MC14007UBDR2G [ONSEMI]
Dual Complementary Pair Plus Inverter; 双互补对加变频器
| 型号： | MC14007UBDR2G |
| 厂家： | 
ONSEMI |
| 描述： | Dual Complementary Pair Plus Inverter |
| 文件： | 总9页 (文件大小：155K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MC14007UB
Dual Complementary Pair
Plus Inverter
The MC14007UB multipurpose device consists of three N−Channel
and three P−Channel enhancement mode devices packaged to provide
access to each device. These versatile parts are useful in inverter
circuits, pulse−shapers, linear amplifiers, high input impedance
amplifiers, threshold detectors, transmission gating, and functional
gating.
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MARKING
DIAGRAMS
14
Features
PDIP−14
P SUFFIX
CASE 646
• Diode Protection on All Inputs
• Supply Voltage Range = 3.0 Vdc to 18 Vdc
• Capable of Driving Two Low−power TTL Loads or One Low−power
Schottky TTL Load Over the Rated Temperature Range
• Pin−for−Pin Replacement for CD4007A or CD4007UB
• This device has 2 outputs without ESD Protection. Antistatic
precautions must be taken.
MC14007UBCP
AWLYYWWG
1
14
SOIC−14
D SUFFIX
CASE 751A
14007UG
AWLYWW
• Pb−Free Packages are Available
1
14
MAXIMUM RATINGS (Voltages Referenced to V
)
SS
SOEIAJ−14
F SUFFIX
CASE 965
MC14007UB
ALYWG
Symbol
Parameter
Value
−0.5 to +18.0
Unit
V
V
DC Supply Voltage Range
DD
1
V , V
in out
Input or Output Voltage Range
(DC or Transient)
−0.5 to V +0.5
V
DD
A
WL, L
YY, Y
= Assembly Location
= Wafer Lot
= Year
I , I
Input or Output Current
(DC or Transient) per Pin
±10
mA
in out
P
Power Dissipation, per Package
(Note 1)
500
mW
D
WW, W = Work Week
= Pb−Free Indicator
G
T
Ambient Temperature Range
Storage Temperature Range
−55 to +125
−65 to +150
260
°C
°C
°C
A
T
stg
PIN ASSIGNMENT
T
Lead Temperature
(8 second Soldering)
L
D−P
S−P
1
2
3
4
5
6
7
14
V
DD
B
B
B
B
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Temperature Derating:
13 D−P
A
GATE
S−N
12 OUT
C
11 S−P
C
Plastic “P and D/DW” Packages: – 7.0 mW/°C from 65°C 5o 125°C.
D−N
10 GATE
C
B
GATE
9
8
S−N
C
A
V
D−N
A
SS
D = DRAIN
S = SOURCE
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
October, 2006 − Rev. 8
MC14007UB/D
MC14007UB
A
B
A
B
12
1
9
2
4
C
3
5
INPUT
V
DD
14
C
11
13
8
INPUT OUTPUT CONDITION
INPUT
6
10
1
0
A = C, B = OPEN
A = B, C = OPEN
7
V
SS
Substrates of P−Channel devices internally
connected to V ; substrates of N−Channel
DD
devices internally connected to V
.
SS
Figure 1. Typical Application: 2−Input Analog Multiplexer
14 13
2
1
11
6
12
7
8
3
4
5
10
9
V
V
= PIN 14
= PIN 7
DD
SS
Figure 2. Schematic
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2
MC14007UB
ELECTRICAL CHARACTERISTICS (Voltages Referenced to V
)
SS
−55°C
25°C
125°C
Typ
(Note 2)
V
Vdc
DD
Min
Max
Min
Max
Min
Max
Symbol
Characteristic
Output Voltage
Unit
V
“0” Level
“1” Level
“0” Level
5.0
10
15
−
−
−
0.05
0.05
0.05
−
−
−
0
0
0
0.05
0.05
0.05
−
−
−
0.05
0.05
0.05
Vdc
OL
V
in
= V or 0
DD
V
5.0
10
15
4.95
9.95
14.95
−
−
−
4.95
9.95
14.95
5.0
10
15
−
−
−
4.95
9.95
14.95
−
−
−
Vdc
Vdc
V
in
= 0 or V
OH
DD
V
Input Voltage
(V = 4.5 Vdc)
IL
5.0
10
15
−
−
−
1.0
2.0
2.5
−
−
−
2.25
4.50
6.75
1.0
2.0
2.5
−
−
−
1.0
2.0
2.5
O
(V = 9.0 Vdc)
O
(V = 13.5 Vdc)
O
V
5.0
10
15
4.0
8.0
12.5
−
−
−
4.0
8.0
12.5
2.75
5.50
8.25
−
−
−
4.0
8.0
12.5
−
−
−
Vdc
(V = 0.5 Vdc)
“1” Level
Source
Sink
IH
O
(V = 1.0 Vdc)
O
(V = 1.5 Vdc)
O
I
Output Drive Current
mAdc
OH
(V
(V
(V
(V
= 2.5 Vdc)
= 4.6 Vdc)
= 9.5 Vdc)
= 13.5 Vdc)
5.0
5.0
10
–3.0
–0.64
–1.6
−
−
−
−
–2.4
–0.51
−1.3
−3.4
–5.0
–1.0
–2.5
–10
−
−
−
−
–1.7
−0.36
–0.9
−
−
−
−
OH
OH
OH
OH
15
–4.2
−2.4
I
(V = 0.4 Vdc)
5.0
10
15
0.64
1.6
4.2
−
−
−
0.51
1.3
3.4
1.0
2.5
10
−
−
−
0.36
0.9
2.4
−
−
−
mAdc
OL
OL
(V = 0.5 Vdc)
OL
(V = 1.5 Vdc)
OL
I
Input Current
Input Capacitance
15
−
−
±0.1
−
−
±0.00001
±0.1
−
−
±1.0
mAdc
in
C
−
−
5.0
7.5
−
pF
in
(V = 0)
in
I
Quiescent Current
(Per Package)
5.0
10
15
−
−
−
0.25
0.5
1.0
−
−
−
0.0005
0.0010
0.0015
0.25
0.5
1.0
−
−
−
7.5
15
30
mAdc
mAdc
DD
I
Total Supply Current (Notes 3 and 4)
(Dynamic plus Quiescent,
5.0
10
15
I
I
I
= (0.7 mA/kHz) f + I /6
DD
T
T
T
T
= (1.4 mA/kHz) f + I /6
DD
Per Gate) (C = 50 pF)
= (2.2 mA/kHz) f + I /6
L
DD
2. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
3. The formulas given are for the typical characteristics only at 25°C.
4. To calculate total supply current at loads other than 50 pF: I (C ) = I (50 pF) + (C − 50) Vfk
T
L
T
L
where: I is in mA (per package), C in pF, V = (V − V ) in volts, f in kHz is input frequency, and k = 0.003.
T
L
DD
SS
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3
−
12
16
20
−
−
−
0
−
1
8.0
−ꢀ6.0
−ꢀ4.0
−ꢀ2.0
−ꢀ0
0
2.0
4.0
8.0
10
−
−
MC14007UB
SWITCHING CHARACTERISTICS (Note 5) (C = 50 pF, T = 25°C)
L
A
V
Typ
DD
Vdc
(Note 6)
Symbol
Characteristic
Output Rise Time
Min
Max
Unit
t
ns
TLH
−
−
−
t
t
t
= (1.2 ns/pF) C + 30 ns
5.0
10
15
90
45
35
180
90
70
TLH
TLH
TLH
L
= (0.5 ns/pF) C + 20 ns
L
= (0.4 ns/pF) C + 15 ns
L
t
ns
ns
ns
Output Fall Time
THL
−
−
−
t
t
t
= (1.2 ns/pF) C + 15 ns
= (0.5 ns/pF) C + 15 ns
= (0.4 ns/pF) C + 10 ns
5.0
10
15
75
40
30
150
80
60
THL
THL
THL
L
L
L
t
Turn−Off Delay Time
PLH
−
−
−
t
t
t
= (1.5 ns/pF) C + 35 ns
= (0.2 ns/pF) C + 20 ns
= (0.15 ns/pF) C + 17.5 ns
5.0
10
15
60
30
25
125
75
55
PLH
PLH
PLH
L
L
L
t
Turn−On Delay Time
PHL
−
−
−
t
t
t
= (1.0 ns/pF) C + 10 ns
= (0.3 ns/pF) C + 15 ns
= (0.2 ns/pF) C + 15 ns
5.0
10
15
60
30
25
125
75
55
PHL
PHL
PHL
L
L
L
5. The formulas given are for the typical characteristics only. Switching specifications are for device connected as an inverter.
6. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
V
= −ꢀV
14
V
= V
DD GS
DD
GS
14
I
V
= V − V
DS OH DD
OH
I
OL
V
= V
DS OL
7
V
SS
7
V
SS
All unused inputs connected to ground.
All unused inputs connected to ground.
0
4.0
8.0
20
16
12
8.0
4.0
0
a
V
= 15 Vdc
GS
b
c
c
a
V
= −ꢀ5.0 Vdc
b
a
GS
10 Vdc
a
b
c
T
=
ꢀ55°C
= +ꢀ25°C
= +ꢀ125°C
A
T
A
b
c
T
A
a
b
c
T = −ꢀ55°C
A
c
b
T
A
= +ꢀ25°C
b
T
A
= +ꢀ125°C
c
−ꢀ15 Vdc
−ꢀ10 Vdc
a
a
c
b
5.0 Vdc
6.0
a
V
, DRAIN VOLTAGE (Vdc)
V , DRAIN VOLTAGE (Vdc)
DS
DS
Figure 3. Typical Output Source Characteristics
Figure 4. Typical Output Sink Characteristics
These typical curves are not guarantees, but are design aids.
Caution: The maximum current rating is 10 mA per pin.
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4
MC14007UB
V
I
DD
20 ns
20 ns
V
V
V
V
DD
SS
OH
OL
0.01 mF
90%
50%
10%
500ꢁmF
V
D
CERAMIC
in
14
V
t
t
PLH
PHL
V
in
PULSE
GENERATOR
90%
50%
10%
V
out
V
out
C
L
7
SS
t
t
TLH
THL
Figure 5. Switching Time and Power Dissipation Test Circuit and Waveforms
APPLICATIONS
The MC14007UB dual pair plus inverter, which has access to all its elements offers a number of unique circuit applications.
Figures 1, 6, and 7 are a few examples of the device flexibility.
+ꢀV
V
DD
DD
2
OUT = A+B•C
14
DISABLEꢂ3
1
13
11
11
2
1
10
12
INPUTꢂ10
12ꢂOUTPUT
B
OUTPUT
8
7
9
8
9
5
DISABLEꢂ6
3
6
7
C
A
4
INPUT
DISABLE
OUTPUT
1
0
X
0
0
1
0
1
OPEN
Substrates of P−Channel devices internally connected to V
Substrates of N−Channel devices internally connected to V
;
.
DD
SS
X = Don’t Care
Figure 7. AOI Functions Using Tree Logic
Figure 6. 3−State Buffer
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5
MC14007UB
ORDERING INFORMATION
Device
†
Package
Shipping
MC14007UBCP
PDIP−14
25 Units / Rail
55 Units / Rail
MC14007UBCPG
PDIP−14
(Pb−Free)
MC14007UBD
SOIC−14
MC14007UBDG
SOIC−14
(Pb−Free)
MC14007UBDR2
SOIC−14
2500 / Tape & Reel
2000 / Tape & Reel
MC14007UBDR2G
SOIC−14
(Pb−Free)
MC14007UBFEL
SOEIAJ−14
MC14007UBFELG
SOEIAJ−14
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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6
MC14007UB
PACKAGE DIMENSIONS
PDIP−14
CASE 646−06
ISSUE P
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
14
1
8
7
B
INCHES
MILLIMETERS
A
F
DIM
A
B
C
D
F
MIN
MAX
0.770
0.260
0.185
0.021
0.070
MIN
18.16
6.10
3.69
0.38
1.02
MAX
19.56
6.60
4.69
0.53
1.78
0.715
0.240
0.145
0.015
0.040
L
N
C
G
H
J
K
L
M
N
0.100 BSC
2.54 BSC
0.052
0.008
0.115
0.290
−−−
0.095
0.015
0.135
0.310
10
1.32
0.20
2.92
7.37
−−−
0.38
2.41
0.38
3.43
7.87
10
−T−
SEATING
PLANE
J
_
_
K
0.015
0.039
1.01
D 14 PL
H
G
M
M
0.13 (0.005)
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7
MC14007UB
PACKAGE DIMENSIONS
SOIC−14
CASE 751A−03
ISSUE H
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
−A−
14
8
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
−B−
P 7 PL
M
M
B
0.25 (0.010)
7
1
G
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
F
R X 45
_
C
A
B
C
D
F
G
J
K
M
P
R
8.55
3.80
1.35
0.35
0.40
8.75 0.337 0.344
4.00 0.150 0.157
1.75 0.054 0.068
0.49 0.014 0.019
1.25 0.016 0.049
0.050 BSC
0.25 0.008 0.009
0.25 0.004 0.009
−T−
SEATING
PLANE
J
M
K
1.27 BSC
D 14 PL
0.19
0.10
0
M
S
S
0.25 (0.010)
T
B
A
7
0
7
_
_
_
_
5.80
0.25
6.20 0.228 0.244
0.50 0.010 0.019
SOLDERING FOOTPRINT*
7X
7.04
14X
1.52
1
14X
0.58
1.27
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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8
MC14007UB
PACKAGE DIMENSIONS
SOEIAJ−14
CASE 965−01
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
L
14
8
E
Q
1
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
H
E
E
_
M
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
L
7
1
DETAIL P
Z
D
MILLIMETERS
INCHES
MIN MAX
−−− 0.081
VIEW P
DIM MIN
MAX
2.05
0.20
0.50
0.20
10.50
5.45
A
e
A
−−−
0.05
0.35
0.10
9.90
5.10
c
A
1
b
c
0.002
0.008
0.020
0.008
0.413
0.215
0.014
0.004
0.390
0.201
D
E
e
b
A
1
1.27 BSC
0.050 BSC
H
M
7.40
0.50
1.10
8.20
0.85
1.50
0.291
0.020
0.043
0.323
0.033
0.059
0.13 (0.005)
E
0.10 (0.004)
0.50
L
E
M
0
10
10
0.035
0
0.028
_
_
_
_
Q
1
0.70
−−−
0.90
1.42
Z
−−− 0.056
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
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Phone: 81−3−5773−3850
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
Literature Distribution Center for ON Semiconductor
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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
For additional information, please contact your local
Sales Representative
MC14007UB/D
相关型号：
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