MC33275D-3.3R2 [ONSEMI]
LOW DROPOUT MICROPOWER VOLTAGE REGULATOR; 低压差微功耗电压稳压器
| 型号： | MC33275D-3.3R2 |
| 厂家： | 
ONSEMI |
| 描述： | LOW DROPOUT MICROPOWER VOLTAGE REGULATOR |
| 文件： | 总12页 (文件大小：200K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
The MC33275 series are micropower low dropout voltage
regulators available in a wide variety of output voltages as well as
packages, DPAK, SOT–223, and SOP–8 surface mount packages.
These devices feature a very low quiescent current and are capable of
supplying output currents up to 300 mA. Internal current and thermal
limiting protection are provided by the presence of a short circuit at the
output and an internal thermal shutdown circuit.
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LOW DROPOUT
MICROPOWER VOLTAGE
REGULATOR
The MC33275 is available as a MC33375 which includes an On/Off
control.
Due to the low input–to–output voltage differential and bias current
specifications, these devices are ideally suited for battery powered
computer, consumer, and industrial equipment where an extension of
useful battery life is desirable.
Gnd
4
4
Features:
MC33275
1
• Low Quiescent Current (125 A)
3
1
2
3
• Low Input–to–Output Voltage Differential of 25 mV at I = 10 mA,
O
Gnd
V
in
V
out
and 260 mV at I = 300 mA
O
PLASTIC
DT SUFFIX
CASE 369A
• Extremely Tight Line and Load Regulation
• Stable with Output Capacitance of only 0.33 F for 2.5 V Output
Voltage
• Internal Current and Thermal Limiting
Gnd
4
Simplified Block Diagram
4
MC33375
1
V
in
V
out
1
2
3
3
V
in
Gnd
V
out
Thermal &
Anti–sat
Protection
PLASTIC
ST SUFFIX
CASE 318E
Rint
1
8
7
6
5
Input
Output
1.23 V
V. Ref.
2
Gnd
Gnd
Gnd
N/C
3
MC33375
8
Gnd
Gnd
54 K
4
Gnd
1
Pins 4 and 5 Not Connected
This device contains 41 active transistors
PLASTIC
D SUFFIX
CASE 751
ORDERING INFORMATION
See detailed ordering and shipping information in the
package dimensions section on page 9 of this data sheet.
Semiconductor Components Industries, LLC, 2000
1
Publication Order Number:
March, 2000 – Rev. 4
MC33275/D
MC33275
MAXIMUM RATINGS (T = 25°C, for min/max values T = –40°C to +125°C)
A
J
Rating
Symbol
Value
Unit
Input Voltage
V
CC
13
Vdc
Power Dissipation and Thermal Characteristics
T = 25°C
A
Maximum Power Dissipation
P
D
Internally Limited
W
Case 751 (SOP–8) D Suffix
Thermal Resistance, Junction–to–Ambient
Thermal Resistance, Junction–to–Case
Case 369A (DPAK) DT Suffix
R
160
25
°C/W
°C/W
θ
JA
JC
R
θ
Thermal Resistance, Junction–to–Air
Thermal Resistance, Junction–to–Case
Case 318E (SOT–223) ST Suffix
Thermal Resistance, Junction–to–Air
Thermal Resistance, Junction–to–Case
R
92
6.0
°C/W
°C/W
θ
JA
JC
R
θ
R
245
15
°C/W
°C/W
θ
JA
JC
R
θ
Output Current
I
300
mA
°C
°C
°C
O
Maximum Junction Temperature
Operating Junction Temperature Range
Storage Temperature Range
T
T
150
J
J
– 40 to +125
– 65 to +150
T
stg
ELECTRICAL CHARACTERISTICS (C = 1.0µF, T = 25°C, for min/max values T = –40°C to +125°C, Note 1)
L
A
J
Characteristic
Symbol
Min
Typ
Max
Unit
Output Voltage
2.5 V Suffix
3.0 V Suffix
3.3 V Suffix
5.0 V Suffix
I
= 0 mA to 250 mA
V
O
Vdc
O
T = 25°C, V = [V + 1] V
2.475
2.970
3.267
4.950
2.50
3.00
3.30
5.00
2.525
3.030
3.333
5.05
A
in
O
2.5 V Suffix
3.0 V Suffix
3.3 V Suffix
5.0 V Suffix
V
= [V + 1] V, 0 < I < 100 mA
2.450
2.940
3.234
4.900
—
—
—
—
2.550
3.060
3.366
5.100
in
O
O
2% Tolerance from T = –40 to +125°C
J
Line Regulation
Load Regulation
Dropout Voltage
V
= [V + 1] V to 12 V, I = 250 mA,
Reg
–
2.0
10
mV
mV
mV
in
O
O
line
All Suffixes T = 25°C
A
V
in
= [V + 1] V, I = 0 mA to 250 mA,
Reg
load
–
5.0
25
O
O
All Suffixes T = 25°C
A
V
in
– V
O
I
O
I
O
I
O
I
O
= 10 mA
T = –40°C to +125°C
J
—
—
—
—
25
100
200
400
500
= 100 mA
= 250 mA
= 300 mA
115
220
260
Ripple Rejection (120 Hz)
V
= [V + 1.5] V to [V + 5.5] V
—
65
75
—
dB
in(peak–peak)
O
O
Output Noise Voltage
V
n
Vrm
s
C = 1
L
F
I
O
= 50 mA (10 Hz to 100 kHz)
—
—
160
46
—
—
C = 200
L
F
CURRENT PARAMETERS
Characteristic
Symbol
Min
Typ
Max
Unit
Quiescent Current
On Mode
On Mode SAT
I
Q
A
V
in
V
in
= [V + 1] V, I = 0 mA
—
—
125
1100
200
1500
O
O
= [V – 0.5] V, I = 0 mA, Note 2
O
O
Current Limit
V
in
= [V + 1], V shorted
I
LIMIT
—
450
—
mA
O
O
THERMAL SHUTDOWN
Characteristic
Symbol
Min
Typ
Max
Unit
Thermal Shutdown
—
—
150
—
°C
NOTE: 1. Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
NOTE: 2. Quiescent Current is measured where the PNP pass transistor is in saturation. V = [V – 0.5] V guarantees this condition.
in
O
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2
MC33275
DEFINITIONS
Load Regulation – The change in output voltage for a
difference between the input power (V X I ) and the
CC CC
change in load current at constant chip temperature.
Dropout Voltage – The input/output differential at which
the regulator output no longer maintains regulation against
further reductions in input voltage. Measured when the
output drops 100 mV below its nominal value (which is
measured at 1.0 V differential), dropout voltage is affected
by junction temperature, load current and minimum input
supply requirements.
output power (V X I ) is increasing.
out out
Depending on ambient temperature, it is possible to
calculate the maximum power dissipation and so the
maximum current as following:
T – T
J
A
Pd
R
JA
The maximum operating junction temperature T is
J
specified at 150°C, if T = 25°C, then P can be found. By
Output Noise Voltage – The RMS AC voltage at the
output with a constant load and no input ripple, measured
over a specified frequency range.
A
D
neglecting the quiescent current, the maximum power
dissipation can be expressed as:
Maximum Power Dissipation – The maximum total
dissipation for which the regulator will operate within
specifications.
QuiescentCurrent – Current which is used to operate the
regulator chip and is not delivered to the load.
Line Regulation – The change in output voltage for a
changein the input voltage. The measurement is made under
conditions of low dissipation or by using pulse techniques
such that the average chip temperature is not significantly
affected.
Maximum Package Power Dissipation – The maximum
package power dissipation is the power dissipation level at
which the junction temperature reaches its maximum value
i.e. 150°C. The junction temperature is rising while the
P
D
I
out
V
– V
out
CC
The thermal resistance of the whole circuit can be
evaluated by deliberately activating the thermal shutdown
of the circuit (by increasing the output current or raising the
input voltage for example).
Then you can calculate the power dissipation by
subtracting the output power from the input power. All
variables are then well known: power dissipation, thermal
shutdown temperature (150°C for MC33275) and ambient
temperature.
T – T
J
A
R
JA
P
D
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3
MC33275
Figure 1. Line Transient Response
Figure 2. Line Transient Response
200
150
100
70
60
7
6
5
4
3
2
7
6
5
4
3
2
T = 25° C
A
C = 0.47
F
L
V
I = 10 mA
in
L
V
out
50
40
30
20
10
0
= 3.3 V
50
0
V
out
–50
–100
1
0
1
0
–10
–20
0
20
40
60
80 100 120 140 160 180 200
TIME ( S)
0
50
100
150
200
TIME ( S)
Figure 4. Load Transient Response
Figure 3. Load Transient Response
1.0
350
250
300
200
100
0
0.8
0.6
0.4
0.14
LOAD CURRENT
150
LOAD CURRENT
0.09
0.04
50
–50
0.2
0
–100
–200
–300
–150
–250
–350
–450
–550
–650
–750
–0.01
–0.06
–0.11
–0.2
–0.4
V
CHANGE
200
F
out
L
C = 1.0
F
V
CHANGE
150
L
out
–400
–500
–600
–700
V
out
= 3.3 V
–0.6
–0.8
T = 25° C
A
V = 4.3 V
in
–1.0
–0.16
0
50
100
150
250
300
350 400
0
50
100
200
300
TIME ( S)
TIME ( S)
Figure 5. Output Voltage versus Input Voltage
Figure 6. Dropout Voltage versus Output Current
300
250
200
150
100
3.5
3.0
2.5
2.0
1.5
1.0
I = 1 mA
L
I = 250 mA
L
50
0
0.5
0
1
10
100
1000
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
INPUT VOLTAGE (V)
I , OUTPUT CURRENT (mA)
O
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4
MC33275
Figure 8. Ground Pin Current versus
Input Voltage
Figure 7. Dropout Voltage versus Temperature
12
10
8
300
250
200
150
100
I = 300 mA
L
I = 300 mA
L
I = 250 mA
L
6
I = 100 mA
L
4
I = 100 mA
L
2
50
0
I = 10 mA
L
I = 50 mA
L
0
–40
0
25
85
0
1
2
3
4
5
6
7
8
TEMPERATURE (°C)
V (VOLTS)
in
Figure 9. Ground Pin Current versus
Ambient Temperature
Figure 10. Output Voltage versus Ambient
Temperature (Vin = Vout1 +1V)
2.5
2.495
2.49
8
7
6
5
4
3
2
I = 0
O
I = 250 mA
L
I = 250 mA
O
2.485
2.48
I = 100 mA
L
I = 50 mA
2.475
2.47
L
1
0
–40
0
25
85
–40 –20
0
20
40
60
80
100 120 140
TEMPERATURE (°C)
T (°C)
A
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5
MC33275
Figure 11. Output Voltage versus Ambient
Temperature (Vin = 12 V)
2.5
2.495
2.49
I = 0
O
I = 250 mA
O
2.485
2.48
2.475
2.47
2.465
–40
0
25
85
TEMPERATURE (°C)
Figure 12. Ripple Rejection
Figure 13. Ripple Rejection
70
60
50
40
30
20
70
60
50
40
30
20
I = 100 mA
L
I = 10 mA
L
I = 250 mA
L
I = 1 mA
L
10
0
10
0
0.1
1
10
100
0.1
1
10
100
FREQUENCY (kHz)
FREQUENCY (kHz)
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MC33275
APPLICATIONS INFORMATION
Figure 14. Typical Application Circuit
V
out
V
in
MC33275–XX
C
in
C
out
LOAD
GND
Figure 15. ESR for Vout = 3.0V
The MC33275 regulators are designed with internal
current limiting and thermal shutdown making them
user–friendly. Figure 14 is a typical application circuit. The
output capability of the regulator is in excess of 300 mA,
with a typical dropout voltage of less than 260 mV. Internal
protective features include current and thermal limiting.
100
10
V
= 3.0 V
= 1.0 F
out
C
out
C = 1.0
in
F
EXTERNAL CAPACITORS
Stable Region
These regulators require only a 0.33 F (or greater)
capacitance between the output and ground for stability for
2.5 V, 3.0 V, and 3.3 V output voltage options. Output
voltage options of 5.0 V require only 0.22 F for stability.
The output capacitor must be mounted as close as possible
to the MC33275. If the output capacitor must be mounted
further than two centimeters away from the MC33275, then
a larger value of output capacitor may be required for
stability. A value of 0.68 F or larger is recommended. Most
type of aluminum, tantalum, or multilayer ceramic will
perform adequately. Solid tantalums or appropriate
multilayer ceramic capacitors are recommended for
operation below 25°C. An input bypass capacitor is
recommended to improve transient response or if the
regulator is connected to the supply input filter with long
wire lengths, more than 4 inches. This will reduce the
circuit’s sensitivity to the input line impedance at high
frequencies. A 0.33 F or larger tantalum, mylar, ceramic,
or other capacitor having low internal impedance at high
frequencies should be chosen. The bypass capacitor should
be mounted with shortest possible lead or track length
directly across the regulator’s input terminals. Figure 15
shows the ESR that allows the LDO to remain stable for
various load currents.
1.0
0.1
0
50
100
150
200
250
300
LOAD CURRENT (mA)
Applications should be tested over all operating
conditions to insure stability.
THERMAL PROTECTION
Internal thermal limiting circuitry is provided to protect
the integrated circuit in the event that the maximum junction
temperature is exceeded. When activated, typically at
150°C, the output is disabled. There is no hysteresis built
into the thermal protection. As a result the output will appear
to be oscillating during thermal limit. The output will turn
off until the temperature drops below the 150°C then the
output turns on again. The process will repeat if the junction
increases above the threshold. This will continue until the
existing conditions allow the junction to operate below the
temperature threshold.
Thermal limit is not a substitute for proper
heatsinking.
The internal current limit will typically limit current to
450 mA. If during current limit the junction exceeds 150°C,
the thermal protection will protect the device also. Current
limit is not a substitute for proper heatsinking.
OUTPUT NOISE
In many applications it is desirable to reduce the noise
present at the output. Reducing the regulator bandwidth by
increasing the size of the output capacitor will reduce the
noise on the MC33275.
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7
MC33275
Figure 16. SOT–223 Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
2.50
1.25
0.83
0.63
0.50
280
240
200
160
120
Free Air
Mounted
Vertically
P
for T = 50°C
A
D(max)
2.0 oz. Copper
L
Minimum
Size Pad
L
80
40
0.42
0.35
R
θ
JA
0
5.0
10
15
20
25
30
L, LENGTH OF COPPER (mm)
Figure 17. DPAK Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
2.4
2.0
1.6
1.2
0.8
100
Free Air
Mounted
Vertically
P
for T = 50°C
A
D(max)
90
80
70
60
2.0 oz. Copper
L
Minimum
Size Pad
L
50
40
0.4
0
R
θ
JA
0
5.0
10
15
20
25
30
L, LENGTH OF COPPER (mm)
Figure 18. SOP–8 Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
170
3.2
2.8
2.4
2.0
1.6
1.2
150
130
110
90
P
for T = 50°C
A
D(max)
Graph Represents Symmetrical Layout
2.0 oz.
L
Copper
70
3.0 mm
L
R
θ
JA
50
30
0.8
0.4
0
10
20
30
40
50
L, LENGTH OF COPPER (mm)
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8
MC33275
ORDERING INFORMATION
Operating
Temperature Range,
Tolerance
Device
Type
Case
369A
318E
751–5
369A
318E
751–5
369A
318E
751–5
369A
318E
751–5
Package
DPAK
MC33275DT–2.5RK
MC33275ST–2.5T3
MC33275D–2.5R2
MC33275DT–3.0RK
MC33275ST–3.0T3
MC33275D–3.0R2
MC33275DT–3.3RK
MC33275ST–3.3T3
MC33275D–3.3R2
MC33275DT–5.0RK
MC33275ST–5.0T3
MC33275D–5.0R2
2.5 V
(Fixed Voltage)
SOT–223
SOP–8
DPAK
3.0 V
(Fixed Voltage)
1% Tolerance
SOT–223
SOP–8
DPAK
at T = 25°C
A
3.3 V
(Fixed Voltage)
2% Tolerance at
T from –40 to +125°C
J
SOT–223
SOP–8
DPAK
5.0 V
(Fixed Voltage)
SOT–223
SOP–8
DEVICE MARKING
Device
Version
Marking (1st line)
27525
MC33275
2.5V
3.0V
3.3V
5.0V
MC33275
27530
MC33275
27533
MC33275
27550
TAPE AND REEL SPECIFICATIONS
Device
Reel Size
Tape Width
Quantity
2500 units
2500 units
4000 units
MC33275DT
MC33275D
MC33275S
13”
13”
13”
16mm embossed tape
12mm embossed tape
8mm embossed tape
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MC33275
PACKAGE DIMENSIONS
ST SUFFIX
PLASTIC PACKAGE
CASE 318E–04
(SOT–223)
A
F
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
4
2
INCHES
DIM MIN MAX
MILLIMETERS
S
B
MIN
6.30
3.30
1.50
0.60
2.90
2.20
MAX
6.70
3.70
1.75
0.89
3.20
2.40
0.100
0.35
2.00
1.05
10
1
3
A
B
C
D
F
G
H
J
0.249
0.130
0.060
0.024
0.115
0.087
0.263
0.145
0.068
0.035
0.126
0.094
D
L
0.0008 0.0040 0.020
G
0.009
0.060
0.033
0
0.014
0.078
0.041
10
0.24
1.50
0.85
0
J
K
L
M
S
C
0.08 (0003)
0.264
0.287
6.70
7.30
M
H
K
D SUFFIX
PLASTIC PACKAGE
CASE 751–06
(SOP–8)
ISSUE T
NOTES:
D
A
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
C
2. DIMENSIONS ARE IN MILLIMETER.
3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
8
5
4
M
M
0.25
B
H
E
1
h X 45
MILLIMETERS
B
C
e
DIM MIN
MAX
1.75
0.25
0.49
0.25
5.00
4.00
A
A1
B
C
D
E
1.35
0.10
0.35
0.19
4.80
3.80
A
SEATING
PLANE
L
e
1.27 BSC
0.10
H
h
L
5.80
0.25
0.40
0
6.20
0.50
1.25
7
A1
B
M
S
S
0.25
C B
A
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MC33275
PACKAGE DIMENSIONS
DT SUFFIX
PLASTIC PACKAGE
CASE 369A–13
(DPAK)
ISSUE Z
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
SEATING
PLANE
–T–
2. CONTROLLING DIMENSION: INCH.
C
B
R
INCHES
DIM MIN MAX
MILLIMETERS
E
V
MIN
5.97
6.35
2.19
0.69
0.84
0.94
MAX
6.35
6.73
2.38
0.88
1.01
1.19
A
B
C
D
E
F
0.235
0.250
0.086
0.027
0.033
0.037
0.250
0.265
0.094
0.035
0.040
0.047
4
2
Z
A
K
S
1
3
G
H
J
K
L
R
S
U
V
Z
0.180 BSC
4.58 BSC
U
0.034
0.018
0.102
0.040
0.023
0.114
0.87
0.46
2.60
1.01
0.58
2.89
0.090 BSC
2.29 BSC
F
J
0.175
0.020
0.020
0.030
0.138
0.215
0.050
–––
0.050
–––
4.45
0.51
0.51
0.77
3.51
5.46
1.27
–––
1.27
–––
L
H
D 2 PL
M
G
0.13 (0.005)
T
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MC33275
ON Semiconductor and
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including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
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SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable
attorneyfees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
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PUBLICATION ORDERING INFORMATION
NORTH AMERICA Literature Fulfillment:
CENTRAL/SOUTH AMERICA:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Spanish Phone: 303–308–7143 (Mon–Fri 8:00am to 5:00pm MST)
Email: ONlit–spanish@hibbertco.com
Phone: 303–675–2175 or 800–344–3860 Toll Free USA/Canada
Fax: 303–675–2176 or 800–344–3867 Toll Free USA/Canada
Email: ONlit@hibbertco.com
ASIA/PACIFIC: LDC for ON Semiconductor – Asia Support
Phone: 303–675–2121 (Tue–Fri 9:00am to 1:00pm, Hong Kong Time)
Toll Free from Hong Kong & Singapore:
Fax Response Line: 303–675–2167 or 800–344–3810 Toll Free USA/Canada
001–800–4422–3781
N. American Technical Support: 800–282–9855 Toll Free USA/Canada
Email: ONlit–asia@hibbertco.com
EUROPE: LDC for ON Semiconductor – European Support
German Phone: (+1) 303–308–7140 (M–F 1:00pm to 5:00pm Munich Time)
Email: ONlit–german@hibbertco.com
JAPAN: ON Semiconductor, Japan Customer Focus Center
4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–8549
Phone: 81–3–5740–2745
French Phone: (+1) 303–308–7141 (M–F 1:00pm to 5:00pm Toulouse Time)
Email: ONlit–french@hibbertco.com
English Phone: (+1) 303–308–7142 (M–F 12:00pm to 5:00pm UK Time)
Email: ONlit@hibbertco.com
Email: r14525@onsemi.com
ON Semiconductor Website: http://onsemi.com
EUROPEAN TOLL–FREE ACCESS*: 00–800–4422–3781
For additional information, please contact your local
Sales Representative.
*Available from Germany, France, Italy, England, Ireland
MC33275/D
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