MC14040B_05

更新时间:2024-09-18 06:59:38
品牌:ONSEMI
描述:12−Bit Binary Counter

MC14040B_05 概述

12−Bit Binary Counter 12位二进制计数器

MC14040B_05 数据手册

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MC14040B  
12−Bit Binary Counter  
The MC14040B 12−stage binary counter is constructed with MOS  
P−Channel and N−Channel enhancement mode devices in a single  
monolithic structure. This part is designed with an input wave shaping  
circuit and 12 stages of ripple−carry binary counter. The device  
advances the count on the negative−going edge of the clock pulse.  
Applications include time delay circuits, counter controls, and  
frequency−driving circuits.  
http://onsemi.com  
MARKING  
DIAGRAMS  
Features  
16  
1
Fully Static Operation  
Diode Protection on All Inputs  
Supply Voltage Range = 3.0 Vdc to 18 Vdc  
PDIP−16  
P SUFFIX  
CASE 648  
MC14040BCP  
AWLYYWWG  
Capable of Driving Two Low−power TTL Loads or One Low−power  
Schottky TTL Load Over the Rated Temperature Range  
Common Reset Line  
16  
SOIC−16  
D SUFFIX  
CASE 751B  
14040BG  
AWLYWW  
Pin−for−Pin Replacement for CD4040B  
Pb−Free Packages are Available*  
1
MAXIMUM RATINGS (Voltages Referenced to V  
)
SS  
16  
Symbol  
Parameter  
Value  
0.5 to +18.0  
Unit  
V
14  
040B  
ALYW  
TSSOP−16  
DT SUFFIX  
CASE 948F  
V
DC Supply Voltage Range  
DD  
V , V  
in out  
Input or Output Voltage Range  
(DC or Transient)  
0.5 to V + 0.5  
V
DD  
1
I , I  
Input or Output Current  
(DC or Transient) per Pin  
10  
mA  
in out  
16  
1
SOEIAJ−16  
F SUFFIX  
CASE 966  
P
T
Power Dissipation, per Package  
(Note 1)  
500  
mW  
MC14040B  
ALYWG  
D
Ambient Temperature Range  
Storage Temperature Range  
55 to +125  
65 to +150  
260  
°C  
°C  
°C  
A
T
stg  
A
WL, L  
YY, Y  
= Assembly Location  
= Wafer Lot  
T
Lead Temperature  
(8−Second Soldering)  
L
= Year  
WW, W = Work Week  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
G
= Pb−Free Indicator  
1. Temperature Derating:  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 2 of this data sheet.  
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C  
This device contains protection circuitry to guard against damage due to high  
static voltages or electric fields. However, precautions must be taken to avoid  
applications of any voltage higher than maximum rated voltages to this  
high−impedance circuit. For proper operation, V and V should be constrained  
in  
out  
to the range V v (V or V ) v V  
.
DD  
SS  
in  
out  
Unused inputs must always be tied to an appropriate logic voltage level  
(e.g., either V or V ). Unused outputs must be left open.  
SS  
DD  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
©
Semiconductor Components Industries, LLC, 2005  
1
Publication Order Number:  
August, 2005 − Rev. 7  
MC14040B/D  
 
MC14040B  
PIN ASSIGNMENT  
Q12  
Q6  
Q5  
Q7  
Q4  
Q3  
Q2  
1
2
3
4
5
6
7
8
16  
V
DD  
15 Q11  
14 Q10  
13 Q8  
12 Q9  
TRUTH TABLE  
Clock  
Reset  
Output State  
0
0
1
No Change  
Advance to next state  
All Outputs are low  
X
11  
10  
9
R
X = Don’t Care  
C
V
Q1  
SS  
LOGIC DIAGRAM  
Q1  
Q2  
Q3  
Q10  
Q11  
15  
Q12  
9
7
6
14  
1
CLOCK  
C
C
Q
Q
C
C
Q
Q
C
C
Q
Q
C
C
Q
Q
C
C
Q
Q
C
C
Q
10  
R
R
R
R
R
R
RESET  
11  
Q4 = PIN 5  
Q5 = PIN 3  
Q6 = PIN 2  
Q7 = PIN 4  
Q8 = PIN 13  
Q9 = PIN 12  
V
= PIN 16  
= PIN 8  
DD  
SS  
V
ORDERING INFORMATION  
Device  
Package  
Shipping  
MC14040BCP  
PDIP−16  
500 Units / Rail  
500 Units / Rail  
MC14040BCPG  
PDIP−16  
(Pb−Free)  
MC14040BD  
SOIC−16  
48 Units / Rail  
48 Units / Rail  
MC14040BDG  
SOIC−16  
(Pb−Free)  
MC14040BDR2  
SOIC−16  
2500 Units / Tape & Reel  
2500 Units / Tape & Reel  
MC14040BDR2G  
SOIC−16  
(Pb−Free)  
MC14040BDT  
MC14040BDTR2  
MC14040BFEL  
TSSOP−16*  
TSSOP−16*  
SOEIAJ−16  
96 Units / Rail  
2500 Units / Tape & Reel  
2000 Units / Tape & Reel  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
*This package is inherently Pb−Free.  
http://onsemi.com  
2
MC14040B  
ELECTRICAL CHARACTERISTICS (Voltages Referenced to V  
)
SS  
− 55_C  
25_C  
125_C  
V
Vdc  
DD  
Characteristic  
Symbol  
Unit  
Min  
Max  
Min  
Typ  
Max  
Min  
Max  
(Note 2)  
Output Voltage  
“0” Level  
“1” Level  
“0” Level  
V
5.0  
10  
15  
0.05  
0.05  
0.05  
0
0
0
0.05  
0.05  
0.05  
0.05  
0.05  
0.05  
Vdc  
OL  
V
in  
= V or 0  
DD  
V
5.0  
10  
15  
4.95  
9.95  
14.95  
4.95  
9.95  
14.95  
5.0  
10  
15  
4.95  
9.95  
14.95  
Vdc  
Vdc  
OH  
V
in  
= 0 or V  
DD  
Input Voltage  
(V = 4.5 or 0.5 Vdc)  
V
IL  
5.0  
10  
15  
1.5  
3.0  
4.0  
2.25  
4.50  
6.75  
1.5  
3.0  
4.0  
1.5  
3.0  
4.0  
O
(V = 9.0 or 1.0 Vdc)  
O
(V = 13.5 or 1.5 Vdc)  
O
V
Vdc  
“1” Level  
IH  
5.0  
10  
15  
3.5  
7.0  
11  
3.5  
7.0  
11  
2.75  
5.50  
8.25  
3.5  
7.0  
11  
(V = 0.5 or 4.5 Vdc)  
O
(V = 1.0 or 9.0 Vdc)  
O
(V = 1.5 or 13.5 Vdc)  
O
Output Drive Current  
I
mAdc  
OH  
(V  
(V  
(V  
(V  
= 2.5 Vdc)  
= 4.6 Vdc)  
= 9.5 Vdc)  
= 13.5 Vdc)  
Source  
Sink  
5.0  
5.0  
10  
– 3.0  
– 0.64  
– 1.6  
– 4.2  
– 2.4  
– 0.51  
– 1.3  
– 3.4  
– 4.2  
– 0.88  
– 2.25  
– 8.8  
– 1.7  
– 0.36  
– 0.9  
– 2.4  
OH  
OH  
OH  
OH  
15  
(V = 0.4 Vdc)  
(V = 0.5 Vdc)  
(V = 1.5 Vdc)  
I
5.0  
10  
15  
0.64  
1.6  
4.2  
0.51  
1.3  
3.4  
0.88  
2.25  
8.8  
0.36  
0.9  
2.4  
mAdc  
OL  
OL  
OL  
OL  
Input Current  
Input Capacitance  
I
15  
0.1  
0.00001  
5.0  
0.1  
7.5  
1.0  
mAdc  
in  
C
pF  
in  
(V = 0)  
in  
Quiescent Current  
(Per Package)  
I
5.0  
10  
15  
5.0  
10  
20  
0.005  
0.010  
0.015  
5.0  
10  
20  
150  
300  
600  
mAdc  
mAdc  
DD  
Total Supply Current (Notes 3 & 4)  
(Dynamic plus Quiescent,  
Per Package)  
I
5.0  
10  
15  
I
I
I
= (0.42 mA/kHz) f + I  
= (0.85 mA/kHz) f + I  
= (1.43 mA/kHz) f + I  
T
T
T
T
DD  
DD  
DD  
(C = 50 pF on all outputs, all  
L
buffers switching)  
2. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.  
3. The formulas given are for the typical characteristics only at 25_C.  
4. To calculate total supply current at loads other than 50 pF:  
I (C ) = I (50 pF) + (C – 50) Vfk  
T
L
T
L
where: I is in mA (per package), C in pF, V = (V – V ) in volts, f in kHz is input frequency, and k = 0.001.  
T
L
DD  
SS  
http://onsemi.com  
3
 
MC14040B  
SWITCHING CHARACTERISTICS (Note 5) (C = 50 pF, T = 25_C)  
L
A
Characteristic  
Symbol  
V
Min  
Typ  
Max  
Unit  
DD  
Vdc  
(Note 6)  
Output Rise and Fall Time  
t
,
ns  
TLH  
T
T
T
, T  
= (1.5 ns/pF) C + 25 ns  
= (0.75 ns/pF) C + 12.5 ns  
L
t
THL  
5.0  
10  
15  
100  
50  
40  
200  
100  
80  
TLH THL  
L
, T  
TLH THL  
, T  
TLH THL  
= (0.55 ns/pF) C + 9.5 ns  
L
Propagation Delay Time  
Clock to Q1  
t
t
,
PLH  
ns  
ns  
ns  
PHL  
t
t
t
, t  
= (1.7 ns/pF) C + 315 ns  
= (0.66 ns/pF) C + 137 ns  
= (0.5 ns/pF) C + 95 ns  
5.0  
10  
15  
260  
115  
80  
520  
230  
160  
PHL PLH  
L
, t  
PHL PLH  
L
, t  
PHL PLH  
L
Clock to Q12  
5.0  
10  
15  
1625  
720  
500  
3250  
1440  
1000  
t
t
t
, t  
= (1.7 ns/pF) C + 2415 ns  
= (0.66 ns/pF) C + 867 ns  
L
= (0.5 ns/pF) C + 475 ns  
L
PHL PLH L  
, t  
PHL PLH  
, t  
PHL PLH  
Propagation Delay Time  
Reset to Q  
t
PHL  
n
t
t
t
= (1.7 ns/pF) C + 485 ns  
5.0  
10  
15  
370  
155  
115  
740  
310  
230  
PHL  
PHL  
PHL  
L
= (0.86 ns/pF) C + 182 ns  
L
= (0.5 ns/pF) C + 145 ns  
L
Clock Pulse Width  
t
5.0  
10  
15  
385  
150  
115  
140  
55  
38  
ns  
MHz  
ns  
WH  
Clock Pulse Frequency  
Clock Rise and Fall Time  
Reset Pulse Width  
f
5.0  
10  
15  
2.1  
7.0  
10.0  
1.5  
3.5  
4.5  
cl  
t
, t  
5.0  
10  
15  
TLH THL  
No Limit  
t
t
5.0  
10  
15  
960  
360  
270  
320  
120  
80  
ns  
WH  
rem  
Reset Removal Time  
5.0  
10  
15  
130  
50  
30  
65  
25  
15  
ns  
5. The formulas given are for the typical characteristics only at 25_C.  
6. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.  
V
DD  
V
DD  
0.01 mF  
CERAMIC  
PULSE  
GENERATOR  
500 mF  
I
D
C
Q1  
Q2  
C
L
Q
n
R
C
L
PULSE  
GENERATOR  
C
Q1  
Q2  
C
L
V
SS  
C
L
Q
n
R
C
L
C
L
V
20 ns  
20 ns  
SS  
CLOCK  
90%  
50%  
10%  
t
WH  
20 ns  
20 ns  
t
t
PHL  
PLH  
V
V
DD  
SS  
90%  
50%  
10%  
CLOCK  
90%  
50%  
10%  
Q
50% DUTY CYCLE  
t
t
THL  
TLH  
Figure 1. Power Dissipation Test Circuit  
and Waveform  
Figure 2. Switching Time Test Circuit  
and Waveforms  
http://onsemi.com  
4
 
MC14040B  
1
2
4
8
16  
32  
64  
128  
256  
512  
1024  
2048  
4096  
CLOCK  
RESET  
Q1  
Q2  
Q3  
Q4  
Q5  
Q6  
Q7  
Q8  
Q9  
Q10  
Q11  
Q12  
Figure 3. Timing Diagram  
APPLICATIONS INFORMATION  
TIME−BASE GENERATOR  
outputs Q5, Q10, Q11, and Q12 division by 3600 is  
accomplished. The MC14012B decodes the counter  
outputs, produces a single output pulse, and resets the binary  
counter. The resulting output frequency is 1.0 pulse/minute.  
A 60 Hz sinewave obtained through a 1.0 Megohm  
resistor connected directly to a standard 120 Vac power line  
is applied to the clock input of the MC14040B. By selecting  
V
V
CC  
CC  
1/6 of HC14A  
MC14040B  
Clock  
1.0M  
13  
12  
10  
9
Q5  
Q10  
Q11  
Q12  
1.0 Pulse/Minute  
Output  
1
2
4
5
20pF  
8
6
120Vac  
60Hz  
1/2  
14012B  
1/2  
14012B  
NOTE: Ground MUST be isolated  
by a transformer or  
opto−isolator for safety  
reasons.  
Figure 4. Time−Base Generator  
http://onsemi.com  
5
MC14040B  
PACKAGE DIMENSIONS  
PDIP−16  
P SUFFIX  
PLASTIC DIP PACKAGE  
CASE 648−08  
ISSUE T  
NOTES:  
−A−  
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION L TO CENTER OF LEADS  
WHEN FORMED PARALLEL.  
4. DIMENSION B DOES NOT INCLUDE  
MOLD FLASH.  
16  
1
9
8
B
S
5. ROUNDED CORNERS OPTIONAL.  
INCHES  
DIM MIN MAX  
0.740 0.770 18.80 19.55  
MILLIMETERS  
F
C
L
MIN MAX  
A
B
C
D
F
0.250 0.270  
0.145 0.175  
0.015 0.021  
6.35  
3.69  
0.39  
1.02  
6.85  
4.44  
0.53  
1.77  
SEATING  
PLANE  
−T−  
0.040  
0.70  
G
H
J
K
L
0.100 BSC  
2.54 BSC  
1.27 BSC  
K
M
H
J
0.050 BSC  
0.008 0.015  
0.110 0.130  
0.295 0.305  
G
0.21  
0.38  
3.30  
7.74  
10  
D 16 PL  
2.80  
7.50  
0
M
M
0.25 (0.010)  
T A  
M
S
0
10  
_
_
_
_
0.020 0.040  
0.51  
1.01  
SOIC−16  
D SUFFIX  
PLASTIC SOIC PACKAGE  
CASE 751B−05  
ISSUE J  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
−A−  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)  
PER SIDE.  
5. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.127 (0.005) TOTAL  
IN EXCESS OF THE D DIMENSION AT  
MAXIMUM MATERIAL CONDITION.  
16  
9
8
−B−  
P 8 PL  
M
S
B
0.25 (0.010)  
1
MILLIMETERS  
INCHES  
G
DIM MIN  
MAX  
10.00  
4.00  
1.75  
0.49  
1.25  
MIN  
MAX  
0.393  
0.157  
0.068  
0.019  
0.049  
A
B
C
D
F
9.80  
3.80  
1.35  
0.35  
0.40  
0.386  
0.150  
0.054  
0.014  
0.016  
F
R X 45  
K
_
G
J
1.27 BSC  
0.050 BSC  
C
0.19  
0.10  
0
0.25  
0.25  
7
0.008  
0.004  
0
0.009  
0.009  
7
−T−  
SEATING  
PLANE  
K
M
P
R
J
_
_
_
_
M
5.80  
0.25  
6.20  
0.50  
0.229  
0.010  
0.244  
0.019  
D
16 PL  
M
S
S
0.25 (0.010)  
T
B
A
http://onsemi.com  
6
MC14040B  
PACKAGE DIMENSIONS  
TSSOP−16  
DT SUFFIX  
PLASTIC TSSOP PACKAGE  
CASE 948F−01  
ISSUE A  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER  
16X KREF  
M
S
S
V
ANSI Y14.5M, 1982.  
0.10 (0.004)  
T
U
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION A DOES NOT INCLUDE MOLD  
FLASH. PROTRUSIONS OR GATE BURRS.  
MOLD FLASH OR GATE BURRS SHALL NOT  
EXCEED 0.15 (0.006) PER SIDE.  
S
U
0.15 (0.006) T  
K
K1  
4. DIMENSION B DOES NOT INCLUDE  
INTERLEAD FLASH OR PROTRUSION.  
INTERLEAD FLASH OR PROTRUSION SHALL  
NOT EXCEED 0.25 (0.010) PER SIDE.  
5. DIMENSION K DOES NOT INCLUDE  
DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.08  
(0.003) TOTAL IN EXCESS OF THE K  
DIMENSION AT MAXIMUM MATERIAL  
CONDITION.  
16  
9
2X L/2  
J1  
B
−U−  
SECTION N−N  
L
J
PIN 1  
IDENT.  
6. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
7. DIMENSION A AND B ARE TO BE  
DETERMINED AT DATUM PLANE −W−.  
8
1
N
0.25 (0.010)  
S
0.15 (0.006) T  
U
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN MAX  
A
M
−V−  
A
B
4.90  
4.30  
−−−  
0.05  
0.50  
5.10 0.193 0.200  
4.50 0.169 0.177  
N
C
1.20  
−−− 0.047  
D
F
0.15 0.002 0.006  
0.75 0.020 0.030  
F
G
H
J
J1  
K
K1  
L
0.65 BSC  
0.026 BSC  
DETAIL E  
0.18  
0.09  
0.09  
0.19  
0.19  
0.28 0.007 0.011  
0.20 0.004 0.008  
0.16 0.004 0.006  
0.30 0.007 0.012  
0.25 0.007 0.010  
−W−  
C
6.40 BSC  
0.252 BSC  
M
0
8
0
8
_
_
_
_
0.10 (0.004)  
DETAIL E  
H
SEATING  
PLANE  
−T−  
D
G
http://onsemi.com  
7
MC14040B  
PACKAGE DIMENSIONS  
SOEIAJ−16  
F SUFFIX  
PLASTIC EIAJ SOIC PACKAGE  
CASE 966−01  
ISSUE O  
NOTES:  
ꢀꢁ1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
L
16  
9
E
ꢀꢁ2. CONTROLLING DIMENSION: MILLIMETER.  
ꢀꢁ3. DIMENSIONS D AND E DO NOT INCLUDE  
MOLD FLASH OR PROTRUSIONS AND ARE  
MEASURED AT THE PARTING LINE. MOLD FLASH  
OR PROTRUSIONS SHALL NOT EXCEED 0.15  
(0.006) PER SIDE.  
Q
1
H
E
E
M
_
ꢀꢁ4. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
1
8
L
ꢀꢁ5. THE LEAD WIDTH DIMENSION (b) DOES NOT  
INCLUDE DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)  
TOTAL IN EXCESS OF THE LEAD WIDTH  
DIMENSION AT MAXIMUM MATERIAL CONDITION.  
DAMBAR CANNOT BE LOCATED ON THE LOWER  
RADIUS OR THE FOOT. MINIMUM SPACE  
BETWEEN PROTRUSIONS AND ADJACENT LEAD  
TO BE 0.46 ( 0.018).  
DETAIL P  
Z
D
VIEW P  
e
A
c
MILLIMETERS  
INCHES  
MIN MAX  
−−− 0.081  
DIM MIN  
MAX  
2.05  
0.20  
0.50  
0.27  
10.50  
5.45  
A
−−−  
0.05  
0.35  
0.18  
9.90  
5.10  
A
A
1
0.002  
0.008  
0.020  
0.011  
0.413  
0.215  
1
b
0.13 (0.005)  
b
c
0.014  
0.007  
0.390  
0.201  
0.10 (0.004)  
M
D
E
e
1.27 BSC  
0.050 BSC  
H
7.40  
0.50  
1.10  
8.20  
0.85  
1.50  
0.291  
0.020  
0.043  
0.323  
0.033  
0.059  
E
L
L
E
0
10  
10  
0.035  
M
Q
0
0.028  
_
_
_
_
0.70  
−−−  
0.90  
0.78  
1
Z
−−− 0.031  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
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USA/Canada  
ON Semiconductor Website: http://onsemi.com  
Order Literature: http://www.onsemi.com/litorder  
Literature Distribution Center for ON Semiconductor  
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA  
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada  
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada  
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For additional information, please contact your  
local Sales Representative.  
MC14040B/D  

MC14040B_05 相关器件

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MC14042BAL MOTOROLA D Latch, 4000/14000/40000 Series, 1-Func, High Level Triggered, 4-Bit, Complementary Output, CMOS, CDIP16, 620-09 获取价格
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MC14042BALDS MOTOROLA 暂无描述 获取价格
MC14042BALS MOTOROLA IC,LATCH,QUAD,1-BIT,CMOS,DIP,16PIN,CERAMIC 获取价格
MC14042BCL MOTOROLA QUAD TRANSPARENT LATCH 获取价格
MC14042BCLD MOTOROLA D Latch, 4000/14000/40000 Series, 1-Func, High Level Triggered, 4-Bit, Complementary Output, CMOS, CDIP16, 620-09 获取价格
MC14042BCLDS MOTOROLA 4000/14000/40000 SERIES, HIGH LEVEL TRIGGERED D LATCH, COMPLEMENTARY OUTPUT, CDIP16, 620-09 获取价格

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