MC33263SQL-40R2 [ONSEMI]
4V FIXED POSITIVE LDO REGULATOR, 0.26V DROPOUT, PDSO6, 2 X 2 MM, PLASTIC, QFN-6;
| 型号： | MC33263SQL-40R2 |
| 厂家： | 
ONSEMI |
| 描述： | 4V FIXED POSITIVE LDO REGULATOR, 0.26V DROPOUT, PDSO6, 2 X 2 MM, PLASTIC, QFN-6 光电二极管 |
| 文件： | 总16页 (文件大小：160K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MC33263
Ultra Low Noise
150 mA Low Dropout
Voltage Regulator with
ON/OFF Control
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Housed in a SOT23–L package, the MC33263 delivers up to
150 mA where it exhibits a typical 180 mV dropout. With an
incredible noise level of 25 mVRMS (over 100 Hz to 100 kHz, with a
10 nF bypass capacitor), the MC33263 represents the ideal choice for
sensitive circuits, especially in portable applications where noise
performance and space are premium. The MC33263 also excels in
response time and reacts in less than 25 ms when receiving an OFF to
ON signal (with no bypass capacitor).
Thanks to a novel concept, the MC33263 accepts output capacitors
without any restrictions regarding their Equivalent Series Resistance
(ESR) thus offering an obvious versatility for immediate implementation.
With a typical DC ripple rejection better than –90 dB (–70 dB @
1.0 kHz), it naturally shields the downstream electronics against
choppy power lines.
SOT–23L
NW SUFFIX
CASE 318J
6
1
QFN 2x2
SQL SUFFIX
CASE 488
1
6
PIN CONNECTIONS AND
MARKING DIAGRAMS
Additionally, thermal shutdown and short–circuit protection
provide the final product with a high degree of ruggedness.
SOT–23L
Features:
1
2
3
6
5
4
V
ON/OFF
GND
IN
• Very Low Quiescent Current 170 µA (ON, no load), 100 nA
(OFF, no load)
GND
• Very Low Dropout Voltage, Typical Value is 137 mV at an Output
Current of 100 mA
BYPASS
V
OUT
• Very Low Noise with External Bypass Capacitor (10 nF),
Typically 25 µVrms over 100 Hz to 100 kHz
• Internal Thermal Shutdown
(Top View)
QFN 2x2
• Extremely Tight Line Regulation Typically –90 dB
6
V
in
On/Off
• Ripple Rejection –70 dB @ 1.0 kHz
1
• Line Transient Response: 1.0 mV for DV = 3.0 V
• Extremely Tight Load Regulation, Typically 20 mV at DI = 150 mA
• Multiple Output Voltages Available
in
xx
2
3
5
4
Gnd
Gnd
out
V
out
Bypass
• Logic Level ON/OFF Control (TTL–CMOS Compatible)
• ESR can vary from 0 to 3.0 W
(Top View)
• Functionally and Pin Compatible with TK112xxA/B Series
• Extremely Small QFN 2x2 Package
x
= Voltage Option Code
xx = Version
A
L
Y
W
= Assembly Location
= Wafer Lot
= Year
Applications:
• All Portable Systems, Battery Powered Systems, Cellular
Telephones, Radio Control Systems, Toys and Low Voltage Systems
= Work Week
ORDERING INFORMATION
See detailed ordering and shipping information on page 11 of
this data sheet.
Semiconductor Components Industries, LLC, 2001
1
Publication Order Number:
June, 2001 – Rev. 4
MC33263/D
MC33263
6 (1)
Input
1 (6)
Shutdown
Thermal
Shutdown
ON/OFF
4 (3)
Output
3 (4)
Bypass
Band Gap
Reference
* Current Limit
* Antisaturation
* Protection
2 (2)
GND
5 (5)
GND
NOTE: Pin numbers in parenthesis indicate QFN package.
Figure 1. MC33263 Block Diagram
MAXIMUM RATINGS
Rating
Symbol
Pin #
Value
Unit
Power Supply Voltage
V
in
6
12
V
Power Dissipation and Thermal Resistance
Maximum Power Dissipation
Thermal Resistance, Junction–to–Air
SOT–23L
P
Internally Limited
W
D
R
q
JA
210
225
°C/W
°C/W
QFN
Operating Ambient Temperature
Maximum Junction Temperature
T
–40 to +85
150
°C
°C
A
T
Jmax
Storage Temperature Range
T
stg
–60 to +150
°C
ELECTRICAL CHARACTERISTICS (For typical values T = 25°C, for min/max values T = –40°C to +85°C, Max T = 150°C)
A
A
J
Characteristics
Symbol
Pin #
Min
Typ
Max
Unit
CONTROL ELECTRICAL CHARACTERISTICS
Input Voltage Range
V
1
1
0
–
–
V
V
ON/OFF
in
ON/OFF Input Current (All versions)
I
mA
ON/OFF
V
= 2.4 V
2.5
–
ON/OFF
ON/OFF Input Voltages (All versions)
Logic “0”, i.e. OFF State
Logic “1”, i.e. ON State
V
1
V
ON/OFF
–
2.2
–
–
0.3
–
CURRENTS PARAMETERS
Current Consumption in OFF State (All versions)
IQ
mA
mA
mA
mA
OFF
OFF Mode Current: V = V + 1.0 V, I = 0 mA
–
–
0.1
170
900
210
2.0
200
1400
–
in
out
out
Current Consumption in ON State (All versions)
ON Mode Sat Current: V = V + 1.0 V, I = 0 mA
IQ
ON
in
out
out
Current Consumption in Saturation ON State (All versions)
ON Mode Sat Current: V = V – 0.5 V, I = 0 mA
IQ
SAT
–
in
out
out
Current Limit V = V + 1.0 V, (All versions)
I
MAX
in
out
Output Short–circuited (Note 1)
175
1. I (Output Current) is the measured current when the output voltage drops below 0.3 V with respect to V at I = 30 mA.
out
out
out
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MC33263
ELECTRICAL CHARACTERISTICS (For typical values T = 25°C, for min/max values T = –40°C to +85°C, Max T = 150°C)
A
A
J
Characteristics
Symbol
Pin #
Min
Typ
Max
Unit
V
in
= V + 1.0 V, T = 25°C, 1.0 mA < I < 150 mA
V
out
4
V
out
A
out
2.8 Suffix
3.0 Suffix
3.2 Suffix
3.3 Suffix
3.8 Suffix
4.0 Suffix
4.75 Suffix
5.0 Suffix
2.74
2.94
3.13
3.23
3.72
3.92
4.66
4.90
2.8
3.0
3.2
3.3
3.8
4.0
4.75
5.0
2.86
3.06
3.27
3.37
3.88
4.08
4.85
5.1
V
in
= V + 1.0 V, –40°C < T < 80°C,
V
out
4
V
out
A
1.0 mA < I < 150 mA
out
2.8 Suffix
3.0 Suffix
3.2 Suffix
3.3 Suffix
3.8 Suffix
4.0 Suffix
4.75 Suffix
5.0 Suffix
2.7
2.9
2.8
3.0
3.2
3.3
3.8
4.0
4.75
5.0
2.9
3.1
3.09
3.18
3.67
3.86
4.58
4.83
3.31
3.42
3.93
4.14
4.92
5.17
LINE AND LOAD REGULATION, DROPOUT VOLTAGES
Line Regulation (All versions)
Reg
4/6
1
mV
mV
line
V
out
+ 1.0 V < V < 12 V, I = 60 mA
–
2.0
10
in
out
Load Regulation (All versions)
V
= V + 1.0 V
Reg
load
in
out
out
out
out
I
I
I
= 1.0 to 60 mA
= 1.0 to 100 mA
= 1.0 to 150 mA
–
–
–
8.0
15
20
25
35
45
Dropout Voltage (All versions)
V
in
– V
4, 6
mV
out
I
I
I
= 10 mA
= 100 mA
= 150 mA
–
–
–
30
137
180
90
230
260
out
out
out
DYNAMIC PARAMETERS
Ripple Rejection (All versions)
4, 6
4, 6
dB
V
in
= V + 1.0 V, V = 1.0 V, f = 1.0 kHz, I = 60 mA
60
–
70
–
–
out
pp
out
Line Transient Response
= V + 1.0 V to V + 4.0 V, I = 60 mA,
mV
V
in
1.0
out
out
out
d(V )/dt = 15 mV/ms
in
Output Noise Voltage (All versions)
= 1.0 µF, I = 60 mA, f = 100 Hz to 100 kHz
V
RMS
4, 6
µVrms
C
out
out
C
C
C
= 10 nF
= 1.0 nF
= 0 nF
–
–
–
25
40
65
–
–
–
bypass
bypass
bypass
Output Noise Density
= 1.0 µF, I = 60 mA, f = 1.0 kHz
V
4
4
nV/ √Hz
N
C
–
230
–
out
out
Output Rise Time (All versions)
= 1.0 µF, I = 30 mA, V = 0 to 2.4 V
ON/OFF
t
r
C
out
out
1% of ON/OFF Signal to 99% of Nominal Output Voltage
Without Bypass Capacitor
–
–
40
1.1
–
–
µs
ms
With C
= 10 nF
bypass
THERMAL SHUTDOWN
Thermal Shutdown (All versions)
–
150
–
°C
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MC33263
DEFINITIONS
Load Regulation – The change in output voltage for a
This feature is provided to prevent catastrophic failures from
accidental overheating.
Maximum Package Power Dissipation – The maximum
package power dissipation is the power dissipation level at
which the junction temperature reaches its maximum value
i.e. 125°C. The junction temperature is rising while the
change in load current at constant chip temperature.
Dropout Voltage – The input/output differential at which
the regulator output no longer maintains regulation against
further reductions in input voltage. Measured when the
output drops 100 mV below its nominal value (which is
measured at 1.0 V differential), dropout voltage is affected
by junction temperature, load current and minimum input
supply requirements.
difference between the input power (V X I ) and the
CC
CC
output power (V X I ) is increasing.
out
out
Depending on ambient temperature, it is possible to
calculate the maximum power dissipation, maximum load
current or maximum input voltage (see Application Hints:
Protection).
Output Noise Voltage – The RMS AC voltage at the
output with a constant load and no input ripple, measured
over a specified frequency range.
Maximum Power Dissipation – The maximum total
dissipation for which the regulator will operate within
specifications.
Quiescent Current – Current which is used to operate the
regulator chip and is not delivered to the load.
Line Regulation – The change in input voltage for a
change in the input voltage. The measurement is made under
conditions of low dissipation or by using pulse techniques
such that the average chip temperature is not significantly
affected.
The maximum power dissipation supported by the device
is a lot increased when using appropriate application design.
Mounting pad configuration on the PCB, the board material
and also the ambient temperature are affected the rate of
temperature rise. It means that when the I has good thermal
C
conductivity through PCB, the junction temperature will be
“low” even if the power dissipation is great.
The thermal resistance of the whole circuit can be
evaluated by deliberately activating the thermal shutdown
of the circuit (by increasing the output current or raising the
input voltage for example).
Line Transient Response
– Typical over– and
undershoot response when input voltage is excited with a
given slope.
Thermal Protection – Internal thermal shutdown
circuitry is provided to protect the integrated circuit in the
event that the maximum junction temperature is exceeded.
When activated, typically 150°C, the regulator turns off.
Then you can calculate the power dissipation by
subtracting the output power from the input power. All
variables are then well known: power dissipation, thermal
shutdown temperature (150°C for MC33263) and ambient
temperature.
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MC33263
APPLICATION HINTS
Input Decoupling – As with any regulator, it is necessary
If a 150 mA output current is needed, the ground current
is extracted from the data–sheet curves: 6.5 mA @ 150 mA.
For a MC33263NW28R2 (2.8 V), the maximum input
voltage will then be 6.48 V, a rather comfortable margin.
Typical Application – The following figure portraits the
typical application for the MC33263 where both
input/output decoupling capacitors appear.
to reduce the dynamic impedance of the supply rail that
feeds the component. A 1 mF capacitor either ceramic or
tantalum is recommended and should be connected close to
the MC33263 package. Higher values will correspondingly
improve the overall line transient response.
Output Decoupling – Thanks to a novel concept, the
MC33263 is a stable component and does not require any
Equivalent Series Resistance (ESR) neither a minimum
output current. Capacitors exhibiting ESRs ranging from a
few mW up to 3 W can thus safely be used. The minimum
decoupling value is 1 mF and can be augmented to fulfill
stringent load transient requirements. The regulator accepts
ceramic chip capacitors as well as tantalum devices.
Noise Performances – Unlike other LDOs, the MC33263
is a true low–noise regulator. With a 10 nF bypass capacitor,
it typically reaches the incredible level of 25 mVRMS overall
noise between 100 Hz and 100 kHz. To give maximum
insight on noise specifications, ON Semiconductor includes
spectral density graphics as well as noise dependency versus
bypass capacitor.
Input
Output
6
1
5
4
3
C3
1.0 mF
C2
1.0 mF
MC33263
2
C1
10 nF
On/Off
The bypass capacitor impacts the start–up phase of the
MC33263 as depicted by the data–sheet curves. A typical
1 ms settling time is achieved with a 10 nF bypass capacitor.
However, thanks to its low–noise architecture, the
MC33263 can operate without bypass and thus offers a
typical 20 ms start–up phase. In that case, the typical output
noise stays lower than 65 mVRMS between 100 Hz –
100 kHz.
Figure 2. A Typical MC33263 Application with
Recommended Capacitor Values
Protections – The MC33263 hosts several protections,
conferring natural ruggedness and reliability to the products
implementing the component. The output current is
internally limited to a minimum of 175 mA while
temperature shutdown occurs if the die heats up beyond
150°C. These value lets you assess the maximum
differential voltage the device can sustain at a given output
current before its protections come into play.
C1
On/Off
10 nF
6
5
4
The maximum dissipation the package can handle is given
by:
1
2
3
Input
Output
T
– T
Jmax
+
A
+
P
+
max
R
C3
1.0 mF
C2
1.0 mF
qJA
If T
is internally limited to 150°C, then the MC33263
Jmax
can dissipate up to 595 mW @ 25°C.
The power dissipated by the MC33263 can be calculated
from the following formula:
Figure 3. A Typical MC33263 Application with
Recommended Capacitor Values
Ptot + ǀV @ I
(I )ǁ ) ǀV * Vout ǁ @ I
out
out
in gnd
in
or
Ptot ) V
@ I
out
out
Vin
+
max
I
) I
out
gnd
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MC33263
As for any low noise designs, particular care has to be
MC33263 Wake–up Improvement – In portable
applications, an immediate response to an enable signal is
vital. If noise is not of concern, the MC33263 without a
bypass capacitor settles in nearly 20 ms and typically delivers
65 mVRMS between 100 Hz and 100 kHz.
taken when tackling Printed Circuit Board (PCB) layout.
The following figure gives an example of a layout where
stray inductances/capacitances are minimized.
In ultra low–noise systems, the designer needs a 10 nF
bypass capacitor to decrease the noise down to 25 mVRMS
between 100 Hz and 100 kHz. With the adjunction of the
10 nF capacitor, the wake–up time expands up to 1 ms as
shown on the data–sheet curves. If an immediate response
is wanted, following figure’s circuit gives a solution to
charge the bypass capacitor with the enable signal without
degrading the noise response of the MC33263.
At power–on, C4 is discharged. When the control logic
sends its wake–up signal by going to a high level, the PNP
base is momentarily tight to ground. The PNP switch closes
and immediately charges the bypass capacitor C1 toward its
operating value. After a few ms, the PNP opens and becomes
totally transparent to the regulator.
This circuit improves the response time of the regulator
which drops from 1 ms down to 30 ms. The value of C4 needs
to be tweaked in order to avoid any bypass capacitor
overload during the wake–up transient.
Figure 4. Printed Circuit Board
Differential (V –V
)
in out
Package Placement – QFN packages can be placed using
standard pick and place equipment with an accuracy of
"0.05 mm. Component pick and place systems are
composed of a vision system that recognizes and positions
the component and a mechanical system which physically
performs the pick and place operation. Two commonly used
types of vision systems are: (1) a vision system that locates
a package silhouette and (2) a vision system that locates
individual bumps on the interconnect pattern. The latter type
renders more accurate place but tends to be more expensive
and time consuming. Both methods are acceptable since the
parts align due to a self–centering feature of the QFN solder
joint during solder re–flow.
C3 MC33263
+
Input
Output
+
C2
C1
Rpull–up
Solder Paste – Type 3 or Type 4 solder paste is acceptable.
Re–flow and Cleaning – The QFN may be assembled
using standard IR/IR convection SMT re–flow processes
without any special considerations. As with other packages,
the thermal profile for specific board locations must be
determined. Nitrogen purge is recommended during solder
for no–clean fluxes. The QFN is qualified for up to three
re–flow cycles at 235°C peak (J–STD–020). The actual
temperature of the QFN is a function of:
ON/OFF
Figure 5. Copper Side Component Layout
This layout is the basis for an MC33263 performance
evaluation board where the BNC connectors give the user an
easy and quick evaluation mean.
• Component density
• Component location on the board
• Size of surrounding components
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MC33263
C4
470 pF
Input
Output
R2
220 k
On/Off
C1
10 nF
MMBT2902LT1
Q1
6
1
5
4
3
+
+
C3
C2
1.0 mF
MC33263
2
1.0 mF
6
1
5
2
4
3
On/Off
R2
220 k
C4
470 pF
Input
Output
C1
10 nF
MMBT2902LT1
Q1
+
+
C3
1.0 mF
C2
1.0 mF
Figure 6. A PNP Transistor Drives the
Bypass Pin when Enable Goes High
Figure 7. A PNP Transistor Drives the
Bypass Pin when Enable Goes High
MC33263 Without
Wake–up Improvement
(Typical Response)
1 ms
MC33263 With
Wake–up Improvement
(Typical Response)
30 ms
Figure 8. MC33263 Wake–up Improvement with Small PNP Transistor
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MC33263
The PNP being wired upon the bypass pin, it shall not
degrade the noise response of the MC33263. Figure 9
confirms the good behavior of the integrated circuit in this
area which reaches a typical noise level of 26 mVRMS
(100 Hz to 100 kHz) at I = 60 mA.
out
350
300
250
200
V
= 3.8 V
= 2.8 V
in
V
out
C = 1.0 mF
o
I
= 60 mA
= 25°C
out
T
amb
C
= 10 nF
byp
150
100
V
= 26 mVrms C = 10 nF
in
50
0
@ 100 Hz – 100 kHz
100 1,000
10,000
100,000
1,000,000
Frequency (Hz)
Figure 9. Noise Density of the MC33263 with a 10 nF
Bypass Capacitor and a Wake–up Improvement Network
TYPICAL PERFORMANCE CHARACTERISTICS
Ground Current Performances
7.0
6.0
5.0
4.0
3.0
2.0
2.1
2.05
2.0
V
= 3.8 V
= 2.8 V
= 1.0 mF
= 25°C
in
V
out
V
= 3.8 V
= 2.8 V
= 1.0 mF
= 60 mA
in
C
T
amb
O
V
out
C
O
I
out
1.95
1.9
1.85
1.8
1.0
0
0
20 40 60 80 100 120 140 160 180 200
OUTPUT CURRENT (mA)
–40
–20
0
20
40
60
80
AMBIENT TEMPERATURE (°C)
Figure 11. Ground Current versus Ambient
Temperature
Figure 10. Ground Current versus Output Current
Line Transient Response and Output Voltage
200
190
180
170
160
150
140
130
120
Y1
V
= 3.8 to 7.0 V
in
Y1 = 1.0 mV/div
Y2 = 1.0 V/div
X = 1.0 ms
dV = 3.2 V
in
Y2
I
= 60 mA
= 25°C
out
T
amb
110
100
–40
–20
0
20
40
60
80
100
TEMPERATURE (°C)
Figure 12. Quiescent Current versus Temperature
Figure 13. Line Transient Response
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MC33263
TYPICAL PERFORMANCE CHARACTERISTICS
Load Transient Response versus Load Current Slope
Y1
Y2
Y2
V
= 3.8 V
in
Y1 = 100 mV/div
Y2 = 20 mV/div
X = 200 ms/div
V
in
= 3.8 V
Y1 = 50 mA/div
Y2 = 20 mV/div
X = 20 ms
T
amb
= 25°C
T
amb
= 25°C
Y1
Y1: OUTPUT CURRENT, Y2: OUTPUT VOLTAGE
Y1: OUTPUT CURRENT, Y2: OUTPUT VOLTAGE
Figure 14. Iout = 3.0 mA to 150 mA
Figure 15. ISlope = 100 mA/ms (Large Scale)
Iout = 3.0 mA to 150 mA
Y1
Y1
Y2
Y2
V
in
= 3.8 V
V
in
= 3.8 V
Y1 = 50 mA/div
Y2 = 20 mV/div
X = 200 ms
Y1 = 50 mA/div
Y2 = 20 mV/div
X = 100 ms
T
= 25°C
T
= 25°C
amb
amb
Y1: OUTPUT CURRENT, Y2: OUTPUT VOLTAGE
Y1: OUTPUT CURRENT, Y2: OUTPUT VOLTAGE
Figure 16. ISlope = 6.0 mA/ms (Large Scale)
out = 3.0 mA to 150 mA
Figure 17. ISlope = 2.0 mA/ms (Large Scale)
I
Iout = 3.0 mA to 150 mA
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MC33263
TYPICAL PERFORMANCE CHARACTERISTICS
Noise Performances
350
300
250
200
150
100
70
V
= 3.8 V
= 2.8 V
= 1.0 mF
= 60 mA
in
0 nF
V
out
60
50
40
30
20
C
I
O
3.3 nF
out
T
amb
= 23°C
C
= 10 nF
byp
V
V
C
= 3.8 V
= 2.8 V
= 1.0 mF
= 60 mA
= 25°C
in
out
Vn = 65 mVrms @ C
Vn = 30 mVrms @ C
Vn = 25 mVrms @ C
= 0
bypass
bypass
bypass
O
= 3.3 nF
= 10 nF
50
0
10
0
I
out
T
amb
over 100 Hz to 100 kHz
100 1000
10,000
FREQUENCY (Hz)
100,000
1,000,000
0
2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10
BYPASS CAPACITOR (nF)
1.0
Figure 18. Noise Density versus Bypass
Capacitor
Figure 19. RMS Noise versus Bypass Capacitor
(100 Hz – 100 kHz)
Settling Time Performances
1200
1000
800
V
= 3.8 V
= 2.8 V
= 1.0 mF
= 60 mA
in
V
out
C
O
I
out
T
amb
= 25°C
600
200 ms/div
500 mV/div
V = 3.8 V
in
400
V
out
= 2.8 V
C
= 10 nF
C
= 1.0 mF
out
= 50 mA
byp
200
0
I
out
T
amb
= 25°C
0
1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10
BYPASS CAPACITOR (nF)
Figure 20. Output Voltage Settling Time versus
Bypass Capacitor
Figure 21. Output Voltage Settling Shape
C
bypass = 10 nF
V
= 3.8 V
= 2.8 V
in
V
= 3.8 V
= 2.8 V
in
V
out
V
out
C
= 1.0 mF
10 ms/div
500 mV/div
out
100 ms/div
500 mV/div
C
= 1.0 mF
out
I
= 50 mA
= 25°C
out
I
= 50 mA
= 25°C
out
T
amb
C
= 0 nF
byp
C
= 3.3 nF
byp
T
amb
Figure 22. Output Voltage Settling Shape
bypass = 3.3 nF
Figure 23. Output Voltage Settling Shape without
Bypass Capacitor
C
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MC33263
TYPICAL PERFORMANCE CHARACTERISTICS
Dropout Voltage
250
200
150
100
250
150 mA
100 mA
200
85°C
25°C
150
100
–40°C
60 mA
50
0
50
0
10 mA
60
10
60
100
150
–40
–20
0
20
40
80
100
I
O
(mA)
TEMPERATURE (°C)
Figure 24. Dropout Voltage versus Iout
Figure 25. Dropout Voltage versus Temperature
Output Voltage
2.860
2.805
2.800
2.795
2.790
2.785
2.780
1 mA
2.840
2.820
2.800
2.780
60 mA
100 mA
–40°C
25°C
150 mA
85°C
2.760
2.740
2.775
2.770
0
20
40
60
80
100 120
140 160
–40
–20
0
20
40
60
80
100
OUTPUT CURRENT (mA)
TEMPERATURE (°C)
Figure 26. Output Voltage versus Temperature
Figure 27. Output Voltage versus Iout
Ripple Rejection Performances
0
–20
–40
–60
–80
0
–10
–20
–30
–40
–50
–60
–70
–80
V
V
C
= 3.8 V
= 2.8 V
= 1.0 mF
= 60 mA
= 25°C
in
V
V
C
= 3.8 V
= 2.8 V
= 1.0 mF
= 60 mA
= 25°C
in
out
out
O
O
I
out
I
out
T
amb
T
amb
–100
–120
–90
–100
10
100
1000
10,000
100,000 1,000,000
100
1000
10,000
100,000
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 28. Ripple Rejection versus Frequency with
10 nF Bypass Capacitor
Figure 29. Ripple Rejection versus Frequency
without Bypass Capacitor
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MC33263
ORDERING AND DEVICE MARKING INFORMATION
Device
Marking
A
Version
2.8 V
3.0 V
3.2 V
3.3 V
3.8 V
4.0 V
4.75 V
5.0 V
2.8 V
3.0 V
3.2 V
3.3 V
3.8 V
4.0 V
4.75 V
5.0 V
Package
Shipping
MC33263NW–28R2
MC33263NW–30R2
MC33263NW–32R2
MC33263NW–33R2
MC33263NW–38R2
MC33263NW–40R2
MC33263NW–47R2
MC33263NW–50R2
MC33263SQL–28R2
MC33263SQL–30R2
MC33263SQL–32R2
MC33263SQL–33R2
MC33263SQL–38R2
MC33263SQL–40R2
MC33263SQL–47R2
MC33263SQL–50R2
B
C
D
SOT–23L
2500 Tape & Reel
E
F
G
H
LEL
LEN
LEP
LEQ
LER
LES
LET
LEU
QFN 2x2
3000 Units/7″ Reel
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MC33263
PACKAGE DIMENSIONS
SOT–23L
NW SUFFIX
CASE 318J–01
ISSUE B
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
0.05
3. DIMENSION E1 DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.23 PER
SIDE.
4. DIMENSIONS b AND b2 DO NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 TOTAL IN EXCESS
OF THE b AND b2 DIMENSIONS AT MAXIMUM
MATERIAL CONDITION.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSIONS D AND E1 ARE TO BE DETERMINED
AT DATUM PLANE H.
E
M
M
C B
C
0.20
PIN 1 IDENTIFIER
IN THIS ZONE
A
A
1
2
6
5
3
4
MILLIMETERS
A1
A
E1
DIM MIN
MAX
1.40
0.10
0.50
0.45
0.25
0.20
3.60
3.60
2.40
B
A
A
A1
b
1.25
0.00
0.35
0.35
0.10
0.10
3.20
3.00
2.00
b1
c
(b)
b1
c1
D
q
E
c
c1
E1
e
0.95
1.90
e1
H
0.55
10
L
0.25
0
L
q
_
_
SECTION A–A
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MC33263
PACKAGE DIMENSIONS
QFN 2x2
SQL SUFFIX
PLASTIC PACKAGE
CASE 488–02
ISSUE A
PIN 1
IDENT.
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. 488-01 OBSOLETE. NEW STANDARD IS 488-02.
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
0.088
0.080
0.037
0.011
A
B
C
D
G
H
J
2.18
1.98
0.88
0.23
2.23 0.086
2.03 0.078
0.93 0.035
0.28 0.009
TOP VIEW
A
0.650 BSC
0.026 BSC
PIN 1
0.35
0.05
1.28
0.33
0.40 0.014
0.016
0.004
0.052
0.015
0.10 0.002
1.33 0.050
0.38 0.013
C
J
L
S
S
H
G
B
L
D
U
BOTTOM VIEW
SIDE VIEW
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MC33263
Notes
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15
MC33263
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
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including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
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Literature Fulfillment:
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MC33263/D
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