MC12095MNR4G [ONSEMI]
2.5 GHz Low Power Prescaler With Stand−By Mode; 2.5 GHz的低功耗分频器采用待机模式
| 型号： | MC12095MNR4G |
| 厂家： | 
ONSEMI |
| 描述： | 2.5 GHz Low Power Prescaler With Stand−By Mode |
| 文件： | 总8页 (文件大小：133K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MC12095
2.5 GHz Low Power
Prescaler With Stand−By
Mode
Description
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MARKING
The MC12095 is a single modulus prescaler for low power
frequency division of a 2.5 GHz high frequency input signal.
MOSAIC V™ technology is utilized to achieve low power dissipation
of 24 mW at a minimum supply voltage of 2.7 V.
DIAGRAMS
On−chip output termination provides output current to drive a
2.0 pF (typical) high impedance load. If additional drive is required
for the prescaler output, an external resistor can be added in parallel
from the OUT pin to GND to increase the output power. Care must be
taken not to exceed the maximum allowable current through the
output.
8
SO−8
D SUFFIX
CASE 751
12095
ALYW
G
8
1
1
Divide ratio control input (SW) selects the required divide ratio of
÷2 or ÷4. Stand−By mode is available to reduce current drain to
100 mA typical when the standby pin SB is switched LOW disabling
the prescaler.
DFN8
MN SUFFIX
CASE 506AA
1
4
Features
• 2.5 GHz Toggle Frequency
• Supply Voltage 2.7 V to 5.5 Vdc
• Low Power 8.7 mA Typical
• Operating Temperature −40°C to 85°C
• Divide by 2 or 4 Selected by the SW Pin
• Pb−Free Packages are Available
A
L
Y
W
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
Table 1. FUNCTIONAL TABLE
SW
H
Divide Ratio
PIN CONNECTIONS
2
4
1
2
3
4
8
7
6
5
IN
IN
L
V
CC
SB
NC
SW
Gnd
1. SW: H = (V − 0.4 V) to V ; L = OPEN
2. SB: H = 2.0 V to V ; L = GND to 0.8 V
CC
CC
OUT
CC
(Top View)
V
= 2.7 to 5.5 V
CC
C3
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
C1
V
CC
IN
IN
SB
SW
EXTERNAL
COMPONENTS
C1 = C2 = 1000 pF
C3 = 0.1 mF
50 W
OUT
GND
C4 = 2.0 pF
C2
C4
Figure 1. AC Test Circuit
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
January, 2006 − Rev. 6
MC12095/D
MC12095
Table 2. ATTRIBUTES
Characteristics
Value
N/A
Internal Input Pulldown Resistor
Internal Input Pullup Resistor
ESD Protection
N/A
Human Body Model
Machine Model
> 4 kV
> 200 V
> 2 kV
Charged Device Model
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)
Pb Pkg
Pb−Free Pkg
SOIC−8
DFN8
Level 1
Level 1
Level 1
Level 1
Flammability Rating
Transistor Count
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
125 Devices
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
Table 3. MAXIMUM RATINGS
Symbol
Rating
Value
Unit
Vdc
°C
V
Power Supply Voltage, Pin 2
Operating Temperature Range
Storage Temperature Range
Maximum Output Current, Pin 4
−0.5 to 6.0
−40 to 85
−65 to 150
8.0
CC
T
A
T
°C
stg
I
mA
O
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
NOTE: ESD data available upon request.
Table 4. ELECTRICAL CHARACTERISTICS (V = 2.7 to 5.5 V; T = −40 to 85°C, unless otherwise noted.)
CC
A
Symbol
Characteristic
Min
500
−
Typ
3.0
8.7
100
−
Max
2.5
14
Unit
GHz
mA
mA
V
f
I
I
Toggle Frequency (Sine Wave)
t
Supply Current
CC
SB
Stand−By Current
−
200
V
V
V
V
V
Stand−By Input HIGH (SB)
Stand−By Input LOW (SB)
Divide Ratio Control Input HIGH (SW)
Divide Ratio Control Input LOW (SW)
Output Voltage Swing (2pF Load)
2.0
GND
V
V
+ 0.5 V
0.8
IH1
IL1
CC
−
V
V
− 0.4
V
CC
+ 0.5 V
V
IH2
IL2
CC
CC
OPEN
OPEN
OPEN
500−1000 MHz Input
1000−1500 MHz Input
1500−2500 MHz Input
800
400
200
−
450
250
−
−
−
mVpp
mVpp
OUT
V
Input Voltage Sensitivity
200
−
1000
IN
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2
MC12095
0
−10
−20
−30
−40
500
700
900
1100
1300
1500
1700
1900
2100
2300
2500
Input Frequency (MHz)
(Divide By 2 Mode, T = 25°C, V = 2.7 V)
CC
Figure 2. Typical Minimum Input Sensitivity versus Input Frequency
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3
MC12095
1800
1600
1400
1200
1000
800
600
400
200
0
−40°C
+25°C
+85°C
SPEC
500
750
1000
1250
1500
1750
2000
2250
2500
Input Frequency (MHz)
(Divide By 2 Mode, V = 2.7 V)
CC
Figure 3. Typical Output Amplitude versus Frequency Over Temperature
1800
1600
1400
1200
1000
800
600
400
200
0
−40°C
+25°C
+85°C
SPEC
500
750
1000
1250
1500
1750
2000
2250
2500
Input Frequency (MHz)
(Divide By 4 Mode, V = 2.7 V)
CC
Figure 4. Typical Output Amplitude versus Frequency Over Temperature
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4
MC12095
150
125
100
75
50
25
0
500
700
900
1100
1300
1500
1700
1900
2100
2300
2500
Input Frequency (MHz)
Figure 5. Input Impedance versus Frequency
100
50
0
−50
−100
−150
−200
500
700
900
1100
1300
1500
1700
1900
2100
2300
2500
Input Frequency (MHz)
Figure 6. Input Impedance versus Frequency
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5
MC12095
ORDERING INFORMATION
Device
†
Package
Shipping
MC12095D
SOIC−8
98 Units / Rail
98 Units / Rail
MC12095DG
SOIC−8
(Pb−Free)
MC12095DR2
SOIC−8
98 Units / Rail
98 Units / Rail
MC12095DR2G
SOIC−8
(Pb−Free)
MC12095MNR4
DFN8
1000 / Tape & Reel
1000 / Tape & Reel
MC12095MNR4G
DFN8
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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6
MC12095
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AG
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
−X−
A
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
8
5
4
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
S
M
M
B
0.25 (0.010)
Y
1
K
−Y−
G
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
0.197
0.157
0.069
0.020
A
B
C
D
G
H
J
K
M
N
S
4.80
3.80
1.35
0.33
5.00 0.189
4.00 0.150
1.75 0.053
0.51 0.013
C
N X 45
_
SEATING
PLANE
−Z−
1.27 BSC
0.050 BSC
0.10 (0.004)
0.10
0.19
0.40
0
0.25 0.004
0.25 0.007
1.27 0.016
0.010
0.010
0.050
8
0.020
0.244
M
J
H
D
8
0
_
_
_
_
0.25
5.80
0.50 0.010
6.20 0.228
M
S
S
X
0.25 (0.010)
Z
Y
SOLDERING FOOTPRINT*
1.52
0.060
7.0
4.0
0.275
0.155
0.6
0.024
1.270
0.050
mm
inches
ǒ
Ǔ
SCALE 6:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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7
MC12095
PACKAGE DIMENSIONS
DFN8
CASE 506AA−01
ISSUE C
NOTES:
D
A
B
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994 .
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
PIN ONE
REFERENCE
MILLIMETERS
DIM MIN
MAX
1.00
0.05
E
A
A1
A3
b
0.80
0.00
0.20 REF
0.20
0.30
2 X
D
D2
E
E2
e
K
2.00 BSC
0.10
C
1.10
1.30
2.00 BSC
2 X
0.70
0.90
0.50 BSC
0.10
C
TOP VIEW
0.20
0.25
−−−
0.35
L
A
0.10
0.08
C
C
8 X
(A3)
SIDE VIEW
D2
A1
SEATING
PLANE
C
e
e/2
4
1
8 X L
E2
K
8
5
0.10 C A B
8 X b
0.05
C
NOTE 3
BOTTOM VIEW
MOSAIC V is a trademark of Motorola, Inc.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
Literature Distribution Center for ON Semiconductor
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
For additional information, please contact your
local Sales Representative.
MC12095/D
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