When the common strobe input is at the low–logic
level, it forces all true outputs to a MECL low–logic state and
all inverting outputs to a MECL high–logic state.
An advantage of this device is that TTL–level information
can be transmitted differentially, via balanced twisted pair
lines, to MECL equipment, where the signal can be received
by the MC10H115 or MC10H116 differential line receivers.
MOTOROLA
2–118
MC10H424
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
M
S
S
0.007 (0.180)
T
L–M
N
B
Y BRK
–M–
–N–
M
S
S
0.007 (0.180)
T
L–M
N
U
D
D
–L–
Z
W
20
1
S
S
S
0.010 (0.250)
T
L–M
N
G1
X
V
VIEW D–D
M
M
S
S
S
S
A
R
0.007 (0.180)
0.007 (0.180)
T
L–M
L–M
N
N
Z
T
M
S
S
0.007 (0.180)
T
L–M
N
H
C
K1
E
K
0.004 (0.100)
–T– SEATING
G
J
PLANE
M
S
S
0.007 (0.180)
T
L–M
N
F
VIEW S
G1
VIEW S
S
S
S
0.010 (0.250)
T
L–M
N
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
INCHES
MILLIMETERS
DIM
MIN
MAX
0.395
0.395
0.180
0.110
0.019
MIN
9.78
9.78
4.20
2.29
0.33
MAX
10.03
10.03
4.57
2.79
0.48
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
A
B
C
E
0.385
0.385
0.165
0.090
0.013
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
F
G
H
J
K
R
U
V
W
X
Y
0.050 BSC
1.27 BSC
0.026
0.020
0.025
0.350
0.350
0.042
0.042
0.042
–––
0.032
–––
–––
0.356
0.356
0.048
0.048
0.056
0.020
10
0.66
0.51
0.64
8.89
8.89
1.07
1.07
1.07
–––
2
0.81
–––
–––
9.04
9.04
1.21
1.21
1.42
0.50
10
Z
G1
K1
2
0.310
0.040
0.330
–––
7.88
1.02
8.38
–––
2–119
MOTOROLA
MC10H424
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
–A–
NOTES:
ISSUE V
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
16
1
9
8
–B–
C
L
INCHES
MILLIMETERS
DIM
A
B
C
D
MIN
MAX
0.785
0.295
0.200
0.020
MIN
19.05
6.10
–––
MAX
19.93
7.49
5.08
0.50
0.750
0.240
–––
–T–
SEATING
PLANE
0.015
0.39
K
N
E
0.050 BSC
1.27 BSC
F
0.055
0.065
1.40
1.65
G
H
K
L
M
N
0.100 BSC
2.54 BSC
M
E
0.008
0.125
0.015
0.170
0.21
3.18
0.38
4.31
F
J
16 PL
0.25 (0.010)
G
0.300 BSC
7.62 BSC
M
S
T
B
0
15
0
15
D 16 PL
0.25 (0.010)
0.020
0.040
0.51
1.01
M
S
T
A
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
–A–
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
16
1
9
8
B
S
INCHES
MILLIMETERS
DIM
A
B
C
D
F
MIN
MAX
0.770
0.270
0.175
0.021
0.70
MIN
18.80
6.35
3.69
0.39
1.02
MAX
19.55
6.85
4.44
0.53
1.77
F
0.740
0.250
0.145
0.015
0.040
C
L
SEATING
–T–
G
H
J
K
L
0.100 BSC
0.050 BSC
2.54 BSC
1.27 BSC
PLANE
K
M
0.008
0.015
0.130
0.305
10
0.21
0.38
3.30
7.74
10
H
J
0.110
0.295
0
2.80
7.50
0
G
D 16 PL
0.25 (0.010)
M
S
0.020
0.040
0.51
1.01
M
M
T
A
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MC10H424/D
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