MC14513B_06 [ONSEMI]
BCD−To−Seven Segment Latch/Decoder/Driver CMOS MSI (Low−Power Complementary MOS); BCD至七段锁存器/解码器/驱动器CMOS MSI (低功耗互补MOS )型号: | MC14513B_06 |
厂家: | ONSEMI |
描述: | BCD−To−Seven Segment Latch/Decoder/Driver CMOS MSI (Low−Power Complementary MOS) |
文件: | 总10页 (文件大小:108K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MC14513B
BCD−To−Seven Segment
Latch/Decoder/Driver
CMOS MSI
(Low−Power Complementary MOS)
The MC14513B BCD−to−seven segment latch/decoder/driver is
constructed with complementary MOS (CMOS) enhancement mode
devices and NPN bipolar output drivers in a single monolithic structure.
The circuit provides the functions of a 4−bit storage latch, an 8421
BCD−to−seven segment decoder, and has output drive capability. Lamp
test (LT), blanking (BI), and latch enable (LE) inputs are used to test the
display, to turn−off or pulse modulate the brightness of the display, and
to store a BCD code, respectively. The Ripple Blanking Input (RBI) and
Ripple Blanking Output (RBO) can be used to suppress either leading
or trailing zeroes. It can be used with seven−segment light emitting
diodes (LED), incandescent, fluorescent, gas discharge, or liquid crystal
readouts either directly or indirectly.
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PDIP−18
P SUFFIX
CASE 707
1
MARKING DIAGRAM
Applications include instrument (e.g., counter, DVM, etc.) display
driver, computer/calculator display driver, cockpit display driver, and
various clock, watch, and timer uses.
18
Features
MC14513BCP
AWLYYWWG
• Low Logic Circuit Power Dissipation
• High−Current Sourcing Outputs (Up to 25 mA)
• Latch Storage of Binary Input
1
• Blanking Input
A
= Assembly Location
• Lamp Test Provision
WL = Wafer Lot
YY = Year
WW = Work Week
• Readout Blanking on all Illegal Input Combinations
• Lamp Intensity Modulation Capability
• Time Share (Multiplexing) Capability
• Adds Ripple Blanking In, Ripple Blanking Out to MC14511B
• Supply Voltage Range = 3.0 V to 18 V
• Capable of Driving Two Low−Power TTL Loads, One Low−Power
Schottky TTL Load to Two HTL Loads Over the Rated Temperature
Range
G
= Pb−Free Package
ORDERING INFORMATION
Device
Package
Shipping
20 Units/Rail
20 Units/Rail
MC14513BCP
MC14513BCPG
PDIP−18
• Pb−Free Package is Available*
MAXIMUM RATINGS (Voltages Referenced to V
PDIP−18
(Pb−Free)
)
SS
Parameter
Symbol
Value
−0.5 to +18.0
Unit
V
DC Supply Voltage Range
V
DD
This device contains protection circuitry to protect
the inputs against damage due to high static voltages
or electric fields. However, it is advised that normal
precautions be taken to avoid application of any
voltage higher than maximum rated voltages to this
high−impedance circuit. A destructive high current
Input Voltage Range, All Inputs
DC Current Drain per Input Pin
Power Dissipation per Package (Note 1)
Operating Temperature Range
Storage Temperature Range
V
−0.5 to V +0.5
V
in
DD
I
10
500
mA
mW
°C
P
D
T
A
−55 to +125
−65 to +150
25
mode may occur if V and V are not constrained to
in
out
the range V v (V or V ) v V
.
T
stg
°C
SS
in
out
DD
Due to the sourcing capability of this circuit,
Maximum Continuous Output Drive
Current (Source) per Output
I
mA
OHmax
damage can occur to the device if V is applied, and
DD
the outputs are shorted to V and are at a logical 1
SS
(See Maximum Ratings).
Unused inputs must always be tied to an appropriate
logic voltage level (e.g., either V or V ).
Maximum Continuous Output Power
(Source) per Output (Note 2)
P
50
mW
OHmax
SS
DD
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Temperature Derating: Plastic “P and D/DW”
*For additional information on our Pb−Free strategy
and soldering details, please download the
ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
Packages: – 7.0 mW/_C From 65_C To 125_C
2. P
= I
(V − V
)
OH
OHmax
OH
DD
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
June, 2006 − Rev. 6
MC14513B/D
MC14513B
PIN ASSIGNMENT
B
C
1
2
3
4
5
6
7
8
9
18
17
16
15
14
13
12
11
V
f
DD
LT
BI
LE
D
g
a
b
c
d
e
A
RBI
V
10 RBO
SS
a
f
g
b
e
c
d
DISPLAY
0
1
2
3
4
5
6
7
8
9
TRUTH TABLE
Inputs
Outputs
RBI LE BI LT
D
C
X
X
B
X
X
A RBO
a
1
0
b
c
1
0
d
1
0
e
1
0
f
g
1
0
Display
8
X
X
X
X
X
0
0
1
X
X
X
X
+
+
1
0
1
0
Blank
1
0
0
0
1
1
1
1
0
0
0
0
0
0
0
0
1
0
0
1
0
1
0
1
0
1
0
1
0
1
0
0
Blank
0
X
X
X
X
X
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
0
1
1
0
0
1
0
1
0
1
0
0
0
0
0
0
1
1
0
1
1
1
1
1
0
1
0
1
1
1
0
1
1
0
1
0
1
0
0
0
0
0
0
1
1
0
1
1
1
1
1
2
3
4
5
X
X
X
X
X
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
0
0
1
1
1
1
1
0
0
0
1
1
0
0
1
0
1
0
1
0
0
0
0
0
0
1
1
1
1
0
0
1
1
1
0
1
1
1
1
0
1
0
1
1
0
1
0
1
0
0
1
0
1
1
0
1
0
1
1
0
6
7
8
9
Blank
X
X
X
X
X
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
1
1
1
1
1
0
0
1
1
1
0
1
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Blank
Blank
Blank
Blank
Blank
X
1
1
1
X
X
X
X
†
*
*
X = Don’t Care
†RBO = RBI (D C B A), indicated by other rows of table
*Depends upon the BCD code previously applied when LE = 0
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2
MC14513B
ELECTRICAL CHARACTERISTICS (Voltages Referenced to V
)
SS
− 55_C
25_C
Typ
125_C
V
DD
(Note 3)
Min
Max
Min
Max
Min
Max
Vdc
Characteristic
Symbol
Unit
Output Voltage — Segment Outputs
“0” Level
V
Vdc
OL
5.0
10
15
−
−
−
0.05
0.05
0.05
−
−
−
0
0
0
0.05
0.05
0.05
−
−
−
0.05
0.05
0.05
V
in
= V or 0
DD
“1” Level
V
5.0
10
15
4.1
9.1
14.1
−
−
−
4.1
9.1
14.1
5.0
10
15
−
−
−
4.1
9.1
14.1
−
−
−
Vdc
Vdc
OH
V
in
= 0 or V
DD
Output Voltage — RBO Output
V
OL
“0” Level
5.0
10
15
−
−
−
0.05
0.05
0.05
−
−
−
0
0
0
0.05
0.05
0.05
−
−
−
0.05
0.05
0.05
V
in
= V or 0
DD
“1” Level
V
5.0
10
15
4.95
9.95
14.95
−
−
−
4.95
9.95
14.95
5.0
10
15
−
−
−
4.95
9.95
14.95
−
−
−
Vdc
Vdc
OH
V
= 0 or V
in
DD
Input Voltage (Note 3) “0” Level
(V = 3.8 or 0.5 Vdc)
V
IL
5.0
10
15
−
−
−
1.5
3.0
4.0
−
−
−
2.25
4.50
6.75
1.5
3.0
4.0
−
−
−
1.5
3.0
4.0
O
O
O
(V = 8.8 or 1.0 Vdc)
(V = 13.8 or 1.5 Vdc)
(V = 0.5 or 3.8 Vdc) “1” Level
O
V
5.0
10
15
3.5
7.0
11
−
−
−
3.5
7.0
11
2.75
5.50
8.25
−
−
−
3.5
7.0
11
−
−
−
Vdc
Vdc
IH
(V = 1.0 or 8.8 Vdc)
O
(V = 1.5 or 13.8 Vdc)
O
Output Drive Voltage — Segments
V
OH
(I
(I
(I
(I
(I
(I
= 0 mA)
Source
5.0
10
15
4.1
−
3.9
−
3.4
−
−
−
−
−
−
−
4.1
−
3.9
−
3.4
−
4.57
4.24
4.12
3.94
3.70
3.54
−
−
−
−
−
−
4.1
−
3.5
−
3.0
−
−
−
−
−
−
−
OH
OH
OH
OH
OH
OH
= 5.0 mA)
= 10 mA)
= 15 mA)
= 20 mA)
= 25 mA)
(I
(I
(I
(I
(I
(I
= 0 mA)
OH
OH
OH
OH
OH
OH
9.1
−
9.0
−
8.6
−
−
−
−
−
−
−
9.1
−
9.0
−
8.6
−
9.58
9.26
9.17
9.04
8.90
8.75
−
−
−
−
−
−
9.1
−
8.6
−
8.2
−
−
−
−
−
−
−
Vdc
Vdc
= 5.0 mA)
= 10 mA)
= 15 mA)
= 20 mA)
= 25 mA)
(I
(I
(I
(I
(I
(I
= 0 mA)
OH
OH
OH
OH
OH
OH
= 5.0 mA)
= 10 mA)
= 15 mA)
= 20 mA)
= 25 mA)
14.1
−
14
−
13.6
−
−
−
−
−
−
−
14.1
−
14
−
13.6
−
14.59
14.27
14.18
14.07
13.95
13.80
−
−
−
−
−
−
14.1
−
13.6
−
13.2
−
−
−
−
−
−
−
3. Noise immunity specified for worst−case input combination.
Noise Margin for both “1” and “0” level =1.0 Vdc min @ V = 5.0 Vdc
DD
2.0 Vdc min @ V = 10 Vdc
DD
2.5 Vdc min @ V = 15 Vdc
DD
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3
MC14513B
ELECTRICAL CHARACTERISTICS (continued) (Voltages Referenced to V
– 55_C
)
SS
25_C
Typ
125_C
V
DD
(Note 4)
Vdc
Min
Max
Min
Max
Min
Max
Characteristic
Symbol
Unit
Output Drive Current — RBO Output
I
mAdc
OH
(V
(V
(V
= 2.5 V)
= 9.5 V)
= 13.5 V)
Source
5.0
10
15
– 0.40
– 0.21
– 0.81
−
−
−
– 0.32
– 0.17
– 0.66
– 0.64
– 0.34
– 1.30
−
−
−
– 0.22
– 0.12
– 0.46
−
−
−
OH
OH
OH
(V = 0.4 V)
Sink
OL
I
I
5.0
10
15
0.18
0.47
1.80
−
−
−
0.15
0.38
1.50
0.29
0.75
2.90
−
−
−
0.10
0.26
1.0
−
−
−
mAdc
mAdc
OL
OL
(V = 0.5 V)
OL
(V = 1.5 V)
OL
Output Drive Current — Segments
(V = 0.4 V) Sink
5.0
10
15
0.64
1.6
4.2
−
−
−
0.51
1.3
3.4
0.88
2.25
8.8
−
−
−
0.36
0.9
2.4
−
−
−
OL
(V = 0.5 V)
OL
(V = 1.5 V)
OL
Input Current
I
15
−
−
−
0.1
−
−
−
0.00001
5.0
0.1
7.5
−
−
1.0
−
mAdc
pF
in
Input Capacitance
Quiescent Current
C
in
I
5.0
10
15
−
−
−
5.0
10
20
−
−
−
0.005
0.010
0.015
5.0
10
20
−
−
−
150
300
600
mAdc
DD
(Per Package) V = 0 or V
,
DD
in
I
= 0 mA
out
Total Supply Current (Note 5, 6)
(Dynamic plus Quiescent,
Per Package)
I
5.0
10
15
I
I
I
= (1.9 mA/kHz) f + I
= (3.8 mA/kHz) f + I
= (5.7 mA/kHz) f + I
mAdc
T
T
T
T
DD
DD
DD
(C = 50 pF on all outputs, all
L
buffers switching)
4. Noise immunity specified for worst−case input combination.
Noise Margin for both “1” and “0” level =1.0 Vdc min @ V = 5.0 Vdc
DD
2.0 Vdc min @ V = 10 Vdc
DD
2.5 Vdc min @ V = 15 Vdc
DD
5. The formulas given are for the typical characteristics only at 25_C.
−3
6. To calculate total supply current at loads other than 50 pF: I (C ) = I (50 pF) + 3.5 x 10 (C − 50) V f where: I is in mA (per package),
T
L
T
L
DD
T
C in pF, V in Vdc, and f in kHz is input frequency.
L
DD
Input LE and RBI low, and Inputs D, BI and LT high.
f in respect to a system clock.
All outputs connected to respective C loads.
L
20 ns
20 ns
V
V
DD
SS
90%
50%
1
A, B, AND C
10%
2f
50% DUTY CYCLE
V
V
OH
OL
50%
ANY OUTPUT
Figure 1. Dynamic Power Dissipation Signal Waveforms
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4
MC14513B
SWITCHING CHARACTERISTICS (Note 7) (C = 50 pF, T = 25_C)
L
A
All Types
Typ
V
Vdc
DD
Min
Max
Characteristic
Symbol
Unit
Output Rise Time — Segment Outputs
t
t
t
t
t
ns
TLH
TLH
THL
THL
PLH
5.0
10
15
−
−
−
40
30
25
80
60
50
Output Rise Time — RBO Output
ns
ns
ns
ns
5.0
10
15
−
−
−
480
240
190
960
480
380
Output Fall Time — Segment Outputs (Note 7)
t
t
t
= (1.5 ns/pF) C + 50 ns
5.0
10
15
−
−
−
125
75
65
250
150
130
THL
THL
THL
L
= (0.75 ns/pF) C + 37.5 ns
L
= (0.55 ns/pF) C + 37.5 ns
L
Output Fall Time — RBO Outputs
t
t
t
= (3.25 ns/pF) C + 107.5 ns
5.0
10
15
−
−
−
270
135
110
540
270
220
THL
THL
THL
L
= (1.35 ns/pF) C + 67.5 ns
L
= (0.95 ns/pF) C + 62.5 ns
L
Propagation Delay Time — A, B, C, D Inputs (Note 7)
t
t
t
= (0.40 ns/pF) C + 620 ns
5.0
10
15
−
−
−
640
250
175
1280
500
350
PLH
PLH
PLH
L
= (0.25 ns/pF) C + 237.5 ns
L
= (0.20 ns/pF) C + 165 ns
L
t
t
t
= (1.3 ns/pF) C + 655 ns
L
PHL
PHL
PHL
t
t
5.0
10
15
−
−
−
720
290
200
1440
580
400
ns
ns
PHL
PLH
= (0.60 ns/pF) C + 260 ns
L
= (0.35 ns/pF) C + 182.5 ns
L
Propagation Delay Time — RBI and BI Inputs (Note 7)
5.0
10
15
−
−
−
600
200
150
750
300
220
t
t
t
= (1.05 ns/pF) C + 547.5 ns
PLH
PLH
PLH
L
= (0.45 ns/pF) C + 177.5 ns
L
= (0.30 ns/pF) C + 135 ns
L
t
t
t
= (0.85 ns/pF) C + 442.5 ns
L
PHL
PHL
PHL
t
t
5.0
10
15
−
−
−
485
200
160
970
400
320
ns
ns
PHL
PLH
= (0.45 ns/pF) C + 177.5 ns
L
= (0.35 ns/pF) C + 142.5 ns
L
Propagation Delay Time — LT Input (Note 7)
5.0
10
15
−
−
−
313
125
90
625
250
180
t
t
t
= (0.45 ns/pF) C + 290.5 ns
PLH
PLH
PLH
L
= (0.25 ns/pF) C + 112.5 ns
L
= (0.20 ns/pF) C + 80 ns
L
t
t
t
= (1.3 ns/pF) C + 248 ns
L
PHL
PHL
PHL
t
5.0
10
15
−
−
−
313
125
90
625
250
180
ns
ns
ns
ns
PHL
= (0.45 ns/pF) C + 102.5 ns
L
= (0.35 ns/pF) C + 72.5 ns
L
Setup Time
Hold Time
t
5.0
10
15
100
40
30
−
−
−
−
−
−
su
t
5.0
10
15
60
40
30
−
−
−
−
−
−
h
Latch Enable Pulse Width
t
5.0
10
15
520
220
130
260
110
65
−
−
−
WL(LE)
7. The formulas given are for the typical characteristics only.
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5
MC14513B
20 ns
20 ns
V
DD
90%
50%
10%
INPUT C
V
V
SS
t
t
PHL
PLH
OH
OUTPUT g
t
V
OL
t
THL
TLH
a. Data Propagation Delay: Inputs RBI, D and LE low, and Inputs A, B, BI and LT high.
20 ns
20 ns
V
DD
90%
50%
10%
INPUT C
V
SS
t
t
PHL
PLH
V
OH
90%
10%
OUTPUT RBO
50%
V
OL
t
t
THL
TLH
b. Inputs A, B, D and LE low, and Inputs RBI, BI and LT high.
20 ns
V
DD
90%
50%
LE
10%
V
V
SS
DD
t
h
t
su
INPUT C
50%
V
V
SS
OH
OUTPUT g
V
OL
c. Setup and Hold Times: Input RBI and D low, Inputs A, B, BI and LT high.
20 ns
20 ns
V
DD
90%
50%
10%
LE
V
SS
t
WL(LE)
d. Pulse Width: Data DCBA strobed into latches.
Figure 2. Dynamic Signal Waveforms
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6
MC14513B
CONNECTIONS TO VARIOUS DISPLAY READOUTS
LIGHT EMITTING DIODE (LED) READOUT
V
DD
V
DD
COMMON
ANODE LED
COMMON
CATHODE LED
≈ 1.7 V
≈ 1.7 V
V
SS
V
SS
INCANDESCENT READOUT
FLUORESCENT READOUT
V
DD
V
V
DD
DD
* *
DIRECT
(LOW BRIGHTNESS)
FILAMENT
(SUPPLY)
V
SS
V
V
VOLTAGE BELOW V
OR APPROPRIATE
.
SS
SS
SS
GAS DISCHARGE READOUT
LIQUID CRYSTAL (LC) READOUT
EXCITATION
(SQUARE WAVE,
TO V
APPROPRIATE
VOLTAGE
V
DD
V
DD
V
)
DD
SS
1/4 OF MC14070B
V
SS
V
SS
**A filament pre−warm resistor is recommended to reduce
filament thermal shock and increase the effective cold
resistance of the filament.
Direct dc drive of LC’s not recommended for life of LC readouts.
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7
MC14513B
LOGIC DIAGRAM
BIꢀ4
15ꢀa
Aꢀ7
Bꢀ1
14ꢀb
13ꢀc
12ꢀd
11ꢀe
17ꢀf
Cꢀ2
16ꢀg
LTꢀ30
10ꢀRBO
RBIꢀ8
Dꢀ6
LEꢀ5
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8
MC14513B
TYPICAL APPLICATIONS FOR RIPPLE BLANKING
LEADING EDGE ZERO SUPPRESSION
DISPLAYS
a − − − − − g
RBI RBO
a − − − − − g
RBO
a − − − − − g
RBO
RBI
a − − − − − g
RBO
a − − − − − g
a − − − − − g
CONNECT TO
(1)
RBO
A
RBO
RBI
RBI
D
RBI
D
RBI
1
0
0
0
0
1
V
D
C
B
A
D
C
B
A
D
C
B
A
D
C
B
A
C
B
C
B
A
DD
MC14513B
MC14513B
MC14513B
MC14513B
MC14513B
MC14513B
0
0
0
0
0
1
0
1
0
0
0
0
0
0
0
1
0
0
1
1
0
0
0
0
INPUT
CODE
(0)
(5)
(0)
(1)
(3)
(0)
TRAILING EDGE ZERO SUPPRESSION
DISPLAYS
− − − − −
− − − − −
− − − − −
− − − − −
− − − − −
− − − − −
a
a
g
a
g
a
g
a
g
a
g
RBI
A
g
RBI
A
CONNECT TO
V (1)
DD
0
RBI
A
RBI
A
RBO
D
RBO
D
RBO
D
RBI
A
RBI
A
RBO
D
RBO
D
RBO
D
0
0
1
1
0
C
B
C
B
C
B
C
B
C
B
C
B
MC14513B
MC14513B
MC14513B
MC14513B
MC14513B
MC14513B
0
0
0
0
0
0
0
1
0
0
1
1
0
0
0
0
0
0
0
0
0
1
0
1
INPUT CODE
(0)
(1)
(3)
(0)
(0)
(5)
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9
MC14513B
PACKAGE DIMENSIONS
PDIP−18
CASE 707−02
ISSUE D
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D), SHALL
J
BE WITHIN 0.25 mm (0.010) AT MAXIMUM
MATERIAL CONDITION, IN RELATION TO SEATING
PLANE AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
18
10
9
B
L
1
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
4. CONTROLLING DIMENSION: INCH.
M
A
INCHES
DIM MIN MAX
MILLIMETERS
MIN
22.22
6.10
3.56
0.36
1.27
MAX
23.24
6.60
4.57
0.56
1.78
A
B
C
D
F
0.875
0.240
0.140
0.014
0.050
0.915
0.260
0.180
0.022
0.070
C
K
N
G
H
J
0.100 BSC
2.54 BSC
0.040
0.008
0.115
0.060
0.012
0.135
1.02
0.20
2.92
1.52
0.30
3.43
F
D
SEATING
PLANE
H
K
L
G
0.300 BSC
7.62 BSC
M
N
0
0.020
15
0.040
0
_
0.51
15
_
1.02
_
_
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