MC33269DT-012 [ONSEMI]
800 mA, Adjustable Output, Low Dropout Voltage Regulator; 800毫安，可调输出，低压差稳压器
| 型号： | MC33269DT-012 |
| 厂家： | 
ONSEMI |
| 描述： | 800 mA, Adjustable Output, Low Dropout Voltage Regulator |
| 文件： | 总12页 (文件大小：268K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MC33269, NCV33269
800 mA, Adjustable Output,
Low Dropout Voltage
Regulator
The MC33269/NCV33269 series are low dropout, medium current,
fixed and adjustable, positive voltage regulators specifically designed
for use in low input voltage applications. These devices offer the
circuit designer an economical solution for precision voltage
regulation, while keeping power losses to a minimum.
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SO−8
D SUFFIX
8
CASE 751
The regulator consists of a 1.0 V dropout composite PNP−NPN pass
transistor, current limiting, and thermal shutdown.
1
GND/Adj
1
2
3
4
8
7
6
NC
Features
3.3 V, 5.0 V, 12 V and Adjustable Versions
2.85 V version available as MC34268
Space Saving DPAK, SO−8 and SOT−223 Power Packages
V
out
V
out
V
in
5
NC
1.0 V Dropout
(Top View)
Output Current in Excess of 800 mA
Thermal Protection
Short Circuit Protection
Output Trimmed to 1.0% Tolerance
NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
DPAK
DT SUFFIX
CASE 369C
1
2 3
1
3
1. GND/Adj
(Top View)
2. V
3. V
out
in
SOT−223
ST SUFFIX
CASE 318E
These are Pb−Free Devices
1
2
3
1
3
(Top View)
Heatsink surface (shown as terminal 4 in
DEVICE TYPE/NOMINAL OUTPUT VOLTAGE
case outline drawing) is connected to Pin 2.
MC33269D
NCV33269D*
MC33269DT
NCV33269DTRK*
MC33269T
Adj
Adj
Adj
MC33269D−5.0
5.0 V
5.0 V
5.0 V
5.0 V
5.0 V
12 V
12 V
12 V
12 V
MC33269DT−5.0
NCV33269DT−5.0*
NCV33269DTRK−5.0*
MC33269T−5.0
Adj
TO−220AB
T SUFFIX
CASE 221AB
3.3 V
3.3 V
3.3 V
3.3 V
3.3 V
MC33269D−3.3
MC33269DT−3.3
NCV33269DTRK−3.3*
MC33269T−3.3
MC33269ST−3.3
MC33269D−012
MC33269DT−012
NCV33269DTRK−012*
MC33269T−012
1. GND/Adj
2. V
3. V
out
in
1
1 2 3
(Top View)
2
3
*NCV Prefix for Automotive and Other Applications Requiring Unique Site and
Control Change Requirements; AEC−Q100 Qualified and PPAP Capable.
Heatsink surface (shown as terminal 4 in
case outline drawing) is connected to Pin 2.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 8 of this data sheet.
Semiconductor Components Industries, LLC, 2013
1
Publication Order Number:
April, 2013 − Rev. 27
MC33269/D
MC33269, NCV33269
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Power Supply Input Voltage
V
in
20
V
Power Dissipation
Case 369C (DPAK)
T = 25C
P
q
q
Internally Limited
W
C/W
C/W
A
D
JA
JC
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
92
6.0
Case 751 (SO−8)
T = 25C
P
q
Internally Limited
W
C/W
C/W
A
D
JA
JC
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
160
25
q
Case 221A (TO−220)
Case 318E (SOT−223)
T = 25C
P
q
Internally Limited
W
C/W
C/W
W
C/W
C/W
A
D
JA
JC
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
65
5.0
q
T = 25C
P
Internally Limited
A
D
JA
JC
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
q
156
15
q
Operating Die Junction Temperature Range
T
−40 to +150
C
C
J
Operating Ambient Temperature Range
NCV33269
MC33269
T
A
−40 to +125
−40 to +125
Storage Temperature
T
stg
−55 to +150
C
Electrostatic Discharge Sensitivity (ESD)
Human Body Model (HBM)
ESD
4000
400
V
Machine Model (MM)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
ELECTRICAL CHARACTERISTICS (C = 10 mF, T = 25C, for min/max values T = −40C to +125C, unless otherwise noted.)
O
A
A
Characteristic
Symbol
Min
Typ
Max
Unit
Output Voltage (I = 10 mA, T = 25C)
V
O
V
out
A
3.3 Suffix (V = 5.3 V)
3.27
4.95
11.88
3.3
5.0
12
3.33
5.05
12.12
CC
5.0 Suffix (V = 7.0 V)
CC
12 Suffix (V = 14 V)
CC
Output Voltage (Line, Load and Temperature) (Note 1)
(1.25 V V − V 15 V, I = 500 mA)
V
O
V
in
out
out
(1.35 V V − V 10 V, I = 800 mA)
in
out
out
3.3 Suffix
5.0 Suffix
12 Suffix
3.23
4.9
11.76
3.3
5.0
12
3.37
5.1
12.24
Reference Voltage for Adjustable Voltage
(I = 10 mA, V − V = 2.0 V, T = 25C)
V
V
1.235
1.25
1.265
V
V
ref
out
in
out
A
Reference Voltage (Line, Load and Temperature) (Note 1) for Adjustable Voltage
(1.25 V V − V 15 V, I = 500 mA)
1.225
1.25
1.275
ref
in
out
out
(1.35 V V − V 10 V, I = 800 mA)
in
out
out
Line Regulation
(I = 10 mA, V = [V + 1.5 V] to V = 20 V, T = 25C)
Reg
−
−
−
−
0.3
0.5
%
%
V
out
in
out
in
A
line
Load Regulation
Dropout Voltage
(V = V + 3.0 V, I = 10 mA to 800 mA, T = 25C)
Reg
load
in
out
out
A
(I = 500 mA)
V
in
− V
out
−
−
1.0
1.1
1.25
1.35
out
(I = 800 mA)
out
Ripple Rejection
Current Limit
(10 V , 120 Hz Sinewave; I = 500 mA)
RR
55
−
−
−
−
dB
mA
mA
pp
out
(V − V = 10 V)
I
800
in
out
Limit
Quiescent Current (Fixed Output)
Minimum Required Load Current
Adjustment Pin Current
(1.5 V V 3.3 V)
I
Q
−
−
5.5
−
8.0
20
out
(5 V V 12 V)
out
Fixed Output Voltage
Adjustable Voltage
I
−
8.0
−
−
0
−
mA
Load
I
−
−
120
mA
Adj
1. The MC33269−12, V − V is limited to 8.0 V maximum, because of the 20 V maximum rating applied to V
in.
in
out
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2
MC33269, NCV33269
V
in
V
out
Trim Links
V
Adj
Gnd
This device contains 38 active transistors.
Figure 1. Internal Schematic
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3
MC33269, NCV33269
1.5
1.3
1.1
0.9
0.7
0.5
T = -40C
A
100
mV/Div
T = 25C
A
C
C
V
= 10 mF
= 10 mF Tantalum
= V + 3.0 V
O
in
O
in
T = 125C
A
Preload = 0.1 A
0.5 A
0 A
0
200
400
600
800
1000
20 ms/DIV
I , OUTPUT LOAD CURRENT (mA)
O
Figure 2. Dropout Voltage versus
Output Load Current
Figure 3. Transient Load Regulation
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
1100
1060
1020
980
I
O
= 800 mA
T = 25C
A
MC33269D-XX
L = 25 mm Copper
940
900
-55
0
2.0
4.0
6.0
8.0
10
12
14
16
-25
0
25
50
75
100
125
T , AMBIENT TEMPERATURE (C)
A
INPUT-OUTPUT VOLTAGE DIFFERENTIAL (V)
Figure 4. Dropout Voltage
versus Temperature
Figure 5. MC33269−XX Output DC Current versus
Input−Output Differential Voltage
70
70
V
O
= 3.3 V or 5.0 V
60
50
40
30
20
60
V
= 12 V
O
50
40
30
20
V
= 8.0 V
= 5.0 V
in
V
out
I = 800 mA
V
= V + 3.0 V
O
in
I = 800 mA
L
C
= 22 mF
L
Adj
T = 25C
A
T = 25C
A
0.1
1.0
10
f, FREQUENCY (kHz)
100
0.1
1.0
10
f, FREQUENCY (kHz)
100
Figure 6. MC33269 Ripple Rejection
versus Frequency
Figure 7. MC33269−ADJ Ripple Rejection
versus Frequency
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4
MC33269, NCV33269
170
150
130
110
90
3.2
2.8
P
for T = 50C
A
D(max)
2.4
2.0
1.6
1.2
0.8
0.4
Graph represents symmetrical layout
2.0 oz.
L
Copper
70
L
3.0 mm
50
R
q
JA
30
0
10
20
30
40
50
L, LENGTH OF COPPER (mm)
Figure 8. SOP−8 Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
2.4
2.0
1.6
1.2
0.8
0.4
0
100
90
80
70
60
50
40
P
for T = 50C
D(max)
A
Free Air
Mounted
Vertically
2.0 oz. Copper
L
Minimum
Size Pad
L
R
q
JA
0
5.0
10
15
20
25
30
L, LENGTH OF COPPER (mm)
Figure 9. DPAK Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
280
240
200
160
120
80
2.50
1.25
0.83
0.63
0.50
0.42
0.35
P
for T = 50C
A
D(max)
Free Air
Mounted
Vertically
2.0 oz. Copper
L
Minimum
Size Pad
L
R
q
JA
40
0
5.0
10
15
20
25
30
L, LENGTH OF COPPER (mm)
Figure 10. SOT−223 Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
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5
MC33269, NCV33269
APPLICATIONS INFORMATION
Figures 11 through 15 are typical application circuits. The
supply input filter with long wire lengths. This will reduce
the circuit’s sensitivity to the input line impedance at high
frequencies. A 0.33 mF or larger tantalum, mylar, ceramic,
or other capacitor having low internal impedance at high
frequencies should be chosen. The bypass capacitor should
be mounted with shortest possible lead or track length
directly across the regulator’s input terminals. Applications
should be tested over all operating conditions to insure
stability.
Internal thermal limiting circuitry is provided to protect
the integrated circuit in the event that the maximum junction
temperature is exceeded. When activated, typically at
170C, the output is disabled. There is no hysteresis built
into the thermal limiting circuit. As a result, if the device is
overheating, the output will appear to be oscillating. This
feature is provided to prevent catastrophic failures from
accidental device overheating. It is not intended to be used
as a substitute for proper heat−sinking.
output current capability of the regulator is in excess of
800 mA, with a typical dropout voltage of less than 1.0 V.
Internal protective features include current and thermal
limiting.
* The MC33269 requires an external output capacitor for
stability. The capacitor should be at least 10 mF with an
equivalent series resistance (ESR) of less than 10 W but
greater than 0.2 W over the anticipated operating
temperature range. With economical electrolytic capacitors,
cold temperature operation can pose a problem. As
temperature decreases, the capacitance also decreases and
the ESR increases, which could cause the circuit to oscillate.
Also capacitance and ESR of a solid tantalum capacitor is
more stable over temperature. The use of a low ESR ceramic
capacitor placed within close proximity to the output of the
device could cause instability.
** An input bypass capacitor is recommended to improve
transient response or if the regulator is connected to the
V
in
V
out
V
in
V
out
MC33269
MC33269-XX
**
C
in
*
10 mF
C
**
o
C
in
R1
R2
*
C
Adj
o
10 mF
GND
An input capacitor is not necessary for stability, however
it will improve the overall performance.
C
Adj
***
Figure 11. Typical Fixed Output Application
R2
ꢀ + ꢀ1.25ꢀꢀǒ1 ) Ǔꢀ)ꢀ I
V
R2
Adjꢀ
out
R1
***C is optional, however it will improve the ripple rejection.
Adj
V
R
S
I
out
in
The MC34269 develops a 1.25 V reference voltage between the
output and the adjust terminal. Resistor R1, operates with
constant current to flow through it and resistor R2. This current
should be set such that the Adjust Pin current causes negligible
drop across resistor R2. The total current with minimum load
should be greater than 8.0 mA.
MC33269
*
10 mF
C
o
**
C
in
Adj
1.25
R
I
ꢀ +ꢀ
out
S
Figure 13. Current Regulator
Figure 12. Typical Adjustable Output Application
V
in
V
out
MC33269-XX
**
C
in
V
in
V
out
MC33269
GND
**
C
in
R1
R2
Adj
*
C
o
10 mF
MC33269-XX
*
C
o
10 mF
**
C
in
GND
The Schottky diode in series with the ground leg of the upper
regulator shifts its output voltage higher by the forward
voltage drop of the diode. This will cause the lower device
to remain off until the input voltage is removed.
R
sets the maximum output voltage. Each transistor
2
reduces the output voltage when turned on.
Figure 14. Battery Backed−Up Power Supply
Figure 15. Digitally Controlled Voltage Regulator
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6
MC33269, NCV33269
ORDERING INFORMATION
Device
†
Package
Shipping Information
MC33269DG
SO−8
(Pb−Free)
98 Units / Rail
MC33269DR2G
SO−8
2500 Units / Tape & Reel
75 Units / Rail
(Pb−Free)
MC33269DTG
DPAK
(Pb−Free)
MC33269DTRKG
MC33269TG
DPAK
2500 Units / Tape & Reel
50 Units / Rail
(Pb−Free)
TO−220
(Pb−Free)
MC33269D−3.3G
SO−8
(Pb−Free)
98 Units / Rail
MC33269DR2−3.3G
MC33269DT−3.3G
MC33269DTRK−3.3G
MC33269ST−3.3T3G
MC33269T−3.3G
SO−8
2500 Units / Tape & Reel
75 Units / Rail
(Pb−Free)
DPAK
(Pb−Free)
DPAK
(Pb−Free)
2500 Units / Tape & Reel
4000 Units / Tape & Reel
50 Units / Rail
SOT−223
(Pb−Free)
TO−220
(Pb−Free)
MC33269D−5.0G
SO−8
(Pb−Free)
98 Units / Rail
MC33269DR2−5.0G
MC33269DT−5.0G
NCV33269DT−5.0G*
MC33269DTRK−5.0G
MC33269T−5.0G
SO−8
2500 Units / Tape & Reel
75 Units / Rail
(Pb−Free)
DPAK
(Pb−Free)
DPAK
(Pb−Free)
75 Units / Rail
DPAK
(Pb−Free)
2500 Units / Tape & Reel
50 Units / Rail
TO−220
(Pb−Free)
MC33269D−012G
MC33269DR2−012G
MC33269DT−012G
MC33269DTRK−012G
MC33269T−012G
NCV33269DR2G*
NCV33269DTRKG*
NCV33269DTRK3.3G*
NCV33269DTRK5.0G*
NCV33269DTRK−12G*
SO−8
98 Units / Rail
(Pb−Free)
SO−8
(Pb−Free)
2500 Units / Tape & Reel
75 Units / Rail
DPAK
(Pb−Free)
DPAK
(Pb−Free)
2500 Units / Tape & Reel
50 Units / Rail
TO−220
(Pb−Free)
SO−8
(Pb−Free)
2500 Units / Tape & Reel
2500 Units / Tape & Reel
2500 Units / Tape & Reel
2500 Units / Tape & Reel
2500 Units / Tape & Reel
DPAK
(Pb−Free)
DPAK
(Pb−Free)
DPAK
(Pb−Free)
DPAK
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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7
MC33269, NCV33269
MARKING DIAGRAMS
SO−8
D SUFFIX
CASE 751
8
1
8
1
8
8
1
269AJ
ALYW
G
69−12
ALYW
G
269−3
ALYW
G
269−5
ALYW
G
1
DPAK
DT SUFFIX
CASE 369C
SOT−223
ST SUFFIX
CASE 318E
269AJG
ALYWW
69−12G
ALYWW
269−3G
ALYWW
269−5G
ALYWW
AYW
2693 G
G
2
2
2
2
1
3
1
3
1
3
1
3
1
2
3
TO−220AB
T SUFFIX
CASE 221A
MC
33269T
AWLYWWG
MC
33269T−12
AWLYWWG
MC
33269T−33
AWLYWWG
MC
33269T−5
AWLYWWG
1
2
3
1
2
3
1
2
3
1
2
3
A
= Assembly Location
L, WL = Wafer Lot
= Year
W, WW = Work Week
Y
G
G
= Pb−Free Package
= Pb−Free Package
(Note: Microdot may be in either location)
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8
MC33269, NCV33269
PACKAGE DIMENSIONS
SO−8
D SUFFIX
CASE 751−07
ISSUE AK
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
−X−
A
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
8
5
4
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
S
M
M
B
0.25 (0.010)
Y
1
K
−Y−
MILLIMETERS
DIM MIN MAX
INCHES
G
MIN
MAX
0.197
0.157
0.069
0.020
A
B
C
D
G
H
J
K
M
N
S
4.80
3.80
1.35
0.33
5.00 0.189
4.00 0.150
1.75 0.053
0.51 0.013
C
N X 45
_
SEATING
PLANE
1.27 BSC
0.050 BSC
−Z−
0.10
0.19
0.40
0
0.25 0.004
0.25 0.007
1.27 0.016
0.010
0.010
0.050
8
0.020
0.244
0.10 (0.004)
M
J
H
D
8
0
_
_
_
_
0.25
5.80
0.50 0.010
6.20 0.228
M
S
S
X
0.25 (0.010)
Z
Y
SOLDERING FOOTPRINT*
1.52
0.060
7.0
4.0
0.275
0.155
0.6
0.024
1.270
0.050
mm
inches
ǒ
Ǔ
SCALE 6:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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9
MC33269, NCV33269
PACKAGE DIMENSIONS
DPAK
DT SUFFIX
CASE 369C
ISSUE D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI-
MENSIONS b3, L3 and Z.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL
NOT EXCEED 0.006 INCHES PER SIDE.
5. DIMENSIONS D AND E ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY.
6. DATUMS A AND B ARE DETERMINED AT DATUM
PLANE H.
C
A
D
A
E
c2
b3
B
4
2
L3
L4
Z
H
DETAIL A
1
3
INCHES
DIM MIN MAX
0.086 0.094
A1 0.000 0.005
0.025 0.035
MILLIMETERS
MIN
2.18
0.00
0.63
0.76
4.57
0.46
0.46
5.97
6.35
MAX
2.38
0.13
0.89
1.14
5.46
0.61
0.61
6.22
6.73
A
b2
c
b
b
b2 0.030 0.045
b3 0.180 0.215
M
0.005 (0.13)
C
H
e
c
0.018 0.024
c2 0.018 0.024
GAUGE
SEATING
PLANE
L2
PLANE
C
D
E
e
0.235 0.245
0.250 0.265
0.090 BSC
2.29 BSC
9.40 10.41
1.40 1.78
2.74 REF
0.51 BSC
0.89 1.27
H
L
L1
L2
0.370 0.410
0.055 0.070
0.108 REF
L
A1
L1
0.020 BSC
DETAIL A
L3 0.035 0.050
ROTATED 905 CW
L4
Z
−−− 0.040
0.155 −−−
−−−
3.93
1.01
−−−
SOLDERING FOOTPRINT*
6.20
0.244
3.00
0.118
2.58
0.102
5.80
0.228
1.60
0.063
6.17
0.243
mm
inches
ǒ
Ǔ
SCALE 3:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
10
MC33269, NCV33269
PACKAGE DIMENSIONS
SOT−223
ST SUFFIX
CASE 318E−04
ISSUE N
D
b1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
MILLIMETERS
INCHES
DIM
A
A1
b
b1
c
D
E
e
e1
L
MIN
1.50
0.02
0.60
2.90
0.24
6.30
3.30
2.20
0.85
0.20
1.50
6.70
0
NOM
1.63
0.06
0.75
3.06
0.29
6.50
3.50
2.30
0.94
−−−
1.75
7.00
−
MAX
MIN
0.060
0.001
0.024
0.115
0.009
0.249
0.130
0.087
0.033
0.008
0.060
0.264
0
NOM
0.064
0.002
0.030
0.121
0.012
0.256
0.138
0.091
0.037
−−−
MAX
0.068
0.004
0.035
0.126
0.014
0.263
0.145
0.094
0.041
−−−
4
2
1.75
0.10
0.89
3.20
0.35
6.70
3.70
2.40
1.05
−−−
2.00
7.30
10
H
E
E
1
3
b
e1
e
L1
0.069
0.276
−
0.078
0.287
10
H
E
C
q
q
A
0.08 (0003)
A1
L
L1
SOLDERING FOOTPRINT*
3.8
0.15
2.0
0.079
6.3
0.248
2.3
0.091
2.3
0.091
2.0
0.079
mm
inches
ǒ
Ǔ
1.5
0.059
SCALE 6:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
11
MC33269, NCV33269
PACKAGE DIMENSIONS
TO−220, SINGLE GAUGE
T SUFFIX
CASE 221AB
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSION Z DEFINES A ZONE WHERE ALL BODY AND
LEAD IRREGULARITIES ARE ALLOWED.
4. PRODUCT SHIPPED PRIOR TO 2008 HAD DIMENSIONS
S = 0.045 - 0.055 INCHES (1.143 - 1.397 MM)
SEATING
PLANE
−T−
C
B
F
T
S
INCHES
DIM MIN MAX
0.620 14.48
MILLIMETERS
4
1
MIN
MAX
15.75
10.28
4.82
0.88
3.73
2.66
3.93
0.64
14.27
1.52
5.33
3.04
2.79
0.61
6.47
1.27
---
A
B
C
D
F
0.570
0.380
0.160
0.025
0.142
0.095
0.110
0.018
0.500
0.045
0.190
0.100
0.080
0.020
0.235
0.000
0.045
---
A
K
Q
Z
0.405
0.190
0.035
0.147
0.105
0.155
0.025
9.66
4.07
0.64
3.61
2.42
2.80
0.46
2
3
U
H
G
H
J
K
L
0.562 12.70
0.060
0.210
0.120
0.110
1.15
4.83
2.54
2.04
N
Q
R
S
T
L
R
V
J
0.024 0.508
0.255
0.050
---
5.97
0.00
1.15
---
G
U
V
Z
D
0.080
2.04
N
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