MC14553BDW [ONSEMI]

3-Digit BCD Counter; 3位BCD计数器
MC14553BDW
型号: MC14553BDW
厂家: ONSEMI    ONSEMI
描述:

3-Digit BCD Counter
3位BCD计数器

计数器 触发器 逻辑集成电路 光电二极管 输出元件 CD
文件: 总12页 (文件大小:181K)
中文:  中文翻译
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The MC14553B 3–digit BCD counter consists of 3 negative edge  
triggered BCD counters that are cascaded synchronously. A quad latch  
at the output of each counter permits storage of any given count. The  
information is then time division multiplexed, providing one BCD  
number or digit at a time. Digit select outputs provide display control.  
All outputs are TTL compatible.  
http://onsemi.com  
An on–chip oscillator provides the low–frequency scanning clock  
which drives the multiplexer output selector.  
This device is used in instrumentation counters, clock displays,  
digital panel meters, and as a building block for general logic  
applications.  
MARKING  
DIAGRAMS  
16  
PDIP–16  
P SUFFIX  
CASE 648  
MC14553BCP  
AWLYYWW  
TTL Compatible Outputs  
On–Chip Oscillator  
Cascadable  
1
Clock Disable Input  
Pulse Shaping Permits Very Slow Rise Times on Input Clock  
Output Latches  
16  
14553B  
SOIC–16  
DW SUFFIX  
CASE 751G  
Master Reset  
AWLYYWW  
1
MAXIMUM RATINGS (Voltages Referenced to V ) (Note 1.)  
SS  
A
= Assembly Location  
Symbol  
Parameter  
Value  
Unit  
V
WL or L = Wafer Lot  
YY or Y = Year  
V
DD  
DC Supply Voltage Range  
0.5 to +18.0  
WW or W = Work Week  
V , V  
in out  
Input or Output Voltage Range  
(DC or Transient)  
0.5 to V + 0.5  
V
DD  
I
Input Current  
(DC or Transient) per Pin  
±10  
+20  
500  
mA  
mA  
mW  
in  
ORDERING INFORMATION  
I
Output Current  
(DC or Transient) per Pin  
out  
Device  
Package  
PDIP–16  
SOIC–16  
Shipping  
P
Power Dissipation,  
MC14553BCP  
MC14553BDW  
25/Rail  
47/Rail  
D
per Package (Note 2.)  
T
Ambient Temperature Range  
Storage Temperature Range  
55 to +125  
65 to +150  
260  
°C  
°C  
°C  
A
T
stg  
T
Lead Temperature  
L
(8–Second Soldering)  
1. Maximum Ratings are those values beyond which damage to the device  
may occur.  
2. Temperature Derating:  
Plastic “P and D/DW” Packages: – 7.0 mW/ C From 65 C To 125 C  
This device contains protection circuitry to guard against damage due to high  
static voltages or electric fields. However, precautions must be taken to avoid  
applications of any voltage higher than maximum rated voltages to this  
high–impedancecircuit. For proper operation, V and V should be constrained  
in  
out  
to the range V  
(V or V  
)
V
DD  
.
SS  
in  
out  
Unused inputs must always be tied to an appropriate logic voltage level (e.g.,  
either V or V ). Unused outputs must be left open.  
SS  
DD  
Semiconductor Components Industries, LLC, 2000  
1
Publication Order Number:  
March, 2000 – Rev. 3  
MC14553B/D  
MC14553B  
BLOCK DIAGRAM  
4
3
CIA CIB  
9
7
6
Q0  
Q1  
Q2  
CLOCK  
12  
10  
LE  
5
Q3  
O.F.  
DS1  
DS2  
DS3  
14  
2
11  
13  
DIS  
MR  
1
15  
V
DD  
= PIN 16  
V
SS  
= PIN 8  
TRUTH TABLE  
Inputs  
Master  
Reset  
Clock  
Disable  
LE  
Outputs  
0
0
0
0
0
0
0
0
1
0
0
1
0
0
X
0
0
X
No Change  
Advance  
No Change  
Advance  
No Change  
No Change  
Latched  
X
1
1
0
X
X
X
X
X
X
X
1
0
Latched  
Q0 = Q1 = Q2 = Q3 = 0  
X = Don’t Care  
http://onsemi.com  
2
MC14553B  
ELECTRICAL CHARACTERISTICS (Voltages Referenced to V  
)
SS  
– 55 C  
25 C  
125 C  
V
Vdc  
DD  
(3.)  
Characteristic  
Output Voltage  
Symbol  
Unit  
Min  
Max  
Min  
Typ  
Max  
Min  
Max  
“0” Level  
“1” Level  
“0” Level  
V
OL  
5.0  
10  
15  
0.05  
0.05  
0.05  
0
0
0
0.05  
0.05  
0.05  
0.05  
0.05  
0.05  
Vdc  
V
in  
= V or 0  
DD  
V
OH  
5.0  
10  
15  
4.95  
9.95  
14.95  
4.95  
9.95  
14.95  
5.0  
10  
15  
4.95  
9.95  
14.95  
Vdc  
Vdc  
V
in  
= 0 or V  
DD  
Input Voltage  
(V = 4.5 or 0.5 Vdc)  
V
IL  
5.0  
10  
15  
1.5  
3.0  
4.0  
2.25  
4.50  
6.75  
1.5  
3.0  
4.0  
1.5  
3.0  
4.0  
O
(V = 9.0 or 1.0 Vdc)  
O
(V = 13.5 or 1.5 Vdc)  
O
“1” Level  
V
IH  
Vdc  
(V = 0.5 or 4.5 Vdc)  
5.0  
10  
15  
3.5  
7.0  
11  
3.5  
7.0  
11  
2.75  
5.50  
8.25  
3.5  
7.0  
11  
O
(V = 1.0 or 9.0 Vdc)  
O
(V = 1.5 or 13.5 Vdc)  
O
Output Drive Current  
I
mAdc  
OH  
(V = 4.6 Vdc)  
Source —  
Pin 3  
5.0  
10  
15  
– 0.25  
– 0.62  
– 1.8  
– 0.2  
– 0.5  
– 1.5  
– 0.36  
– 0.9  
– 3.5  
0.14  
0.35  
1.1  
OH  
(V = 9.5 Vdc)  
OH  
(V = 13.5 Vdc)  
OH  
(V = 4.6 Vdc)  
Source —  
Other  
Outputs  
5.0  
10  
15  
– 0.64  
– 1.6  
– 4.2  
– 0.51  
– 1.3  
– 3.4  
– 0.88  
– 2.25  
– 8.8  
– 0.36  
– 0.9  
– 2.4  
mAdc  
mAdc  
mAdc  
OH  
(V = 9.5 Vdc)  
OH  
(V = 13.5 Vdc)  
OH  
(V = 0.4 Vdc)  
Sink —  
Pin 3  
I
OL  
5.0  
10  
15  
0.5  
1.1  
1.8  
0.4  
0.9  
1.5  
0.88  
2.25  
8.8  
0.28  
0.65  
1.20  
OL  
(V = 0.5 Vdc)  
OL  
(V = 1.5 Vdc)  
OL  
(V = 0.4 Vdc) Sink — Other  
5.0  
10  
15  
3.0  
6.0  
18  
2.5  
5.0  
15  
4.0  
8.0  
20  
1.6  
3.5  
10  
OL  
(V = 0.5 Vdc)  
Outputs  
OL  
(V = 1.5 Vdc)  
OL  
Input Current  
Input Capacitance  
I
15  
±0.1  
±0.00001  
±0.1  
±1.0  
µAdc  
in  
C
5.0  
7.5  
pF  
in  
(V = 0)  
in  
Quiescent Current  
(Per Package)  
I
5.0  
10  
15  
5.0  
10  
20  
0.010  
0.020  
0.030  
5.0  
10  
20  
150  
300  
600  
µAdc  
µAdc  
DD  
MR = V  
DD  
(4.) (5.)  
Total Supply Current  
I
T
5.0  
10  
15  
I = (0.35 µA/kHz) f + I  
T
I = (0.85 µA/kHz) f + I  
T
I = (1.50 µA/kHz) f + I  
T
DD  
DD  
DD  
(Dynamic plus Quiescent,  
Per Package)  
(C = 50 pF on all outputs, all  
L
buffers switching)  
3. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.  
4. The formulas given are for the typical characteristics only at 25 C.  
5. To calculate total supply current at loads other than 50 pF:  
I (C ) = I (50 pF) + (C – 50) Vfk  
T
L
T
L
where: I is in µA (per package), C in pF, V = (V – V ) in volts, f in kHz is input frequency, and k = 0.004.  
T
L
DD  
SS  
http://onsemi.com  
3
MC14553B  
SWITCHING CHARACTERISTICS (6.) (C = 50 pF, T = 25 C)  
L
A
(7.)  
Characteristic  
Figure  
Symbol  
V
DD  
Min  
Typ  
Max  
Unit  
Output Rise and Fall Time  
2a  
t
,
ns  
TLH  
t
t
t
, t  
= (1.5 ns/pF) C + 25 ns  
t
THL  
5.0  
10  
15  
100  
50  
40  
200  
100  
80  
TLH THL  
L
, t  
= (0.75 ns/pF) C + 12.5 ns  
TLH THL  
L
, t  
= (0.55 ns/pF) C + 9.5 ns  
L
TLH THL  
Clock to BCD Out  
Clock to Overflow  
Reset to BCD Out  
2a  
2a  
2b  
2b  
2b  
2a  
2b  
2a  
2b  
1
t
t
,
5.0  
10  
15  
900  
500  
200  
1800  
1000  
400  
ns  
ns  
PLH  
PHL  
t
5.0  
10  
15  
600  
400  
200  
1200  
800  
400  
PHL  
t
5.0  
10  
15  
900  
500  
300  
1800  
1000  
600  
ns  
PHL  
Clock to Latch Enable Setup Time  
Master Reset to Latch Enable Setup Time  
t
su  
5.0  
10  
15  
600  
400  
200  
300  
200  
100  
ns  
Removal Time  
t
5.0  
10  
15  
– 80  
– 10  
0
– 200  
– 70  
– 50  
ns  
rem  
Latch Enable to Clock  
Clock Pulse Width  
t
t
5.0  
10  
15  
550  
200  
150  
275  
100  
75  
ns  
WH(cl)  
WH(R)  
Reset Pulse Width  
5.0  
10  
15  
1200  
600  
450  
600  
300  
225  
ns  
Reset Removal Time  
Input Clock Frequency  
Input Clock Rise Time  
t
5.0  
10  
15  
– 80  
0
20  
– 180  
– 50  
– 30  
ns  
rem  
f
cl  
5.0  
10  
15  
1.5  
5.0  
7.0  
0.9  
2.5  
3.5  
MHz  
ns  
t
5.0  
10  
15  
No  
Limit  
TLH  
Disable, MR, Latch Enable  
Rise and Fall Times  
t
t
,
5.0  
10  
15  
15  
5.0  
4.0  
µs  
TLH  
THL  
Scan Oscillator Frequency  
f
5.0  
10  
15  
1.5/C1  
4.2/C1  
7.0/C1  
Hz  
osc  
(C1 measured in µF)  
6. The formulas given are for the typical characteristics only at 25 C.  
7. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.  
http://onsemi.com  
4
MC14553B  
UNITS CLOCK  
UNITS Q0  
UNITS Q1  
UNITS Q2  
UNITS Q3  
TENS CLOCK  
TENS Q0  
TENS Q3  
UP AT 980  
UP AT 80  
HUNDREDS  
CLOCK  
HUNDREDS Q0  
HUNDREDS Q3  
DISABLE  
UP AT 800  
(DISABLES CLOCK WHEN HIGH)  
OVERFLOW  
MASTER  
RESET  
SCAN  
OSCILLATOR  
DIGIT SELECT 1  
DIGIT SELECT 2  
UNITS  
TENS  
DIGIT SELECT 3  
HUNDREDS  
Figure 1. 3–Digit Counter Timing Diagram (Reference Figure 3)  
16  
V
DD  
(a)  
PULSE  
GENERATOR  
Q3  
Q2  
20 ns  
t
WL(cl)  
C
20 ns  
90%  
C
L
90%  
10%  
CLOCK  
C
L
50%  
Q1  
LE  
C
L
Q0  
t
PLH  
1/f  
t
cl  
C
L
O.F.  
DS1  
DS2  
DS3  
PHL  
DIS  
BCD OUT  
C
L
t
50%  
t
PHL  
10%  
t
TLH  
THL  
50%  
OVERFLOW  
MR  
8
V
SS  
t
TLH  
90%  
10%  
CLOCK  
50%  
V
DD  
(b)  
GENERATOR  
1
t
su  
t
Q3  
Q2  
rem  
C
C
L
LATCH  
ENABLE  
C
L
50%  
, t  
Q1  
GENERATOR  
2
LE  
C
L
Q0  
t
PHL PLH  
t
su  
C
L
O.F.  
DS1  
DS2  
DS3  
GENERATOR  
3
MR  
C
L
BCD OUT  
50%  
DIS  
t
PHL  
V
SS  
50%  
MASTER RESET  
t
WH(R)  
Figure 2. Switching Time Test Circuits and Waveforms  
http://onsemi.com  
5
MC14553B  
OPERATING CHARACTERISTICS  
The MC14553B three–digit counter, shown in Figure 3,  
The Master Reset input, when taken high, initializes the  
three BCD counters and the multiplexer scanning circuit.  
While Master Reset is high the digit scanner is set to digit  
one; but all three digit select outputs are disabled to prolong  
display life, and the scan oscillator is inhibited. The Disable  
input, when high, prevents the input clock from reaching the  
counters, while still retaining the last count. A pulse shaping  
circuit at the clock input permits the counters to continue  
operating on input pulses with very slow rise times.  
Information present in the counters when the latch input  
goes high, will be stored in the latches and will be retained  
while the latch input is high, independent of other inputs.  
Information can be recovered from the latches after the  
counters have been reset if Latch Enable remains high  
during the entire reset cycle.  
consists of three negative edge–triggered BCD counters  
which are cascaded in a synchronous fashion. A quad latch  
at the output of each of the three BCD counters permits  
storage of any given count. The three sets of BCD outputs  
(active high), after going through the latches, are time  
division multiplexed, providing one BCD number or digit at  
a time. Digit select outputs (active low) are provided for  
display control. All outputs are TTL compatible.  
An on–chip oscillator provides the low frequency  
scanning clock which drives the multiplexer output selector.  
The frequency of the oscillator can be controlled externally  
by a capacitor between pins 3 and 4, or it can be overridden  
and driven with an external clock at pin 4. Multiple devices  
can be cascaded using the overflow output, which provides  
one pulse for every 1000 counts.  
C1  
A
LATCH ENABLE  
10  
4
3
SCAN  
OSCILLATOR  
PULSE  
GENERATOR  
R
C1  
C1  
B
CLOCK  
12  
R SCANNER  
Q0  
PULSE  
SHAPER  
C
R
Q1  
Q2  
Q3  
QUAD  
LATCH  
÷10  
UNITS  
9
Q0  
11  
DISABLE  
(ACTIVE  
HIGH)  
MULTIPLEXER  
7
Q1  
Q0  
Q1  
Q2  
Q3  
C
R
QUAD  
LATCH  
BCD  
OUTPUTS  
(ACTIVE  
HIGH)  
÷10  
TENS  
6
Q2  
Q0  
Q1  
Q2  
Q3  
C
R
5
QUAD  
LATCH  
Q3  
÷10  
HUNDREDS  
2
1
15  
DS1 DS2 DS3  
(LSD) DIGIT SELECT (MSD)  
(ACTIVE LOW)  
13  
MR  
(ACTIVE HIGH)  
14  
OVERFLOW  
Figure 3. Expanded Block Diagram  
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6
MC14553B  
Figure 4. Six–Digit Display  
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7
MC14553B  
PACKAGE DIMENSIONS  
PDIP–16  
P SUFFIX  
PLASTIC DIP PACKAGE  
CASE 648–08  
ISSUE R  
NOTES:  
–A–  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION L TO CENTER OF LEADS WHEN  
FORMED PARALLEL.  
16  
1
9
8
B
S
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.  
5. ROUNDED CORNERS OPTIONAL.  
INCHES  
DIM MIN MAX  
0.740 0.770 18.80 19.55  
MILLIMETERS  
MIN MAX  
F
A
B
C
D
F
G
H
J
K
L
M
S
C
L
0.250 0.270  
0.145 0.175  
0.015 0.021  
6.35  
3.69  
0.39  
1.02  
6.85  
4.44  
0.53  
1.77  
0.040  
0.70  
SEATING  
PLANE  
–T–  
0.100 BSC  
0.050 BSC  
0.008 0.015  
2.54 BSC  
1.27 BSC  
K
M
0.21  
0.38  
3.30  
7.74  
10  
H
J
0.110  
0.295 0.305  
10  
0.020 0.040  
0.130  
2.80  
7.50  
0
G
D 16 PL  
0
0.51  
1.01  
M
M
0.25 (0.010)  
T A  
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8
MC14553B  
PACKAGE DIMENSIONS  
SOIC–16  
DW SUFFIX  
PLASTIC SOIC PACKAGE  
CASE 751G–03  
ISSUE B  
A
D
16  
9
NOTES:  
1. DIMENSIONS ARE IN MILLIMETERS.  
2. INTERPRET DIMENSIONS AND TOLERANCES  
PER ASME Y14.5M, 1994.  
3. DIMENSIONS D AND E DO NOT INLCUDE MOLD  
PROTRUSION.  
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.  
5. DIMENSION B DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS  
OF THE B DIMENSION AT MAXIMUM MATERIAL  
CONDITION.  
1
8
MILLIMETERS  
B
16X B  
DIM MIN  
MAX  
2.65  
0.25  
0.49  
0.32  
10.45  
7.60  
A
A1  
B
C
D
E
2.35  
0.10  
0.35  
0.23  
10.15  
7.40  
M
S
S
0.25  
T A  
B
e
1.27 BSC  
H
h
L
10.05  
0.25  
0.50  
0
10.55  
0.75  
0.90  
7
SEATING  
PLANE  
14X  
e
C
T
http://onsemi.com  
9
MC14553B  
Notes  
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10  
MC14553B  
Notes  
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11  
MC14553B  
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French Phone: (+1) 303–308–7141 (M–F 1:00pm to 5:00pm Toulouse Time)  
Email: ONlit–french@hibbertco.com  
English Phone: (+1) 303–308–7142 (M–F 12:00pm to 5:00pm UK Time)  
Email: ONlit@hibbertco.com  
Email: r14525@onsemi.com  
ON Semiconductor Website: http://onsemi.com  
EUROPEAN TOLL–FREE ACCESS*: 00–800–4422–3781  
For additional information, please contact your local  
Sales Representative.  
*Available from Germany, France, Italy, England, Ireland  
MC14553B/D  

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