MC14553BDW [ONSEMI]
3-Digit BCD Counter; 3位BCD计数器型号: | MC14553BDW |
厂家: | ONSEMI |
描述: | 3-Digit BCD Counter |
文件: | 总12页 (文件大小:181K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
The MC14553B 3–digit BCD counter consists of 3 negative edge
triggered BCD counters that are cascaded synchronously. A quad latch
at the output of each counter permits storage of any given count. The
information is then time division multiplexed, providing one BCD
number or digit at a time. Digit select outputs provide display control.
All outputs are TTL compatible.
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An on–chip oscillator provides the low–frequency scanning clock
which drives the multiplexer output selector.
This device is used in instrumentation counters, clock displays,
digital panel meters, and as a building block for general logic
applications.
MARKING
DIAGRAMS
16
PDIP–16
P SUFFIX
CASE 648
MC14553BCP
AWLYYWW
• TTL Compatible Outputs
• On–Chip Oscillator
• Cascadable
1
• Clock Disable Input
• Pulse Shaping Permits Very Slow Rise Times on Input Clock
• Output Latches
16
14553B
SOIC–16
DW SUFFIX
CASE 751G
• Master Reset
AWLYYWW
1
MAXIMUM RATINGS (Voltages Referenced to V ) (Note 1.)
SS
A
= Assembly Location
Symbol
Parameter
Value
Unit
V
WL or L = Wafer Lot
YY or Y = Year
V
DD
DC Supply Voltage Range
–0.5 to +18.0
WW or W = Work Week
V , V
in out
Input or Output Voltage Range
(DC or Transient)
–0.5 to V + 0.5
V
DD
I
Input Current
(DC or Transient) per Pin
±10
+20
500
mA
mA
mW
in
ORDERING INFORMATION
I
Output Current
(DC or Transient) per Pin
out
Device
Package
PDIP–16
SOIC–16
Shipping
P
Power Dissipation,
MC14553BCP
MC14553BDW
25/Rail
47/Rail
D
per Package (Note 2.)
T
Ambient Temperature Range
Storage Temperature Range
–55 to +125
–65 to +150
260
°C
°C
°C
A
T
stg
T
Lead Temperature
L
(8–Second Soldering)
1. Maximum Ratings are those values beyond which damage to the device
may occur.
2. Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/ C From 65 C To 125 C
This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
high–impedancecircuit. For proper operation, V and V should be constrained
in
out
to the range V
(V or V
)
V
DD
.
SS
in
out
Unused inputs must always be tied to an appropriate logic voltage level (e.g.,
either V or V ). Unused outputs must be left open.
SS
DD
Semiconductor Components Industries, LLC, 2000
1
Publication Order Number:
March, 2000 – Rev. 3
MC14553B/D
MC14553B
BLOCK DIAGRAM
4
3
CIA CIB
9
7
6
Q0
Q1
Q2
CLOCK
12
10
LE
5
Q3
O.F.
DS1
DS2
DS3
14
2
11
13
DIS
MR
1
15
V
DD
= PIN 16
V
SS
= PIN 8
TRUTH TABLE
Inputs
Master
Reset
Clock
Disable
LE
Outputs
0
0
0
0
0
0
0
0
1
0
0
1
0
0
X
0
0
X
No Change
Advance
No Change
Advance
No Change
No Change
Latched
X
1
1
0
X
X
X
X
X
X
X
1
0
Latched
Q0 = Q1 = Q2 = Q3 = 0
X = Don’t Care
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2
MC14553B
ELECTRICAL CHARACTERISTICS (Voltages Referenced to V
)
SS
– 55 C
25 C
125 C
V
Vdc
DD
(3.)
Characteristic
Output Voltage
Symbol
Unit
Min
Max
Min
Typ
Max
Min
Max
“0” Level
“1” Level
“0” Level
V
OL
5.0
10
15
—
—
—
0.05
0.05
0.05
—
—
—
0
0
0
0.05
0.05
0.05
—
—
—
0.05
0.05
0.05
Vdc
V
in
= V or 0
DD
V
OH
5.0
10
15
4.95
9.95
14.95
—
—
—
4.95
9.95
14.95
5.0
10
15
—
—
—
4.95
9.95
14.95
—
—
—
Vdc
Vdc
V
in
= 0 or V
DD
Input Voltage
(V = 4.5 or 0.5 Vdc)
V
IL
5.0
10
15
—
—
—
1.5
3.0
4.0
—
—
—
2.25
4.50
6.75
1.5
3.0
4.0
—
—
—
1.5
3.0
4.0
O
(V = 9.0 or 1.0 Vdc)
O
(V = 13.5 or 1.5 Vdc)
O
“1” Level
V
IH
Vdc
(V = 0.5 or 4.5 Vdc)
5.0
10
15
3.5
7.0
11
—
—
—
3.5
7.0
11
2.75
5.50
8.25
—
—
—
3.5
7.0
11
—
—
—
O
(V = 1.0 or 9.0 Vdc)
O
(V = 1.5 or 13.5 Vdc)
O
Output Drive Current
I
mAdc
OH
(V = 4.6 Vdc)
Source —
Pin 3
5.0
10
15
– 0.25
– 0.62
– 1.8
—
—
—
– 0.2
– 0.5
– 1.5
– 0.36
– 0.9
– 3.5
—
—
—
0.14
0.35
1.1
—
—
—
OH
(V = 9.5 Vdc)
OH
(V = 13.5 Vdc)
OH
(V = 4.6 Vdc)
Source —
Other
Outputs
5.0
10
15
– 0.64
– 1.6
– 4.2
—
—
—
– 0.51
– 1.3
– 3.4
– 0.88
– 2.25
– 8.8
—
—
—
– 0.36
– 0.9
– 2.4
—
—
—
mAdc
mAdc
mAdc
OH
(V = 9.5 Vdc)
OH
(V = 13.5 Vdc)
OH
(V = 0.4 Vdc)
Sink —
Pin 3
I
OL
5.0
10
15
0.5
1.1
1.8
—
—
—
0.4
0.9
1.5
0.88
2.25
8.8
—
—
—
0.28
0.65
1.20
—
—
—
OL
(V = 0.5 Vdc)
OL
(V = 1.5 Vdc)
OL
(V = 0.4 Vdc) Sink — Other
5.0
10
15
3.0
6.0
18
—
—
—
2.5
5.0
15
4.0
8.0
20
—
—
—
1.6
3.5
10
—
—
—
OL
(V = 0.5 Vdc)
Outputs
OL
(V = 1.5 Vdc)
OL
Input Current
Input Capacitance
I
15
—
—
—
±0.1
—
—
±0.00001
±0.1
—
—
±1.0
µAdc
in
C
—
5.0
7.5
—
pF
in
(V = 0)
in
Quiescent Current
(Per Package)
I
5.0
10
15
—
—
—
5.0
10
20
—
—
—
0.010
0.020
0.030
5.0
10
20
—
—
—
150
300
600
µAdc
µAdc
DD
MR = V
DD
(4.) (5.)
Total Supply Current
I
T
5.0
10
15
I = (0.35 µA/kHz) f + I
T
I = (0.85 µA/kHz) f + I
T
I = (1.50 µA/kHz) f + I
T
DD
DD
DD
(Dynamic plus Quiescent,
Per Package)
(C = 50 pF on all outputs, all
L
buffers switching)
3. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
4. The formulas given are for the typical characteristics only at 25 C.
5. To calculate total supply current at loads other than 50 pF:
I (C ) = I (50 pF) + (C – 50) Vfk
T
L
T
L
where: I is in µA (per package), C in pF, V = (V – V ) in volts, f in kHz is input frequency, and k = 0.004.
T
L
DD
SS
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3
MC14553B
SWITCHING CHARACTERISTICS (6.) (C = 50 pF, T = 25 C)
L
A
(7.)
Characteristic
Figure
Symbol
V
DD
Min
Typ
Max
Unit
Output Rise and Fall Time
2a
t
,
ns
TLH
t
t
t
, t
= (1.5 ns/pF) C + 25 ns
t
THL
5.0
10
15
—
—
—
100
50
40
200
100
80
TLH THL
L
, t
= (0.75 ns/pF) C + 12.5 ns
TLH THL
L
, t
= (0.55 ns/pF) C + 9.5 ns
L
TLH THL
Clock to BCD Out
Clock to Overflow
Reset to BCD Out
2a
2a
2b
2b
2b
2a
2b
—
2a
2b
—
1
t
t
,
5.0
10
15
—
—
—
900
500
200
1800
1000
400
ns
ns
PLH
PHL
t
5.0
10
15
—
—
—
600
400
200
1200
800
400
PHL
t
5.0
10
15
—
—
—
900
500
300
1800
1000
600
ns
PHL
Clock to Latch Enable Setup Time
Master Reset to Latch Enable Setup Time
t
su
5.0
10
15
600
400
200
300
200
100
—
—
—
ns
Removal Time
t
5.0
10
15
– 80
– 10
0
– 200
– 70
– 50
—
—
—
ns
rem
Latch Enable to Clock
Clock Pulse Width
t
t
5.0
10
15
550
200
150
275
100
75
—
—
—
ns
WH(cl)
WH(R)
Reset Pulse Width
5.0
10
15
1200
600
450
600
300
225
—
—
—
ns
Reset Removal Time
Input Clock Frequency
Input Clock Rise Time
t
5.0
10
15
– 80
0
20
– 180
– 50
– 30
—
—
—
ns
rem
f
cl
5.0
10
15
—
—
—
1.5
5.0
7.0
0.9
2.5
3.5
MHz
ns
t
5.0
10
15
No
Limit
TLH
Disable, MR, Latch Enable
Rise and Fall Times
t
t
,
5.0
10
15
—
—
—
—
—
—
15
5.0
4.0
µs
TLH
THL
Scan Oscillator Frequency
f
5.0
10
15
—
—
—
1.5/C1
4.2/C1
7.0/C1
—
—
—
Hz
osc
(C1 measured in µF)
6. The formulas given are for the typical characteristics only at 25 C.
7. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
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4
MC14553B
UNITS CLOCK
UNITS Q0
UNITS Q1
UNITS Q2
UNITS Q3
TENS CLOCK
TENS Q0
TENS Q3
UP AT 980
UP AT 80
HUNDREDS
CLOCK
HUNDREDS Q0
HUNDREDS Q3
DISABLE
UP AT 800
(DISABLES CLOCK WHEN HIGH)
OVERFLOW
MASTER
RESET
SCAN
OSCILLATOR
DIGIT SELECT 1
DIGIT SELECT 2
UNITS
TENS
DIGIT SELECT 3
HUNDREDS
Figure 1. 3–Digit Counter Timing Diagram (Reference Figure 3)
16
V
DD
(a)
PULSE
GENERATOR
Q3
Q2
20 ns
t
WL(cl)
C
20 ns
90%
C
L
90%
10%
CLOCK
C
L
50%
Q1
LE
C
L
Q0
t
PLH
1/f
t
cl
C
L
O.F.
DS1
DS2
DS3
PHL
DIS
BCD OUT
C
L
t
50%
t
PHL
10%
t
TLH
THL
50%
OVERFLOW
MR
8
V
SS
t
TLH
90%
10%
CLOCK
50%
V
DD
(b)
GENERATOR
1
t
su
t
Q3
Q2
rem
C
C
L
LATCH
ENABLE
C
L
50%
, t
Q1
GENERATOR
2
LE
C
L
Q0
t
PHL PLH
t
su
C
L
O.F.
DS1
DS2
DS3
GENERATOR
3
MR
C
L
BCD OUT
50%
DIS
t
PHL
V
SS
50%
MASTER RESET
t
WH(R)
Figure 2. Switching Time Test Circuits and Waveforms
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5
MC14553B
OPERATING CHARACTERISTICS
The MC14553B three–digit counter, shown in Figure 3,
The Master Reset input, when taken high, initializes the
three BCD counters and the multiplexer scanning circuit.
While Master Reset is high the digit scanner is set to digit
one; but all three digit select outputs are disabled to prolong
display life, and the scan oscillator is inhibited. The Disable
input, when high, prevents the input clock from reaching the
counters, while still retaining the last count. A pulse shaping
circuit at the clock input permits the counters to continue
operating on input pulses with very slow rise times.
Information present in the counters when the latch input
goes high, will be stored in the latches and will be retained
while the latch input is high, independent of other inputs.
Information can be recovered from the latches after the
counters have been reset if Latch Enable remains high
during the entire reset cycle.
consists of three negative edge–triggered BCD counters
which are cascaded in a synchronous fashion. A quad latch
at the output of each of the three BCD counters permits
storage of any given count. The three sets of BCD outputs
(active high), after going through the latches, are time
division multiplexed, providing one BCD number or digit at
a time. Digit select outputs (active low) are provided for
display control. All outputs are TTL compatible.
An on–chip oscillator provides the low frequency
scanning clock which drives the multiplexer output selector.
The frequency of the oscillator can be controlled externally
by a capacitor between pins 3 and 4, or it can be overridden
and driven with an external clock at pin 4. Multiple devices
can be cascaded using the overflow output, which provides
one pulse for every 1000 counts.
C1
A
LATCH ENABLE
10
4
3
SCAN
OSCILLATOR
PULSE
GENERATOR
R
C1
C1
B
CLOCK
12
R SCANNER
Q0
PULSE
SHAPER
C
R
Q1
Q2
Q3
QUAD
LATCH
÷10
UNITS
9
Q0
11
DISABLE
(ACTIVE
HIGH)
MULTIPLEXER
7
Q1
Q0
Q1
Q2
Q3
C
R
QUAD
LATCH
BCD
OUTPUTS
(ACTIVE
HIGH)
÷10
TENS
6
Q2
Q0
Q1
Q2
Q3
C
R
5
QUAD
LATCH
Q3
÷10
HUNDREDS
2
1
15
DS1 DS2 DS3
(LSD) DIGIT SELECT (MSD)
(ACTIVE LOW)
13
MR
(ACTIVE HIGH)
14
OVERFLOW
Figure 3. Expanded Block Diagram
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6
MC14553B
Figure 4. Six–Digit Display
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7
MC14553B
PACKAGE DIMENSIONS
PDIP–16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
–A–
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
16
1
9
8
B
S
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
INCHES
DIM MIN MAX
0.740 0.770 18.80 19.55
MILLIMETERS
MIN MAX
F
A
B
C
D
F
G
H
J
K
L
M
S
C
L
0.250 0.270
0.145 0.175
0.015 0.021
6.35
3.69
0.39
1.02
6.85
4.44
0.53
1.77
0.040
0.70
SEATING
PLANE
–T–
0.100 BSC
0.050 BSC
0.008 0.015
2.54 BSC
1.27 BSC
K
M
0.21
0.38
3.30
7.74
10
H
J
0.110
0.295 0.305
10
0.020 0.040
0.130
2.80
7.50
0
G
D 16 PL
0
0.51
1.01
M
M
0.25 (0.010)
T A
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8
MC14553B
PACKAGE DIMENSIONS
SOIC–16
DW SUFFIX
PLASTIC SOIC PACKAGE
CASE 751G–03
ISSUE B
A
D
16
9
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INLCUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
1
8
MILLIMETERS
B
16X B
DIM MIN
MAX
2.65
0.25
0.49
0.32
10.45
7.60
A
A1
B
C
D
E
2.35
0.10
0.35
0.23
10.15
7.40
M
S
S
0.25
T A
B
e
1.27 BSC
H
h
L
10.05
0.25
0.50
0
10.55
0.75
0.90
7
SEATING
PLANE
14X
e
C
T
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9
MC14553B
Notes
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10
MC14553B
Notes
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11
MC14553B
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MC14553B/D
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